OptiX OSN 1500 Intelligent Optical Transmission System

V100R007

Hardware Description

Issue

02

Date

2007-09-10

Part Number

31401357

Huawei Technologies Proprietary

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Huawei Technologies Proprietary

OptiX OSN 1500 Intelligent Optical Transmission System

Hardware Description

Contents

Contents
About This Document.....................................................................................................................1
1 Equipment Structure.................................................................................................................1-1
2 Cabinet.........................................................................................................................................2-1
2.1 Cabinet Type...................................................................................................................................................2-2
2.2 Cabinet Configuration.....................................................................................................................................2-2
2.2.1 Cabinet Indicator....................................................................................................................................2-3
2.2.2 DC PDU.................................................................................................................................................2-3
2.2.3 Other Configuration...............................................................................................................................2-4
2.3 Technical Specifications.................................................................................................................................2-5

3 Subrack.........................................................................................................................................3-1
3.1 Structure..........................................................................................................................................................3-2
3.2 Capacity...........................................................................................................................................................3-3
3.3 Slot Allocation.................................................................................................................................................3-4
3.4 Technical Specifications...............................................................................................................................3-17

4 Board List and Classification...................................................................................................4-1

4.1 Appearance and Dimensions of Boards..........................................................................................................4-2
4.2 Description of the Barcode on the Board........................................................................................................4-3
4.3 Board Classification........................................................................................................................................4-4
4.3.1 SDH Processing Boards.........................................................................................................................4-4
4.3.2 PDH Processing Boards.........................................................................................................................4-6
4.3.3 Data Processing Boards..........................................................................................................................4-7
4.3.4 Interface Boards and Switching Boards.................................................................................................4-9
4.3.5 Cross-Connect Boards and SCC Boards..............................................................................................4-10
4.3.6 Auxiliary Boards..................................................................................................................................4-10
4.3.7 WDM Processing Boards.....................................................................................................................4-11
4.3.8 Optical Amplifier Boards and Dispersion Compensation Board.........................................................4-11
4.3.9 Power Interface Boards........................................................................................................................4-12

5 SDH Processing Boards............................................................................................................5-1

5.1 SL1..................................................................................................................................................................5-3
5.1.1 Version Description................................................................................................................................5-3
5.1.2 Function and Feature..............................................................................................................................5-4
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OptiX OSN 1500 Intelligent Optical Transmission System

Hardware Description
5.1.3 Working Principle and Signal Flow.......................................................................................................5-5
5.1.4 Front Panel.............................................................................................................................................5-7
5.1.5 Valid Slots..............................................................................................................................................5-8
5.1.6 Board Feature Code................................................................................................................................5-9
5.1.7 Board Configuration Reference.............................................................................................................5-9
5.1.8 Technical Specifications........................................................................................................................5-9

5.2 SLQ1.............................................................................................................................................................5-11
5.2.1 Version Description..............................................................................................................................5-11
5.2.2 Function and Feature............................................................................................................................5-12
5.2.3 Working Principle and Signal Flow.....................................................................................................5-13
5.2.4 Front Panel...........................................................................................................................................5-15
5.2.5 Valid Slots............................................................................................................................................5-16
5.2.6 Board Feature Code..............................................................................................................................5-17
5.2.7 Board Configuration Reference...........................................................................................................5-17
5.2.8 Technical Specifications......................................................................................................................5-17
5.3 SLO1.............................................................................................................................................................5-19
5.3.1 Version Description..............................................................................................................................5-19
5.3.2 Function and Feature............................................................................................................................5-19
5.3.3 Working Principle and Signal Flow.....................................................................................................5-20
5.3.4 Front Panel...........................................................................................................................................5-22
5.3.5 Valid Slots............................................................................................................................................5-24
5.3.6 Board Feature Code..............................................................................................................................5-24
5.3.7 Board Configuration Reference...........................................................................................................5-24
5.3.8 Technical Specifications......................................................................................................................5-25
5.4 SLT1..............................................................................................................................................................5-26
5.4.1 Version Description..............................................................................................................................5-26
5.4.2 Function and Feature............................................................................................................................5-26
5.4.3 Working Principle and Signal Flow.....................................................................................................5-27
5.4.4 Front Panel...........................................................................................................................................5-29
5.4.5 Valid Slots............................................................................................................................................5-31
5.4.6 Board Configuration Reference...........................................................................................................5-31
5.4.7 Technical Specifications......................................................................................................................5-31
5.5 SEP1..............................................................................................................................................................5-32
5.5.1 Version Description..............................................................................................................................5-33
5.5.2 Function and Feature............................................................................................................................5-33
5.5.3 Working Principle and Signal Flow.....................................................................................................5-34
5.5.4 Front Panel...........................................................................................................................................5-37
5.5.5 Valid Slots............................................................................................................................................5-39
5.5.6 TPS Protection for the Board...............................................................................................................5-39
5.5.7 Board Configuration Reference...........................................................................................................5-40
5.5.8 Technical Specifications......................................................................................................................5-41
5.6 SL4................................................................................................................................................................5-41
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Hardware Description

Contents

5.6.1 Version Description..............................................................................................................................5-42

5.6.2 Function and Feature............................................................................................................................5-42
5.6.3 Working Principle and Signal Flow.....................................................................................................5-43
5.6.4 Front Panel...........................................................................................................................................5-45
5.6.5 Valid Slots............................................................................................................................................5-47
5.6.6 Board Feature Code..............................................................................................................................5-47
5.6.7 Board Configuration Reference...........................................................................................................5-48
5.6.8 Technical Specifications......................................................................................................................5-48
5.7 SLD4.............................................................................................................................................................5-49
5.7.1 Version Description..............................................................................................................................5-50
5.7.2 Function and Feature............................................................................................................................5-50
5.7.3 Working Principle and Signal Flow.....................................................................................................5-51
5.7.4 Front Panel...........................................................................................................................................5-53
5.7.5 Valid Slots............................................................................................................................................5-55
5.7.6 Board Feature Code..............................................................................................................................5-55
5.7.7 Board Configuration Reference...........................................................................................................5-56
5.7.8 Technical Specifications......................................................................................................................5-56
5.8 SLQ4.............................................................................................................................................................5-57
5.8.1 Version Description..............................................................................................................................5-58
5.8.2 Function and Feature............................................................................................................................5-58
5.8.3 Working Principle and Signal Flow.....................................................................................................5-59
5.8.4 Front Panel...........................................................................................................................................5-61
5.8.5 Valid Slots............................................................................................................................................5-63
5.8.6 Board Feature Code..............................................................................................................................5-63
5.8.7 Board Configuration Reference...........................................................................................................5-63
5.8.8 Technical Specifications......................................................................................................................5-63
5.9 SL16..............................................................................................................................................................5-64
5.9.1 Version Description..............................................................................................................................5-65
5.9.2 Function and Feature............................................................................................................................5-66
5.9.3 Working Principle and Signal Flow.....................................................................................................5-67
5.9.4 Front Panel...........................................................................................................................................5-69
5.9.5 Valid Slots............................................................................................................................................5-70
5.9.6 Board Feature Code..............................................................................................................................5-70
5.9.7 Board Configuration Reference...........................................................................................................5-71
5.9.8 Technical Specifications......................................................................................................................5-71
5.10 SL16A.........................................................................................................................................................5-73
5.10.1 Version Description............................................................................................................................5-73
5.10.2 Function and Feature..........................................................................................................................5-74
5.10.3 Working Principle and Signal Flow...................................................................................................5-75
5.10.4 Front Panel.........................................................................................................................................5-77
5.10.5 Valid Slots..........................................................................................................................................5-79
5.10.6 Board Feature Code............................................................................................................................5-79
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Hardware Description
5.10.7 Board Configuration Reference.........................................................................................................5-79
5.10.8 Technical Specifications....................................................................................................................5-79

5.11 SF16............................................................................................................................................................5-81
5.11.1 Version Description............................................................................................................................5-81
5.11.2 Function and Feature..........................................................................................................................5-81
5.11.3 Working Principle and Signal Flow...................................................................................................5-83
5.11.4 Front Panel.........................................................................................................................................5-85
5.11.5 Valid Slots..........................................................................................................................................5-86
5.11.6 Board Configuration Reference.........................................................................................................5-86
5.11.7 Technical Specifications....................................................................................................................5-86

6 PDH Processing Boards............................................................................................................6-1

6.1 PL1..................................................................................................................................................................6-3
6.1.1 Version Description................................................................................................................................6-3
6.1.2 Function and Feature..............................................................................................................................6-3
6.1.3 Working Principle and Signal Flow.......................................................................................................6-4
6.1.4 Front Panel............................................................................................................................................. 6-6
6.1.5 Valid Slots..............................................................................................................................................6-7
6.1.6 Board Feature Code................................................................................................................................6-7
6.1.7 Board Configuration Reference............................................................................................................. 6-7
6.1.8 Technical Specifications........................................................................................................................ 6-8
6.2 PD1 .................................................................................................................................................................6-8
6.2.1 Version Description................................................................................................................................6-9
6.2.2 Function and Feature..............................................................................................................................6-9
6.2.3 Working Principle and Signal Flow.....................................................................................................6-10
6.2.4 Front Panel...........................................................................................................................................6-13
6.2.5 Valid Slots............................................................................................................................................6-13
6.2.6 Board Feature Code..............................................................................................................................6-14
6.2.7 TPS Protection for the Board...............................................................................................................6-15
6.2.8 Board Configuration Reference...........................................................................................................6-17
6.2.9 Technical Specifications......................................................................................................................6-17
6.3 PQ1................................................................................................................................................................6-18
6.3.1 Version Description..............................................................................................................................6-18
6.3.2 Function and Feature............................................................................................................................6-19
6.3.3 Working Principle and Signal Flow.....................................................................................................6-20
6.3.4 Front Panel...........................................................................................................................................6-22
6.3.5 Valid Slots............................................................................................................................................6-23
6.3.6 Board Feature Code..............................................................................................................................6-24
6.3.7 TPS Protection for the Board...............................................................................................................6-24
6.3.8 Board Configuration Reference...........................................................................................................6-26
6.3.9 Technical Specifications......................................................................................................................6-26
6.4 PQM .............................................................................................................................................................6-27
6.4.1 Version Description..............................................................................................................................6-27
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6.4.2 Function and Feature............................................................................................................................6-27

6.4.3 Working Principle and Signal Flow.....................................................................................................6-28
6.4.4 Front Panel...........................................................................................................................................6-30
6.4.5 Valid Slots............................................................................................................................................6-31
6.4.6 TPS Protection for the Board...............................................................................................................6-32
6.4.7 Board Configuration Reference...........................................................................................................6-34
6.4.8 Technical Specifications......................................................................................................................6-34
6.5 PL3................................................................................................................................................................6-35
6.5.1 Version Description..............................................................................................................................6-35
6.5.2 Function and Feature............................................................................................................................6-36
6.5.3 Working Principle and Signal Flow.....................................................................................................6-36
6.5.4 Front Panel...........................................................................................................................................6-39
6.5.5 Valid Slots............................................................................................................................................6-40
6.5.6 TPS Protection for the Board...............................................................................................................6-40
6.5.7 Board Configuration Reference...........................................................................................................6-42
6.5.8 Technical Specifications......................................................................................................................6-42
6.6 PL3A.............................................................................................................................................................6-43
6.6.1 Version Description..............................................................................................................................6-43
6.6.2 Function and Feature............................................................................................................................6-44
6.6.3 Working Principle and Signal Flow.....................................................................................................6-45
6.6.4 Front Panel...........................................................................................................................................6-47
6.6.5 Valid Slots............................................................................................................................................6-48
6.6.6 Board Configuration Reference...........................................................................................................6-48
6.6.7 Technical Specifications......................................................................................................................6-48
6.7 PD3................................................................................................................................................................6-49
6.7.1 Version Description..............................................................................................................................6-50
6.7.2 Function and Feature............................................................................................................................6-50
6.7.3 Working Principle and Signal Flow.....................................................................................................6-51
6.7.4 Front Panel...........................................................................................................................................6-53
6.7.5 Valid Slots............................................................................................................................................6-54
6.7.6 TPS Protection for the Board...............................................................................................................6-55
6.7.7 Board Configuration Reference...........................................................................................................6-56
6.7.8 Technical Specifications......................................................................................................................6-57
6.8 PQ3................................................................................................................................................................6-57
6.8.1 Version Description..............................................................................................................................6-58
6.8.2 Function and Feature............................................................................................................................6-58
6.8.3 Working Principle and Signal Flow.....................................................................................................6-58
6.8.4 Front Panel...........................................................................................................................................6-61
6.8.5 Valid Slots............................................................................................................................................6-62
6.8.6 TPS Protection for the Board...............................................................................................................6-62
6.8.7 Board Configuration Reference...........................................................................................................6-64
6.8.8 Technical Specifications......................................................................................................................6-64
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OptiX OSN 1500 Intelligent Optical Transmission System

Hardware Description

6.9 DX1...............................................................................................................................................................6-64
6.9.1 Version Description..............................................................................................................................6-65
6.9.2 Function and Feature............................................................................................................................6-65
6.9.3 Working Principle and Signal Flow.....................................................................................................6-66
6.9.4 Front Panel...........................................................................................................................................6-67
6.9.5 Valid Slots............................................................................................................................................6-68
6.9.6 Board Feature Code..............................................................................................................................6-68
6.9.7 TPS Protection for the Board...............................................................................................................6-69
6.9.8 Board Configuration Reference...........................................................................................................6-70
6.9.9 Technical Specifications......................................................................................................................6-70
6.10 DXA............................................................................................................................................................6-71
6.10.1 Version Description............................................................................................................................6-71
6.10.2 Function and Feature..........................................................................................................................6-72
6.10.3 Working Principle and Signal Flow...................................................................................................6-72
6.10.4 Front Panel.........................................................................................................................................6-73
6.10.5 Valid Slots..........................................................................................................................................6-74
6.10.6 Board Configuration Reference.........................................................................................................6-75
6.10.7 Technical Specifications....................................................................................................................6-75
6.11 SPQ4............................................................................................................................................................6-75
6.11.1 Version Description............................................................................................................................6-76
6.11.2 Function and Feature..........................................................................................................................6-76
6.11.3 Working Principle and Signal Flow...................................................................................................6-77
6.11.4 Front Panel.........................................................................................................................................6-80
6.11.5 Valid Slots..........................................................................................................................................6-81
6.11.6 TPS Protection for the Board.............................................................................................................6-82
6.11.7 Board Configuration Reference.........................................................................................................6-83
6.11.8 Technical Specifications....................................................................................................................6-83

7 Data Processing Boards.............................................................................................................7-1

7.1 EFT4................................................................................................................................................................7-3
7.1.1 Version Description................................................................................................................................7-3
7.1.2 Function and Feature..............................................................................................................................7-3
7.1.3 Working Principle and Signal Flow.......................................................................................................7-4
7.1.4 Front Panel............................................................................................................................................. 7-6
7.1.5 Valid Slots..............................................................................................................................................7-8
7.1.6 Board Configuration Reference............................................................................................................. 7-8
7.1.7 Technical Specifications........................................................................................................................ 7-8
7.2 EFT8................................................................................................................................................................7-9
7.2.1 Version Description................................................................................................................................7-9
7.2.2 Function and Feature..............................................................................................................................7-9
7.2.3 Working Principle and Signal Flow.....................................................................................................7-10
7.2.4 Front Panel...........................................................................................................................................7-12
7.2.5 Valid Slots............................................................................................................................................7-14
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7.2.6 Board Configuration Reference...........................................................................................................7-15

7.2.7 Technical Specifications......................................................................................................................7-15
7.3 EFT8A...........................................................................................................................................................7-15
7.3.1 Version Description..............................................................................................................................7-16
7.3.2 Function and Feature............................................................................................................................7-16
7.3.3 Working Principle and Signal Flow.....................................................................................................7-17
7.3.4 Front Panel...........................................................................................................................................7-19
7.3.5 Valid Slots............................................................................................................................................7-21
7.3.6 Board Configuration Reference...........................................................................................................7-22
7.3.7 Technical Specifications......................................................................................................................7-22
7.4 EGT2.............................................................................................................................................................7-22
7.4.1 Version Description..............................................................................................................................7-23
7.4.2 Function and Feature............................................................................................................................7-23
7.4.3 Working Principle and Signal Flow.....................................................................................................7-24
7.4.4 Front Panel...........................................................................................................................................7-26
7.4.5 Valid Slots............................................................................................................................................7-27
7.4.6 Board Feature Code..............................................................................................................................7-27
7.4.7 Board Configuration Reference...........................................................................................................7-28
7.4.8 Technical Specifications......................................................................................................................7-28
7.5 EFS0..............................................................................................................................................................7-29
7.5.1 Version Description..............................................................................................................................7-29
7.5.2 Function and Feature............................................................................................................................7-30
7.5.3 Working Principle and Signal Flow.....................................................................................................7-32
7.5.4 Front Panel...........................................................................................................................................7-35
7.5.5 Valid Slots............................................................................................................................................7-36
7.5.6 TPS Protection......................................................................................................................................7-36
7.5.7 Board Configuration Reference...........................................................................................................7-37
7.5.8 Technical Specifications......................................................................................................................7-37
7.6 EFS4..............................................................................................................................................................7-37
7.6.1 Version Description..............................................................................................................................7-38
7.6.2 Function and Feature............................................................................................................................7-38
7.6.3 Working Principle and Signal Flow.....................................................................................................7-40
7.6.4 Front Panel...........................................................................................................................................7-43
7.6.5 Valid Slots............................................................................................................................................7-45
7.6.6 Board Configuration Reference...........................................................................................................7-45
7.6.7 Technical Specifications......................................................................................................................7-45
7.7 EGS2.............................................................................................................................................................7-45
7.7.1 Version Description..............................................................................................................................7-46
7.7.2 Function and Feature............................................................................................................................7-46
7.7.3 Working Principle and Signal Flow.....................................................................................................7-49
7.7.4 Front Panel...........................................................................................................................................7-51
7.7.5 Valid Slots............................................................................................................................................7-53
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Hardware Description
7.7.6 Board Feature Code..............................................................................................................................7-53
7.7.7 Board Configuration Reference...........................................................................................................7-53
7.7.8 Technical Specifications......................................................................................................................7-53

7.8 EMS4.............................................................................................................................................................7-54
7.8.1 Version Description..............................................................................................................................7-55
7.8.2 Function and Feature............................................................................................................................7-55
7.8.3 Working Principle and Signal Flow.....................................................................................................7-57
7.8.4 Front Panel...........................................................................................................................................7-60
7.8.5 Valid Slots............................................................................................................................................7-62
7.8.6 Board Feature Code..............................................................................................................................7-62
7.8.7 Board Protection...................................................................................................................................7-63
7.8.8 Board Configuration Reference...........................................................................................................7-65
7.8.9 Technical Specifications......................................................................................................................7-66
7.9 EGS4.............................................................................................................................................................7-67
7.9.1 Version Description..............................................................................................................................7-67
7.9.2 Function and Feature............................................................................................................................7-67
7.9.3 Working Principle and Signal Flow.....................................................................................................7-69
7.9.4 Front Panel...........................................................................................................................................7-72
7.9.5 Valid Slots............................................................................................................................................7-74
7.9.6 Board Feature Code..............................................................................................................................7-74
7.9.7 Board Protection...................................................................................................................................7-74
7.9.8 Board Configuration Reference...........................................................................................................7-77
7.9.9 Technical Specifications......................................................................................................................7-78
7.10 EGR2...........................................................................................................................................................7-79
7.10.1 Version Description............................................................................................................................7-79
7.10.2 Function and Feature..........................................................................................................................7-79
7.10.3 Working Principle and Signal Flow...................................................................................................7-82
7.10.4 Front Panel.........................................................................................................................................7-84
7.10.5 Valid Slots..........................................................................................................................................7-86
7.10.6 Board Feature Code............................................................................................................................7-86
7.10.7 Board Configuration Reference.........................................................................................................7-86
7.10.8 Technical Specifications....................................................................................................................7-86
7.11 EMR0..........................................................................................................................................................7-87
7.11.1 Version Description............................................................................................................................7-88
7.11.2 Function and Feature..........................................................................................................................7-89
7.11.3 Working Principle and Signal Flow...................................................................................................7-92
7.11.4 Front Panel.........................................................................................................................................7-94
7.11.5 Valid Slots..........................................................................................................................................7-97
7.11.6 Board Feature Code............................................................................................................................7-98
7.11.7 Board Configuration Reference.........................................................................................................7-98
7.11.8 Technical Specifications....................................................................................................................7-98
7.12 ADL4...........................................................................................................................................................7-99
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7.12.1 Version Description..........................................................................................................................7-100

7.12.2 Function and Feature........................................................................................................................7-100
7.12.3 Working Principle and Signal Flow.................................................................................................7-101
7.12.4 Front Panel.......................................................................................................................................7-103
7.12.5 Valid Slots........................................................................................................................................7-104
7.12.6 Board Feature Code..........................................................................................................................7-104
7.12.7 Board Configuration Reference.......................................................................................................7-104
7.12.8 Technical Specifications..................................................................................................................7-105
7.13 ADQ1........................................................................................................................................................7-106
7.13.1 Version Description..........................................................................................................................7-106
7.13.2 Function and Feature........................................................................................................................7-106
7.13.3 Working Principle and Signal Flow.................................................................................................7-107
7.13.4 Front Panel.......................................................................................................................................7-109
7.13.5 Valid Slots........................................................................................................................................7-111
7.13.6 Board Feature Code..........................................................................................................................7-111
7.13.7 Board Configuration Reference.......................................................................................................7-111
7.13.8 Technical Specifications..................................................................................................................7-112
7.14 IDL4..........................................................................................................................................................7-113
7.14.1 Version Description..........................................................................................................................7-113
7.14.2 Function and Feature........................................................................................................................7-113
7.14.3 Working Principle ...........................................................................................................................7-115
7.14.4 Front Panel.......................................................................................................................................7-117
7.14.5 Valid Slots........................................................................................................................................7-118
7.14.6 Board Feature Code..........................................................................................................................7-118
7.14.7 Board Protection...............................................................................................................................7-118
7.14.8 Board Configuration Reference.......................................................................................................7-119
7.14.9 Technical Specifications..................................................................................................................7-119
7.15 IDQ1..........................................................................................................................................................7-120
7.15.1 Version Description..........................................................................................................................7-120
7.15.2 Function and Feature........................................................................................................................7-121
7.15.3 Working Principle and Signal Flow.................................................................................................7-122
7.15.4 Front Panel.......................................................................................................................................7-124
7.15.5 Valid Slots........................................................................................................................................7-126
7.15.6 Board Feature Code..........................................................................................................................7-126
7.15.7 Board Protection...............................................................................................................................7-126
7.15.8 Board Configuration Reference.......................................................................................................7-126
7.15.9 Technical Specifications..................................................................................................................7-127
7.16 MST4.........................................................................................................................................................7-128
7.16.1 Version Description..........................................................................................................................7-128
7.16.2 Function and Feature........................................................................................................................7-128
7.16.3 Working Principle and Signal Flow.................................................................................................7-130
7.16.4 Front Panel.......................................................................................................................................7-132
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Hardware Description
7.16.5 Valid Slots........................................................................................................................................7-133
7.16.6 Board Feature Code..........................................................................................................................7-133
7.16.7 Board Configuration Reference.......................................................................................................7-134
7.16.8 Technical Specifications..................................................................................................................7-134

8 Interface Boards and Switching Boards.................................................................................8-1

8.1 L12S................................................................................................................................................................8-3
8.1.1 Version Description................................................................................................................................8-3
8.1.2 Function and Feature..............................................................................................................................8-3
8.1.3 Working Principle and Signal Flow.......................................................................................................8-3
8.1.4 Front Panel.............................................................................................................................................8-4
8.1.5 Valid Slots..............................................................................................................................................8-5
8.1.6 Technical Specifications........................................................................................................................8-5
8.2 D12B...............................................................................................................................................................8-5
8.2.1 Version Description................................................................................................................................8-6
8.2.2 Function and Feature..............................................................................................................................8-6
8.2.3 Working Principle and Signal Flow.......................................................................................................8-6
8.2.4 Front Panel.............................................................................................................................................8-6
8.2.5 Valid Slots..............................................................................................................................................8-8
8.2.6 Technical Specifications........................................................................................................................8-9
8.3 D12S................................................................................................................................................................8-9
8.3.1 Version Description................................................................................................................................8-9
8.3.2 Function and Feature..............................................................................................................................8-9
8.3.3 Working Principle and Signal Flow.......................................................................................................8-9
8.3.4 Front Panel...........................................................................................................................................8-10
8.3.5 Valid Slots............................................................................................................................................8-12
8.3.6 Technical Specifications......................................................................................................................8-13
8.4 L75S..............................................................................................................................................................8-13
8.4.1 Version Description..............................................................................................................................8-13
8.4.2 Function and Feature............................................................................................................................8-13
8.4.3 Working Principle and Signal Flow.....................................................................................................8-14
8.4.4 Front Panel...........................................................................................................................................8-14
8.4.5 Valid Slots............................................................................................................................................8-15
8.4.6 Technical Specifications......................................................................................................................8-15
8.5 D75S..............................................................................................................................................................8-16
8.5.1 Version Description..............................................................................................................................8-16
8.5.2 Function and Feature............................................................................................................................8-16
8.5.3 Working Principle and Signal Flow.....................................................................................................8-16
8.5.4 Front Panel...........................................................................................................................................8-17
8.5.5 Valid Slots............................................................................................................................................8-19
8.5.6 Technical Specifications......................................................................................................................8-20
8.6 D34S..............................................................................................................................................................8-20
8.6.1 Version Description..............................................................................................................................8-20
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8.6.2 Function and Feature............................................................................................................................8-20

8.6.3 Working Principle and Signal Flow.....................................................................................................8-21
8.6.4 Front Panel...........................................................................................................................................8-21
8.6.5 Valid Slots............................................................................................................................................8-22
8.6.6 Technical Specifications......................................................................................................................8-23
8.7 C34S..............................................................................................................................................................8-23
8.7.1 Version Description..............................................................................................................................8-24
8.7.2 Function and Feature............................................................................................................................8-24
8.7.3 Working Principle and Signal Flow.....................................................................................................8-24
8.7.4 Front Panel...........................................................................................................................................8-25
8.7.5 Valid Slots............................................................................................................................................8-26
8.7.6 Technical Specifications......................................................................................................................8-26
8.8 EU04..............................................................................................................................................................8-27
8.8.1 Version Description..............................................................................................................................8-27
8.8.2 Function and Feature............................................................................................................................8-27
8.8.3 Working Principle and Signal Flow.....................................................................................................8-27
8.8.4 Front Panel...........................................................................................................................................8-28
8.8.5 Valid Slots............................................................................................................................................8-29
8.8.6 Technical Specifications......................................................................................................................8-30
8.9 EU08..............................................................................................................................................................8-30
8.9.1 Version Description..............................................................................................................................8-31
8.9.2 Function and Feature............................................................................................................................8-31
8.9.3 Working Principle and Signal Flow.....................................................................................................8-31
8.9.4 Front Panel...........................................................................................................................................8-32
8.9.5 Valid Slots............................................................................................................................................8-33
8.9.6 Technical Specifications......................................................................................................................8-33
8.10 OU08 ..........................................................................................................................................................8-34
8.10.1 Version Description............................................................................................................................8-34
8.10.2 Function and Feature..........................................................................................................................8-35
8.10.3 Working Principle and Signal Flow...................................................................................................8-35
8.10.4 Front Panel.........................................................................................................................................8-35
8.10.5 Valid Slots..........................................................................................................................................8-38
8.10.6 Technical Specifications....................................................................................................................8-38
8.11 MU04..........................................................................................................................................................8-39
8.11.1 Version Description............................................................................................................................8-39
8.11.2 Function and Feature..........................................................................................................................8-39
8.11.3 Working Principle and Signal Flow...................................................................................................8-39
8.11.4 Front Panel.........................................................................................................................................8-40
8.11.5 Valid Slots..........................................................................................................................................8-41
8.11.6 Technical Specifications....................................................................................................................8-42
8.12 TSB8............................................................................................................................................................8-42
8.12.1 Version Description............................................................................................................................8-43
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8.12.2 Function and Feature..........................................................................................................................8-43
8.12.3 Working Principle and Signal Flow...................................................................................................8-43
8.12.4 Front Panel.........................................................................................................................................8-44
8.12.5 Valid Slots..........................................................................................................................................8-45
8.12.6 Technical Specifications....................................................................................................................8-46

8.13 EFF8............................................................................................................................................................8-46
8.13.1 Version Description............................................................................................................................8-47
8.13.2 Function and Feature..........................................................................................................................8-47
8.13.3 Working Principle and Signal Flow...................................................................................................8-47
8.13.4 Front Panel.........................................................................................................................................8-48
8.13.5 Valid Slots..........................................................................................................................................8-49
8.13.6 Technical Specifications....................................................................................................................8-50
8.14 ETF8............................................................................................................................................................8-51
8.14.1 Version Description............................................................................................................................8-51
8.14.2 Function and Feature..........................................................................................................................8-51
8.14.3 Working Principle and Signal Flow...................................................................................................8-51
8.14.4 Front Panel.........................................................................................................................................8-52
8.14.5 Valid Slots..........................................................................................................................................8-54
8.14.6 Technical Specifications....................................................................................................................8-55
8.15 ETS8............................................................................................................................................................8-56
8.15.1 Version Description............................................................................................................................8-56
8.15.2 Function and Feature..........................................................................................................................8-56
8.15.3 Working Principle and Signal Flow...................................................................................................8-56
8.15.4 Front Panel.........................................................................................................................................8-57
8.15.5 Valid Slots..........................................................................................................................................8-59
8.15.6 Technical Specifications....................................................................................................................8-59
8.16 DM12..........................................................................................................................................................8-60
8.16.1 Version Description............................................................................................................................8-60
8.16.2 Function and Feature..........................................................................................................................8-60
8.16.3 Working Principle and Signal Flow...................................................................................................8-60
8.16.4 Front Panel.........................................................................................................................................8-61
8.16.5 Valid Slots..........................................................................................................................................8-64
8.16.6 Technical Specifications....................................................................................................................8-64

9 Cross-Connect and System Control Boards..........................................................................9-1

9.1 CXL1...............................................................................................................................................................9-2
9.1.1 Version Description................................................................................................................................9-2
9.1.2 Function and Feature..............................................................................................................................9-2
9.1.3 Working Principle and Signal Flow.......................................................................................................9-5
9.1.4 Front Panel.............................................................................................................................................9-9
9.1.5 Valid Slots............................................................................................................................................9-11
9.1.6 Board Feature Code..............................................................................................................................9-11
9.1.7 Board Configuration Reference...........................................................................................................9-11
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9.1.8 Technical Specifications......................................................................................................................9-12

9.2 CXL4.............................................................................................................................................................9-13
9.2.1 Version Description..............................................................................................................................9-14
9.2.2 Function and Feature............................................................................................................................9-14
9.2.3 Working Principle and Signal Flow.....................................................................................................9-17
9.2.4 Front Panel...........................................................................................................................................9-20
9.2.5 Valid Slots............................................................................................................................................9-22
9.2.6 Board Feature Code..............................................................................................................................9-22
9.2.7 Board Configuration Reference...........................................................................................................9-22
9.2.8 Technical Specifications......................................................................................................................9-23
9.3 CXL16...........................................................................................................................................................9-24
9.3.1 Version Description..............................................................................................................................9-25
9.3.2 Function and Feature............................................................................................................................9-25
9.3.3 Working Principle and Signal Flow.....................................................................................................9-28
9.3.4 Front Panel...........................................................................................................................................9-31
9.3.5 Valid Slots............................................................................................................................................9-33
9.3.6 Board Feature Code..............................................................................................................................9-33
9.3.7 Board Configuration Reference...........................................................................................................9-33
9.3.8 Technical Specifications......................................................................................................................9-34

10 Auxiliary Boards.....................................................................................................................10-1
10.1 EOW............................................................................................................................................................10-2
10.1.1 Version Description............................................................................................................................10-2
10.1.2 Function and Feature..........................................................................................................................10-2
10.1.3 Working Principle and Signal Flow...................................................................................................10-2
10.1.4 Front Panel.........................................................................................................................................10-3
10.1.5 Valid Slots..........................................................................................................................................10-5
10.1.6 Technical Specifications....................................................................................................................10-5
10.2 AUX............................................................................................................................................................10-6
10.2.1 Version Description............................................................................................................................10-6
10.2.2 Function and Feature..........................................................................................................................10-6
10.2.3 Working Principle and Signal Flow...................................................................................................10-7
10.2.4 Jumper..............................................................................................................................................10-11
10.2.5 Front Panel.......................................................................................................................................10-11
10.2.6 Valid Slots........................................................................................................................................10-14
10.2.7 Technical Specifications..................................................................................................................10-15
10.3 AMU..........................................................................................................................................................10-15
10.3.1 Version Description..........................................................................................................................10-15
10.3.2 Function and Feature........................................................................................................................10-15
10.3.3 Working Principle and Signal Flow.................................................................................................10-16
10.3.4 Front Panel.......................................................................................................................................10-17
10.3.5 Valid Slots........................................................................................................................................10-20
10.3.6 Technical Specifications..................................................................................................................10-20
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10.4 FAN...........................................................................................................................................................10-21
10.4.1 Version Description..........................................................................................................................10-21
10.4.2 Function and Feature........................................................................................................................10-21
10.4.3 Working Principle and Signal Flow.................................................................................................10-22
10.4.4 Front Panel.......................................................................................................................................10-22
10.4.5 Valid Slots........................................................................................................................................10-23
10.4.6 Technical Specifications..................................................................................................................10-23

11 WDM Processing Boards......................................................................................................11-1

11.1 CMR2..........................................................................................................................................................11-3
11.1.1 Version Description............................................................................................................................11-3
11.1.2 Function and Feature..........................................................................................................................11-3
11.1.3 Working Principle and Signal Flow...................................................................................................11-4
11.1.4 Front Panel......................................................................................................................................... 11-5
11.1.5 Valid Slots..........................................................................................................................................11-7
11.1.6 Board Feature Code............................................................................................................................11-7
11.1.7 Technical Specifications.................................................................................................................... 11-8
11.2 CMR4..........................................................................................................................................................11-9
11.2.1 Version Description............................................................................................................................11-9
11.2.2 Function and Feature..........................................................................................................................11-9
11.2.3 Working Principle and Signal Flow.................................................................................................11-10
11.2.4 Front Panel.......................................................................................................................................11-11
11.2.5 Valid Slots........................................................................................................................................11-13
11.2.6 Board Feature Code..........................................................................................................................11-13
11.2.7 Technical Specifications..................................................................................................................11-14
11.3 MR2...........................................................................................................................................................11-15
11.3.1 Version Description..........................................................................................................................11-16
11.3.2 Function and Feature........................................................................................................................11-16
11.3.3 Working Principle and Signal Flow.................................................................................................11-16
11.3.4 Front Panel.......................................................................................................................................11-17
11.3.5 Valid Slots........................................................................................................................................11-19
11.3.6 Board Feature Code..........................................................................................................................11-19
11.3.7 Technical Specifications..................................................................................................................11-20
11.4 MR2A........................................................................................................................................................11-21
11.4.1 Version Description..........................................................................................................................11-21
11.4.2 Function and Feature........................................................................................................................11-21
11.4.3 Working Principle and Signal Flow.................................................................................................11-23
11.4.4 Front Panel.......................................................................................................................................11-24
11.4.5 Valid Slots........................................................................................................................................11-25
11.4.6 Technical Specifications..................................................................................................................11-25
11.5 MR2B........................................................................................................................................................11-26
11.5.1 Version Description..........................................................................................................................11-27
11.5.2 Function and Feature........................................................................................................................11-27
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11.5.3 Working Principle and Signal Flow.................................................................................................11-28

11.5.4 Front Panel.......................................................................................................................................11-29
11.5.5 Valid Slots........................................................................................................................................11-30
11.5.6 Technical Specifications..................................................................................................................11-30
11.6 MR2C........................................................................................................................................................11-31
11.6.1 Version Description..........................................................................................................................11-32
11.6.2 Function and Feature........................................................................................................................11-32
11.6.3 Working Principle and Signal Flow.................................................................................................11-33
11.6.4 Front Panel.......................................................................................................................................11-34
11.6.5 Valid Slots........................................................................................................................................11-36
11.6.6 Technical Specifications..................................................................................................................11-36
11.7 MR4...........................................................................................................................................................11-37
11.7.1 Version Description..........................................................................................................................11-37
11.7.2 Function and Feature........................................................................................................................11-37
11.7.3 Working Principle and Signal Flow.................................................................................................11-38
11.7.4 Front Panel.......................................................................................................................................11-39
11.7.5 Valid Slots........................................................................................................................................11-41
11.7.6 Board Feature Code..........................................................................................................................11-41
11.7.7 Technical Specifications..................................................................................................................11-42
11.8 LWX..........................................................................................................................................................11-43
11.8.1 Version Description..........................................................................................................................11-43
11.8.2 Function and Feature........................................................................................................................11-43
11.8.3 Working Principle and Signal Flow.................................................................................................11-44
11.8.4 Front Panel.......................................................................................................................................11-46
11.8.5 Valid Slots........................................................................................................................................11-48
11.8.6 Board Feature Code..........................................................................................................................11-48
11.8.7 Technical Specifications..................................................................................................................11-48
11.9 OBU1........................................................................................................................................................11-51
11.9.1 Version Description..........................................................................................................................11-52
11.9.2 Function and Feature........................................................................................................................11-52
11.9.3 Working Principle and Signal Flow.................................................................................................11-52
11.9.4 Front Panel.......................................................................................................................................11-54
11.9.5 Valid Slots........................................................................................................................................11-55
11.9.6 Board Feature Code..........................................................................................................................11-55
11.9.7 Technical Specifications..................................................................................................................11-56
11.10 FIB...........................................................................................................................................................11-57
11.10.1 Version Description........................................................................................................................11-57
11.10.2 Function and Feature......................................................................................................................11-57
11.10.3 Working Principle and Signal Flow...............................................................................................11-58
11.10.4 Front Panel.....................................................................................................................................11-58
11.10.5 Valid Slots......................................................................................................................................11-59
11.10.6 Technical Specifications................................................................................................................11-59
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12 Optical Amplifier Boards and Dispersion Compensation Boards............................... 12-1

12.1 BA2............................................................................................................................................................. 12-2
12.1.1 Version Description............................................................................................................................12-2
12.1.2 Function and Feature..........................................................................................................................12-2
12.1.3 Working Principle and Signal Flow...................................................................................................12-3
12.1.4 Front Panel......................................................................................................................................... 12-5
12.1.5 Valid Slots..........................................................................................................................................12-7
12.1.6 Board Feature Code............................................................................................................................12-7
12.1.7 Technical Specifications.................................................................................................................... 12-7
12.2 BPA.............................................................................................................................................................12-8
12.2.1 Version Description............................................................................................................................12-9
12.2.2 Function and Feature..........................................................................................................................12-9
12.2.3 Working Principle and Signal Flow.................................................................................................12-10
12.2.4 Front Panel.......................................................................................................................................12-11
12.2.5 Valid Slots........................................................................................................................................12-13
12.2.6 Board Feature Code..........................................................................................................................12-13
12.2.7 Technical Specifications..................................................................................................................12-13
12.3 COA..........................................................................................................................................................12-14
12.3.1 Version Description..........................................................................................................................12-15
12.3.2 Function and Feature........................................................................................................................12-15
12.3.3 Working Principle and Signal Flow.................................................................................................12-18
12.3.4 Front Panel.......................................................................................................................................12-19
12.3.5 Installation Position..........................................................................................................................12-23
12.3.6 Board Feature Code..........................................................................................................................12-24
12.3.7 Technical Specifications..................................................................................................................12-24

13 Power Interface Boards.........................................................................................................13-1

13.1 UPM............................................................................................................................................................13-2
13.1.1 Version Description............................................................................................................................13-2
13.1.2 Function and Feature..........................................................................................................................13-2
13.1.3 Working Principle and Signal Flow...................................................................................................13-3
13.1.4 Rear Panel.......................................................................................................................................... 13-4
13.1.5 Valid Slots..........................................................................................................................................13-6
13.1.6 Technical Specifications.................................................................................................................... 13-6
13.2 PIU.............................................................................................................................................................. 13-7
13.2.1 Version Description............................................................................................................................13-8
13.2.2 Function and Feature..........................................................................................................................13-8
13.2.3 Working Principle and Signal Flow...................................................................................................13-8
13.2.4 Front Panel......................................................................................................................................... 13-9
13.2.5 Valid Slots........................................................................................................................................13-10
13.2.6 Technical Specifications..................................................................................................................13-10
13.3 PIUA..........................................................................................................................................................13-11
13.3.1 Version Description..........................................................................................................................13-11
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13.3.2 Function and Feature........................................................................................................................13-11

13.3.3 Working Principle and Signal Flow.................................................................................................13-12
13.3.4 Front Panel.......................................................................................................................................13-13
13.3.5 Valid Slots........................................................................................................................................13-14
13.3.6 Technical Specifications..................................................................................................................13-14

14 Cables.......................................................................................................................................14-1
14.1 Fiber Jumper................................................................................................................................................14-2
14.1.1 Types of Fiber Jumpers......................................................................................................................14-2
14.1.2 Connector...........................................................................................................................................14-3
14.2 Power Cables and Grounding Cables..........................................................................................................14-5
14.2.1 Cabinet 48 V/BGND/PGND Power Cable.......................................................................................14-5
14.2.2 Equipment 48 V/60 V Power Cable/PGND Grounding Cable......................................................14-7
14.2.3 UPM Power Cable..............................................................................................................................14-9
14.3 Alarm Cable..............................................................................................................................................14-10
14.3.1 Alarm Input/Output Cable................................................................................................................14-10
14.4 Management Cable....................................................................................................................................14-12
14.4.1 OAM Serial Port Cable....................................................................................................................14-12
14.4.2 Serial 14/F1/F&f Serial Port Cable................................................................................................14-14
14.4.3 RS232/RS-422 Serial Port Cable.....................................................................................................14-15
14.4.4 Ordinary Telephone Wire.................................................................................................................14-17
14.4.5 COA Concatenating Cable...............................................................................................................14-18
14.4.6 Straight Through Cable....................................................................................................................14-19
14.4.7 Crossover Cable...............................................................................................................................14-20
14.5 Signal Cable..............................................................................................................................................14-21
14.5.1 75-ohm 8 x E1 Cable........................................................................................................................14-22
14.5.2 75-ohm 16 x E1 Cable......................................................................................................................14-23
14.5.3 120-ohm 8 x E1 Cable......................................................................................................................14-26
14.5.4 120-ohm 16 x E1 Cable....................................................................................................................14-28
14.5.5 E3/T3/STM-1 Cable.........................................................................................................................14-30
14.5.6 Framed E1 Cable..............................................................................................................................14-31
14.5.7 N x 64 kbit/s Cables.........................................................................................................................14-31
14.6 Clock Cable...............................................................................................................................................14-48
14.6.1 Clock Cable......................................................................................................................................14-48
14.6.2 One-Channel and Two-Channel Clock Transfer Cables..................................................................14-50

A Equipment and Board Alarm Indicators.............................................................................A-1

A.1 Indicators on the Cabinet...............................................................................................................................A-2
A.2 Board Alarm Indicator...................................................................................................................................A-2

B Labels..........................................................................................................................................B-1
B.1 Safety Label...................................................................................................................................................B-2
B.1.1 Label Description..................................................................................................................................B-2
B.1.2 Label Position.......................................................................................................................................B-3
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B.2 Optical Module Labels...................................................................................................................................B-5

B.3 Engineering Labels........................................................................................................................................B-7

C Power Consumption and Weight..........................................................................................C-1

D Board Version Configuration................................................................................................D-1
E Board Loopbacks.......................................................................................................................E-1
F Board Configuration Reference..............................................................................................F-1
F.1 SDH Processing Boards..................................................................................................................................F-2
F.2 PDH Processing Board...................................................................................................................................F-2
F.3 Data Processing Board....................................................................................................................................F-4
F.3.1 SDH Parameters.....................................................................................................................................F-5
F.3.2 Ethernet Parameters...............................................................................................................................F-6
F.3.3 ATM Parameter.....................................................................................................................................F-7
F.4 Cross-Connect and Timing Unit.....................................................................................................................F-8

G Glossary.....................................................................................................................................G-1
H Acronyms and Abbreviations...............................................................................................H-1
Index.................................................................................................................................................i-1

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Figures

Figures
Figure 1-1 Appearance of the OptiX OSN 1500A...............................................................................................1-1
Figure 1-2 Appearance of the OptiX OSN 1500B...............................................................................................1-1
Figure 2-1 ETSI cabinet.......................................................................................................................................2-2
Figure 2-2 Appearance of the DC PDU...............................................................................................................2-4
Figure 3-1 Structure of the OptiX OSN 1500A subrack......................................................................................3-2
Figure 3-2 Structure of the OptiX OSN 1500B subrack......................................................................................3-3
Figure 3-3 Slot access capacity of the OptiX OSN 1500A..................................................................................3-4
Figure 3-4 Slot access capacity of the OptiX OSN 1500B..................................................................................3-4
Figure 3-5 Slot layout of the OptiX OSN 1500A subrack...................................................................................3-5
Figure 3-6 Slot layout of the OptiX OSN 1500A subrack after the division of slots..........................................3-5
Figure 3-7 Slot access capacity of the OptiX OSN 1500A..................................................................................3-5
Figure 3-8 Slot layout of the OptiX OSN 1500B subrack...................................................................................3-6
Figure 3-9 Slot access capacity of the OptiX OSN 1500B..................................................................................3-6
Figure 3-10 Slot layout of the OptiX OSN 1500B subrack (after the division of slots)......................................3-6
Figure 3-11 Access capacity of the OptiX OSN 1500B subrack (after the division of slots)..............................3-7
Figure 4-1 Barcode of a board..............................................................................................................................4-3
Figure 5-1 Block diagram for the working principle of the SL1..........................................................................5-5
Figure 5-2 Front panel of the N1SL1/N2SL1......................................................................................................5-7
Figure 5-3 Front panel of the R1SL1...................................................................................................................5-8
Figure 5-4 Block diagram for the working principle of the SLQ1.....................................................................5-13
Figure 5-5 Front panel of the N1SLQ1/N2SLQ1...............................................................................................5-15
Figure 5-6 Front panel of the R1SLQ1.............................................................................................................. 5-16
Figure 5-7 Block diagram for the working principle of the SLO1.....................................................................5-21
Figure 5-8 Front panel of the SLO1...................................................................................................................5-23
Figure 5-9 Block diagram for the working principle of the SLT1.....................................................................5-28
Figure 5-10 Front panel of the SLT1..................................................................................................................5-30
Figure 5-11 Block diagram for the working principle of the SEP1................................................................... 5-35
Figure 5-12 Block diagram for the working principle of the SEP used with the EU08.....................................5-35
Figure 5-13 Block diagram for the working principle of the SEP used with the OU08.................................... 5-36
Figure 5-14 Front panel of the SEP1..................................................................................................................5-38
Figure 5-15 Principle of the TPS protection for the SEP1 ................................................................................5-39
Figure 5-16 Slot configuration for the 1:1 TPS protection for the SEP1...........................................................5-40
Figure 5-17 Block diagram for the working principle of the SL4......................................................................5-44
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Figures

Figure 5-18 Front panel of the N1SL4/N2SL4.................................................................................................. 5-46

Figure 5-19 Front panel of the R1SL4...............................................................................................................5-46
Figure 5-20 Block diagram for the working principle of the SLD4...................................................................5-52
Figure 5-21 Front panel of the N1SLD4/N2SLD4.............................................................................................5-54
Figure 5-22 Front panel of the R1SLD4............................................................................................................5-54
Figure 5-23 Block diagram for the working principle of the SLQ4...................................................................5-60
Figure 5-24 Front panel of the SLQ4.................................................................................................................5-62
Figure 5-25 Block diagram for the working principle of the SL16....................................................................5-67
Figure 5-26 Front panel of the SL16..................................................................................................................5-69
Figure 5-27 Block diagram for the working principle of the N1SL16A and N2SL16A....................................5-75
Figure 5-28 Block diagram for the working principle of the N3SL16A............................................................5-76
Figure 5-29 Front panel of the SL16A...............................................................................................................5-78
Figure 5-30 Block diagram for the working principle of the SF16....................................................................5-83
Figure 5-31 Front panel of the SF16..................................................................................................................5-85
Figure 6-1 Block diagram for the functions of the PL1.......................................................................................6-4
Figure 6-2 Block diagram of the E1 mapping/demapping...................................................................................6-5
Figure 6-3 Front panel of the PL1........................................................................................................................6-6
Figure 6-4 Block diagram for the functions of the PD1.....................................................................................6-11
Figure 6-5 Block diagram of the E1 mapping/ demapping ...............................................................................6-11
Figure 6-6 Front panel of the PD1......................................................................................................................6-13
Figure 6-7 Principle of the TPS protection for the PD1 in the OptiX OSN 1500A subrack..............................6-15
Figure 6-8 Principle of the TPS protection for the PD1 in the OptiX OSN 1500B subrack..............................6-16
Figure 6-9 Slot configuration for the 1:1 TPS protection for the PD1 in the OptiX OSN 1500A subrack........6-16
Figure 6-10 Block diagram for the functions of the PQ1...................................................................................6-20
Figure 6-11 Block diagram of the E1/T1 mapping/ demapping ........................................................................6-21
Figure 6-12 Front panel of the PQ1....................................................................................................................6-23
Figure 6-13 Principle of the TPS protection for the PQ1 in the OptiX OSN 1500B subrack............................6-25
Figure 6-14 Slot configuration for 1:2 TPS protection of the PQ1....................................................................6-26
Figure 6-15 Block diagram for the functions of the PQM.................................................................................6-28
Figure 6-16 Block diagram of the E1/T1 mapping/ demapping ........................................................................6-29
Figure 6-17 Front panel of the PQM..................................................................................................................6-31
Figure 6-18 Principle of the TPS protection for the PQM in the OptiX OSN 1500B subrack..........................6-33
Figure 6-19 Slot configuration for the 1:2 TPS protection for the PQM in the OptiX OSN 1500B subrack....6-34
Figure 6-20 Block diagram for the functions of the PL3...................................................................................6-37
Figure 6-21 Block diagram of the E3/T3 mapping/demapping .........................................................................6-37
Figure 6-22 Front panel of the PL3....................................................................................................................6-39
Figure 6-23 Principle of the TPS protection for the PL3 in the OptiX OSN 1500B subrack............................6-41
Figure 6-24 Slot configuration for the 1:1 TPS protection for the PL3 in the OptiX OSN 1500B subrack......6-42
Figure 6-25 Block diagram for the functions of the PL3A................................................................................6-45
Figure 6-26 Block diagram of the E3/T3 mapping/demapping .........................................................................6-45
Figure 6-27 Front panel of the PL3A.................................................................................................................6-47
Figure 6-28 Block diagram for the functions of the PD3...................................................................................6-51
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Figure 6-29 Block diagram of the E3/T3 mapping/demapping .........................................................................6-52

Figure 6-30 Front panel of the PD3....................................................................................................................6-54
Figure 6-31 Principle of the TPS protection for the PD3 in the OptiX OSN 1500B subrack............................6-55
Figure 6-32 Slot configuration for the 1:1 TPS protection for the PD3 in the OptiX OSN 1500B subrack......6-56
Figure 6-33 Block diagram for the functions of the PQ3...................................................................................6-59
Figure 6-34 Block diagram of the E3/T3 mapping/demapping .........................................................................6-59
Figure 6-35 Front panel of the PQ3....................................................................................................................6-61
Figure 6-36 Principle of the TPS protection for the PQ3 in the OptiX OSN 1500B subrack............................6-62
Figure 6-37 Slot configuration for the 1:1 TPS protection for the PQ3 in the OptiX OSN 1500B subrack......6-63
Figure 6-38 Block diagram for the functions of the DX1..................................................................................6-66
Figure 6-39 Front panel of the DX1...................................................................................................................6-67
Figure 6-40 Principle of the TPS protection for the DX1 in the OptiX OSN 1500B subrack...........................6-69
Figure 6-41 Slot configuration for the 1:2 TPS protection for the DX1 in the OptiX OSN 1500B subrack
.............................................................................................................................................................................6-70
Figure 6-42 Block diagram for the functions of the DXA................................................................................. 6-72
Figure 6-43 Front panel of the DXA..................................................................................................................6-74
Figure 6-44 Block diagram for the functions of the SPQ4.................................................................................6-77
Figure 6-45 Block diagram of the 140M mapping/demapping .........................................................................6-78
Figure 6-46 Block diagram of the SDH overhead processing module...............................................................6-78
Figure 6-47 Front panel of the SPQ4................................................................................................................. 6-81
Figure 6-48 Principle of the TPS protection for the SPQ4 in the OptiX OSN 1500B subrack......................... 6-82
Figure 6-49 Slot configuration for the 1:1 TPS protection for the SPQ4...........................................................6-83
Figure 7-1 Block diagram for the functions of the EFT4.....................................................................................7-5
Figure 7-2 Front panel of the EFT4......................................................................................................................7-7
Figure 7-3 Block diagram for the functions of the EFT8...................................................................................7-11
Figure 7-4 Front panel of the EFT8....................................................................................................................7-13
Figure 7-5 Block diagram for the functions of the EFT8A................................................................................7-18
Figure 7-6 Front panel of the EFT8A.................................................................................................................7-20
Figure 7-7 Block diagram for the functions of the EGT2..................................................................................7-24
Figure 7-8 Front panel of the EGT2...................................................................................................................7-26
Figure 7-9 Block diagram for the functions of the EFS0...................................................................................7-33
Figure 7-10 Front panel of the EFS0..................................................................................................................7-35
Figure 7-11 Slot configuration for the 1:1 TPS protection for the EFS0 in the OptiX OSN 1500B subrack
.............................................................................................................................................................................7-37
Figure 7-12 Block diagram for the functions of the EFS4.................................................................................7-41
Figure 7-13 Front panel of the EFS4..................................................................................................................7-43
Figure 7-14 Block diagram for the functions of the EGS2................................................................................ 7-49
Figure 7-15 Front panel of the EGS2.................................................................................................................7-52
Figure 7-16 Block diagram for the functions of the EMS4................................................................................7-58
Figure 7-17 Front panel of the EMS4................................................................................................................ 7-61
Figure 7-18 Normal working of the EMS4........................................................................................................7-63
Figure 7-19 Principle of the BPS protection for the EMS4............................................................................... 7-64
Figure 7-20 Principle of the PPS protection for the EMS4................................................................................7-65
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Figure 7-21 Block diagram for the functions of the EGS4................................................................................7-70

Figure 7-22 Front panel of the EGS4.................................................................................................................7-73
Figure 7-23 Normal working of the EGS4.........................................................................................................7-75
Figure 7-24 Principle of the BPS protection for the EGS4................................................................................7-76
Figure 7-25 Principle of the PPS protection for the EGS4.................................................................................7-77
Figure 7-26 Block diagram for the functions of the EGR2................................................................................7-82
Figure 7-27 Front panel of the EGR2.................................................................................................................7-85
Figure 7-28 Block diagram for the functions of the EMR0...............................................................................7-92
Figure 7-29 Front panel of the N1EMR0...........................................................................................................7-95
Figure 7-30 Front panel of the N2EMR0...........................................................................................................7-96
Figure 7-31 Block diagram for the functions of the ADL4..............................................................................7-101
Figure 7-32 Front panel of the ADL4..............................................................................................................7-103
Figure 7-33 Block diagram for the functions of the ADQ1.............................................................................7-108
Figure 7-34 Front panel of the ADQ1..............................................................................................................7-110
Figure 7-35 Block diagram for the functions of the IDL4...............................................................................7-115
Figure 7-36 Front panel of the IDL4................................................................................................................7-117
Figure 7-37 Block diagram for the functions of the IDQ1...............................................................................7-123
Figure 7-38 Front panel of the IDQ1................................................................................................................7-125
Figure 7-39 Block diagram for the functions of the MST4..............................................................................7-130
Figure 7-40 Front panel of the MST4..............................................................................................................7-132
Figure 8-1 Block diagram for the functions of the L12S.....................................................................................8-3
Figure 8-2 Front panel of the L12S......................................................................................................................8-4
Figure 8-3 Block diagram for the functions of the D12B....................................................................................8-6
Figure 8-4 Front panel of the D12B.....................................................................................................................8-7
Figure 8-5 Block diagram for the functions of the D12S...................................................................................8-10
Figure 8-6 Front panel of the D12S....................................................................................................................8-11
Figure 8-7 Block diagram for the functions of the L75S...................................................................................8-14
Figure 8-8 Front panel of the L75S....................................................................................................................8-15
Figure 8-9 Block diagram for the functions of the D75S...................................................................................8-17
Figure 8-10 Front panel of the D75S..................................................................................................................8-18
Figure 8-11 Block diagram for the functions of the D34S.................................................................................8-21
Figure 8-12 Front panel of the D34S..................................................................................................................8-22
Figure 8-13 Block diagram for the functions of the C34S.................................................................................8-24
Figure 8-14 Front panel of the C34S..................................................................................................................8-25
Figure 8-15 Block diagram for the functions of the EU04.................................................................................8-28
Figure 8-16 Front panel of the EU04.................................................................................................................8-29
Figure 8-17 Block diagram for the functions of the EU08.................................................................................8-31
Figure 8-18 Front panel of the EU08.................................................................................................................8-32
Figure 8-19 Block diagram for the functions of the OU08................................................................................8-35
Figure 8-20 Front panel of the N1OU08............................................................................................................8-36
Figure 8-21 Front panel of the N2OU08............................................................................................................8-37
Figure 8-22 Block diagram for the functions of the MU04................................................................................8-40
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Figure 8-23 Front panel of the MU04................................................................................................................8-41

Figure 8-24 Block diagram for the functions of the TSB8.................................................................................8-43
Figure 8-25 Front panel of the TSB8.................................................................................................................8-44
Figure 8-26 Block diagram for the functions of the EFF8.................................................................................8-47
Figure 8-27 Front panel of the EFF8..................................................................................................................8-48
Figure 8-28 Block diagram for the functions of the ETF8.................................................................................8-52
Figure 8-29 Front panel of the ETF8..................................................................................................................8-53
Figure 8-30 Block diagram for the functions of the ETS8.................................................................................8-57
Figure 8-31 Front panel of the ETS8..................................................................................................................8-58
Figure 8-32 Block diagram for the functions of the DM12................................................................................8-61
Figure 8-33 Front panel of the DM12................................................................................................................8-62
Figure 9-1 Block diagram for the functions of the CXL1....................................................................................9-6
Figure 9-2 Block diagram of higher and lower order cross-connect modules....................................................9-9
Figure 9-3 Front panel of the CXL1...................................................................................................................9-10
Figure 9-4 Block diagram for the functions of the CXL4..................................................................................9-17
Figure 9-5 Block diagram of higher and lower order cross-connect modules..................................................9-20
Figure 9-6 Front panel of the CXL4...................................................................................................................9-21
Figure 9-7 Block diagram for the functions of the CXL16................................................................................9-28
Figure 9-8 Block diagram of higher and lower order cross-connect modules..................................................9-31
Figure 9-9 Front panel of the CXL16.................................................................................................................9-32
Figure 10-1 Block diagram for the functions of the EOW.................................................................................10-3
Figure 10-2 Front panel of the EOW..................................................................................................................10-4
Figure 10-3 Block diagram for the functions of the R1AUX.............................................................................10-8
Figure 10-4 Block diagram for the functions of the R2AUX.............................................................................10-9
Figure 10-5 Position of J9 on the AUX............................................................................................................10-11
Figure 10-6 Front panel of the AUX................................................................................................................10-12
Figure 10-7 Block diagram for the functions of the AMU...............................................................................10-16
Figure 10-8 Positions of orderwire bytes in the SDH frame............................................................................10-17
Figure 10-9 Front panel of the AMU...............................................................................................................10-18
Figure 10-10 Connection of the cabinet alarm indicators................................................................................10-20
Figure 10-11 Block diagram for the functions of the FAN..............................................................................10-22
Figure 10-12 Front panel of the FAN...............................................................................................................10-23
Figure 11-1 Block diagram for the functions of the CMR2...............................................................................11-4
Figure 11-2 Front panel of the CMR2................................................................................................................11-6
Figure 11-3 Block diagram for the functions of the CMR4.............................................................................11-10
Figure 11-4 Front panel of the CMR4..............................................................................................................11-12
Figure 11-5 Block diagram for the functions of the MR2................................................................................11-17
Figure 11-6 Front panel of the MR2................................................................................................................11-18
Figure 11-7 MR2A used as the OTM station...................................................................................................11-22
Figure 11-8 MR2A and LWX used as the two-channel wavelength adding/dropping OADM station...........11-22
Figure 11-9 Block diagram for the functions of the MR2A.............................................................................11-23
Figure 11-10 Front panel of the MR2A............................................................................................................11-24
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Figure 11-11 MR2B used as the OTM station.................................................................................................11-27

Figure 11-12 MR2B and LWX used as the two-channel wavelength adding/dropping OADM station......... 11-28
Figure 11-13 Block diagram for the functions of the MR2B...........................................................................11-28
Figure 11-14 Front panel of the MR2B............................................................................................................11-29
Figure 11-15 MR2C used as the OTM station.................................................................................................11-32
Figure 11-16 Two-channel wavelength adding/dropping OADM station realized by the MR2C and LWX
...........................................................................................................................................................................11-33
Figure 11-17 Block diagram for the functions of the MR2C...........................................................................11-33
Figure 11-18 Front panel of the MR2C............................................................................................................11-35
Figure 11-19 Block diagram for the functions of the MR4..............................................................................11-38
Figure 11-20 Front panel of the MR4.............................................................................................................. 11-40
Figure 11-21 Block diagram for the functions of the LWX.............................................................................11-45
Figure 11-22 Front panel of the LWX..............................................................................................................11-47
Figure 11-23 Block diagram for the functions of the OBU1............................................................................11-53
Figure 11-24 Front panel of the OBU1............................................................................................................11-54
Figure 11-25 Location of the FIB in the optical transmission system............................................................. 11-57
Figure 11-26 Block diagram for the working principle of the FIB..................................................................11-58
Figure 11-27 Front panel of the FIB................................................................................................................ 11-59
Figure 12-1 Location of the BA in the optical transmission system..................................................................12-2
Figure 12-2 Block diagram for the functions of the BA2..................................................................................12-4
Figure 12-3 Front panel of the BA2...................................................................................................................12-6
Figure 12-4 Location of the BA and PA in the optical transmission system.....................................................12-9
Figure 12-5 Block diagram for the working principle of the BPA...................................................................12-10
Figure 12-6 Front panel of the BPA.................................................................................................................12-12
Figure 12-7 Appearance of the case-shaped 61COA and N1COA (PA)......................................................... 12-16
Figure 12-8 Appearance of the case-shaped 62COA.......................................................................................12-17
Figure 12-9 Application of the optical Raman amplifier (62COA).................................................................12-17
Figure 12-10 Block diagram for the functions of the 61COA and N1COA.................................................... 12-18
Figure 12-11 Front panel of the 61COA and N1COA.....................................................................................12-20
Figure 12-12 Front panel of the 62COA..........................................................................................................12-20
Figure 12-13 SC/PC fiber connector................................................................................................................12-21
Figure 12-14 E2000 flange and fiber connector...............................................................................................12-21
Figure 12-15 Position of the 61COA in the ETSI cabinet............................................................................... 12-24
Figure 13-1 Appearance of the power supply case............................................................................................13-2
Figure 13-2 Rear view of the UPM....................................................................................................................13-4
Figure 13-3 Block diagram for the functions of the PIU....................................................................................13-9
Figure 13-4 Front panel of the PIU..................................................................................................................13-10
Figure 13-5 Block diagram for the functions of the PIUA...............................................................................13-12
Figure 13-6 Front panel of the PIUA............................................................................................................... 13-13
Figure 14-1 LC/PC optical connector................................................................................................................14-3
Figure 14-2 SC/PC optical connector.................................................................................................................14-4
Figure 14-3 FC/PC optical connector.................................................................................................................14-4
Figure 14-4 E2000/APC optical connector........................................................................................................14-5
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Figures

