Liebert XD TM

A Closer Look at the XD Solution

Liebert
 UPS and Surge
Suppression
 Precision Air Conditioning
 Enclosure Systems
 Site Monitoring and
Software
 DC Power
 24 x 7 Service
 Agenda
 Introduction
 The Cooling Challenge
 Liebert XDTM
– Second generation
– First generation
Key Topics

 Heat Density - Brief Background

 How These Trends are Influencing
our View of the Computer Space
 Energy Considerations & Tools
 New Product Brief
 Agenda
 Introduction
 The Cooling Challenge
 Liebert XDTM
– Second generation
– First generation
 Comparative Heat Densities -Watts / Ft2
60
Range of Average Heat Density

50

40

30

20

10

0
Commercial Computer
 Average Load Density
Present/Future

600

500

400

300 3 - 5 Yrs

200
Present
100

0
50 75 150 300

Heat Density - Watts / Square Foot

Environmental Footprint

24 % @
400 WSF

3%@
50 WSF
The Cooling Challenge
Heat Drivers – Microprocessors
100000
30000

25000
Transistors per Microprocessor
10000
Pentium 4 = 42,000,000
20000
1000
15000
100
10000
10 500
1000
5000
450
01 400
1971
1971 1976
1976 1981
1981 1986 350
1986 1991
1991
100 1996
1996
300
250 Clock Frequency
200 Pentium 4 = 1.4 GHz
10
150
100
50
10
12
01
1971
1971 1976
1976 1981
1981 1986
1986 101991
1991 1996

8
Device Track Spacing
61
Pentium 4 = 0.12 Micron
4

0.1
0
1971
1971 1976
1976 1981
1981 1986
1986 1991
1991 1996
1996
 Projected Power Consumption
IA64 (140-180W)
Estimated Thermal Design Power Max (Watts)

140
Intel 486 Processors
130
Pentium (II) Processors
Itanium 2 (130 W)
120 Pentium 3 & 4 Processors
110 Future CPU Developments
100
90
80 Pentium 4 -- 3.0 GHz (83W)
Xeon -- 2.4 GHz (78W)
70
60 Pentium 4 -- 2.4 GHz (61W)
50
40
Pentium 3 -- 1.4 GHz (35 W)
30
20
10
0
94

96

00
97
90

98

03
93

99

01
89

92

95

02
91

19

19
19

20
19

20
19
19
19

19

19

19

20
20
19

Estimated Introduction Date

Hewlett Packard - Proliant BL 20p Blade
Server

7U High Server - Six per Enclosure

Eight Blades per Server
1.4 GHz Pentium III, (1 or 2 )

Fully Configured, 1.86 kW / Server = 11.16 kW = 1,633 wsf

Min- Configure, 1.27 kW / Server = 7.62 kW = 1,115 wsf
 Sun
Fire Blade, B1600 (Announced on 2/10/03)

3U High Shelf - Fourteen per Encl

Sixteen Blades per Shelf
Sun Ultra Sparc Processor, (1 )

Maximum Power / Shelf, 1.015 kW = 14.2 kW = 2,078 wsf

Avg Operating Power / Shelf, 0.5 kW = 7.0 kW = 1,024 wsf

Average / Maximum = 7.0 / 14.2 = 49.3 %

 IBM - xSeries Bladecenter (Preliminary
Power)

7U High Server - Six per Enclosure

Fourteen Blades per Server
2.4 GHz Pentium Xeon, (1 or 2 )

Fully Configured, 2.7 kW / Server = 16.2 kW = 2,370 wsf

Minimum Configure, 1.6 kW / Server = 9.6 kW = 1,405 wsf
RackSaver RSV -1100VMX (Houston,
TX Site)

1U (kind of) Server - 88 per Enclosure

Stacked Vertically - Front & Back

2.0 GHz Pentium Xeon, (1 or 2 )

Measured Power / Cabinet
Design = 14.4 kW
Normal = 11.0 - 11.6 kW
Minimum = 9.0 kW

Entire Room Will Be 350 Watts/sf !!!

250 Sensible Tons in a 36 x 70 Area !!!
IBM Regatta (Maryland Site)
Proprietary Cabinet
Measured Power / Cabinet
Normal = 8.8 kW
Minimum = 7.4 kW

Two - FH 529C’s
Two - FH 290A’s

Hot Aisle was 110 F !!!

