Professional Documents
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Mr. SACHHIDANANDA M H
ASSISTANT PROFESSOR
PROJECT PROPOSAL EVALUATION
CONTENTS
Team composition
Literature Review
Objectives
Methodology
Resources needed
Timeline
PROJECT PROPOSAL EVALUATION
TEAM COMPOSITION
VISHNU. S PES1UG20ME126
ABHISHEK. S PES1UG20ME196
SACHHIDANANDA M H
Assistant Professor,Dept of ME
In electronic products and devices, solder joints provide effectively electrical, thermal and
mechanical connections among different components and various circuits, including chips.
The quality and performance of solder materials are crucial to the integrity and reliability of
solder joints that are generally regarded as the weakest part in packaging systems and
electronic assemblies, With the global trend of electronic products and systems moving
toward lead-free, miniaturized, lightweight, and high-reliability, the lead-free ball grid array
(BGA) packages are widely used in many electronic applications for high I/O density, small
profile, high performance and low cost . In service, BGA structure joints are mainly
subjected to thermal cyclic loads owing to the thermal fluctuation such as power transient
and the change in environment temperature during a long-term service, so their fatigue
failure is one of key reliability issues.
PROJECT PROPOSAL EVALUATION
LITERATURE REVIEW
Softwares :
Hardwares:
Fabrications:
PROJECT PROPOSAL EVALUATION
Timeline
Gann Chart
THANK YOU
Project ID :- Team No – 18
VISHNU. S PES1UG20ME126
TANUSH BHASKAR PES1UG20ME131
ABHISHEK. S PES1UG20ME196
G. DURGESH KHANNA PES1UG20ME197