Introduction

IC technologies :

• NMOS
• PMOS
• CMOS
• SOI
• BiCMOS
• GaAs
 

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Basic Fabrication Steps:

• Wafer Processing.
• Mask making.
• Photolithography.
• Oxidation.
• Diffusion.
• Etching.
• Poly-gate formation.
• Metallization.
 

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Basic Fabrication Steps:

Wafer Processing : single crystal wafer, diameter
70 mm to 200 mm, thickness less than 1mm, front
face polished, scratch free mirror finish.

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Basic Fabrication Steps:

Mask making :
• After complete design the drawing is broken
into subsequent IC processing steps.
• These steps are called mask levels.
• Electron beam machine known as pattern
generator is used for mask making.
• The interface is CIF between layout and mask
machine.
• Mask machine transfers design features
directly on photosensitive glass plate using
 
CIF.
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Basic Fabrication Steps:

Photolithography : The process used to transfer a

pattern on wafer is called lithography. The
process has 6 steps.

1. Photoresist Coating.
2. Pre baking.

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Basic Fabrication Steps:

3. Alignment and exposing.

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Basic Fabrication Steps:

4. Development.
5. Post baking.

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Basic Fabrication Steps:

6. Etching Removal of photoresist.

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Basic Fabrication Steps:

Wafer after Removal of photoresist.

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Basic Fabrication Steps:

Oxidation : The purpose of SiO2 layer is

1. acts as component in MOS.

2. acts as mask against diffusion.

3. used to isolate the devices

4. provides electrical isolation in multilevel

  metallization.

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Basic Fabrication Steps:

Diffusion : The purpose is to alter the type of

conductivity by diffusing impurities.

Goal :
1. Control of impurity concentration.

2. Uniformity.

3. Reproducibility.
 

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Basic Fabrication Steps:

Metallization :

• Is done to provide low resistance

interconnects.

• Common method is evaporation and

sputtering.

• In high vacuum chamber the metal is deposited

by evaporation with subsequent condensation
 
on substrate target.
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Basic NMOS Fabrication Steps:

Formation of SiO2 and then photoresist coating

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Basic NMOS Fabrication Steps:

Photo-mask and then etching of selected area.

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Basic NMOS Fabrication Steps:

The wafer is then placed into an oxidation furnace
and thin oxide (the gate oxide) is grown to cover the
etched region

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Basic NMOS Fabrication Steps:

A layer of poly-crystalline silicon is deposited all
over the wafer.
This layer is then patterned and etched to form the
gate of transistor.

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Basic NMOS Fabrication Steps:

An n-type dopant is introduced into the opened

regions and diffused into the wafers.

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Basic NMOS Fabrication Steps:

Oxide is deposited using Low Pressure Chemical Vapor
Deposition (LPCVD) and is used for top coat protection.

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Basic NMOS Fabrication Steps:

A layer of aluminum is deposited all over the wafer
and patterned and etched to form the
interconnecting layers and the connections to
channel Metal Oxide Semiconductor.

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N-Well CMOS Fabrication Steps

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N-Well CMOS Fabrication Steps (contd.)

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N-Well CMOS Fabrication Steps (contd.)

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N-Well CMOS Fabrication Steps (contd.)

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 Next Class Topic

MOS Transistor Modeling

Lecture-2-Fabrication