Entire Room Is 142 W/sf !!!

Server Area is 266 W/st !!!
55 Sensible Tons in a 13 x 56 Area !!!
10,000 Sq Ft Center, 50 wsf = 500 kW

( Qty = Six )
DH380A = 88.6 kW

32

50
10,000 Sq Ft Center, 100 wsf = 1,000 kW

( Qty = Twelve )
DH380A = 88.6 kW

16

50
10,000 Sq Ft Center, 150 wsf = 1,500 kW

( Qty = Eighteen )
DH380A = 88.6 kW

10

50
10,000 Sq Ft Center, 300 wsf = 3,000 kW

( Qty = Thirty-Six )
DH380A = 88.6 kW

10

50
Uptime Institute -
Heat Density Trends

ip le
Tr

b le
D ou

u bl e
D o

nt
50 Perce
Uptime Institute -
Heat Density Trends

 Projections based on information collected by major

computer/communication equipment manufacturers:
– Amdahl
– Cisco – Intel
– Compaq – Lucent
– Cray – Motorola
– Dell – Nokia
– EMC – Nortel
– Hewlett-Packard – Sun Microsystems
– IBM – Unisys
New Critical Items

 Cooling System Restart Time

 Automatic Sensing and Response

 Air Distribution System, Raised Floor Height

Space Temperature Rise
Measured Room Ambient Temperature - F
50
450 w/ft2
300 w/ft2
45
Ambient Temperature - C

40
127F 123F
150 w/ft2
35

30
108F
25

20

15
70F
10
0 5 10 15 20 25
Time - Minutes
Things That Affect Air Flow in The
Raised Floor Plenum

Blast Losses Friction Losses Total Pressure

Height

Velocity Pressure Static Pressure

Distance
(There are other losses, such as barriers, pipes, cables,
etc, that are not accounted for in this example.)
 Heat Density - Raised Floor Height
Square Room
70
150
60
125 Minimum Height @ 150 W/sf
Raised Floor Height (“)

50
100
40
75
30
50
20

10

0
100 50 33 25 20

Floor Area (1,000 * sf)

High Heat Density - Raised Floor

“2/3 of the failures from the top 1/3 of the rack”

 Agenda
 Introduction
 The Cooling Challenge
 Liebert XDTM
– Second generation
– First generation
The Solution – Liebert XD System
Liebert EXtreme Density System Features
 Designed for Heat Densities up to 500 W/ft 2

 For Supplemental Spot or Zone Cooling

 Perfect in Combination with Deluxe System/3
Units
H2O
 XD Coolant –
 Energy Efficient
 “No” Floor Space Needed
 Flexible and Scalable
 Introduction to Liebert XDTM
 Second Generation High Heat Density Cooling System
– XD CoolantTM H2O

– No Compressor, No Expansion Valve

• Low Pressure / Low Temperature System
 Designed for Heat Densities Up To 500 W/ft2

 Applications are Flexible and Scalable

– Data Center Hot Spots
– Zone Cooling
– Room Sections
The Solution – Liebert XD System
Schematic
XD for Supplemental Spot or Zone Cooling
Indirect System
Building
XDP XDO / XDV
Chilled
Water
XD Coolant XDO / XDV

XDP XDO / XDV

H2O
Direct System
XD
Chiller XDO / XDV
XD Coolant
XDO / XDV
Liebert XDTM – Components
 Circuit Consists of:
– Evaporator (Fan Coil)

FAN
COIL

XDO/XDV
Liebert XDTM – Components
 Circuit Consists of:
– Evaporator (Fan Coil)
– Condenser (Heat Exchanger)

HX FAN
COIL

XDP XDO/XDV
Liebert XDTM – Components
 Circuit Consists of:
– Evaporator (Fan Coil)
– Condenser (Heat Exchanger)
– Pump (s)

HX FAN
COIL

XDP XDO/XDV
Liebert XDTM – Components
 Circuit Consists of:
– Evaporator (Fan Coil)
– Condenser (Heat Exchanger)
– Redundant Pumps
– XD Coolant HX FAN
COIL
• Two Phase Fluid (Refrigerant)

