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CLEAN ROOMs

In Semiconductor Foundries
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CONTENTS
• Introduction
• Semi-conductor cleanrooms
• Classifications
• Types of cleanrooms
• Clean room equipments
 CLEAN ROOM :

 A cleanroom is an engineered space, which maintains a very low concentration of

airborne particulates.

 Such rooms are commonly needed for scientific research, and in industrial production for all

nanoscale processes, such as semiconductor manufacturing.

 The ambient outdoor air in a typical urban area contains 35,000,000 particles for each cubic meter

in the size range >=0.5 micrometer and bigger.


 CLEAN ROOM ENTRANCE :
 CLEAN ROOMS:
 SEMI-CONDUCTOR CLEANROOMS :

 Clean rooms in semiconductor fabs should have tight control over the following

Airbone particles

Temperature

Humidity

Lighting
I. Controlling Airbone Particles:

 First outside air entering a clean room is filtered by several outdoor air handlers (HVAC – heating,

ventilation and air conditioning)

 Personals working in semiconductor clean rooms should grab up and often pass through an air shower

which blows them off with HEPA (High-Efficiency Particulate Air filter which removes almost

99.97% dust, bacteria and airbone particulars with size <=0.3 microns)

 Air is constantly recirculated through fan units containing HEPA and ULPA (Ultra Low Particulate

Air) filters to remove internally generated particulates


o As per US FED STD (United States Federal Standard) clean rooms are classified as ;
II. Temperature :
 As we know semiconductor conductivity increases by temperature, so it is crucial to

control the temperature.

 The set temperature in clean rooms is 190C – 230C for class 10 clean room.
III. Humidity :

 Humidity and airflow were controlled by HVAC systems.

 Common cleanroom guidelines state that Relative Humidity (RH) levels in cleanrooms should
remain between 30-40% RH year-round.
IV. Lighting :

 The lower class of the clean rooms usually in amber lighting because normal white light should
expose the photoresist which was used to pattern the semiconductor wafer.
 CLEANROOM CLASSIFICATION:

 It is classified into two standards. Federal standard 209 E is used domestically and TC 209 is the

new standard from the International Standard Organization (ISO).

 FS 209E have six classes. The cleanest room is class 1 and dirtiest clean room is class 9.

 ISO 14644-1 defines the maximum concentration of particle size with the following formula

 CN = 10N (0.1/D)2.08
N=Class of the cleanroom
D = size of particulate in microns
Federal Standard ISO
1
2
1 3
10 4
100 5
1000 6
10,000 7
10,00000 8
9

o The above figure shows the graph of particle size


versus particles per cubic foot for different room
classes.
 TYPES OF CLEAN ROOM :

 Mainly there are two types of clean rooms on the basis of ventilation.

Laminar ventilated and

Turbulently ventilated.

 Laminar air flow systems are typically employed across 80% of a cleanroom ceiling to maintain
constant air processing.

 Turbulent, or non unidirectional, air flow uses both laminar air flow hoods and nonspecific
velocity filters to keep air in a cleanroom in constant motion, although not all in the same
direction.
 TURBULENT AIR FLOW CLEAN ROOM:

 In case of Turbulent flow Clean Rooms, a vortex air


flow is introduced that mixes with internal air.
 It is done by using HEPA Filters
 this techniques followed in Class 100000 to Class 1000
clean rooms
 LAMINAR AIR FLOW CLEAN ROOM:

 Laminar flow it pushes the air uniformly from the top


to the bottom according to what is called the “piston
effect”.
 Vertical Unidirectional flow Clean Rooms this type
of clean room are installed on the suspended ceiling
grid.
 Horizontal Unidirectional flow Clean Rooms this
type of clean room is typically used in operating
rooms.
 CLEAN ROOM EQUIPMENT’S :
• Automatic Shoe Cleaners
• Ceiling Tiles
• Containment Hoods • Cleanroom Air Showers
• Environmental Monitoring • Eye Wash Spray Gun
Systems
• Cleanroom Filters • Cleanroom Fume Hoods
• HEPA AC Units • Laminar Flow Hoods
 The Sequence For Gowning:

 Dedicated shoes or shoe covers.

 Head and facial hair covers and facemasks.

 Eye shields are optional unless working with irritants.

 After this grab, personnel must clean their nails and wash their hands.

 Then they must dry with lint-free disposable towels or an electric hand dryer.

 After hands are dry, personnel must don a non-shedding gown.

 Once inside the buffer room, prior to donning sterile powder free gloves, personnel must clean
their hands with an alcohol based surgical hand scrub as per mfg. recommendations.
CONCLUSION :

• IISc Bangalore has Class 1000 and Class 10000 Clean rooms.
• Semiconductor facilities often get by with Class 10 to Class 100, while Class 1 facilities are
exceedingly rare.

References:
1. National Nano Fabrication Center(NNFC) video related to Clean Room
THANK YOU

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