Figure 14-5 Cabinet 48 V power cable and BGND power grounding cable....................................................14-6
Figure 14-6 Cabinet PGND protection grounding cable (JG2)..........................................................................14-6
Figure 14-7 Cabinet PGND protection grounding cable (OT)...........................................................................14-6
Figure 14-8 Structure of the equipment 48 V/60 V Power Cable..................................................................14-8
Figure 14-9 PGND power cable.........................................................................................................................14-8
Figure 14-10 Structure of the UPM power cable...............................................................................................14-9
Figure 14-11 Structure of the alarm input/output cable...................................................................................14-11
Figure 14-12 Structure of the OAM serial port cable.......................................................................................14-13
Figure 14-13 Structure of the Serial 14/F1/F&f serial port cable..................................................................14-14
Figure 14-14 Structure of the RS232/RS-422 serial port cable........................................................................14-16
Figure 14-15 Structure of the ordinary telephone wire....................................................................................14-17
Figure 14-16 Structure of the COA concatenating cable.................................................................................14-18
Figure 14-17 Structure of the straight through cable........................................................................................14-19
Figure 14-18 Structure of the crossover cable..................................................................................................14-20
Figure 14-19 Structure of the 75-ohm 8 x E1 cable.........................................................................................14-22
Figure 14-20 Structure of the 75-ohm 16 x E1 cable.......................................................................................14-24
Figure 14-21 Structure of the 120-ohm 8 x E1 cable.......................................................................................14-26
Figure 14-22 Structure of the 120-ohm 16 x E1 cable.....................................................................................14-28
Figure 14-23 Structure of the E3/T3/STM-1 cable..........................................................................................14-30
Figure 14-24 Structure of the V.35 DCE cable................................................................................................14-33
Figure 14-25 Structure of the V.35 DTE cable................................................................................................14-35
Figure 14-26 Structure of the V.24 DCE cable................................................................................................14-36
Figure 14-27 Structure of the V.24 DTE cable................................................................................................14-38
Figure 14-28 Structure of the X.21 DCE cable................................................................................................14-39
Figure 14-29 Structure of the X.21 DTE cable................................................................................................14-40
Figure 14-30 Structure of the RS449 DCE cable.............................................................................................14-42
Figure 14-31 Structure of the RS449 DTE cable.............................................................................................14-43
Figure 14-32 Structure of the RS530 DCE cable.............................................................................................14-45
Figure 14-33 Structure of the RS530 DTE cable.............................................................................................14-47
Figure 14-34 Structure of the 75-ohm clock cable...........................................................................................14-49
Figure 14-35 Structure of the 120-ohm 8 x E1 cable.......................................................................................14-49
Figure 14-36 Structure of the one-channel clock transfer cable (75 ohms to 120 ohms)................................14-50
Figure 14-37 Structure of the two-channel clock transfer cable (75 ohms to 120 ohms)................................14-50
Figure B-1 Labels on the OptiX OSN 1500B subrack........................................................................................B-4
Figure B-2 Labels on the OptiX OSN 1500A subrack........................................................................................B-4
Figure B-3 Labels on a board..............................................................................................................................B-5
Figure B-4 Optical module labels........................................................................................................................B-5

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Tables
Table 2-1 Indicators on the ETSI cabinet.............................................................................................................2-3
Table 2-2 Connection of power terminals at side A and side B...........................................................................2-4
Table 2-3 Technical specifications of the ETSI cabinet.......................................................................................2-5
Table 3-1 Mapping relation between slots for interface boards and slots for processing boards of the OptiX OSN
1500A....................................................................................................................................................................3-7
Table 3-2 Mapping relation between slots for interface boards and slots for processing boards of the OptiX OSN
1500B....................................................................................................................................................................3-7
Table 3-3 Boards and their valid slots for the OptiX OSN 1500A.......................................................................3-8
Table 3-4 Boards and their valid slots for the OptiX OSN 1500B.....................................................................3-12
Table 3-5 Technical specifications of the OptiX OSN 1500A subrack..............................................................3-17
Table 3-6 Maximum power consumption of the OptiX OSN 1500A subrack...................................................3-17
Table 3-7 Technical specifications of the OptiX OSN 1500B subrack..............................................................3-18
Table 3-8 Maximum power consumption of the OptiX OSN 1500B subrack...................................................3-18
Table 4-1 Appearance and dimensions of boards for the OptiX OSN 1500........................................................4-2
Table 4-2 SDH processing boards for the OptiX OSN 1500A.............................................................................4-4
Table 4-3 SDH processing boards for the OptiX OSN 1500B.............................................................................4-5
Table 4-4 PDH processing boards for the OptiX OSN 1500A.............................................................................4-7
Table 4-5 PDH processing boards for the OptiX OSN 1500B.............................................................................4-7
Table 4-6 Data processing boards for the OptiX OSN 1500A.............................................................................4-8
Table 4-7 Data processing boards for the OptiX OSN 1500B.............................................................................4-8
Table 4-8 Interface boards and switching boards supported by the OptiX OSN 1500A.....................................4-9
Table 4-9 Interface boards and switching boards supported by the OptiX OSN 1500B......................................4-9
Table 4-10 Cross-connect boards and SCC boards supported by the OptiX OSN 1500A and the OptiX OSN 1500B
.............................................................................................................................................................................4-10
Table 4-11 Auxiliary boards supported by the OptiX OSN 1500A and the OptiX OSN 1500B......................4-10
Table 4-12 Optical add/drop multiplexing boards supported by the OptiX OSN 1500A..................................4-11
Table 4-13 Optical add/drop multiplexing boards supported by the OptiX OSN 1500B..................................4-11
Table 4-14 Optical amplifier boards and dispersion compensation boards supported by the OptiX OSN 1500A/B
.............................................................................................................................................................................4-12
Table 5-1 Version Description of the SL1............................................................................................................5-3
Table 5-2 Functions and features of the SL1........................................................................................................5-4
Table 5-3 Optical interfaces of the SL1................................................................................................................5-8
Table 5-4 Relation between the board feature code and the optical interface type..............................................5-9
Table 5-5 Specifications of the optical interfaces of the SL1.............................................................................5-10
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Table 5-6 Version Description of the SLQ1.......................................................................................................5-12
Table 5-7 Functions and features of the SLQ1...................................................................................................5-12
Table 5-8 Optical interfaces of the SLQ1...........................................................................................................5-16
Table 5-9 Relation between the board feature code and the optical interface type............................................5-17
Table 5-10 Specifications of the optical interfaces of the SLQ1........................................................................5-18
Table 5-11 Functions and features of the SLO1 board.......................................................................................5-20
Table 5-12 Optical interfaces of the SLO1.........................................................................................................5-23
Table 5-13 Relation between the board feature code and the optical interface type..........................................5-24
Table 5-14 Specifications of the optical interfaces of the SLO1........................................................................5-25
Table 5-15 Functions and features of the SLT1.................................................................................................5-26
Table 5-16 Optical interfaces of the SLT1.........................................................................................................5-30
Table 5-17 Specifications of the optical interfaces of the SLT1........................................................................5-31
Table 5-18 Functions and features of the SEP1.................................................................................................5-33
Table 5-19 Access capabilities for the SEP1......................................................................................................5-34
Table 5-20 Electrical interfaces of the SEP1......................................................................................................5-39
Table 5-21 Slots for the SEP1, EU08 and TSB8................................................................................................5-40
Table 5-22 Technical specifications of the SEP1 board.....................................................................................5-41
Table 5-23 Version Description of the SL4........................................................................................................5-42
Table 5-24 Functions and features of the SL4....................................................................................................5-42
Table 5-25 Optical interfaces of the SL4............................................................................................................5-47
Table 5-26 Relation between the board feature code and the optical interface type of the SL4........................5-47
Table 5-27 Specifications of the optical interfaces of the SL4...........................................................................5-48
Table 5-28 Version Description of the SLD4.....................................................................................................5-50
Table 5-29 Functions and features of the SLD4.................................................................................................5-50
Table 5-30 Optical interfaces of the SLD4.........................................................................................................5-55
Table 5-31 Relation between the board feature code and the optical interface type of the SLD4.....................5-56
Table 5-32 Specifications of the optical interfaces of the SLD4........................................................................5-56
Table 5-33 Version Description of the SLQ4.....................................................................................................5-58
Table 5-34 Functions and features of the SLQ4.................................................................................................5-59
Table 5-35 Optical interfaces of the SLQ4.........................................................................................................5-62
Table 5-36 Relation between the board feature code and the optical interface type of the SLQ4.....................5-63
Table 5-37 Specifications of the optical interfaces of the SLQ4........................................................................5-64
Table 5-38 Version Description of the SL16......................................................................................................5-65
Table 5-39 Functions and features of the SL16..................................................................................................5-66
Table 5-40 Optical interfaces of the SL16..........................................................................................................5-70
Table 5-41 Relation between the board feature code and the optical interface type for the SL16.....................5-70
Table 5-42 Specifications of the optical interfaces of the SL16.........................................................................5-71
Table 5-43 Specifications of the ITU-T G.692-compliant optical interfaces that output standard wavelengths
.............................................................................................................................................................................5-72
Table 5-44 Version Description of the SL16A...................................................................................................5-73
Table 5-45 Functions and features of the SL16A...............................................................................................5-74
Table 5-46 Optical interfaces of the SL16A.......................................................................................................5-78
Table 5-47 Relation between the board feature code and the optical interface type..........................................5-79

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Table 5-48 Specifications of the optical interfaces of the SL16A......................................................................5-79

Table 5-49 Functions and features of the SF16..................................................................................................5-81
Table 5-50 Optical interfaces of the SF16..........................................................................................................5-86
Table 5-51 Specifications of the optical interfaces of the SF16.........................................................................5-87
Table 5-52 Specifications of the ITU-T G.692-compliant optical interfaces that output standard wavelengths
.............................................................................................................................................................................5-87
Table 6-1 Functions and features of the PL1........................................................................................................6-3
Table 6-2 Interfaces on the front panel of the PL1...............................................................................................6-7
Table 6-3 Relation between the board feature code and the optical interface type of the PL1............................6-7
Table 6-4 Specifications of the electrical interfaces of the PL1...........................................................................6-8
Table 6-5 Version Description of the PD1...........................................................................................................6-9
Table 6-6 Functions and features of the PD1.......................................................................................................6-9
Table 6-7 Valid slots for the PD1 and corresponding slots for the L75S and L12S in the OptiX OSN 1500A subrack
.............................................................................................................................................................................6-14
Table 6-8 Valid slots for the PD1 and corresponding slots for the D75S and D12S in the OptiX OSN 1500B subrack
.............................................................................................................................................................................6-14
Table 6-9 Relation between the board feature code and the interface impedance type.....................................6-15
Table 6-10 Slot configuration for the 1:2 TPS protection for the PD1 in the OptiX OSN 1500B subrack.......6-17
Table 6-11 Version Description of the PQ1.......................................................................................................6-18
Table 6-12 Functions and features of the PQ1...................................................................................................6-19
Table 6-13 Valid slots for the PQ1 and corresponding slots for the D75S, D12S or D12B in the OptiX OSN 1500B
subrack................................................................................................................................................................6-24
Table 6-14 Relation between the board feature code and the interface impedance type...................................6-24
Table 6-15 Slot configuration for the 1:2 TPS protection for the PQ1 in the OptiX OSN 1500B subrack.......6-25
Table 6-16 Functions and features of the PQM..................................................................................................6-27
Table 6-17 Valid slots for the PQM and corresponding slots for the D12S and D12B in the OptiX OSN 1500B
subrack................................................................................................................................................................6-32
Table 6-18 Slot configuration for the 1:2 TPS protection for the PQM in the OptiX OSN 1500B subrack
.............................................................................................................................................................................6-33
Table 6-19 Version description of the PL3........................................................................................................6-35
Table 6-20 Functions and features of the PL3....................................................................................................6-36
Table 6-21 Valid slots for the PL3 and corresponding slots for the C34S in the OptiX OSN 1500B subrack
.............................................................................................................................................................................6-40
Table 6-22 Slot configuration for the 1:1 TPS protection for the PL3 in the OptiX OSN 1500B subrack........6-41
Table 6-23 Slots for the PL3, C34S and TSB8 in the OptiX OSN 1500B subrack...........................................6-42
Table 6-24 Version description of the PL3A......................................................................................................6-44
Table 6-25 Functions and features of the PL3A.................................................................................................6-44
Table 6-26 Specifications of the electrical interfaces of the PL3A....................................................................6-48
Table 6-27 Version Description of the PD3.......................................................................................................6-50
Table 6-28 Functions and features of the PD3...................................................................................................6-50
Table 6-29 Valid slots for the PD3 and corresponding slots for the D34S in the OptiX OSN 1500B subrack
.............................................................................................................................................................................6-55
Table 6-30 Slot configuration for the 1:1 TPS protection for the PD3 in the OptiX OSN 1500B subrack.......6-56
Table 6-31 Slots for the PD3, D34S and TSB8 in the OptiX OSN 1500B subrack...........................................6-56
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Table 6-32 Functions and features of the PQ3...................................................................................................6-58
Table 6-33 Valid slots for the PQ3 and corresponding slots for the D34S in the OptiX OSN 1500B subrack
.............................................................................................................................................................................6-62
Table 6-34 Slot configuration for the 1:1 TPS protection for the PQ3 in the OptiX OSN 1500B subrack.......6-63
Table 6-35 Slots for the PQ3, D34S and TSB8 in the OptiX OSN 1500B subrack...........................................6-63
Table 6-36 Functions and features of the DX1...................................................................................................6-65
Table 6-37 Valid slots for the DX1 and corresponding slots for the DM12 in the OptiX OSN 1500B subrack
.............................................................................................................................................................................6-68
Table 6-38 Relation between the board feature code and the interface impedance type...................................6-69
Table 6-39 Slots for the DX1 and DM12 in the OptiX OSN 1500B subrack....................................................6-70
Table 6-40 Functions and features of the DXA..................................................................................................6-72
Table 6-41 Version Description of the SPQ4.....................................................................................................6-76
Table 6-42 Functions and features of the SPQ4.................................................................................................6-76
Table 6-43 Valid slots for the SPQ4 and corresponding slots for the MU04 in the OptiX OSN 1500B subrack
.............................................................................................................................................................................6-82
Table 6-44 Slots for the SPQ4, MU04 and TSB8 in the OptiX OSN 1500B subrack.......................................6-83
Table 7-1 Functions and features of the EFT4.....................................................................................................7-3
Table 7-2 Optical interfaces of the EFT4.............................................................................................................7-7
Table 7-3 Pins of the RJ-45 of the EFT4..............................................................................................................7-8
Table 7-4 Functions and features of the EFT8.....................................................................................................7-9
Table 7-5 Optical interfaces of the EFT8...........................................................................................................7-14
Table 7-6 Pins of the RJ-45 of the EFT8............................................................................................................7-14
Table 7-7 Valid slots for the EFT8 and corresponding slots for the ETF8 and EFF8 in the OptiX OSN 1500A
.............................................................................................................................................................................7-15
Table 7-8 Valid slots for the EFT8 and corresponding slots for the ETF8 and EFF8 in the OptiX OSN 1500B
.............................................................................................................................................................................7-15
Table 7-9 Functions and features of the EFT8A................................................................................................7-16
Table 7-10 Optical interfaces of the EFT8A......................................................................................................7-21
Table 7-11 Pins of the RJ-45 of the EFT8A.......................................................................................................7-21
Table 7-12 Functions and features of the EGT2.................................................................................................7-23
Table 7-13 Optical interfaces of the EGT2.........................................................................................................7-27
Table 7-14 Relation between the board feature code and the optical interface type..........................................7-27
Table 7-15 Specifications of the optical interfaces of the EGT2........................................................................7-28
Table 7-16 Version Description of the EFS0.....................................................................................................7-30
Table 7-17 Functions and features of the EFS0.................................................................................................7-30
Table 7-18 Valid slots for the EFS0 and corresponding slots for the ETF8 and EFF8 in the OptiX OSN 1500B
subrack................................................................................................................................................................7-36
Table 7-19 Version Description of the EFS4.....................................................................................................7-38
Table 7-20 Functions and features of the EFS4.................................................................................................7-39
Table 7-21 Optical interfaces of the EFS4.........................................................................................................7-44
Table 7-22 Pins of the RJ-45 of the EFS4..........................................................................................................7-44
Table 7-23 Version Description of the EGS2.....................................................................................................7-46
Table 7-24 Functions and features of the EGS2.................................................................................................7-47
Table 7-25 Optical interfaces of the EGS2.........................................................................................................7-53

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Table 7-26 Relation between the board feature code and the optical interface type..........................................7-53
Table 7-27 Specifications of the optical interfaces of the EGS2........................................................................7-54
Table 7-28 Functions and features of the EMS4................................................................................................7-55
Table 7-29 Optical interfaces of the EMS4........................................................................................................7-62
Table 7-30 Valid slots for the EMS4 and corresponding slots for the ETF8 and EFF8 in the OptiX OSN 1500A
subrack................................................................................................................................................................7-62
Table 7-31 Valid slots for the EMS4 and corresponding slots for the ETF8 and EFF8 in the OptiX OSN 1500B
subrack................................................................................................................................................................7-62
Table 7-32 Relation between the board feature code and the optical interface type..........................................7-63
Table 7-33 Specifications of the optical interfaces of the EMS4.......................................................................7-66
Table 7-34 Functions and features of the EGS4.................................................................................................7-68
Table 7-35 Optical interfaces of the EGS4.........................................................................................................7-74
Table 7-36 Relation between the board feature code and the optical interface type..........................................7-74
Table 7-37 Specifications of the optical interfaces of the EGS4........................................................................7-78
Table 7-38 Functions and features of the EGR2................................................................................................7-79
Table 7-39 Optical interfaces of the EGR2 .......................................................................................................7-86
Table 7-40 Relation between the board feature code and the optical interface type..........................................7-86
Table 7-41 Specifications of the interfaces of the EGR2...................................................................................7-87
Table 7-42 Version description of the EMR0....................................................................................................7-88
Table 7-43 Comparison of features of the N1EMR0 and N2EMR0..................................................................7-88
Table 7-44 Functions and features of the EMR0................................................................................................7-89
Table 7-45 Optical interfaces of the EMR0 .......................................................................................................7-97
Table 7-46 Valid slots for the EMR0 and corresponding slots for the ETF8 and EFF8 in the OptiX OSN 1500A
subrack................................................................................................................................................................7-97
Table 7-47 Valid slots for the EMR0 and corresponding slots for the ETF8 and EFF8 in the OptiX OSN 1500B
subrack................................................................................................................................................................7-97
Table 7-48 Relation between the board feature code and the optical interface type..........................................7-98
Table 7-49 Specifications of the optical interfaces of the EMR0.......................................................................7-98
Table 7-50 Functions and features of the ADL4..............................................................................................7-100
Table 7-51 Optical interface of the ADL4 .......................................................................................................7-104
Table 7-52 Relation between the board feature code and the optical interface type........................................7-104
Table 7-53 Specifications of the optical interfaces of the ADL4.....................................................................7-105
Table 7-54 Functions and features of the ADQ1..............................................................................................7-107
Table 7-55 Optical interfaces of the ADQ1 .....................................................................................................7-111
Table 7-56 Relation between the board feature code and the optical interface type........................................7-111
Table 7-57 Specifications of the optical interfaces of the ADQ1.....................................................................7-112
Table 7-58 Functions and features of the IDL4................................................................................................7-114
Table 7-59 Optical interface of the IDL4 ........................................................................................................7-118
Table 7-60 Relation between the board feature code and the optical interface type........................................7-118
Table 7-61 Specifications of the optical interfaces of the IDL4.......................................................................7-119
Table 7-62 Functions and features of the IDQ1...............................................................................................7-121
Table 7-63 Optical interfaces of the IDQ1 ......................................................................................................7-126
Table 7-64 Relation between the board feature code and the optical interface type........................................7-126
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Table 7-65 Specifications of the optical interfaces of the IDQ1......................................................................7-127
Table 7-66 Functions and features of the MST4..............................................................................................7-129
Table 7-67 Services and service rates provided by the MST4.........................................................................7-129
Table 7-68 Optical interfaces of the MST4......................................................................................................7-133
Table 7-69 Relation between the board feature code and service type............................................................7-133
Table 7-70 Specifications of the optical interfaces of the MST4.....................................................................7-134
Table 8-1 Valid slots for the PD1 and corresponding slots for the L12S in the OptiX OSN 1500A subrack
...............................................................................................................................................................................8-5
Table 8-2 Interfaces on the front panel of the D12B............................................................................................8-7
Table 8-3 Pins of the DB44 interfaces of the D12B.............................................................................................8-8
Table 8-4 Valid slots for the PQ1/PQM and corresponding slots for the D12B in the OptiX OSN 1500B subrack
...............................................................................................................................................................................8-8
Table 8-5 Interfaces on the front panel of the D12S..........................................................................................8-11
Table 8-6 Pins of the DB44 interfaces of the D12S...........................................................................................8-12
Table 8-7 Valid slots for the PQ1/PQM and corresponding slots for the D12S in the OptiX OSN 1500B subrack
.............................................................................................................................................................................8-12
Table 8-8 Valid slots for the PD1 and corresponding slots for the L75S...........................................................8-15
Table 8-9 Interfaces on the front panel of the D75S..........................................................................................8-18
Table 8-10 Pins of the DB44 interfaces of the D75S.........................................................................................8-19
Table 8-11 Valid slots for the PQ1/PQM and corresponding slots for the D75S in the OptiX OSN 1500B subrack
.............................................................................................................................................................................8-19
Table 8-12 Interfaces of the D34S......................................................................................................................8-22
Table 8-13 Valid slots for the PD3 and corresponding slots for the D34S in the OptiX OSN 1500B subrack
.............................................................................................................................................................................8-23
Table 8-14 Specifications of the electrical interfaces of the D34S....................................................................8-23
Table 8-15 Interfaces of the C34S......................................................................................................................8-26
Table 8-16 Valid slots for the PL3 and corresponding slots for the C34S in the OptiX OSN 1500B subrack
.............................................................................................................................................................................8-26
Table 8-17 Specifications of the electrical interfaces of the C34S.....................................................................8-26
Table 8-18 Interfaces of the EU04.....................................................................................................................8-29
Table 8-19 Valid slots for the SEP and corresponding slots for the EU04........................................................8-30
Table 8-20 Specifications of the electrical interfaces of the EU04....................................................................8-30
Table 8-21 Interfaces of the EU08.....................................................................................................................8-33
Table 8-22 Valid slots for the SEP and corresponding slots for the EU08........................................................8-33
Table 8-23 Specifications of the electrical interfaces of the EU08....................................................................8-33
Table 8-24 Version description of the OU08.....................................................................................................8-34
Table 8-25 Interfaces of the N1OU08................................................................................................................8-37
Table 8-26 Interfaces of the N2OU08................................................................................................................8-38
Table 8-27 Valid slots for the SEP and corresponding slots for the OU08........................................................8-38
Table 8-28 Specifications of the optical interfaces of the OU08........................................................................8-38
Table 8-29 Interfaces of the MU04....................................................................................................................8-41
Table 8-30 Valid slots for the SPQ4 and corresponding slots for the MU04.....................................................8-42
Table 8-31 Specifications of the electrical interfaces of the MU04...................................................................8-42
Table 8-32 Valid slots for the TSB8 and corresponding slots for the SPQ4 and MU04....................................8-45

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Table 8-33 Valid slots for the TSB8 and corresponding slots for the PD3 and D34S.......................................8-45
Table 8-34 Valid slots for the TSB8 and corresponding slots for the SEP and EU04.......................................8-45
Table 8-35 Valid slots for the TSB8 and corresponding slots for the SEP and EU08.......................................8-45
Table 8-36 Valid slots for the TSB8 and corresponding slots for the EFS0 and ETS8.....................................8-46
Table 8-37 Valid slots for the TSB8 and corresponding slots for the PL3 and C34S........................................8-46
Table 8-38 Interfaces of the EFF8......................................................................................................................8-49
Table 8-39 Valid slots for the EFT8 and corresponding slots for the EFF8......................................................8-49
Table 8-40 Valid slots for the EFS0 and corresponding slots for the EFF8.......................................................8-49
Table 8-41 Valid slots for the EMS4 and corresponding slots for the EFF8.....................................................8-49
Table 8-42 Valid slots for the EMR0 and corresponding slots for the EFF8.....................................................8-50
Table 8-43 Specifications of the optical interfaces of the EFF8........................................................................8-50
Table 8-44 Interfaces of the ETF8......................................................................................................................8-53
Table 8-45 Pins of the RJ-45 connector of the ETF8.........................................................................................8-54
Table 8-46 Valid slots for the EFT8 and corresponding slots for the ETF8......................................................8-54
Table 8-47 Valid slots for the EFS0 and corresponding slots for the ETF8......................................................8-55
Table 8-48 Valid slots for the EMS4 and corresponding slots for the ETF8.....................................................8-55
Table 8-49 Valid slots for the EMR0 and corresponding slots for the ETF8.....................................................8-55
Table 8-50 Specifications of the electrical interfaces of the ETF8....................................................................8-55
Table 8-51 Interfaces of the ETS8......................................................................................................................8-58
Table 8-52 Pins of the RJ-45 connector of the ETS8.........................................................................................8-59
Table 8-53 Valid slots for the EFS0 and corresponding slots for the ETS8......................................................8-59
Table 8-54 Specifications of the electrical interfaces of the ETS8....................................................................8-59
Table 8-55 Interfaces on the front panel of the DM12.......................................................................................8-62
Table 8-56 Pins of the DB44 interfaces of the DM12........................................................................................8-63
Table 8-57 Pins of the DB28 interfaces of the DM12........................................................................................8-64
Table 8-58 Valid slots for the DX1 and corresponding slots for the DM12......................................................8-64
Table 9-1 Function and feature of the SDH processing unit of the CXL1...........................................................9-3
Table 9-2 Function and feature of the SCC unit of the CXL1.............................................................................9-3
Table 9-3 Function and feature of the cross-connect unit of the CXL1...............................................................9-4
Table 9-4 Function and feature of the clock unit of the CXL1............................................................................9-5
Table 9-5 Optical interface and switches on the CXL1......................................................................................9-11
Table 9-6 Relation between the board feature code and the optical interface type............................................9-11
Table 9-7 Logical slots displayed on the T2000 for the CXL1..........................................................................9-12
Table 9-8 Specifications of the optical interfaces of the CXL1.........................................................................9-12
Table 9-9 Function and feature of the SDH processing unit of the CXL4.........................................................9-14
Table 9-10 Function and feature of the SCC unit of the CXL4.........................................................................9-15
Table 9-11 Function and feature of the cross-connect unit of the CXL4...........................................................9-16
Table 9-12 Function and feature of the clock unit of the CXL4........................................................................9-16
Table 9-13 Optical interface and switches on the CXL4....................................................................................9-22
Table 9-14 Relation between the board feature code and the optical interface type..........................................9-22
Table 9-15 Logical slots displayed on the T2000 for the CXL4........................................................................9-23
Table 9-16 Specifications of the optical interfaces of the CXL4.......................................................................9-23
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Table 9-17 Function and feature of the SDH processing unit of the CXL16.....................................................9-25
Table 9-18 Function and feature of the SCC unit of the CXL16.......................................................................9-26
Table 9-19 Function and feature of the cross-connect unit of the CXL16.........................................................9-27
Table 9-20 Function and feature of the clock unit of the CXL16......................................................................9-27
Table 9-21 Optical interface and switches on the CXL16..................................................................................9-33
Table 9-22 Relation between the board feature code and the optical interface type..........................................9-33
Table 9-23 Logical slots displayed on the T2000 for the CXL16......................................................................9-34
Table 9-24 Specifications of the optical interfaces of the CXL16.....................................................................9-34
Table 10-1 Functions and features of the EOW.................................................................................................10-2
Table 10-2 Interfaces on the front panel of the EOW........................................................................................10-4
Table 10-3 Pins of the PHONE interface of the EOW.......................................................................................10-5
Table 10-4 Pins of the S1, S2, S3 and S4 interfaces of the EOW......................................................................10-5
Table 10-5 Functions and features of the AUX..................................................................................................10-7
Table 10-6 Interfaces on the front panel of the AUX.......................................................................................10-12
Table 10-7 Pins of the CLK interface of the AUX...........................................................................................10-13
Table 10-8 Pins of the ETH and COM interfaces of the AUX.........................................................................10-13
Table 10-9 Pins of the ALM interface of the AUX..........................................................................................10-13
Table 10-10 Pins of the OAM interface of the AUX.......................................................................................10-14
Table 10-11 Pins of the F&f interface of the AUX..........................................................................................10-14
Table 10-12 Functions and features of the AMU.............................................................................................10-16
Table 10-13 Interfaces on the front panel of the AMU....................................................................................10-18
Table 10-14 Pins of the PHONE interface of the AMU...................................................................................10-19
Table 10-15 Pins of the S1 and S2 interfaces of the AMU..............................................................................10-19
Table 10-16 Pins of the LAMP1 and LAMP2 interfaces of the AMU.............................................................10-19
Table 10-17 Functions and features of the FAN..............................................................................................10-21
Table 11-1 Functions and features of the CMR2...............................................................................................11-3
Table 11-2 Optical interfaces of the CMR2.......................................................................................................11-7
Table 11-3 Feature code of the CMR2...............................................................................................................11-7
Table 11-4 Specifications of the optical interfaces of the CMR2......................................................................11-8
Table 11-5 Functions and features of the CMR4.............................................................................................11-10
Table 11-6 Optical interfaces of the CMR4.....................................................................................................11-13
Table 11-7 Feature code of the CMR4.............................................................................................................11-13
Table 11-8 Specifications of the optical interfaces of the CMR4....................................................................11-14
Table 11-9 Functions and features of the MR2................................................................................................11-16
Table 11-10 Optical interfaces of the MR2......................................................................................................11-19
Table 11-11 Feature code of the MR2..............................................................................................................11-19
Table 11-12 Specifications of the optical interfaces of the MR2.....................................................................11-20
Table 11-13 Functions and features of the MR2A...........................................................................................11-22
Table 11-14 Optical interfaces of the MR2A...................................................................................................11-25
Table 11-15 Specifications of the optical interfaces of the MR2A..................................................................11-25
Table 11-16 Functions and features of the MR2B...........................................................................................11-27
Table 11-17 Optical interfaces of the MR2B...................................................................................................11-30

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Table 11-18 Specifications of the optical interfaces of the MR2B..................................................................11-30

Table 11-19 Functions and features of the MR2C...........................................................................................11-32
Table 11-20 Optical interfaces of the MR2C...................................................................................................11-35
Table 11-21 Specifications of the optical interfaces of the MR2C..................................................................11-36
Table 11-22 Functions and features of the MR4..............................................................................................11-37
Table 11-23 Optical interfaces of the MR4......................................................................................................11-41
Table 11-24 Board feature code.......................................................................................................................11-41
Table 11-25 Specifications of the optical interfaces of the MR4.....................................................................11-42
Table 11-26 Functions and features of the LWX.............................................................................................11-44
Table 11-27 Optical interfaces on the front panel of the LWX........................................................................11-48
Table 11-28 Relation between the board feature code and the receive/transmit scheme.................................11-48
Table 11-29 Specifications of the client-side optical interfaces of the LWX...................................................11-48
Table 11-30 Specifications of the WDM-side optical interfaces of the LWX.................................................11-49
Table 11-31 Functions and features of the OBU1............................................................................................11-52
Table 11-32 Optical interfaces of the OBU1....................................................................................................11-55
Table 11-33 Feature code of the OBU1............................................................................................................11-55
Table 11-34 Specifications of optical interfaces of the OBU1.........................................................................11-56
Table 11-35 Functions and features of the FIB................................................................................................11-58
Table 11-36 Optical interfaces of the FIB .......................................................................................................11-59
Table 11-37 Specifications of the optical interfaces of the FIB.......................................................................11-60
Table 12-1 Functions and features of the BA2...................................................................................................12-3
Table 12-2 Optical interfaces of the BA2 ..........................................................................................................12-7
Table 12-3 Relation between the board feature code and output optical power for the BA2............................12-7
Table 12-4 Specifications of the optical interfaces of the BA2..........................................................................12-8
Table 12-5 Functions and features of the BPA...................................................................................................12-9
Table 12-6 Optical interfaces of the BPA .......................................................................................................12-13
Table 12-7 Relation between the board feature code and output optical power for the BPA..........................12-13
Table 12-8 Specifications of the optical interfaces of the BPA........................................................................12-14
Table 12-9 Version Description of the COA....................................................................................................12-15
Table 12-10 Functions and features of the 61COA and N1COA.....................................................................12-16
Table 12-11 Functions and features of the 62COA..........................................................................................12-18
Table 12-12 Pins of the RS232 interface..........................................................................................................12-22
Table 12-13 Pins of the MONITOR-1 and MONITOR-2 interfaces...............................................................12-22
Table 12-14 Pins of the RJ-45 connector of the 62COA..................................................................................12-23
Table 12-15 Relation between the board feature code and output optical power for the 61COA...................12-24
Table 12-16 Specifications of the optical interfaces of the COA.....................................................................12-24
Table 13-1 Functions and features of the UPM..................................................................................................13-3
Table 13-2 Interfaces on the rear panel of the UPM..........................................................................................13-5
Table 13-3 Pins of the RS232 interface of the UPM..........................................................................................13-5
Table 13-4 Specifications of the power supply of the UPM..............................................................................13-6
Table 13-5 Functions and features of the PIU....................................................................................................13-8
Table 13-6 Interfaces on the front panel of the PIU.........................................................................................13-10
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Table 13-7 Functions and features of the PIUA...............................................................................................13-12
Table 13-8 Interfaces and switch on the front panel of the PIUA....................................................................13-14
Table 14-1 Types of fiber jumpers.....................................................................................................................14-2
Table 14-2 Types of connectors.........................................................................................................................14-3
Table 14-3 Equipment 48 V/60 V power cable..............................................................................................14-8
Table 14-4 Connection of the UPM power cable...............................................................................................14-9
Table 14-5 Specifications of the UPM power cable.........................................................................................14-10
Table 14-6 Pin assignment of the alarm input/output cable.............................................................................14-11
Table 14-7 Pin assignment of the OAM serial port cable................................................................................14-13
Table 14-8 Pin assignment of the Serial 14/F1/F&f serial port cable............................................................14-15
Table 14-9 Pin assignment of the RS232/RS-422 serial port cable.................................................................14-16
Table 14-10 Pin assignment of the ordinary telephone wire............................................................................14-17
Table 14-11 Pin assignment of the COA concatenating cable.........................................................................14-18
Table 14-12 Pin assignment of the straight through cable...............................................................................14-19
Table 14-13 Pin assignment of the crossover cable.........................................................................................14-20
Table 14-14 Pin assignment of the 75-ohm 8 x E1 cable.................................................................................14-22
Table 14-15 Pin assignment of the 75-ohm 16 x E1 cable...............................................................................14-24
Table 14-16 Pin assignment of the 120-ohm E1 cable.....................................................................................14-27
Table 14-17 Pin assignment of the 120-ohm 16 x E1 cable.............................................................................14-28
Table 14-18 Pin assignment of the DB28 connector of the DM12..................................................................14-31
Table 14-19 Pin assignment of the V.35 DCE cable........................................................................................14-33
Table 14-20 Pin assignment of the V.35 DTE cable........................................................................................14-35
Table 14-21 Pin assignment of the V.24 DCE cable........................................................................................14-36
Table 14-22 Technical specifications of the V.24 DCE cable..........................................................................14-37
Table 14-23 Pin assignment of the V.24 DTE cable........................................................................................14-38
Table 14-24 Technical specifications of the V.24 DTE cable..........................................................................14-38
Table 14-25 Pin assignment of the X.21 DCE cable........................................................................................14-39
Table 14-26 Technical specifications of the X.21 DCE cable..........................................................................14-40
Table 14-27 Pin assignment of the X.21 DTE cable........................................................................................14-41
Table 14-28 Technical specifications of the X.12 DTE cable..........................................................................14-41
Table 14-29 Pin assignment of the RS449 DCE cable.....................................................................................14-42
Table 14-30 Specifications of the RS449 DCE cable.......................................................................................14-43
Table 14-31 Pin assignment of the RS449 DTE cable.....................................................................................14-43
Table 14-32 Specifications of the RS449 DTE cable.......................................................................................14-44
Table 14-33 Pin assignment of the RS530 DCE cable.....................................................................................14-45
Table 14-34 Specifications of the RS530 DCE cable.......................................................................................14-46
Table 14-35 Pin assignment of the RS530 DTE cable.....................................................................................14-47
Table 14-36 Specifications of the RS530 DTE cable.......................................................................................14-48
Table 14-37 Pin assignment of the 120-ohm clock cable.................................................................................14-49
Table 14-38 Pin assignment of the two-channel clock transfer cable (75 ohms to 120 ohms)........................14-51
Table B-1 Labels on the equipment.....................................................................................................................B-2
Table B-2 Optical module code and type mapping table.....................................................................................B-5

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Table B-3 Huawei specifications for engineering labels.....................................................................................B-7

Table C-1 Power consumption and weight of each board for the OptiX OSN 1500..........................................C-1
Table D-1 Board versions that are compatible with the OptiX OSN products....................................................D-1
Table E-1 Loopbacks of the SDH boards for the OptiX OSN equipment...........................................................E-1
Table E-2 Loopbacks of the PDH boards for the OptiX OSN equipment...........................................................E-2
Table E-3 Loopbacks of the Ethernet boards for the OptiX OSN equipment.....................................................E-3
Table E-4 Loopbacks of the Ethernet boards for the OptiX OSN equipment.....................................................E-4
Table F-1 Mapping relation between the service type and setting of the C2.......................................................F-2
Table F-2 Mapping relation between the service type and setting of the C2.......................................................F-3
Table F-3 Mapping relation between the service type and setting of the V5.......................................................F-3
Table F-4 Mapping relation between the service type and setting of the V5.......................................................F-6

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Hardware Description

About This Document

About This Document

Overview
This document describes the equipment structure, subrack structure and board classification.
This document also describes each board of different classes in details.
This document helps you get the detailed information on the equipment hardware.

Product Versions
The following table lists the product versions related to this document.
Product Name

Version

OptiX OSN 1500

V100R007

OptiX iManager T2000

V200R005C01

Intended Audience
The intended audience of this document are:
l

Network planners and designers

Installation personnel

Commissioning engineers

Network monitors

Data configuration engineers

Maintenance engineers

On-site maintenance engineers

Organization
This document describes the cabinet, subrack, boards and each unit of the boards in terms of the
function and working principle.
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About This Document

Chapter

Description

1 Equipment Structure

This chapter describes the structure of the equipment.

2 Cabinet

This chapter describes the dimensions, appearance and

technical specifications of the cabinet. This chapter also
describes the configuration of the equipment in each
cabinet.

3 Subrack

This chapter describes the structure of the subrack.

4 Board List and

Classification

This chapter describes the classification of boards and

appearance of the boards.

5 SDH Processing Boards

This chapter describes the SDH processing boards in terms

of the function, principle, front panel, interface and
technical specifications.

6 PDH Processing Boards

This chapter describes the PDH processing boards in terms

of the function, principle, front panel, interface and
technical specifications.

7 Data Processing Boards

This chapter describes the data processing boards in terms

of the function, principle, front panel, interface and
technical specifications.

8 Interface Boards and

Switching Boards

This chapter describes the interface boards and switching

boards in terms of the function, principle, front panel,
interface and technical specifications.

9 Cross-Connect and System

Control Boards

This chapter describes the cross-connect and system control

boards in terms of the function, principle, front panel,
interface and technical specifications.

10 Auxiliary Boards

This chapter describes the auxiliary boards in terms of the

function, principle, front panel, interface and technical
specifications.

11 WDM Processing Boards

This chapter describes the WDM processing boards in

terms of the function, principle, front panel, interface and
technical specifications.

12 Optical Amplifier Boards

and Dispersion
Compensation Boards

This chapter describes the optical amplifier boards and

dispersion compensation boards in terms of the function,
principle, front panel, interface and technical
specifications.

13 Power Interface Boards

This chapter describes the power interface boards in terms

of the function, principle, front panel, interface and
technical specifications.

14 Cables

This chapter describes the external cables and internal

cables in terms of the structure, appearance, pin assignment
and technical specifications.

A Equipment and Board

Alarm Indicators

This appendix describes the indication of the equipment and

board alarm indicators.

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About This Document

Chapter

Description

B Labels

This appendix describes the safety labels, optical module

labels and engineering labels.

C Power Consumption and

Weight

This appendix describes the power consumption and weight

of each board.

D Board Version
Configuration

This appendix describes the compatibility among the

product versions.

E Board Loopbacks

This appendix describes the loopback capabilities of the

boards.

F Board Configuration
Reference

This appendix describes the parameters that can be

configured by using the T2000.

G Glossary

This appendix lists the terms used in this document.

H Acronyms and
Abbreviations

This appendix lists the acronyms and abbreviations used in

this document.

Conventions
Symbol Conventions
The following symbols may be found in this document. They are defined as follows.
Symbol

Description
Indicates a hazard with a high level of risk which, if not
avoided, will result in death or serious injury.

DANGER

WARNING

CAUTION

Indicates a hazard with a medium or low level of risk which,

if not avoided, could result in minor or moderate injury.
Indicates a potentially hazardous situation that, if not
avoided, could cause equipment damage, data loss, and
performance degradation, or unexpected results.

TIP

Indicates a tip that may help you solve a problem or save

you time.

NOTE

Provides additional information to emphasize or

supplement important points of the main text.

General Conventions

Issue 02 (2007-09-10)

Convention

Description

Times New Roman

Normal paragraphs are in Times New Roman.

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Hardware Description

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Convention

Description

Boldface

Names of files, directories, folders, and users are in boldface. For

example, log in as user root.

Italic

Book titles are in italics.

Courier New

Terminal display is in Courier New.

Command Conventions
Convention

Description

Boldface

The keywords of a command line are in boldface.

Italic

Command arguments are in italic.

[]

Items (keywords or arguments) in square brackets [ ] are optional.

{ x | y | ... }

Alternative items are grouped in braces and separated by vertical bars.

One is selected.

[ x | y | ... ]

Optional alternative items are grouped in square brackets and

separated by vertical bars. One or none is selected.

{ x | y | ... } *

Alternative items are grouped in braces and separated by vertical bars.

A minimum of one or a maximum of all can be selected.

GUI Conventions
Convention

Description

Boldface

Buttons, menus, parameters, tabs, window, and dialog titles are in

boldface. For example, click OK.

>

Multi-level menus are in boldface and separated by the > signs. For
example, choose File > Create > Folder.

Keyboard Operation

Format

Description

Key

Press the key. For example, press Enter and press Tab.

Key 1+Key 2

Press the keys concurrently. For example, pressing Ctrl+Alt+A means

the three keys should be pressed concurrently.

Key 1, Key 2

Press the keys in turn. For example, pressing Alt, A means the two keys
should be pressed in turn.

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Hardware Description

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Mouse Operation
Action

Description

Click

Select and release the primary mouse button without moving the pointer.

Double-click

Press the primary mouse button twice continuously and quickly without
moving the pointer.

Drag

Press and hold the primary mouse button and move the pointer to a certain
position.

Update History
Updates between document versions are cumulative. Therefore, the latest document version
contains all updates made to previous versions.

Updates in Issue 02 (2007-09-10) Based on Product Version V100R007

The updated contents are as follows.
This release of the document fixes several bugs, adds product labels, and checks the parameters
of the dimensions and weight. It also details function block diagram and relative description for
each board.

Updates in Issue 01 (2007-06-15) Based on Product Version V100R007

This document of the V100R007 version is of the first release. Compared with the V100R006,
this version has the following new or optimized content:
l

The N3SL16, N3SL16A, N2PQ3, N2PD3, N2PL3, N2PL3A, TN11OBU1, TN11MR2,

TN11MR4, TN11CMR2, TN11CMR4 are added.

Appendix E "Board Loopbacks" and Appendix F "Board Configuration Reference" are

added.

The structure of the board description is adjusted and optimized. First the board version is
described, and then the board function and feature, working principle and signal flow, front
panel, valid slots, board feature code, board configuration reference, technical
specifications and so on are described.

Updates in Issue 03 (2007-03-30) Based on Product Version V100R006

The updated contents are as follows.
This release of the document fixes several bugs, adds product labels. It also checks the parameters
of the slots and optical interfaces. In addition, it adds the description on the N1SL64 board.

Updates in Issue 02 (2007-01-10) Based on Product Version V100R006

The updated contents are as follows.
This release of the document fixes several bugs in the document of previous version. The T2000
is upgraded from V200R003C02 to V200R004C01.
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Updates in Issue 01 (2006-09-20) Based on Product Version V100R006

This document of the V100R006 version is of the first release.

Updates in Issue 03 (2006-11-20) Based on Product Version V100R005

The updated contents are as follows.
With updated naming of versions, this release of the document fixes several bugs in the manual
of the previous version.

Updates in Issue 02 (2006-06-20) Based on Product Version V100R005

The former manual version is T2-042521-20060620-C-1.51.
The updated contents are as follows.
This release of the document fixes several bugs in the manual of the previous version.

Updates in Issue 01 (2006-03-20) Based on Product Version V100R005

The former manual version is T2-042521-20060320-C-1.50.
This document of the V100R005 version is of the first release.

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1 Equipment Structure

Equipment Structure

The OptiX OSN 1500A and the OptiX OSN 1500B are both case-shaped equipment. The OptiX
OSN 1500A/B subrack can be installed in a 300-mm or 600-mm ETSI cabinet, or a 19-inch
cabinet. The OptiX OSN 1500A/B can also be installed against the wall. The OptiX OSN 1500A
can be installed on the desk.
Figure 1-1 shows the appearance of the OptiX OSN 1500A.
Figure 1-1 Appearance of the OptiX OSN 1500A

Figure 1-2 shows the appearance of the OptiX OSN 1500B.

Figure 1-2 Appearance of the OptiX OSN 1500B

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2 Cabinet

Cabinet

About This Chapter

The OptiX OSN subracks are installed in the cabinets.
2.1 Cabinet Type
The OptiX OSN 1500 subrack can be installed in a 300-mm or 600-mm ETSI cabinet, 19-inch
cabinet or the cabinet used for the access network equipment. The OptiX OSN 1500 subrack
can be installed against the wall.
2.2 Cabinet Configuration
On the top of the ETSI cabinet, there are cabinet indicators and a DC power distribution unit
(PDU).
2.3 Technical Specifications
The specifications of the cabinet cover the dimensions, weight and number of allowed subracks.

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2.1 Cabinet Type

The OptiX OSN 1500 subrack can be installed in a 300-mm or 600-mm ETSI cabinet, 19-inch
cabinet or the cabinet used for the access network equipment. The OptiX OSN 1500 subrack
can be installed against the wall.
The OptiX OSN 1500 can be installed in the following cabinets:
l

300-mm deep ETSI cabinet

600-mm deep ETSI cabinet

19-inch cabinet

Cabinet used for the access network equipment

2.2 Cabinet Configuration

On the top of the ETSI cabinet, there are cabinet indicators and a DC power distribution unit
(PDU).
Figure 2-1 shows where the cabinet indicators and the DC PDU are on the cabinet.
Figure 2-1 ETSI cabinet
1
2
PowerCritical MajorMinor

Power distribution unit

H
W

1. Cabinet indicator

2. DC PDU

2.2.1 Cabinet Indicator

The indicators on the ETSI cabinet are power supply indicators and alarm severity indicators.
2.2.2 DC PDU
The DC PDU is on the top of the cabinet and used to supply power for the equipment.
2.2.3 Other Configuration
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The external case-shaped devices can be installed in the cabinet as required.

2.2.1 Cabinet Indicator

The indicators on the ETSI cabinet are power supply indicators and alarm severity indicators.
Table 2-1 lists the information about the indicators on the ETSI cabinet.
Table 2-1 Indicators on the ETSI cabinet
Indicator

State

Indication

Normal power supply indicator: Power

(green)

Lit

The power is supplied

to the equipment.

Unlit

No power is supplied to
the equipment.

Lit

Critical alarms are

generated in the
equipment.

Unlit

No critical alarms are

generated in the
equipment.

Lit

Major alarms are

generated in the
equipment.

Unlit

No major alarms are

generated in the
equipment.

Lit

Minor alarms are

generated in the
equipment.

Unlit

No minor alarms are

generated in the
equipment.

Critical alarm indicator: Critical (red)

Major alarm indicator: Major (orange)

Minor alarm indicator: Minor (yellow)

CAUTION
The cabinet indicators are driven by the subrack. The cabinet indicators can be lit only after the
cables are correctly connected and the subrack is powered on.

2.2.2 DC PDU
The DC PDU is on the top of the cabinet and used to supply power for the equipment.
Figure 2-2 shows the appearance of the DC PDU.
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Figure 2-2 Appearance of the DC PDU

3
2
OUTPUT

2 3 4 5

ON

3
2
OUTPUT

ON
RTN1(+) RTN2(+) NEG1(-) NEG2(-)

OFF
32A

32A

20A

INPUT

OFF
32A

20A

1. Power terminal (A)

2. Power cable RTN1 (+)

3. Power cable RTN2 (+)

4. Power cable NEG1 ()

5. Power cable NEG2 ()

6. Power terminal (B)

7. PGND

8. Power switch

32A

20A

20A

For the OptiX OSN 1500A, the power terminals at side A and side B supply power to the PIU
boards at side A and side B of the subrack respectively. Table 2-2 shows the connections of the
power terminals at side A and side B.
For the OptiX OSN 1500B, the power terminals at sides A and B supply power to the PIU boards
at the upper and lower subrack respectively.
Table 2-2 Connection of power terminals at side A and side B
Power
Terminal at
Side A

Corresponding Subrack
and PIU Board

Power
Terminal
at Side B

Corresponding Subrack
and PIU Board

The PIU board at side A of

the first subrack

The PIU board at side B of

the first subrack

The PIU board at side A of

the second subrack

The PIU board at side B of

the second subrack

The PIU board at side A of

the third subrack

The PIU board at side B of

the third subrack

The PIU board at side A of

the fourth subrack

The PIU board at side B of

the fourth subrack

2.2.3 Other Configuration

The external case-shaped devices can be installed in the cabinet as required.
l

UPM

The UPM numbered GIE4805S can directly supply power to the OptiX OSN 1500. The UPM
directly converts the 220 V mains supply to the 48 V DC power supply required by the
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communication equipment. If operators cannot provide the 48 V DC power supply for the
equipment or require that the battery be used, the UPM can be applied.
l

COA

Fiber management spool, which is used to spool the redundant fibers inside the cabinet.

2.3 Technical Specifications

The specifications of the cabinet cover the dimensions, weight and number of allowed subracks.
Table 2-3 lists the technical specifications of the ETSI cabinet.
Table 2-3 Technical specifications of the ETSI cabinet

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Dimensions (mm)

Weight (kg)

Number of Allowed OptiX

OSN 1500A/1500B Subracks

600 (W) x 300 (D) x 2000 (H)

55

600 (W) x 600 (D) x 2000 (H)

79

600 (W) x 300 (D) x 2200 (H)

60

The number of allowed OptiX

OSN 1500A/1500B subracks
varies with the cabinet capacity
and the number of the power
supplies.

600 (W) x 600 (D) x 2200 (H)

84

600 (W) x 300 (D) x 2600 (H)

70

600 (W) x 600 (D) x 2600 (H)

94

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3 Subrack

Subrack

About This Chapter

This chapter describes the cabinet in terms of the structure, capacity, slot allocation and technical
specifications.
3.1 Structure
The OptiX OSN 1500A subrack is of a one-layer structure. The subrack consists of the slot area
for boards, power supply area, fan area and fiber routing area. The OptiX OSN 1500B subrack
is of a two-layer structure. The subrack consists of the slot area for processing boards, slot area
for interface boards, slot area for the auxiliary interface board, power supply area and fan area.
3.2 Capacity
Both the OptiX OSN 1500A and the OptiX OSN 1500B have slots that can be divided into halfwidth slots. These slots have different service access capacities before and after the slot division.
3.3 Slot Allocation
The OptiX OSN 1500A subrack has only one tier, where 12 slots are present before the division
of slots. The OptiX OSN 1500B subrack has two tiers. The upper tier of the subrack, where four
slots are present, is the slot area for interface boards. The lower tier of the subrack, where ten
slots are present before the division of slots (including slots 4 and 5), is the slot area for processing
boards.
3.4 Technical Specifications
The specifications of the subrack cover dimensions, weight and maximum power consumption.

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3 Subrack

3.1 Structure
The OptiX OSN 1500A subrack is of a one-layer structure. The subrack consists of the slot area
for boards, power supply area, fan area and fiber routing area. The OptiX OSN 1500B subrack
is of a two-layer structure. The subrack consists of the slot area for processing boards, slot area
for interface boards, slot area for the auxiliary interface board, power supply area and fan area.
Figure 3-1 shows the structure of the OptiX OSN 1500A subrack.
Figure 3-1 Structure of the OptiX OSN 1500A subrack

3
4

W
6

1. Fan area

2. Slot area for boards

3. Power supply area

4. Slot area for interface boards

5. Fiber routing area

6. Mounting ear

The functions of these areas are as follows:

l

Slot area for boards: This area is used to house the boards for the OptiX OSN 1500A.

Fan area: This area is used to house one fan module, which dissipates heat generated by
the equipment.

Power supply area: This area is used to house two PIU boards, which are used to supply
power for the equipment.

Fiber routing area: This area is used to route fibers and cables in the subrack.

Figure 3-2 shows the structure of the OptiX OSN 1500B subrack.

3-2

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Figure 3-2 Structure of the OptiX OSN 1500B subrack

4
4

H
W

1. Slot area for interface boards

2. Power supply area

3. Fan area

4. Slot area for processing boards

5. Slot area for the auxiliary interface board

6. Fiber routing area

7. Mounting ear

The functions of these areas are as follows:

l

Slot area for interface boards: This area is used to house the tributary interface boards and
Ethernet interface boards for the OptiX OSN 1500B.

Slot area for processing boards: This area is used to house the line, tributary and Ethernet
processing boards for the OptiX OSN 1500B.

Fan area: This area is used to house one fan module, which dissipates heat generated by
the equipment.

Slot area for the auxiliary interface board: This area is used to house the auxiliary interface
board, which provides alarm interfaces, orderwire phone interface, management and
maintenance interface, and clock interface.

Power supply area: This area is used to house two PIU boards, which are used to supply
power for the equipment.

Fiber routing area: This area is used to route fibers and cables in the subrack.

3.2 Capacity
Both the OptiX OSN 1500A and the OptiX OSN 1500B have slots that can be divided into halfwidth slots. These slots have different service access capacities before and after the slot division.
In the OptiX OSN 1500A subrack, slots 12 and 13 can be divided into half-width slots. In the
OptiX OSN 1500B subrack, slots 1113 can be divided into half-width slots. Figure 3-3 shows
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the slot access capacity of the OptiX OSN 1500A. Figure 3-4 shows the slot access capacity of
the OptiX OSN 1500B.
In the OptiX OSN 1500A subrack, slots 12 and 13 can be divided into half-width slots.
l

When slot 12 is divided, the two half-width slots are numbered slot 2 and slot 12.

When slot 13 is divided, the two half-width slots are numbered slot 3 and slot 13.

When slots 12 and 13 are not divided, the access capacity of each slot is 2.5 Gbit/s.

When slots 12 and 13 are divided, the access capacity of each half-width slot is 1.25 Gbit/
s.

In the OptiX OSN 1500B subrack, slots 1113 can be divided into half-width slots.
l

When slot 11 is divided, the two half-width slots are numbered slot 1 and slot 11.

When slot 12 is divided, the two half-width slots are numbered slot 2 and slot 12.

When slot 13 is divided, the two half-width slots are numbered slot 3 and slot 13.

When slots 1113 are not divided, the access capacity of each slot is 2.5 Gbit/s.

When slots 1113 are divided, the access capacity of each half-width slot is 1.25 Gbit/s.

Figure 3-3 Slot access capacity of the OptiX OSN 1500A

Slot
XCS1A PIU

Slot20
FAN

Slot 11 PIU

XCS B
Slot 6 1.25Gbit/s

Slot 2/12

2.5Gbit/s

Slot 7 1.25Gbit/s

Slot 3/13

2.5Gbit/s

Slot 8 1.25Gbit/s

Slot 4

2.5Gbit/s

Slot 9 1.25Gbit/s

Slot 5

2.5Gbit/s

Slot 10

AUX

Figure 3-4 Slot access capacity of the OptiX OSN 1500B

Slot 14

Slot 18

PIU

Slot 19

PIU

Slot 15
Slot 16
Slot 17

Slot 20
FAN

Slot 1/11

2.5Gbit/s

Slot 6

622Mbit/s

Slot 2/12

2.5Gbit/s

Slot 7

622Mbit/s

Slot 3/13

2.5Gbit/s

Slot 8

622Mbit/s

Slot 4

2.5Gbit/s

Slot 9

622Mbit/s

Slot 5

2.5Gbit/s

Slot 10

AUX

3.3 Slot Allocation

The OptiX OSN 1500A subrack has only one tier, where 12 slots are present before the division
of slots. The OptiX OSN 1500B subrack has two tiers. The upper tier of the subrack, where four
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3 Subrack

slots are present, is the slot area for interface boards. The lower tier of the subrack, where ten
slots are present before the division of slots (including slots 4 and 5), is the slot area for processing
boards.
Figure 3-5 shows the slot layout of the OptiX OSN 1500A subrack.
Figure 3-5 Slot layout of the OptiX OSN 1500A subrack
Slot 1
Slot 20
FAN

Slot 6

Slot 11

Slot 12

Slot 7

Slot 13

Slot 8

Slot 4

CXL16/4/1

Slot 9

EOW

Slot 5

CXL16/4/1

Slot 10

AUX

Slots 12 and 13 in the OptiX OSN 1500A subrack can be divided into two half-width slots
respectively. See Figure 3-6.
Figure 3-6 Slot layout of the OptiX OSN 1500A subrack after the division of slots

Slot 20
FAN

Slot 1

Slot 11

Slot 6

Slot 2

Slot 12

Slot 7

Slot 3

Slot 13

Slot 8

Slot 4

CXL16/4/1

Slot 9

EOW

Slot 5

CXL16/4/1

Slot 10

AUX

Figure 3-7 shows the slot access capacity of the OptiX OSN 1500A.
Figure 3-7 Slot access capacity of the OptiX OSN 1500A
Slot 11

XCS B
Slot 6 1.25Gbit/s

Slot 2/12

2.5Gbit/s

Slot 7 1.25Gbit/s

Slot 3/13

2.5Gbit/s

Slot 8 1.25Gbit/s

Slot 4

2.5Gbit/s

Slot 9 1.25Gbit/s

Slot 5

2.5Gbit/s

Slot 10

Slot
XCS
A 1

Slot20

When slots 12 and 13 are not divided, the access capacity of each slot is 2.5 Gbit/s. When slots
12 and 13 are divided, the access capacity of each slot is 1.25 Gbit/s.
The slots in the OptiX OSN 1500A subrack are allocated as follows:
l

Slots for integrated boards of the line, SCC, cross-connect and timing units: slots 45

Slots for processing boards before the division of slots: slots 69 and 1213

Slots for processing boards after the division of slots: slots 69, 1213, and 23

Slot for the orderwire board: slot 9 (also for the processing board)

Slot for the auxiliary interface board: slot 10

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l

Slots for PIU boards: slots 1 and 11

Slots for the fan board: slot 20

Figure 3-8 shows the slot layout of the OptiX OSN 1500B subrack. Figure 3-9 shows the slot
access capacity of the OptiX OSN 1500B.
Figure 3-8 Slot layout of the OptiX OSN 1500B subrack
Slot 14

Interface board

Slot 15

Interface board

Slot 16

Interface board

Slot 17

Slot 20
FAN

Interface board

Slot 11

Processing board

Slot 12

Processing board

Slot 18

PIU

Slot 19

PIU

Slot 6 Processing

board

Slot 7 Processing

board

Slot 8 Processing

Slot 13

Processing board

Slot 4

CXL16/4/1

Slot 9

EOW

Slot 5

CXL16/4/1

Slot 10

AUX

board

Figure 3-9 Slot access capacity of the OptiX OSN 1500B

Slot 14
Slot 15
Slot 16
Slot 17

Slot 20
FAN

Slot 18

PIU

Slot 19

PIU

Slot 11

2.5Gbit/s

Slot 6

622Mbit/s

Slot 12

2.5Gbit/s

Slot 7

622Mbit/s

Slot 13

2.5Gbit/s

Slot 8

622Mbit/s

Slot 4

2.5Gbit/s

Slot 9

622Mbit/s

Slot 5

2.5Gbit/s

Slot 10

AUX

NOTE

Slots 1113 in the OptiX OSN 1500B subrack can be divided. As shown in Figure 3-10, the divided slots
are in the dashed area. The slots in the left portion of the original slots are slots 13, and the slots in the
right portion of the original slots are slots 1113. After the division of slots, the maximum access capacity
of each slot is 1.25 Gbit/s. See Figure 3-11.

Figure 3-10 Slot layout of the OptiX OSN 1500B subrack (after the division of slots)
Slot 14

Interface board

Slot 15

Interface board

Slot 16

Interface board

Slot 17

Interface board
Slot 11 Processing Slot 6 Processing
board
board
Slot 12 Processing Slot 7 Processing
board
board
Slot 13 Processing Slot 8 Processing
board
board

Slot 1
Slot 20

Slot 2
Slot 3

FAN

3-6

Slot 18

PIU

Slot 19

PIU

Slot 4

CXL16/4/1

Slot 9

EOW

Slot 5

CXL16/4/1

Slot 10

AUX

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Figure 3-11 Access capacity of the OptiX OSN 1500B subrack (after the division of slots)
Slot 14
Slot 15
Slot 16
Slot 17
Slot 1

Slot 18

PIU

Slot 19

PIU

1.25 Gbit/s

Slot 11 1.25 Gbit/s

Slot 6

622 Mbit/s

Slot 20 Slot 2

1.25 Gbit/s

Slot 12 1.25 Gbit/s

Slot 7

622 Mbit/s

Slot 3

1.25 Gbit/s

Slot 13 1.25 Gbit/s

Slot 8

622 Mbit/s

2.5 Gbit/s

Slot 9

622 Mbit/s

2.5 Gbit/s

Slot 10

AUX

FAN

Slot 4
Slot 5

The slots in the OptiX OSN 1500B subrack are allocated as follows:
l

Slots for integrated boards of the line, SCC, cross-connect and timing units: slots 45

Slots for processing boards before the division of slots: slots 69 and 1113

Slots for processing boards after the division of slots: slots 19 and 1113

Slots for the interface boards: slots 1417

Slot for the orderwire board: slot 9 (also for the processing board)

Slot for the auxiliary interface board: slot 10

Slots for PIU boards: slots 18 and 19

Slot for the fan board: slot 20

Mapping Relation Between Slots for Interface Boards and Slots for Processing
Boards
Table 3-1 lists the mapping relation between slots for interface boards and slots for processing
boards of the OptiX OSN 1500A.
Table 3-1 Mapping relation between slots for interface boards and slots for processing boards
of the OptiX OSN 1500A.
Slots for Processing Boards

Slots for Interface Boards

Slot 12

Slots 6 and 7

Table 3-2 lists the mapping relation between slots for interface boards and slots for processing
boards of the OptiX OSN 1500B.
Table 3-2 Mapping relation between slots for interface boards and slots for processing boards
of the OptiX OSN 1500B.

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Slots for
Processing
Boards

Slots for Interface

Boards

Slots for
Processing
Boards

Slots for Interface

Boards

Slot 2

Slot 14

Slot 3

Slot 16

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Slots for
Processing
Boards

Slots for Interface

Boards

Slots for
Processing
Boards

Slots for Interface

Boards

Slot 7

Slot 15

Slot 8

Slot 17

Slot 12

Slots 14 and 15

Slot 13

Slots 16 and 17

The corresponding interface boards for the PD3, PL3, SEP, and SPQ4 can be housed only in
slots of even numbers.
The boards housed in slots 12 and 7 share the same interface board housed in slot 15, and the
boards housed in slots 13 and 8 share the same interface board housed in slot 17. Therefore,
when you configure the boards:
l

If slot 12 houses the N1EMS4 (used with an interface board) or R1PD1, slot 7 cannot house
any board used with an interface board.

If slot 13 houses the N1EMS4 (used with an interface board) or R1PD1, slot 8 cannot house
any board used with an interface board.