XDP XDO/XDV
Liebert XDTM – Components
 Circuit Consists of:
– Evaporator (Fan Coil)
– Condenser (Heat Exchanger)
– Pump
– XD Coolant HX FAN
COIL
• Two Phase Fluid (Refrigerant)
– Building CW
XDP XDO/XDV
• 45 ° H20
• Control Valve
Liebert XDO – Components and
Features
 Components
– Mounted in the Ceiling Above the Heat
Emitting Equipment. Typically About 24” from
Top of Cabinets
– Enclosure, Coil, and 3 Fans Hot Cold Hot
 Options & Features Aisle Aisle Aisle
– Nominal Capacity >32 kW (9 Ton) @ 85°F
EAT Side View
• Capacity is dependent on the entering air
temperature. Higher EAT will yield more
capacity
– 208V-3ph-50/60Hz
– Dimensions 72” x 72”’ x 22” (WxLxH)
– Overhead Lighting
XDO - Isometric
Cooling Coils
XDO - Isometric
Cooling Coils

Fans
XDO - Isometric
Cooling Coils

Fans

Optional Lights
Liebert XDO – System Operation
 System Operation
– Installed Over Conditioned Space
(Cold Aisle)
– Pulls Air from Two Hot Aisles and Hot Cold Hot
Delivers Conditioned Air to Cold Aisle Aisle Aisle
Aisle
Side View
Liebert XDO - Thermal Imaging

Side View
Liebert XDO – System Operation
 System Operation
– Installed Over Conditioned Space
(Cold Aisle)
– Pulls Air from Two Hot Aisles and Hot Cold Hot
Delivers Conditioned Air to Cold Aisle Aisle Aisle
Aisle
– XD Coolant Changes from a Liquid Side View
to a Gas as Heat is Absorbed in the
Cooling Coil and Returned to the
XDP to Condense Back to a Liquid
Liebert XDO – System Operation
 System Operation
– Installed Over Conditioned Space (Cold
Aisle)
– Pulls Air from Two Hot Aisles and Delivers
Conditioned Air to Cold Aisle Hot Cold Hot
– XD Coolant Changes from a Liquid to a Gas Aisle Aisle Aisle
as Heat is Absorbed in the Cooling Coil and
Returned to the XDP to Condense Back to a
Liquid Side View
 Advantages
– No Floor Space Needed
– Highly Energy Efficient
– Optional Lighting Available to Assure
Visibility in Cold Aisles
 Liebert XDV
 General
– Fan Coil (Enclosure, Coil, Fans,
Controls) Mounted on Top of the Racks
– 120V-1ph-50/60Hz or 230V/1ph- “Hot Cold “Hot
Aisle” Aisle Aisle”
50/60Hz
– Dimension 23.5” x 30” x 14” (WxLxH)
Side View
 Options
– Condensate Detection
 Features
– No Floor Space Needed
– Excellent for Retrofit Installations
Liebert XDV – Components and
Features
 Components
– Mounted on Top of the Racks with Heat
Emitting Equipment.
– Enclosure, Coil, 2 Fans. “Hot Cold “Hot
Aisle” Aisle Aisle”
 Features
– Nominal Capacity >8 kW (2 Ton) @ 90°F
Side View
EAT
• Capacity is dependent on the entering air
temperature. Higher EAT will yield more
capacity
– Dual (A and B) Power Cords for Increased
Uptime
• Powered directly from rack.
XDV - Isometric

Coil
XDV - Isometric

Coil
Fans
Liebert XDV – System Operation

 System Operation “Hot Cold “Hot

– Configurable as a Bottom Return Aisle” Aisle Aisle”
Through the Rack, or as a Rear
Return from the Defined Hot Aisle
Side View
– XD Coolant Changes from a Liquid
to a Gas as Heat is Absorbed in the
Cooling Coil and Returned to the
XDP to Condense Back to a Liquid
Liebert XDV – Thermal Imaging

