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David Chapman

Copper Development Association


david.chapman@copperdev.co.uk
Copper Development Association
Busbar Design Basics
www.leonardo-
energy.org
Copper Development Association
www.cda.org.uk

High electrical conductivity


only silver is better than copper

Good thermal conductor


heat reaches surface quickly

Strong (at working temperature)


to withstand short circuit stresses
low creep

Easy to joint
resistant to corrosion
Materials for Busbar Systems
www.leonardo-
energy.org
Copper Development Association
www.cda.org.uk
Busbar System Current Ratings
usbar ratings are determined only by the
ma!imum desired working temperature
"t working temperature#
heat generated $ heat lost
www.leonardo-
energy.org
Copper Development Association
www.cda.org.uk
Busbar System Current Ratings
usbar ratings depend on#
% &orking and ambient temperatures
% Heat lost from the busbar
' by convection
' by radiation
% Heat generated in the busbar
www.leonardo-
energy.org
Copper Development Association
www.cda.org.uk
25 . 0
25 . 1
66 . 7
v
P
cv

=
(ower dissipated by convection is given by#
where
is the temperature rise above ambient
v is the vertical height of the surface
Busbar System Current Ratings
P
cv1
P
cv2
v
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energy.org
Copper Development Association
www.cda.org.uk
Power dissipation per metre length v Vertical height
0
40
80
120
160
0 50 100 150 200
Vertical height (mm
P
o
w
e
r

d
i
s
s
i
p
a
t
i
o
n

p
e
r

m
e
t
r
e

l
e
n
g
t
h

(
!

)onvection (for *+ ) temperature rise)


Busbar System Current Ratings
www.leonardo-
energy.org
Copper Development Association
www.cda.org.uk
Power dissipated by radiation is given by
( )
8 4
1
4
2
10 7 . 5

= T T P
r

where
(
r
is the power dissipated per square metre
,
-
is the working temperature. /
,
0
is the ambient temperature. /
is the emissivity
Busbar System Current Ratings
P
r
P
r
www.leonardo-
energy.org
Copper Development Association
www.cda.org.uk
,he emissivity. . describes how effectively
the surface radiates heat
1or a perfectly polished surface. the value is
close to 2ero 3 a very poor radiator
1or a matt black surface. the value is close to
0 3 a very good radiator
Busbar System Current Ratings
www.leonardo-
energy.org
Copper Development Association
www.cda.org.uk
right copper has an emissivity of about +40
5uring use. the emissivity of the copper
surface increases 3 and the current rating
increases 3 as the copper darkens to reach an
emissivity value of about +46
,in plated copper has an emissivity of about
+47 to +48
ut painting bars reduces the current rating9
Busbar System Current Ratings
www.leonardo-
energy.org
Copper Development Association
www.cda.org.uk
Busbar System Current Ratings
P
r
P
r
P
r
P
r
P
r
P
r
!o radiation heat loss
"rom internal sur"aces
www.leonardo-
energy.org
Copper Development Association
www.cda.org.uk
"adiation power dissipation v !or#ing temperat$re
0
20
40
60
80
100
2%& &2& &%&
A'sol$te !or#ing (emperat$re ()
P
o
w
e
r

d
i
s
s
i
p
a
t
i
o
n

(
!

p
e
r

s
*
m

:adiation (for 7+ ) ambient)


Busbar System Current Ratings
www.leonardo-
energy.org
Copper Development Association
www.cda.org.uk
for 0++ mm vertical height. 7+ ) ambient
(otal power dissipation v !or#ing temperat$re
0
100
200
&00
400
500
600
%00
800
+00
1000
40 60 80 100 120 140
!or#ing temperat$re (C
P
o
w
e
r

d
i
s
s
i
p
a
t
i
o
n

(
!

p
e
r

s
*
m

Convection
"adiation
(otal
Busbar System Current Ratings
www.leonardo-
energy.org
Copper Development Association
www.cda.org.uk
R I P
2
=
a
l
I P

2
=
,he power generated by current in the busbar is#
where
is the resistivity of the material
a is the cross sectional area
l is the length
Busbar System Current Ratings
www.leonardo-
energy.org
Copper Development Association
www.cda.org.uk
"t some temperature. the heat generated in the
busbar is equal to the total heat lost by convection
and radiation4
[ ] [ ]
r c i
P P P + =
Busbar System Current Ratings
www.leonardo-
energy.org
Copper Development Association
www.cda.org.uk
)alculation method#
0 Select working and ambient temperatures
- "ssume initial current density of * amps;mm
-
7 1ind appropriate si2e in standard range
< )alculate heat generated due to current
8 )alculate heat loss at working temperature
= >f <?8. increase si2e and return to <
&hen <$@8. this is smallest possible si2e
Minimum size calculation
www.leonardo-
energy.org
Copper Development Association
www.cda.org.uk
,he most economic si2e gives the lowest
lifetime cost4 >t is the minimum total cost of
%material
%installation and
%energy costs
over the circuit lifetime4
Higher purchase cost 3 lower running costs
Best economic sizing
www.leonardo-
energy.org
Copper Development Association
www.cda.org.uk
Best economic sizing
Cost o, 'ar
0
5
10
15
0 100 200 &00 400 500 600
Cross sectional area (s*mm
C
o
s
t

o
,

'
a
r

p
e
r

m
e
t
r
e

(
-

www.leonardo-
energy.org
Copper Development Association
www.cda.org.uk
Best economic sizing
Cost o, losses . 5 /ears
0
10
20
&0
0 100 200 &00 400 500 600
Cross sectional area (s*mm
C
o
s
t

o
,

l
o
s
s
e
s

o
v
e
r

5

/
e
a
r
s

(
-

www.leonardo-
energy.org
Copper Development Association
www.cda.org.uk
Economic Sizing of Busbars
(otal cost . 5 /ears
0
10
20
&0
0 100 200 &00 400 500 600
Cross sectional area (s*mm
0
i
,
e
t
i
m
e

c
o
s
t

p
e
r

m
e
t
r
e

(
-

Cost o, 'ar
Cost o, loss
(otal
www.leonardo-
energy.org
Copper Development Association
www.cda.org.uk
Busbar calculation software
www.leonardo-
energy.org
Copper Development Association
www.cda.org.uk
Busbar calculation software
www.leonardo-
energy.org
Copper Development Association
www.cda.org.uk
Busbar calculation software
www.leonardo-
energy.org
Copper Development Association
www.cda.org.uk
Further considerations
Having calculated the si2e of the bar. there
are three further considerations#

voltage drop

skin effect
'increases apparent resistance by reducing
effective area 3 important for#
thick busbars
high frequencies
harmonics generated by non3linear loads

short circuit current


www.leonardo-
energy.org
Copper Development Association
www.cda.org.uk
Summary of Busbar Material Characteristics
High )onductivity
% low loss. low voltage drop
% ?0+048 A >")S
Easy 1ormability
% due to small grain si2e and advanced production
technology
% easy to bend without surface deformation
Good 1latness
% simple reliable jointing
Good Straightness
% easy installation. lower joint stress

David Chapman
Copper Development Association
david.chapman@copperdev.co.uk
Copper Development Association

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