Boards and Their Valid Slots

Table 3-3 lists the boards and their valid slots for the OptiX OSN 1500A.
Table 3-3 Boards and their valid slots for the OptiX OSN 1500A

3-8

Board

Full Name

Valid Slots

Q2CXL16

STM-16 integrated board of the

SCC, cross-connect, timing and
line units

Slots 4 and 5

Q2CXL4

STM-4 integrated board of the

SCC, cross-connect, timing and
line units

Slots 4 and 5

Q2CXL1

STM-1 integrated board of the

SCC, cross-connect, timing and
line units

Slots 4 and 5

N1SL16 (A)

1 x STM-16 optical interface

board

Slots 12 and 13

N2SL16 (A)

1 x STM-16 optical interface

board

Slots 12 and 13

N3SL16 (A)

1 x STM-16 optical interface

board

Slots 12 and 13

N1SF16

1 x STM-16 optical interface

board (with FEC)

Slots 12 and 13

N1SLQ4

4 x STM-4 optical interface board

Slots 12 and 13

N2SLQ4

4 x STM-4 optical interface board

Slots 12 and 13

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Board

Full Name

Valid Slots

N1SLD4

2 x STM-4 optical interface board

Slots 12 and 13

N2SLD4

2 x STM-4 optical interface board

Slots 12 and 13

N1SL4

1 x STM-4 optical interface board

Slots 12 and 13

N2SL4

1 x STM-4 optical interface board

Slots 12 and 13

N1SLT1

12 x STM-1 optical interface

board

Slots 12 and 13

N2SLO1

8 x STM-1 optical interface board

Slots 12 and 13

N1SLQ1

4 x STM-1 optical interface board

Slots 12 and 13

N2SLQ1

4 x STM-1 optical interface board

Slots 12 and 13

N1SL1

1 x STM-1 optical interface board

Slots 12 and 13

N2SL1

1 x STM-1 optical interface board

Slots 12 and 13

N1SEP1

2 x STM-1 line processing board

Slots 12 and 13

R1SLD4

2 x STM-4 optical interface board

(half-width)

Slots 23, 69, and 1213

R1SL4

1 x STM-4 optical interface board

(half-width)

Slots 23, 69, and 1213

R1SLQ1

4 x STM-1 optical interface board

(half-width)

Slots 23, 69, and 1213

R1SL1

1 x STM-1 optical interface board

(half-width)

Slots 23, 69, and 1213

N1PL3A

3 x E3/T3 processing board (not

used with the interface board)

Slots 12 and 13

N2PL3A

3 x E3/T3 processing board (not

used with the interface board)

Slots 12 and 13

R1PD1A

32 x E1 processing board (halfwidth)

Slots 2 and 12

R1PD1B

32 x E1 processing board (halfwidth)

Slots 2 and 12

R2PD1

32 x E1/T1 hybrid processing

board (half-width)

Slots 2 and 12

R1PL1A

16 x E1 processing board (halfwidth)

Slots 69

R1PL1B

16 x E1 processing board (halfwidth)

Slots 69

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Board

Full Name

Valid Slots

R1L75S

16 x EI 75-ohm interface board

(half-width)

Slots 6 and 7

R1L12S

16 x E1 120-ohm interface board

(half-width)

Slots 6 and 7

N2EGR2

2 x GE Ethernet ring processing

board

Slots 12 and 13 (2.5 Gbit/s)

N1EGS2

2 x GE Ethernet processing board

Slots 12 and 13 (2.5 Gbit/s)

N2EGS2

2 x GE Ethernet processing board

Slots 12 and 13 (2.5 Gbit/s)

N1EFS4

4 x 10M/100M Ethernet
processing board

Slots 12 and 13

N2EFS4

4 x 10M/100M Ethernet
processing board

Slots 12 and 13 (1.25 Gbit/s)

N1EMS4

4 x GE Ethernet processing board

Slots 12 and 13 (2.5 Gbit/s)

N1EGS4

4 x GE Ethernet processing board

Slots 12 and 13 (2.5 Gbit/s)

N1EGT2

2 x GE Ethernet transparent
transmission board

Slots 12 and 13 (2.5 Gbit/s)

R1EFT4

4 x 10M/100M Ethernet
transparent transmission board
(half-width)

Slots 23, 1213 and 69 (622

Mbit/s)

N1EFT8 (not used

with the interface
board)

8 x 10M/100M Ethernet
transparent transmission board

Slots 1213 (622 Mbit/s)

N1EMR0 (not used

with the interface
board)

1 x GE and 4 x FE Ethernet
processing board

Slots 12 and 13 (2.5 Gbit/s)

N2EMR0 (not used

with the interface
board)

1 x GE and 4 x FE Ethernet
processing board

Slots 12 and 13 (2.5 Gbit/s)

N1EFT8A

8 x FE transparent transmission
board (interfaces are available on
the front panel)

Slots 12 and 13 (622 Mbit/s)

N1ADL4

1 x STM-4 ATM processing

board

Slots 12 and 13 (1.25 Gbit/s)

N1ADQ1

4 x STM-1 ATM processing

board

Slots 12 and 13 (1.25 Gbit/s)

N1IDL4

1 x STM-4 IMA processing board

Slots 12 and 13 (1.25 Gbit/s)

N1IDQ1

4 x STM-1 IMA processing board

Slots 12 and 13 (1.25 Gbit/s)

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Board

Full Name

Valid Slots

N1MST4

4-channel multiservice (SAN or

video service) transparent
transmission board

Slots 12 and 13 (2.5 Gbit/s)

N1LWX

Arbitrary rate access board

Slots 12 and 13

N1MR2A

Arbitrary two-wavelength add/

drop board (processing board)

Slots 12 and 13

N1MR2B

Arbitrary two-wavelength add/

drop board (half-width)

Slots 12 and 13

TN11OBU1

Optical booster amplifier board

Slots 12 and 13

TN11MR2

2-channel optical add/drop

multiplexing board

Slots 12 and 13

TN11MR4

4-channel optical add/drop

multiplexing board

Slots 12 and 13

TN11CMR2

2-channel CWDM optical add/

drop multiplexing board

Slots 12 and 13

TN11CMR4

4-channel CWDM optical add/

drop multiplexing board

Slots 12 and 13

N1DXA

N x 64 kbit/s convergence and

processing board

Slots 12 and 13

R1AMU

Orderwire processing or alarm

concatenation board

Slot 9

N1FIB

Filter isolating board

Slots 12 and 13

ROP

Single wavelength long-haul

board (remote pumping)

Slot 103 (external)

R1AUX

System auxiliary processing unit

Slot 10

R2AUX

System auxiliary processing unit

Slot 10

R1PIUA

PIU board

Slots 1 and 11

CAU

CAU power monitoring board

Slot 50

COA

COA board

Slots 101 and 102

N1BA2

2-channel optical booster

amplifier board

Slots 12 and 13

N1BPA

1-channel amplifier and 1channel preamplifier board

Slots 12 and 13

R1FAN

Fan board

Slot 20

R1EOW

Orderwire communication board

Slot 9

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Table 3-4 lists the boards and their valid slots for the OptiX OSN 1500B.
Table 3-4 Boards and their valid slots for the OptiX OSN 1500B

3-12

Board

Full Name

Valid Slots

Q2CXL16

STM-16 integrated board of the

SCC, cross-connect, timing and
line units

Slots 4 and 5

Q2CXL4

STM-4 integrated board of the

SCC, cross-connect, timing and
line units

Slots 4 and 5

Q2CXL1

STM-1 integrated board of the

SCC, cross-connect, timing and
line units

Slots 4 and 5

N1SL16 (A)

1 x STM-16 optical interface

board

Slots 1113

N2SL16 (A)

1 x STM-16 optical interface

board

Slots 1113

N3SL16 (A)

1 x STM-16 optical interface

board

Slots 1113

N1SF16

1 x STM-16 outband optical

interface board (with FEC)

Slots 1113

N1SLQ4

4 x STM-4 optical interface board

Slots 1113

N2SLQ4

4 x STM-4 optical interface board

Slots 1113

N1SLD4

2 x STM-4 optical interface board

Slots 1113

N2SLD4

2 x STM-4 optical interface board

Slots 1113

N1SL4

1 x STM-4 optical interface board

Slots 1113

N2SL4

1 x STM-4 optical interface board

Slots 1113

N1SLQ1

4 x STM-1 optical interface board

Slots 1113

N2SLQ1

4 x STM-1 optical interface board

Slots 1113

N1SL1

1 x STM-1 optical interface board

Slots 1113

N2SL1

1 x STM-1 optical interface board

Slots 1113

R1SLD4

2 x STM-4 optical interface board

(half-width)

Slots 13 and 1113 (for the

board housed in any of slots 13
and 1113, two optical interfaces
can be configured), slots 69 (for
the board housed in any of slots
69, one optical interface can be
configured)

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Board

Full Name

Valid Slots

R1SL4

1 x STM-4 optical interface board

(half-width)

Slots 13, 69 and 1113

R1SLQ1

4 x STM-1 optical interface board

(half-width)

Slots 13, 69 and 1113

R1SL1

1 x STM-1 optical interface board

(half-width)

Slots 13, 69 and 1113

N1SEP

8 x STM-1 (e) processing board

(used with the interface board)

Slots 1213

N1SEP1

2 x STM-1 (e) processing board

(not used with the interface board)

Slots 1113

N1SLT1

12 x STM-1 optical interface

board

Slots 1113

N2SPQ4

4 x STM-1/E4 (e) processing

board (used with the interface
board)

Slots 12 and 13

N1EU08

8 x STM-1 (e) electrical interface

board

Slots 14 and 16

N1OU08

8 x STM-1 optical interface board

Slots 14 and 16

N2OU08

8 x STM-1 optical interface board

Slots 14 and 16

N1EU04

4 x STM-1 (e) electrical interface

board

Slots 14 and 16

N2SLO1

8 x AU-3 high density access

board

Slots 1113

R1PL1A

16 x E1 interface and processing

board (interfaces available on the
front panel)

Slots 69

R1PL1B

16 x E1 interface and processing

board (interfaces available on the
front panel)

Slots 69

N2PQ3

12 x E3/T3 processing board

Slots 12 and 13

N2PD3

6 x E3/T3 processing board

Slots 12 and 13

N2PL3

3 x E3/T3 processing board

Slots 12 and 13

N1PL3A

3 x E3/T3 processing board (not

used with the interface board)

Slots 1113

N2PL3A

3 x E3/T3 processing board (not

used with the interface board)

Slots 1113

N1PD3

6 x E3/T3 processing board

Slots 12 and 13

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3-14

Board

Full Name

Valid Slots

N1PL3

3 x E3/T3 processing board

Slots 12 and 13

N1C34S

3 x 34M/45M electrical interface

switching board

Slots 14 and 16

N1D34S

6 x 34M/45M electrical interface

switching board

Slots 1417

N1SPQ4

4 x E4/STM-1 processing board

Slots 1213

N1MU04

4 x E4/STM-1 processing board

Slots 14 and 16

N1PQ1A

63 x E1 75-ohm processing board

Slots 1113

N1PQ1B

63 x E1 120-ohm processing
board

Slots 1113

N1PQM

63 x E1 75-ohm or 120-ohm
processing board

Slots 1113

N2PQ1

63 x E1/T1 hybrid processing

board

Slots 1113

R2PD1

32 x E1/T1 hybrid processing

board

Slots 13, 68 and 1113

N1D75S

32 x E1/T1 75-ohm electrical

interface switching board

Slots 1417

N1D12S

32 x E1/T1 120-ohm electrical

interface switching board

Slots 1417

N1D12B

32 x E1/T1 120-ohm electrical

interface board

Slots 1417

N1DX1

N x 64 kbit/s access and

convergence board

Slots 1113

N1DXA

N x 64 kbit/s convergence and

processing board

Slots 1113

N1DM12

N x 64 kbit/s interface board

Slots 1417

N1EMS4 (used with

the interface board)

4 x GE and 16 x FE Ethernet
processing board

Slots 12 and 13 (2.5 Gbit/s)

N1EMS4 (not used

with the interface
board)

4 x GE Ethernet processing board

Slots 1113 (2.5 Gbit/s)

N1EGS4

4 x GE Ethernet processing board

Slots 1113 (2.5 Gbit/s)

N2EFS4

4 x 10M/100M Ethernet
processing board

Slots 1113 (1.25 Gbit/s)

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Board

Full Name

Valid Slots

N4EFS0

10M/100M Ethernet processing

board (used with the interface
board)

Slots 12 and 13 (1.25 Gbit/s)

N1EFT8A

8 x FE transparent transmission
board (interfaces available on the
front panel)

Slots 1113 (622 Mbit/s)

N1EFT8 (not used

with the interface
board)

8 x 10M/100M Ethernet
transparent transmission board

Slots 1113 (622 Mbit/s)

N1EFT8 (used with

the interface board)

8 x 10M/100M Ethernet
transparent transmission board

Slots 12 and 13 (1.25 Gbit/s)

R1AMU

Orderwire processing or alarm

concatenation board

Slot 9

N1FIB

Filter isolating board

Slots 12 and 13

ROP

Single wavelength long-haul

board (remote pumping)

Slot 103 (external)

R2AUX

System auxiliary interface board

Slot 10

N2EGR2

2 x GE Ethernet ring processing

board

Slots 1113 (2.5 Gbit/s)

N2EMR0 (used with

the interface board)

1 x GE and 12 x FE Ethernet
processing board

Slots 1213 (2.5 Gbit/s)

N2EMR0 (not used

with the interface
board)

1 x GE and 4 x FE Ethernet
processing board

Slots 1113 (2.5 Gbit/s)

R1EFT4

4 x FE processing board
(interfaces available on the front
panel)

Slots 13, 1113 and 69 (622

Mbit/s)

N1TSB8

8-channel electrical interface

switching board

Slots 14 and 15

N1TSB4

4-channel electrical interface

switching board

Slot 14

N1EFS0 (used with

the interface board)

10M/100M Ethernet processing

board

Slots 1213 (622 Mbit/s)

N2EFS0 (used with

the interface board)

10M/100M Ethernet processing

board

Slots 1213 (1.25 Gbit/s)

N1ETF8

8 x FE Ethernet electrical interface

board

Slots 1417

N1EFS4

4 x 10M/100M Ethernet
processing board

Slots 1113

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3 Subrack

3-16

Board

Full Name

Valid Slots

N2EGS2

2 x GE Ethernet processing board

Slots 1113 (2.5 Gbit/s)

N1EGT2

2 x GE Ethernet transparent
transmission board

Slots 1113 (2.5 Gbit/s)

N1MST4

4-channel multiservice
transparent transmission board

Slots 1113 (2.5 Gbit/s)

N1EGS2

2 x GE Ethernet processing board

Slots 1113 (2.5 Gbit/s)

N1EMR0 (used with

the interface board)

1 x GE and 12 x FE Ethernet
processing board

Slots 1213 (2.5 Gbit/s)

N1EMR0 (not used

with the interface
board)

1 x GE and 4 x FE Ethernet
processing board

Slots 1113 (2.5 Gbit/s)

N1EFF8

8-channel Ethernet optical

interface board

Slots 1417

N1ETS8

8 x 10/100M Ethernet twisted pair

interface switching board

Slots 14 and 16

N1ADQ1

4 x STM-1 or 1 x STM-4 ATM

processing board

Slots 1113 (1.25 Gbit/s)

N1ADL4

1 x STM-4 ATM processing board

Slots 1113 (1.25 Gbit/s)

N1IDQ1

4 x STM-1 IMA processing board

Slots 1113 (1.25 Gbit/s)

N1IDL4

1 x STM-4 IMA processing board

Slots 1113 (1.25 Gbit/s)

CAU

CAU power monitoring board

Slot 50

COA

COA board

Slots 101102

N1BA2

2-channel optical booster

amplifier board

Slots 1113

N1BPA

Optical booster preamplifier

board

Slots 1113

R1PD1

32 x E1 processing board (halfwidth)

Slots 13, 68 and 1113

R1FAN

Fan board

Slot 20

R1AUX

System auxiliary processing unit

Slot 10

R1EOW

Orderwire communication board

Slot 9

R1PIU

PIU board

Slots 1819

N1MR2A

Arbitrary two-wavelength add/

drop board

Slots 1113

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Board

Full Name

Valid Slots

N1MR2B

Arbitrary two-wavelength add/

drop board (half-width)

Slots 13, 69 and 1113

N1MR2C

Arbitrary two-wavelength add/

drop board

Slots 1417

N1LWX

Arbitrary rate access board

Slots 1113

TN11OBU1

Optical booster amplifier board

Slots 1113

TN11MR2

2-channel optical add/drop

multiplexing board

Slots 1113

TN11MR4

4-channel optical add/drop

multiplexing board

Slots 1113

TN11CMR2

2-channel CWDM optical add/

drop multiplexing board

Slots 1113

TN11CMR4

4-channel CWDM optical add/

drop multiplexing board

Slots 1113

3.4 Technical Specifications

The specifications of the subrack cover dimensions, weight and maximum power consumption.
Table 3-5 lists the technical specifications of the OptiX OSN 1500A subrack.
Table 3-5 Technical specifications of the OptiX OSN 1500A subrack
Dimensions (mm)

Weight (kg)

444 (W) x 262 (D) x 131 (H)

8 (the backplane, fans and two PIU

boards included)

Table 3-6 lists power consumption of the OptiX OSN 1500A subrack.
Table 3-6 Maximum power consumption of the OptiX OSN 1500A subrack
Subrack Type

Maximum Power
Consumption

Fuse Capacity

OptiX OSN 1500A general

subrack

200 W

10 A

OptiX OSN 1500A enhanced

subrack

313 W

15 A

Table 3-7 lists the technical specifications of the OptiX OSN 1500B subrack.

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Table 3-7 Technical specifications of the OptiX OSN 1500B subrack

Dimensions (mm)

Weight (kg)

444 (W) x 263 (D) x 221 (H)

9 (the backplane, fans and two PIU

boards included)

Table 3-8 lists power consumption of the OptiX OSN 1500B subrack.
Table 3-8 Maximum power consumption of the OptiX OSN 1500B subrack

3-18

Subrack Type

Maximum Power
Consumption

Fuse Capacity

OptiX OSN 1500B general

subrack

280 W

10 A

OptiX OSN 1500B enhanced

subrack

400 W

15 A

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4 Board List and Classification

Board List and Classification

About This Chapter

This chapter describes the appearance, barcode and classification of boards used for the OptiX
OSN systems.
4.1 Appearance and Dimensions of Boards
Different boards have different appearance and dimensions.
4.2 Description of the Barcode on the Board
The barcode on the front panel of the board indicates the board version, name and board features.
4.3 Board Classification
By function, the boards can be classified into SDH processing boards, PDH processing boards,
data processing boards, WDM processing boards and auxiliary boards.

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4 Board List and Classification

4.1 Appearance and Dimensions of Boards

Different boards have different appearance and dimensions.
Table 4-1 lists the appearance figures and dimensions of boards for the OptiX OSN 1500.
Table 4-1 Appearance and dimensions of boards for the OptiX OSN 1500
Item

Appearance and Dimensions

Board
appearance

Board
classificatio
n

Integrated board of the

SCC, cross-connect and
line units (CXL)

Board housed in a divided

slot (PD1/PIUA/AUX/
EOW)

Service interface
board (D75S, for
example)

Height
(mm)

262.05

111.8

262.05

Depth (mm)

220

220

110

Width (mm)

25.4

25.4

22

Note: The figure in the right cell illustrates the three dimensions. The
height and width are measured for the front panel and the depth is
measured for the printed circuit board (PCB).

H
D

CAUTION
Wear the anti-static wrist strap when holding the board with hands. Make sure that the anti-static
wrist strap is well grounded. Otherwise, the static discharge may cause damage to the board.

DANGER
Avoid direct eye exposure to laser beams launched from the optical interface board or optical
interfaces. Otherwise, damage may be caused to the eyes.

4-2

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CAUTION
l

Do not directly insert the attenuators into the level optical modules. If the attenuators are
required, use the attenautors at the ODF side.

If a board requires an attenuator, insert the attenuator in the IN interface instead of the OUT
interface.

When performing the loopback, use attenuators to prevent damage to the optical modules.

4.2 Description of the Barcode on the Board

The barcode on the front panel of the board indicates the board version, name and board features.
Two types of barcodes are used for the boards of the OptiX OSN 1500.
l

16-character manufacturing code + board version + board name + board feature code

20-character manufacturing code + board version + board name + board feature code

The barcode is stuck on the front panel of a board. Figure 4-1 shows a barcode with 16-character
manufacturing code.
Figure 4-1 Barcode of a board

Bar code

0364401055000015 -SSN3SL16A01

Last 6-character serial code of BOM

Internal code
Board version
Board name
5 Board feature code

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4 Board List and Classification

NOTE

For details on the board feature code, see the section that describes the board feature code for each board.

4.3 Board Classification

By function, the boards can be classified into SDH processing boards, PDH processing boards,
data processing boards, WDM processing boards and auxiliary boards.
4.3.1 SDH Processing Boards
The OptiX OSN 1500 supports the SDH processing boards at the STM-16, STM-4 and STM-1
levels.
4.3.2 PDH Processing Boards
The OptiX OSN 1500 supports PDH processing boards at different rates and of different
impedance.
4.3.3 Data Processing Boards
The OptiX OSN 1500 supports data processing boards with the transparent transmission,
switching or RPR function.
4.3.4 Interface Boards and Switching Boards
The OptiX OSN 1500 supports the optical interface boards, electrical interface boards and
switching boards.
4.3.5 Cross-Connect Boards and SCC Boards
The OptiX OSN 1500 supports the integrated boards of the cross-connect, SCC and line units
at different rates.
4.3.6 Auxiliary Boards
The OptiX OSN 1500 supports auxiliary boards such as the system auxiliary interface boards
and fan boards.
4.3.7 WDM Processing Boards
The OptiX OSN 1500 supports WDM processing boards such as the optical add/drop
multiplexing boards and optical power amplifier boards.
4.3.8 Optical Amplifier Boards and Dispersion Compensation Board
The OptiX OSN 1500 supports several optical booster amplifier boards.
4.3.9 Power Interface Boards
The OptiX OSN 1500A supports the UPM and R1PIUA. The OptiX OSN 1500B supports the
UPM and R1PIU.

4.3.1 SDH Processing Boards

The OptiX OSN 1500 supports the SDH processing boards at the STM-16, STM-4 and STM-1
levels.
Table 4-2 lists the SDH processing boards supported by the OptiX OSN 1500A.
Table 4-2 SDH processing boards for the OptiX OSN 1500A

4-4

Board

Full Name

N1SL16

1 x STM-16 optical interface board

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Board

Full Name

N2SL16

1 x STM-16 optical interface board

N3SL16

1 x STM-16 optical interface board

N1SL16A

1 x STM-16 optical interface board

N2SL16A

1 x STM-16 optical interface board

N3SL16A

1 x STM-16 optical interface board

N1SF16

1 x STM-16 optical interface board (with FEC)

N1SL4

1 x STM-4 optical interface board

N2SL4

1 x STM-4 optical interface board

R1SL4

1 x STM-4 optical interface board (half-width)

N1SLQ4

1 x STM-4 optical interface board

N2SLQ4

4 x STM-4 optical interface board

N1SLD4

2 x STM-4 optical interface board

N2SLD4

2 x STM-4 optical interface board

R1SLD4

2 x STM-4 optical interface board (half-width)

N1SLT1

12 x STM-1 optical interface board

N1SLQ1

4 x STM-1 optical interface board

N2SLQ1

4 x STM-1 optical interface board

R1SLQ1

4 x STM-1 optical interface board (half-width)

N1SL1

1 x STM-1 optical interface board

N2SL1

1 x STM-1 optical interface board

R1SL1

1 x STM-1 optical interface board (half-width)

N1SEP1

2 x STM-1 line processing board when interfaces are available

on the front panel

N2SLO1

8 x STM-1 optical interface board

Table 4-3 lists the SDH processing boards supported by the OptiX OSN 1500B.
Table 4-3 SDH processing boards for the OptiX OSN 1500B

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Board

Full Name

N1SL16

1 x STM-16 optical interface board

N2SL16

1 x STM-16 optical interface board

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Board

Full Name

N3SL16

1 x STM-16 optical interface board

N1SL16A

1 x STM-16 optical interface board

N2SL16A

1 x STM-16 optical interface board

N3SL16A

1 x STM-16 optical interface board

N1SF16

1 x STM-16 optical interface board (with FEC)

N1SL4

1 x STM-4 optical interface board

N2SL4

1 x STM-4 optical interface board

R1SL4

1 x STM-4 optical interface board (half-width)

N1SLQ4

4 x STM-4 optical interface board

N2SLQ4

4 x STM-4 optical interface board

N1SLD4

2 x STM-4 optical interface board

N2SLD4

2 x STM-4 optical interface board

R1SLD4

2 x STM-4 optical interface board (half-width)

N1SLT1

12 x STM-1 optical interface board

N1SLQ1

4 x STM-1 optical interface board

N2SLQ1

4 x STM-1 optical interface board

R1SLQ1

4 x STM-1 optical interface board (half-width)

N1SL1

1 x STM-1 optical interface board

N2SL1

1 x STM-1 optical interface board

R1SL1

1 x STM-1 optical interface board (half-width)

N1SEP1

2 x STM-1 line processing board when interfaces are available

on the front panel
8 x STM-1 line processing board when used with an interface
board

N2SLO1

8 x STM-1 optical interface board

4.3.2 PDH Processing Boards

The OptiX OSN 1500 supports PDH processing boards at different rates and of different
impedance.
Table 4-4 lists the PDH processing boards supported by the OptiX OSN 1500A.

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Table 4-4 PDH processing boards for the OptiX OSN 1500A
Board

Full Name

Board

Full Name

R1PL1

16 x E1 processing board

N1PL3A

3 x E3/T3 processing board

(interfaces available on the
front panel)

R1PD1

32 x E1 processing board

N2PL3A

3 x E3/T3 processing board

(interfaces available on the
front panel)

R2PD1

32 x E1/T1 processing board

N1DXA

DDN service convergence

board

Table 4-5 lists the PDH processing boards supported by the OptiX OSN 1500B.
Table 4-5 PDH processing boards for the OptiX OSN 1500B
Board

Full Name

Board

Full Name

R1PL1

16 x E1 processing board

N2PL3A

3 x E3/T3 processing board

(interfaces available on the
front panel)

R1PD1

32 x E1 processing board

N1PD3

6 x E3/T3 processing board

R2PD1

32 x E1/T1 processing board

N2PD3

6 x E3/T3 processing board

N1PQ1

63 x E1 processing board

N2PQ3

12 x E3/T3 processing board

N2PQ1

63 x E1 processing board

N1DX1

DDN service access and

convergence board

N1PQM

63 x E1/T1 processing board

N1DXA

DDN service convergence

board

N1PL3

3 x E3/T3 processing board

N1SPQ4

4 x E4/STM-1 electrical
processing board

N2PL3

3 x E3/T3 processing board

N2SPQ4

4 x E4/STM-1 electrical
processing board

N1PL3A

3 x E3/T3 processing board

(interfaces available on the front
panel)

4.3.3 Data Processing Boards

The OptiX OSN 1500 supports data processing boards with the transparent transmission,
switching or RPR function.
Table 4-6 lists the data processing boards supported by the OptiX OSN 1500A.

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Table 4-6 Data processing boards for the OptiX OSN 1500A
Board

Full Name

Board

Full Name

N1EFT4

4 x FE Ethernet transparent
transmission board (half-width)

N1EGS4

4 x GE Ethernet convergence
board

N1EFT8

8 x FE Ethernet transparent
transmission board

N2EGR2

2 x GE Ethernet ring processing

board

N1EFT8
A

8 x FE Ethernet transparent
transmission board

N1EMR0

4 x FE and 1 x GE Ethernet ring

processing board

N1EGT2

2 x GE Ethernet transparent
transmission board

N2EMR0

4 x FE and 1 x GE Ethernet ring

processing board

N1EFS4

4 x FE Ethernet processing
board with Lanswitch

N1ADL4

1 x STM-4 ATM processing

board

N2EFS4

4 x FE Ethernet processing
board with Lanswitch

N1ADQ1

1 x STM-4 ATM processing

board

N1EGS2

2 x GE Ethernet processing
board with Lanswitch

N1IDL4

1 x STM-4 ATM processing

board

N2EGS2

2 x GE Ethernet processing
board with Lanswitch

N1IDQ1

4 x STM-1 ATM processing

board

N1EMS4

4 x GE Ethernet transparent
transmission and convergence
board

N1MST4

4-port multi-service transparent

transmission board

Table 4-7 lists the data processing boards supported by the OptiX OSN 1500B.
Table 4-7 Data processing boards for the OptiX OSN 1500B

4-8

Board

Full Name

Board

Full Name

N1EFT4

4 x FE Ethernet transparent
transmission board (half-width)

N1EMS4

4 x GE and 16 x FE Ethernet
transparent transmission and
convergence board

N1EFT8

8 x FE or 16 x FE Ethernet
transparent transmission board

N1EGS4

4 x GE Ethernet convergence
board

N1EFT8
A

8 x FE Ethernet transparent
transmission board

N2EGR2

2 x GE Ethernet ring processing

board

N1EGT2

2 x GE Ethernet transparent
transmission board

N1EMR0

12 x FE and 1 x GE Ethernet
ring processing board

N1EFS0

8-port Fast Ethernet processing

board with Lanswitch

N2EMR0

12 x FE and 1 x GE Ethernet
ring processing board

N2EFS0

8 x FE Ethernet processing
board with Lanswitch

N1ADL4

1 x STM-4 ATM processing

board

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Board

Full Name

Board

Full Name

N4EFS0

8 x FE Ethernet processing
board with Lanswitch

N1ADQ1

1 x STM-4 ATM processing

board

N1EFS4

4 x FE Ethernet processing
board with Lanswitch

N1IDL4

1 x STM-4 ATM processing

board

N2EFS4

4 x FE Ethernet processing
board with Lanswitch

N1IDQ1

4 x STM-1 ATM processing

board

N1EGS2

2 x GE Ethernet processing
board with Lanswitch

N1MST4

4-port multi-service transparent

transmission board

N2EGS2

2 x GE Ethernet processing
board with Lanswitch

4.3.4 Interface Boards and Switching Boards

The OptiX OSN 1500 supports the optical interface boards, electrical interface boards and
switching boards.
Table 4-8 lists the interface boards and switching boards supported by the OptiX OSN 1500A.
Table 4-8 Interface boards and switching boards supported by the OptiX OSN 1500A
Board

Full Name

R1L12S

16 x E1/T1 120-ohm electrical interface switching board

R1L75S

16 x E1 75-ohm electrical interface switching board

Table 4-9 lists the interface boards and switching boards supported by the OptiX OSN 1500B.
Table 4-9 Interface boards and switching boards supported by the OptiX OSN 1500B

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Board

Full Name

Board

Full Name

N1EU08

8 x STM-1 electrical interface

board

N1D12S

32 x E1/T1 120-ohm
electrical interface switching
board

N1OU08

8 x STM-1 optical interface

board (LC)

N1D12B

32 x E1/T1 120-ohm
electrical interface board

N2OU08

8 x STM-1 optical interface

board (SC)

N1EFF8

8 x 100M Ethernet optical

interface board

N1D75S

32 x E1/T1 75-ohm electrical

interface switching board

N1ETF8

8 x 100M Ethernet twisted

pair interface board

N1MU04

4 x STM-1 electrical interface

board

N1ETS8

8 x 10/100M Ethernet
twisted pair interface
switching board

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Board

Full Name

Board

Full Name

N1D34S

6 x E3/T3 electrical interface

switching board

N1DM12

DDN service interface board

N1C34S

3 x E3/T3 electrical interface

switching board

N1TSB4

4-channel electrical
interface switching board

N1EU04

4 x STM-1 electrical interface

board

N1TSB8

8-channel electrical
interface switching board

4.3.5 Cross-Connect Boards and SCC Boards

The OptiX OSN 1500 supports the integrated boards of the cross-connect, SCC and line units
at different rates.
Table 4-10 lists the cross-connect boards and SCC boards supported by the OptiX OSN 1500A
and the OptiX OSN 1500B.
Table 4-10 Cross-connect boards and SCC boards supported by the OptiX OSN 1500A and the
OptiX OSN 1500B
Board

Full Name

Q2CXL1

Integrated board of the SCC, cross-connect and line units at the

STM-1 level

Q2CXL4

Integrated board of the SCC, cross-connect and line units at the

STM-4 level

Q2CXL16

Integrated board of the SCC, cross-connect and line units at the

STM-16 level

4.3.6 Auxiliary Boards

The OptiX OSN 1500 supports auxiliary boards such as the system auxiliary interface boards
and fan boards.
Table 4-11 lists the auxiliary boards supported by the OptiX OSN 1500A and the OptiX OSN
1500B.
Table 4-11 Auxiliary boards supported by the OptiX OSN 1500A and the OptiX OSN 1500B

4-10

Board

Full Name

Board

Full Name

R1EOW

Orderwire phone
processing board

R1AUX/
R2AUX

System auxiliary
interface board

R1AMU

Orderwire processing or
alarm concatenation
board

R1FAN

Fan board

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4.3.7 WDM Processing Boards

The OptiX OSN 1500 supports WDM processing boards such as the optical add/drop
multiplexing boards and optical power amplifier boards.
Table 4-12 lists the optical add/drop multiplexing boards supported by the OptiX OSN 1500A.
Table 4-12 Optical add/drop multiplexing boards supported by the OptiX OSN 1500A
Board

Full Name

Board

Full Name

TN11CMR2

2-channel optical add/drop

multiplexing board

N1MR2C

2-channel optical add/drop

multiplexing board

TN11CMR4

4-channel optical add/drop

multiplexing board

N1LWX

Arbitrary bit rate wavelength

conversion board

MR2

2-channel optical add/drop

multiplexing board

TN11OBU1

Optical booster amplifier

board

MR4

4-channel optical add/drop

multiplexing board

N1FIB

Filter isolating board

N1MR2A

2-channel optical add/drop

multiplexing board

Table 4-13 lists the optical add/drop multiplexing boards supported by the OptiX OSN 1500B.
Table 4-13 Optical add/drop multiplexing boards supported by the OptiX OSN 1500B
Board

Full Name

Board

Full Name

TN11CMR2

2-channel optical add/drop

multiplexing board

N1MR2B

2-channel optical add/drop

multiplexing board

TN11CMR4

4-channel optical add/drop

multiplexing board

N1MR2C

2-channel optical add/drop

multiplexing board

MR2

2-channel optical add/drop

multiplexing board

N1LWX

Arbitrary bit rate wavelength

conversion board

MR4

42-channel optical add/drop

multiplexing board

TN11OBU1

Optical booster amplifier

board

N1MR2A

2-channel optical add/drop

multiplexing board

N1FIB

Filter isolating board

4.3.8 Optical Amplifier Boards and Dispersion Compensation

Board
The OptiX OSN 1500 supports several optical booster amplifier boards.
Table 4-14 lists the optical amplifier boards and dispersion compensation boards supported by
the OptiX OSN 1500A and the OptiX OSN 1500B.
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Table 4-14 Optical amplifier boards and dispersion compensation boards supported by the OptiX
OSN 1500A/B
Board

Full Name

N1BPA

Optical booster and pre-amplifier board

N1BA2

Optical booster amplifier board

N1COA/61COA/62COA

Case-shaped optical amplifier

4.3.9 Power Interface Boards

The OptiX OSN 1500A supports the UPM and R1PIUA. The OptiX OSN 1500B supports the
UPM and R1PIU.
The UPM is an uninterruptible power module.
The R1PIUA is used for the OptiX OSN 1500A as the power interface board.
The R1PIU is used for the OptiX OSN 1500B as the power interface board.

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5 SDH Processing Boards

SDH Processing Boards

About This Chapter

This chapter describes the SDH processing boards at the STM-1, STM-4, and STM-16 levels.
5.1 SL1
This section describes the SL1, a 1 x STM-1 optical interface board, in terms of the version,
function, working principle, front panel and specifications.
5.2 SLQ1
This section describes the SLQ1, a 4 x STM-1 optical interface board, in terms of the version,
function, working principle, front panel and parameters.
5.3 SLO1
This section describes the SLO1, an 8 x STM-1 optical interface board, in terms of the version,
function, working principle, front panel and parameters.
5.4 SLT1
This section describes the SLT1, a 12 x STM-1 optical interface board, in terms of the version,
function, working principle, front panel and specifications.
5.5 SEP1
This section describes the SEP1 board, in terms of the version, function, working principle, front
panel, and specifications.
5.6 SL4
This section describes the SL4, a 1 x STM-4 optical interface board, in terms of the version,
function, working principle, front panel and specifications.
5.7 SLD4
This section describes the SLD4, a 2 x STM-4 optical interface board, in terms of the version,
function, working principle, front panel and specifications.
5.8 SLQ4
This section describes the SLQ4, a 4 x STM-4 optical interface board, in terms of the version,
function, working principle, front panel and specifications.
5.9 SL16
This section describes the SL16, a 1 x STM-16 optical interface board, in terms of the version,
function, working principle, front panel and specifications.
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5.10 SL16A
This section describes the SL16A, a 1 x STM-16 optical interface board, in terms of the version,
function, working principle, front panel and specifications.
5.11 SF16
This section describes the SF16, a 1 x STM-16 optical interface board with the out-band FEC
function, in terms of the version, function, working principle, front panel and specifications.

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5.1 SL1
This section describes the SL1, a 1 x STM-1 optical interface board, in terms of the version,
function, working principle, front panel and specifications.
5.1.1 Version Description
The SL1 board has three versions: R1, N1 and N2. The difference among the three versions lies
in the support for the TCM function. The R1SL1 is a 1 x STM-1 optical interface board, which
is housed in a divided slot in a subrack.
5.1.2 Function and Feature
The SL1 is used to transmit and receive STM-1 optical signals, to perform O/E conversion for
the STM-1 optical signals, to extract or insert overhead bytes, and to generate alarm signals.
5.1.3 Working Principle and Signal Flow
The SL1 board consists of the O/E conversion module, CDR module, SDH overhead processing
module, RST and so on.
5.1.4 Front Panel
On the front panel of the N1L1/N2SL1, there are indicators, interfaces, barcode and laser safety
class label. On the front panel of the R1SL1, there are indicators, interfaces and barcode.
5.1.5 Valid Slots
The slots valid for the SL1 vary with the version of the board.
5.1.6 Board Feature Code
The code behind the board name in the barcode is the board feature code. The board feature code
of the SL1 indicates the optical interface type.
5.1.7 Board Configuration Reference
You can use the T2000 to set parameters for the SL1.
5.1.8 Technical Specifications
The technical specifications of the SL1 cover the optical interface specifications, board
dimensions, weight and power consumption.

5.1.1 Version Description

The SL1 board has three versions: R1, N1 and N2. The difference among the three versions lies
in the support for the TCM function. The R1SL1 is a 1 x STM-1 optical interface board, which
is housed in a divided slot in a subrack.
Table 5-1 lists the details on the versions of the SL1 board.
Table 5-1 Version Description of the SL1

Issue 02 (2007-09-10)

Item

Description

Functional
version

The SL1 has three versions, R1, N1 and N2.

Difference

The N2SL1 supports the TCM function. The N1SL1 and R1SL1 do not
support the TCM function. The R1SL1 is housed in a divided slot.

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Item

Description

Replaceability

The versions cannot be replaced by each other.

5.1.2 Function and Feature

The SL1 is used to transmit and receive STM-1 optical signals, to perform O/E conversion for
the STM-1 optical signals, to extract or insert overhead bytes, and to generate alarm signals.
Table 5-2 lists the functions and features of the SL1.
Table 5-2 Functions and features of the SL1
Function and
Feature

SL1

Basic function

Transmits and receives 1 x STM-1 optical signals.

Specification of
the optical
interface

Supports standard optical interfaces of the I-1, S-1.1, L-1.1, L-1.2 and
Ve-1.2 types. The optical interfaces of the I-1, S-1.1, L-1.1 and L-1.2 types
comply with ITU-T G.957 in features. The optical interface of the Ve-1.2
type complies with the standards defined by Huawei.

Specification of
the optical
module

Supports detection and query of the information on the optical module.

Supports the usage and detection of the pluggable optical module SFP for
easy maintenance.
The optical interface supports the function of setting the on/off state of the
laser and the ALS function.

Service
processing

Supports the processing of the VC-12, VC-3 and VC-4 services.

Overhead
processing

Supports the processing of the SOH bytes of the STM-1 signals.

Supports the transparent transmission and termination of the POH bytes.
Supports the setting and query of the J0/J1/C2 bytes.

Alarm and
performance
event

Provides rich alarms and performance events for easy management and
maintenance of the equipment.

Protection
scheme

Supports the two-fiber bidirectional MSP protection ring, linear MPS,

SNCP, SNCTP and SNCMP.

Maintenance
feature

Supports inloop and outloop for optical interfaces.

Supports warm reset and cold reset. The warm reset does not affect
services.
Supports the function of querying the manufacturing information of the
board.
Supports the in-service loading of the FPGA.
Supports the upgrade of the board software without affecting services.

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5.1.3 Working Principle and Signal Flow

The SL1 board consists of the O/E conversion module, CDR module, SDH overhead processing
module, RST and so on.
Figure 5-1 shows the block diagram for the working principle of the SL1.
Figure 5-1 Block diagram for the working principle of the SL1
155 MHz

155Mbit/s
155Mbit/s

O/E

S
P
I

O/E

155Mbit/s

O/E

K1 and K2

K1 and K2 insertion/extration

High speed bus

....

155Mbit/s

O/E

155Mbit/s

CDR

Cross-connect unit

Cross-connect unit

155Mbit/s

....
155Mbit/s

Reference clock

155 MHz
PLL

155Mbit/s

S
P
I

CDR

RST

MST

MSA

High speed bus

155Mbit/s
155Mbit/s

DCC
SDH overhead processing module

IIC
LOS
Laser shut down

Communication
and control
module
+3.3 V

+5 V
+1.8 V

DC/DC
converter

Cross-connect unit A

HPT

DC/DC
converter

Frame header
Communication

Fuse

Cross-connect unit B

SCC unit

Cross-connect unit
SCC unit

-48 V/ -60 V
-48 V/ -60 V

Fuse

+3.3 V

+3.3 V
backup power

PLL: phase-locked loop

SPI: SDH physical interface

RST: regenerator section

termination

MST: multiplex section termination MSA: multiplex section adaptation

HPT: higher order path termination IIC: inter-integrated circuit

SDH: synchronous digital hierarchy

CDR: clock and data recovery

The function modules of the STM-1 units are described below:

O/E Conversion Module

l

In the receive direction, the module converts the received optical signals into electrical
signals.

In the transmit direction, the module converts the electrical signals into SDH optical signals,
and then sends optical signals to fibers for transmission.

The SPI detects the R_LOS alarm and provides function to shut down the laser.

It recovers the data signal and the clock signal.

CDR Module

SDH Overhead Processing Module

l

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This module includes RST, MST, MSA and HPT. It provides inloop and outloop function.
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RST
l

In the receive direction, RST performs frame alignment detection (A1, A2), regenerator
section trace recovery (J0) and mismatch detection, BIP-8 errored block count.

In the transmit direction, RST performs frame alignment insertion, regenerator section path
trace insertion, BIP-8 calculation and insertion.

In the receive direction, MST performs BIP-24 errored block count, multiplex sectionremote error indication (MS_REI) recovery, multiplex section-remote defect indication
(MS_RDI) and multiplex section-alarm indication signal (MS_AIS) detection.

In the transmit direction, MST performs BIP-24 calculation and insertion, MS_REI
MS_RDI and MS_AIS insertion.

MST provides extraction or insertion of K1 byte and K2 byte.

In the receive direction, MSA performs AU4's pointer interpretation, LOP and AIS
detection, pointer justification.

In the transmit direction, MST it performs administration unit group (AUG) assembly,
AU-4 pointer generation, AU_AIS generation.

OH termination

J1 path trace message recovery

REI information recovering

HP_RDI detection (path status monitoring)

UNEQ and AIS detection (signal label monitoring)

VC-4 BIP-8 errored block count

MST

MSA

HPT

Communication and Control Module

l

Manages and configures other modules of the boards.

Performs inter-board communication through internal Ethernet interface.

Traces the clock signal from the active and the standby cross-connect units.

Controls the laser.

Realizes the pass-through of orderwire and embedded control channel (ECC) bytes between
the paired slots constituting the add/ drop multiplexer (ADM) when the CXL is not online.

Selects the clock and frame header from the active or the standby cross-connect units.

Controls the indicator on the board.

DC/DC Converter
It provides the board with required DC voltages. It converts the 48/60 V power supply to the
following voltages: + 3.3 V, + 1.8 V, + 5 V. It also provides protection for +3.3 V power supply.
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5.1.4 Front Panel

On the front panel of the N1L1/N2SL1, there are indicators, interfaces, barcode and laser safety
class label. On the front panel of the R1SL1, there are indicators, interfaces and barcode.

Appearance of the Front Panel

Figure 5-2 shows the appearance of the front panel of the N1SL1/N2SL1.
Figure 5-2 Front panel of the N1SL1/N2SL1
SL1
STAT
ACT
PROG
SRV
CLASS1
LASER
PRODUCT

OUT

IN

SL1

Figure 5-3 shows the appearance of the front panel of the R1SL1.

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Figure 5-3 Front panel of the R1SL1

SL1
STAT
ACT
PROG
SRV

OUT IN

SL1

Indicators
The following indicators are present on the front panel of the board:
l

Board hardware state indicator (STAT), which is green or red when lit.

Service activating state indicator (ACT), which is green when lit.

Board software state indicator (PROG), which is green or red when lit.

Service alarm indicator (SRV), which is red, green or yellow when lit.

For indication of these indicators, see A Equipment and Board Alarm Indicators.

Interfaces
There is one pair of optical interfaces on the front panel of the SL1. Table 5-3 lists the type and
usage of the optical interfaces.
Table 5-3 Optical interfaces of the SL1
Interfaces on the
Front Panel

Interface Type

Usage

IN

LC

Receives optical signals.

OUT

LC

Transmits optical signals.

5.1.5 Valid Slots

The slots valid for the SL1 vary with the version of the board.
The slots valid for the SL1 are as follows:
l

5-8

The R1SL1 can be housed in any of slots 23, 69 and 1213 in the OptiX OSN 1500A
subrack.
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The N1SL1 can be housed in any of slots 1213 in the OptiX OSN 1500A subrack.

The N2SL1 can be housed in any of slots 1213 in the OptiX OSN 1500A subrack.

The R1SL1 can be housed in any of slots 13, 69 and 1113 in the OptiX OSN 1500B
subrack.

The N1SL1 can be housed in any of slots 1113 in the OptiX OSN 1500B subrack.

The N2SL1 can be housed in any of slots 1113 in the OptiX OSN 1500B subrack.

5.1.6 Board Feature Code

The code behind the board name in the barcode is the board feature code. The board feature code
of the SL1 indicates the optical interface type.
Table 5-4 lists the relation between the board feature code and optical interface type for the SL1.
Table 5-4 Relation between the board feature code and the optical interface type
Board

Feature Code

Optical Interface Type

SSN1SL110, SSN2SL110

10

S-1.1

SSN1SL111, SSN2SL111

11

L-1.1

SSN1SL112, SSN2SL112

12

L-1.2

SSN1SL113, SSN2SL113

13

Ve-1.2

SSN1SL114, SSN2SL114

14

I-1

5.1.7 Board Configuration Reference

You can use the T2000 to set parameters for the SL1.
You can use the T2000 to set the following parameters for the SL1:
l

J0

J1

C2

For details on the parameters, refer to F Board Configuration Reference.

5.1.8 Technical Specifications

The technical specifications of the SL1 cover the optical interface specifications, board
dimensions, weight and power consumption.

Optical Interface Specifications

Table 5-5 lists the specifications of the optical interfaces of the SL1.

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Table 5-5 Specifications of the optical interfaces of the SL1

Item

Specification

Nominal
bit rate

155.52 Mbit/s

Line code

NRZ

Optical
interface
type

I-1

S-1.1

L-1.1

L-1.2

Ve-1.2

Optical
source type

MLM

MLM

MLM, SLM

SLM

SLM

Working
wavelengt
h (nm)

12601360

12611360

12631360

14801580

14801580

Launched
optical
power
(dBm)

15 to 8

15 to 8

5 to 0

5 to 0

3 to 0

Receiver
sensitivity
(dBm)

23

28

34

34

34

Overload
optical
power
(dBm)

10

10

10

Min.
extinction
ratio (dB)

8.2

8.2

10

10

10

Note: MLM indicates the multi-longitudinal mode and SLM indicates the single-longitudinal
mode.

Laser Safety Class

The safety class of the laser on the board is CLASS 1.
The maximum launched optical power of the optical interfaces is lower than 10 dBm (10 mW).

Mechanical Specifications
The mechanical specifications of the N1SL1/N2SL1 are as follows:
l

Board dimensions (mm): 262.05 (H) x 220 (D) x 25.4 (W)

Weight (kg): 1.0

The mechanical specifications of the R1SL1 are as follows:

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Board dmensions (mm): 111.8 (H) x 220 X (D) x 25.4 (W)

Weight (kg): 0.3

5 SDH Processing Boards

Power Consumption
In the normal temperature (25), the maximum power consumption of the N1SL1/N2SL1 is
14 W.
In the normal temperature (25), the maximum power consumption of the R1SL1 is 10.3 W.

5.2 SLQ1
This section describes the SLQ1, a 4 x STM-1 optical interface board, in terms of the version,
function, working principle, front panel and parameters.
5.2.1 Version Description
The SLQ1 board has three versions, R1, N1 and N2. The difference among the three versions
lies in the support for the TCM function. The R1SLQ1 is a 4 x STM-1 optical interface board,
which is housed in a divided slot in a subrack.
5.2.2 Function and Feature
The SLQ1 is used to transmit and receive STM-1 optical signals, to perform O/E conversion for
the STM-1 optical signals, to extract or insert overhead bytes, and to generate alarm signals.
5.2.3 Working Principle and Signal Flow
The SLQ1 board consists of the O/E conversion module, CDR module, SDH overhead
processing module, RST and so on.
5.2.4 Front Panel
On the front panel of the N1SLQ1/N2SLQ1, there are indicators, interfaces, barcode and laser
safety class label.On the front panel of the R1SLQ1, there are indicators, interfaces and barcode.
5.2.5 Valid Slots
The slots valid for the SLQ1 vary with the version of the board.
5.2.6 Board Feature Code
The code behind the board name in the barcode is the board feature code. The board feature code
of the SLQ1 indicates the optical interface type.
5.2.7 Board Configuration Reference
You can use the T2000 to set parameters for the SLQ1.
5.2.8 Technical Specifications
The technical specifications of the SLQ1 cover the optical interface specifications, board
dimensions, weight and power consumption.

5.2.1 Version Description

The SLQ1 board has three versions, R1, N1 and N2. The difference among the three versions
lies in the support for the TCM function. The R1SLQ1 is a 4 x STM-1 optical interface board,
which is housed in a divided slot in a subrack.
Table 5-6 lists the details on the versions of the SLQ1 board.
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Table 5-6 Version Description of the SLQ1

Item

Description

Functional
version

The SLQ1 has three versions, R1, N1 and N2.

Difference

The N2SLQ1 supports the TCM function. The N1SLQ1 and R1SLQ1
do not support the TCM function. The R1SLQ1 is housed in a divided
slot.

Replaceability

The versions cannot be replaced by each other.

5.2.2 Function and Feature

The SLQ1 is used to transmit and receive STM-1 optical signals, to perform O/E conversion for
the STM-1 optical signals, to extract or insert overhead bytes, and to generate alarm signals.
Table 5-7 lists the functions and features of the SLQ1.
Table 5-7 Functions and features of the SLQ1
Function and
Feature

SLQ1

Basic function

Transmits and receives 4 x STM-1 optical signals.

Specification of
the optical
interface

Supports standard optical interfaces of the I-1, S-1.1, L-1.1, L-1.2 and
Ve-1.2 types. The optical interfaces of the I-1, S-1.1, L-1.1 and L-1.2 types
comply with ITU-T G.957 in features. The optical interface of the Ve-1.2
type complies with the standards defined by Huawei.

Specification of
the optical
module

Supports detection and query of the information on the optical module.

The optical interface supports the function of setting the on/off state of
the laser and the ALS function.
Supports the usage and detection of the pluggable optical module SFP for
easy maintenance.

Service
processing

Supports the processing of the VC-12, VC-3 and VC-4 services.

Overhead
processing

Supports the processing of the SOH bytes of the STM-1 signals.

Supports the transparent transmission and termination of the POH bytes.
Supports the setting and query of the J0/J1/C2 bytes.
Supports one to four channels of ECC communication.

5-12

Alarm and
performance
event

Provides rich alarms and performance events for easy management and
maintenance of the equipment.

Protection
scheme

Supports the two-fiber unidirectional MSP protection ring, linear MSP,

SNCP, SNCTP and SNCMP.

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Function and
Feature

SLQ1

Maintenance
feature

Supports inloop and outloop for optical interfaces.

Supports warm reset and cold reset. The warm reset does not affect
services.
Supports the function of querying the manufacturing information of the
board.
Supports the in-service loading of the FPGA.
Supports the upgrade of the board software without affecting services.

5.2.3 Working Principle and Signal Flow

The SLQ1 board consists of the O/E conversion module, CDR module, SDH overhead
processing module, RST and so on.
Figure 5-4 shows the block diagram for the working principle of the SLQ1.
Figure 5-4 Block diagram for the working principle of the SLQ1
155 MHz

155Mbit/s
155Mbit/s

O/E
O/E

S
P
I

155Mbit/s

O/E

K1 and K2

K1 and K2 insertion/extration

High speed bus

....

155Mbit/s

O/E

155Mbit/s

CDR

Cross-connect unit

Cross-connect unit

155Mbit/s

....
155Mbit/s

Reference clock

155 MHz
PLL

155Mbit/s

S
P
I

CDR

RST

MST

MSA

HPT
High speed bus

155Mbit/s
155Mbit/s

DCC
SDH overhead processing module

IIC
LOS
Laser shut down

Communication
and control
module
+3.3 V

+5 V
+1.8 V

DC/DC
converter

Cross-connect unit A

DC/DC
converter

Frame header
Communication

Fuse

Cross-connect unit B

SCC unit

Cross-connect unit
SCC unit

-48 V/ -60 V
-48 V/ -60 V

Fuse

+3.3 V

+3.3 V
backup power

PLL: phase-locked loop

SPI: SDH physical interface

RST: regenerator section

termination

MST: multiplex section termination MSA: multiplex section adaptation

HPT: higher order path termination IIC: inter-integrated circuit

SDH: synchronous digital hierarchy

CDR: clock and data recovery

The function modules of the STM-1 units are described below:

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O/E Conversion Module

l

In the receive direction, the module converts the received optical signals into electrical
signals.

In the transmit direction, the module converts the electrical signals into SDH optical signals,
and then sends optical signals to fibers for transmission.

The SPI detects the R_LOS alarm and provides function to shut down the laser.

It recovers the data signal and the clock signal.

CDR Module

SDH Overhead Processing Module

l

This module includes RST, MST, MSA and HPT. It provides inloop and outloop function.

In the receive direction, RST performs frame alignment detection (A1, A2), regenerator
section trace recovery (J0) and mismatch detection, BIP-8 errored block count.

In the transmit direction, RST performs frame alignment insertion, regenerator section path
trace insertion, BIP-8 calculation and insertion.

In the receive direction, MST performs BIP-24 errored block count, multiplex sectionremote error indication (MS_REI) recovery, multiplex section-remote defect indication
(MS_RDI) and multiplex section-alarm indication signal (MS_AIS) detection.

In the transmit direction, MST performs BIP-24 calculation and insertion, MS_REI
MS_RDI and MS_AIS insertion.

MST provides extraction or insertion of K1 byte and K2 byte.

In the receive direction, MSA performs AU4's pointer interpretation, LOP and AIS
detection, pointer justification.

In the transmit direction, MST it performs administration unit group (AUG) assembly,
AU-4 pointer generation, AU_AIS generation.

OH termination

J1 path trace message recovery

REI information recovering

HP_RDI detection (path status monitoring)

UNEQ and AIS detection (signal label monitoring)

VC-4 BIP-8 errored block count

RST

MST

MSA

HPT

Communication and Control Module

l

5-14

Manages and configures other modules of the boards.

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Performs inter-board communication through internal Ethernet interface.

Traces the clock signal from the active and the standby cross-connect units.

Controls the laser.

Realizes the pass-through of orderwire and embedded control channel (ECC) bytes between
the paired slots constituting the add/ drop multiplexer (ADM) when the CXL is not online.

Selects the clock and frame header from the active or the standby cross-connect units.

Controls the indicator on the board.

DC/DC Converter
It provides the board with required DC voltages. It converts the 48/60 V power supply to the
following voltages: + 3.3 V, + 1.8 V, + 5 V. It also provides protection for +3.3 V power supply.

5.2.4 Front Panel

On the front panel of the N1SLQ1/N2SLQ1, there are indicators, interfaces, barcode and laser
safety class label.On the front panel of the R1SLQ1, there are indicators, interfaces and barcode.

Appearance of the Front Panel

Figure 5-5 shows the appearance of the front panel of the N1SLQ1/N2SLQ1.
Figure 5-5 Front panel of the N1SLQ1/N2SLQ1
SLQ1
STAT
ACT
PROG
SRV
CLASS1
LASER
PRODUCT

OUT1 IN1
OUT2 IN2
OUT3 IN3
OUT4 IN4

SLQ1

Figure 5-6 shows the appearance of the front panel of the R1SLQ1.
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Figure 5-6 Front panel of the R1SLQ1

SLQ1
STAT
ACT
PROG
SRV

OUT1 IN1 OUT2 IN2 OUT3 IN3 OUT4 IN4

SLQ1

Indicators
The following indicators are present on the front panel of the board:
l

Board hardware state indicator (STAT), which is green or red when lit.

Service activating state indicator (ACT), which is green when lit.

Board software state indicator (PROG), which is green or red when lit.

Service alarm indicator (SRV), which is red, green or yellow when lit.

For indication of these indicators, see A Equipment and Board Alarm Indicators.

Interfaces
There are four pairs of optical interfaces on the front panel of the SLQ1. Table 5-8 lists the type
and usage of the optical interfaces.
Table 5-8 Optical interfaces of the SLQ1
Interfaces

Interface Type

Usage

IN1-IN4

LC

Receives optical signals.

OUT1-OUT4

LC

Transmits optical signals.

5.2.5 Valid Slots

The slots valid for the SLQ1 vary with the version of the board.
The slots valid for the SLQ1 are as follows:
l

5-16

The R1SLQ1 can be housed in any of slots 23, 69 and 1213 in the OptiX OSN 1500A
subrack.
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The N1SLQ1 can be housed in any of slots 1213 in the OptiX OSN 1500A subrack.

The N2SLQ1 can be housed in any of slots 1213 in the OptiX OSN 1500A subrack.

The R1SLQ1 can be housed in any of slots 13, 69 and 1113 in the OptiX OSN 1500B
subrack.

The N1SLQ1 can be housed in any of slots 1113 in the OptiX OSN 1500B subrack.

The N2SLQ1 can be housed in any of slots 1113 in the OptiX OSN 1500B subrack.

5.2.6 Board Feature Code

The code behind the board name in the barcode is the board feature code. The board feature code
of the SLQ1 indicates the optical interface type.
Table 5-9 lists the relation between the board feature code and optical interface type for the
SLQ1.
Table 5-9 Relation between the board feature code and the optical interface type
Board

Feature Code

Optical Interface Type

SSN2SLQ110,
SSN1SLQ110

10

S-1.1

SSN2SLQ111,
SSN1SLQ111

11

L-1.1

SSN2SLQ112,
SSN1SLQ112

12

L-1.2

SSN2SLQ113,
SSN1SLQ113

13

Ve-1.2

SSN2SLQ114,
SSN1SLQ114

14

I-1

5.2.7 Board Configuration Reference

You can use the T2000 to set parameters for the SLQ1.
You can use the T2000 to set the following parameters for the SLQ1:
l

J0

J1

C2

For details on the parameters, refer to F Board Configuration Reference.

5.2.8 Technical Specifications

The technical specifications of the SLQ1 cover the optical interface specifications, board
dimensions, weight and power consumption.

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Optical Interface Specifications

Table 5-10 lists the specifications of the optical interfaces of the SLQ1.
Table 5-10 Specifications of the optical interfaces of the SLQ1
Item

Specification

Nominal bit
rate

155.52 Mbit/s

Line code

NRZ

Optical
interface type

I-1

S-1.1

L-1.1

L-1.2

Ve-1.2

Optical source
type

MLM

MLM

MLM,
SLM

SLM

SLM

Working
wavelength
(nm)

12601360

12611360

12631360

14801580

14801580

Launched
optical power
(dBm)

15 to 8

15 to 8

5 to 0

5 to 0

3 to 0

Receiver
sensitivity
(dBm)

23

28

34

34

34

Overload
optical power
(dBm)

10

10

10

Min. extinction
ratio (dB)

8.2

8.2

10

10

10

Laser Safety Class

The safety class of the laser on the board is CLASS 1.
The maximum launched optical power of the optical interfaces is lower than 10 dBm (10 mW).

Mechanical Specifications
The mechanical specifications of the N1SLQ1/N2SLQ1 are as follows:
l

Board dimensions (mm): 262.05 (H) x 220 (D) x 25.4 (W)

Weight (kg): 1.0

The mechanical specifications of the R1SLQ1 are as follows:

5-18

Board dmensions (mm): 111.8 (H) x 220 X (D) x 25.4 (W)

Weight (kg): 0.4

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Power Consumption
In the normal temperature (25), the maximum power consumption of the N1SLQ1/
N2SLQ1 is 15 W.
In the normal temperature (25), the maximum power consumption of the R1SLQ1 is 12 W.

5.3 SLO1
This section describes the SLO1, an 8 x STM-1 optical interface board, in terms of the version,
function, working principle, front panel and parameters.
5.3.1 Version Description
The functional version of the SLO1 board is N1.
5.3.2 Function and Feature
The SLO1 is used to access 8 x STM-1 optical signals, to perform the O/E conversion to the
signals, to insert or extract the overhead bytes, and to generate alarm signals.
5.3.3 Working Principle and Signal Flow
The SLO1 board consists of the O/E conversion module, CDR module, SDH overhead
processing module, RST and so on.
5.3.4 Front Panel
On the front panel of the SLO1, there are indicators, interfaces, barcode and laser safety class
label.
5.3.5 Valid Slots
If the SLO1 is housed in any of slots 1213 of the OptiX OSN 1500A subrack, one to eight
optical interfaces can be configured. If the SLO1 is housed in any of slots 1113 of the OptiX
OSN 1500B subrack, one to eight optical interfaces can be configured.
5.3.6 Board Feature Code
The code behind the board name in the barcode is the board feature code. The board feature code
of the SLO1 indicates the optical interface type.
5.3.7 Board Configuration Reference
You can use the T2000 to set parameters for the SLO1.
5.3.8 Technical Specifications
The technical specifications of the SLO1 cover the optical interface specifications, board
dimensions, weight and power consumption.

5.3.1 Version Description

The functional version of the SLO1 board is N1.

5.3.2 Function and Feature

The SLO1 is used to access 8 x STM-1 optical signals, to perform the O/E conversion to the
signals, to insert or extract the overhead bytes, and to generate alarm signals.
Table 5-11 lists the functions and features of the SLO1.
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Table 5-11 Functions and features of the SLO1 board

Function and
Feature

SLO1

Basic function

Receives and transmits 8 x STM-1 optical signals.

Specification of the
optical interface

Supports standard optical interfaces of the I-1.1, S-1.1, L-1.1, L-1.2

and Ve-1.2 types. The optical interfaces of the I-1, S-1.1, L-1.1 and
L-1.2 types comply with ITU-T G.957 in features. The optical interface
of the Ve-1.2 type complies with the standards defined by Huawei.

Specification of the
optical module

The optical module is pluggable. When optical modules of other types

are inserted, an alarm indicating the mismatch of the optical module is
reported.
Supports detection and query of the information on the optical module.
Supports the default off state of the laser. The laser is turned off before
the software finishes the initialization when the board is powered on.
Supports the usage and detection of the pluggable optical module SFP.
Supports the setting and query of the on/off state of the laser. An alarm
is generated when the laser is turned off. Performance events are
reported to indicate the performance of the optical module.

Service processing

Supports the processing of the VC-12, VC-3 and VC-4 services.

Overhead
processing

Supports the processing of the SOH bytes of the STM-1 signals.

Supports the transparent transmission and termination of the POH
bytes.
If the two SCC boards are not in service, the SLO1 does not transmit
overhead bytes (long 0s) to the two SCC boards.
Supports one to eight channels of ECC communication.

Alarm and
performance event

Provides rich alarms and performance events for easy management and
maintenance of the equipment.

Protection scheme

Supports the two-fiber unidirectional MSP protection ring, linear MSP,

SNCP, SNCTP and SNCMP.

Maintenance
feature

Supports inloop and outloop for optical interfaces.

Supports warm reset and cold reset. The warm reset does not affect
services.
Supports the function of querying the manufacturing information of
the board.
Supports the in-service loading of the FPGA.
Supports the upgrade of the board software without affecting services.

5.3.3 Working Principle and Signal Flow

The SLO1 board consists of the O/E conversion module, CDR module, SDH overhead
processing module, RST and so on.
Figure 5-7 shows the block diagram for the working principle of the SLO1.
5-20

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Figure 5-7 Block diagram for the working principle of the SLO1
155 MHz

155Mbit/s
155Mbit/s

O/E

S
P
I

O/E

155Mbit/s

O/E

K1 and K2

K1 and K2 insertion/extration

High speed bus

....

155Mbit/s

O/E

155Mbit/s

CDR

Cross-connect unit

Cross-connect unit

155Mbit/s

....
155Mbit/s

Reference clock

155 MHz
PLL

155Mbit/s

S
P
I

CDR

RST

MST

MSA

HPT
High speed bus

155Mbit/s
155Mbit/s

DCC
SDH overhead processing module

IIC
LOS
Laser shut down

Communication
and control
module
+3.3 V

+5 V
+1.8 V

DC/DC
converter

Cross-connect unit A

DC/DC
converter

Frame header
Communication

Fuse

Cross-connect unit B

SCC unit

Cross-connect unit
SCC unit

-48 V/ -60 V
-48 V/ -60 V

Fuse

+3.3 V

+3.3 V
backup power

PLL: phase-locked loop

SPI: SDH physical interface

RST: regenerator section

termination

MST: multiplex section termination MSA: multiplex section adaptation

HPT: higher order path termination IIC: inter-integrated circuit

SDH: synchronous digital hierarchy

CDR: clock and data recovery

The function modules of the STM-1 units are described below:

O/E Conversion Module

l

In the receive direction, the module converts the received optical signals into electrical
signals.

In the transmit direction, the module converts the electrical signals into SDH optical signals,
and then sends optical signals to fibers for transmission.

The SPI detects the R_LOS alarm and provides function to shut down the laser.

It recovers the data signal and the clock signal.

CDR Module

SDH Overhead Processing Module

l

This module includes RST, MST, MSA and HPT. It provides inloop and outloop function.

In the receive direction, RST performs frame alignment detection (A1, A2), regenerator
section trace recovery (J0) and mismatch detection, BIP-8 errored block count.

In the transmit direction, RST performs frame alignment insertion, regenerator section path
trace insertion, BIP-8 calculation and insertion.