Side View
XDV - Isometric

Air Inlet

Air Inlet
The Solution – Liebert XDV

Side View
Liebert XDO and XDV

Side View
Liebert XDP – Components and
Features
 Components
– Enclosure, Pump(s), Controls, Heat
Exchanger, Valves and Piping
Chilled XDP XD Coolant
– Circulates and Controls the Fluid to the Water
XDO/XDV Cooling Modules
 Options & Features
– Nominal Capacity >160 kW (47 Ton) @
45°F EWT, and 140 GPM
• 8°F Delta T
– 208V-3ph-60Hz or 460V-3ph-60Hz
– Dimension 36” x 30” x 76” (WxLxH)
– Intelligent Controls of the XD Coolant
– Redundant Pump
XDP - Isometric

• Tubular Steel Frame

• 20 Gauge Panel
Construction
 Heat Exchanger
XDP - Isometric

Microprocessor
Controls

Valves XD Coolant Pumps

Liebert XDP – System Operation
 System Operation
– Circulates and Controls the Fluid to
the XDO/XDV Cooling Modules Chilled XDP XD Coolant
– The XDP also Serves as an Water
Intermediary Between the Building
CW Loop and the XD Coolant Loop.
Liebert XDP – System Operation
 System Operation
– Circulates and Controls the Fluid to
the XDO/XDV Cooling Modules Chilled XDP XD Coolant
– The XDP also Serves as an Water
Intermediary Between the Building
CW Loop and the XD Coolant Loop.
– Prevents Condensation by
Maintaining the XD Coolant
Temperature Above the Dew Point
 Advantages
– Intelligent Controls of the XD Coolant
– Floor Space Efficient
Liebert XDA
Hot Hot
Cold
Aisle Aisle
Aisle

Side View
Liebert XDA – Components and
Features
 Components
– Mounted on the Back of the Enclosure to
Hot Hot
Draw the air Through the Enclosure. Cold
Aisle Aisle
– Enclosure, and 5 Fans Aisle
 Options & Features
– Nominal Capacity 1000 CFM Side View
– 120V-1ph-50/60Hz or 230V-1ph-50/60Hz
– Dimension 8” x 2.25” x 56” (WxDxH)
– Dual (A and B) Power Cords for Increased
Uptime
– Versatile, 4 Different Application Ways (1
or 2 Units, Inside or Outside Cabinet Door)
– Consumes Zero ‘U’ of Rack Space
XDA – System Operation
The Challenge
Air Restricting
Power Cables Servers
(Up To 82 Cables)

Back Front

Side View
XDA – System Operation
The Challenge Liebert XDA Solution
Air Restricting
Power Cables Servers
(Up To 82 Cables)

Back Front

Side View Side View

 Agenda
 Introduction
 The Cooling Challenge
 Liebert XDTM
– Second generation
– First generation
First Generation High Heat Density
Systems

RackCoolerTM Coolant Distribution Unit, CDU

Renamed - XDR Renamed - XDWP
 Liebert XDR (RackCooler)

75 F 75 F

8 kW
(55°EFT, 100°EAT)
Fluid In Out
 XDWP (CDU)

Dual Pumps
Control
Valve Exp. Tank /
Fluid Sensor
Chilled
XDR
Water

Shut
Off
Heat
To Valve
Exchanger
Drain 100 kW
(45°ECWT/55LFT°)
•Isolates XDR From Building CW Loop
•Regulates Building CW to Ensure Water Temp Above Dew Point
•Patented Fluid Management System
 Floor Area Comparison
25
Used Floor Area (%)

20
st em
l S y
15
i ti ona
d
Tra
10
Liebert XD
5

0
0 100 200 300 400
Heat Density (W/sqft)
Liebert XDTM – System Considerations
 Use traditional cooling system as a base for temperature and humidity control
 If available cooling capacity is sufficient, add XDA to enclosures to minimize
hot spots
 Install XDO or XDV (and XDP) as heat density increases
 Both cooling modules and XDA can be used together to increase air flow
through overheated cabinets
 Minimum and Maximum # of cooling modules per 1 XDP unit:
– 1 XDO minimum and 5 XDOs maximum
– 4 XDVs minimum and 20 XDVs maximum
 Liebert XDTM – Summary

Liebert XDV
Liebert
Deluxe Liebert XDR

Liebert XDO
Liebert XDWP

Liebert XDA

Liebert XDP
Virginia Tech Job
http://don.cc.vt.edu/g5sinracks/
Liebert Extreme Heat Density Lab

Side View
Thank You!