RST

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MST
l

In the receive direction, MST performs BIP-24 errored block count, multiplex sectionremote error indication (MS_REI) recovery, multiplex section-remote defect indication
(MS_RDI) and multiplex section-alarm indication signal (MS_AIS) detection.

In the transmit direction, MST performs BIP-24 calculation and insertion, MS_REI
MS_RDI and MS_AIS insertion.

MST provides extraction or insertion of K1 byte and K2 byte.

In the receive direction, MSA performs AU4's pointer interpretation, LOP and AIS
detection, pointer justification.

In the transmit direction, MST it performs administration unit group (AUG) assembly,
AU-4 pointer generation, AU_AIS generation.

OH termination

J1 path trace message recovery

REI information recovering

HP_RDI detection (path status monitoring)

UNEQ and AIS detection (signal label monitoring)

VC-4 BIP-8 errored block count

MSA

HPT

Communication and Control Module

l

Manages and configures other modules of the boards.

Performs inter-board communication through internal Ethernet interface.

Traces the clock signal from the active and the standby cross-connect units.

Controls the laser.

Realizes the pass-through of orderwire and embedded control channel (ECC) bytes between
the paired slots constituting the add/ drop multiplexer (ADM) when the CXL is not online.

Selects the clock and frame header from the active or the standby cross-connect units.

Controls the indicator on the board.

DC/DC Converter
It provides the board with required DC voltages. It converts the 48/60 V power supply to the
following voltages: + 3.3 V, + 1.8 V, + 5 V. It also provides protection for +3.3 V power supply.

5.3.4 Front Panel

On the front panel of the SLO1, there are indicators, interfaces, barcode and laser safety class
label.
Figure 5-8 shows the front panel of the SLO1.
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Figure 5-8 Front panel of the SLO1

SLO1
STAT
ACT
PROG
SRV

OUT1 IN1
OUT2
IN2
OUT3 IN3 OUT4
IN4
OUT5 IN5
OUT6
IN6
OUT7 IN7
OUT8 IN8
CLASS1
LASER
PRODUCT

SLO1

Indicators
The following indicators are present on the front panel of the board:
l

Board hardware state indicator (STAT), which is green or red when lit.

Service activating state indicator (ACT), which is green when lit.

Board software state indicator (PROG), which is green or red when lit.

Service alarm indicator (SRV), which is red, green or yellow when lit.

For indication of these indicators, see A Equipment and Board Alarm Indicators.

Interfaces
There are eight pairs of optical interfaces on the front panel of the SLO1. Table 5-12 lists the
type and usage of the optical interfaces.
Table 5-12 Optical interfaces of the SLO1

Issue 02 (2007-09-10)

Interfaces

Interface Type

Usage

IN1IN8

LC

Receives optical signals.

OUT1OUT8

LC

Transmits optical signals.

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NOTE

The optical interfaces of the SLO1 are level optical interfaces and indented by 20 mm. The SLO1 board
can use the pluggable optical modules for easy maintenance.

WARNING
The optical interfaces of the SLO1 board are level optical interfaces. Thus, use the optical
attenuator only at the ODF side.

5.3.5 Valid Slots

If the SLO1 is housed in any of slots 1213 of the OptiX OSN 1500A subrack, one to eight
optical interfaces can be configured. If the SLO1 is housed in any of slots 1113 of the OptiX
OSN 1500B subrack, one to eight optical interfaces can be configured.

5.3.6 Board Feature Code

The code behind the board name in the barcode is the board feature code. The board feature code
of the SLO1 indicates the optical interface type.
Table 5-13 lists the relation between the board feature code and optical interface type for the
SLO1.
Table 5-13 Relation between the board feature code and the optical interface type
Board

Feature Code

Optical Interface Type

SSN2SLO110

10

S-1.1

SSN2SLO111

11

L-1.1

SSN2SLO112

12

L-1.2

SSN2SLO113

13

Ve-1.2

SSN2SLO114

14

I-1

5.3.7 Board Configuration Reference

You can use the T2000 to set parameters for the SLO1.
You can use the T2000 to set the following parameters for the SLO1:
l

J0

J1

C2

For details on the parameters, refer to F Board Configuration Reference.

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5.3.8 Technical Specifications

The technical specifications of the SLO1 cover the optical interface specifications, board
dimensions, weight and power consumption.

Optical Interface Specifications

Table 5-14 lists the specifications of the optical interfaces of the SLO1.
Table 5-14 Specifications of the optical interfaces of the SLO1
Item

Specification

Nominal bit rate

155520 kbit/s

Line code

NRZ

Optical interface
type

I-1.1

S-1.1

L-1.1

L-1.2

Ve-1.2

Optical source type

MLM

MLM

MLM,
SLM

SLM

SLM

Working
wavelength (nm)

12611360

1261
1360

1263
1360

1480
1580

1480
1580

Launched optical
power (dBm)

15 to 8

15 to 8

5 to 0

5 to 0

3 to 0

Receiver
sensitivity (dBm)

23

28

34

34

34

Overload optical
power (dBm)

10

10

10

Min. extinction
ratio (dB)

8.2

8.2

10

10

10

Laser Safety Class

The safety class of the laser on the board is CLASS 1.
The maximum launched optical power of the optical interfaces is lower than 10 dBm (10 mW).

Mechanical Specifications
The mechanical specifications of the SLO1 are as follows:
l

Board dimensions (mm): 262.05 (H) x 220 (D) x 25.4 (W)

Weight (kg): 1.1

Power Consumption
In the normal temperature (25), the maximum power consumption of the SLO1 is 26W.
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5.4 SLT1
This section describes the SLT1, a 12 x STM-1 optical interface board, in terms of the version,
function, working principle, front panel and specifications.
5.4.1 Version Description
The functional version of the SLT1 board is N1.
5.4.2 Function and Feature
The SLT1 is used to transmit and receive STM-1 optical signals, to perform O/E conversion for
STM-1 optical signals, to extract or insert overhead bytes, and to generate alarm signals.
5.4.3 Working Principle and Signal Flow
The SLT1 board consists of the O/E conversion module, CDR module, SDH overhead processing
module, RST and so on. The external services are accessed by the external interface boards EU08
and OU08 . The EU08 is an electrical interface board, and the OU08 is an optical interface board.
5.4.4 Front Panel
On the front panel of the SLT1, there are indicators, interfaces, barcode and laser safety class
label.
5.4.5 Valid Slots
The SLT1, housed in any of slots 1213 of the OptiX OSN 1500A subrack, one to twelve optical
interfaces can be configured. For the SLT1, housed in any of slots 1113 of the OptiX OSN
1500B subrack, one to twelve optical interfaces can be configured.
5.4.6 Board Configuration Reference
You can use the T2000 to set parameters for the SLT1.
5.4.7 Technical Specifications
The technical specifications of the SLT1 cover the optical interface specifications, board
dimensions, weight and power consumption.

5.4.1 Version Description

The functional version of the SLT1 board is N1.

5.4.2 Function and Feature

The SLT1 is used to transmit and receive STM-1 optical signals, to perform O/E conversion for
STM-1 optical signals, to extract or insert overhead bytes, and to generate alarm signals.
Table 5-15 lists the functions and features of the SLT1.
Table 5-15 Functions and features of the SLT1

5-26

Function and
Feature

SLT1

Basic function

Transmits and receives 12 x STM-1 optical signals.

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Function and
Feature

SLT1

Specification of
the optical
interface

Supports S-1.1 standard optical interfaces compliant with ITU-T G.957

in features.

Specification of
the optical
module

Supports detection and query of the information on the optical module.

The optical interface supports the function of setting the on/off state of
the laser and the ALS function.
Supports the usage and detection of the pluggable optical module SFP for
easy maintenance.

Service
processing

Supports the processing of the VC-12, VC-3 and VC-4 services.

Overhead
processing

Supports the processing of the SOH bytes of the STM-1 signals.

Supports the transparent transmission and termination of the POH bytes.
Supports the setting and query of the J0/J1/C2 bytes.
Supports one to eight channels of ECC communication.

Alarm and
performance
event

Provides rich alarms and performance events for easy management and
maintenance of the equipment.

Protection
scheme

Supports the two-fiber unidirectional MSP protection ring, linear MSP

protection ring, SNCP, SNCTP, and SNCMP.

Maintenance
feature

Supports inloop and outloop for optical interfaces.

Supports warm reset and cold reset. The warm reset does not affect
services.
Supports the function of querying the manufacturing information of the
board.
Supports the in-service loading of the FPGA.
Supports the upgrade of the board software without affecting services.

5.4.3 Working Principle and Signal Flow

The SLT1 board consists of the O/E conversion module, CDR module, SDH overhead processing
module, RST and so on. The external services are accessed by the external interface boards EU08
and OU08 . The EU08 is an electrical interface board, and the OU08 is an optical interface board.
Figure 5-9 shows the block diagram for the working principle of the SLT1.

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Figure 5-9 Block diagram for the working principle of the SLT1
155 MHz

155Mbit/s
155Mbit/s

O/E

S
P
I

O/E

155Mbit/s

S
P
I

O/E

K1 and K2

K1 and K2 insertion/extration

High speed bus

....

155Mbit/s

155Mbit/s

O/E

155Mbit/s

Cross-connect unit

Cross-connect unit

155Mbit/s

....
155Mbit/s

CDR

Reference clock

155 MHz
PLL

CDR

RST

MST

MSA

HPT
High speed bus

155Mbit/s
155Mbit/s

DCC
SDH overhead processing module

IIC
LOS
Laser shut down

Communication
and control
module
+3.3 V

+5 V
+1.8 V

DC/DC
converter

Cross-connect unit A

DC/DC
converter

Frame header
Communication

Fuse

Cross-connect unit B

SCC unit

Cross-connect unit
SCC unit

-48 V/ -60 V
-48 V/ -60 V

Fuse

+3.3 V

+3.3 V
backup power

PLL: phase-locked loop

SPI: SDH physical interface

RST: regenerator section

termination

MST: multiplex section termination MSA: multiplex section adaptation

HPT: higher order path termination IIC: inter-integrated circuit

SDH: synchronous digital hierarchy

CDR: clock and data recovery

The function modules of the STM-1 units are described below:

O/E Conversion Module

l

In the receive direction, the module converts the received optical signals into electrical
signals.

In the transmit direction, the module converts the electrical signals into SDH optical signals,
and then sends optical signals to fibers for transmission.

The SPI detects the R_LOS alarm and provides function to shut down the laser.

It recovers the data signal and the clock signal.

CDR Module

SDH Overhead Processing Module

l

This module includes RST, MST, MSA and HPT. It provides inloop and outloop function.

In the receive direction, RST performs frame alignment detection (A1, A2), regenerator
section trace recovery (J0) and mismatch detection, BIP-8 errored block count.

In the transmit direction, RST performs frame alignment insertion, regenerator section path
trace insertion, BIP-8 calculation and insertion.

RST

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MST
l

In the receive direction, MST performs BIP-24 errored block count, multiplex sectionremote error indication (MS_REI) recovery, multiplex section-remote defect indication
(MS_RDI) and multiplex section-alarm indication signal (MS_AIS) detection.

In the transmit direction, MST performs BIP-24 calculation and insertion, MS_REI
MS_RDI and MS_AIS insertion.

MST provides extraction or insertion of K1 byte and K2 byte.

In the receive direction, MSA performs AU4's pointer interpretation, LOP and AIS
detection, pointer justification.

In the transmit direction, MST it performs administration unit group (AUG) assembly,
AU-4 pointer generation, AU_AIS generation.

OH termination

J1 path trace message recovery

REI information recovering

HP_RDI detection (path status monitoring)

UNEQ and AIS detection (signal label monitoring)

VC-4 BIP-8 errored block count

MSA

HPT

Communication and Control Module

l

Manages and configures other modules of the boards.

Performs inter-board communication through internal Ethernet interface.

Traces the clock signal from the active and the standby cross-connect units.

Controls the laser.

Realizes the pass-through of orderwire and embedded control channel (ECC) bytes between
the paired slots constituting the add/ drop multiplexer (ADM) when the CXL is not online.

Selects the clock and frame header from the active or the standby cross-connect units.

Controls the indicator on the board.

DC/DC Converter
It provides the board with required DC voltages. It converts the 48/60 V power supply to the
following voltages: + 3.3 V, + 1.8 V, + 5 V. It also provides protection for +3.3 V power supply.

5.4.4 Front Panel

On the front panel of the SLT1, there are indicators, interfaces, barcode and laser safety class
label.

Appearance of the Front Panel

Figure 5-10 shows the appearance of the front panel of the SLT1.
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Figure 5-10 Front panel of the SLT1

SLT1
STAT
ACT
PROG
SRV
CLASS1
LASER
PRODUCT

OUT1 IN1 OUT2 IN2 OUT3 IN3 OUT4 IN4 OUT5 IN5 OUT6 IN6
OUT7 IN7
OUT8 IN8
OUT9 IN9 OUT10 IN10 OUT11 IN11 OUT12 IN12

SLT1

Indicators
The following indicators are present on the front panel of the board:
l

Board hardware state indicator (STAT), which is green or red when lit.

Service activating state indicator (ACT), which is green when lit.

Board software state indicator (PROG), which is green or red when lit.

Service alarm indicator (SRV), which is red, green or yellow when lit.

For indication of these indicators, see A Equipment and Board Alarm Indicators.

Interfaces
There are 12 pairs of optical interfaces on the front panel of the SLT1. Table 5-16 lists the type
and usage of the optical interfaces.
Table 5-16 Optical interfaces of the SLT1

5-30

Interface

Interface
Type

Usage

IN1-IN12

LC

Receives optical signals.

OUT1-OUT12

LC

Transmits optical signals.

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WARNING
The optical interfaces of the SLT1 board are level optical interfaces. Thus, use the optical
attenuator only at the ODF side.

5.4.5 Valid Slots

The SLT1, housed in any of slots 1213 of the OptiX OSN 1500A subrack, one to twelve optical
interfaces can be configured. For the SLT1, housed in any of slots 1113 of the OptiX OSN
1500B subrack, one to twelve optical interfaces can be configured.

5.4.6 Board Configuration Reference

You can use the T2000 to set parameters for the SLT1.
You can use the T2000 to set the following parameters for the SLT1:
l

J0

J1

C2

For details on the parameters, refer to F Board Configuration Reference.

5.4.7 Technical Specifications

The technical specifications of the SLT1 cover the optical interface specifications, board
dimensions, weight and power consumption.

Optical Interface Specifications

Table 5-17 lists the specifications of the optical interfaces of the SLT1.
Table 5-17 Specifications of the optical interfaces of the SLT1

Issue 02 (2007-09-10)

Item

Specification

Nominal bit rate

155.52 Mbit/s

Line code

NRZ

Optical interface type

S-1.1

Optical source type

MLM

Working wavelength (nm)

12611360

Launched optical power (dBm)

15 to 8

Receiver sensitivity (dBm)

28

Overload optical power (dBm)

Min. extinction ratio (dB)

8.2
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Laser Safety Class

The safety class of the laser on the board is CLASS 1.
The maximum launched optical power of the optical interfaces is lower than 10 dBm (10 mW).

Mechanical Specifications
The mechanical specifications of the SLT1 are as follows:
l

Board dimensions (mm): 262.05 (H) x 220 (D) x 25.4 (W)

Weight (kg): 1.2

Power Consumption
In the normal temperature (25), the maximum power consumption of the SLT1 is 15 W.

5.5 SEP1
This section describes the SEP1 board, in terms of the version, function, working principle, front
panel, and specifications.
5.5.1 Version Description
The functional version of the SEP1 board is N1.
5.5.2 Function and Feature
The SEP1 board processes STM-1 electrical signals.
5.5.3 Working Principle and Signal Flow
The SEP1 board consists of the line interface module and CDR module, SDH overhead
processing module, RST and so on. The external services are accessed by the external interface
boards EU08 and OU08. The EU08 is an electrical interface board, and the OU08 is an optical
interface board.
5.5.4 Front Panel
On the front panel of the SEP1, there are indicators, interfaces and barcode.
5.5.5 Valid Slots
When the SEP1 board is housed in any of slots 1213 of the OptiX OSN 1500A subrack, it
cannot be used with the interface board. In the OptiX OSN 1500B subrack, when interfaces are
available on the front panel of the SEP1 board, it can be housed in any of slots 1113. When the
SEP1 board is used with the interface board, it is defined as SEP. In this case, it can be housed
in any of slots 1213.
5.5.6 TPS Protection for the Board
The TPS protection is equipment-level protection. When the working board fails, the accessed
services are switched to the protection board.
5.5.7 Board Configuration Reference
You can use the T2000 to set parameters for the SEP1.
5.5.8 Technical Specifications
The technical specifications of the SEP1 cover the board dimensions, weight and power
consumption.
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5.5.1 Version Description

The functional version of the SEP1 board is N1.
When interfaces are available on the front panel of the SEP1 (the logical board is displayed as
the SEP1 on the T2000), the SEP1 processes 2 x STM-1 electrical signals. In this case, the SEP1
is a 2 x STM-1 signal processing board. When the SEP1 is used with the interface board (the
logical board is displayed as the SEP on the T2000), the SEP1 processes 8 x STM-1 electrical
signals. In this case, the SEP1 is an 8 x STM-1 signal processing board. The physical boards for
the 2 x STM-1 signal processing board and 8 x STM-1 signal processing board are both the
SEP1. Thus, they are defined as the SEP1 when the logical boards are not differentiated.

5.5.2 Function and Feature

The SEP1 board processes STM-1 electrical signals.
Table 5-18 lists the functions and features of the SEP1.
Table 5-18 Functions and features of the SEP1
Function and
Feature

SEP1

Basic function

Processes 2 x STM-1 signals when interfaces are available on the front

panel.
Processes 8 x STM-1 signals when used with the interface board.

Specification of
the optical
module

Supports detection and query of the information on the optical module.

The optical interface supports the function of setting the on/off state of the
laser and the ALS function.
Supports the usage and monitoring of the pluggable optical module SFP.

Service
processing

Supports the processing of the VC-12, VC-3 and VC-4 services.

Overhead
processing

Supports the processing of the SOH bytes of the STM-1 signals.

Supports the transparent transmission and termination of the POH bytes.
Supports the setting and query of the J0/J1/C2 bytes.

Alarm and
performance
event

Provides rich alarms and performance events for easy management and
maintenance of the equipment.

Protection
scheme

Supports the TPS protection when used with the interface board and the
switching board.
Supports the two-fiber unidirectional MSP protection ring, linear MSP
protection, and SNCP.

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Function and
Feature

SEP1

Maintenance
feature

Supports inloop and outloop for optical interfaces.

Supports warm reset and cold reset. The warm reset does not affect
services.
Supports the function of querying the manufacturing information of the
board.
Supports the in-service loading of the FPGA.
Supports the upgrade of the board software without affecting services.

When the SEP1 is used with different interface boards and electrical interface switching boards,
the access capabilities for the STM-1 signals are different. See Table 5-19.
Table 5-19 Access capabilities for the SEP1
Interface Board

SEP1

None

Accesses and processes 2 x STM-1 electrical signals, and does not

support the TPS protection.

EU08

Accesses and processes 8 x STM-1 electrical signals.

OU08

Accesses and processes 8 x STM-1 optical signals.

EU08+OU08

The hybrid usage is not supported.

EU08+TSB8

Accesses and processes 8 x STM-1 electrical signals, and supports the

TPS protection for the SEP1 board.

CAUTION
When the SEP1 is used with the interface board, the two interfaces on the front panel are invalid.
The hybrid usage of the EU08 and OU08 is not supported.

5.5.3 Working Principle and Signal Flow

The SEP1 board consists of the line interface module and CDR module, SDH overhead
processing module, RST and so on. The external services are accessed by the external interface
boards EU08 and OU08. The EU08 is an electrical interface board, and the OU08 is an optical
interface board.
Figure 5-11 shows the block diagram for the working principle of the SEP1.

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Figure 5-11 Block diagram for the working principle of the SEP1
Reference clock

155 MHz PLL

Cross-connect unit

SDH overhead processing module

K1 and K2
insertion/extration

K1 and K2

high speed
bus
155 Mbit/s
Port 1 155 Mbit/s

CMI

Transfo
rmer
CMI

155 Mbit/s
Port 2 155 Mbit/s

Transfor
mer

SPI
Encode/
Decode
Encode/
Decode

NRZ

CDR

155 Mbit/s

RST

MST

MSA

HPT

NRZ

155 Mbit/s

CDR

155 Mbit/s

DCC

Frame header

LOS

Communication and
control module

Communication

+3.3 V
+1.8 V

high speed
bus

155 Mbit/s

Fuse

DC/DC
converter

DC/DC
converter

Cross-connect unit

Cross-connect
unit A
Cross-connect
unit B

SCC unit

Cross-connect
unit
SCC unit

-48 V/ -60 V
-48 V/ -60 V

Fuse

+3.3 V backup
power

Figure 5-12 shows the block diagram for the working principle of the SEP used with the EU08.
Figure 5-12 Block diagram for the working principle of the SEP used with the EU08
Reference clock

155 MHz PLL

EU08
155 Mbit/s
Port 1

Port 8

155 Mbit/s

Transfo
rmer

155 Mbit/s
155 Mbit/s

155 Mbit/s
Port 1 155 Mbit/s
Port 2

SPI

Transfo
rmer

CMI

Encode
/
Decode

CDR

Encode
/
Decode

CDR

CMI

Transfo
rmer

Encode/
Decode
CMI

155 Mbit/s
155 Mbit/s

CMI

Transfor
mer

NRZ

CDR

SDH overhead processing

module

K1 and K2
insertion/extration

Cross-connect
unit

155 Mbit/s
high speed
bus

155 Mbit/s

155 Mbit/s

RST

CDR

MST

MSA

high speed
bus

HPT

DCC

Communication and
control module
+3.3 V

DC/DC
converter

Cross-connect unit
A
Cross-connect unit
B

155 Mbit/s
155 Mbit/s

LOS

+1.8 V

K1 and K2

155 Mbit/s
NRZ

Encode/
Decode

155 Mbit/s
155 Mbit/s

Cross-connect
unit

DC/DC
converter

Frame header
Communication

Fuse

SCC unit

Cross-connect unit
SCC unit

-48 V/ -60 V
-48 V/ -60 V

Fuse

+3.3 V backup
power

Figure 5-13 shows the block diagram for the working principle of the SEP used with the OU08.
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Figure 5-13 Block diagram for the working principle of the SEP used with the OU08

O/E

155 Mbit/s
Port 1 155 Mbit/s

O/E

Port 8 155 Mbit/s

O/E

Reference clock

155 MHz PLL

OU08
NRZ

155 Mbit/s

CDR

SDH overhead processing module

155 Mbit/s

S
P
I

NRZ

K1 and K2
insertion/extration

K1 and K2

high speed
bus

155 Mbit/s

O/E

Port 1

Port 2

155 Mbit/s
155 Mbit/s

Transfo
rmer

155 Mbit/s
155 Mbit/s Transfor

SPI
Encode/
Decode

CMI

NRZ

Encode/
Decode

mer

155 Mbit/s

CDR

RST

MST

MSA

HPT

high speed
bus

155 Mbit/s
NRZ

CMI

CDR

LOS

DCC

Communication and
control module

LOS
Laser shut down
+3.3 V

DC/DC
converter

Cross-connect unit A

Cross-connect unit
B

155 Mbit/s
155 Mbit/s

+1.8 V

Cross-connect unit

155 Mbit/s

CDR

155 Mbit/s

Cross-connect unit

DC/DC
converter

Frame header
Communication

Fuse

SCC unit

Cross-connect unit
SCC unit

-48 V/ -60 V
-48 V/ -60 V

Fuse

+3.3 V backup
power

The function modules are described below:

Line Interface Module and CDR Module

l

In the receive direction, the received electrical signals (CMI code) are isolated through the
converter and then transmitted to the decoding unit. The CDR module then recovers the
data and clock signals after decoding.

In the transmit direction, the SDH signals, which are processed by the overhead processing
unit, are transmitted to the encoding unit. After isolation by converter, 155 Mbit/s electrical
signals (CMI code) are output. The encoding and decoding unit monitors R_LOS alarms.

SDH Overhead Processing Module

l

This module includes RST, MST, MSA and HPT. It also provides inloop and outloop
function.

In the receive direction, RST performs frame alignment detection (A1, A2), regenerator
section trace recovery (J0) and mismatch detection, BIP-8 errored block count.

In the transmit direction, RST performs frame alignment insertion, regenerator section path
trace insertion, BIP-8 calculation and insertion.

In the receive direction, MST performs BIP-24 errored block count, MS_REI recovery,
MS_RDI and MS_AIS detection.

In the transmit direction, MST performs BIP-24 calculation and insertion, MS_REI
MS_RDI and MS_AIS insertion.

RST

MST

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Provides extraction or insertion of K1 byte and K2 byte.

In the receive direction, MSA performs AU4's pointer interpretation, LOP and AIS
detection, pointer justification.

In the transmit direction, MSA performs AUG assembly, AU-4 pointer generation,
AU_AIS generation.

OH termination

J1 path trace message recovery

REI information recovering

HP_RDI detection (path status monitoring)

UNEQ and AIS detection (signal label monitoring)

VC-4 BIP-8 errored block count

MSA

HPT

Communication and Control Module

l

Manages and configures other modules of the boards.

Performs inter-board communication through internal Ethernet interface.

Traces the clock signal from the active and the standby cross-connect unit.

Controls the laser.

Realizes the pass-through of orderwire and ECC bytes between the paired slots constituting
the ADM when the CXL is not online.

Selects the clock and frame header from the active or the standby cross-connect units.

Controls the indicator on the board.

DC/DC Converter Module

It provides the board with required DC voltages. It converts the 48 V/ 60 V power supply to
the following voltages: + 3.3 V, + 1.8 V. It also provides protection for +3.3 V power supply.

5.5.4 Front Panel

On the front panel of the SEP1, there are indicators, interfaces and barcode.

Appearance of the Front Panel

Figure 5-14 shows the appearance of the front panel of the SEP1.

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Figure 5-14 Front panel of the SEP1

SEP1
STAT
ACT
PROG
SRV

OUT1 IN1 OUT2 IN2

SEP1

Indicators
The following indicators are present on the front panel of the board:
l

Board hardware state indicator (STAT), which is green or red when lit.

Service activating state indicator (ACT), which is green when lit.

Board software state indicator (PROG), which is green or red when lit.

Service alarm indicator (SRV), which is red, green or yellow when lit.

For indication of these indicators, see A Equipment and Board Alarm Indicators.

Interfaces
There are two pairs of optical interfaces on the front panel of the SEP1. Table 5-20 lists the type
and usage of the optical interfaces.

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Table 5-20 Electrical interfaces of the SEP1

Interface

Interface Type

Usage

IN1-IN2

75-ohm SMB

Receives the STM-1 signals.

OUT1-OUT2

75-ohm SMB

Transmits the STM-1 signals.

Note: The SEP1 board can also be used with interface boards EU08 and OU08. In this case,
the SEP1 is defined as the SEP. When the SEP1 is used with the interface board, the two
interfaces on the front panel are invalid.

5.5.5 Valid Slots

When the SEP1 board is housed in any of slots 1213 of the OptiX OSN 1500A subrack, it
cannot be used with the interface board. In the OptiX OSN 1500B subrack, when interfaces are
available on the front panel of the SEP1 board, it can be housed in any of slots 1113. When the
SEP1 board is used with the interface board, it is defined as SEP. In this case, it can be housed
in any of slots 1213.

5.5.6 TPS Protection for the Board

The TPS protection is equipment-level protection. When the working board fails, the accessed
services are switched to the protection board.
In this way, complex network-level protection, such as the MSP and SNCP, are not triggered,
but the reliability of the equipment can be ensured.
The OptiX OSN 1500B supports the TPS protection for the SEP1. The SEP1 board can be used
with the EU08 and TSB8 boards to realize the 1:1 TPS protection for 2 x STM-1 electrical
signals. The OptiX OSN 1500A does not support the SEP1 board.

Protection Principle
Figure 5-15 shows the principle of the TPS protection for the SEP1 board.
Figure 5-15 Principle of the TPS protection for the SEP1
8STM-1(e)

EU08

TSB8

Switch control
signal

Crossconnect
and timing
board

SLOT 9/10
Protection
SEP

Working
SEP
Fail

SLOT12

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l

Normal state: When the working boards are running normally, the control switch of the
EU08 is in position 1 and the EU08 directly accesses the service signals to the SEP1 board.

Switching state: When a failure is detected on the working board, the working board housed
in each slot can be protected in the following ways.

When the working board housed in slot 13 fails, the control switch of the corresponding
EU08 shifts from position 1 to position 2. At the same time, the control switch of the
TSB8 shifts from position 1 to position 2, and thus the working board housed in slot 13
is protected by the protection board housed in slot 12.

Hardware Configuration
Figure 5-16 shows the slot configuration for the 1:1 TPS protection for the SEP1.
Figure 5-16 Slot configuration for the 1:1 TPS protection for the SEP1
Slot 14

TSB8

Slot 15
Slot 16

EU08

Slot 17

Slot 18

PIU

Slot 19

PIU

Slot 6

Slot 11
Slot 20

Slot 12

Protection

Slot 7

FAN

Slot 13

Working

Slot 8

Slot 4

CXL16/4/1

Slot 9

EOW

Slot 5

CXL16/4/1

Slot 10

AUX

As shown in Figure 5-16, the protection board housed in slot 12 protects the board housed in
slot 13.
Table 5-21 lists the slots for the SEP1, EU08 and TSB8.
Table 5-21 Slots for the SEP1, EU08 and TSB8
Board

Protection Group

SEP1 (working board)

Slot 12

TSB8

Slot 14

SEP1 (working board)

Slot 13

EU08

Slot 16

5.5.7 Board Configuration Reference

You can use the T2000 to set parameters for the SEP1.
You can use the T2000 to set the following parameters for the SEP1:
l

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J1

C2

5 SDH Processing Boards

For details on the parameters, refer to F Board Configuration Reference.

5.5.8 Technical Specifications

The technical specifications of the SEP1 cover the board dimensions, weight and power
consumption.
Table 5-22 Technical specifications of the SEP1 board
Item

Specification

Nominal bit rate

155.520 Mbit/s

Line code

Coded mark inversion (CMI), NRZ

Connector

SMB

Mechanical Specifications
The mechanical specifications of the SEP1 are as follows:
l

Board dimensions (mm): 262.05 (H) x 220 (D) x 25.4 (W)

Weight (kg): 1.0

Power Consumption
In the normal temperature (25), the maximum power consumption of the SEP1 is 17 W.

5.6 SL4
This section describes the SL4, a 1 x STM-4 optical interface board, in terms of the version,
function, working principle, front panel and specifications.
5.6.1 Version Description
The SL4 board has three versions, R1, N1 and N2. The difference among the three versions lies
in the support for the TCM function. The R1SL4 is an STM-1 optical interface board, which is
housed in a divided slot in a subrack.
5.6.2 Function and Feature
The SL4 board is used to receive and transmit 1 x STM-4 optical signals, to process the overhead
bytes, and to perform the MSP protection.
5.6.3 Working Principle and Signal Flow
The SL4 board consists of the O/E conversion module, CDR module, SDH overhead processing
module, RST and so on.
5.6.4 Front Panel
On the front panel of the N1SL4/N2SL4, there are indicators, interfaces, barcode and laser safety
class label.On the front panel of the R1SL4, there are indicators, interfaces and barcode.
5.6.5 Valid Slots
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The slots valid for the SL4 vary with the version of the board.
5.6.6 Board Feature Code
The code behind the board name in the barcode is the board feature code. The board feature code
of the SL4 indicates the optical interface type.
5.6.7 Board Configuration Reference
You can use the T2000 to set parameters for the SL4.
5.6.8 Technical Specifications
The technical specifications of the SL4 cover the optical interface specifications, board
dimensions, weight and power consumption.

5.6.1 Version Description

The SL4 board has three versions, R1, N1 and N2. The difference among the three versions lies
in the support for the TCM function. The R1SL4 is an STM-1 optical interface board, which is
housed in a divided slot in a subrack.
Table 5-23 lists the details on the versions of the SL4 board.
Table 5-23 Version Description of the SL4
Item

Description

Functional
version

The SL4 has three versions, R1, N1 and N2.

Difference

The N2SL4 supports the TCM function. The N1 and R1SL4 do not
support the TCM function. The R1SL4 is housed in a divided slot.

Replaceability

The versions cannot be replaced by each other.

5.6.2 Function and Feature

The SL4 board is used to receive and transmit 1 x STM-4 optical signals, to process the overhead
bytes, and to perform the MSP protection.
The SL4 is used to transmit and receive STM-4 optical signals, to perform O/E conversion for
STM-4 signals, to extract or insert overhead bytes, and to generate alarm signals on the line.
Table 5-24 lists the functions and features of the SL4.
Table 5-24 Functions and features of the SL4

5-42

Function and
Feature

SL4

Basic function

Receives and transmits 1 x STM-4 optical signals, and processes 1 x

STM-4 standard or concatenation services.

Specification of
the optical
interface

Supports standard optical interfaces of the I-4, S-4.1, L-4.1, L-4.2 and
Ve-4.2 types. The optical interfaces of the I-4, S-4.1, L-4.1 and L-4.2
types comply with ITU-T G.957 in features. The optical interface of the
Ve-4.2 type complies with the standards defined by Huawei.

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Function and
Feature

SL4

Specification of
the optical module

Supports detection and query of the information on the optical module.

The optical interface supports the function of setting the on/off state of
the laser and the ALS function.
Supports the usage and monitoring of the pluggable optical module SFP.

Service
processing

Supports VC-12, VC-3, and VC-4 services and VC-4-4c concatenation

services.

Overhead
processing

Supports the processing of the SOH bytes of the STM-4 signals.

Alarm and
performance
event

Provides rich alarms and performance events for easy management and
maintenance of the equipment.

Protection scheme

Supports the two-fiber MSP protection ring, four-fiber MSP protection

ring, linear MSP, SNCP, SNCTP, and SNCMP.

Supports the transparent transmission and termination of the POH bytes.

Supports the setting and query of the J0/J1/C2 bytes.

Supports the optical-path-shared MSP and SNCP protection.

Maintenance
feature

Supports inloop and outloop for optical interfaces.

Supports warm reset and cold reset. The warm reset does not affect
services.
Supports the function of querying the manufacturing information of the
board.
Supports the in-service loading of the FPGA.
Supports the upgrade of the board software without affecting services.

5.6.3 Working Principle and Signal Flow

The SL4 board consists of the O/E conversion module, CDR module, SDH overhead processing
module, RST and so on.
Figure 5-17 shows the block diagram for the working principle of the SL4.

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Figure 5-17 Block diagram for the working principle of the SL4
155 MHz

622Mbit/s
622Mbit/s

O/E

S
P
I

O/E

622Mbit/s

S
P
I

O/E

K1 and K2

K1 and K2 insertion/extration

High speed bus

....

622Mbit/s

O/E

622Mbit/s

Cross-connect unit

Cross-connect unit

622Mbit/s

....
622Mbit/s

CDR

Reference clock

155 MHz
PLL

622Mbit/s

CDR

RST

MST

MSA

HPT
High speed bus

622Mbit/s
622Mbit/s

DCC
SDH overhead processing module

IIC
LOS
Laser shut down

Communication
and control
module
+3.3 V

+5 V
+1.8 V

DC/DC
converter

Cross-connect unit A

DC/DC
converter

Frame header
Communication

Fuse

Cross-connect unit B

SCC unit

Cross-connect unit
SCC unit

-48 V/ -60 V
-48 V/ -60 V

Fuse

+3.3 V

+3.3 V
backup power

PLL: phase-locked loop

SPI: SDH physical interface

RST: regenerator section

termination

MST: multiplex section termination MSA: multiplex section adaptation

HPT: higher order path termination IIC: inter-integrated circuit

SDH: synchronous digital hierarchy

CDR: clock and data recovery

The function modules of the STM-4 units are described below:

O/E Conversion Module

l

In the receive direction, the module converts the received optical signals into electrical
signals.

In the transmit direction, the module converts the electrical signals into SDH optical signals,
and then sends optical signals to fibers for transmission.

The SPI detects the R_LOS alarm and provides function to shut down the laser.

It recovers the data signal and the clock signal.

CDR Module

SDH Overhead Processing Module

l

This module includes RST, MST, MSA and HPT. It provides inloop and outloop function.

In the receive direction, RST performs frame alignment detection (A1, A2), regenerator
section trace recovery (J0) and mismatch detection, BIP-8 errored block count.

In the transmit direction, RST performs frame alignment insertion, regenerator section path
trace insertion, BIP-8 calculation and insertion.

RST

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MST
l

In the receive direction, MST performs BIP-24 errored block count, multiplex sectionremote error indication (MS_REI) recovery, multiplex section-remote defect indication
(MS_RDI) and multiplex section-alarm indication signal (MS_AIS) detection.

In the transmit direction, MST performs BIP-24 calculation and insertion, MS_REI
MS_RDI and MS_AIS insertion.

MST provides extraction or insertion of K1 byte and K2 byte.

In the receive direction, MSA performs AU4's pointer interpretation, LOP and AIS
detection, pointer justification.

In the transmit direction, MST it performs administration unit group (AUG) assembly,
AU-4 pointer generation, AU_AIS generation.

OH termination

J1 path trace message recovery

REI information recovering

HP_RDI detection (path status monitoring)

UNEQ and AIS detection (signal label monitoring)

VC-4 BIP-8 errored block count

MSA

HPT

Communication and Control Module

l

Manages and configures other modules of the boards.

Performs inter-board communication through internal Ethernet interface.

Traces the clock signal from the active and the standby cross-connect units.

Controls the laser.

Realizes the pass-through of orderwire and embedded control channel (ECC) bytes between
the paired slots constituting the add/ drop multiplexer (ADM) when the CXL is not online.

Selects the clock and frame header from the active or the standby cross-connect units.

Controls the indicator on the board.

DC/DC Converter
It provides the board with required DC voltages. It converts the 48/60 V power supply to the
following voltages: + 3.3 V, + 1.8 V, + 5 V. It also provides protection for +3.3 V power supply.

5.6.4 Front Panel

On the front panel of the N1SL4/N2SL4, there are indicators, interfaces, barcode and laser safety
class label.On the front panel of the R1SL4, there are indicators, interfaces and barcode.

Appearance of the Front Panel

Figure 5-18 shows the appearance of the front panel of the N1SL4/N2SL4.
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Figure 5-18 Front panel of the N1SL4/N2SL4

SL4
STAT
ACT
PROG
SRV

CLASS1
LASER
PRODUCT

OUT

IN

SL4

Figure 5-19 shows the appearance of the front panel of the R1SL4.
Figure 5-19 Front panel of the R1SL4

SL4
STAT
ACT
PROG
SRV

OUT IN

SL4

Indicators
The following indicators are present on the front panel of the board:
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Board hardware state indicator (STAT), which is green or red when lit.

Service activating state indicator (ACT), which is green when lit.

Board software state indicator (PROG), which is green or red when lit.

Service alarm indicator (SRV), which is red, green or yellow when lit.

For indication of these indicators, see A Equipment and Board Alarm Indicators.

Interfaces
There is one pair of optical interfaces on the front panel of the SL4. Table 5-25 lists the type
and usage of the optical interfaces.
Table 5-25 Optical interfaces of the SL4
Interface

Interface Type

Usage

IN

LC

Receives optical signals.

OUT

LC

Transmits optical signals.

The SL4 board can use the pluggable optical modules for easy maintenance.

5.6.5 Valid Slots

The slots valid for the SL4 vary with the version of the board.
The slots valid for the SL4 are as follows:
l

The R1SL4 can be housed in any of slots 23, 69 and 1213 in the OptiX OSN 1500A
subrack.

The N1SL4 can be housed in any of slots 1213 in the OptiX OSN 1500A subrack.

The N2SL4 can be housed in any of slots 1213 in the OptiX OSN 1500A subrack.

The R1SL4 can be housed in any of slots 13, 69 and 1113 in the OptiX OSN 1500B
subrack.

The N1SL4 can be housed in any of slots 1113 in the OptiX OSN 1500B subrack.

The N2SL4 can be housed in any of slots 1113 in the OptiX OSN 1500B subrack.

5.6.6 Board Feature Code

The code behind the board name in the barcode is the board feature code. The board feature code
of the SL4 indicates the optical interface type.
Table 5-26 lists the relation between the board feature code and optical interface type for the
SL4.
Table 5-26 Relation between the board feature code and the optical interface type of the SL4

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Board

Feature Code

Optical Interface Type

SSN1SL410, SSN2SL410

10

S-4.1

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Board

Feature Code

Optical Interface Type

SSN1SL411, SSN2SL411

11

L-4.1

SSN1SL412, SSN2SL412

12

L-4.2

SSN1SL413, SSN2SL413

13

Ve-4.2

SSN1SL414, SSN2SL414

14

I-4

5.6.7 Board Configuration Reference

You can use the T2000 to set parameters for the SL4.
You can use the T2000 to set the following parameters for the SL4:
l

J0

J1

C2

For details on the parameters, refer to F Board Configuration Reference.

5.6.8 Technical Specifications

The technical specifications of the SL4 cover the optical interface specifications, board
dimensions, weight and power consumption.

Optical Interface Specifications

Table 5-27 lists the specifications of the optical interfaces of the SL4.
Table 5-27 Specifications of the optical interfaces of the SL4

5-48

Item

Specification

Nominal bit rate

622080 kbit/s

Line code

NRZ

Optical interface
type

I-4

S-4.1

L-4.1

L-4.2

Ve-4.2

Optical source
type

MLM

MLM

SLM

SLM

SLM

Working
wavelength (nm)

12611360

12741356

12801335

14801580

14801580

Launched optical
power (dBm)

15 to 8

15 to 8

3 to +2

3 to +2

3 to +2

Receiver
sensitivity (dBm)

23

28

28

28

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Item

Specification

Overload optical
power (dBm)

13

Min. extinction
ratio (dB)

8.2

8.2

10

10

10.5

Laser Safety Class

The safety class of the laser on the board is CLASS 1.
The maximum launched optical power of the optical interfaces is lower than 10 dBm (10 mW).

Mechanical Specifications
The mechanical specifications of the N1SL4/N2SL4 are as follows:
l

Board dimensions (mm): 262.05 (H) x 220 (D) x 25.4 (W)

Weight (kg): 1.0

The mechanical specifications of the R1SL4 are as follows:

l

Board dmensions (mm): 111.8 (H) x 220 X (D) x 25.4 (W)

Weight (kg): 0.5

Power Consumption
In the normal temperature (25), the maximum power consumption of the N1SL4/N2SL4 is
15 W.
In the normal temperature (25), the maximum power consumption of the R1SL4 is 10 W.

5.7 SLD4
This section describes the SLD4, a 2 x STM-4 optical interface board, in terms of the version,
function, working principle, front panel and specifications.
5.7.1 Version Description
The SLD4 board has three versions, R1, N1 and N2. The difference among the three versions
lies in the support for the TCM function. The R1SLD4 is a 2 x STM-1 optical interface board,
which is housed in a divided slot in a subrack.
5.7.2 Function and Feature
The SLD4 is used to transmit and receive STM-4 optical signals, to perform O/E conversion for
STM-4 signals, to extract or insert overhead bytes, and to generate alarm signals on the line.
5.7.3 Working Principle and Signal Flow
The SLD4 board consists of the O/E conversion module, CDR module, SDH overhead
processing module so on.
5.7.4 Front Panel
On the front panel of the N1SLD4/N2SLD4, there are indicators, interfaces, barcode and laser
safety class label.On the front panel of the R1SLD4, there are indicators, interfaces and barcode.
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5.7.5 Valid Slots

The slots valid for the SLD4 vary with the cross-connect capacity of the subrack.
5.7.6 Board Feature Code
The code behind the board name in the barcode is the board feature code. The board feature code
of the SLD4 indicates the optical interface type.
5.7.7 Board Configuration Reference
You can use the T2000 to set parameters for the SLD4.
5.7.8 Technical Specifications
The technical specifications of the SLD4 cover the optical interface specifications, board
dimensions, weight and power consumption.

5.7.1 Version Description

The SLD4 board has three versions, R1, N1 and N2. The difference among the three versions
lies in the support for the TCM function. The R1SLD4 is a 2 x STM-1 optical interface board,
which is housed in a divided slot in a subrack.
Table 5-28 lists the details on the versions of the SLD4 board.
Table 5-28 Version Description of the SLD4
Item

Description

Functional
version

The SLD4 has three versions, R1, N1 and N2.

Difference

The N2SLD4 supports the TCM function. The N1SLD4 and R1SLD4
do not support the TCM function. The SLD4 board of the R1SLD4 is
housed in a divided slot.

Replaceability

The versions cannot be replaced by each other.

5.7.2 Function and Feature

The SLD4 is used to transmit and receive STM-4 optical signals, to perform O/E conversion for
STM-4 signals, to extract or insert overhead bytes, and to generate alarm signals on the line.
Table 5-29 lists the functions and features of the SLD4.
Table 5-29 Functions and features of the SLD4

5-50

Function and
Feature

SLD4

Basic function

Receives and transmits 2 x STM-4 optical signals, and processes 2 x

STM-4 standard or concatenation services.

Specification of
the optical
interface

Supports standard optical interfaces of the I-4, S-4.1, L-4.1, L-4.2 and
Ve-4.2 types. The optical interfaces of the I-4, S-4.1, L-4.1 and L-4.2
types comply with ITU-T G.957 in features. The optical interface of the
Ve-4.2 type complies with the standards defined by Huawei.

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Function and
Feature

SLD4

Specifications of
the optical module

Supports detection and query of the information on the optical module.

The optical interface supports the function of setting the on/off state of
the laser and the ALS function.
Supports the usage and monitoring of the pluggable optical module SFP.

Service
processing

Supports VC-12, VC-3, and VC-4 services and VC-4-4c concatenation

services.

Overhead
processing

Supports the processing of the SOH bytes of the STM-4 signals.

Supports the transparent transmission or termination of the POH bytes.
Supports the setting and query of the J0/J1/C2 bytes.
Supports one to two channels of ECC communication.

Alarm and
performance event

Provides rich alarms and performance events for easy management and
maintenance of the equipment.

Protection scheme

Supports the two-fiber MSP protection ring, four-fiber MSP protection

ring, linear MSP, SNCP, SNCTP, and SNCMP.
Supports the optical-path-shared MSP and SNCP protection.

Maintenance
feature

Supports inloop and outloop for optical interfaces.

Supports warm reset and cold reset. The warm reset does not affect
services.
Supports the function of querying the manufacturing information of the
board.
Supports the in-service loading of the FPGA.
Supports the upgrade of the board software without affecting services.

5.7.3 Working Principle and Signal Flow

The SLD4 board consists of the O/E conversion module, CDR module, SDH overhead
processing module so on.
Figure 5-20 shows the block diagram for the working principle of the SLD4.

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Figure 5-20 Block diagram for the working principle of the SLD4
155 MHz

622Mbit/s
622Mbit/s

O/E

S
P
I

O/E

622Mbit/s

S
P
I

O/E

K1 and K2

K1 and K2 insertion/extration

High speed bus

....

622Mbit/s

O/E

622Mbit/s

Cross-connect unit

Cross-connect unit

622Mbit/s

....
622Mbit/s

CDR

Reference clock

155 MHz
PLL

622Mbit/s

CDR

RST

MST

MSA

HPT
High speed bus

622Mbit/s
622Mbit/s

DCC
SDH overhead processing module

IIC
LOS
Laser shut down

Communication
and control
module
+3.3 V

+5 V
+1.8 V

DC/DC
converter

Cross-connect unit A

DC/DC
converter

Frame header
Communication

Fuse

Cross-connect unit B

SCC unit

Cross-connect unit
SCC unit

-48 V/ -60 V
-48 V/ -60 V

Fuse

+3.3 V

+3.3 V
backup power

PLL: phase-locked loop

SPI: SDH physical interface

RST: regenerator section

termination

MST: multiplex section termination MSA: multiplex section adaptation

HPT: higher order path termination IIC: inter-integrated circuit

SDH: synchronous digital hierarchy

CDR: clock and data recovery

The function modules of the STM-4 units are described below:

O/E Conversion Module

l

In the receive direction, the module converts the received optical signals into electrical
signals.

In the transmit direction, the module converts the electrical signals into SDH optical signals,
and then sends optical signals to fibers for transmission.

The SPI detects the R_LOS alarm and provides function to shut down the laser.

It recovers the data signal and the clock signal.

CDR Module

SDH Overhead Processing Module

l

This module includes RST, MST, MSA and HPT. It provides inloop and outloop function.

In the receive direction, RST performs frame alignment detection (A1, A2), regenerator
section trace recovery (J0) and mismatch detection, BIP-8 errored block count.

In the transmit direction, RST performs frame alignment insertion, regenerator section path
trace insertion, BIP-8 calculation and insertion.

RST

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MST
l

In the receive direction, MST performs BIP-24 errored block count, multiplex sectionremote error indication (MS_REI) recovery, multiplex section-remote defect indication
(MS_RDI) and multiplex section-alarm indication signal (MS_AIS) detection.

In the transmit direction, MST performs BIP-24 calculation and insertion, MS_REI
MS_RDI and MS_AIS insertion.

MST provides extraction or insertion of K1 byte and K2 byte.

In the receive direction, MSA performs AU4's pointer interpretation, LOP and AIS
detection, pointer justification.

In the transmit direction, MST it performs administration unit group (AUG) assembly,
AU-4 pointer generation, AU_AIS generation.

OH termination

J1 path trace message recovery

REI information recovering

HP_RDI detection (path status monitoring)

UNEQ and AIS detection (signal label monitoring)

VC-4 BIP-8 errored block count

MSA

HPT

Communication and Control Module

l

Manages and configures other modules of the boards.

Performs inter-board communication through internal Ethernet interface.

Traces the clock signal from the active and the standby cross-connect units.

Controls the laser.

Realizes the pass-through of orderwire and embedded control channel (ECC) bytes between
the paired slots constituting the add/ drop multiplexer (ADM) when the CXL is not online.

Selects the clock and frame header from the active or the standby cross-connect units.

Controls the indicator on the board.

DC/DC Converter
It provides the board with required DC voltages. It converts the 48/60 V power supply to the
following voltages: + 3.3 V, + 1.8 V, + 5 V. It also provides protection for +3.3 V power supply.

5.7.4 Front Panel

On the front panel of the N1SLD4/N2SLD4, there are indicators, interfaces, barcode and laser
safety class label.On the front panel of the R1SLD4, there are indicators, interfaces and barcode.

Appearance of the Front Panel

Figure 5-21 shows the appearance of the front panel of the N1SLD4/N2SLD4.
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Figure 5-21 Front panel of the N1SLD4/N2SLD4

SLD4
STAT
ACT
PROG
SRV
CLASS1
LASER
PRODUCT

OUT1 IN1
OUT2 IN2

SLD4

Figure 5-22 shows the appearance of the front panel of the R1SLD4.
Figure 5-22 Front panel of the R1SLD4

SLD4
STAT
ACT
PROG
SRV

OUT IN
OUT IN

SLD4

Indicators
The following indicators are present on the front panel of the board:
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Board hardware state indicator (STAT), which is green or red when lit.

Service activating state indicator (ACT), which is green when lit.

Board software state indicator (PROG), which is green or red when lit.

Service alarm indicator (SRV), which is red, green or yellow when lit.

For indication of these indicators, see A Equipment and Board Alarm Indicators.

Interfaces
There are two pairs of optical interfaces on the front panel of the SLD4. Table 5-30 lists the
type and usage of the optical interfaces.
Table 5-30 Optical interfaces of the SLD4
Interface

Interface Type

Usage

IN1-IN2

LC

Receives optical signals.

OUT1-OUT2

LC

Transmits optical signals.

The SLD4 board can use the pluggable optical modules for easy maintenance.

5.7.5 Valid Slots

The slots valid for the SLD4 vary with the cross-connect capacity of the subrack.
The slots valid for the SLD4 are as follows:
l

The R1SLD4 can be housed in any of slots 23, 69 and 1213 in the OptiX OSN 1500A
subrack.

The N1SLD4 can be housed in any of slots 1213 in the OptiX OSN 1500A subrack.

The N2SLD4 can be housed in any of slots 1213 in the OptiX OSN 1500A subrack.

The R1SLD4 can be housed in any of slots 13, 69 and 1113 in the OptiX OSN 1500B
subrack. For the board housed in any of slots 13 and 1113, two optical interfaces can be
configured. For the board housed in any of slots 69, one optical interface can be configured.

The N1SLD4 can be housed in any of slots 1113 in the OptiX OSN 1500B subrack.

The N2SLD4 can be housed in any of slots 1113 in the OptiX OSN 1500B subrack.

5.7.6 Board Feature Code

The code behind the board name in the barcode is the board feature code. The board feature code
of the SLD4 indicates the optical interface type.
Table 5-31 lists the relation between the board feature code and optical interface type for the
SLD4.

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Table 5-31 Relation between the board feature code and the optical interface type of the SLD4
Board

Feature Code

Optical Interface Type

SSN1SLD410,
SSN2SLD410

10

S-4.1

SSN1SLD411,
SSN2SLD411

11

L-4.1

SSN1SLD412,
SSN2SLD412

12

L-4.2

SSN1SLD413,
SSN2SLD413

13

Ve-4.2

SSN1SLD414,
SSN2SLD414

14

I-4

5.7.7 Board Configuration Reference

You can use the T2000 to set parameters for the SLD4.
You can use the T2000 to set the following parameters for the SLD4:
l

J0

J1

C2

For details on the parameters, refer to F Board Configuration Reference.

5.7.8 Technical Specifications

The technical specifications of the SLD4 cover the optical interface specifications, board
dimensions, weight and power consumption.

Optical Interface Specifications

Table 5-32 lists the specifications of the optical interfaces of the SLD4.
Table 5-32 Specifications of the optical interfaces of the SLD4

5-56

Item

Specification

Nominal bit rate

622080 kbit/s

Line code

NRZ

Optical
interface type

I-4

S-4.1

L-4.1

L-4.2

Ve-4.2

Optical source
interface

MLM

MLM

SLM

SLM

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Item

Specification

Working
wavelength
(nm)

12611360

12741356

12801335

14801580

14801580

Launched
optical power
(dBm)

15 to 8

15 to 8

3 to +2

3 to +2

3 to +2

Receiver
sensitivity
(dBm)

23

28

28

28

34

Overload
optical power
(dBm)

13

Min. extinction
ratio (dB)

8.2

8.2

10

10

10.5

Laser Safety Class

The safety class of the laser on the board is CLASS 1.
The maximum launched optical power of the optical interfaces is lower than 10 dBm (10 mW).

Mechanical Specifications
The mechanical specifications of the N1SLD4/N2SLD4 are as follows:
l

Board dimensions (mm): 262.05 (H) x 220 (D) x 25.4 (W)

Weight (kg): 1.0

The mechanical specifications of the R1SLD4 are as follows:

l

Board dmensions (mm): 111.8 (H) x 220 X (D) x 25.4 (W)

Weight (kg): 0.5

Power Consumption
In the normal temperature (25), the maximum power consumption of the N1SLD4/N2SLD4
is 15 W.
In the normal temperature (25), the maximum power consumption of the R1SLD4 is 11 W.

5.8 SLQ4
This section describes the SLQ4, a 4 x STM-4 optical interface board, in terms of the version,
function, working principle, front panel and specifications.
5.8.1 Version Description
The SLQ4 board has two versions, N1 and N2. The difference between the two versions lies in
the support for the TCM function.
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5.8.2 Function and Feature

The SLQ4 is used to transmit and receive STM-4 optical signals, to perform O/E conversion for
STM-4 signals, to extract or insert overhead bytes, and to generate alarm signals on the line.
5.8.3 Working Principle and Signal Flow
The SLQ4 board consists of the O/E conversion module, CDR module, SDH overhead
processing module, RST and so on.
5.8.4 Front Panel
On the front panel of the SLQ4, there are indicators, interfaces, barcode and laser safety class
label.
5.8.5 Valid Slots
The SLQ4 can be housed in any of slots 1213 in the OptiX OSN 1500A subrack. The SLQ4
can be housed in any of slots 1113 in the OptiX OSN 1500B subrack.
5.8.6 Board Feature Code
The code behind the board name in the barcode is the board feature code. The board feature code
of the SLQ4 indicates the optical interface type.
5.8.7 Board Configuration Reference
You can use the T2000 to set parameters for the SLQ4.
5.8.8 Technical Specifications
The technical specifications of the SLQ4 cover the optical interface specifications, board
dimensions, weight and power consumption.

5.8.1 Version Description

The SLQ4 board has two versions, N1 and N2. The difference between the two versions lies in
the support for the TCM function.
Table 5-33 lists the details on the versions of the SLQ4 board.
Table 5-33 Version Description of the SLQ4
Item

Description

Functional
version

The SLQ4 has two versions, N1 and N2.

Difference

The N2SLQ4 supports the TCM function. The N1SLQ4 does not support
the TCM function.

Replaceability

The versions cannot be replaced by each other.

5.8.2 Function and Feature

The SLQ4 is used to transmit and receive STM-4 optical signals, to perform O/E conversion for
STM-4 signals, to extract or insert overhead bytes, and to generate alarm signals on the line.
Table 5-34 lists the functions and features of the SLQ4.

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Table 5-34 Functions and features of the SLQ4

Function and
Feature

SLQ4

Basic function

Transmits and receives 4 x STM-4 optical signals.

Specification of
the optical
interface

Supports standard optical interfaces of the I-4, S-4.1, L-4.1, L-4.2 and
Ve-4.2 types. The optical interfaces of the I-4, S-4.1, L-4.1 and L-4.2 types
comply with ITU-T G.957 in features. The optical interface of the Ve-4.2
type complies with the standards defined by Huawei.

Specification of
the optical
module

Supports detection and query of the information on the optical module.

The optical interface supports the function of setting the on/off state of
the laser and the ALS function.
Supports the usage and monitoring of the pluggable optical module SFP .

Service
processing

Supports VC-12, VC-3, and VC-4 services and VC-4-4c concatenation

services.

Overhead
processing

Supports the processing of the SOH bytes of the STM-4 signals.

Supports the transparent transmission or termination of the POH bytes.
Supports the setting and query of the J0/J1/C2 bytes.
Supports one to four channels of ECC communication.

Alarm and
performance
event

Provides rich alarms and performance events for easy management and
maintenance of the equipment.

Protection
scheme

Supports the two-fiber MSP protection ring, four-fiber MSP protection

ring, linear MSP, SNCP, SNCTP and SNCMP.
Supports the optical-path-shared MSP and SNCP protection.

Maintenance
feature

Supports inloop and outloop for optical interfaces.

Supports warm reset and cold reset. The warm reset does not affect
services.
Supports the function of querying the manufacturing information of the
board.
Supports the in-service loading of the FPGA.
Supports the upgrade of the board software without affecting services.

5.8.3 Working Principle and Signal Flow

The SLQ4 board consists of the O/E conversion module, CDR module, SDH overhead
processing module, RST and so on.
Figure 5-23 shows the block diagram for the working principle of the SLQ4.

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Figure 5-23 Block diagram for the working principle of the SLQ4
155 MHz

622Mbit/s
622Mbit/s

O/E

S
P
I

O/E

622Mbit/s

S
P
I

O/E

K1 and K2

K1 and K2 insertion/extration

High speed bus

....

622Mbit/s

O/E

622Mbit/s

Cross-connect unit

Cross-connect unit

622Mbit/s

....
622Mbit/s

CDR

Reference clock

155 MHz
PLL

622Mbit/s

CDR

RST

MST

MSA

HPT
High speed bus

622Mbit/s
622Mbit/s

DCC
SDH overhead processing module

IIC
LOS
Laser shut down

Communication
and control
module
+3.3 V

+5 V
+1.8 V

DC/DC
converter

Cross-connect unit A

DC/DC
converter

Frame header
Communication

Fuse

Cross-connect unit B

SCC unit

Cross-connect unit
SCC unit

-48 V/ -60 V
-48 V/ -60 V

Fuse

+3.3 V

+3.3 V
backup power

PLL: phase-locked loop

SPI: SDH physical interface

RST: regenerator section

termination

MST: multiplex section termination MSA: multiplex section adaptation

HPT: higher order path termination IIC: inter-integrated circuit

SDH: synchronous digital hierarchy

CDR: clock and data recovery

The function modules of the STM-4 units are described below:

O/E Conversion Module

l

In the receive direction, the module converts the received optical signals into electrical
signals.

In the transmit direction, the module converts the electrical signals into SDH optical signals,
and then sends optical signals to fibers for transmission.

The SPI detects the R_LOS alarm and provides function to shut down the laser.

It recovers the data signal and the clock signal.

CDR Module

SDH Overhead Processing Module

l

This module includes RST, MST, MSA and HPT. It provides inloop and outloop function.

In the receive direction, RST performs frame alignment detection (A1, A2), regenerator
section trace recovery (J0) and mismatch detection, BIP-8 errored block count.

In the transmit direction, RST performs frame alignment insertion, regenerator section path
trace insertion, BIP-8 calculation and insertion.

RST

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MST
l

In the receive direction, MST performs BIP-24 errored block count, multiplex sectionremote error indication (MS_REI) recovery, multiplex section-remote defect indication
(MS_RDI) and multiplex section-alarm indication signal (MS_AIS) detection.

In the transmit direction, MST performs BIP-24 calculation and insertion, MS_REI
MS_RDI and MS_AIS insertion.

MST provides extraction or insertion of K1 byte and K2 byte.

In the receive direction, MSA performs AU4's pointer interpretation, LOP and AIS
detection, pointer justification.

In the transmit direction, MST it performs administration unit group (AUG) assembly,
AU-4 pointer generation, AU_AIS generation.

OH termination

J1 path trace message recovery

REI information recovering

HP_RDI detection (path status monitoring)

UNEQ and AIS detection (signal label monitoring)

VC-4 BIP-8 errored block count

MSA

HPT

Communication and Control Module

l

Manages and configures other modules of the boards.

Performs inter-board communication through internal Ethernet interface.

Traces the clock signal from the active and the standby cross-connect units.

Controls the laser.

Realizes the pass-through of orderwire and embedded control channel (ECC) bytes between
the paired slots constituting the add/ drop multiplexer (ADM) when the CXL is not online.

Selects the clock and frame header from the active or the standby cross-connect units.

Controls the indicator on the board.

DC/DC Converter
It provides the board with required DC voltages. It converts the 48/60 V power supply to the
following voltages: + 3.3 V, + 1.8 V, + 5 V. It also provides protection for +3.3 V power supply.

5.8.4 Front Panel

On the front panel of the SLQ4, there are indicators, interfaces, barcode and laser safety class
label.

Appearance of the Front Panel

Figure 5-24 shows the appearance of the front panel of the SLQ4.
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Figure 5-24 Front panel of the SLQ4

SLQ4
STAT
ACT
PROG
SRV

CLASS1
LASER
PRODUCT

OUT1
IN1
OUT2 IN2
OUT3 IN3
OUT4 IN4

SLQ4

Indicators
The following indicators are present on the front panel of the board:
l

Board hardware state indicator (STAT), which is green or red when lit.

Service activating state indicator (ACT), which is green when lit.

Board software state indicator (PROG), which is green or red when lit.

Service alarm indicator (SRV), which is red, green or yellow when lit.

For indication of these indicators, see A Equipment and Board Alarm Indicators.

Interfaces
There are four pairs of optical interfaces on the front panel of the SLQ4. Table 5-35 lists the
type and usage of the optical interfaces.
Table 5-35 Optical interfaces of the SLQ4
Interface

Interface Type

Usage

IN1-IN4

LC

Receives optical signals.

OUT1-OUT4

LC

Transmits optical signals.

The SLQ4 board can use the pluggable optical modules for easy maintenance.
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5.8.5 Valid Slots

The SLQ4 can be housed in any of slots 1213 in the OptiX OSN 1500A subrack. The SLQ4
can be housed in any of slots 1113 in the OptiX OSN 1500B subrack.

5.8.6 Board Feature Code

The code behind the board name in the barcode is the board feature code. The board feature code
of the SLQ4 indicates the optical interface type.
Table 5-36 lists the relation between the board feature code and optical interface type for the
SLQ4.
Table 5-36 Relation between the board feature code and the optical interface type of the SLQ4
Board

Feature Code

Optical interface type

SSN1SLQ410,
SSN2SLQ410

10

S-4.1

SSN1SLQ411,
SSN2SLQ411

11

L-4.1

SSN1SLQ412,
SSN2SLQ412

12

L-4.2

SSN1SLQ413,
SSN2SLQ413

13

Ve-4.2

SSN1SLQ414,
SSN2SLQ414

14

I-4

5.8.7 Board Configuration Reference

You can use the T2000 to set parameters for the SLQ4.
You can use the T2000 to set the following parameters for the SLQ4:
l

J0

J1

C2

For details on the parameters, refer to F Board Configuration Reference.

5.8.8 Technical Specifications

The technical specifications of the SLQ4 cover the optical interface specifications, board
dimensions, weight and power consumption.

Optical Interface Specifications

Table 5-37 lists the specifications of the optical interfaces of the SLQ4.
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Table 5-37 Specifications of the optical interfaces of the SLQ4

Item

Specification

Nominal bit rate

622080 kbit/s

Line code

NRZ

Optical interface
type

I-4

S-4.1

L-4.1

L-4.2

Ve-4.2

Optical source
type

MLM

MLM

SLM

SLM

SLM

Working
wavelength
(nm)

12611360

12741356

12801335

14801580

14801580

Launched
optical power
(dBm)

15 to 8

15 to 8

3 to +2

3 to +2

3 to +2

Receiver
sensitivity
(dBm)

23

28

28

28

34

Overload optical
power (dBm)

13

Min. extinction
ratio (dB)

8.2

8.2

10

10

10.5

Laser Safety Class

The safety class of the laser on the board is CLASS 1.
The maximum launched optical power of the optical interfaces is lower than 10 dBm (10 mW).

Mechanical Specifications
The mechanical specifications of the SLQ4 are as follows:
l

Board dimensions (mm): 262.05 (H) x 220 (D) x 25.4 (W)

Weight (kg): 1.0

Power Consumption
In the normal temperature (25), the maximum power consumption of the SLQ4 is 16 W.

5.9 SL16
This section describes the SL16, a 1 x STM-16 optical interface board, in terms of the version,
function, working principle, front panel and specifications.
5.9.1 Version Description
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The SL16 board has three versions, N1, N2 and N3. The difference among the three versions
lies in the support for the TCM function and AU-3 services.
5.9.2 Function and Feature
The SL16 board is used to receive and transmit 1 x STM-16 optical signals and to process the
overhead.
5.9.3 Working Principle and Signal Flow
The SL16 board consists of the O/E conversion module, MUX/DEMUX module, SDH overhead
processing module, RST and so on.
5.9.4 Front Panel
On the front panel of the SL16, there are indicators, interfaces, barcode, laser safety class label,
and APD alarm label.
5.9.5 Valid Slots
The SL16 board can be housed in any of slots 1213 in the OptiX OSN 1500A subrack, and any
of slots 1113 in the OptiX OSN 1500B subrack.
5.9.6 Board Feature Code
The code behind the board name in the barcode is the board feature code. The board feature code
of the SL16 indicates the optical interface type.
5.9.7 Board Configuration Reference
You can use the T2000 to set parameters for the SL16.
5.9.8 Technical Specifications
The technical specifications of the SL16 cover the optical interface specifications, board
dimensions, weight and power consumption.

5.9.1 Version Description

The SL16 board has three versions, N1, N2 and N3. The difference among the three versions
lies in the support for the TCM function and AU-3 services.
Table 5-38 lists the details on the versions of the SL16 board.
Table 5-38 Version Description of the SL16
Item

Description

Functional
version

The SL16 has three versions, N1, N2 and N3.

Difference

The N1SL16 does not support the TCM function and AU-3 services.
The N2SL16 supports the TCM function, and it can be configured with
AU-3 services.
The TCM function and AU-3 services cannot be configured on the
N3SL16 at the same time.
The N3SL16 supports the board version replacement function.

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Item

Description

Replaceability

The N1SL16 and N2SL16 cannot be replaced by each other.

When the TCM function and AU-3 services are not required, the N3SL16
can fully replace the N2SL16 and N1SL16.
The N3SL16 supports the board version replacement function and can
replace the N1SL16. After the N1SL16 is replaced, the N3SL16 is
consistent with the N1SL16 in configuration and service status.

5.9.2 Function and Feature

The SL16 board is used to receive and transmit 1 x STM-16 optical signals and to process the
overhead.
Table 5-39 lists the functions and features of the SL16.
Table 5-39 Functions and features of the SL16
Function
and Feature

SL16

Basic function

Transmits and receives 1 x STM-16 optical signals.

Specification
of the optical
interface

Supports optical interfaces of the L-16.2, L-16.2Je, V-16.2Je (with BA),

U-16.2Je (with BA and PA) types. The optical interface of the L-16.2 type
complies with ITU-T G.957 and ITU-T G.692 in features. The optical
interfaces of the L-16.2Je, V-16.2Je (with BA), and U-16.2Je (with BA and
PA) comply with the standards defined by Huawei.
Supports the output of standard wavelengths that comply with ITU-T G.692.
The U-16.2Je optical interface can be directly connected to the DWDM
equipment.

Specification
of the optical
module

Supports detection and query of the information on the optical module.

Service
processing

Supports VC-12, VC-3, and VC-4 services and VC-4-4c, VC-4-8c, and
VC-4-16c concatenation services.

The optical interface supports the function of setting the on/off state of the
laser and the ALS function.

Supports AU-3 services.

Overhead
processing

Supports the processing of the SOH of the STM-16 signals.

Supports the transparent transmission and termination of the POH bytes.
Supports the setting and query of the J0/J1/C2 bytes.

5-66

Alarm and
performance
event

Provides rich alarms and performance events.

Processing of
the K byte

Processes two sets of K bytes. One SL16 board supports a maximum of two
MSP protection rings.

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5 SDH Processing Boards

Function
and Feature

SL16

Specifications
of the REG

Supports the setting and query of the REG working mode.

Protection
scheme

Supports the two-fiber MSP protection ring, four-fiber MSP protection ring,
linear MSP protection, SNCP, SNCTP and SNCMP.
Supports the optical-path-shared MSP and SNCP protection.

Maintenance
feature

Supports inloop and outloop for optical interfaces.

Supports warm reset and cold reset. The warm reset does not affect services.
Supports the function of querying the manufacturing information of the
board.
Supports the in-service loading of the FPGA.
Supports the upgrade of the board software without affecting services.
Supports the PRBS function.

5.9.3 Working Principle and Signal Flow

The SL16 board consists of the O/E conversion module, MUX/DEMUX module, SDH overhead
processing module, RST and so on.
Figure 5-25 shows the block diagram for the working principle of the SL16.
Figure 5-25 Block diagram for the working principle of the SL16
155 MHz

2.488
Gbit/s

2.488
Gbit/s

S
P
I
O/E

K1 and K2

K1 and K2 insertion/extration

Cross-connect
unit

Cross-connect
unit

DEMUX

O/E

2.488
Gbit/s

16 x 155
Mbit/s

Reference clock

155 MHz
PLL

2.488
Gbit/s

16 x 155
Mbit/s

RST

MST

MSA

high speed bus

Cross-connect
unit A

high speed bus

Cross-connect
unit B

HPT

MUX

DCC
SDH overhead processing module

IIC

Communication
and control
module

LOS
Laser shut down

+3.3 V
5V
+1.8 V

DC/DC
converter

DC/DC
converter

Frame header
Communication

SCC unit

Cross-connect
unit
SCC unit

-48 V/-60 V

Fuse

-48 V/-60 V
Fuse

+3.3 V

+3.3 V backup power

O/E Conversion Module

l

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In the receive direction, it converts the received optical signals into electrical signals.
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l

In the transmit direction, it converts the electrical signals into SDH optical signals, and then
send optical signals to fibers for transmission.

The SPI detects the R_LOS alarm and provides the function to shut down the laser.

MUX/DEMUX Module
l

In the receive direction, the DEMUX part demultiplexes the high rate electrical signals into
multiple parallel electrical signals, and recovery the clock signal at the same time.

In the transmit direction, the MUX part multiplexes the parallel electrical signals received
from the SDH overhead processing module into high rate electrical signals.

SDH Overhead Processing Module

It includes RST, MST, MSA and HPT, and provides outloop and inloop function.

RST
l

In the receiving direction, RST performs frame alignment detection (A1, A2), regenerator
section trace recovery (J0) and mismatch detection, and BIP-8 errored block count.

In the transmitting direction, RST performs frame alignment insertion, regenerator section
path trace insertion, BIP-8 calculation and insertion.

In the receiving direction, MST performs BIP-24 errored block count, MS_REI recovery,
MS_RDI and MS_AIS detection.

In the transmitting direction, MST performs calculation and insertion of BIP-24, insertion
of MS_REI MS_RDI and MS_AIS.

Provides extraction or insertion of K1 byte and K2 byte.

In the receiving direction, MSA performs AU4 pointer interpretation, LOP and AIS
detection, pointer justification.

In the transmitting direction, MSA performs AUG assembly, AU-4 pointer generation, and
AU_AIS generation.

OH termination

J1 path trace message recovery

REI information recovering

HP_RDI detection (path status monitoring)

UNEQ and AIS detection (signal label monitoring)

VC-4 BIP-8 errored block count

MST

MSA

HPT

Communication and Control Module

5-68

Manages and configures other modules of the boards.

Performs inter-board communication through internal Ethernet interface.

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Tracing the clock signal from the active and the standby cross-connect units.

Implements laser controlling function.

Realizes the pass-through of orderwire and ECC bytes between the paired slots constituting
the ADM when the CXL is not online.

Selects the clock and frame header from the active or the standby cross-connect units.

Controls the indicator on the board.

DC/DC Converter Module

This module provides the board with required DC voltages. It converts the 48/60 V power
supply to the following voltages: + 3.3 V, + 1.8 V, + 5 V. This module also provides
protection for the board +3.3V power supply.

5.9.4 Front Panel

On the front panel of the SL16, there are indicators, interfaces, barcode, laser safety class label,
and APD alarm label.

Appearance of the Front Panel

Figure 5-26 shows the appearance of the front panel of the SL16.
Figure 5-26 Front panel of the SL16
SL16
STAT
ACT
PROG
SRV

CLASS 1
LASER
PRODUCT

APD

Receiver
MAX:-9dBm

OUT

IN

SL16

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Indicators
The following indicators are present on the front panel of the board:
l

Board hardware state indicator (STAT), which is green or red when lit.

Service activating state indicator (ACT), which is green when lit.

Board software state indicator (PROG), which is green or red when lit.

Service alarm indicator (SRV), which is red, green or yellow when lit.

For indication of these indicators, see A Equipment and Board Alarm Indicators.

Interfaces
There is one pair of optical interfaces on the front panel of the SL16. Table 5-40 lists the type
and usage of the optical interfaces.
Table 5-40 Optical interfaces of the SL16
Interface

Interface Type

Usage

IN

LC

Receives optical signals.

OUT

LC

Transmits optical signals.

5.9.5 Valid Slots

The SL16 board can be housed in any of slots 1213 in the OptiX OSN 1500A subrack, and any
of slots 1113 in the OptiX OSN 1500B subrack.

5.9.6 Board Feature Code

The code behind the board name in the barcode is the board feature code. The board feature code
of the SL16 indicates the optical interface type.
Table 5-41 lists the relation between the board feature code and optical interface type for the
SL16.
Table 5-41 Relation between the board feature code and the optical interface type for the SL16

5-70

Board

Feature Code

Optical interface type

SSN1SL1601, SSN2SL1601

01

L-16.2

SSN1SL1602,
SSN2SL1602, SSN3SL1602

02

L-16.2Je

SSN1SL1603,
SSN2SL1603, SSN3SL1603

03

V-16.2Je

SSN1SL1604,
SSN2SL1604, SSN3SL1604

04

U-16.2

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5.9.7 Board Configuration Reference

You can use the T2000 to set parameters for the SL16.
You can use the T2000 to set the following parameters for the SL16:
l

J0

J1

C2

For details on the parameters, refer to F Board Configuration Reference.

5.9.8 Technical Specifications

The technical specifications of the SL16 cover the optical interface specifications, board
dimensions, weight and power consumption.

Optical Interface Specifications

Table 5-42 lists the specifications of the optical interfaces of the SL16.
Table 5-42 Specifications of the optical interfaces of the SL16

Issue 02 (2007-09-10)

Item

Specification

Nominal
bit rate

2488320 kbit/s

Optical
Interface
Type

L-16.2

L-16.2Je

V-16.2Je (BA)

U-16.2Je (BA+PA)

Optical
source type

SLM

SLM

SLM

SLM

Working
wavelengt
h (nm)

15001580

15301560

15301565

1550.12

Launched
optical
power
(dBm)

2 to +3

5 to 7

2 to +3
(without
BA)

Receiver
sensitivity
(dBm)

28

28

Overload
optical
power
(dBm)

13 to 15
(with BA)

2 to +3
(without
BA and
PA)

15 to 18
(with BA)

28

28
(without
PA and
BA)

32 (with
PA)

9
(without
PA and
BA)

10 (with
PA)

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Item

Specification

Min.
extinction
ratio (dB)

8.2

8.2

8.2

8.2

Note: The optical interface of the Le-16.2 type is the same as the optical interface of the
L-16.2Je type.
The launched optical power of the optical interface of the V-16.2Je type is measured when
the booster amplifer (BA) is added. The launched optical power of the optical interfaces of
the V-16.2Je and U-16.2Je types ranges from 2 dBm to 3 dBm when no BA is added.
Table 5-43 Specifications of the ITU-T G.692-compliant optical interfaces that output standard
wavelengths
Item

Specification

Nominal bit rate

2488320 kbit/s

Dispersion limit (km)

170

640

Mean launched optical power (dBm)

2 to +3

5 to 1

Receiver sensitivity (dBm)

28

28

Min. overload (dBm)

Max. allowed dispersion (ps/nm)

3400

10880

Min. extinction ratio (dB)

8.2

10

Laser Safety Class

The safety class of the laser on the board is CLASS 1.
The maximum launched optical power of the optical interfaces is lower than 10 dBm (10 mW).

Mechanical Specifications
The mechanical specifications of the SL16 are as follows:
l

Board dimensions (mm): 262.05 (H) x 220 (D) x 25.4 (W)

Weight (kg): 1.1

Power Consumption
In the normal temperature (25), the maximum power consumption of the N1SL16 is 20 W.
In the normal temperature (25), the maximum power consumption of the N2SL16 is 20 W.
In the normal temperature (25), the maximum power consumption of the N3SL16 is 22 W.

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5.10 SL16A
This section describes the SL16A, a 1 x STM-16 optical interface board, in terms of the version,
function, working principle, front panel and specifications.
5.10.1 Version Description
The SL16A board has three versions, N1, N2, and N3. The difference among the three versions
lies in the support for the TCM function.
5.10.2 Function and Feature
The SL16A board is used to receive and transmit 1 x STM-16 optical signals, to process the
overhead bytes, and to perform the MSP protection.
5.10.3 Working Principle and Signal Flow
The SL16A board consists of the O/E conversion module, MUX/DEMUX module, SDH
overhead processing module, RST and so on.
5.10.4 Front Panel
On the front panel of the SL16A, there are indicators, interfaces, barcode, laser safety class label,
and APD alarm label.
5.10.5 Valid Slots
The SL16A can be housed in any of slots 1213 in the OptiX OSN 1500A subrack. The SL16A
can be housed in any of slots 1113 in the OptiX OSN 1500B subrack.
5.10.6 Board Feature Code
The code behind the board name in the barcode is the board feature code. The board feature code
of the SL16A indicates the optical interface type.
5.10.7 Board Configuration Reference
You can use the T2000 to set the J0 parameter for the SL16A.
5.10.8 Technical Specifications
The technical specifications of the SL16A cover the optical interface specifications, board
dimensions, weight and power consumption.

5.10.1 Version Description

The SL16A board has three versions, N1, N2, and N3. The difference among the three versions
lies in the support for the TCM function.
Table 5-44 lists the details on the versions of the SL16A board.
Table 5-44 Version Description of the SL16A

Issue 02 (2007-09-10)

Item

Description

Functional
version

The SL16A has three versions, N1, N2, and N3.

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Item

Description

Difference

The N1SL16A does not support the TCM function and AU-3 services.
The N2SL16A supports the TCM function, and it can be configured with
AU-3 services.
The TCM function and AU-3 services cannot be configured on the
N3SL16A at the same time.
The N3SL16A supports the board version replacement function and can
replace the N3SL16A and N1SL16A. After the N3SL16A and N1SL16A
are replaced, the N3SL16A and N1SL16A are consistent with the
N1SL16A in configuration and service status.

Replaceability

The N1SL16A and N2SL16A cannot be replaced by each other.

When the TCM function and AU-3 services are not required, the
N3SL16A can fully replace the N2SL16A and N1SL16A.

5.10.2 Function and Feature

The SL16A board is used to receive and transmit 1 x STM-16 optical signals, to process the
overhead bytes, and to perform the MSP protection.
Table 5-45 lists the functions and features of the SL16A.
Table 5-45 Functions and features of the SL16A
Function and
Feature

SL16A

Basic function

Transmit and receive 1 x STM-16 optical signals.

Specification of the
optical interface

Supports optical interfaces of the I-16, S-16.1, L-16.1, and L-16.2 types.
The optical interfaces comply with ITU-T G.957 and ITU-T G.692 in
features.
Supports the output of standard wavelengths that comply with ITU-T
G.692 and can be directly connected to the DWDM equipment.

Specification of the
optical module

Supports detection and query of the information on the optical module.

The optical interface supports the function of setting the on/off state of
the laser and the ALS function.
Supports the usage and monitoring of the SFP pluggable optical
module.

5-74

Service processing

Supports VC-12, VC-3, and VC-4 services and VC-4-4c, VC-4-8c, and
VC-4-16c concatenation services.

Overhead
processing

Supports the processing of the SOH bytes of the STM-16 signals.

Alarm and
performance event

Provides rich alarms and performance events.

Supports the transparent transmission and termination of the POH

bytes. Supports the setting and query of the J0 bytes.

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Function and
Feature

SL16A

Processing of the K
byte

Processes two sets of the K bytes.

Specifications of
the REG

Supports the setting and query of the REG working mode.

Protection scheme

Supports the two-fiber MSP protection ring, four-fiber MSP protection

ring, linear MSP protection, SNCP, SNCTP and SNCMP.
Supports the optical-path-shared MSP and SNCP protection.

Maintenance
feature

Supports inloop and outloop for optical interfaces.

Supports warm reset and cold reset. The warm reset does not affect
services.
Supports the function of querying the manufacturing information of the
board.
Supports the in-service loading of the FPGA.
Supports the upgrade of the board software without affecting services.
Supports AU-3 services.

5.10.3 Working Principle and Signal Flow

The SL16A board consists of the O/E conversion module, MUX/DEMUX module, SDH
overhead processing module, RST and so on.
Figure 5-27 shows the block diagram for the working principle of the N1SL16A and N2SL16A.
Figure 5-27 Block diagram for the working principle of the N1SL16A and N2SL16A
155 MHz

2.488
Gbit/s

2.488
Gbit/s

S
P
I
O/E

K1 and K2

K1 and K2 insertion/extration

Cross-connect
unit

2.488
Gbit/s

16 x 155
Mbit/s

RST

MST

MSA

high speed bus

Cross-connect
unit A

high speed bus

Cross-connect
unit B

HPT

MUX

DCC
SDH overhead processing module

IIC

Communication
and control
module

LOS
Laser shut down

+3.3 V
5V
+1.8 V

Issue 02 (2007-09-10)

Cross-connect
unit

DEMUX

O/E

2.488
Gbit/s

16 x 155
Mbit/s

Reference clock

155 MHz
PLL

DC/DC
converter

DC/DC
converter

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Frame header
Communication

SCC unit

Cross-connect
unit
SCC unit

-48 V/-60 V

Fuse

-48 V/-60 V
Fuse

+3.3 V

+3.3 V backup power

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Figure 5-28 shows the block diagram for the working principle of the N3SL16A.
Figure 5-28 Block diagram for the working principle of the N3SL16A
155 MHz

2.488
Gbit/s

2.488
Gbit/s

K1 and K2

K1 and K2 insertion/extration

Cross-connect
unit

Cross-connect
unit

DEMUX

O/E
S
P
I

2.488
Gbit/s

16 x 155
Mbit/s

Reference clock

155 MHz
PLL

2.488
Gbit/s

16 x 155
Mbit/s

RST

MST

MSA

Cross-connect
unit A

high speed bus

Cross-connect
unit B

HPT

MUX

O/E

high speed bus

DCC

SCC unit

SDH overhead processing module

IIC

Communication
and control
module

LOS
Laser shut down

+3.3 V
5V
+1.8 V

DC/DC
converter

DC/DC
converter

Frame header
Communication

Cross-connect
unit
SCC unit

-48 V/-60 V

Fuse

-48 V/-60 V
Fuse

+3.3 V

+3.3 V backup power

O/E Conversion Module

l

In the receive direction, it converts the received optical signals into electrical signals.

In the transmit direction, it converts the electrical signals into SDH optical signals, and then
send optical signals to fibers for transmission.

The SPI detects the R_LOS alarm and provides the function to shut down the laser.

MUX/DEMUX Module
l

In the receive direction, the DEMUX part demultiplexes the high rate electrical signals into
multiple parallel electrical signals, and recovery the clock signal at the same time.

In the transmit direction, the MUX part multiplexes the parallel electrical signals received
from the SDH overhead processing module into high rate electrical signals.

SDH Overhead Processing Module

It includes RST, MST, MSA and HPT, and provides outloop and inloop function.

RST

5-76

In the receiving direction, RST performs frame alignment detection (A1, A2), regenerator
section trace recovery (J0) and mismatch detection, and BIP-8 errored block count.

In the transmitting direction, RST performs frame alignment insertion, regenerator section
path trace insertion, BIP-8 calculation and insertion.

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MST
l

In the receiving direction, MST performs BIP-24 errored block count, MS_REI recovery,
MS_RDI and MS_AIS detection.

In the transmitting direction, MST performs calculation and insertion of BIP-24, insertion
of MS_REI MS_RDI and MS_AIS.

Provides extraction or insertion of K1 byte and K2 byte.

In the receiving direction, MSA performs AU4 pointer interpretation, LOP and AIS
detection, pointer justification.

In the transmitting direction, MSA performs AUG assembly, AU-4 pointer generation, and
AU_AIS generation.

OH termination

J1 path trace message recovery

REI information recovering

HP_RDI detection (path status monitoring)

UNEQ and AIS detection (signal label monitoring)

VC-4 BIP-8 errored block count

MSA

HPT

Communication and Control Module

l

Manages and configures other modules of the boards.

Performs inter-board communication through internal Ethernet interface.

Tracing the clock signal from the active and the standby cross-connect units.

Implements laser controlling function.

Realizes the pass-through of orderwire and ECC bytes between the paired slots constituting
the ADM when the CXL is not online.

Selects the clock and frame header from the active or the standby cross-connect units.

Controls the indicator on the board.

DC/DC Converter Module

l

This module provides the board with required DC voltages. It converts the 48/60 V power
supply to the following voltages: + 3.3 V, + 1.8 V, + 5 V. This module also provides
protection for the board +3.3V power supply.

5.10.4 Front Panel

On the front panel of the SL16A, there are indicators, interfaces, barcode, laser safety class label,
and APD alarm label.

Appearance of the Front Panel

Figure 5-29 shows the appearance of the front panel of the SL16A.
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Figure 5-29 Front panel of the SL16A

SL16A
STAT
ACT
PROG
SRV

CLASS 1
LASER
PRODUCT

APD

Receiver
MAX:-9dBm

OUT

IN

SL16A

Indicators
The following indicators are present on the front panel of the board:
l

Board hardware state indicator (STAT), which is green or red when lit.

Service activating state indicator (ACT), which is green when lit.

Board software state indicator (PROG), which is green or red when lit.

Service alarm indicator (SRV), which is red, green or yellow when lit.

For indication of these indicators, see A Equipment and Board Alarm Indicators.

Interfaces
There is one pair of optical interfaces on the front panel of the SL16A. Table 5-46 lists the type
and usage of the optical interfaces.
Table 5-46 Optical interfaces of the SL16A

5-78

Interface

Interface Type

Usage

IN

LC

Receives optical signals.

OUT

LC

Transmits optical signals.

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5.10.5 Valid Slots

The SL16A can be housed in any of slots 1213 in the OptiX OSN 1500A subrack. The SL16A
can be housed in any of slots 1113 in the OptiX OSN 1500B subrack.

5.10.6 Board Feature Code

The code behind the board name in the barcode is the board feature code. The board feature code
of the SL16A indicates the optical interface type.
Table 5-47 lists the relation between the board feature code and optical interface type for the
SL16A.
Table 5-47 Relation between the board feature code and the optical interface type
Board

Feature Code

Optical Interface Type

SSN1SL16A01,
SSN2SL16A01,
SSN3SL16A01

01

I-16

SSN1SL16A02,
SSN2SL16A02,
SSN3SL16A02

02

S-16.1

SSN1SL16A03,
SSN2SL16A03,
SSN3SL16A03

03

L-16.1

SSN1SL16A04,
SSN2SL16A04,
SSN3SL16A04

04

L-16.2

5.10.7 Board Configuration Reference

You can use the T2000 to set the J0 parameter for the SL16A.
For details on the parameter, refer to F Board Configuration Reference.

5.10.8 Technical Specifications

The technical specifications of the SL16A cover the optical interface specifications, board
dimensions, weight and power consumption.

Optical Interface Specifications

Table 5-48 lists the specifications of the optical interfaces of the SL16A.
Table 5-48 Specifications of the optical interfaces of the SL16A

Issue 02 (2007-09-10)

Item

Specification

Nominal
bit rate

2488320 kbit/s

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Item

Specification

Optical
Interface
Type

I-16

S-16.1

L-16.1

L-16.2

Optical
source type

MLM

SLM

SLM

SLM

Working
wavelength
(nm)

12661360

12601360

12801335

15001580

Launched
optical
power
(dBm)

10 to 3

5 to 0

2 to +3

2 to +3

Receiver
sensitivity
(dBm)

18

18

27

28

Overload
optical
power
(dBm)

Min.
extinction
ratio (dB)

8.2

8.2

8.2

8.2

Laser Safety Class

The safety class of the laser on the board is CLASS 1.
The maximum launched optical power of the optical interfaces is lower than 10 dBm (10 mW).

Mechanical Specifications
The mechanical specifications of the SL16A are as follows:
l

Board dimensions (mm): 262.05 (H) x 220 (D) x 25.4 (W)

Weight (kg):

N1SL16A and N2SL16A:1.1

N3SL16A:0.9

Weight (kg):1.1

Power Consumption
In the normal temperature (25), the maximum power consumption of the N1SL16A and
N2SL16A are 20 W.
In the normal temperature (25), the maximum power consumption of the N3SL16A is 17 W.
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5.11 SF16
This section describes the SF16, a 1 x STM-16 optical interface board with the out-band FEC
function, in terms of the version, function, working principle, front panel and specifications.
5.11.1 Version Description
The functional version of the SF16 board is N1.
5.11.2 Function and Feature
The SF16 board is used to receive and transmit one-channel OTU1 (2.666 Gbit/s, FEC) optical
signals and to process the overhead.
5.11.3 Working Principle and Signal Flow
The SF16 consists of the O/E conversion module, MUX/DEMUX module, FEC module, SDH
overhead processing module and so on.
5.11.4 Front Panel
On the front panel of the SF16, there are indicators, interfaces, barcode and laser safety class
label.
5.11.5 Valid Slots
The SF16 can be housed in any of slots 1213 in the OptiX OSN 1500A subrack. The SF16 can
be housed in any of slots 1113 in the OptiX OSN 1500B subrack.
5.11.6 Board Configuration Reference
You can use the T2000 to set parameters for the SF16.
5.11.7 Technical Specifications
The technical specifications of the SF16 cover the optical interface specifications, board
dimensions, weight and power consumption.

5.11.1 Version Description

The functional version of the SF16 board is N1.

5.11.2 Function and Feature

The SF16 board is used to receive and transmit one-channel OTU1 (2.666 Gbit/s, FEC) optical
signals and to process the overhead.
Table 5-49 lists the functions and features of the SF16.
Table 5-49 Functions and features of the SF16
Function and
Feature

SF16

Basic function

Receives and transmits 1 x OTU1 (2.666 Gbit/s, FEC) optical signals.

Supports the enabling or disabling of the FEC function.

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Function and
Feature

SF16

Specification
of the optical
interface

Supports optical interfaces of the Ve-16.2c, Ve-16.2d, and Ve-16.2f types.

The optical interfaces of the Ve-16.2c, Ve-16.2d, and Ve-16.2f types
comply with the standards defined by Huawei.
The optical interface supports the output of standard wavelengths that
comply with ITU-T G.692 and can be directly connected to the DWDM
equipment.

Specification
of the optical
module

Supports detection and query of the information on the optical module.

Service
processing

Supports VC-12, VC-3, and VC-4 services and VC-4-4c, VC-4-8c, and
VC-4-16c concatenation services.

The optical interface supports the function of setting the on/off state of the
laser and the ALS function.

Supports AU-3 services.

The SF16 board encapsulates and encodes signals with the FEC function,
and processes overhead bytes, which comply with ITU-T G.709.
Overhead
processing

Supports the processing of the OTU, ODU, and OPU overhead bytes,
performance monitoring, and alarm detection, which comply with ITU-T
G.709.
Supports the processing of the SOH of the STM-16 signals.
Supports the transparent transmission and termination of the POH bytes.
Supports the setting and query of the J0/J1/C2 bytes.

Alarm and
performance
event

Provides rich alarms and performance events.

Processing of
the K byte

Processes two sets of K bytes. One SF16 board supports a maximum of two
MSP protection rings.

Specification
of the REG

Supports the setting and query of the REG working mode.

Protection
scheme

Supports the two-fiber MSP protection ring, four-fiber MSP protection

ring, linear MSP protection, SNCP, SNCTP and SNCMP.

Supports alarms and performance events related to the OTU, ODU, and
OPU layers and the FEC function.

Supports the optical-path-shared MSP and SNCP protection.

Maintenance
feature

Supports inloop and outloop for optical interfaces.

Supports warm reset and cold reset. The warm reset does not affect services.
Supports the function of querying the manufacturing information of the
board.
Supports the in-service loading of the FPGA.
Supports the upgrade of the board software without affecting services.

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5.11.3 Working Principle and Signal Flow

The SF16 consists of the O/E conversion module, MUX/DEMUX module, FEC module, SDH
overhead processing module and so on.
Figure 5-30 shows the block diagram for the working principle of the SF16.
Figure 5-30 Block diagram for the working principle of the SF16
155 MHz PLL

2.666
Gbit/s

2.666
Gbit/s

O/E

16x155
Mbit/s

16x166
Mbit/s

155 MHz PLL

Reference clock

K1 and K2

K1 and K2 insertion/extration

Cross-connect unit

Cross-connect unit

high speed bus

S
P
I

2.666
Gbit/s

DEMUX

155 MHz

Cross-connect unit

FEC
2.666
Gbit/s

O/E

16x155
Mbit/s

16x166
Mbit/s

RST

MST

MSA

HPT
high speed bus

MUX
DCC
SDH overhead processing module

166 MHz PLL

IIC
LOS
Laser shut down

Communication
and control
module
+3.3 V

5V
+1.8 V

DC/DC
converter

DC/DC
converter

Frame header
Communication

Fuse

Cross-connect unit

SCC unit

Cross-connect unit
SCC unit
-48 V/-60 V
-48 V/-60 V

Fuse

+3.3 V backup power

The function modules are described below:

O/E Conversion Module

l

In the receive direction, the module converts the received 2.666 Gbit/s FEC optical signals
into electrical signals.

In the transmit direction, the module converts the electrical signals into SDH optical signals,
and then send optical signals to fibers for transmission.

The SPI detects the R_LOS alarm and provides function to shut down the laser.

MUX/DEMUX Module
l

In the receive direction, the DEMUX part demultiplexes the high rate electrical signals into
multiple parallel electrical signals, and recovers the clock signal at the same time.

In the transmit direction, the MUX part multiplexes the parallel electrical signals received
from the FEC module into high rate electrical signals.

In the downstream direction, the FEC encoding and decoding module receives 2.488 Gbit/
s SDH signals, which are sent by the SDH overhead processing chip. After frame search,

FEC Module

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FEC encoding, data packets encapsulation and scrambling, the 2.488 Gbit/s SDH signals
are converted to 2.666 Gbit/s signals and then transmitted to the MUX module.
l

In the upstream direction, signals take the reverse process. The FEC encoding and decoding
module receives the 2.666 Gbit/s signals from the DEMUX module. After frame search,
FEC encoding, data packets encapsulation and scrambling in the FEC module, the 2.488
Gbit/s signals are recovered and then transmitted to SDH overhead processing chip. The
frame format of the 2.666 Gbit/s signals complies with ITU G.709.

The FEC processing module connects to the communication and control unit through a
CPU bus. The CPU controls working modes of the FEC module by configuring the internal
register. The working mode can be regenerator mode, that is, REG mode. The CPU can
monitor the performance through the internal register.

SDH Overhead Processing Module

This module includes RST, MST, MSA and HPT. It also provides inloop and outloop function.

RST
l

In the receive direction, RST performs frame alignment detection (A1, A2), regenerator
section trace recovery (J0), mismatch detection, BIP-8 errored block count.

In the transmit direction, RST performs frame alignment insertion, regenerator section path
trace insertion, BIP-8 calculation and insertion.

In the receive direction, MST performs BIP-24 errored block count, MS_REI recovery,
MS_RDI and MS_AIS detection.

In the transmit direction, MST performs BIP-24 calculation and insertion, MS_REI
MS_RDI and MS_AIS insertion.

Provides extraction or insertion of K1 byte and K2 byte.

In the receive direction, MSA performs AU4's pointer interpretation, LOP and AIS
detection, pointer justification.

In the transmit direction, MSA performs AUG assembly, AU-4 pointer generation, and
AU_AIS generation.

OH termination

J1 path trace message recovery

REI information recovering

HP_RDI detection (path status monitoring)

UNEQ and AIS detection (signal label monitoring)

VC-4 BIP-8 errored block count

MST

MSA

HPT

Communication and Control Module

l

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Manages and configures other modules of the boards.

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Performs inter-board communication through internal Ethernet interface.

Traces the clock signal from the active and the standby cross-connect unit.

Controls the laser.

Realizes the pass-through of orderwire and ECC bytes between the paired slots constituting
the ADM when the CXL is not online.

Selects the clock and frame header from the active or the standby cross-connect units.

Controls the indicator on the board.

DC/DC Converter
It provides the board with required DC voltages. It converts the 48 V/60 V power supply to
the following voltages: + 3.3 V, + 1.8 V, + 5 V. It also provides protection for +3.3V power
supply.

5.11.4 Front Panel

On the front panel of the SF16, there are indicators, interfaces, barcode and laser safety class
label.

Appearance of the Front Panel

Figure 5-31 shows the appearance of the front panel of the SF16.
Figure 5-31 Front panel of the SF16

SF 16
STAT
ACT
PROG
SRV

CLASS 1
LASER
PRODUCT

OUT

IN

SF16

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Indicators
The following indicators are present on the front panel of the board:
l

Board hardware state indicator (STAT), which is green or red when lit.

Service activating state indicator (ACT), which is green when lit.

Board software state indicator (PROG), which is green or red when lit.

Service alarm indicator (SRV), which is red, green or yellow when lit.

For indication of these indicators, see A Equipment and Board Alarm Indicators.

Interfaces
There is one pair of optical interfaces on the front panel of the SF16. Table 5-50 lists the type
and usage of the optical interfaces.
NOTE

The SF16 uses the unpluggable optical module.

Table 5-50 Optical interfaces of the SF16

Interface

Interface
Type

Usage

IN

LC

Receives optical signals.

OUT

LC

Transmits optical signals.

5.11.5 Valid Slots

The SF16 can be housed in any of slots 1213 in the OptiX OSN 1500A subrack. The SF16 can
be housed in any of slots 1113 in the OptiX OSN 1500B subrack.

5.11.6 Board Configuration Reference

You can use the T2000 to set parameters for the SF16.
You can use the T2000 to set the following parameters for the SF16:
l

J0

J1

C2

For details on the parameters, refer to F Board Configuration Reference.

5.11.7 Technical Specifications

The technical specifications of the SF16 cover the optical interface specifications, board
dimensions, weight and power consumption.

Optical Interface Specifications

Table 5-51 lists the specifications of the optical interfaces of the SF16.
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Table 5-51 Specifications of the optical interfaces of the SF16

Item

Specification

Nominal bit rate

2666057.143 kbit/s

Service processing
capability

1 x STM-16 standard services or concatenation services

Line code

NRZ

Optical Interface
Typea

Ve-16.2c

Ve-16.2d

Ve-16.2f

FEC+BA(14)
+PA

FEC+BA(17)
+PA

FEC+BA(17)+RA+PA

Optical source type

SLM

SLM

SLM

Wavelength (nm)

1550.12

Launched optical
power (dBm)b

5 to 1

5 to 1

5 to 1

Launched optical
power (dBm)c

1315

1315

1518

Receiver sensitivity
(dBm)b

27.5

27.5

27.5

Receiver sensitivity
(dBm)d

37

37

42

Overload optical
power (dBm)d

10

10

10

Min. extinction ratio

(dB)b

10

10

10

a: The numbers in the brackets indicate the specifications. For example, BA (14) indicates
that the optical power amplified by the BA is 14 dBm. "FEC+BA+PA+RA" indicates that the
optical interface is used with the FEC, PA, Raman amplifier and BA.
b: The specifications are for the optical module itself rather than for the amplifier.
c: The specifications are for the BA.
d: The specifications are for the PA.
Table 5-52 Specifications of the ITU-T G.692-compliant optical interfaces that output standard
wavelengths

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Item

Specification

Nominal bit rate

2666057.143 kbit/s

Dispersion limit (km)

640

Mean launched optical power (dBm)

5 to 1

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Item

Specification

Receiver sensitivity (dBm)

28

Min. overload (dBm)

Max. allowed dispersion (ps/nm)

10880

Min. extinction ratio (dB)

8.2

Laser Safety Class

The safety class of the laser on the board is CLASS 1.
The maximum launched optical power of the optical interfaces is lower than 10 dBm (10 mW).

Mechanical Specifications
The mechanical specifications of the SF16 are as follows:
l

Board dimensions (mm): 262.05 (H) x 220 (D) x 25.4 (W)

Weight (kg): 1.1

Power Consumption
In the normal temperature (25), the maximum power consumption of the SF16 is 26 W.

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PDH Processing Boards

About This Chapter

This chapter describes the PDH processing boards for the E1/T1, E3/T3, E4/STM-1, and DDN
signals.
6.1 PL1
This section describes the PL1, a 16 x E1 processing board, in terms of the version, function,
working principle, front panel and specifications.
6.2 PD1
This section describes the PD1, a 32 x E1 processing board, in terms of the version, function,
working principle, front panel and specifications.
6.3 PQ1
This section describes the PQ1, a 63 x E1 processing board, in terms of the version, function,
principle, front panel, configuration and specifications.
6.4 PQM
This section describes the PQM, a 63 x E1/T1 processing board, in terms of the version, function,
principle, front panel, configuration and specifications.
6.5 PL3
This section describes the PL3, a 3 x E3/T3 processing board, in terms of the version, function,
principle, front panel, configuration and specifications.
6.6 PL3A
This section describes the PL3A, a 3 x E3/T3 processing board, in terms of the version, function,
principle, front panel, configuration and specifications.
6.7 PD3
This section describes the PD3, a 6 x E3/T3 processing board, in terms of the version, function,
principle, front panel, configuration and specifications.
6.8 PQ3
This section describes the PQ3, a 12 x E3/T3 processing board, in terms of the version, function,
principle, front panel, configuration and specifications.
6.9 DX1
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This section describes the DX1, a DDN interface convergence board, in terms of the version,
function, principle, front panel, configuration and specifications.
6.10 DXA
This section describes the DXA, a DDN convergence board, in terms of the version, function,
principle, front panel, configuration and specifications.
6.11 SPQ4
This section describes the SPQ4, a 4 x E1/STM-1 processing board, in terms of the version,
function, working principle, front panel and specifications.

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6.1 PL1
This section describes the PL1, a 16 x E1 processing board, in terms of the version, function,
working principle, front panel and specifications.
6.1.1 Version Description
The functional version of the PL1 is R1.
6.1.2 Function and Feature
The PL1 is used to directly access and process E1 electrical signals, to process the overhead, to
report alarms and performance events and to provide the maintenance features.
6.1.3 Working Principle and Signal Flow
The PL1 consists of the PPI, E1 mapping/demapping, interface conversion module,
communication and control module and so on.
6.1.4 Front Panel
On the front panel of the PL1, there are indicators and interfaces.
6.1.5 Valid Slots
The PL1 can be housed in any of slots 69 of the OptiX OSN 1500A subrack or the OptiX OSN
1500B subrack.
6.1.6 Board Feature Code
The code behind the board name in the barcode is the board feature code. The board feature code
of the PL1 indicates the interface impedance type.
6.1.7 Board Configuration Reference
You can use the T2000 to set parameters for the PL1.
6.1.8 Technical Specifications
The technical specifications of the PL1 cover the optical interface specifications, board
dimensions, weight and power consumption.

6.1.1 Version Description

The functional version of the PL1 is R1.

6.1.2 Function and Feature

The PL1 is used to directly access and process E1 electrical signals, to process the overhead, to
report alarms and performance events and to provide the maintenance features.
Table 6-1 lists the functions and features of the PL1.
Table 6-1 Functions and features of the PL1

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Function and
Feature

PL1

Basic function

Processes 16 x E1 signals (interfaces available on the front panel).

Service processing

Directly accesses and processes 16 x E1 electrical signals.

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Function and
Feature

PL1

Overhead processing

Supports the transparent transmission and termination of POH bytes

at the VC-12 level, such as the J2 byte.

Alarm and
performance event

Provides rich alarms and performance events for easy management

and maintenance of the equipment.

Maintenance feature

Supports inloop and outloop for electrical interfaces.

Supports warm reset and cold reset. The warm reset does not affect
services.
Supports the function of querying the manufacturing information of
the board.
Supports the in-service loading of the FPGA.
Supports the upgrade of the board software without affecting
services.
Supports the PRBS function.

6.1.3 Working Principle and Signal Flow

The PL1 consists of the PPI, E1 mapping/demapping, interface conversion module,
communication and control module and so on.
Figure 6-1 shows the block diagram for the functions of the PL1.
Figure 6-1 Block diagram for the functions of the PL1
1.5 MHz/
2 MHz
OSC

E1

E1

155 MHz
PLL

155 Mbit/s

6 x 2 Mbit/s

LIU

E1
mapping/
demapping

P
P
I

6 x 2 Mbit/s

LIU

LOS
Outloop/Inloop control

Reference clock

155 Mbit/s

Interface
coversion
module

+1.8 V

DC/DC
converter

Cross-connect unit
A

High speed bus

Cross-connect unit
B

Cross-connect unit

Communication

+3.3 V

+2.5 V

High speed bus

Frame header

Communication and
control module

DC/DC
converter

Cross-connect unit

SCC Unit

Fuse

-48 V/ -60 V
-48 V/ -60 V

Fuse
+3.3 V backup
power

Figure 6-2 shows the block diagram of the E1 mapping/demapping.

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Figure 6-2 Block diagram of the E1 mapping/demapping

E1 mapping/demapping
E1

LPA

PDH AIS
Detector

LPT

LPOH(V5/J2/N2/
K4)
insertion
LPOH(V5/J2/N2/
K4)
Extraction

HPA

HPT

STM-1

TU-AIS/TU-LOP
Detector

E1

STM-1

LPA

LPT

HPA

HPT

The function modules are described as follows.

PPI
The PPI module mainly consists of line interface units (LIUs). It provides inloop and outloop
function. This module:
l

Encodes and decodes signals.

Recovers data and clock.

Processes the PDH LOS signals.

E1 mapping/demapping
l

LPA

The 2 Mbit/s plesiochronous stream is inserted in a VC-12 container to be adapted so as to

be transported into the synchronous network for check of the PDH AIS.

LPT

The virtual container (VC-12) is formatted. The VC-12 is structured so that its octets are
distributed within a 125 us interval (for example, one STM1 period), and consists of the
VC-12 container and POH. The latter contains nine octets equally distributed within the
frame bytes for VC-12: V5, J2, N2, and K4.

HPA

HPA generates and processes channel level TU-PTR. In the receive direction, the signals
are split into VC-12s, which are located and isolated in TU-12. TU-PTR is processed. TUAIS and TU-LOP alarms are monitored. In the transmit direction, VC-12s are located
precisely and added with TU-PTR. 63 TUG-3s are multiplexed into a VC-4 by bytes
interleaving. The sequence is: TUG2->TUG3->VC-4.

HPT

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l

The virtual container (VC-4) is formatted. The VC-4 is structured so that its octets are
distributed within a 125 us interval (for example, one STM1 period), and consists of the
C4 container and POH.

MST and RST

These two functions are necessary to create a proprietary STM1 signal in order to interface
the E1 mapping/demapping block with the multiplex unit.

Interface conversion module

The interface converting module mainly converts 622 Mbit/s low voltage differential signals
(LVDS) bus of SDH system into parallel bus. Through this module, the high-rate backplane
interface connects to low-rate interface chip of the transmitting system.

Communication and control module

l

Manages and configures other modules of the boards.

Performs inter-board communication through internal Ethernet interface.

Traces the clock signal from the active and the standby cross-connect units.

Selects the clock and frame header from the active or the standby cross-connect units.

Control the indicator on the board.

DC/DC converter
It provides the board with required DC voltages. It converts the 48 V/60 V power supply to
the following voltages: + 2.5 V, + 3.3 V, + 1.8 V. In addition, protection for +3.3 V power are
provided to the board.

6.1.4 Front Panel

On the front panel of the PL1, there are indicators and interfaces.

Appearance of the Front Panel

Figure 6-3 shows the appearance of the front panel of the PL1.
Figure 6-3 Front panel of the PL1

PL1
STAT
ACT
PROG
SRV

1-16

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Indicators
The following indicators are present on the front panel of the board:
l

Board hardware state indicator (STAT), which is green or red when lit.

Service activating state indicator (ACT), which is green when lit.

Board software state indicator (PROG), which is green or red when lit.

Service alarm indicator (SRV), which is red, green or yellow when lit.

For indication of these indicators, see A Equipment and Board Alarm Indicators.

Interfaces
There are 16 2mmHM interfaces on the front panel of the PL1. Table 6-2 lists the type and usage
of the interfaces.
Table 6-2 Interfaces on the front panel of the PL1
Interface

Interface
Type

Usage

18

2mmHM

Receives the first eight channels (18) of E1 signals.

916

2mmHM

Receives the last eight channels (916) of E1 signals.

6.1.5 Valid Slots

The PL1 can be housed in any of slots 69 of the OptiX OSN 1500A subrack or the OptiX OSN
1500B subrack.

6.1.6 Board Feature Code

The code behind the board name in the barcode is the board feature code. The board feature code
of the PL1 indicates the interface impedance type.
Table 6-3 lists the relation between the board feature code and interface impedance type for the
PL1.
Table 6-3 Relation between the board feature code and the optical interface type of the PL1
Board

Feature Code

Interface Impedance Type

SSR1PL1A01

A01

75 ohms

SSR1PL1B01

B01

120 ohms

6.1.7 Board Configuration Reference

You can use the T2000 to set parameters for the PL1.
You can use the T2000 to set the following parameters for the PL1:
l

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J2 byte
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l

V5 byte

Tributary loopback

Service loading indication

For details on these parameters, see F Board Configuration Reference.

6.1.8 Technical Specifications

The technical specifications of the PL1 cover the optical interface specifications, board
dimensions, weight and power consumption.

Electrical Interface Specifications

Table 6-4 lists the specifications of the optical interfaces of the PL1.
Table 6-4 Specifications of the electrical interfaces of the PL1
Interface
Type

Code

Output
Signal Bit
Rate

Allowed
Input
Frequency
Deviation

2048 kbit/s

HDB3

Compliant with ITU-T G.703

Allowed
Input
Attenuatio
n

Input
Jitter
Tolerance

Mechanical Specifications
The mechanical specifications of the PL1 are as follows:
l

Board dmensions (mm): 111.8 (H) x 220 X (D) x 25.4 (W)

Weight (kg): 0.5

Power Consumption
In the normal temperature (25), the maximum power consumption of the PL1 is 7 W.

6.2 PD1
This section describes the PD1, a 32 x E1 processing board, in terms of the version, function,
working principle, front panel and specifications.
6.2.1 Version Description
The PD1 has two versions, R1 and R2. The two versions have different functions.
6.2.2 Function and Feature
The PD1 is used to process E1 signals and the overhead, to report alarms and performance events,
and to provide the maintenance features and TPS protection.
6.2.3 Working Principle and Signal Flow
The PD1 consists of the PPI, E1 mapping/demapping, interface conversion module,
communication and control module and so on.
6.2.4 Front Panel
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On the front panel of the PD1, there are indicators.

6.2.5 Valid Slots
The PD1 must be used with the L75S or L12S.
6.2.6 Board Feature Code
The code behind the board name in the barcode is the board feature code. The board feature code
of the PD1 indicates the interface impedance type.
6.2.7 TPS Protection for the Board
The PD1 supports the 1:N TPS protection.
6.2.8 Board Configuration Reference
You can use the T2000 to set parameters for the PD1.
6.2.9 Technical Specifications
The technical specifications of the PD1 cover the electrical interface specifications, board
dimensions, weight and power consumption.

6.2.1 Version Description

The PD1 has two versions, R1 and R2. The two versions have different functions.
Table 6-5 lists the details on the versions of the PD1 board.
Table 6-5 Version Description of the PD1
Item

Description

Functional
version

The PD1 has two versions, R1 and R2.

Difference

The R2PD1 supports the E13 function and the board version replacement
function.

Replaceability

The R1PD1A can be replaced by the R2PD1A.

The R1PD1B can be replaced by the R2PD1B.

6.2.2 Function and Feature

The PD1 is used to process E1 signals and the overhead, to report alarms and performance events,
and to provide the maintenance features and TPS protection.
Table 6-6 lists the functions and features of the PD1.
Table 6-6 Functions and features of the PD1

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Function
and
Feature

PD1
R1PD1

R2PD1

Basic
function

Processes 32 x E1
signals.

Processes 32 x E1 signals.

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Function
and
Feature

PD1
R1PD1

R2PD1

Service
processing

Accesses and
processes 32 x E1
electrical signals
when used with the
interface board.

Accesses and processes 32 x E1 electrical signals when

used with the interface board.
Supports the E13 function, which is used to converge
E1 services into E3 services.

Overhead
processing

Supports the transparent transmission and termination of the POH bytes at the
VC-12 level, such as the J2 byte.

Alarm and
performance
event

Provides rich alarms and performance events for easy management and
maintenance of the equipment.

Maintenanc
e feature

Supports inloop and outloop for the electrical interfaces.

Supports warm reset and cold reset. The warm reset does not affect services.
Supports the function of querying the manufacturing information of the board.
Supports the in-service loading of the FPGA.
Supports the upgrade of the board software without affecting services.
Supports the PRBS function.

Protection
scheme

Supports the TPS protection when used with the electrical interface switching
board.

6.2.3 Working Principle and Signal Flow

The PD1 consists of the PPI, E1 mapping/demapping, interface conversion module,
communication and control module and so on.
Figure 6-4 shows the block diagram for the functions of the PD1.

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Figure 6-4 Block diagram for the functions of the PD1

1.5 MHz/
2 MHz
OSC

E1

E1

155 MHz
PLL

155 Mbit/s

6 x 2 Mbit/s

LIU

E1
mapping/
demapping

P
P
I

LOS
Outloop/Inloop control

Interface
coversion
module

155 Mbit/s

6 x 2 Mbit/s

LIU

Reference clock

+1.8 V

Cross-connect unit
A

High speed bus

Cross-connect unit
B

Cross-connect unit

Communication

+3.3 V

+2.5 V

High speed bus

Frame header

Communication and
control module

DC/DC
converter

DC/DC
converter

Cross-connect unit

SCC Unit

Fuse

-48 V/ -60 V
-48 V/ -60 V

Fuse
+3.3 V backup
power

Figure 6-5 shows the block diagram of the E1mapping/ demapping.

Figure 6-5 Block diagram of the E1 mapping/ demapping
E1 mapping/demapping
E1

LPA

PDH AIS
Detector

LPT

LPOH(V5/J2/N2/
K4)
insertion
LPOH(V5/J2/N2/
K4)
Extraction

HPA

HPT

STM-1

TU-AIS/TU-LOP
Detector

E1

STM-1

LPA

LPT

HPA

HPT

The function modules are described as follows.

PPI
The PPI module mainly consists of line interface units (LIUs). It provides inloop and outloop
function. This module:
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l

Encodes and decodes signals.

Recovers data and clock.

Processes the PDH LOS signals.

E1 mapping/demapping
l

LPA

The 2 Mbit/s plesiochronous stream is inserted in a VC-12 container to be adapted so as to

be transported into the synchronous network for check of the PDH AIS.

LPT

The virtual container (VC-12) is formatted. The VC-12 is structured so that its octets are
distributed within a 125 us interval (for example, one STM1 period), and consists of the
VC-12 container and POH. The latter contains nine octets equally distributed within the
frame bytes for VC-12: V5, J2, N2, and K4.

HPA

HPA generates and processes channel level TU-PTR. In the receive direction, the signals
are split into VC-12s, which are located and isolated in TU-12. TU-PTR is processed. TUAIS and TU-LOP alarms are monitored. In the transmit direction, VC-12s are located
precisely and added with TU-PTR. 63 TUG-3s are multiplexed into a VC-4 by bytes
interleaving. The sequence is: TUG2->TUG3->VC-4.

HPT

The virtual container (VC-4) is formatted. The VC-4 is structured so that its octets are
distributed within a 125 us interval (for example, one STM1 period), and consists of the
C4 container and POH.

MST and RST

These two functions are necessary to create a proprietary STM1 signal in order to interface
the E1 mapping/demapping block with the multiplex unit.

Interface conversion module

The interface converting module mainly converts 622 Mbit/s low voltage differential signals
(LVDS) bus of SDH system into parallel bus. Through this module, the high-rate backplane
interface connects to low-rate interface chip of the transmitting system.

Communication and control module

l

Manages and configures other modules of the boards.

Performs inter-board communication through internal Ethernet interface.

Traces the clock signal from the active and the standby cross-connect units.

Selects the clock and frame header from the active or the standby cross-connect units.

Control the indicator on the board.

DC/DC converter
It provides the board with required DC voltages. It converts the 48 V/60 V power supply to
the following voltages: + 2.5 V, + 3.3 V, + 1.8 V. In addition, protection for +3.3 V power are
provided to the board.
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6.2.4 Front Panel

On the front panel of the PD1, there are indicators.

Appearance of the Front Panel

Figure 6-6 shows the appearance of the front panel of the PD1.
Figure 6-6 Front panel of the PD1

PD1
STAT
ACT
PROG
SRV

Indicators
The following indicators are present on the front panel of the board:
l

Board hardware state indicator (STAT), which is green or red when lit.

Service activating state indicator (ACT), which is green when lit.

Board software state indicator (PROG), which is green or red when lit.

Service alarm indicator (SRV), which is red, green or yellow when lit.

For indication of these indicators, see A Equipment and Board Alarm Indicators.

Interfaces
There are no interfaces on the front panel of the PD1.
In the OptiX OSN 1500A subrack, the PD1 is used with the L75S or L12S, which provides 75ohm or 120-ohm E1 interfaces. For details, see the sections that describe the L75S and L12S.
In the OptiX OSN 1500B subrack, the PD1 is used with the D75S or D12S, which provides 75ohm or 120-ohm E1 interfaces. For details, see the sections that describe the D75S and D12S.

6.2.5 Valid Slots

The PD1 must be used with the L75S or L12S.
In the OptiX OSN 1500A subrack, the PD1 can be housed in any of half-width slots 2 and 12.
Table 6-7 lists the valid slots for the PD1 and corresponding slots for the L75S and L12S.
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Table 6-7 Valid slots for the PD1 and corresponding slots for the L75S and L12S in the OptiX
OSN 1500A subrack
Valid Slot for the PD1

Corresponding Slot for the L75S and L12S

Slot 12

Slot 7 (116 channels services)

Slot 6 (1732 channels services)

NOTE

Slot 2 can house a protection board of the TPS protection. The board housed in slot 2 protects the board
housed in slot 12.

In the OptiX OSN 1500B subrack, the PD1 can be housed in any of slots 13, 68 and 1113.
Table 6-8 lists the valid slots for the PD1 and the corresponding slots for the D75S and D12S.
Table 6-8 Valid slots for the PD1 and corresponding slots for the D75S and D12S in the OptiX
OSN 1500B subrack
Valid Slot for the PD1

Corresponding Slot for the D75S and

D12S

Slot 2

Slot 14

Slot 3

Slot 16

Slots 7 and 12

Slot 15

Slots 8 and 13

Slot 17

NOTE

Boards housed in slots 7 and 12 share the interface board housed in slot 15. The boards housed in slots
7 and 12 cannot be used with the interface board housed in slot 15 to add or drop services at the same
time.

Boards housed in slots 8 and 13 share the interface board housed in slot 17. The boards housed in slots
8 and 13 cannot be used with the interface board housed in slot 17 to add or drop services at the same
time.

Slot 1 can house a protection board of the TPS protection. The board housed in slot 1 protects the boards
housed in slots 2 and 3.

Slot 11 can house a protection board of the TPS protection. The board housed in slot 11 protects the
boards housed in slots 12 and 13.

Slot 6 can house a protection board of the TPS protection. The board housed in slot 6 protects the boards
housed in slots 7 and 8.

6.2.6 Board Feature Code

The code behind the board name in the barcode is the board feature code. The board feature code
of the PD1 indicates the interface impedance type.
Table 6-9 lists the relation between the board feature code and interface impedance type for the
PD1.

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Table 6-9 Relation between the board feature code and the interface impedance type
Board

Feature Code

Interface Impedance
Type

SSR1PD1A01,
SSR2PD1A01

A01

75 ohms

SSR1PD1B01,
SSR2PD1B01

B01

120 ohms

6.2.7 TPS Protection for the Board

The PD1 supports the 1:N TPS protection.

Protection Principle
In the OptiX OSN 1500A subrack, used with the L75S or L12S, two PD1 boards can get 1:1
TPS protection. Figure 6-7 shows the principle for the TPS protection of the PD1.
Figure 6-7 Principle of the TPS protection for the PD1 in the OptiX OSN 1500A subrack

L75S

S
L
O
T
2

S
L
O
T
7

L75S

E1protection bus

S
L
O
T
6

S
L
O
T

E1
service
bus

12

Protection

Working

Fail

PD1

PD1

Detect
board fault
Cross-connect and timing
board

TPS
switching
control bus

In the OptiX OSN 1500B subrack, used with the D75S or D12S, the PD1 boards can get 1:N
(12) TPS protection. Figure 6-8 shows the principle of the TPS protection for the PD1.

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Figure 6-8 Principle of the TPS protection for the PD1 in the OptiX OSN 1500B subrack

E1 protection bus
D75S

D75S

E1
service bus
Fail
Protection

Working

PD1

PD1

Working
PD1

Detect
board fault

TPS switching
control bus

Cross-connect and
timing board

When detecting a failure in the working PD1 board, the cross-connect board issues a command
to switch the services from the faulty PD1 to the protection PD1. In this way, services are
protected.

Hardware Configuration
In the OptiX OSN 1500A subrack, PD1 boards can be housed in the half-width slots to realize
the 1:1 TPS protection. Figure 6-9 shows the slot configuration for the 1:1 TPS protection for
the PD1.
Figure 6-9 Slot configuration for the 1:1 TPS protection for the PD1 in the OptiX OSN 1500A
subrack
Slot 1
Slot 20

PD1(P) Slot 2
Slot 3

FAN

Slot 11

Slot 6 L75S(17~32)

Slot 12 PD1(W)

Slot 7 L75S(1~16)

Slot 13

Slot 8

Slot 4

CXL16/4/1

Slot 9

EOW

Slot 5

CXL16/4/1

Slot 10

AUX

Table 6-10 shows the slot configuration for the 1:2 TPS protection for the PD1 in the OptiX
OSN 1500B subrack.

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Table 6-10 Slot configuration for the 1:2 TPS protection for the PD1 in the OptiX OSN 1500B
subrack
Board

Protection Group Before

the Slot Division

Protection Group After the Slot

Division

PD1
(protection)

Slot 6

Slot 1

Slot 11

Slot 6

PD1
(working)

Slots 7 and 8

Slots 2 and
3

Slots 12 and
13

Slots 7 and
8

D75S/D12S

Slots 15 and 17

Slots 14 and
16

Slots 15 and
17

Slots 15
and 17

The two protection groups that contain slots 6 and 11 share the protection bus and thus cannot
coexist. Before the slots are divided, the OptiX OSN 1500B supports one group of TPS protection
for E1 services. After the slots are divided, the OptiX OSN 1500B supports a maximum of two
TPS protection groups for E1 services.

6.2.8 Board Configuration Reference

You can use the T2000 to set parameters for the PD1.
You can use the T2000 to set the following parameters for the PD1:
l

J2 byte

V5 byte

Tributary loopback

Service loading indication

For details on these parameters, see F Board Configuration Reference.

6.2.9 Technical Specifications

The technical specifications of the PD1 cover the electrical interface specifications, board
dimensions, weight and power consumption.

Electrical Interface Specifications

The L12S, L75S, D12S or D75S board provides electrical interfaces for the PD1. For
specifications of the electrical interfaces, see the sections that describe these boards.

Mechanical Specifications
The mechanical specifications of the PD1 are as follows:
l

Board dmensions (mm): 111.8 (H) x 220 X (D) x 25.4 (W)

Weight (kg)

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0.5 (R1PD1)

0.56 (R2PD1)
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Power Consumption
In the normal temperature (25), the maximum power consumption of the R1PD1 is 15 W.
In the normal temperature (25), the maximum power consumption of the R2PD1 is 10.4 W.

6.3 PQ1
This section describes the PQ1, a 63 x E1 processing board, in terms of the version, function,
principle, front panel, configuration and specifications.
6.3.1 Version Description
The PQ1 has two versions, R1 and R2. The two versions have different functions.
6.3.2 Function and Feature
The PQ1 can be used to process E1 signals and the overhead, to report alarms and performance
events, to provide the maintenance feature and the TPS protection.
6.3.3 Working Principle and Signal Flow
The PQ1 consists of the PPI, E1/T1 mapping/demapping, interface conversion module and so
on.
6.3.4 Front Panel
On the front panel of the PQ1, there are indicators.
6.3.5 Valid Slots
The PQ1 must be used with the D75S, D12S or D12B.
6.3.6 Board Feature Code
The code behind the board name in the barcode is the board feature code. The board feature code
of the PQ1 indicates the interface impedance type.
6.3.7 TPS Protection for the Board
The PQ1 supports the 1:N TPS protection.
6.3.8 Board Configuration Reference
You can use the T2000 to set parameters for the PQ1.
6.3.9 Technical Specifications
The technical specifications of the PQ1 cover the electrical interface specifications, board
dimensions, weight and power consumption.

6.3.1 Version Description

The PQ1 has two versions, R1 and R2. The two versions have different functions.
Table 6-11 lists the details on the versions of the PQ1 board.
Table 6-11 Version Description of the PQ1

6-18

Item

Description

Functional
version

The PQ1 has two versions, N1 and N2.

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Item

Description

Difference

The N2PQ1 supports the E13 function and the board version replacement
function.
The N2PQ1 does not perform the tributary timing function.

Replaceability

When the tributary timing function is not required, the N1PQ1A can be
replaced by the N2PQ1A.
When the tributary timing function is not required, the N1PQ1B can be
replaced by the N2PQ1B.

NOTE: When the impedance of interfaces is ignored, the PQ1A (75 ohms) and PQ1B (100
ohms/120 ohms) are called PQ1 hereinafter.

6.3.2 Function and Feature

The PQ1 can be used to process E1 signals and the overhead, to report alarms and performance
events, to provide the maintenance feature and the TPS protection.
Table 6-12 lists the functions and features of the PQ1.
Table 6-12 Functions and features of the PQ1
Function
and
Feature

PQ1
N1PQ1

N2PQ1

Basic
function

Processes 63 x E1
signals.

Processes 63 x E1 signals.

Service
processing

Processes 63 x E1
electrical signals
when used with an
interface board.

Processes 63 x E1 electrical signals when used with an

interface board.
Supports the E13 function, which is used to converge
E1 services into E3 services.

Overhead
processing

Supports the transparent transmission and termination of the POH bytes at the
VC-12, such as the J2 byte.

Alarm and
performanc
e event

Provides rich alarms and performance events for easy management and
maintenance of the equipment.

Maintenan
ce feature

Supports inloop and outloop for electrical interfaces.

Supports warm reset and cold reset. The warm reset does not affect services.
Supports the function of querying the manufacturing information of the board.
Supports the in-service loading of the FPGA.
Supports the upgrade of the board software without affecting services.
Supports the PRBS function.

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Function
and
Feature

PQ1

Protection
scheme

Supports the TPS protection when used with the interface board.

N1PQ1

N2PQ1

When the working board is the PQ1, the protection board can be the PQM. In
this way, the hybrid protection is provided.

6.3.3 Working Principle and Signal Flow

The PQ1 consists of the PPI, E1/T1 mapping/demapping, interface conversion module and so
on.
Figure 6-10 shows the block diagram for the functions of the PQ1.
Figure 6-10 Block diagram for the functions of the PQ1
1.5 MHz/
2 MHz
OSC

E1/T1

E1/T1

155 MHz
PLL

6 x 1.5 Mbit/s/
6 x 2 Mbit/s

LIU
P
P
I

6 x 1.5 Mbit/s/
6 x 2 Mbit/s

LIU

LOS
Outloop/Inloop control

155 Mbit/s

E1/T1
mapping/
demapping

155 Mbit/s

Interface
coversion
module

+1.8 V

DC/DC
converter

Cross-connect unit
A

High speed bus

Cross-connect unit
B

Cross-connect unit

Communication

+3.3 V

DC/DC
converter

Cross-connect unit

High speed bus

Frame header

Communication and
control module

+2.5 V

Reference clock

SCC Unit

Fuse

-48 V/ -60 V
-48 V/ -60 V

Fuse
+3.3 V backup
power

Figure 6-11 shows the block diagram of the E1/T1 mapping/ demapping.

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Figure 6-11 Block diagram of the E1/T1 mapping/ demapping

E1/T1 mapping/demapping
E1/T1

LPA

PDH AIS
Detector

LPT

LPOH(V5/J2/N2/
K4)
insertion
LPOH(V5/J2/N2/
K4)
Extraction

HPA

HPT

STM-1

TU-AIS/TU-LOP
Detector

E1/T1

STM-1

LPT

LPA

HPA

HPT

The function modules are described as follows.

PPI
The PPI module mainly consists of line interface units (LIUs). It provides inloop and outloop
function. This module:
l

Encodes and decodes signals.

Recovers data and clock.

Processes the PDH LOS signals.

E1/T1 mapping/demapping
l

LPA

The 2 Mbit/s (1.5 Mbit/s) plesiochronous stream is inserted in a VC-12 container to be

adapted so as to be transported into the synchronous network for check of the PDH AIS.

LPT

The virtual container (VC-12) is formatted. The VC-12 is structured so that its octets are
distributed within a 125 us interval (for example, one STM1 period), and consists of the
VC-12 container and POH. The latter contains nine octets equally distributed within the
frame bytes for VC-12: V5, J2, N2, and K4.

HPA

HPA generates and processes channel level TU-PTR. In the receive direction, the signals
are split into VC-12s, which are located and isolated in TU-12. TU-PTR is processed. TUAIS and TU-LOP alarms are monitored. In the transmit direction, VC-12s are located
precisely and added with TU-PTR. 63 TUG-3s are multiplexed into a VC-4 by bytes
interleaving. The sequence is: TUG2->TUG3->VC-4.

HPT

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l

The virtual container (VC-4) is formatted. The VC-4 is structured so that its octets are
distributed within a 125 us interval (for example, one STM1 period), and consists of the
C4 container and POH.

MST and RST

These two functions are necessary to create a proprietary STM1 signal in order to interface
the E1/T1 mapping/demapping block with the multiplex unit.

Interface conversion module

The interface converting module mainly converts 622 Mbit/s low voltage differential signals
(LVDS) bus of SDH system into parallel bus. Through this module, the high-rate backplane
interface connects to low-rate interface chip of the transmitting system.

Communication and control module

l

Manages and configures other modules of the boards.

Performs inter-board communication through internal Ethernet interface.

Traces the clock signal from the active and the standby cross-connect units.

Selects the clock and frame header from the active or the standby cross-connect units.

Control the indicator on the board.

DC/DC converter
It provides the board with required DC voltages. It converts the 48 V/60 V power supply to
the following voltages: + 2.5 V, + 3.3 V, + 1.8 V. In addition, protection for +3.3 V power are
provided to the board.

6.3.4 Front Panel

On the front panel of the PQ1, there are indicators.

Appearance of the Front Panel

Figure 6-12 shows the appearance of the front panel of the PQ1.

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Figure 6-12 Front panel of the PQ1

PQ1
STAT
ACT
PROG
SRV

PQ1

Indicators
The following indicators are present on the front panel of the board:
l

Board hardware state indicator (STAT), which is green or red when lit.

Service activating state indicator (ACT), which is green when lit.

Board software state indicator (PROG), which is green or red when lit.

Service alarm indicator (SRV), which is red, green or yellow when lit.

For indication of these indicators, see A Equipment and Board Alarm Indicators.

Interfaces
There are no interfaces on the front panel of the PQ1.
The D75S, D12S or D12B provides 75-ohm or 120-ohm E1/T1 interfaces for the PQ1. For
details, see the sections that describe the D75S, D12S and D12B.

6.3.5 Valid Slots

The PQ1 must be used with the D75S, D12S or D12B.
The OptiX OSN 1500A does not support the PQ1 board.
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In the OptiX OSN 1500B subrack, the PQ1 can be housed in any of slots 1113, and must be
used with the D75S, D12S or D12B.
Table 6-13 lists the valid slots for the PQ1 and corresponding slots for the D75S, D12S or D12B.
Table 6-13 Valid slots for the PQ1 and corresponding slots for the D75S, D12S or D12B in the
OptiX OSN 1500B subrack
Valid Slot for the PQ1

Corresponding Slot for the D75S, D12S

and D12B

Slot 12

Slot 14 (132 channels of services)

Slot 15 (3363 channels of services)

Slot 13

Slot 16 (132 channels of services)

Slot 17 (3363 channels of services)

NOTE

Slot 11 can house a protection board of the TPS protection. The board housed in slot 11 protects the
boards housed in slots 12 and 13.

If the interface board for the boards housed in slot 12 and 13 is the D12B, the boards housed in slot 12
and 13 cannot get the TPS protection.

6.3.6 Board Feature Code

The code behind the board name in the barcode is the board feature code. The board feature code
of the PQ1 indicates the interface impedance type.
Table 6-14 lists the relation between the board feature code and interface impedance type for
the PQ1.
Table 6-14 Relation between the board feature code and the interface impedance type
Board

Feature Code

Interface Impedance
Type

SSN1PQ1A01,
SSN2PQ1A01

A01

75 ohms

SSN1PQ1B01,
SSN2PQ1B01

B01

120 ohms

6.3.7 TPS Protection for the Board

The PQ1 supports the 1:N TPS protection.

Protection Principle
In the OptiX OSN 1500B subrack, used with the D75S or D12S, the PQ1 can get the 1:N (2)
TPS protection. Figure 6-13 shows the principle of the TPS protection for the PQ1.
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Figure 6-13 Principle of the TPS protection for the PQ1 in the OptiX OSN 1500B subrack

S
L
O
T
16

D75S
D75S

S
L
O
T
17

S S
L L
O O
T T
14 15

D75S
D75S

E1
protection bus

E1
service
bus

SLOT
11

SLOT
12

SLOT
13

Working

Working

Protection

Fail

Detect
board fault
Cross-connect and
timing board

TPS switching
control bus

When detecting a failure in the working PD1 board, the cross-connect board issues a command
to switch the services from the faulty PQ1 to the protection PQ1. In this way, services are
protected.

Hardware Configuration
Table 6-15 lists the slot configuration for the 1:2 TPS protection for the PQ1 in the OptiX OSN
1500B subrack.
Table 6-15 Slot configuration for the 1:2 TPS protection for the PQ1 in the OptiX OSN 1500B
subrack

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Working Board

Protection Board

Slot

PQ1A (75 ohms)

PQ1A (75 ohms)

PQ1B (120 ohms)

PQ1B (120 ohms) or

PQM

Slot 11 can house the protection board.

The board in slot 11 protects the boards
in slots 12 and 13. Figure 6-14 shows the
slot configuration for the 1:2 TPS
protection for the PQ1.

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Figure 6-14 Slot configuration for 1:2 TPS protection of the PQ1

Slot 20

FAN

Slot 14

D75S

Slot 15

D75S

Slot 16

D75S

Slot 17

D75S

Slot 11

Protection

Slot 6

Slot 12

Working

Slot 7

Slot 13

Working

Slot 8

Slot 4

CXL16/4/1

Slot 9

EOW

Slot 5

CXL16/4/1

Slot 10

AUX

Slot 18

PIU

Slot 19

PIU

6.3.8 Board Configuration Reference

You can use the T2000 to set parameters for the PQ1.
You can use the T2000 to set the following parameters for the PQ1:
l

J2 byte

V5 byte

Tributary loopback

Service loading indication

For details on these parameters, see F Board Configuration Reference.

6.3.9 Technical Specifications

The technical specifications of the PQ1 cover the electrical interface specifications, board
dimensions, weight and power consumption.

Electrical Interface Specifications

The D75S, D12S or D12B provides electrical interfaces for the PQ1. For the specifications of
these electrical interfaces, see the section that describes the D75S, D12S or D12B.

Mechanical Specifications
The mechanical specifications of the PQ1 are as follows:
l

Board dimensions (mm): 262.05 (H) x 220 (D) x 25.4 (W)

Weight (kg): 1.0

Power Consumption
In the normal temperature (25), the maximum power consumption of the N1PQ1 is 19 W.
In the normal temperature (25), the maximum power consumption of the N2PQ1 is 13 W.
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6.4 PQM
This section describes the PQM, a 63 x E1/T1 processing board, in terms of the version, function,
principle, front panel, configuration and specifications.
6.4.1 Version Description
The functional version of the PQM board is N1.
6.4.2 Function and Feature
The PQM is used to process E1/T1 signals and the overhead, to report alarms and performance
events, and to provide the maintenance features and TPS protection.
6.4.3 Working Principle and Signal Flow
The PQM consists the PPI, E1/T1 mapping/demapping, interface conversion module,
communication and control module and so on.
6.4.4 Front Panel
On the front panel of the PQM, there are indicators.
6.4.5 Valid Slots
The OptiX OSN 1500A does not support the PQM board.
6.4.6 TPS Protection for the Board
The PQM supports the 1:N TPS protection.
6.4.7 Board Configuration Reference
You can use the T2000 to set parameters for the PQM.
6.4.8 Technical Specifications
The technical specifications of the PQM cover the electrical interface specifications, board
dimensions, weight and power consumption.

6.4.1 Version Description

The functional version of the PQM board is N1.

6.4.2 Function and Feature

The PQM is used to process E1/T1 signals and the overhead, to report alarms and performance
events, and to provide the maintenance features and TPS protection.
Table 6-16 lists the functions and features of the PQM.
Table 6-16 Functions and features of the PQM

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Function
and Feature

PQM

Basic function

Processes 63 x E1/T1 signals.

Service
processing

The PQM accesses and processes 63 x E1/T1 electrical signals when used
with the interface board. Each channel can be configured as E1 or T1.

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Function
and Feature

PQM

Overhead
processing

Supports the transparent transmission and termination of the POH bytes at

the VC-12 level, such as the J2 byte.

Alarm and
performance
event

Provides rich alarms and performance events for easy management and
maintenance of the equipment.

Maintenance
feature

Supports inloop and outloop for electrical interfaces.

Supports warm reset and cold reset. The warm reset does not affect services.
Supports the function of querying the manufacturing information of the
board.
Supports the in-service loading of the FPGA.
Supports the upgrade of the board software without affecting services.
Supports the PRBS function.
When used with the interface board, the PQM supports the TPS protection.

Protection
scheme

When the working board is the PQ1, the protection board can be the PQM.
In this way, the hybrid protection is provided.

6.4.3 Working Principle and Signal Flow

The PQM consists the PPI, E1/T1 mapping/demapping, interface conversion module,
communication and control module and so on.
Figure 6-15 shows the block diagram for the functions of the PQM.
Figure 6-15 Block diagram for the functions of the PQM
1.5 MHz/
2 MHz
OSC

E1/T1

E1/T1

155 MHz
PLL

6 x 1.5 Mbit/s/
6 x 2 Mbit/s

LIU
P
P
I

6 x 1.5 Mbit/s/
6 x 2 Mbit/s

LIU

LOS
Outloop/Inloop control

155 Mbit/s

E1/T1
mapping/
demapping

155 Mbit/s

Interface
coversion
module

+1.8 V

DC/DC
converter

Cross-connect unit
A

High speed bus

Cross-connect unit
B

Cross-connect unit

Communication

+3.3 V

DC/DC
converter

Cross-connect unit

High speed bus

Frame header

Communication and
control module

+2.5 V

Reference clock

SCC Unit

Fuse

-48 V/ -60 V
-48 V/ -60 V

Fuse
+3.3 V backup
power

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Figure 6-16 shows the block diagram of the E1/T1 mapping/ demapping.
Figure 6-16 Block diagram of the E1/T1 mapping/ demapping
E1/T1 mapping/demapping
E1/T1

LPA

PDH AIS
Detector

LPT

LPOH(V5/J2/N2/
K4)
insertion
LPOH(V5/J2/N2/
K4)
Extraction

HPA

HPT

STM-1

TU-AIS/TU-LOP
Detector

E1/T1

STM-1

LPT

LPA

HPA

HPT

The function modules are described as follows.

PPI
The PPI module mainly consists of line interface units (LIUs). It provides inloop and outloop
function. This module:
l

Encodes and decodes signals.

Recovers data and clock.

Processes the PDH LOS signals.

E1/T1 mapping/demapping
l

LPA

The 2 Mbit/s (1.5 Mbit/s) plesiochronous stream is inserted in a VC-12 container to be

adapted so as to be transported into the synchronous network for check of the PDH AIS.

LPT

The virtual container (VC-12) is formatted. The VC-12 is structured so that its octets are
distributed within a 125 us interval (for example, one STM1 period), and consists of the
VC-12 container and POH. The latter contains nine octets equally distributed within the
frame bytes for VC-12: V5, J2, N2, and K4.

HPA

HPA generates and processes channel level TU-PTR. In the receive direction, the signals
are split into VC-12s, which are located and isolated in TU-12. TU-PTR is processed. TUAIS and TU-LOP alarms are monitored. In the transmit direction, VC-12s are located
precisely and added with TU-PTR. 63 TUG-3s are multiplexed into a VC-4 by bytes
interleaving. The sequence is: TUG2->TUG3->VC-4.

HPT

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l

The virtual container (VC-4) is formatted. The VC-4 is structured so that its octets are
distributed within a 125 us interval (for example, one STM1 period), and consists of the
C4 container and POH.

MST and RST

These two functions are necessary to create a proprietary STM1 signal in order to interface
the E1/T1 mapping/demapping block with the multiplex unit.

Interface conversion module

The interface converting module mainly converts 622 Mbit/s low voltage differential signals
(LVDS) bus of SDH system into parallel bus. Through this module, the high-rate backplane
interface connects to low-rate interface chip of the transmitting system.

Communication and control module

l

Manages and configures other modules of the boards.

Performs inter-board communication through internal Ethernet interface.

Traces the clock signal from the active and the standby cross-connect units.

Selects the clock and frame header from the active or the standby cross-connect units.

Control the indicator on the board.

DC/DC converter
It provides the board with required DC voltages. It converts the 48 V/60 V power supply to
the following voltages: + 2.5 V, + 3.3 V, + 1.8 V. In addition, protection for +3.3 V power are
provided to the board.

6.4.4 Front Panel

On the front panel of the PQM, there are indicators.

Appearance of the Front Panel

Figure 6-17 shows the appearance of the front panel of the PQM.

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Figure 6-17 Front panel of the PQM

PQM
STAT
ACT
PROG
SRV

PQM

Indicators
The following indicators are present on the front panel of the board:
l

Board hardware state indicator (STAT), which is green or red when lit.

Service activating state indicator (ACT), which is green when lit.

Board software state indicator (PROG), which is green or red when lit.

Service alarm indicator (SRV), which is red, green or yellow when lit.

For indication of these indicators, see A Equipment and Board Alarm Indicators.

Interfaces
There are no interfaces on the front panel of the PQM.
The D12S or D12B provides 100-ohm T1/E1 interfaces for the PQM. For details, see the sections
that describe the D12S and D12B.

6.4.5 Valid Slots

The OptiX OSN 1500A does not support the PQM board.
In the OptiX OSN 1500B subrack, the PQM can be housed in any of slots 1113, and must be
used with the D12S or D12B.
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Table 6-17 lists the valid slots for the PQM and corresponding slots for the D12S and D12B.
Table 6-17 Valid slots for the PQM and corresponding slots for the D12S and D12B in the OptiX
OSN 1500B subrack
Valid Slot for the PQM

Corresponding Slot for the D12S and

D12B

Slot 12

Slot 14 (132 channels of services)

Slot 15 (3363 channels of services)

Slot 13

Slot 16 (132 channels of services)

Slot 17 (3363 channels of services)

NOTE

Slot 11 can house a protection board of the TPS protection. The board housed in slot 11 protects the
boards housed in slots 12 and 13.

If the interface board for the boards housed in slots 12 and 13 is the D12B, the boards housed in slots
12 and 13 cannot get the TPS protection.

6.4.6 TPS Protection for the Board

The PQM supports the 1:N TPS protection.

Protection Principle
In the OptiX OSN 1500B, used with the D12S, the PQM can be configured into one 1:N (N
2) TPS protection group. Figure 6-18 shows the principle of the TPS protection for the PQM.

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Figure 6-18 Principle of the TPS protection for the PQM in the OptiX OSN 1500B subrack

S
L
O
T
16

S
L
O
T
17

D12S

D12S

D12S

S S
L L
O O
T T
14 15

D12S

E1/T1
protection bus

E1/T1
service
bus

SLOT
11

SLOT
12

SLOT
13

Working

Working

Protection

Fail

Detect
board fault
Cross-connect and
timing board

TPS switching
control bus

When detecting a fault in the working PQM board, the cross-connect board issues a command
to switch the services from the faulty PQM to the protection PQM. In this way, services are
protected.

Hardware Configuration
Table 6-18 lists the slot configuration for the 1:2 TPS protection for the PQM in the OptiX OSN
1500B subrack.
Table 6-18 Slot configuration for the 1:2 TPS protection for the PQM in the OptiX OSN 1500B
subrack

Issue 02 (2007-09-10)

Working
Board

Protection Board

Slot

PQM (E1)

PQM (E1)

PQM (T1)

PQM (T1)

Slot 11 can house the protection board. The board

in slot 11 protects the boards in slots 12 and 13.
Figure 6-19 shows the slot configuration for the
1:2 TPS protection for the PQM.

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Figure 6-19 Slot configuration for the 1:2 TPS protection for the PQM in the OptiX OSN 1500B
subrack

Slot 20

FAN

Slot 14

D12S

Slot 15

D12S

Slot 16

D12S

Slot 17

D12S

Slot 11

Protection

Slot 6

Slot 12

Working

Slot 7

Slot 13

Working

Slot 8

Slot 4

CXL16/4/1

Slot 9

EOW

Slot 5

CXL16/4/1

Slot 10

AUX

Slot 18

PIU

Slot 19

PIU

6.4.7 Board Configuration Reference

You can use the T2000 to set parameters for the PQM.
You can use the T2000 to set the following parameters for the PQM:
l

J2 byte

V5 byte

Tributary loopback

Service loading indication

Path service type

For details on these parameters, see F Board Configuration Reference.

6.4.8 Technical Specifications

The technical specifications of the PQM cover the electrical interface specifications, board
dimensions, weight and power consumption.

Electrical Interface Specifications

The D12S or D12B provides electrical interfaces for the PQM. For the specifications of the
electrical interfaces, see the sections that describe the D12S and D12B.

Mechanical Specifications
The mechanical specifications of the PQM are as follows:
l

Board dimensions (mm): 262.05 (H) x 220 (D) x 25.4 (W)

Weight (kg): 1.0

Power Consumption
In the normal temperature (25), the maximum power consumption of the PQM is 22 W.
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6.5 PL3
This section describes the PL3, a 3 x E3/T3 processing board, in terms of the version, function,
principle, front panel, configuration and specifications.
6.5.1 Version Description
The PL3 has two versions, N1 and N2. The two versions have different functions.
6.5.2 Function and Feature
The PL3 can be used to process E3/T3 signals and the overhead, to report alarms and performance
events, to provide the maintenance feature and the TPS protection.
6.5.3 Working Principle and Signal Flow
The PL3 consists the PPI, E3/T3 mapping/demapping, interface conversion module,
communication and control module and so on.
6.5.4 Front Panel
On the front panel of the PL3, there are indicators.
6.5.5 Valid Slots
The OptiX OSN 1500A does not support the PL3 board.
6.5.6 TPS Protection for the Board
The PL3 supports the 1:N TPS protection.
6.5.7 Board Configuration Reference
You can use the T2000 to set parameters for the PL3.
6.5.8 Technical Specifications
The technical specifications of the PL3 cover the electrical interface specifications, board
dimensions, weight and power consumption.

6.5.1 Version Description

The PL3 has two versions, N1 and N2. The two versions have different functions.
Table 6-19 lists the details on the versions of the PL3 board.
Table 6-19 Version description of the PL3
Item

Description

Functional
version

The PL3 has two versions, N1 and N2.

Difference

The N1PL3 does not support the E13/M13 function.

The N2PL3 supports the E13/M13 function.
The N2PL3 supports the board version replacement function and can
replace the N1PL3. After the N1PL3 is replaced, the N2PL3 is consistent
with the N1PL3 in configuration and service status.

Replaceability

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The N2PL3 can fully replace the N1PL3.

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6.5.2 Function and Feature

The PL3 can be used to process E3/T3 signals and the overhead, to report alarms and performance
events, to provide the maintenance feature and the TPS protection.
Table 6-20 lists the functions and features of the PL3.
Table 6-20 Functions and features of the PL3
Function and
Feature

PL3

Basic function

Processes 3 x E3/T3 signals.

Service processing

Accesses and processes 3 x E3/T3 electrical signals.

Overhead
processing

Supports the setting and query of all path overhead bytes at the VC-3
level.

Alarm and
performance event

Provides rich alarms and performance events for easy management and
maintenance of the equipment.

Maintenance
feature

Supports inloop and outloop for electrical interfaces.

Supports warm reset and cold reset. The warm reset does not affect
services.
Supports the function of querying the manufacturing information of the
board.
Supports the in-service loading of the FPGA.
Supports the upgrade of the board software without affecting services.
Supports the PRBS function.

Protection scheme

Supports the TPS protection when used with the interface board and the
switching board.

6.5.3 Working Principle and Signal Flow

The PL3 consists the PPI, E3/T3 mapping/demapping, interface conversion module,
communication and control module and so on.
Figure 6-20 shows the block diagram for the functions of the PL3.

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Figure 6-20 Block diagram for the functions of the PL3

34 MHz/
45 MHz
OSC

E3/T3

E3/T3

6 x 34 Mbit/s/
6 x 45 Mbit/s

LIU
P
P
I

LOS

E3/T3
mapping/
demapping

2 x 155 Mbit/s

Interface
coversion
module

High
speed bus

Frame header

Communication and
control module

Outloop/Inloop control

High
speed bus

2 x 155 Mbit/s

6 x 34 Mbit/s/
6 x 45 Mbit/s

LIU

Reference clock

155 MHz
PLL

Cross-connect unit
B

SCC Unit

Fuse

DC/DC
converter

DC/DC
converter

Cross-connect unit
A

Cross-connect unit

Communication

+3.3 V

+1.8 V

Cross-connect unit

-48 V/ -60 V
-48 V/ -60 V

Fuse
+3.3 V backup
power

OSC: Oscillator

PPI: PDH physical interface

Figure 6-21 shows the block diagram of the E3/T3 mapping/demapping.

Figure 6-21 Block diagram of the E3/T3 mapping/demapping
E3/T3 mapping/demapping

E3/T3

LPA

HPA

LPT

HPT

STM-1

LPOH(J1/C2/B3)
insertion
PDH AIS
Detector

TU-AIS/TU-LOP
Detector
LPOH(J1/C2/B3)
extraction

E3/T3

STM-1

LPA

HPA

LPT

HPT

LPA: Low order Path Adaptation

LPT: Low order Path Termination

HPA: High order Path Adaptation

HPT: High order Path Termination

The function modules are described as follows.

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PPI
l

The PPI module mainly consists of line interface units (LIUs). It provides inloop and
outloop function. This module:

Encodes and decodes signals.

Recovers data and clock.

Processes the A_LOS alarm.

E3/T3 mapping/demapping
l

LPA

The 45 Mbit/s (34 Mbit/s) plesiochronous stream is inserted in a C3 container to be adapted

so as to be transported into the synchronous network.

LPT

The virtual container (VC-3) is formatted by lower order path termination (LPT).

The VC-3 is structured so that its octets are distributed within a 125 us interval (for example,
one STM1 period), and consists of the VC-3 container and POH. The latter contains nine
octets equally distributed within the frame bytes for VC-3: J1, B3, C2, G1, F2, H4, F3, K3,
and N1.

HPA

HPA generates and processes channel level TU-PTR. In the receive direction, the signals
are split into VC-3s, which are located and isolated in TU-3. TU-PTR is processed. In the
transmit direction, VC-3s are located precisely and added with TU-PTR. Three TUG-3s
are multiplexed into a VC-4 by bytes interleaving. The sequence is: TU-3->TUG3->VC-4.

HPT

The virtual container (VC-4) is formatted. The VC-4 is structured so that its octets are
distributed within a 125 us interval (for example, one STM1 period), and consists of the
C4 container and POH.

MST and RST

The functions are necessary to create a proprietary STM1 signal in order to connect the
interface conversion module.

Interface conversion module

The interface converting module mainly converts 622 Mbit/s low voltage differential signals
(LVDS) bus of SDH system into parallel bus. Through this module, the high-rate backplane
interface connects to low-rate interface chip of the transmitting system.

Communication and control module

6-38

Manages and configures other modules of the boards.

Performs inter-board communication through internal Ethernet interface.

Traces the clock signal from the active and the standby cross-connect units.

Selects the clock and frame header from the active or the standby cross-connect units.

Controls the indicator on the board.

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DC/DC converter module

Through the DC/ DC converting module, different direct currents are provided to each chip on
the board. Two direct currents are provided: +1.8 V and +3.3 V. In addition, protection for +3.3
V power are provided to the board.

6.5.4 Front Panel

On the front panel of the PL3, there are indicators.

Appearance of the Front Panel

Figure 6-22 shows the appearance of the front panel of the PL3.
Figure 6-22 Front panel of the PL3

PL3
STAT
ACT
PROG
SRV

PL3

Indicators
The following indicators are present on the front panel of the board:
l

Board hardware state indicator (STAT), which is green or red when lit.

Service activating state indicator (ACT), which is green when lit.

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l

Board software state indicator (PROG), which is green or red when lit.

Service alarm indicator (SRV), which is red, green or yellow when lit.

For indication of these indicators, see A Equipment and Board Alarm Indicators.

Interfaces
There are no interfaces on the front panel of the PL3.
The C34S, an electrical interface switching board, provides the E3/T3 interfaces for the PL3.
For details, see the section that describes the D34S.

6.5.5 Valid Slots

The OptiX OSN 1500A does not support the PL3 board.
In the OptiX OSN 1500B subrack, the PL3 can be housed in any of slots 1213, and must be
used with the C34S.
Table 6-21 lists the valid slots for the PL3 and corresponding slots for the C34S.
Table 6-21 Valid slots for the PL3 and corresponding slots for the C34S in the OptiX OSN
1500B subrack
Valid Slot for the PL3

Corresponding Slot for the C34S

Slot 12

Slot 14

Slot 13

Slot 16

6.5.6 TPS Protection for the Board

The PL3 supports the 1:N TPS protection.

Protection Principle
In the OptiX OSN 1500B, used with the C34S and TSB8, the PL3 can be configured into one
1:1 TPS protection group. Figure 6-23 shows the principle of the TPS protection for the PL3.

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Figure 6-23 Principle of the TPS protection for the PL3 in the OptiX OSN 1500B subrack
3 xE3/T3

TSB8

C34S

Switch
control
signal

Crossconnect
and timing
board

SLOT 4/5

Protection
PL3

Working
PL3
Fail

SLOT12

SLOT13

Normal state
When the working boards are running normally, the control switch of the C34S is in position
1 and services are directly accessed to the PL3 board.

Switching state
When the working board detects a fault and requires a switching, the control switch of the
C34S is shifted to position 2 and the control switch of the TSB8 is shifted to a corresponding
position. In this way, the protection board protects the faulty working board.

Hardware Configuration
Table 6-22 lists the slot configuration for the 1:1 TPS protection for the PL3 in the OptiX OSN
1500B subrack.
Table 6-22 Slot configuration for the 1:1 TPS protection for the PL3 in the OptiX OSN 1500B
subrack

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Working
Board

Protection Board

Slot

PL3 (E3)

PL3 (E3)/PD3 (E3)

PL3 (T3)

PL3 (T3)/PD3 (T3)

If the working board is the PL3, the PD3

can be the protection board. Figure 6-24
shows the slot configuration for the 1:1 TPS
protection for the PL3.

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Figure 6-24 Slot configuration for the 1:1 TPS protection for the PL3 in the OptiX OSN 1500B
subrack
Slot 14

TSB8

Slot 15
Slot 16

C34S

Slot 17

Slot 12

FAN

PIU

Slot 19

PIU

Slot 6

Slot 11
Slot 20

Slot 18

Protection

Slot 7

Slot 13

Working

Slot 8

Slot 4

CXL16/4/1

Slot 9

EOW

Slot 5

CXL16/4/1

Slot 10

AUX

As shown in Figure 6-24, the protection board housed in slot 12 protects the board housed in
slot 13.
Table 6-23 lists the slots for the PL3, C34S and TSB8.
Table 6-23 Slots for the PL3, C34S and TSB8 in the OptiX OSN 1500B subrack
Board

Protection Group

PL3 (working)

Slot 13

PL3/PD3 (protection)

Slot 12

TSB8

Slot 14

C34S

Slot 16

6.5.7 Board Configuration Reference

You can use the T2000 to set parameters for the PL3.
You can use the T2000 to set the following parameters for the PL3:
l

J1 byte

C2 byte

Tributary loopback

Service loading indication

Path service type

For details on these parameters, see F Board Configuration Reference.

6.5.8 Technical Specifications

The technical specifications of the PL3 cover the electrical interface specifications, board
dimensions, weight and power consumption.

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Electrical Interface Specifications

The C34S provides electrical interfaces for the PL3. For the specifications of the electrical
interfaces, see the section that describes the C34S.

Mechanical Specifications
The mechanical specifications of the PL3 are as follows:
l

Board dimensions (mm): 262.05 (H) x 220 (D) x 25.4 (W)

Weight (kg): 1.0

Power Consumption
In the normal temperature (25), the maximum power consumption of the N1PL3 is 15 W.
In the normal temperature (25), the maximum power consumption of the N2PL3 is 12 W.

6.6 PL3A
This section describes the PL3A, a 3 x E3/T3 processing board, in terms of the version, function,
principle, front panel, configuration and specifications.
6.6.1 Version Description
The PL3A board has two functional versions, N1 and N2. The difference between the two
versions lies in the support for the E13/M13 function.
6.6.2 Function and Feature
The PL3A can be used to process E3/T3 signals and the overhead, to report alarms and
performance events, to provide the maintenance feature and the TPS protection.
6.6.3 Working Principle and Signal Flow
The PL3A consists of the PPI, E3/T3 mapping/demapping, interface conversion module,
communication and control module and so on.
6.6.4 Front Panel
On the front panel of the PL3A, there are indicators and interfaces.
6.6.5 Valid Slots
The PL3A can be housed in different slots in the OptiX OSN 1500A and OptiX OSN 1500B
subracks
6.6.6 Board Configuration Reference
You can use the T2000 to set parameters for the PL3A.
6.6.7 Technical Specifications
The technical specifications of the PL3A cover the electrical interface specifications, board
dimensions, weight and power consumption.

6.6.1 Version Description

The PL3A board has two functional versions, N1 and N2. The difference between the two
versions lies in the support for the E13/M13 function.
Table 6-24 lists the details on the versions of the PL3A board.
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Table 6-24 Version description of the PL3A

Item

Description

Functional
version

The PL3A has two versions, N1 and N2.

Difference

The N1PL3A does not support the E13/M13 function.

The N2PL3A supports the E13/M13 function.
The N2PL3A supports the board version replacement function and can
replace the N1PL3A. After the N1PD3A is replaced, the N2PD3A is
consistent with the N1PD3A in configuration and service status.

Replaceability

The N2PD3A can fully replace the N1PD3A.

6.6.2 Function and Feature

The PL3A can be used to process E3/T3 signals and the overhead, to report alarms and
performance events, to provide the maintenance feature and the TPS protection.
Table 6-25 lists the functions and features of the PL3A.
Table 6-25 Functions and features of the PL3A
Function and
Feature

PL3A

Basic function

Processes 3 x E3/T3 signals.

The N2PL3A supports the E13 function, which is used to converge E1
services into E3 services.
The N2PL3A supports the M13 function, which is used to converge T1
services into T3 services.

Service
processing

Accesses and processes 3 x E3/T3 electrical signals.

Overhead
processing

Supports the setting and query of all path overhead bytes at the VC-3 level.

Alarm and
performance
event

Provides rich alarms and performance events for easy management and
maintenance of the equipment.

Maintenance
feature

Supports inloop and outloop for electrical interfaces.

Supports warm reset and cold reset. The warm reset does not affect
services.
Supports the function of querying the manufacturing information of the
board.
Supports the in-service loading of the FPGA.
Supports the upgrade of the board software without affecting services.
Supports the PRBS function.

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6.6.3 Working Principle and Signal Flow

The PL3A consists of the PPI, E3/T3 mapping/demapping, interface conversion module,
communication and control module and so on.
Figure 6-25 shows the block diagram for the functions of the PL3A.
Figure 6-25 Block diagram for the functions of the PL3A
34 MHz/
45 MHz
OSC

E3/T3

E3/T3

6 x 34 Mbit/s/
6 x 45 Mbit/s

LIU
P
P
I

LOS

E3/T3
mapping/
demapping

2 x 155 Mbit/s

Interface
coversion
module

High
speed bus

Frame header

Communication and
control module

Outloop/Inloop control

High
speed bus

2 x 155 Mbit/s

6 x 34 Mbit/s/
6 x 45 Mbit/s

LIU

Reference clock

155 MHz
PLL

Cross-connect unit
B

SCC Unit

Fuse

DC/DC
converter

DC/DC
converter

Cross-connect unit
A

Cross-connect unit

Communication

+3.3 V

+1.8 V

Cross-connect unit

-48 V/ -60 V
-48 V/ -60 V

Fuse
+3.3 V backup
power

OSC: Oscillator

PPI: PDH physical interface

Figure 6-26 shows the block diagram of the E3/T3 mapping/demapping.

Figure 6-26 Block diagram of the E3/T3 mapping/demapping
E3/T3 mapping/demapping

E3/T3

LPA

HPA

LPT

HPT

STM-1

LPOH(J1/C2/B3)
insertion
PDH AIS
Detector

TU-AIS/TU-LOP
Detector
LPOH(J1/C2/B3)
extraction

E3/T3

STM-1

LPA

LPT

LPA: Low order Path Adaptation

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HPA

HPT

LPT: Low order Path Termination

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HPA: High order Path Adaptation

HPT: High order Path Termination

The function modules are described as follows.

PPI
l

The PPI module mainly consists of line interface units (LIUs). It provides inloop and
outloop function. This module:

Encodes and decodes signals.

Recovers data and clock.

Processes the A_LOS alarm.

E3/T3 mapping/demapping
l

LPA

The 45 Mbit/s (34 Mbit/s) plesiochronous stream is inserted in a C3 container to be adapted

so as to be transported into the synchronous network.

LPT

The virtual container (VC-3) is formatted by lower order path termination (LPT).

The VC-3 is structured so that its octets are distributed within a 125 us interval (for example,
one STM1 period), and consists of the VC-3 container and POH. The latter contains nine
octets equally distributed within the frame bytes for VC-3: J1, B3, C2, G1, F2, H4, F3, K3,
and N1.

HPA

HPA generates and processes channel level TU-PTR. In the receive direction, the signals
are split into VC-3s, which are located and isolated in TU-3. TU-PTR is processed. In the
transmit direction, VC-3s are located precisely and added with TU-PTR. Three TUG-3s
are multiplexed into a VC-4 by bytes interleaving. The sequence is: TU-3->TUG3->VC-4.

HPT

The virtual container (VC-4) is formatted. The VC-4 is structured so that its octets are
distributed within a 125 us interval (for example, one STM1 period), and consists of the
C4 container and POH.

MST and RST

The functions are necessary to create a proprietary STM1 signal in order to connect the
interface conversion module.

Interface conversion module

The interface converting module mainly converts 622 Mbit/s low voltage differential signals
(LVDS) bus of SDH system into parallel bus. Through this module, the high-rate backplane
interface connects to low-rate interface chip of the transmitting system.

Communication and control module

6-46

Manages and configures other modules of the boards.

Performs inter-board communication through internal Ethernet interface.

Traces the clock signal from the active and the standby cross-connect units.
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Selects the clock and frame header from the active or the standby cross-connect units.

Controls the indicator on the board.

DC/DC converter module

Through the DC/ DC converting module, different direct currents are provided to each chip on
the board. Two direct currents are provided: +1.8 V and +3.3 V. In addition, protection for +3.3
V power are provided to the board.

6.6.4 Front Panel

On the front panel of the PL3A, there are indicators and interfaces.

Appearance of the Front Panel

Figure 6-27 shows the appearance of the front panel of the PL3A.
Figure 6-27 Front panel of the PL3A

PL3A
STAT
ACT
PROG
SRV

OUT1
IN1
OUT2
IN2
OUT3
IN3

PL3A

Indicators
The following indicators are present on the front panel of the board:
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l

Board hardware state indicator (STAT), which is green or red when lit.

Service activating state indicator (ACT), which is green when lit.

Board software state indicator (PROG), which is green or red when lit.

Service alarm indicator (SRV), which is red, green or yellow when lit.

For indication of these indicators, see A Equipment and Board Alarm Indicators.

Interfaces
There are three pairs of 75-ohm unbalanced interfaces, which are of the SMB type.

6.6.5 Valid Slots

The PL3A can be housed in different slots in the OptiX OSN 1500A and OptiX OSN 1500B
subracks
The PL3A can be housed in any of slots 1213 in the OptiX OSN 1500A subrack.
The PL3A can be housed in any of slots 1113 in the OptiX OSN 1500B subrack.

6.6.6 Board Configuration Reference

You can use the T2000 to set parameters for the PL3A.
You can use the T2000 to set the following parameters for the PL3A:
l

J1 byte

C2 byte

Tributary loopback

Service loading indication

Path service type

For details on these parameters, see F Board Configuration Reference.

6.6.7 Technical Specifications

The technical specifications of the PL3A cover the electrical interface specifications, board
dimensions, weight and power consumption.

Electrical Interface Specifications

Table 6-26 lists the specifications of the electrical interfaces of the PL3A.
Table 6-26 Specifications of the electrical interfaces of the PL3A

6-48

Interface Type

Code

Output
Signal Bit
Rate

34368 kbit/s

HDB3

Compliant with ITU-T G.703

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Allowed
Input
Frequency
Deviation

Allowed
Input
Attenuatio
n

Input
Jitter
Tolerance

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Interface Type

Code

Output
Signal Bit
Rate

Allowed
Input
Frequency
Deviation

44736 kbit/s

B3ZS

Compliant with ITU-T G.703

Allowed
Input
Attenuatio
n

Input
Jitter
Tolerance

Mechanical Specifications
The mechanical specifications of the PL3A are as follows:
l

Board dimensions (mm): 262.05 (H) x 220 (D) x 25.4 (W)

Weight (kg): 1.0

Power Consumption
In the normal temperature (25), the maximum power consumption of the N1PL3A is 15 W.
In the normal temperature (25), the maximum power consumption of the N2PL3A is 12 W.

6.7 PD3
This section describes the PD3, a 6 x E3/T3 processing board, in terms of the version, function,
principle, front panel, configuration and specifications.
6.7.1 Version Description
The PD3 board has two functional versions, N1 and N2. The difference between the two versions
lies in the support for the E13/M13 function.
6.7.2 Function and Feature
The PD3 can be used to process E3/T3 signals and the overhead, to report alarms and
performance events, to provide the maintenance feature and the TPS protection.
6.7.3 Working Principle and Signal Flow
The PD3 consists of the PPI, E3/T3 mapping/demapping, interface conversion module,
communication and control module and so on.
6.7.4 Front Panel
On the front panel of the PD3, there are indicators.
6.7.5 Valid Slots
The OptiX OSN 1500A does not support the PD3 board.
6.7.6 TPS Protection for the Board
The PD3 supports the 1:N TPS protection.
6.7.7 Board Configuration Reference
You can use the T2000 to set parameters for the PD3.
6.7.8 Technical Specifications
The technical specifications of the PD3 cover the electrical interface specifications, board
dimensions, weight and power consumption.

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6.7.1 Version Description

The PD3 board has two functional versions, N1 and N2. The difference between the two versions
lies in the support for the E13/M13 function.
Table 6-27 lists the details on the versions of the PD3 board.
Table 6-27 Version Description of the PD3
Item

Description

Functional
version

The PD3 has two functional versions, N1 and N2.

Difference

The N1PD3 does not support the E13/M13 function.

The N2PD3 supports the E13/M13 function.
The N2PD3 supports the board version replacement function and can
replace the N1PD3. After the N1PD3 is replaced, the N2PD3 is consistent
with the N1PD3 in configuration and service status.

Replaceability

The N2PD3 can fully replace the N1PD3.

6.7.2 Function and Feature

The PD3 can be used to process E3/T3 signals and the overhead, to report alarms and
performance events, to provide the maintenance feature and the TPS protection.
Table 6-28 lists the functions and features of the PD3.
Table 6-28 Functions and features of the PD3
Function
and Feature

PD3

Basic function

Processes 6 x E3/T3 signals.

Service
processing

Accesses and processes 6 x E3/T3 electrical signals.

The N2PD3 supports the E13 function, which is used to converge E1
services into E3 services.
The N2PD3 supports the M13 function, which is used to converge T1
services into T3 services.

6-50

Overhead
processing

Supports the setting and query of all path overhead bytes at the VC-3 level.

Alarm and
performance
event

Provides rich alarms and performance events for easy management and
maintenance of the equipment.

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Function
and Feature

PD3

Maintenance
feature

Supports inloop and outloop for electrical interfaces.

Supports warm reset and cold reset. The warm reset does not affect services.
Supports the function of querying the manufacturing information of the
board.
Supports the in-service loading of the FPGA.
Supports the upgrade of the board software without affecting services.
Supports the PRBS function.
Supports the TPS protection when used with the interface and switching
boards.

Protection
scheme

6.7.3 Working Principle and Signal Flow

The PD3 consists of the PPI, E3/T3 mapping/demapping, interface conversion module,
communication and control module and so on.
Figure 6-28 shows the block diagram for the functions of the PD3.
Figure 6-28 Block diagram for the functions of the PD3
34 MHz/
45 MHz
OSC

E3/T3

E3/T3

155 MHz
PLL

6 x 34 Mbit/s/
6 x 45 Mbit/s

LIU
P
P
I

LOS
Outloop/Inloop control

High
speed bus

2 x 155 Mbit/s

E3/T3
mapping/
demapping

6 x 34 Mbit/s/
6 x 45 Mbit/s

LIU

Reference clock

2 x 155 Mbit/s

Interface
coversion
module

Frame header

Communication and
control module

DC/DC
converter

DC/DC
converter

Cross-connect unit
A

Cross-connect unit
B

Cross-connect unit

Communication

+3.3 V

+1.8 V

High
speed bus

Cross-connect unit

SCC Unit

Fuse

-48 V/ -60 V
-48 V/ -60 V

Fuse
+3.3 V backup
power

OSC: Oscillator

PPI: PDH physical interface

Figure 6-29 shows the block diagram of the E3/T3 mapping/demapping.

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Figure 6-29 Block diagram of the E3/T3 mapping/demapping

E3/T3 mapping/demapping

E3/T3

LPA

HPA

LPT

HPT

STM-1

LPOH(J1/C2/B3)
insertion
PDH AIS
Detector

TU-AIS/TU-LOP
Detector
LPOH(J1/C2/B3)
extraction

E3/T3

STM-1

LPA

LPT

HPA

HPT

LPA: Low order Path Adaptation

LPT: Low order Path Termination

HPA: High order Path Adaptation

HPT: High order Path Termination

The function modules are described as follows.

PPI
l

The PPI module mainly consists of line interface units (LIUs). It provides inloop and
outloop function. This module:

Encodes and decodes signals.

Recovers data and clock.

Processes the A_LOS alarm.

E3/T3 mapping/demapping

6-52

LPA

The 45 Mbit/s (34 Mbit/s) plesiochronous stream is inserted in a C3 container to be adapted

so as to be transported into the synchronous network.

LPT

The virtual container (VC-3) is formatted by lower order path termination (LPT).

The VC-3 is structured so that its octets are distributed within a 125 us interval (for example,
one STM1 period), and consists of the VC-3 container and POH. The latter contains nine
octets equally distributed within the frame bytes for VC-3: J1, B3, C2, G1, F2, H4, F3, K3,
and N1.

HPA

HPA generates and processes channel level TU-PTR. In the receive direction, the signals
are split into VC-3s, which are located and isolated in TU-3. TU-PTR is processed. In the
transmit direction, VC-3s are located precisely and added with TU-PTR. Three TUG-3s
are multiplexed into a VC-4 by bytes interleaving. The sequence is: TU-3->TUG3->VC-4.

HPT

The virtual container (VC-4) is formatted. The VC-4 is structured so that its octets are
distributed within a 125 us interval (for example, one STM1 period), and consists of the
C4 container and POH.
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MST and RST

The functions are necessary to create a proprietary STM1 signal in order to connect the
interface conversion module.

Interface converting module

The interface converting module mainly converts 622 Mbit/s low voltage differential signals
(LVDS) bus of SDH system into parallel bus. Through this module, the high-rate backplane
interface connects to low-rate interface chip of the transmitting system.

Communication and control module

l

Manages and configures other modules of the boards.

Performs inter-board communication through internal Ethernet interface.

Traces the clock signal from the active and the standby cross-connect units.

Selects the clock and frame header from the active or the standby cross-connect units.

Controls the indicator on the board.

DC/DC converter module

Through the DC/ DC converting module, different direct currents are provided to each chip on
the board. Two direct currents are provided: +1.8 V and +3.3 V. In addition, protection for +3.3
V power are provided to the board.

6.7.4 Front Panel

On the front panel of the PD3, there are indicators.

Appearance of the Front Panel

Figure 6-30 shows the appearance of the front panel of the PD3.

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Figure 6-30 Front panel of the PD3

PD3
STAT
ACT
PROG
SRV

PD3

Indicators
The following indicators are present on the front panel of the board:
l

Board hardware state indicator (STAT), which is green or red when lit.

Service activating state indicator (ACT), which is green when lit.

Board software state indicator (PROG), which is green or red when lit.

Service alarm indicator (SRV), which is red, green or yellow when lit.

For indication of these indicators, see A Equipment and Board Alarm Indicators.

Interfaces
No interfaces are present on the front panel of the PD3.
The D34S, an electrical interface switching board, provides the E3/T3 interfaces for the PD3.
For details, see the section that describes the D34S.

6.7.5 Valid Slots

The OptiX OSN 1500A does not support the PD3 board.
In the OptiX OSN 1500B subrack, the PD3 can be housed in any of slots 1213, and must be
used with the D34S.
Table 6-29 lists the valid slots for the PD3 and corresponding slots for the D34S.
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Table 6-29 Valid slots for the PD3 and corresponding slots for the D34S in the OptiX OSN
1500B subrack
Valid Slot for the PD3

Corresponding Slot for the D34S

Slot 12

Slot 14

Slot 13

Slot 16

6.7.6 TPS Protection for the Board

The PD3 supports the 1:N TPS protection.

Protection Principle
For the OptiX OSN 1500B, when used with the D34S and TSB8, the PD3 can be configured
into one 1:1 TPS protection group. Figure 6-31 shows the principle of the TPS protection for
the PD3.
Figure 6-31 Principle of the TPS protection for the PD3 in the OptiX OSN 1500B subrack
6 xE3/T3

TSB8

D34S

Switch
control
signal

Crossconnect
and
timing
board

SLOT 4/5
Protection

Working

PD3

PD3
Fail

SLOT12

SLOT13

Normal state
When the working boards are running normally, the control switch of the D34S is in position
1 and services are directly accessed to the PD3 board.

Switching state
When the working board detects a fault and requires a switching, the control switch of the
D34S is shifted to position 2 and the control switch of the TSB8 is shifted to a corresponding
position. In this way, the protection board protects the faulty working board.

Hardware Configuration
Table 6-30 lists the slot configuration for the TPS protection for the PD3 in the OptiX OSN
1500B subrack.
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Table 6-30 Slot configuration for the 1:1 TPS protection for the PD3 in the OptiX OSN 1500B
subrack
Working
Board

Protection Board

Slot

PD3 (E3)

PD3 (E3)

PD3 (T3)

PD3 (T3)

Figure 6-32 shows the slot configuration for

the 1:1TPS protection for the PD3

Figure 6-32 Slot configuration for the 1:1 TPS protection for the PD3 in the OptiX OSN 1500B
subrack
Slot 14

TSB8

Slot 15
Slot 16

D34S

Slot 17

Slot 18

PIU

Slot 19

PIU

Slot 6

Slot 11
Slot 20

Slot 12

Protection

Slot 7

FAN

Slot 13

Working

Slot 8

Slot 4

CXL16/4/1

Slot 9

EOW

Slot 5

CXL16/4/1

Slot 10

AUX

As shown in Figure 6-32, the protection board housed in slot 12 protects the board housed in
slot 13.
Table 6-31 lists the slots for the PD3, D34S and TSB8.
Table 6-31 Slots for the PD3, D34S and TSB8 in the OptiX OSN 1500B subrack
Board

Protection Group

PD3 (working)

Slot 13

PD3 (protection)

Slot 12

TSB8

Slot 14

D34S

Slot 16

6.7.7 Board Configuration Reference

You can use the T2000 to set parameters for the PD3.
You can use the T2000 to set the following parameters for the PD3:

6-56

J1 byte

C2 byte

Tributary loopback

Service loading indication

Path service type

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For details on these parameters, see F Board Configuration Reference.

6.7.8 Technical Specifications

The technical specifications of the PD3 cover the electrical interface specifications, board
dimensions, weight and power consumption.

Electrical Interface Specifications

The D34S provides electrical interfaces for the PD3. For the specifications of the electrical
interfaces, see the section that describes the D34S.

Mechanical Specifications
The mechanical specifications of the PD3 are as follows:
l

Board dimensions (mm): 262.05 (H) x 220 (D) x 25.4 (W)

Weight (kg): 1.1

Power Consumption
In the normal temperature (25), the maximum power consumption of the N1PD3 is 19 W.
In the normal temperature (25), the maximum power consumption of the N2PD3 is 12 W.

6.8 PQ3
This section describes the PQ3, a 12 x E3/T3 processing board, in terms of the version, function,
principle, front panel, configuration and specifications.
6.8.1 Version Description
The functional version of the PQ3 board is N2.
6.8.2 Function and Feature
The PQ3 can be used to process E3/T3 signals and the overhead, to report alarms and
performance events, to provide the maintenance feature and the TPS protection.
6.8.3 Working Principle and Signal Flow
The PQ3 consists the PPI, E3/T3 mapping/demapping, interface conversion module,
communication and control module and so on.
6.8.4 Front Panel
On the front panel of the PQ3, there are indicators.
6.8.5 Valid Slots
The OptiX OSN 1500A does not support the PQ3 board.
6.8.6 TPS Protection for the Board
The PQ3 supports the 1:N TPS protection.
6.8.7 Board Configuration Reference
You can use the T2000 to set parameters for the PQ3.
6.8.8 Technical Specifications
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The technical specifications of the PQ3 cover the electrical interface specifications, board
dimensions, weight and power consumption.

6.8.1 Version Description

The functional version of the PQ3 board is N2.

6.8.2 Function and Feature

The PQ3 can be used to process E3/T3 signals and the overhead, to report alarms and
performance events, to provide the maintenance feature and the TPS protection.
Table 6-32 lists the functions and features of the PQ3.
Table 6-32 Functions and features of the PQ3
Function and
Feature

PQ3

Basic function

Processes 12 x E3/T3 signals.

Service
processing

Accesses and processes 12 x E3/T3 electrical signals.

Supports the E13 function, which is used to converge E1 services into E3
services.
Supports the M13 function, which is used to converge T1 services into T3
services.

Overhead
processing

Supports the setting and query of all path overhead bytes at the VC-3 level.

Alarm and
performance
event

Provides rich alarms and performance events for easy management and
maintenance of the equipment.

Maintenance
feature

Supports inloop and outloop for electrical interfaces.

Supports warm reset and cold reset. The warm reset does not affect services.
Supports the function of querying the manufacturing information of the
board.
Supports the in-service loading of the FPGA.
Supports the upgrade of the board software without affecting services.
Supports the PRBS function.

Protection
scheme

Supports the TPS protection when used with the interface board and the
switching board.

6.8.3 Working Principle and Signal Flow

The PQ3 consists the PPI, E3/T3 mapping/demapping, interface conversion module,
communication and control module and so on.
Figure 6-33 shows the block diagram for the functions of the PQ3.
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Figure 6-33 Block diagram for the functions of the PQ3

34 MHz/
45 MHz
OSC

E3/T3

E3/T3

6 x 34 Mbit/s/
6 x 45 Mbit/s

LIU
P
P
I

LOS

E3/T3
mapping/
demapping

2 x 155 Mbit/s

Interface
coversion
module

High
speed bus

Frame header

Communication and
control module

Outloop/Inloop control

High
speed bus

2 x 155 Mbit/s

6 x 34 Mbit/s/
6 x 45 Mbit/s

LIU

Reference clock

155 MHz
PLL

Cross-connect unit
B

SCC Unit

Fuse

DC/DC
converter

DC/DC
converter

Cross-connect unit
A

Cross-connect unit

Communication

+3.3 V

+1.8 V

Cross-connect unit

-48 V/ -60 V
-48 V/ -60 V

Fuse
+3.3 V backup
power

OSC: Oscillator

PPI: PDH physical interface

Figure 6-34 shows the block diagram of the E3/T3 mapping/demapping.

Figure 6-34 Block diagram of the E3/T3 mapping/demapping
E3/T3 mapping/demapping

E3/T3

LPA

HPA

LPT

HPT

STM-1

LPOH(J1/C2/B3)
insertion
PDH AIS
Detector

TU-AIS/TU-LOP
Detector
LPOH(J1/C2/B3)
extraction

E3/T3

STM-1

LPA

HPA

LPT

HPT

LPA: Low order Path Adaptation

LPT: Low order Path Termination

HPA: High order Path Adaptation

HPT: High order Path Termination

The function modules are described as follows.

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PPI
l

The PPI module mainly consists of line interface units (LIUs). It provides inloop and
outloop function. This module:

Encodes and decodes signals.

Recovers data and clock.

Processes the A_LOS alarm.

E3/T3 mapping/demapping
l

LPA

The 45 Mbit/s (34 Mbit/s) plesiochronous stream is inserted in a C3 container to be adapted

so as to be transported into the synchronous network.

LPT

The virtual container (VC-3) is formatted by lower order path termination (LPT).

The VC-3 is structured so that its octets are distributed within a 125 us interval (for example,
one STM1 period), and consists of the VC-3 container and POH. The latter contains nine
octets equally distributed within the frame bytes for VC-3: J1, B3, C2, G1, F2, H4, F3, K3,
and N1.

HPA

HPA generates and processes channel level TU-PTR. In the receive direction, the signals
are split into VC-3s, which are located and isolated in TU-3. TU-PTR is processed. In the
transmit direction, VC-3s are located precisely and added with TU-PTR. Three TUG-3s
are multiplexed into a VC-4 by bytes interleaving. The sequence is: TU-3->TUG3->VC-4.

HPT

The virtual container (VC-4) is formatted. The VC-4 is structured so that its octets are
distributed within a 125 us interval (for example, one STM1 period), and consists of the
C4 container and POH.

MST and RST

The functions are necessary to create a proprietary STM1 signal in order to connect the
interface conversion module.

Interface conversion module

The interface converting module mainly converts 622 Mbit/s low voltage differential signals
(LVDS) bus of SDH system into parallel bus. Through this module, the high-rate backplane
interface connects to low-rate interface chip of the transmitting system.

Communication and control module

6-60

Manages and configures other modules of the boards.

Performs inter-board communication through internal Ethernet interface.

Traces the clock signal from the active and the standby cross-connect units.

Selects the clock and frame header from the active or the standby cross-connect units.

Controls the indicator on the board.

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DC/DC converter module

Through the DC/ DC converting module, different direct currents are provided to each chip on
the board. Two direct currents are provided: +1.8 V and +3.3 V. In addition, protection for +3.3
V power are provided to the board.

6.8.4 Front Panel

On the front panel of the PQ3, there are indicators.

Appearance of the Front Panel

Figure 6-35 shows the appearance of the front panel of the PQ3.
Figure 6-35 Front panel of the PQ3
PQ3
STAT
ACT
PROG
SRV

PQ3

Indicators
The following indicators are present on the front panel of the board:
l

Board hardware state indicator (STAT), which is green or red when lit.

Service activating state indicator (ACT), which is green when lit.

Board software state indicator (PROG), which is green or red when lit.

Service alarm indicator (SRV), which is red, green or yellow when lit.

For indication of these indicators, see A Equipment and Board Alarm Indicators.
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Interfaces
There are no interfaces on the front panel of the PQ3.
The D34S, an electrical interface switching board, provides the E3/T3 interfaces for the PQ3.
For details, see the section that describes the D34S.

6.8.5 Valid Slots

The OptiX OSN 1500A does not support the PQ3 board.
In the OptiX OSN 1500B subrack, the PQ3 can be housed in any of slots 1213, and must be
used with the D34S.
Table 6-33 lists the valid slots for the PQ3 and corresponding slots for the D34S.
Table 6-33 Valid slots for the PQ3 and corresponding slots for the D34S in the OptiX OSN
1500B subrack
Valid Slot for the PQ1

Corresponding Slot for the D34S

Slot 12

Slots 14 and 15

Slot 13

Slots 16 and 17

6.8.6 TPS Protection for the Board

The PQ3 supports the 1:N TPS protection.

Protection Principle
In the OptiX OSN 1500B, used with the D34S and TSB8, the PQ3 can be configured into one
1:1 TPS protection group. Figure 6-36 shows the principle of the TPS protection for the PQ3.
Figure 6-36 Principle of the TPS protection for the PQ3 in the OptiX OSN 1500B subrack
6 xE3/T3

TSB8

TSB8

6 xE3/T3

D34S

D34S

Switch
control
signal

Crossconnect
and timing
board

Protection

Working
PQ3

SLOT 4/5

PQ3
Fail

SLOT12

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6 PDH Processing Boards

Normal state
When the working boards are running normally, the control switch of the D34S is in position
1 and services are directly accessed to the PQ3 board.

Switching state
When the working board detects a fault and requires a switching, the control switch of the
D34S is shifted to position 2 and the control switch of the TSB8 is shifted to a corresponding
position. In this way, the protection board protects the faulty working board.

Hardware Configuration
NOTE

Two TSB8 boards are required to configure the TPS protection for the N2PQ3.

Table 6-34 lists the slot configuration for the TPS protection for the PQ3 in the OptiX OSN
1500B subrack.
Table 6-34 Slot configuration for the 1:1 TPS protection for the PQ3 in the OptiX OSN 1500B
subrack
Working
Board

Protection Board

Slot

PQ3 (E3)

PQ3 (E3)

PQ3 (T3)

PQ3 (T3)

Figure 6-37 shows the slot configuration for

the 1:3 TPS protection for the PQ3.

Figure 6-37 Slot configuration for the 1:1 TPS protection for the PQ3 in the OptiX OSN 1500B
subrack
Slot 14

TSB8

Slot 15

TSB8

Slot 16

D34S

Slot 17

D34S

Slot 12

FAN

PIU

Slot 19

PIU

Slot 6

Slot 11
Slot 20

Slot 18

Protection

Slot 7

Slot 13

Working

Slot 8

Slot 4

CXL16/4/1

Slot 9

EOW

Slot 5

CXL16/4/1

Slot 10

AUX

As shown in Figure 6-37, the protection board housed in slot 12 protects the board housed in
slot 13.
Table 6-35 lists the slots for the PQ3, D34S and TSB8.
Table 6-35 Slots for the PQ3, D34S and TSB8 in the OptiX OSN 1500B subrack

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Board

Protection Group

PQ3 (working)

Slot 13

PQ3 (protection)

Slot 12
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Board

Protection Group

TSB8

Slots 1415

D34S

Slots 1617

6.8.7 Board Configuration Reference

You can use the T2000 to set parameters for the PQ3.
You can use the T2000 to set the following parameters for the PQ3:
l

J1 byte

C2 byte

Tributary loopback

Service loading indication

Path service type

For details on these parameters, see F Board Configuration Reference.

6.8.8 Technical Specifications

The technical specifications of the PQ3 cover the electrical interface specifications, board
dimensions, weight and power consumption.

Electrical Interface Specifications

The D34S provides electrical interfaces for the PQ3. For the specifications of the electrical
interfaces, see the section that describes the D34S.

Mechanical Specifications
The mechanical specifications of the PL1 are as follows:
l

Board dimensions (mm): 262.05 (H) x 220 (D) x 25.4 (W)

Weight (kg): 1.1

Power Consumption
In the normal temperature (25), the maximum power consumption of the PQ3 is 13 W.

6.9 DX1
This section describes the DX1, a DDN interface convergence board, in terms of the version,
function, principle, front panel, configuration and specifications.
6.9.1 Version Description
The functional version of the DX1 board is N1.
6.9.2 Function and Feature
The DX1, a DDN interface convergence board, cross-connects 48 x E1 signals at the 64k level
at the system side.
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6.9.3 Working Principle and Signal Flow

The DX1 consists of the interface and frame processing module, encoding/decoding module,
timeslot cross-connect module, framing/deframing module and so on.
6.9.4 Front Panel
On the front panel of the DX1, there are indicators.
6.9.5 Valid Slots
The OptiX OSN 1500A does not support the DX1 board.
6.9.6 Board Feature Code
The code behind the board name in the barcode is the board feature code. The board feature code
of the DX1 indicates the interface impedance type.
6.9.7 TPS Protection for the Board
The DX1 supports the 1:N TPS protection.
6.9.8 Board Configuration Reference
You can use the T2000 to set parameters for the DX1.
6.9.9 Technical Specifications
The technical specifications of the DX1 cover the electrical interface specifications, board
dimensions, weight and power consumption.

6.9.1 Version Description

The functional version of the DX1 board is N1.

6.9.2 Function and Feature

The DX1, a DDN interface convergence board, cross-connects 48 x E1 signals at the 64k level
at the system side.
Table 6-36 lists the functions and features of the DX1.
Table 6-36 Functions and features of the DX1

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Function
and
Feature

DX1

Basic
function

Processes eight channels of N x 64 kbit/s services and 8 x framed E1 services.

Used with
the interface
board

Accesses eight channels of N x 64 kbit/s and 8 x framed E1 services and

realizes the 1:N TPS protection when used with the DM12.

Alarm and
performance
event

Provides rich alarms and performance events for easy management and
maintenance of the equipment.

Connector

The connectors of the DB28 and DB44 are present on the front panel of the
DM12. The DB28 is for the N x 64 kbit/s signals, and the DB44 is for the
framed E1 signals.

Cross-connects 48 channels of N x 64 kbit/s signals at the system side.

One DX1 board should be used with two DM12 boards.

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Function
and
Feature

DX1

Loopback
function

Supports inloop and outloop.

PRBS selftest

Supported.

6.9.3 Working Principle and Signal Flow

The DX1 consists of the interface and frame processing module, encoding/decoding module,
timeslot cross-connect module, framing/deframing module and so on.
Figure 6-38 shows the block diagram for the functions of the DX1.
Figure 6-38 Block diagram for the functions of the DX1
Backplane

8X
Frame E1

8X
Nx64 kbit/s

DM12
Frame E1
interface
module
N x 64 kbit/s
interface
module
Power
DM12

8X
Nx64 kbit/s

Backplane
DX1
Frame E1
encoding/decoding
and frame
processing
module
Nx64k bit/s
interface and
frame
processing
module

64kbit/s
Timeslot
crossconnect
module

N x 64 kbit/s
interface
module

Framing/
deframing
module

mapping/
demapping
module

Communication
and control
module

Power
Frame E1
interface
module

+3.3 V

DC/DC
converter

Crossconnect unit

SCC unit

DC/DC
converter

Fuse

Fuse

-48 V/-60 V
-48 V/-60 V
+3.3 V
backup
power

In the transmit direction

The SDH cross-connect board transmits the VC-4 signals to the mapping/demapping module,
which recovers the signals. The framing/deframing module converts the signals to framed E1
signals and transmits the signals to the timeslot cross-connect module. The timeslot crossconnect module cross-connects and grooms the signals in the 64 kbit/s granularities, and
transmits the services that are dropped at the NE to the interface module.

In the receive direction

The DX1 accesses 8 x framed E1 signals from the framed E1 interface module and eight channels
of N x 64 kbit/s services from the N x 64 kbit/s interface module of the DM12. In addition, the
DX1 recovers the clock and data signals.
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The DX1 decodes the framed E1 signals and processes the frames. The DX1 also converts the
N x 64 kbit/s signals, processes the frames. The DX1 then transmits the signals to the 64 kbit/s
cross-connect module. The timeslot cross-connect module cross-connects and grooms the
signals in the 64 kbit/s granularities. The timeslot cross-connect module then transmits the
signals to the framing/deframing module. The framing/deframing module then maps the signals
into the VC-4 and transmits the signals into the SDH cross-connect board.

Control and communication module

The control and communication module performs the board communication, control and service
configuration.

DC/DC converter module

The DC/DC converter module provides the DC voltages required by the modules of the board.

6.9.4 Front Panel

On the front panel of the DX1, there are indicators.

Appearance of the Front Panel

Figure 6-39 shows the appearance of the front panel of the DX1.
Figure 6-39 Front panel of the DX1
DX1
STAT
ACT
PROG
SRV

DX1

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Indicators
The following indicators are present on the front panel of the board:
l

Board hardware state indicator (STAT), which is green or red when lit.

Service activating state indicator (ACT), which is green when lit.

Board software state indicator (PROG), which is green or red when lit.

Service alarm indicator (SRV), which is red, green or yellow when lit.

For indication of these indicators, see A Equipment and Board Alarm Indicators.

Interfaces
There are no interfaces on the front panel of the DX1.
When used with the DM12, the DX1 can input and output the framed E1 and N x 64 kbit/s
signals. For details, see the section that describes the DM12.

6.9.5 Valid Slots

The OptiX OSN 1500A does not support the DX1 board.
In the OptiX OSN 1500B subrack, the DX1 can be housed in any of slots 1113, and must be
used with the DM12.
Table 6-37 lists the valid slots for the DX1 and corresponding slots for the DM12.
Table 6-37 Valid slots for the DX1 and corresponding slots for the DM12 in the OptiX OSN
1500B subrack
Valid Slot for the DX1

Corresponding Slot for the DM12

Slot 12

Slots 14 and 15

Slot 13

Slots 16 and 17

NOTE

Slot 11 can house a protection board of the TPS protection. The board housed in slot 11 protects the
boards housed in slots 12 and 13.

One DX1 should be used with two DM12 to access eight channels of N x 64 kbit/s signals. The DM12
board housed in the slot with a smaller slot number is used to access 8 x framed E1 and four channels
of N x 64 kbit/s signals. The DM12 board housed in the slot with a larger slot number is used to access
four channels of N x 64 kbit/s signals.

6.9.6 Board Feature Code

The code behind the board name in the barcode is the board feature code. The board feature code
of the DX1 indicates the interface impedance type.
Table 6-38 lists the relation between the board feature code and interface impedance type for
the DX1.
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Table 6-38 Relation between the board feature code and the interface impedance type
Board Barcode

Feature Code

Interface Impedance
Type

SSN1DX1A01

A01

75 ohms

SSN1DX1B01

B01

120 ohms

6.9.7 TPS Protection for the Board

The DX1 supports the 1:N TPS protection.

Protection Principle
In the OptiX OSN 1500B, used with the DM12, the DX1 can be configured into one 1:N (N
2) TPS protection group. Figure 6-40 shows the principle of the TPS protection for the DX1.
Figure 6-40 Principle of the TPS protection for the DX1 in the OptiX OSN 1500B subrack

S S
L L
protection bus O O
T T
14 15

S
L
O
T
16

S
L
O
T
17

DM12
DM12

DM12
DM12

service
bus
S
L
O
T
11

S
L
O
T
12

S
L
O
T
13

Fail

Working

Working

Protection

Detect
board fault

TPS
switching
control bus

Cross-connect and timing

board

When detecting a fault in the working DX1 board, the cross-connect board issues a command
to switch the services from the faulty DX1 to the protection DX1. In this way, services are
protected.

Hardware Configuration
Figure 6-41 shows the slot configuration for the 1:2 TPS protection for the DX1 in the OptiX
OSN 1500B subrack.
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Figure 6-41 Slot configuration for the 1:2 TPS protection for the DX1 in the OptiX OSN 1500B
subrack
Slot 14

DM12

Slot 15

DM12

Slot 16

DM12

Slot 17

DM12

Slot 11

Protection

Slot 6

Slot
20

Slot 12

Working

Slot 7

Slot 13

Working

Slot 8

FAN

Slot

CXL16/4/1

Slot 9

EOW

Slot

CXL16/4/1

Slot 10

AUX

Slot 18

PIU

Slot 19

PIU

As shown in Figure 6-41, the protection board housed in slot 11 protects the boards housed in
slots 1213.
Table 6-39 lists the slots for the DX1 and DM12 in the OptiX OSN 1500B subrack.
Table 6-39 Slots for the DX1 and DM12 in the OptiX OSN 1500B subrack
Board

Protection Group

DX1 (working)

Slots 12 and 13

DX1 (protection)

Slot 11

DM12

Slots 1417

6.9.8 Board Configuration Reference

You can use the T2000 to set parameters for the DX1.
You can use the T2000 to set the following parameters for the DX1:
l

J2 byte

Tributary loopback

Service loading indication

Protocol mode of serial ports

DDN clock source management

For details on these parameters, see F Board Configuration Reference.

6.9.9 Technical Specifications

The technical specifications of the DX1 cover the electrical interface specifications, board
dimensions, weight and power consumption.

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Electrical Interface Specifications

The DM12 provides electrical interfaces for the DX1. For the specifications of the electrical
interfaces, see the section that describes the DM12.

Mechanical Specifications
The mechanical specifications of the DX1 are as follows:
l

Board dimensions (mm): 262.05 (H) x 220 (D) x 25.4 (W)

Weight (kg): 1.0

Power Consumption
In the normal temperature (25), the maximum power consumption of the DX1 is 15 W.
NOTE

After the TPS protection is performed, the power consumption of the DX1 is 31 W.

6.10 DXA
This section describes the DXA, a DDN convergence board, in terms of the version, function,
principle, front panel, configuration and specifications.
6.10.1 Version Description
The functional version of the DXA board is N1.
6.10.2 Function and Feature
The DXA, a DDN interface convergence board, cross-connects 63 x E1 signals at the 64k level
at the system side.
6.10.3 Working Principle and Signal Flow
The DXA consists of the timeslot cross-connect module, framing/deframing module, mapping/
demapping module, control and communication module and power supply module.
6.10.4 Front Panel
On the front panel of the DXA, there are indicators.
6.10.5 Valid Slots
The DXA can be housed in different slots in the OptiX OSN 1500A and OptiX OSN 1500B
subracks.
6.10.6 Board Configuration Reference
You can use the T2000 to set parameters for the DXA.
6.10.7 Technical Specifications
The technical specifications of the DXA cover the optical interface specifications, board
dimensions, weight and power consumption.

6.10.1 Version Description

The functional version of the DXA board is N1.
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6.10.2 Function and Feature

The DXA, a DDN interface convergence board, cross-connects 63 x E1 signals at the 64k level
at the system side.
Table 6-40 lists the functions and features of the DXA.
Table 6-40 Functions and features of the DXA
Function and
Feature

DXA

Basic function

Cross-connects 63 x framed E1 signals.

Alarm and
performance event

Provides rich alarms and performance events for easy management and
maintenance of the equipment.

Loopback function

Supports inloop and outloop.

PRBS self-test

Not supported.

6.10.3 Working Principle and Signal Flow

The DXA consists of the timeslot cross-connect module, framing/deframing module, mapping/
demapping module, control and communication module and power supply module.
Figure 6-42 shows the block diagram for the functions of the DXA.
Figure 6-42 Block diagram for the functions of the DXA
Backplane

64 kbit/s
timeslot
crossconnect
module

Framing/
deframing
module

Mapping/
demapping
module

Crossconnect
unit

Control and
communication
module
+3.3 V
DC/DC
converter

DC/DC
converter

Crossconnect
unit

Fuse

-48 V/-60 V
-48 V/-60 V

Fuse

+3.3 V Backup
Power

In the transmit direction

The SDH cross-connect board transmits the VC-4 signals to the mapping/demapping module,
which recovers the signals. The framing/deframing module converts the signals to framed E1
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signals and transmits the signals to the timeslot cross-connect module. The timeslot crossconnect module cross-connects and grooms the signals in the 64 kbit/s granularities.

In the receive direction

The timeslot cross-connect module cross-connects and grooms the signals in the 64 kbit/s
granularities. The timeslot cross-connect module then transmits the signals to the framing/
deframing module. The framing/deframing module then maps the signals into the VC-4 and
transmits the signals into the SDH cross-connect board.

Control and communication module

The control and communication module performs the board communication, control and service
configuration.

DC/DC converter module

The DC/DC converter module provides the DC voltages required by the modules of the board.

6.10.4 Front Panel

On the front panel of the DXA, there are indicators.

Appearance of the Front Panel

Figure 6-43 shows the appearance of the front panel of the DXA.

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Figure 6-43 Front panel of the DXA

DXA
STAT
ACT
PROG
SRV

DXA

Indicators
The following indicators are present on the front panel of the board:
l

Board hardware state indicator (STAT), which is green or red when lit.

Service activating state indicator (ACT), which is green when lit.

Board software state indicator (PROG), which is green or red when lit.

Service alarm indicator (SRV), which is red, green or yellow when lit.

For indication of these indicators, see A Equipment and Board Alarm Indicators.

Interfaces
There are no interfaces on the front panel of the DXA.

6.10.5 Valid Slots

The DXA can be housed in different slots in the OptiX OSN 1500A and OptiX OSN 1500B
subracks.
The DXA can be housed in any of slots 1213 in the OptiX OSN 1500A subrack.
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The DXA can be housed in any of slots 1113 in the OptiX OSN 1500B subrack.

6.10.6 Board Configuration Reference

You can use the T2000 to set parameters for the DXA.
You can use the T2000 to set the following parameters for the DXA:
l

J2 byte

Tributary loopback

Service loading indication

Protocol mode of serial ports

DDN clock source management

For details on these parameters, see F Board Configuration Reference.

6.10.7 Technical Specifications

The technical specifications of the DXA cover the optical interface specifications, board
dimensions, weight and power consumption.

Mechanical Specifications
The mechanical specifications of the DXA are as follows:
l

Board dimensions (mm): 262.05 (H) x 220 (D) x 25.4 (W)

Weight (kg): 0.8

Power Consumption
In the normal temperature (25), the maximum power consumption of the DXA is 10 W.

6.11 SPQ4
This section describes the SPQ4, a 4 x E1/STM-1 processing board, in terms of the version,
function, working principle, front panel and specifications.
6.11.1 Version Description
The SPQ4 has two versions, N1 and N2. The two versions have different functions.
6.11.2 Function and Feature
The SPQ4 is used to process 4 x E4/STM-1 electrical signals and the overhead, to report alarms
and performance events, and to provide the maintenance features and protection.
6.11.3 Working Principle and Signal Flow
The SPQ4 consists of the interface module, encoding/decoding module, frame synchronization
and scramble processing module, mapping/demapping module, SDH overhead processing
module, logic control module, and power supply module.
6.11.4 Front Panel
On the front panel of the SPQ4, there are indicators.
6.11.5 Valid Slots
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The OptiX OSN 1500A does not support the SPQ4 board.
6.11.6 TPS Protection for the Board
The SPQ4 supports the 1:N TPS protection.
6.11.7 Board Configuration Reference
You can use the T2000 to set parameters for the SPQ4.
6.11.8 Technical Specifications
The technical specifications of the SPQ4 cover the electrical interface specifications, board
dimensions, weight and power consumption.

6.11.1 Version Description

The SPQ4 has two versions, N1 and N2. The two versions have different functions.
Table 6-41 lists the details on the versions of the SPQ4 board.
Table 6-41 Version Description of the SPQ4
Item

Description

Functional
version

The SPQ4 has two versions, N1 and N2.

Difference

The equipment of the V100R001 and V100R002 versions support the

N1SPQ4. The equipment of the V100R003 and later versions support the
N2SPQ2.

Replaceability

The N1SPQ4 can be replaced by the N2SPQ4. When the N1SPQ4 is

replaced, the NE should be upgraded.

6.11.2 Function and Feature

The SPQ4 is used to process 4 x E4/STM-1 electrical signals and the overhead, to report alarms
and performance events, and to provide the maintenance features and protection.
Table 6-42 lists the functions and features of the SPQ4.
Table 6-42 Functions and features of the SPQ4
Function and
Feature

SPQ4

Basic function

Processes 4 x STM-1/E4 signals.

Service
processing

Accesses and processes 4 x E4/STM-1 electrical signals. For each

channel, the E4 and STM-1 signals are compatible. Supports the
processing of the VC-12, VC-3 and VC-4 services.

Overhead
processing

Supports the processing of SOH bytes for the STM-1 signals, such as B1,
B2, K1, K2, M1, F1, and D1D12.
Supports the transparent transmission and termination of POH bytes,
including J1, B3, C2, G1, and H4.
Supports the setting and query of the J0/J1/C2 bytes.

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Function and
Feature

SPQ4

Alarm and
performance
event

Provides rich alarms and performance events for easy management and
maintenance of the equipment.

Protection
scheme

Supports the TPS protection when used with the interface board and the
switching board.
Supports the two-fiber unidirectional MSP protection ring, linear MSP
protection, and SNCP.

Maintenance
feature

Supports inloop and outloop for optical interfaces.

Supports warm reset and cold reset. The warm reset does not affect
services.
Supports the function of querying the manufacturing information of the
board.
Supports the in-service loading of the FPGA.
Supports the upgrade of the board software without affecting services.

6.11.3 Working Principle and Signal Flow

The SPQ4 consists of the interface module, encoding/decoding module, frame synchronization
and scramble processing module, mapping/demapping module, SDH overhead processing
module, logic control module, and power supply module.
Figure 6-44 shows the block diagram for the functions of the SPQ4.Figure 6-45 shows the block
diagram of the 140M mapping/ demapping. Figure 6-46 shows the block diagram of the SDH
overhead processing module.
Figure 6-44 Block diagram for the functions of the SPQ4
34 MHz
OSC

4x139 Mbit/s
E4/STM-1

LIU

LIU

P
P
I/
S
P
I

4x155 Mbit/s

Reference clock

155 MHz
PLL

140M mapping/demapping

High speed bus

4x155 Mbit/s

Cross-connect
unit A

Interface
conversion
module
SDH overhead processing
module

High speed bus

4x155 Mbit/s

DCC

Cross-connect
unit

EN 140M/155M
LOS
Outloop/Inloop control

Frame header

Communication
and control
module

Communication

+3.3 V
5V
+1.8V
+2.5V

DC/DC
converter

Cross-connect
unit B

SCC unit

K1 and K2

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Crossconnect unit

DC/DC
converter

Huawei Technologies Proprietary

Fuse

Cross-connect
unit
SCC unit

-48 V/ -60 V
-48 V/ -60 V

Fuse

+3.3 V backup
power

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Figure 6-45 Block diagram of the 140M mapping/demapping

140M mapping/demapping
155Mbit/s

139Mbit/s

LPA

HPT

PDH AIS
detector

E4 AIS
insertion

PG

MST

RST

MST

RST

E4 AIS
insertion

J1/C2/B3

155Mbit/s

139Mbit/s

SIPO

HPT

LPA

Figure 6-46 Block diagram of the SDH overhead processing module

SDH overhead processing module

Crossconnect unit

K1 and K2 insertion/extration

155 Mbit/s
155 Mbit/s

RST

MST

MSA

HPT

155 Mbit/s
155 Mbit/s

DCC

SCC unit

The principle of the E4/ STM-1 electrical interface units is described below.

PPI/SPI

6-78

The PPI module mainly consists of line interface units (LIUs). It provides inloop and
outloop function. This module:

Encodes and decodes signals.

Recovers data and clock.

Processes the PDH LOS signals.

The SPI module mainly consists of line interface units (LIUs). It provides inloop and
outloop function. This module:

Encodes and decodes signals.

Recovers data and clock.

Processes the R_LOS signals.

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SDH Overhead Processing Module and 140M Mapping/Demapping Module

SDH Overhead Processing Module (155Mbit/s SDH Signals)
The functions required to manage 155 Mbit/s SDH signals are implemented by the SDH
overhead processing module.

RST
l

In the receive direction, RST performs frame alignment detection (A1, A2), regenerator
section trace recovery (J0) and mismatch detection, BIP-8 errored block count.

In the transmit direction, RST performs frame alignment insertion, regenerator section path
trace insertion, BIP-8 calculation and insertion.

In the receive direction, MST performs BIP-24 errored block count, MS_REI recovery,
MS_RDI and MS_AIS detection.

In the transmit direction, MST performs BIP-24 calculation and insertion, MS_REI
MS_RDI and MS_AIS insertion.

Provides extraction or insertion of K1 byte and K2 byte.

In the receive direction, MSA performs AU4's pointer interpretation, LOP and AIS
detection, pointer justification.

In the transmit direction, MSA performs AUG assembly, AU-4 pointer generation,
AU_AIS generation.

OH termination

J1 path trace message recover

REI information recovering

HP_RDI detection (path status monitoring

UNEQ and AIS detection (signal label monitoring)

VC-4 BIP-8 errored block count

MST

MSA

HPT

140M mapping/demapping (140Mbit/s PDH signals)

The functions required to manage 140 Mbit/s PDH signals are implemented by the 140M
mapping/demapping module.

LPA
The 140 Mbit/s plesiochronous stream is inserted in a C4 container to be adapted so as to be
transported into the synchronous network. PDH AIS is monitored and E4 AIS in inserted.

HPT
The virtual container (VC-4) is formatted. The VC-4 is structured so that its octets are distributed
within a 125 us interval (for example, one STM1 period), and consists of the C4 container and
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POH. The latter contains nine octets equally distributing within the frame. These overhead bytes
can be extracted: J1, B3. C2, G1, F2, H4, F3, K3 and N1.E4 AIS can be inserted in downstream
direction.
PG (Pointer generator)
A fixed pointer value is inserted in the SOH to structure the AU4 signal.

MST and RST

These two functions are necessary to create a proprietary STM1 signal in order to connect with
interface conversion module. In the receive direction, MST and RST perform frame alignment
detection (A1, A2).

Interface converting module

The interface converting module mainly converts 622 Mbit/s low voltage differential signals
(LVDS) bus of SDH system into parallel bus. Through this module, the high-rate backplane
interface connects to low-rate interface chip of the transmitting system.

Communication and control module

l

Manages and configures other modules of the boards.

Performs inter-board communication through internal Ethernet interface.

Traces the clock signal from the active and the standby cross-connect units.

Realizes the pass-through of orderwire and ECC bytes between the two service processing
boards constituting the ADM when the GSCC is not online.

Selects the clock and frame header from the active or the standby cross-connect units.

Control the indicator on the board.

DC/DC converter module

It provides the board with required DC voltages. It converts the 48 V/60 V power supply to
the following voltages: +2.5 V, + 3.3 V, + 1.8 V, + 5 V. In addition, protection for +3.3 V power
are provided to the board.

6.11.4 Front Panel

On the front panel of the SPQ4, there are indicators.

Appearance of the Front Panel

Figure 6-47 shows the appearance of the front panel of the SPQ4.

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Figure 6-47 Front panel of the SPQ4

SPQ4
STAT
ACT
PROG
SRV

SPQ4

Indicators
The following indicators are present on the front panel of the board:
l

Board hardware state indicator (STAT), which is green or red when lit.

Service activating state indicator (ACT), which is green when lit.

Board software state indicator (PROG), which is green or red when lit.

Service alarm indicator (SRV), which is red, green or yellow when lit.

For indication of these indicators, see A Equipment and Board Alarm Indicators.

Interfaces
There are no interfaces on the front panel of the SPQ4. When used with the MU04, the SPQ4
can input or output the E4/STM-1 signals. For details, see the section that describes the MU04.

6.11.5 Valid Slots

The OptiX OSN 1500A does not support the SPQ4 board.
In the OptiX OSN 1500B subrack, the SPQ4 can be housed in any of slots 1213, and must be
used with the MU04.
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Table 6-43 lists the valid slots for the SPQ4 and corresponding slots for the MU04.
Table 6-43 Valid slots for the SPQ4 and corresponding slots for the MU04 in the OptiX OSN
1500B subrack
Valid Slot for the SPQ4

Corresponding Slot for the DMU04

Slot 12

Slot 14

Slot 13

Slot 16

6.11.6 TPS Protection for the Board

The SPQ4 supports the 1:N TPS protection.

Protection Principle
In the OptiX OSN 1500B, used with the MU04 and TSB8, the SPQ4 can be configured into one
1:1 TPS protection group. Figure 6-48 shows the principle of the TPS protection for the SPQ4.
Figure 6-48 Principle of the TPS protection for the SPQ4 in the OptiX OSN 1500B subrack
4E4/STM-1

TSB8

MU04
1

Switch
control
signal

Crossconnect
and
timing
board

SLOT 4/5
Protection

SPQ4

Working
SPQ4
Fail

SLOT12

SLOT13

Normal state
When the working boards are running normally, the control switch of the MU04 is in
position 1 and the MU04 directly accesses the service signals to the SLH1.

Switching state
When the working board detects a fault and requires a switching, the control switch of the
MU04 is shifted to position 2 and the control switch of the TSB8 is shifted to a
corresponding position. In this way, the protection board protects the faulty working board.

Hardware Configuration
Figure 6-49 shows the slot configuration for the 1:2 TPS protection for the SPQ4 in the OptiX
OSN 1500B subrack.
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Figure 6-49 Slot configuration for the 1:1 TPS protection for the SPQ4
Slot 14

TSB8

Slot 15
Slot 16

MU04

Slot 17

Slot 18

PIU

Slot 19

PIU

Slot 6

Slot 11
Slot 20

Slot 12

Protection

Slot 7

FAN

Slot 13

Working

Slot 8

Slot 4

CXL16/4/1

Slot 9

EOW

Slot 5

CXL16/4/1

Slot 10

AUX

As shown in Figure 6-49, the protection board housed in slot 12 protects the board housed in
slot 13.
Table 6-44 lists the slots for the SPQ4, MU04 and TSB8.
Table 6-44 Slots for the SPQ4, MU04 and TSB8 in the OptiX OSN 1500B subrack
Board

Protection Group

SPQ4 (working)

Slot 13

SPQ4 (protection)

Slot 12

MU04

Slot 16

TSB8

Slot 14

6.11.7 Board Configuration Reference

You can use the T2000 to set parameters for the SPQ4.
You can use the T2000 to set the following parameters for the SPQ4:
l

J1 byte

C2 byte

For details on these parameters, see F Board Configuration Reference.

6.11.8 Technical Specifications

The technical specifications of the SPQ4 cover the electrical interface specifications, board
dimensions, weight and power consumption.

Electrical Interface Specifications

The MU04 provides electrical interfaces for the SPQ4. For the specifications of the electrical
interfaces, see the section that describes the MU04.
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Mechanical Specifications
The mechanical specifications of the SPQ4 are as follows:
l

Board dimensions (mm): 262.05 (H) x 220 (D) x 25.4 (W)

Weight (kg): 0.9

Power Consumption
In the normal temperature (25), the maximum power consumption of the SPQ4 is 24 W.

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Data Processing Boards

About This Chapter

This chapter describes the data processing boards for the FE, GE, ATM, and SAN signals.
7.1 EFT4
This section describes the EFT4, a 4 x FE Ethernet transparent transmission board, in terms of
the version, function, principle, front panel, configuration and specifications.
7.2 EFT8
This section describes the EFT8, an 8/16 x FE Ethernet transparent transmission board, in terms
of the version, function, principle, front panel, configuration and specifications.
7.3 EFT8A
This section describes the EFT8A, an 8 x FE Ethernet transparent transmission board, in terms
of the version, function, principle, front panel, configuration and specifications.
7.4 EGT2
This section describes the EGT2, a 2 x GE Ethernet transparent transmission board, in terms of
the version, function, principle, front panel, configuration and specifications.
7.5 EFS0
This section describes the EFS0, an 8 x FE Ethernet processing board with Lanswitch, in terms
of the version, function, principle, front panel, configuration and specifications.
7.6 EFS4
This section describes the EFS4, a 4 x FE Ethernet processing board with Lanswitch, in terms
of the version, function, principle, front panel, configuration and specifications.
7.7 EGS2
This section describes the EGS2, a 2 x GE Ethernet processing board with Lanswitch, in terms
of the version, function, principle, front panel, configuration and specifications.
7.8 EMS4
This section describes the EMS4, a 4 x GE and 16 x FE Ethernet transparent transmission and
convergence board, in terms of the version, function, principle, front panel, configuration and
specifications.
7.9 EGS4
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This section describes the EGS4, a 4 x GE Ethernet convergence board, in terms of the version,
function, principle, front panel, configuration and specifications.
7.10 EGR2
This section describes the EGR2, a 2 x GE Ethernet processing board, in terms of the version,
function, principle, front panel, configuration and specifications.
7.11 EMR0
This section describes the EMR0, a 12 x FE and 1 x GE Ethernet ring processing board, in terms
of the version, function, principle, front panel, configuration and specifications.
7.12 ADL4
This section describes the ADL4, a 1 x STM-4 ATM processing board, in terms of the version,
function, principle, front panel, configuration and specifications.
7.13 ADQ1
This section describes the ADQ1, a 4 x STM-1 ATM processing board, in terms of the version,
function, principle, front panel, configuration and specifications.
7.14 IDL4
This section describes the IDL4, a 1 x STM-4 ATM processing board, in terms of the version,
function, principle, front panel, configuration and specifications.
7.15 IDQ1
This section describes the IDQ1, a 4 x STM-1 ATM processing board, in terms of the version,
function, principle, front panel, configuration and specifications.
7.16 MST4
This section describes the MST4, a 4-channel multi-service transparent transmission board, in
terms of the version, function, principle, front panel, configuration and specifications.

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7.1 EFT4
This section describes the EFT4, a 4 x FE Ethernet transparent transmission board, in terms of
the version, function, principle, front panel, configuration and specifications.
7.1.1 Version Description
The functional version of the EFT4 board is R1.
7.1.2 Function and Feature
The EFT4 supports transparent transmission of Ethernet services, LCAS, and test frames.
7.1.3 Working Principle and Signal Flow
The EFT4 consists of the ethernet access module, mapping module, interface converting module,
Communication and control module and so on.
7.1.4 Front Panel
On the front panel of the EFT4, there are indicators, interfaces and barcode.
7.1.5 Valid Slots
The EFT4 can be housed in any of slots 2, 3, 69 and 1213 in the OptiX OSN 1500A subrack.
The EFT4 can be housed in any of slots 13, 69 and 1113 in the OptiX OSN 1500B subrack.
7.1.6 Board Configuration Reference
You can use the T2000 to set parameters for the EFT4.
7.1.7 Technical Specifications
The specifications of the EFT4 cover the mechanical specifications and power consumption.

7.1.1 Version Description

The functional version of the EFT4 board is R1.

7.1.2 Function and Feature

The EFT4 supports transparent transmission of Ethernet services, LCAS, and test frames.
Table 7-1 lists the functions and features of the EFT4.
Table 7-1 Functions and features of the EFT4

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Function and
Feature

EFT4

Basic function

Transmits 4 x FE services.

Specification of
the optical
interface

Supports 10Base-T/100Base-TX signals. The optical interfaces comply

with IEEE 802.3u.

Format of service
frames

Supports Ethernet II, IEEE 802.3, and IEEE 802.1q TAG.

Supports frames with a length ranging from 64 bytes to 9600 bytes.
Supports Jumbo frames with a length less than 9600 bytes.
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Function and
Feature

EFT4

Max. uplink
bandwidth

622 Mbit/s.

Number of
VCTRUNKs

4.

Encapsulation
format

HDLC.
LAPS.
GFP-F.

Mapping
granularity

Supports VC-12, VC-3, VC-12-Xv (X63), and VC-3-Xv (X3).

Ethernet service
type

Supports EPL.

MPLS

Not supported.

VLAN

Supports VLAN transparent transmission.

LPT

Not supported.

CAR

Not supported.

Flow control
function

Supports the IEEE 802.3x flow control based on FE port.

LCAS

Dynamically increases or decreases the bandwidth, and realizes the

protection function, compliant with ITU-T G.7042.

Test frame

Receives and transmits Ethernet test frames.

Ethernet
performance
monitoring

Supports Ethernet performance monitoring at the port level.

Alarm and
performance
event

Provides rich alarms and performance events for easy management and
maintenance of the equipment.

7.1.3 Working Principle and Signal Flow

The EFT4 consists of the ethernet access module, mapping module, interface converting module,
Communication and control module and so on.
Figure 7-1 shows the block diagram for the functions of the EFT4.

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Figure 7-1 Block diagram for the functions of the EFT4

ENCP
FE

Ethernet
access
module

Cross-connect unit

Interface
converting
module

VCP
DENCP

Cross-connect unit

Mapping module
Laser
shutdown

LOS

Communication

Communication
and control
module

+3.3 V

Clock module

SCC unit

Reference clock and frame header

+1.5 V
+1.8 V
+2.5 V

DC/DC
converter

DC/DC
converter

Fuse

SCC unit

Fuse

- 48 V/-60V
- 48 V/-60V

+3.3 V

+3.3 V backup
power

77 125 155
MHz MHz MHz

The function modules of ethernet switching boards are described below:

ENCP: data encapsulation module

DENCP: decapsulation module

VCP: virtual concatenation processing module

Ethernet access module

In the receive direction, the optical signals from Ethernet equipment, such as switch and router,
are converted into electrical signals. For the signals accessed from electrical interfaces, O/E
conversion is unnecessary. At PHY layer, the electrical signals are decoded and the ETH_LOS
alarms are tested. The electrical signals are converted from serial signals to parallel signals and
then sent to network processor.
In the transmit direction, the parallel signals are converted to serial signals. At the PHY layer,
signals are encoded and converted from electrical signals to optical signals.

Mapping module
The mapping module consists of encapsulation and mapping.
In the upstream direction, this module first encapsulates Ethernet signals in LAPS or GFP format.
The concatenation is processed. Ethernet signals are then converted into SDH signals.
In the downstream direction, SDH signals are demapped. The time delay of virtual concatenation
is compensated. After aligning, packets are decapsulated as per encapsulation format. The
decapsulated data are transmitted to the network processor module in packets.
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Interface converting module

The interface converting module mainly converts 622 Mbit/s low voltage differential signals
(LVDS) bus of SDH system into parallel bus. Through this module, the high-rate backplane
interface connects to low-rate interface chip of the transmitting system.

Communication and control module

The communication and control module consists of CPU, register, oscillator, Ethernet port and
HDLC controller. This module connects to external circuits through bus. The communication
and control module:
l

Manages and configures other modules of the boards.

Performs inter-board communication through internal Ethernet interface.

The control module also contains basic logic units. This module enjoys the following functions:
l

Writes and reads register

Provides interface for CPU

Checks, selects clock

Performs phase discrimination and frequency division to the clock

Checks the in-service state of the cross-connect, the SCC and the line boards

Controls the shutting down of the optical module

Processes communication

Control indicators

Clock unit
This clock unit tracing the system reference clock and generates the required working clocks for
each chip. The frequencies of these clocks are: 50 MHz, 77MHz, 125 MHz and 155 MHz.

DC/DC converter module

Through the DC/DC module, the power unit generates required voltages for each chip on the
board. The following DC voltages are provided: +1.5 V, +1.8 V, +2.5 V and +3.3 V. In addition,
this unit also provides protection for the board +3.3 V power supply.

7.1.4 Front Panel

On the front panel of the EFT4, there are indicators, interfaces and barcode.

Appearance of the Front Panel

Figure 7-2 shows the appearance of the front panel of the EFT4.

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Figure 7-2 Front panel of the EFT4

EFT4
STAT
ACT
PROG
SRV

FE1
FE2
FE3
FE4

Indicators
The following indicators are present on the front panel of the board:
l

Board hardware state indicator (STAT), which is green or red when lit.

Service activating state indicator (ACT), which is green when lit.

Board software state indicator (PROG), which is green or red when lit.

Service alarm indicator (SRV), which is red, green or yellow when lit.

Connection status indicator (LINK), which is green when lit.

Data receiving and transmission indicator (ACT), which is orange when lit.

For indication of these indicators, see A Equipment and Board Alarm Indicators.

Interfaces
There are four FE interfaces on the front panel of the EFT4. Table 7-2 lists the type and usage
of the interfaces.
Table 7-2 Optical interfaces of the EFT4
Interface

Interface Type

Usage

FE1

RJ-45

Transmits and receives the 10Base-T/100Base-TX

signals.

FE2

RJ-45

Transmits and receives the 10Base-T/100Base-TX

signals.

FE3

RJ-45

Transmits and receives the 10Base-T/100Base-TX

signals.

FE4

RJ-45

Transmits and receives the 10Base-T/100Base-TX

signals.

Table 7-3 lists the pins of the RJ-45 interface.

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Table 7-3 Pins of the RJ-45 of the EFT4

Pin

Description

Transmitting positive

Transmitting negative

Receiving positive

Grounding

Grounding

Receiving negative

Grounding

Grounding

7.1.5 Valid Slots

The EFT4 can be housed in any of slots 2, 3, 69 and 1213 in the OptiX OSN 1500A subrack.
The EFT4 can be housed in any of slots 13, 69 and 1113 in the OptiX OSN 1500B subrack.
NOTE

The slots are divided slots.

7.1.6 Board Configuration Reference

You can use the T2000 to set parameters for the EFT4.
You can use the T2000 to set the following parameters for the EFT4:
l

Working mode

Enabling of the LCAS

Maximum packet length

Mapping protocol

For details on the parameters, refer to F Board Configuration Reference.

7.1.7 Technical Specifications

The specifications of the EFT4 cover the mechanical specifications and power consumption.

Mechanical Specifications
The mechanical specifications of the EFT4 are as follows:
l

Board dmensions (mm): 111.8 (H) x 220 X (D) x 25.4 (W)

Weight (kg): 0.5

Power Consumption
In the normal temperature (25), the maximum power consumption of the EFT4 is 14 W.
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7.2 EFT8
This section describes the EFT8, an 8/16 x FE Ethernet transparent transmission board, in terms
of the version, function, principle, front panel, configuration and specifications.
7.2.1 Version Description
The functional version of the EFT8 board is N1.
7.2.2 Function and Feature
The EFT8 supports transparent transmission of Ethernet services, LCAS, and test frames.
7.2.3 Working Principle and Signal Flow
The EFT8 consists of the ethernet access module, mapping module, interface converting module,
communication and control module and so on.
7.2.4 Front Panel
On the front panel of the EFT8, there are indicators, interfaces and barcode.
7.2.5 Valid Slots
The EFT8 can be used with the ETF8 and EFF8.
7.2.6 Board Configuration Reference
You can use the T2000 to set parameters for the EFT8.
7.2.7 Technical Specifications
The specifications of the EFT8 cover the mechanical specifications and power consumption.

7.2.1 Version Description

The functional version of the EFT8 board is N1.

7.2.2 Function and Feature

The EFT8 supports transparent transmission of Ethernet services, LCAS, and test frames.
Table 7-4 lists the functions and features of the EFT8.
Table 7-4 Functions and features of the EFT8
Function and
Feature

EFT8

Basic function

Transmits 8 x FE or 16 x FE services

Used with the

interface board

Accesses 8 x Ethernet signals at the electrical port.

Accesses 16 x Ethernet signals at the electrical port when used with the
ETF8.
Accesses 8 x Ethernet optical signals and 8 x Ethernet electrical signals
when used with the EFF8.

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Function and
Feature

EFT8

Specification of
the optical
interface

Supports the 10Base-T/100Base-TX signals when used with the ETF8.

Format of service
frames

Supports Ethernet II, IEEE 802.3, and IEEE 802.1q TAG. Supports
frames with a length ranging from 64 bytes to 9600 bytes. Supports
Jumbo frames with a length less than 9600 bytes.

Max. uplink
bandwidth

1.25 Gbit/s.

Number of
VCTRUNKs

16.

Encapsulation
format

Supports HDLC, LAPS, and GFP-F.

Mapping
granularity

Supports VC-12, VC-3, VC-12-Xv (X63), and VC-3-Xv (X3).

Ethernet service
type

Supports EPL.

MPLS

Not supported.

VLAN

Supports the VLAN transparent transmission.

LPT

Not supported.

CAR

Not supported.

Flow control
function

Supports the IEEE 802.3x flow control based on FE port.

LCAS

Dynamically increases or decreases the bandwidth, and realizes the

protection function, compliant with ITU-T G.7042.

Test frame

Receives and transmits GFP test frames.

Ethernet
performance
monitoring

Supports Ethernet performance monitoring at the port level.

Alarms and
performance
events

Provides rich alarms and performance events for easy management and
maintenance of the equipment.

Supports the 100Base-FX/100Base-TX signals when used with the

EFF8. The optical interfaces comply with IEEE 802.3u.

7.2.3 Working Principle and Signal Flow

The EFT8 consists of the ethernet access module, mapping module, interface converting module,
communication and control module and so on.
Figure 7-3 shows the block diagram for the functions of the EFT8.

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Figure 7-3 Block diagram for the functions of the EFT8

ENCP
FE

Ethernet
access
module

Cross-connect unit

Interface
converting
module

VCP
DENCP

Cross-connect unit

Mapping module
Laser
shutdown

LOS

Communication

Communication
and control
module

SCC unit

Reference clock and frame header

+3.3 V
+1.5 V

Clock module

+1.8 V
+2.5 V

DC/DC
converter

DC/DC
converter

Fuse

SCC unit

Fuse

- 48 V/-60V
- 48 V/-60V

+3.3 V

+3.3 V backup
power

77 125 155
MHz MHz MHz

ENCP: data encapsulation module

DENCP: decapsulation module

VCP: virtual concatenation processing module

The function modules of ethernet switching boards are described below:

Ethernet Access Module

In the receive direction, the optical signals from Ethernet equipment, such as switch and router,
are converted into electrical signals. For the signals accessed from electrical interfaces, O/E
conversion is unnecessary. At PHY layer, the electrical signals are decoded and the ETH_LOS
alarms are tested. The electrical signals are converted from serial signals to parallel signals and
then sent to network processor.
In the transmit direction, the parallel signals are converted to serial signals. At the PHY layer,
signals are encoded and converted from electrical signals to optical signals.

Mapping Module
The mapping module consists of encapsulation and mapping.
In the upstream direction, this module first encapsulates Ethernet signals in LAPS or GFP format.
The concatenation is processed. Ethernet signals are then converted into SDH signals.
In the downstream direction, SDH signals are demapped. The time delay of virtual concatenation
is compensated. After aligning, packets are decapsulated as per encapsulation format. The
decapsulated data are transmitted to the network processor module in packets.

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Interface Converting Module

The interface converting module mainly converts 622 Mbit/s low voltage differential signals
(LVDS) bus of SDH system into parallel bus. Through this module, the high-rate backplane
interface connects to low-rate interface chip of the transmitting system.

Communication and Control Module

The communication and control module consists of CPU, register, oscillator, Ethernet port and
HDLC controller. This module connects to external circuits through bus. The communication
and control module:
l

Manages and configures other modules of the boards.

Performs inter-board communication through internal Ethernet interface.

The control module also contains basic logic units. This module enjoys the following functions:
l

Writes and reads register

Provides interface for CPU

Checks, selects clock

Performs phase discrimination and frequency division to the clock

Checks the in-service state of the cross-connect, the SCC and the line boards

Controls the shutting down of the optical module

Processes communication

Control indicators

Clock Unit
This clock unit tracing the system reference clock and generates the required working clocks for
each chip. The frequencies of these clocks are: 50 MHz, 77MHz, 125 MHz and 155 MHz.

DC/DC Converter Module

Through the DC/DC module, the power unit generates required voltages for each chip on the
board. The following DC voltages are provided: +1.5 V, +1.8 V, +2.5 V and +3.3 V. In addition,
this unit also provides protection for the board +3.3 V power supply.

7.2.4 Front Panel

On the front panel of the EFT8, there are indicators, interfaces and barcode.

Appearance of the Front Panel

Figure 7-4 shows the appearance of the front panel of the EFT8.

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Figure 7-4 Front panel of the EFT8

EFT8
STAT
ACT
PROG
SRV
FE1

FE2

FE3

FE4

FE5

FE6

FE7

FE8

EFT8

Indicators
The following indicators are present on the front panel of the board:
l

Board hardware state indicator (STAT), which is green or red when lit.

Service activating state indicator (ACT), which is green when lit.

Board software state indicator (PROG), which is green or red when lit.

Service alarm indicator (SRV), which is red, green or yellow when lit.

Connection status indicator (LINK), which is green when lit.

Data receiving and transmission indicator (ACT), which is orange when lit.

For indication of these indicators, see A Equipment and Board Alarm Indicators.

Interfaces
There are eight interfaces on the front panel of the EFT8. Table 7-5 lists the type and usage of
the interfaces.

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Table 7-5 Optical interfaces of the EFT8

Interface

Interface Type

Usage

FE1

RJ-45

Transmits and receives the 10Base-T/100Base-TX

signals.

FE2

RJ-45

Transmits and receives the 10Base-T/100Base-TX

signals.

FE3

RJ-45

Transmits and receives the 10Base-T/100Base-TX

signals.

FE4

RJ-45

Transmits and receives the 10Base-T/100Base-TX

signals.

FE5

RJ-45

Transmits and receives the 10Base-T/100Base-TX

signals.

FE6

RJ-45

Transmits and receives the 10Base-T/100Base-TX

signals.

FE7

RJ-45

Transmits and receives the 10Base-T/100Base-TX

signals.

FE8

RJ-45

Transmits and receives the 10Base-T/100Base-TX

signals.

Table 7-6 lists the pins of the RJ-45 interface.

Table 7-6 Pins of the RJ-45 of the EFT8
Pin

Description

Transmitting positive

Transmitting negative

Receiving positive

Grounding

Grounding

Receiving negative

Grounding

Grounding

7.2.5 Valid Slots

The EFT8 can be used with the ETF8 and EFF8.
Table 7-7 and Table 7-8 list the valid slots for the EFT8 and corresponding slots for the ETF8
and EFF8.
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Table 7-7 Valid slots for the EFT8 and corresponding slots for the ETF8 and EFF8 in the OptiX
OSN 1500A
Valid Slot for the EFT8

Corresponding Slot for the ETF8 and EFF8

Slot 12

Without the interface board

Slot 13

Without the interface board

Table 7-8 Valid slots for the EFT8 and corresponding slots for the ETF8 and EFF8 in the OptiX
OSN 1500B
Valid Slot for the EFT8

Corresponding Slot for the ETF8 and EFF8

Slot 11

Without the interface board

Slot 12

Slot 14

Slot 13

Slot 16

7.2.6 Board Configuration Reference

You can use the T2000 to set parameters for the EFT8.
You can use the T2000 to set the following parameters for the EFT8:
l

Working mode

Enabling of the LCAS

Maximum packet length

Mapping protocol

For details on the parameters, refer to F Board Configuration Reference.

7.2.7 Technical Specifications

The specifications of the EFT8 cover the mechanical specifications and power consumption.

Mechanical Specifications
The mechanical specifications of the EFT8 are as follows:
l

Board dimensions (mm): 262.05 (H) x 220 (D) x 25.4 (W)

Weight (kg): 1.0

Power Consumption
In the normal temperature (25), the maximum power consumption of the EFT8 is 26 W.

7.3 EFT8A
This section describes the EFT8A, an 8 x FE Ethernet transparent transmission board, in terms
of the version, function, principle, front panel, configuration and specifications.
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7.3.1 Version Description

The functional version of the EFT8A board is N1.
7.3.2 Function and Feature
The EFT8A supports transparent transmission of Ethernet services, LCAS, and test frames.
7.3.3 Working Principle and Signal Flow
The EFT8A consists of the ethernet access module, mapping module, interface converting
module, communication and control module and so on.
7.3.4 Front Panel
On the front panel of the EFT8A, there are indicators, interfaces and barcode.
7.3.5 Valid Slots
The EFT8A can be housed in any of slots 1213 in the OptiX OSN 1500A subrack. The EFT8A
can be housed in any of slots 1113 in the OptiX OSN 1500B subrack.
7.3.6 Board Configuration Reference
You can use the T2000 to set parameters for the EFT8A.
7.3.7 Technical Specifications
The specifications of the EFT8A cover the mechanical specifications and power consumption.

7.3.1 Version Description

The functional version of the EFT8A board is N1.

7.3.2 Function and Feature

The EFT8A supports transparent transmission of Ethernet services, LCAS, and test frames.
Table 7-9 lists the functions and features of the EFT8A.
Table 7-9 Functions and features of the EFT8A

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Function and
Feature

EFT8A

Basic function

Transparently transmits 8 x FE services.

Specification of the
optical interface

Supports 10Base-T/100Base-TX signals. The optical interfaces

comply with IEEE 802.3u.

Format of service
frames

Supports Ethernet II, IEEE 802.3, and IEEE 802.1q TAG. Supports
frames with a length ranging from 64 bytes to 9600 bytes. Supports
Jumbo frames with a length less than 9600 bytes.

Max. uplink
bandwidth

622 Mbit/s.

Number of
VCTRUNKs

8.

Encapsulation
format

Supports HDLC, LAPS, and GFP-F.

Mapping granularity

Supports VC-12, VC-3, VC-12-Xv (X63), and VC-3-Xv (X3).

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Function and
Feature

EFT8A

Ethernet service type

Supports EPL.

MPLS

Not supported.

VLAN

Supports VLAN transparent transmission.

LPT

Not supported.

CAR

Not supported.

Flow control
function

Supports the IEEE 802.3x flow control based on FE port.

LCAS

Dynamically increases or decreases the bandwidth, and realizes the

protection function, compliant with ITU-T G.7042.

Test frame

Receives and transmits GFP test frames.

Ethernet
performance
monitoring

Supports Ethernet performance monitoring at the port level.

Alarm and
performance event

Provides rich alarms and performance events for easy management

and maintenance of the equipment.

7.3.3 Working Principle and Signal Flow

The EFT8A consists of the ethernet access module, mapping module, interface converting
module, communication and control module and so on.
Figure 7-5 shows the block diagram for the functions of the EFT8A.

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Figure 7-5 Block diagram for the functions of the EFT8A

ENCP
FE

Ethernet
access
module

Cross-connect unit

Interface
converting
module

VCP
DENCP

Cross-connect unit

Mapping module
Laser
shutdown

LOS

Communication

Communication
and control
module

+3.3 V

Clock module

SCC unit

Reference clock and frame header

+1.5 V
+1.8 V
+2.5 V

DC/DC
converter

DC/DC
converter
Fuse

SCC unit

Fuse

- 48 V/-60V
- 48 V/-60V

+3.3 V

+3.3 V backup
power

77 125 155
MHz MHz MHz

ENCP: data encapsulation module

DENCP: decapsulation module

VCP: virtual concatenation processing module

The function modules of ethernet switching boards are described below:

Ethernet Access Module

In the receive direction, the optical signals from Ethernet equipment, such as switch and router,
are converted into electrical signals. For the signals accessed from electrical interfaces, O/E
conversion is unnecessary. At PHY layer, the electrical signals are decoded and the ETH_LOS
alarms are tested. The electrical signals are converted from serial signals to parallel signals and
then sent to network processor.
In the transmit direction, the parallel signals are converted to serial signals. At the PHY layer,
signals are encoded and converted from electrical signals to optical signals.

Mapping Module
The mapping module consists of encapsulation and mapping.
In the upstream direction, this module first encapsulates Ethernet signals in LAPS or GFP format.
The concatenation is processed. Ethernet signals are then converted into SDH signals.
In the downstream direction, SDH signals are demapped. The time delay of virtual concatenation
is compensated. After aligning, packets are decapsulated as per encapsulation format. The
decapsulated data are transmitted to the network processor module in packets.

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Interface Converting Module

The interface converting module mainly converts 622 Mbit/s low voltage differential signals
(LVDS) bus of SDH system into parallel bus. Through this module, the high-rate backplane
interface connects to low-rate interface chip of the transmitting system.

Communication and Control Module

The communication and control module consists of CPU, register, oscillator, Ethernet port and
HDLC controller. This module connects to external circuits through bus. The communication
and control module:
l

Manages and configures other modules of the boards.

Performs inter-board communication through internal Ethernet interface.

The control module also contains basic logic units. This module enjoys the following functions:
l

Writes and reads register

Provides interface for CPU

Checks, selects clock

Performs phase discrimination and frequency division to the clock

Checks the in-service state of the cross-connect, the SCC and the line boards

Controls the shutting down of the optical module

Processes communication

Control indicators

Clock Unit
This clock unit tracing the system reference clock and generates the required working clocks for
each chip. The frequencies of these clocks are: 50 MHz, 77MHz, 125 MHz and 155 MHz.

DC/DC Converter Module

Through the DC/DC module, the power unit generates required voltages for each chip on the
board. The following DC voltages are provided: +1.5 V, +1.8 V, +2.5 V and +3.3 V. In addition,
this unit also provides protection for the board +3.3 V power supply.

7.3.4 Front Panel

On the front panel of the EFT8A, there are indicators, interfaces and barcode.

Appearance of the Front Panel

Figure 7-6 shows the appearance of the front panel of the EFT8A.

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Figure 7-6 Front panel of the EFT8A

EFT8A
STAT
ACT
PROG
SRV

FE1

FE2

FE3

FE4

FE5

FE6

FE7

FE8

EFT8A

Indicators
The following indicators are present on the front panel of the board:
l

Board hardware state indicator (STAT), which is green or red when lit.

Service activating state indicator (ACT), which is green when lit.

Board software state indicator (PROG), which is green or red when lit.

Service alarm indicator (SRV), which is red, green or yellow when lit.

Connection status indicator (LINK), which is green when lit.

Data receiving and transmission indicator (ACT), which is orange when lit.

For indication of these indicators, see A Equipment and Board Alarm Indicators.

Interfaces
There are eight FE interfaces on the front panel of the EFT8A. Table 7-10 lists the type and
usage of the interfaces.

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Table 7-10 Optical interfaces of the EFT8A

Interface

Interface Type

Usage

FE1

RJ-45

Transmits and receives the 10Base-T/100Base-TX

signals.

FE2

RJ-45

Transmits and receives the 10Base-T/100Base-TX

signals.

FE3

RJ-45

Transmits and receives the 10Base-T/100Base-TX

signals.

FE4

RJ-45

Transmits and receives the 10Base-T/100Base-TX

signals.

FE5

RJ-45

Transmits and receives the 10Base-T/100Base-TX

signals.

FE6

RJ-45

Transmits and receives the 10Base-T/100Base-TX

signals.

FE7

RJ-45

Transmits and receives the 10Base-T/100Base-TX

signals.

FE8

RJ-45

Transmits and receives the 10Base-T/100Base-TX

signals.

Table 7-11 lists the pins of the RJ-45 interface.

Table 7-11 Pins of the RJ-45 of the EFT8A
Pin

Description

Transmitting positive

Transmitting negative

Receiving positive

Grounding

Grounding

Receiving negative

Grounding

Grounding

7.3.5 Valid Slots

The EFT8A can be housed in any of slots 1213 in the OptiX OSN 1500A subrack. The EFT8A
can be housed in any of slots 1113 in the OptiX OSN 1500B subrack.

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7.3.6 Board Configuration Reference

You can use the T2000 to set parameters for the EFT8A.
You can use the T2000 to set the following parameters for the EFT8A:
l

Working mode

Enabling of the LCAS

Maximum packet length

Mapping protocol

For details on the parameters, refer to F Board Configuration Reference.

7.3.7 Technical Specifications

The specifications of the EFT8A cover the mechanical specifications and power consumption.

Mechanical Specifications
The mechanical specifications of the EFT8A are as follows:
l

Board dimensions (mm): 262.05 (H) x 220 (D) x 25.4 (W)

Weight (kg): 1.0

Power Consumption
In the normal temperature (25), the maximum power consumption of the EFT8A is 26 W.

7.4 EGT2
This section describes the EGT2, a 2 x GE Ethernet transparent transmission board, in terms of
the version, function, principle, front panel, configuration and specifications.
7.4.1 Version Description
The functional version of the EGT2 board is N1.
7.4.2 Function and Feature
The EGT2 supports transparent transmission of Ethernet services, LCAS, and test frames.
7.4.3 Working Principle and Signal Flow
The EGT2 consists of the ethernet access module, mapping module, interface converting
module, interface converting module, Communication and Control Module and so on.
7.4.4 Front Panel
On the front panel of the EGT2, there are indicators, interfaces and barcode.
7.4.5 Valid Slots
The EGT2 can be housed in any of slots 1213 in the OptiX OSN 1500A subrack. The EGT2
can be housed in any of slots 1113 in the OptiX OSN 1500B subrack.
7.4.6 Board Feature Code
The code behind the board name in the barcode is the board feature code. The board feature code
of the EGT2 indicates the optical interface type.
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7.4.7 Board Configuration Reference

You can use the T2000 to set parameters for the EGT2.
7.4.8 Technical Specifications
The specifications of the EGT2 cover the optical interface specifications, mechanical
specifications and power consumption.

7.4.1 Version Description

The functional version of the EGT2 board is N1.

7.4.2 Function and Feature

The EGT2 supports transparent transmission of Ethernet services, LCAS, and test frames.
Table 7-12 lists the functions and features of the EGT2.
Table 7-12 Functions and features of the EGT2

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Function and
Feature

EGT2

Basic function

Transparently transmits 2 x GE services.

Specification of
the optical
interface

The optical interfaces are 1000Base-SX/LX/ZX Ethernet optical

interfaces. The optical interfaces support the auto-negotiation, compliant
with IEEE 802.3z. The optical interfaces use the hot-swappable optical
module SFP. When multimode optical fiber is used, the maximum
transmission distance is 550 m. When single-mode optical fiber is used,
the maximum transmission distance is 10 km. The optical modules can
be used for different requirements for the transmission distance, such as
40 km and 70 km.

Format of service
frames

Supports Ethernet II, IEEE 802.3, and IEEE 802.1q TAG. Supports
frames with a length ranging from 64 bytes to 9600 bytes. Supports
Jumbo frames with a length less than 9600 bytes.

Max. uplink
bandwidth

2.5 Gbit/s.

Number of
VCTRUNKs

2.

Encapsulation
format

Supports HDLC, LAPS, and GFP-F.

Mapping
granularity

Supports VC-4, VC-3, VC-3-Xv (X24), and VC-4-Xv (X8).

Ethernet service
type

Supports EPL.

MPLS

Not supported.

VLAN

Supports VLAN transparent transmission.

LPT

Not supported.
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Function and
Feature

EGT2

CAR

Not supported.

Flow control
function

Supports the IEEE 802.3x flow control based on GE port.

LCAS

Dynamically increases or decreases the bandwidth and realizes the

protection function, compliant with ITU-T G.7042.

Test frame

Receives and transmits Ethernet test frames.

Ethernet
performance
monitoring

Supports Ethernet performance monitoring at the port level.

Alarm and
performance
event

Provides rich alarms and performance events for easy management and
maintenance of the equipment.

7.4.3 Working Principle and Signal Flow

The EGT2 consists of the ethernet access module, mapping module, interface converting
module, interface converting module, Communication and Control Module and so on.
Figure 7-7 shows the block diagram for the functions of the EGT2.
Figure 7-7 Block diagram for the functions of the EGT2

ENCP
GE

Ethernet
access
module

Cross-connect unit

Interface
converting
module

VCP
DENCP

Cross-connect unit

Mapping module
Laser
shutdown

LOS

Communication

Communication
and control
module

+3.3 V

Clock module

SCC unit

Reference clock and frame header

+1.5 V
+1.8 V
+2.5 V

DC/DC
converter

DC/DC
converter
Fuse

SCC unit

Fuse

- 48 V/-60V
- 48 V/-60V

+3.3 V

+3.3 V backup
power

77 125 155
MHz MHz MHz

ENCP: data encapsulation module

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VCP: virtual concatenation processing module

The function modules of ethernet switching boards are described below:

Ethernet Access Module

In the receive direction, the optical signals from Ethernet equipment, such as switch and router,
are converted into electrical signals. For the signals accessed from electrical interfaces, O/E
conversion is unnecessary. At PHY layer, the electrical signals are decoded and the ETH_LOS
alarms are tested. The electrical signals are converted from serial signals to parallel signals and
then sent to network processor.
In the transmit direction, the parallel signals are converted to serial signals. At the PHY layer,
signals are encoded and converted from electrical signals to optical signals.

Mapping Module
The mapping module consists of encapsulation and mapping.
In the upstream direction, this module first encapsulates Ethernet signals in LAPS or GFP format.
The concatenation is processed. Ethernet signals are then converted into SDH signals.
In the downstream direction, SDH signals are demapped. The time delay of virtual concatenation
is compensated. After aligning, packets are decapsulated as per encapsulation format. The
decapsulated data are transmitted to the network processor module in packets.

Interface Converting Module

The interface converting module mainly converts 622 Mbit/s low voltage differential signals
(LVDS) bus of SDH system into parallel bus. Through this module, the high-rate backplane
interface connects to low-rate interface chip of the transmitting system.

Communication and Control Module

The communication and control module consists of CPU, register, oscillator, Ethernet port and
HDLC controller. This module connects to external circuits through bus. The communication
and control module:
l

Manages and configures other modules of the boards.

Performs inter-board communication through internal Ethernet interface.

The control module also contains basic logic units. This module enjoys the following functions:
l

Writes and reads register

Provides interface for CPU

Checks, selects clock

Performs phase discrimination and frequency division to the clock

Checks the in-service state of the cross-connect, the SCC and the line boards

Controls the shutting down of the optical module

Processes communication

Control indicators

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Clock Unit
This clock unit tracing the system reference clock and generates the required working clocks for
each chip. The frequencies of these clocks are: 50 MHz, 77MHz, 125 MHz and 155 MHz.

DC/DC Converter Module

Through the DC/DC module, the power unit generates required voltages for each chip on the
board. The following DC voltages are provided: +1.5 V, +1.8 V, +2.5 V and +3.3 V. In addition,
this unit also provides protection for the board +3.3 V power supply.

7.4.4 Front Panel

On the front panel of the EGT2, there are indicators, interfaces and barcode.

Appearance of the Front Panel

Figure 7-8 shows the appearance of the front panel of the EGT2.
Figure 7-8 Front panel of the EGT2

EGT2
STAT
ACT
PROG
SRV
LINK1
ACT1
LINK2
ACT2

CLASS 1
LASER
PRODUCT

OUT1 IN1
OUT2 IN2
EGT2

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Indicators
The following indicators are present on the front panel of the board:
l

Board hardware state indicator (STAT), which is green or red when lit.

Service activating state indicator (ACT), which is green when lit.

Board software state indicator (PROG), which is green or red when lit.

Service alarm indicator (SRV), which is red, green or yellow when lit.

Connection status indicator (LINK), which is green when lit.

Data receiving and transmission indicator (ACT), which is orange when lit.

For indication of these indicators, see A Equipment and Board Alarm Indicators.

Interfaces
There are two GE interfaces on the front panel of the EGT2. Table 7-13 lists the type and usage
of the interfaces.
Table 7-13 Optical interfaces of the EGT2
Interface

Interface Type

Usage

IN1/OUT1

LC (pluggable)

Transmits and receives the 1000Base-SX/LX/ZX

signals.

IN2/OUT2

LC (pluggable)

Transmits and receives the 1000Base-SX/LX/ZX

signals.

7.4.5 Valid Slots

The EGT2 can be housed in any of slots 1213 in the OptiX OSN 1500A subrack. The EGT2
can be housed in any of slots 1113 in the OptiX OSN 1500B subrack.

7.4.6 Board Feature Code

The code behind the board name in the barcode is the board feature code. The board feature code
of the EGT2 indicates the optical interface type.
Table 7-14 lists the relation between the board feature code and optical interface type for the
EGT2.
Table 7-14 Relation between the board feature code and the optical interface type

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Board Barcode

Feature Code

Optical Interface Type

SSN1EGT210

10

1000Base-SX (0.55 km)

SSN1EGT211

11

1000Base-LX (10 km)

SSN1EGT212

12

1000Base-ZX (40 km)

SSN1EGT213

13

1000Base-ZX (70 km)

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7.4.7 Board Configuration Reference

You can use the T2000 to set parameters for the EGT2.
You can use the T2000 to set the following parameters for the EGT2:
l

Working mode

Enabling of the LCAS

Maximum packet length

Mapping protocol

For details on the parameters, refer to F Board Configuration Reference.

7.4.8 Technical Specifications

The specifications of the EGT2 cover the optical interface specifications, mechanical
specifications and power consumption.

Optical Interface Specifications

Table 7-15 lists the specifications of the interfaces of the EGT2.
Table 7-15 Specifications of the optical interfaces of the EGT2
Item

Specification

Optical
interface type

1000Base-ZX
(70 km)

1000Base-ZX
(40 km)

1000Base-LX
(10 km)

1000Base-SX
(0.55 km)

Optical source
type

MLM

MLM

MLM

MLM

Launched
optical power
(dBm)

4 to +2

2 to +5

9 to 3

9.5 to 0

Central
wavelength
(nm)

1480 to 1580

1270 to 1355

1270 to 1355

770 to 860

Overload
optical power
(dBm)

Receiver
sensitivity
(dBm)

22

23

19

17

Extinction ratio
(dB)

Laser Safety Class

The safety class of the laser on the board is CLASS 1.
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The maximum launched optical power of the optical interfaces is lower than 10 dBm (10 mW).

Mechanical Specifications
The mechanical specifications of the EGT2 are as follows:
l

Board dimensions (mm): 262.05 (H) x 220 (D) x 25.4 (W)

Weight (kg): 0.9

Power Consumption
In the normal temperature (25), the maximum power consumption of the EGT2 is 29 W.

7.5 EFS0
This section describes the EFS0, an 8 x FE Ethernet processing board with Lanswitch, in terms
of the version, function, principle, front panel, configuration and specifications.
7.5.1 Version Description
The EFS0 has three functional versions, N1, N2 and N4. The production of the N1 version is
stopped.
7.5.2 Function and Feature
The EFS0 supports Layer 2 switching, MPLS and broadcast.
7.5.3 Working Principle and Signal Flow
The EFS0 consists of the ethernet access module, network processor module, mapping module,
interface converting module and so on.
7.5.4 Front Panel
On the front panel of the EFS0, there are indicators, interfaces and barcode.
7.5.5 Valid Slots
The EFS0 can be housed in any of slots 1213 in the OptiX OSN 1500B subrack.
7.5.6 TPS Protection
The EFS0 supports the 1:N TPS protection.
7.5.7 Board Configuration Reference
You can use the T2000 to set parameters for the EFS0.
7.5.8 Technical Specifications
The specifications of the EFS0 cover the mechanical specifications and power consumption.

7.5.1 Version Description

The EFS0 has three functional versions, N1, N2 and N4. The production of the N1 version is
stopped.
The OptiX OSN 1500A does not support the EFS0. The OptiX OSN 1500B supports the EFS0.
Table 7-16 lists the details on the versions of the EFS0 board.

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Table 7-16 Version Description of the EFS0

Item

Description

Functional
version

The EFS0 has three versions, N1, N2, and N4.

Difference

The maximum uplink bandwidth of the N1EFS0 is 622 Mbit/s.

The maximum uplink bandwidth of the N2EFS0 is 1.25 Gbit/s.
The N1EFS0 supports the port flow, port+VLAN ID flow, and port
+VLAN PRI flow.
The N2EFS0 and N4EFS0 support the port flow, port+VLAN ID flow,
and port+VLAN PRI flow.

Replaceability

The N2EFS0 supports the board version replacement function and can
replace the N1EFS0.
The N4EFS0 supports the board version replacement function and can
replace the N1EFS0 and N2EFS0.

7.5.2 Function and Feature

The EFS0 supports Layer 2 switching, MPLS and broadcast.
Table 7-17 lists the functions and features of the EFS0.
Table 7-17 Functions and features of the EFS0
Function and
Feature

EFS0

Basic function

Processes 8 x FE services.

Used with the

interface board

Accesses 8 x FE signals at the electrical interface when used with the

ETF8.
Accesses 8 x FE signals at the optical interface when used with the EFF8.
Realizes the TPS protection for 8 x FE signals at the electrical interface
when used with the ETS8 and TSB8.

Specification of
the optical
interface

Supports the 10Base-T/100Base-TX signals when used with the ETF8.

Format of service
frames

Supports Ethernet II, IEEE 802.3, and IEEE 802.1 q/p. Supports frames
with a length ranging from 64 bytes to 9600 bytes. Supports Jumbo
frames with a length less than 9600 bytes.

Max. uplink
bandwidth

The maximum uplink bandwidth of the N1EFS0 is 622 Mbit/s.

Supports the 100Base-FX signals when used with the EFF8. The optical
inerfaces comply with IEEE 802.3u.

The maximum uplink bandwidth of the N2EFS0 is 1.25 Gbit/s.

The maximum uplink bandwidth of the N4EFS0 is 1.25 Gbit/s.

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Function and
Feature

EFS0

Number of
VCTRUNKs

The number of the VCTRUNKs of the N1EFS0 is 12.

The number of the VCTRUNKs of the N2EFS0 is 24.
The number of the VCTRUNKs of the N4EFS0 is 24.

Mapping
granularity

Supports VC-12, VC-3, VC-12-Xv (X63), and VC-3-Xv (X12).

Encapsulation
format

GFP.

EPL

Supports transparent transmission based on port and Ethernet private line

services based on port+VLAN.

EVPL

Supports EVPL services that use the frame encapsulation formats of

MartinioE and stack VLAN.

EPLAN

Supports the Layer 2 convergence and point to multipoint convergence.

Supports the Layer 2 forwarding function.
Supports switching at the client and SDH sides.
Supports the function of self-learning the source MAC address. The
length of the MAC address table is 16k. The aging time of the MAC
address can be set and queried.
Supports the configuration of static MAC route.
The N1EFS0 and N2EFS0 support the dynamic query of the MAC
address, and support the query of the number of the learned MAC
addresses according to VB+VLAN or VB+LP.
The N4EFS0 does not support the dynamic query of the MAC address,
but it supports the query of the number of the learned MAC addresses
according to VB+VLAN or VB+LP.
Supports data isolation based on VB+VLAN.
Supports the creation, deletion and query of the VB. The maximum
number of the VBs is 16. The maximum number of logical ports for each
VB is 30.

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EVPLAN

Supports EVPLAN services. The N1EFS0 uses the frame encapsulation

formats of MPLS MartinioE, MPLS MartinioP and stack VLAN. The
N2EFS0 and N4EFS0 use the frame encapsulation formats of MPLS
MartinioE and stack VLAN.

MPLS

Supported.

VLAN

Compliant with IEEE 802.1q/p.

VLAN
convergence

Supported (4k VLAN).

RSTP

Supports broadcast packet suppression and RSTP, compliant with IEEE

802.1w.

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Function and
Feature

EFS0

Multicast (IGMP
Snooping)

Supported.

CAR

Supported.
The granularity is 64 kbit/s.

Service based
QoS flow
classification

The N1EFS0 supports the port service, port+VLAN ID service, and port
+VLAN PRI service.
The N2EFS0 and N4EFS0 support the port flow, port+VLAN ID flow,
and port+VLAN PRI flow.

LCAS

Dynamically increases or decreases the bandwidth and realizes the

protection function, compliant with ITU-T G.7042.

LPT

Supports the LPT function, which can be enabled or disabled.

Flow control
function

Supports the IEEE 802.3x flow control based on port.

Test frame

Receives and transmits Ethernet test frames.

Loopback
function

Supports inloop at the Ethernet port (PHY layer or MAC layer). Supports
inloop and outloop at the VC-3 level.

Ethernet
performance
monitoring

Supports Ethernet performance monitoring at the port level.

Alarm and
performance
event

Provides rich alarms and performance events for easy management and
maintenance of the equipment.

7.5.3 Working Principle and Signal Flow

The EFS0 consists of the ethernet access module, network processor module, mapping module,
interface converting module and so on.
Figure 7-9 shows the block diagram for the functions of the EFS0.

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Figure 7-9 Block diagram for the functions of the EFS0

E
N
C
P

Control
FE

Ethernet
access
module

Network
processor

Switch
fabric

Laser
shutdown

V
C
P

D
E
N
C
P

Data

Network processor module

Cross-connect unit

Interface
coversion
module
Cross-connect unit

Mapping module

LOS

Communication

Communication
and control module

Reference clock and frame header

+3.3 V
+1.5 V

Clock module

+1.8 V
+2.5 V

DC/DC
converter

DC/DC
converter

Fuse

SCC unit

-48 V/ -60 V
-48 V/ -60 V

Fuse

50
77 125 155
MHz MHz MHz MHz

ENCP: data encapsulation module

SCC unit

+3.3 V backup
power

DENCP: decapsulation module

VCP: virtual concatenation processing module

The function modules of ethernet switching boards are described below:

Ethernet Access Module

In the receive direction, the optical signals from Ethernet equipment, such as switch and router,
are converted into electrical signals. For the signals accessed from electrical interfaces, O/E
conversion is unnecessary. At PHY layer, the electrical signals are decoded and the ETH_LOS
alarms are tested. The electrical signals are converted from serial signals to parallel signals and
then sent to network processor.
In the transmit direction, the parallel signals are converted to serial signals. At the PHY layer,
signals are encoded and converted from electrical signals to optical signals.

Network Processor Module

The network processor module consists of network processor and switch fabric. The network
processor first performs MAC functions, which include code conversion, framing of Ethernet
packets, CRC check and Ethernet performance statistics.
After the striped Ethernet frame enters the core of network processor, the flow is classified as
per service type and configuration requirements. The frame is encapsulated or decapsulated.
These packets formats are supported:
l

Multi-protocol label switching (MPLS)

L2MPLS VPN

Ethernet/ VLAN

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In the receive direction, services are mapped and forwarded by adding Tunnel and VC double
labels as per service configuration. In the transmit direction, Tunnel or VC is extracted as per
the level (P or PE) of the equipment. Services are then routed or forwarded.
The network processor module:
l

Supports flow sense and flow classification

Supports uni-cast, multi-cast and broadcast of the flow

Provides data priority setting

Provides weighted fair queuing (WFQ)

Provides four classes of services (CoS)

Mapping Module
The mapping module consists of encapsulation and mapping.
In the upstream direction, this module first encapsulates Ethernet signals in LAPS or GFP format.
The concatenation is processed. The LCAS function is supported. Ethernet signals are then
converted into SDH signals.
In the downstream direction, SDH signals are demapped. The time delay of virtual concatenation
is compensated. After aligning, packets are decapsulated as per encapsulation format. The
decapsulated data are transmitted to the network processor module in packets.

Interface Conversion Module

The interface converting module mainly converts 622 Mbit/s low voltage differential signals
(LVDS) bus of SDH system into parallel bus. Through this module, the high-rate backplane
interface connects to low-rate interface chip of the transmitting system.

Communication and Control Module

The communication and control module consists of CPU, register, oscillator, Ethernet port and
HDLC controller. This module connects to external circuits through bus. The communication
and control module:
l

Manages and configures other modules of the boards.

Performs inter-board communication through internal Ethernet interface.

The control module also contains basic logic units. This module enjoys the following functions:

7-34

Writes and reads register

Provides interface for CPU

Checks, selects clock

Performs phase discrimination and frequency division to the clock

Checks the in-service state of the cross-connect, the SCC and the line boards

Controls the shutting down of the optical module

Processes communication

Control indicators
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Clock Unit
This clock unit tracing the system reference clock and generates the required working clocks for
each chip. The frequencies of these clocks are: 50 MHz, 77MHz, 125 MHz and 155 MHz.

DC/DC Converter Module

Through the DC/DC module, the power converting unit generates required voltages for each
chip on the board. The following DC voltages are provided: +1.5 V, +1.8 V, +2.5 V and +3.3
V. In addition, this unit also provides protection for the board +3.3 V power supply.

7.5.4 Front Panel

On the front panel of the EFS0, there are indicators, interfaces and barcode.

Appearance of the Front Panel

Figure 7-10 shows the appearance of the front panel of the EFS0.
Figure 7-10 Front panel of the EFS0

EFS0
STAT
ACT
PROG
SRV

EFS0

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Indicators
The following indicators are present on the front panel of the board:
l

Board hardware state indicator (STAT), which is green or red when lit.

Service activating state indicator (ACT), which is green when lit.

Board software state indicator (PROG), which is green or red when lit.

Service alarm indicator (SRV), which is red, green or yellow when lit.

For indication of these indicators, see A Equipment and Board Alarm Indicators.

Interfaces
There are no interfaces on the front panel of the EFS0. The interfaces are present on the ETF8
or EFF8.

7.5.5 Valid Slots

The EFS0 can be housed in any of slots 1213 in the OptiX OSN 1500B subrack.
When the N1EFS0 is housed in any of slots 1213 in the OptiX OSN 1500B subrack, the
bandwidth is 622 Mbit/s.
When the N2EFS0 or N4EFS0 is housed in any of slots 1213 in the OptiX OSN 1500B subrack,
the bandwidth is 1.25 Gbit/s.
The EFS0 can be used with the ETF8 and EFF8.
Table 7-18 lists the valid slots for the EFS0 and corresponding slots for the ETF8 and EFF8.
Table 7-18 Valid slots for the EFS0 and corresponding slots for the ETF8 and EFF8 in the OptiX
OSN 1500B subrack
Valid Slot for the EFS0

Corresponding Slot for the ETF8 and EFF8

Slot 12

Slot 14

Slot 13

Slot 16

7.5.6 TPS Protection

The EFS0 supports the 1:N TPS protection.
Figure 7-11 shows the slot configuration for the 1:1 TPS protection for the EFS0.

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Figure 7-11 Slot configuration for the 1:1 TPS protection for the EFS0 in the OptiX OSN 1500B
subrack
Slot 14

TSB8

Slot 15
Slot 16

ETS8

Slot 17

Slot 18

PIU

Slot 19

PIU

Slot 6

Slot 11
Slot 20

Slot 12

EFS0 Protection

Slot 7

FAN

Slot 13

EFS0 Working

Slot 8

Slot 4

CXL16/4/1

Slot 9

EOW

Slot 5

CXL16/4/1

Slot 10

AUX

As shown in Figure 7-11, the protection board housed in slot 12 protects the board housed in
slot 13. The ETS8, housed in slot 16, is used with the working ETS0. The TSB8, housed in slot
14, is used with the protection EFS0.

7.5.7 Board Configuration Reference

You can use the T2000 to set parameters for the EFS0.
You can use the T2000 to set the following parameters for the EFS0:
l

Working mode

Enabling of the LCAS

Maximum packet length

Mapping protocol

For details on the parameters, refer to F Board Configuration Reference.

7.5.8 Technical Specifications

The specifications of the EFS0 cover the mechanical specifications and power consumption.

Mechanical Specifications
The mechanical specifications of the EFS0 are as follows:
l

Board dimensions (mm): 262.05 (H) x 220 (D) x 25.4 (W)

Weight (kg): 1.0

Power Consumption
In the normal temperature (25), the maximum power consumption of the EFS0 is 35 W.

7.6 EFS4
This section describes the EFS4, a 4 x FE Ethernet processing board with Lanswitch, in terms
of the version, function, principle, front panel, configuration and specifications.
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7.6.1 Version Description

The EFS4 has two functional versions, N1 and N2. The two versions have different maximum
uplink bandwidth.
7.6.2 Function and Feature
The EFS4 supports Layer 2 switching, MPLS and broadcast.
7.6.3 Working Principle and Signal Flow
The EFS4 consists of the interface module, service processing module, encapsulation and
mapping module, interface converting module, control and communication Module and the
power supply module
7.6.4 Front Panel
On the front panel of the EFS4, there are indicators, interfaces and barcode.
7.6.5 Valid Slots
The EFS4 can be housed in any of slots 1213 in the OptiX OSN 1500A subrack. The EFS4 can
be housed in any of slots 1113 in the OptiX OSN 1500B subrack.
7.6.6 Board Configuration Reference
You can use the T2000 to set parameters for the EFS4.
7.6.7 Technical Specifications
The specifications of the EFS4 cover the mechanical specifications and power consumption.

7.6.1 Version Description

The EFS4 has two functional versions, N1 and N2. The two versions have different maximum
uplink bandwidth.
Table 7-19 lists the details on the versions of the EFS4 board.
Table 7-19 Version Description of the EFS4
Item

Description

Functional
version

The EFS4 has two versions, N1 and N2.

Difference

The maximum uplink bandwidth of the N1EFS4 is 622 Mbit/s.

The maximum uplink bandwidth of the N2EFS4 is 1.25 Gbit/s.
The N2EFS4 supports the board version replacement function.

Replaceability

The N2EFS4 supports the board version replacement function and can
replace the N1EFS4.

7.6.2 Function and Feature

The EFS4 supports Layer 2 switching, MPLS and broadcast.
Table 7-20 lists the functions and features of the EFS4.

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Table 7-20 Functions and features of the EFS4

Function and
Feature

EFS4

Basic function

Processes 4 x FE services.

Specification of
the optical
interfaces

Supports 10Base-T/100Base-TX signals. The optical interfaces comply

with IEEE 802.3u.

Format of service
frames

Supports Ethernet II, IEEE 802.3, and IEEE 802.1 q/p. Supports frames
with a length ranging from 64 bytes to 9600 bytes. Supports Jumbo frames
with a length less than 9600 bytes.

Max. uplink
bandwidth

The maximum uplink bandwidth of the N1EFS4 is 622 Mbit/s.

Number of
VCTRUNKs

The number of the VCTRUNKs of the N1EFS4 is 12.

Mapping
granularity

Supports VC-12, VC-3, VC-12-Xv (X63), and VC-3-Xv (X12).

Encapsulation
format

GFP.

EPL

Supports transparent transmission based on port and Ethernet private line

services based on port+VLAN.

EVPL

Supports EVPL services that use the frame encapsulation formats of

MartinioE and stack VLAN.

EPLAN

Supports the Layer 2 convergence and point to multipoint convergence.

The maximum uplink bandwidth of the N2EFS4 is 1.25 Gbit/s.

The number of the VCTRUNKs of the N2EFS4 is 24.

Supports the Layer 2 forwarding function and switching at the client and
SDH sides.
Supports the function of self-learning the source MAC address. The
length of the MAC address table is 16k. The aging time of the MAC
address can be set and queried.
Supports the configuration of static MAC route.
The N1EFS4 supports the dynamic query of the MAC address, and
supports the query of the number of the learned MAC addresses according
to VB+VLAN or VB+LP.
The N2EFS4 does not support the dynamic query of the MAC address,
but it supports the query of the number of the learned MAC addresses
according to VB+VLAN or VB+LP.
Supports data isolation based on VB+VLAN.
Supports the creation, deletion and query of the VB. The maximum
number of the VBs is 16 (a maximum of two VBs for the N2EGS2). The
maximum number of logical ports for each VB is 30.

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Function and
Feature

EFS4

EVPLAN

Supports EVPLAN services. The N1EFS4 uses the frame encapsulation

formats of MPLS MartinioE, MPLS MartinioP and stack VLAN. The
N2EFS4 uses the frame encapsulation formats of MPLS MartinioE and
stack VLAN.

MPLS

Supported.

VLAN

Compliant with IEEE 802.1q/p.

VLAN
convergence

Supported (4k VLAN).

RSTP

Supports broadcast packet suppression and RSTP, compliant with IEEE

802.1w.

Multicast (IGMP
Snooping)

Supported.

CAR

Supported.
The granularity is 64 kbit/s.

Service based

The N1EFS4 supports the port service, port+VLAN ID service, and port
+VLAN PRI service.

QoS flow
classification

The N2EFS4 supports the port flow, port+VLAN ID flow, and port
+VLAN PRI flow.

LCAS

Dynamically increases or decreases the bandwidth, and realizes the

protection function, compliant with ITU-T G.7042.

LPT

Supports the LPT function, which can be enabled or disabled.

Flow control
function

Supports the IEEE 802.3x flow control based on port.

Test frame

Receives and transmits Ethernet test frames.

Loopback
function

Supports inloop at the Ethernet port (PHY layer or MAC layer). Supports
inloop and outloop at the VC-3 level.

Ethernet
performance
monitoring

Supports Ethernet performance monitoring at the port level.

Alarm and
performance
event

Provides rich alarms and performance events for easy management and
maintenance of the equipment.

7.6.3 Working Principle and Signal Flow

The EFS4 consists of the interface module, service processing module, encapsulation and
mapping module, interface converting module, control and communication Module and the
power supply module
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Figure 7-12 shows the block diagram for the functions of the EFS4.
Figure 7-12 Block diagram for the functions of the EFS4
E
N
C
P

Control
FE

Ethernet
access
module

Network
processor

Switch
fabric

Laser
shutdown

V
C
P

D
E
N
C
P

Data

Network processor module

Cross-connect unit

Interface
coversion
module
Cross-connect unit

Mapping module

LOS

Communication

Communication
and control module

Reference clock and frame header

+3.3 V
+1.5 V

Clock module

+1.8 V
+2.5 V

DC/DC
converter

DC/DC
converter

Fuse

SCC unit

-48 V/ -60 V
-48 V/ -60 V

Fuse

77 125 155
50
MHz MHz MHz MHz

ENCP: data encapsulation module

SCC unit

+3.3 V backup
power

DENCP: decapsulation module

VCP: virtual concatenation processing module

The function modules of ethernet switching boards are described below:

Ethernet Access Module

In the receive direction, the optical signals from Ethernet equipment, such as switch and router,
are converted into electrical signals. For the signals accessed from electrical interfaces, O/E
conversion is unnecessary. At PHY layer, the electrical signals are decoded and the ETH_LOS
alarms are tested. The electrical signals are converted from serial signals to parallel signals and
then sent to network processor.
In the transmit direction, the parallel signals are converted to serial signals. At the PHY layer,
signals are encoded and converted from electrical signals to optical signals.

Network Processor Module

The network processor module consists of network processor and switch fabric. The network
processor first performs MAC functions, which include code conversion, framing of Ethernet
packets, CRC check and Ethernet performance statistics.
After the striped Ethernet frame enters the core of network processor, the flow is classified as
per service type and configuration requirements. The frame is encapsulated or decapsulated.
These packets formats are supported:
l

Multi-protocol label switching (MPLS)

L2MPLS VPN

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l

Ethernet/ VLAN

In the receive direction, services are mapped and forwarded by adding Tunnel and VC double
labels as per service configuration. In the transmit direction, Tunnel or VC is extracted as per
the level (P or PE) of the equipment. Services are then routed or forwarded.
The network processor module:
l

Supports flow sense and flow classification

Supports uni-cast, multi-cast and broadcast of the flow

Provides data priority setting

Provides weighted fair queuing (WFQ)

Provides four classes of services (CoS)

Mapping Module
The mapping module consists of encapsulation and mapping.
In the upstream direction, this module first encapsulates Ethernet signals in LAPS or GFP format.
The concatenation is processed. The LCAS function is supported. Ethernet signals are then
converted into SDH signals.
In the downstream direction, SDH signals are demapped. The time delay of virtual concatenation
is compensated. After aligning, packets are decapsulated as per encapsulation format. The
decapsulated data are transmitted to the network processor module in packets.

Interface Conversion Module

The interface converting module mainly converts 622 Mbit/s low voltage differential signals
(LVDS) bus of SDH system into parallel bus. Through this module, the high-rate backplane
interface connects to low-rate interface chip of the transmitting system.

Communication and Control Module

The communication and control module consists of CPU, register, oscillator, Ethernet port and
HDLC controller. This module connects to external circuits through bus. The communication
and control module:
l

Manages and configures other modules of the boards.

Performs inter-board communication through internal Ethernet interface.

The control module also contains basic logic units. This module enjoys the following functions:

7-42

Writes and reads register

Provides interface for CPU

Checks, selects clock

Performs phase discrimination and frequency division to the clock

Checks the in-service state of the cross-connect, the SCC and the line boards

Controls the shutting down of the optical module

Processes communication

Control indicators
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Clock Unit
This clock unit tracing the system reference clock and generates the required working clocks for
each chip. The frequencies of these clocks are: 50 MHz, 77MHz, 125 MHz and 155 MHz.

DC/DC Converter Module

Through the DC/DC module, the power converting unit generates required voltages for each
chip on the board. The following DC voltages are provided: +1.5 V, +1.8 V, +2.5 V and +3.3
V. In addition, this unit also provides protection for the board +3.3 V power supply.

7.6.4 Front Panel

On the front panel of the EFS4, there are indicators, interfaces and barcode.

Appearance of the Front Panel

Figure 7-13 shows the appearance of the front panel of the EFS4.
Figure 7-13 Front panel of the EFS4

EFS4
STAT
ACT
PROG
SRV

FE1

FE2

FE3

FE4

EFS4

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Indicators
The following indicators are present on the front panel of the board:
l

Board hardware state indicator (STAT), which is green or red when lit.

Service activating state indicator (ACT), which is green when lit.

Board software state indicator (PROG), which is green or red when lit.

Service alarm indicator (SRV), which is red, green or yellow when lit.

Connection status indicator (LINK), which is green when lit.

Data receiving and transmission indicator (ACT), which is orange when lit.

For indication of these indicators, see A Equipment and Board Alarm Indicators.

Interfaces
There are four FE interfaces on the front panel of the EFS4. Table 7-21 lists the type and usage
of the interfaces.
Table 7-21 Optical interfaces of the EFS4
Interface

Interface Type

Usage

FE1

RJ-45

Transmits and receives the 10Base-T/100Base-TX

signals.

FE2

RJ-45

Transmits and receives the 10Base-T/100Base-TX

signals.

FE3

RJ-45

Transmits and receives the 10Base-T/100Base-TX

signals.

FE4

RJ-45

Transmits and receives the 10Base-T/100Base-TX

signals.

Table 7-22 lists the pins of the RJ-45 interface.

Table 7-22 Pins of the RJ-45 of the EFS4

7-44

Pin

Description

Transmitting positive

Transmitting negative

Receiving positive

Grounding

Grounding

Receiving negative

Grounding
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Pin

Description

Grounding

7 Data Processing Boards

7.6.5 Valid Slots

The EFS4 can be housed in any of slots 1213 in the OptiX OSN 1500A subrack. The EFS4 can
be housed in any of slots 1113 in the OptiX OSN 1500B subrack.

7.6.6 Board Configuration Reference

You can use the T2000 to set parameters for the EFS4.
You can use the T2000 to set the following parameters for the EFS4:
l

Working mode

Enabling of the LCAS

Maximum packet length

Mapping protocol

For details on the parameters, refer to F Board Configuration Reference.

7.6.7 Technical Specifications

The specifications of the EFS4 cover the mechanical specifications and power consumption.

Mechanical Specifications
The mechanical specifications of the EFS4 are as follows:
l

Board dimensions (mm): 262.05 (H) x 220 (D) x 25.4 (W)

Weight (kg): 1.0

Power Consumption
In the normal temperature (25), the maximum power consumption of the EFS4 is 30 W.

7.7 EGS2
This section describes the EGS2, a 2 x GE Ethernet processing board with Lanswitch, in terms
of the version, function, principle, front panel, configuration and specifications.
7.7.1 Version Description
The EGS2 has two functional versions, N1 and N2. The two versions have different functions
and features.
7.7.2 Function and Feature
The EGS2 supports Layer 2 switching, MPLS and broadcast.
7.7.3 Working Principle and Signal Flow
The EGS2 consists of the ethernet access module, network processor module, mapping module,
interface converting module, communication and control module and so on.
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7.7.4 Front Panel

On the front panel of the EGS2, there are indicators, interfaces and barcode.
7.7.5 Valid Slots
The EGS2 can be housed in any of slots 1213 in the OptiX OSN 1500A subrack. The EGS2
can be housed in any of slots 1113 in the OptiX OSN 1500B subrack.
7.7.6 Board Feature Code
The code behind the board name in the barcode is the board feature code. The board feature code
of the EGS2 indicates the optical interface type.
7.7.7 Board Configuration Reference
You can use the T2000 to set parameters for the EGS2.
7.7.8 Technical Specifications
The specifications of the EGS2 cover the optical interface specifications, mechanical
specifications and power consumption.

7.7.1 Version Description

The EGS2 has two functional versions, N1 and N2. The two versions have different functions
and features.
Table 7-23 lists the details on the versions of the EGS2 board.
Table 7-23 Version Description of the EGS2
Item

Description

Functional
version

The EGS2 has two versions, N1 and N2.

Difference

The maximum uplink bandwidth of the N1EGS2 is 1.25 Gbit/s. The

maximum uplink bandwidth of the N2EGS2 is 2.5 Gbit/s.
The number of the VCTRUNKs of the N1EGS2 is 24. The number of the
VCTRUNKs of the N2EGS2 is 48.
The encapsulation formats of the N1EGS2 are GFP, LAPS, and HDLC.
The encapsulation format of the N1EGS2 is GFP.
The N1EGS2 supports the MartinioP encapsulation of the MPLS. The
N2EGS2 does not support the MartinioP encapsulation.
The N2EGS2 supports the board version replacement function.

Replaceability

On certain conditions, the N2EGS2 can replace the N1EGS2. When the
N2EGS2 replaces the N1EGS2, the N1EGS2 should not be configured
with MartinioP or CoS of the MPLS.

7.7.2 Function and Feature

The EGS2 supports Layer 2 switching, MPLS and broadcast.
Table 7-24 lists the functions and features of the EGS2.

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Table 7-24 Functions and features of the EGS2

Function and
Feature

EGS2

Basic function

Processes 2 x GE services.

Specification of
the optical
interface

The optical interfaces are 1000Base-SX/LX/ZX Ethernet optical

interfaces.
The optical interfaces support the auto-negotiation, compliant with IEEE
802.3z. The optical interfaces use the hot-swappable optical module
SFP.
When multimode optical fiber is used, the maximum transmission
distance is 550 m. When single-mode optical fiber is used, the maximum
transmission distance is 10 km.
The optical modules can be used for different requirements for the
transmission distance, such as 40 km and 70 km.

Format of service
frames

Supports Ethernet II, IEEE 802.3, and IEEE 802.1q/p. Supports frames
with a length ranging from 64 bytes to 9600 bytes. Supports Jumbo
frames with a length less than 9600 bytes.

Max. uplink
bandwidth

The maximum uplink bandwidth of the N1EGS2 is 1.25 Gbit/s.

Number of
VCTRUNKs

The number of the VCTRUNKs of the N1EGS2 is 24.

Mapping
granularity

Supports VC-12, VC-3, VC-12-Xv (X63), and VC-3-Xv (X12).

Encapsulation
format

The encapsulation formats for the N1EGS2 are GFP, LAPS, and HDLC.

EPL

Supports transparent transmission based on port and Ethernet private

line services based on port+VLAN.

EVPL

Not supported by the N1EGS2.

The maximum uplink bandwidth of the N2EGS2 is 2.5 Gbit/s.

The number of the VCTRUNKs of the N2EGS2 is 48.

The encapsulation format for the N2EGS2 is GFP.

The N2EGS2 supports EVPL services that use the frame encapsulation
formats of MartinioE and stack VLAN.
EPLAN

Supports the Layer 2 convergence and point to multipoint convergence.

Supports the Layer 2 forwarding function and switching at the client and
SDH sides.
Supports the function of self-learning the source MAC address. The
length of the MAC address table is 16k. The aging time of the MAC
address can be set and queried.
Supports the configuration of the static MAC route.
Supports data isolation based on VB+VLAN.
Supports the creation, deletion and query of the VB. The maximum
number of the VBs is 2. The maximum number of logical ports for each
VB is 30.

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Function and
Feature

EGS2

EVPLAN

Not supported by the N1EGS2.

The N2EGS2 supports EVPL services that use the frame encapsulation
formats of MPLS MartinioE, MPLS MartinioP and stack VLAN. The
N2EGS2 does not support the encapsulation format of MPLS MartinioP.

MPLS

Not supported by the N1EGS2.

Supported by the N2EGS2.

VLAN

Compliant with IEEE 802.1q/p.

VLAN
convergence

Supported (4k VLAN).

RSTP

Not supported by the N1EGS2.

The N2EGS2 supports broadcast packet suppression and RSTP,
compliant with IEEE 802.1w.

Multicast (IGMP
Snooping)

Not supported by the N1EGS2.

CAR

Supported.

Supported by the N2EGS2.

The granularity is 64 kbit/s.

Service based
QoS flow
classification
LCAS

The N1EGS2 supports the port service, port+VLAN ID service, and port
+VLAN PRI service.
The N2EGS2 supports the port flow, port+VLAN ID flow, and port
+VLAN PRI flow.
Not supported by the N1EGS2.
The N2EGS2 supports LCAS, compliant with ITU-T G.7042.
Dynamically increases or decreases the bandwidth, and realizes the
protection function.

7-48

LPT

Supports the LPT function, which can be enabled or disabled.

Flow control
function

Supports the IEEE 802.3x flow control based on port.

Test frame

Receives and transmits Ethernet test frames.

Loopback
function

Supports inloop at the Ethernet port (PHY layer or MAC layer). Supports
inloop and outloop at the VC-3 level.

Ethernet
performance
monitoring

Supports Ethernet performance monitoring at the port level.

Alarm and
performance
event

Provides rich alarms and performance events for easy management and
maintenance of the equipment.

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7.7.3 Working Principle and Signal Flow

The EGS2 consists of the ethernet access module, network processor module, mapping module,
interface converting module, communication and control module and so on.
Figure 7-14 shows the block diagram for the functions of the EGS2.
Figure 7-14 Block diagram for the functions of the EGS2
E
N
C
P

Control
GE

Ethernet
access
module

Network
processor

Switch
fabric

Laser
shutdown

V
C
P

D
E
N
C
P

Data

Network processor module

Cross-connect unit

Interface
coversion
module
Cross-connect unit

Mapping module

LOS

Communication

Communication
and control module

Reference clock and frame header

+3.3 V
+1.5 V

Clock module

+1.8 V
+2.5 V

DC/DC
converter

DC/DC
converter

Fuse

SCC unit

-48 V/ -60 V
-48 V/ -60 V

Fuse

50
77 125 155
MHz MHz MHz MHz

ENCP: data encapsulation module

SCC unit

+3.3 V backup
power

DENCP: decapsulation module

VCP: virtual concatenation processing module

The function modules of ethernet switching boards are described below:

Ethernet Access Module

In the receive direction, the optical signals from Ethernet equipment, such as switch and router,
are converted into electrical signals. For the signals accessed from electrical interfaces, O/E
conversion is unnecessary. At PHY layer, the electrical signals are decoded and the ETH_LOS
alarms are tested. The electrical signals are converted from serial signals to parallel signals and
then sent to network processor.
In the transmit direction, the parallel signals are converted to serial signals. At the PHY layer,
signals are encoded and converted from electrical signals to optical signals.

Network Processor Module

The network processor module consists of network processor and switch fabric. The network
processor first performs MAC functions, which include code conversion, framing of Ethernet
packets, CRC check and Ethernet performance statistics.
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After the striped Ethernet frame enters the core of network processor, the flow is classified as
per service type and configuration requirements. The frame is encapsulated or decapsulated.
These packets formats are supported:
l

Multi-protocol label switching (MPLS)

L2MPLS VPN

Ethernet/ VLAN

In the receive direction, services are mapped and forwarded by adding Tunnel and VC double
labels as per service configuration. In the transmit direction, Tunnel or VC is extracted as per
the level (P or PE) of the equipment. Services are then routed or forwarded.
The network processor module:
l

Supports flow sense and flow classification

Supports uni-cast, multi-cast and broadcast of the flow

Provides data priority setting

Provides weighted fair queuing (WFQ)

Provides four classes of services (CoS)

Mapping Module
The mapping module consists of encapsulation and mapping.
In the upstream direction, this module first encapsulates Ethernet signals in LAPS or GFP format.
The concatenation is processed. The LCAS function is supported. Ethernet signals are then
converted into SDH signals.
In the downstream direction, SDH signals are demapped. The time delay of virtual concatenation
is compensated. After aligning, packets are decapsulated as per encapsulation format. The
decapsulated data are transmitted to the network processor module in packets.

Interface Conversion Module

The interface converting module mainly converts 622 Mbit/s low voltage differential signals
(LVDS) bus of SDH system into parallel bus. Through this module, the high-rate backplane
interface connects to low-rate interface chip of the transmitting system.

Communication and Control Module

The communication and control module consists of CPU, register, oscillator, Ethernet port and
HDLC controller. This module connects to external circuits through bus. The communication
and control module:
l

Manages and configures other modules of the boards.

Performs inter-board communication through internal Ethernet interface.

The control module also contains basic logic units. This module enjoys the following functions:

7-50

Writes and reads register

Provides interface for CPU

Checks, selects clock

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Performs phase discrimination and frequency division to the clock

Checks the in-service state of the cross-connect, the SCC and the line boards

Controls the shutting down of the optical module

Processes communication

Control indicators

Clock Unit
This clock unit tracing the system reference clock and generates the required working clocks for
each chip. The frequencies of these clocks are: 50 MHz, 77MHz, 125 MHz and 155 MHz.

DC/DC Converter Module

Through the DC/DC module, the power converting unit generates required voltages for each
chip on the board. The following DC voltages are provided: +1.5 V, +1.8 V, +2.5 V and +3.3
V. In addition, this unit also provides protection for the board +3.3 V power supply.

7.7.4 Front Panel

On the front panel of the EGS2, there are indicators, interfaces and barcode.

Appearance of the Front Panel

Figure 7-15 shows the appearance of the front panel of the EGS2.

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Figure 7-15 Front panel of the EGS2

EGS2
STAT
ACT
PROG
SRV
LINK1
ACT1
LINK2
ACT2

CLASS 1
LASER
PRODUCT

OUT1 IN1
OUT2 IN2
EGS2

Indicators
The following indicators are present on the front panel of the board:
l

Board hardware state indicator (STAT), which is green or red when lit.

Service activating state indicator (ACT), which is green when lit.

Board software state indicator (PROG), which is green or red when lit.

Service alarm indicator (SRV), which is red, green or yellow when lit.

Connection status indicator (LINK), which is green when lit.

Data receiving and transmission indicator (ACT), which is orange when lit.

For indication of these indicators, see A Equipment and Board Alarm Indicators.

Interfaces
There are two GE interfaces on the front panel of the EGS2. Table 7-25 lists the type and usage
of the interfaces.
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Table 7-25 Optical interfaces of the EGS2

Interface

Interface Type

Usage

OUT1/IN1

LC (pluggable)

Transmits and receives the 1000Base-SX/LX/ZX

signals.

OUT2/IN2

LC (pluggable)

Transmits and receives the 1000Base-SX/LX/ZX

signals.

7.7.5 Valid Slots

The EGS2 can be housed in any of slots 1213 in the OptiX OSN 1500A subrack. The EGS2
can be housed in any of slots 1113 in the OptiX OSN 1500B subrack.

7.7.6 Board Feature Code

The code behind the board name in the barcode is the board feature code. The board feature code
of the EGS2 indicates the optical interface type.
Table 7-26 lists the relation between the board feature code and optical interface type for the
EGS2.
Table 7-26 Relation between the board feature code and the optical interface type
Board Barcode

Feature Code

Optical Interface Type

SSN2EGS210

10

1000Base-SX (0.55 km)

SSN2EGS211

11

1000Base-LX (10 km)

SSN2EGS212

12

1000Base-ZX (40 km)

SSN2EGS213

13

1000Base-ZX (70 km)

7.7.7 Board Configuration Reference

You can use the T2000 to set parameters for the EGS2.
You can use the T2000 to set the following parameters for the EGS2:
l

Working mode

Enabling of the LCAS

Maximum packet length

Mapping protocol

For details on the parameters, refer to F Board Configuration Reference.

7.7.8 Technical Specifications

The specifications of the EGS2 cover the optical interface specifications, mechanical
specifications and power consumption.
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Optical Interface Specifications

Table 7-27 lists the specifications of the interfaces of the EGS2.
Table 7-27 Specifications of the optical interfaces of the EGS2
Item

Specification

Optical interface
type

1000Base-ZX
(70 km)

1000Base-ZX
(40 km)

1000Base-SX
(10 km)

1000Base-LX
(0.55 km)

Optical source
type

MLM

MLM

MLM

MLM

Launched optical
power (dBm)

4 to +2

2 to +5

9 to 3

9.5 to 0

Central
wavelength (nm)

1480 to 1580

1270 to 1355

1270 to 1355

770 to 860

Overload optical
power (dBm)

Receiver
sensitivity (dBm)

22

23

19

17

Extinction ratio
(dB)

Laser Safety Class

The safety class of the laser on the board is CLASS 1.
The maximum launched optical power of the optical interfaces is lower than 10 dBm (10 mW).

Mechanical Specifications
The mechanical specifications of the EGS2 are as follows:
l

Board dimensions (mm): 262.05 (H) x 220 (D) x 25.4 (W)

Weight (kg): 1.0

Power Consumption
In the normal temperature (25), the maximum power consumption of the EGS2 is 43 W.

7.8 EMS4
This section describes the EMS4, a 4 x GE and 16 x FE Ethernet transparent transmission and
convergence board, in terms of the version, function, principle, front panel, configuration and
specifications.
7.8.1 Version Description
The functional version of the EMS4 board is N1.
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7.8.2 Function and Feature

The EMS4 supports Layer 2 switching, link convergence, and multicast.
7.8.3 Working Principle and Signal Flow
The EMS4 consists of the ethernet access module, mapping module, interface conversion module
and so on.
7.8.4 Front Panel
On the front panel of the EMS4, there are indicators, interfaces and barcode.
7.8.5 Valid Slots
The EMS4 can be housed in any of slots 1213 in the OptiX OSN 1500A subrack. Without the
interface board, the EMS4 can be housed in any of slots 1113 in the OptiX OSN 1500B subrack.
With the interface board, the EMS4 can be housed in any of slots 1213 in the OptiX OSN 1500B
subrack.
7.8.6 Board Feature Code
The code behind the board name in the barcode is the board feature code. The board feature code
of the EMS4 indicates the optical interface type.
7.8.7 Board Protection
The EMS4 supports the board protection switching (BPS) and port protection switching (PPS)
protection.
7.8.8 Board Configuration Reference
You can use the T2000 to set parameters for the EMS4.
7.8.9 Technical Specifications
The specifications of the EMS4 cover the optical interface specifications, laser safety class,
mechanical specifications and power consumption.

7.8.1 Version Description

The functional version of the EMS4 board is N1.

7.8.2 Function and Feature

The EMS4 supports Layer 2 switching, link convergence, and multicast.
Table 7-28 lists the functions and features of the EMS4.
Table 7-28 Functions and features of the EMS4
Function and
Feature

EMS4

Basic function

Accesses and processes 4 x GE services, and processes 16 x FE

services.

Used with the

interface board

Accesses 16 x FE signals at the electrical interface when used with

the ETF8.
Accesses 16 x FE signals at the optical interface when used with the
EFF8.
Accesses 8 x FE signals at the electrical interface and 8 x FE signals
at the optical interface when used with the ETF8 and EFF8.

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Function and
Feature

EMS4

Specification of the
optical interface

The optical interfaces are 1000Base-SX/LX/ZX Ethernet optical

interfaces. Supports the auto-negotiation, compliant with IEEE
802.3z.
The optical interfaces use the hot-swappable optical module SFP.
When multimode optical fiber is used, the maximum transmission
distance is 550 m. When single-mode optical fiber is used, the
maximum transmission distance is 10 km.
The optical modules can be used for different requirements for the
transmission distance, such as 40 km and 70 km.
Supports 10Base-T/100Base-TX signals when used with the ETF8.
Supports 100Base-FX signals when used with the EFF8.
The optical interfaces are compliant with IEEE 802.3u.

Format of service
frames

Supports Ethernet II, IEEE 802.3, IEEE 802.1q TAG, and IEEE
802.1p TAG.
Supports frames with a length ranging from 64 bytes to 9216 bytes.
Supports Jumbo frames with a length less than 9216 bytes.

Max. uplink
bandwidth

2.5 Gbit/s.

Mapping granularity

Virtual concatenation: VC-12, VC-3, VC-4, VC-12-Xv (X64),

VC-3-Xv (X24), and VC-4-Xv (X8).

VCG

A maximum of 64.

Encapsulation format

Supports GFP-F, LAPS, and HDLG.

EPL

Supports transparent transmission based on port. Supports 42 x

bidirectional services.

EVPL

Supports EVPL services based on port+VLAN. Supports a

maximum of 8000 links.
Supports EVPL services based on QinQ. Supports service
forwarding based on port.

EPLAN

Supports the Layer 2 forwarding function and switching at the client

and SDH sides.
Supports 1k MAC switching or 4K VLAN MAC switching.
Supports the function of self-learning the source MAC address.
The length of the MAC address table is 128k. The aging time of the
MAC address can be set and queried.
The configuration of static MAC routes is supported.
Supports data isolation based on VB+VLAN.
Supports the creation, deletion and query of VB. The maximum
number of VBs is two.

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Function and
Feature

EMS4

VLAN

Supports VLAN and QinQ, the addition, deletion and switching of

VLAN labels, compliant with IEEE 802.1q/p.

RSTP

Supports broadcast packet suppression and RSTP, compliant with

IEEE 802.1w.

Multicast(IGMPSnooping)

Supported.

ETH-OAM

Supports CC for the multicast and LB test for the unicast.

Test frame

Supported.

Service mirroring

Not supported.

Link convergence

Supports manual link convergence and static link convergence.

VLAN convergence

Supported (4095 VLAN).

Protection

Supports the 1+1 hot backup for the board and the PPS protection.

CAR

Supported.
The granularity is 64 kbit/s.

Flow classification

Supports the port flow and port+VLAN ID flow.

LCAS

Dynamically increases or decreases the bandwidth, and realizes the

protection function, compliant with ITU-T G.7042.

LPT

Supported.

Flow control function

Supports the IEEE 802.3x flow control based on port.

Loopback function

Supports inloop at the Ethernet port (PHY layer) and outloop at the
SDH side.

Ethernet performance
monitoring

Supports Ethernet performance monitoring RMON at the port level

and VCTRUNK.

Alarm and
performance event

Provides rich alarms and performance events for easy management

and maintenance of the equipment.

7.8.3 Working Principle and Signal Flow

The EMS4 consists of the ethernet access module, mapping module, interface conversion module
and so on.
Figure 7-16 shows the block diagram for the functions of the EMS4.

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Figure 7-16 Block diagram for the functions of the EMS4

E
N
C
P

Control
GE/FE Ethernet

access
module

Network
processor

Switch
fabric

Laser
shutdown

V
C
P

D
E
N
C
P

Data

Network processor module

Cross-connect unit

Interface
coversion
module
Cross-connect unit

Mapping module

LOS

Communication

Communication
and control module

Reference clock and frame header

+3.3 V
+1.5 V

Clock module

+1.8 V
+2.5 V

DC/DC
converter

DC/DC
converter

Fuse

SCC unit
SCC unit

-48 V/ -60 V
-48 V/ -60 V

77 125 155
50
MHz MHz MHz MHz

ENCP: data encapsulation module

DENCP: decapsulation module

VCP: virtual concatenation processing module

In the Transmit Direction

The cross-connect unit transmits the VC-4/VC-3/VC-12 or the virtual concatenation signals to
the EGS4 through the backplane. The interface module transmits the signals to the encapsulation
and mapping module. The encapsulation and mapping module then compensates for the time
delay of the virtual concatenation services, aligns frames, demaps and decapsulates the frames,
strips the data packets, and transmits the data packets to the service processing module. Finally,
the service processing module converges the data and transmits the data through the ethernet
physical interface.

In the Receive Direction

The interface module accesses the signals from external Ethernet device, such as the Ethernet
switch and router. The interface module then decodes the signals and converts the series signals
into parallel signals. The service processing module then aligns the frames, strips the preamble
code, terminates the CRC code and performs the Ethernet statistics for the Ethernet performance.
In addition, the service processing module classifies the flow (Ethernet or VLAN packet formats)
according to the service type and configuration.
If the switch is not required on the local, the data services are forwarded to other local ports
according to the configuration. If the data services are to be transmitted to the upstream SDH
line, the encapsulation module encapsulates the Ethernet frames in the GFP-F, LAPS or HDLC
formats. Finally, the encapsulation module transmits the frames to the mapping module, which
maps frames into VC-4/VC-3/VC-12, concatenated frames or a single VC-3 concatenated frame.
The interface module then transmits the frames to the cross-connect unit.

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Ethernet Access Module

In the receive direction, the optical signals from Ethernet equipment, such as switch and router,
are converted into electrical signals. For the signals accessed from electrical interfaces, O/E
conversion is unnecessary. At PHY layer, the electrical signals are decoded and the ETH_LOS
alarms are tested. The electrical signals are converted from serial signals to parallel signals and
then sent to network processor.
In the transmit direction, the parallel signals are converted to serial signals. At the PHY layer,
signals are encoded and converted from electrical signals to optical signals.

Network Processor Module

The network processor module consists of network processor and switch fabric. The network
processor first performs MAC functions, which include code conversion, framing of Ethernet
packets, CRC check and Ethernet performance statistics.
After the striped Ethernet frame enters the core of network processor, the flow is classified as
per service type and configuration requirements. The frame is encapsulated or decapsulated.
These packets formats are supported:
l

Ethernet/ VLAN

The network processor module:

l

Supports flow sense and flow classification

Supports uni-cast, multi-cast and broadcast of the flow

Provides data priority setting

Provides weighted fair queuing (WFQ)

Provides four classes of services (CoS)

Mapping Module
The mapping module consists of encapsulation and mapping.
In the upstream direction, this module first encapsulates Ethernet signals in LAPS, GFP or HDLC
format. The concatenation is processed. The LCAS function is supported. Ethernet signals are
then converted into SDH signals.
In the downstream direction, SDH signals are demapped. The time delay of virtual concatenation
is compensated. After aligning, packets are decapsulated as per encapsulation format. The
decapsulated data are transmitted to the network processor module in packets.

Interface Conversion Module

The interface converting module mainly converts 622 Mbit/s low voltage differential signals
(LVDS) bus of SDH system into parallel bus. Through this module, the high-rate backplane
interface connects to low-rate interface chip of the transmitting system.

Communication and Control Module

The communication and control module consists of CPU, register, oscillator, Ethernet port and
HDLC controller. This module connects to external circuits through bus. The communication
and control module:
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l

Manages and configures other modules of the boards.

Performs inter-board communication through internal Ethernet interface.

The control module also contains basic logic units. This module enjoys the following functions:
l

Writes and reads register

Provides interface for CPU

Checks, selects clock

Performs phase discrimination and frequency division to the clock

Checks the in-service state of the cross-connect, the SCC and the line boards

Controls the shutting down of the optical module

Processes communication

Control indicators

Clock Unit
This clock unit tracing the system reference clock and generates the required working clocks for
each chip. The frequencies of these clocks are: 50 MHz, 77MHz, 125 MHz and 155 MHz.

DC/DC Converter Module

Through the DC/DC module, the power converting unit generates required voltages for each
chip on the board. The following DC voltages are provided: +1.5 V, +1.8 V, +2.5 V and +3.3
V.

7.8.4 Front Panel

On the front panel of the EMS4, there are indicators, interfaces and barcode.

Appearance of the Front Panel

Figure 7-17 shows the appearance of the front panel of the EMS4.

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Figure 7-17 Front panel of the EMS4

EMS4
STAT
ACT
PROG
SRV

CLASS 1
LASER
PRODUCT

OUT1 IN1
OUT2 IN2
OUT3 IN3
OUT4 IN4
LINK

ACT

EMS4

Indicators
The following indicators are present on the front panel of the board:
l

Board hardware state indicator (STAT), which is green or red when lit.

Service activating state indicator (ACT), which is green when lit.

Board software state indicator (PROG), which is green or red when lit.

Service alarm indicator (SRV), which is red, green or yellow when lit.

Connection status indicator (LINK), which is green when lit.

Data receiving and transmission indicator (ACT), which is orange when lit.

For indication of these indicators, see A Equipment and Board Alarm Indicators.

Interfaces
There are four pairs of optical interfaces on the front panel of the EMS4. Table 7-29 lists the
type and usage of the optical interfaces.
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Table 7-29 Optical interfaces of the EMS4

Interface

Interface Type

Usage

OUT1/IN1

LC (pluggable)

Transmits and receives the 1000Base-SX/LX/ZX

signals.

OUT2/IN2

LC (pluggable)

Transmits and receives the 1000Base-SX/LX/ZX

signals.

OUT3/IN3

LC (pluggable)

Transmits and receives the 1000Base-SX/LX/ZX

signals.

OUT4/IN4

LC (pluggable)

Transmits and receives the 1000Base-SX/LX/ZX

signals.

7.8.5 Valid Slots

The EMS4 can be housed in any of slots 1213 in the OptiX OSN 1500A subrack. Without the
interface board, the EMS4 can be housed in any of slots 1113 in the OptiX OSN 1500B subrack.
With the interface board, the EMS4 can be housed in any of slots 1213 in the OptiX OSN 1500B
subrack.
The EMS4 can be used with the ETF8 and EFF8.
Table 7-30 and Table 7-31 list the valid slots for the EMS4 and corresponding slots for the
ETF8 and EFF8.
Table 7-30 Valid slots for the EMS4 and corresponding slots for the ETF8 and EFF8 in the
OptiX OSN 1500A subrack
Valid Slot for the EMS4

Corresponding Slot for the ETF8 and EFF8

Slot 12

Without the interface board

Slot 13

Without the interface board

Table 7-31 Valid slots for the EMS4 and corresponding slots for the ETF8 and EFF8 in the
OptiX OSN 1500B subrack
Valid Slot for the EMS4

Corresponding Slot for the ETF8 and EFF8

Slot 11

Without the interface board

Slot 12

Slots 14 and 15

Slot 13

Slots 16 and 17

7.8.6 Board Feature Code

The code behind the board name in the barcode is the board feature code. The board feature code
of the EMS4 indicates the optical interface type.
Table 7-32 lists the relation between the board feature code and optical interface type for the
EMS4.
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Table 7-32 Relation between the board feature code and the optical interface type
Board Barcode

Feature Code

Optical Interface Type

SSN1EMS410

10

1000Base-LX (0.55 km)

SSN1EMS411

11

1000Base-SX (10 km)

SSN1EMS412

12

1000Base-ZX (40 km)

SSN1EMS413

13

1000Base-ZX (70 km)

7.8.7 Board Protection

The EMS4 supports the board protection switching (BPS) and port protection switching (PPS)
protection.

Protection Principle
When the BPS protection is performed to the EMS4, the GE and FE ports use the single-fed
dual-selective scheme to get protected. The EMS4 has four four GE ports and 16 FE ports, which
may be connected to many communication devices. Normally, the active board is working and
services are transmitted in the two directions of the active link. On the backup link, the EMS4
disables the transmission of all ports. In this case, the ports of opposite board are in the Linkdown
state. At the same time, the opposite board enables the transmission and does not transmit
services. In this way, the receive ports of the backup EMS4 are not in the Linkdown state. The
solid lines in Figure 7-18 show how the EMS4 normally works.
Figure 7-18 Normal working of the EMS4

No.1

Active
communication
equipment

Active
EMS4

Standby
communication
equipment

No.2

No.3

Active
communication
equipment

XCS

B
Standby
communication
equipment

No.1
No.2

Standby
EMS4

No.3

Active
communication
equipment
Standby
communication
equipment

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l

BPS Protection

For the BPS protection, when the active board detects the Linkdown fault of any link or any
board fault, the cross-connect board switches all services to the standby board. In this way,
services are protected. As the solid lines shown in Figure 7-19. The services numbered 1, 2 and
3 are all switched to the standby EMS4 and corresponding communication equipment.
Figure 7-19 Principle of the BPS protection for the EMS4

No.1

Active
EMS4

Active
communication
equipment
Standby
communication
equipment

No.2

No.3

Active
communication
equipment

XCS

B
Standby
communication
equipment

No.1
No.2

Standby
EMS4

No.3

Active
communication
equipment
Standby
communication
equipment

PPS Protection

For the PPS protection, when the active board detects the Linkdown fault of any link or any
board fault, the cross-connect board switches all services to the standby board. In this way,
services are protected. The solid lines in Figure 7-20 show how the PPS protection is performed.
Only the service numbered 1 is switched to the standby EMS4 and the standby communication
equipment.

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Figure 7-20 Principle of the PPS protection for the EMS4

No.1

Active
communication
equipment

Active
EMS4

Standby
communication
equipment

No.2

No.3
Active
communication
equipment

XCS

B
Standby
communication
equipment

No.1
No.2

Standby
EMS4

No.3

Active
communication
equipment

Standby
communication
equipment

The conditions that trigger the protection for the EMS4 are as follows:
l

Fault at at the PHY layer of the MAC port, also Linkdown

Fault in key board hardware units, such as the power supply module and the optical module

WARNING
When the board-level protection is performed, FE ports only support the 100M full duplex mode
and GE ports support the auto-negotiation and 1000M full duplex mode.

Board Configuration
Two EMS4 boards should be configured for the protection. One EMS4 is the active board and
the other is the standby board. For the protection, the access capacity of the slot for the standby
board must be larger than that of the slot for the active board.

7.8.8 Board Configuration Reference

You can use the T2000 to set parameters for the EMS4.
You can use the T2000 to set the following parameters for the EMS4:
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l

Working mode

Enabling of the LCAS

Maximum packet length

Mapping protocol

For details on the parameters, refer to F Board Configuration Reference.

7.8.9 Technical Specifications

The specifications of the EMS4 cover the optical interface specifications, laser safety class,
mechanical specifications and power consumption.

Optical Interface Specifications

Table 7-33 lists the specifications of the interfaces of the EMS4.
Table 7-33 Specifications of the optical interfaces of the EMS4
Item

Specification

Optical interface
type

1000Base-ZX
(70 km)

1000Base-ZX
(40 km)

1000Base-SX
(10 km)

1000Base-LX
(0.55 km)

Optical source
type

MLM

MLM

MLM

MLM

Launched optical
power (dBm)

4 to +2

2 to +5

9 to 3

9.5 to 0

Central
wavelength (nm)

1480 to 1580

1270 to 1355

1270 to 1355

770 to 860

Overload optical
power (dBm)

Receiver
sensitivity (dBm)

22

23

19

17

Extinction ratio
(dB)

Laser Safety Class

The safety class of the laser on the board is CLASS 1.
The maximum launched optical power of the optical interfaces is lower than 10 dBm (10 mW).

Mechanical Specifications
The mechanical specifications of the EMS4 are as follows:

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Board dimensions (mm): 262.05 (H) x 220 (D) x 25.4 (W)

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Power Consumption
In the normal temperature (25), the maximum power consumption of the EMS4 is 65 W if
the EMS4 is not used with an interface board.
In the normal temperature (25), the maximum power consumption of the EMS4 is 75 W if
the EMS4 is used with an interface board.

7.9 EGS4
This section describes the EGS4, a 4 x GE Ethernet convergence board, in terms of the version,
function, principle, front panel, configuration and specifications.
7.9.1 Version Description
The functional version of the EGS4 board is N1.
7.9.2 Function and Feature
The EGS4 supports Layer 2 switching, MPLS and broadcast.
7.9.3 Working Principle and Signal Flow
The EGS4 consists of the interface module, service processing module, encapsulation and
mapping module, interface converting module, control and communication module and the
power supply module.
7.9.4 Front Panel
On the front panel of the EGS4, there are indicators, interfaces and barcode.
7.9.5 Valid Slots
The EGS4 can be housed in any of slots 1213 in the OptiX OSN 1500A subrack. The EGS4
can be housed in any of slots 1113 in the OptiX OSN 1500B subrack.
7.9.6 Board Feature Code
The code behind the board name in the barcode is the board feature code. The board feature code
of the EGS4 indicates the optical interface type.
7.9.7 Board Protection
The EGS4 supports the board protection switching (BPS) and port protection switching (PPS)
protection.
7.9.8 Board Configuration Reference
You can use the T2000 to set parameters for the EGS4.
7.9.9 Technical Specifications
The specifications of the EGS4 cover the optical interface specifications, laser safety class,
mechanical specifications and power consumption.

7.9.1 Version Description

The functional version of the EGS4 board is N1.

7.9.2 Function and Feature

The EGS4 supports Layer 2 switching, MPLS and broadcast.
Table 7-34 lists the functions and features of the EGS4.
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Table 7-34 Functions and features of the EGS4

Function and
Feature

EGS4

Basic function

Accesses and processes 4 x GE services.

Specification of the
optical interface

The optical interfaces are 1000Base-SX/LX/ZX Ethernet optical

interfaces.
The optical interfaces support the auto-negotiation, compliant with
IEEE 802.3z. The optical interfaces use the hot-swappable optical
module SFP.
When multimode optical fiber is used, the maximum transmission
distance is 550 m. When single-mode optical fiber is used, the
maximum transmission distance is 10 km.
The optical modules can be used for different requirements for the
transmission distance, such as 40 km and 70 km.

Format of service
frames

Supports Ethernet II, IEEE 802.3, IEEE 802.1q TAG, and IEEE
802.1p TAG.
Supports frames with a length ranging from 64 bytes to 9216 bytes.
Supports Jumbo frames with a length less than 9216 bytes.

Max. uplink
bandwidth

2.5 Gbit/s.

Mapping granularity

Virtual concatenation: VC-12, VC-3, VC-4, VC-12-Xv (X64),

VC-3-Xv (X24), and VC-4-Xv (X8).

VCG

64 to the maximum.

Encapsulation format

Supports GFP-F, LAPS, and HDLG.

EPL

Supports transparent transmission based on port.

EVPL

Supports EVPL services based on port+VLAN. Supports a maximum

of 8000 links.
Supports EVPL services based on QinQ. Supports service forwarding
based on port.

EPLAN

Supports the Layer 2 forwarding function and switching at the client

and SDH sides.
Supports 1k MAC switching or 4k VLAN MAC switching.
Supports the function of self-learning the source MAC address. The
length of the MAC address table is 128k. The aging time of the MAC
address can be set and queried. The configuration of static MAC
routes is supported.
Supports data isolation based on VB+VLAN.
Supports the creation, deletion and query of VB. The maximum
number of VBs is two.

VLAN

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Supports VLAN and QinQ, the addition, deletion and switching of

VLAN labels, compliant with IEEE 802.1q/p.

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Function and
Feature

EGS4

RSTP

Supports broadcast packet suppression and RSTP, compliant with

IEEE 802.1w.

Multicast(IGMPSnooping)

Supported.

ETH-OAM

Supports CC for the multicast and LB test for the unicast.

Test frame

Supported.

Service mirroring

Not supported.

Link convergence

Supports manual link convergence and static link convergence.

VLAN convergence

Supported (4095 VLAN).

Protection

Supports the 1+1 hot backup for the board and the PPS protection.

CAR

Supported.
The granularity is 64 kbit/s.

Flow classification

Supports the port flow and port+VLAN ID flow.

LCAS

Dynamically increases or decreases the bandwidth, and realizes the

protection function, compliant with ITU-T G.7042.

LPT

Supported.

Flow control
function

Supports the IEEE 802.3x flow control based on port.

Loopback function

Supports inloop at the Ethernet port (PHY layer).

Ethernet
performance
monitoring

Supports Ethernet performance monitoring RMON at the port level

and VCTRUNK.

Alarm and
performance event

Provides rich alarms and performance events for easy management

and maintenance of the equipment.

7.9.3 Working Principle and Signal Flow

The EGS4 consists of the interface module, service processing module, encapsulation and
mapping module, interface converting module, control and communication module and the
power supply module.
Figure 7-21 shows the block diagram for the functions of the EGS4.

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Figure 7-21 Block diagram for the functions of the EGS4

E
N
C
P

Control
GE

Ethernet
access
module

Network
processor

Switch
fabric

Laser
shutdown

V
C
P

D
E
N
C
P

Data

Network processor module

Cross-connect unit

Interface
coversion
module
Cross-connect unit

Mapping module

LOS

Communication

Communication
and control module

Reference clock and frame header

+3.3 V
+1.5 V

Clock module

+1.8 V
+2.5 V

DC/DC
converter

DC/DC
converter

Fuse

SCC unit
SCC unit

-48 V/ -60 V
-48 V/ -60 V

50
77 125 155
MHz MHz MHz MHz

In the Transmit Direction

The cross-connect unit transmits the VC-4/VC-3/VC-12 or the virtual concatenation signals to
the EGS4 through the backplane. The interface module transmits the signals to the encapsulation
and mapping module. The encapsulation and mapping module then compensates for the time
delay of the virtual concatenation services, aligns frames, demaps and decapsulates the frames,
strips the data packets, and transmits the data packets to the service processing module. Finally,
the service processing module converges the data and transmits the data through the ethernet
physical interface.

In the Receive Direction

The interface module accesses the 1000Base-SX/LX/ZX signals from external Ethernet device,
such as the Ethernet switch and router. The interface module then decodes the signals and
converts the series signals into parallel signals. The service processing module then aligns the
frames, strips the preamble code, terminates the CRC code and performs the Ethernet statistics
for the Ethernet performance. In addition, the service processing module classifies the flow
(Ethernet or VLAN packet formats) according to the service type and configuration.
If the switch is not required on the local, the data services are forwarded to other local ports
according to the configuration. If the data services are to be transmitted to the upstream SDH
line, the encapsulation module encapsulates the Ethernet frames in the GFP-F, LAPS or HDLC
formats. Finally, the encapsulation module transmits the frames to the mapping module, which
maps frames into VC-4/VC-3/VC-12 or concatenated frames. The interface module then
transmits the frames to the cross-connect unit.

Ethernet Access Module

In the receive direction, the optical signals from Ethernet equipment, such as switch and router,
are converted into electrical signals. For the signals accessed from electrical interfaces, O/E
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conversion is unnecessary. At PHY layer, the electrical signals are decoded and the ETH_LOS
alarms are tested. The electrical signals are converted from serial signals to parallel signals and
then sent to network processor.
In the transmit direction, the parallel signals are converted to serial signals. At the PHY layer,
signals are encoded and converted from electrical signals to optical signals.

Network Processor Module

The network processor module consists of network processor and switch fabric. The network
processor first performs MAC functions, which include code conversion, framing of Ethernet
packets, CRC check and Ethernet performance statistics.
After the striped Ethernet frame enters the core of network processor, the flow is classified as
per service type and configuration requirements. The frame is encapsulated or decapsulated.
These packets formats are supported:
l

Ethernet/ VLAN

The network processor module:

l

Supports flow sense and flow classification

Supports uni-cast, multi-cast and broadcast of the flow

Provides data priority setting

Provides weighted fair queuing (WFQ)

Provides four classes of services (CoS)

Mapping Module
The mapping module consists of encapsulation and mapping.
In the upstream direction, this module first encapsulates Ethernet signals in LAPS, GFP or HDLC
format. The concatenation is processed. The LCAS function is supported. Ethernet signals are
then converted into SDH signals.
In the downstream direction, SDH signals are demapped. The time delay of virtual concatenation
is compensated. After aligning, packets are decapsulated as per encapsulation format. The
decapsulated data are transmitted to the network processor module in packets.

Interface Conversion Module

The interface converting module mainly converts 622 Mbit/s low voltage differential signals
(LVDS) bus of SDH system into parallel bus. Through this module, the high-rate backplane
interface connects to low-rate interface chip of the transmitting system.

Communication and Control Module

The communication and control module consists of CPU, register, oscillator, Ethernet port and
HDLC controller. This module connects to external circuits through bus. The communication
and control module:
l

Manages and configures other modules of the boards.

Performs inter-board communication through internal Ethernet interface.

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The control module also contains basic logic units. This module enjoys the following functions:
l

Writes and reads register

Provides interface for CPU

Checks, selects clock

Performs phase discrimination and frequency division to the clock

Checks the in-service state of the cross-connect, the SCC and the line boards

Controls the shutting down of the optical module

Processes communication

Control indicators

Clock Unit
This clock unit tracing the system reference clock and generates the required working clocks for
each chip. The frequencies of these clocks are: 50 MHz, 77MHz, 125 MHz and 155 MHz.

DC/DC Converter Module

Through the DC/DC module, the power converting unit generates required voltages for each
chip on the board. The following DC voltages are provided: +1.5 V, +1.8 V, +2.5 V and +3.3
V.

7.9.4 Front Panel

On the front panel of the EGS4, there are indicators, interfaces and barcode.

Appearance of the Front Panel

Figure 7-22 shows the appearance of the front panel of the EGS4.

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Figure 7-22 Front panel of the EGS4

EGS4
STAT
ACT
PROG
SRV

CLASS 1
LASER
PRODUCT

OUT1 IN1
OUT2 IN2
OUT3 IN3
OUT4 IN4
LINK

ACT

EGS4

Indicators
The following indicators are present on the front panel of the board:
l

Board hardware state indicator (STAT), which is green or red when lit.

Service activating state indicator (ACT), which is green when lit.

Board software state indicator (PROG), which is green or red when lit.

Service alarm indicator (SRV), which is red, green or yellow when lit.

Connection status indicator (LINK), which is green when lit.

Data receiving and transmission indicator (ACT), which is orange when lit.

For indication of these indicators, see A Equipment and Board Alarm Indicators.

Interfaces
There are four pairs of optical interfaces on the front panel of the EGS4. Table 7-35 lists the
type and usage of the optical interfaces.

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Table 7-35 Optical interfaces of the EGS4

Interface

Interface Type

Usage

OUT1/IN1

LC (pluggable)

Transmits and receives the 1000Base-SX/LX/ZX

signals.

OUT2/IN2

LC (pluggable)

Transmits and receives the 1000Base-SX/LX/ZX

signals.

OUT3/IN3

LC (pluggable)

Transmits and receives the 1000Base-SX/LX/ZX

signals.

OUT4/IN4

LC (pluggable)

Transmits and receives the 1000Base-SX/LX/ZX

signals.

7.9.5 Valid Slots

The EGS4 can be housed in any of slots 1213 in the OptiX OSN 1500A subrack. The EGS4
can be housed in any of slots 1113 in the OptiX OSN 1500B subrack.

7.9.6 Board Feature Code

The code behind the board name in the barcode is the board feature code. The board feature code
of the EGS4 indicates the optical interface type.
Table 7-36 lists the relation between the board feature code and optical interface type for the
EGS4.
Table 7-36 Relation between the board feature code and the optical interface type
Board Barcode

Feature Code

Optical Interface Type

SSN1EGS410

10

1000Base-SX (0.55 km)

SSN1EGS411

11

1000Base-LX (10 km)

SSN1EGS412

12

1000Base-ZX (40 km)

SSN1EGS413

13

1000Base-ZX (70 km)

7.9.7 Board Protection

The EGS4 supports the board protection switching (BPS) and port protection switching (PPS)
protection.

Protection Principle
When the BPS protection is performed to the EGS4, the GE and FE ports use the single-fed dualselective scheme to get protected. The EGS4 has four four GE ports and 16 FE ports, which may
be connected to many communication devices. Normally, the active board is working and
services are transmitted in the two directions of the active link. On the standby link, the EGS4
disables the transmission of all ports. In this case, the ports of the opposite board are in the
Linkdown state. At the same time, the opposite board enables the transmission and does not
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transmit services. In this way, the receive ports of the standby EGS4 are not in the Linkdown
state. The solid lines in Figure 7-23 show how the EGS4 normally works.
Figure 7-23 Normal working of the EGS4

No.1

Active
EGS4

Active
communication
equipment
Standby
communication
equipment

No.2

No.3

Active
communication
equipment

XCS

B
Standby
communication
equipment

No.1
No.2

Standby
EGS4

No.3

Active
communication
equipment
Standby
communication
equipment

BPS Protection

For the BPS protection, when the active board detects the Linkdown fault of any link or any
board fault, the cross-connect board switches all services to the standby board. In this way,
services are protected. The lines in Figure 7-24 show how the BPS protection is performed. The
services numbered 1, 2 and 3 are all switched to the standby EGS4 and corresponding
communication equipment.

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Figure 7-24 Principle of the BPS protection for the EGS4

No.1

Active
EGS4

Active
communication
equipment
Standby
communication
equipment

No.2

No.3

Active
communication
equipment

XCS

B
Standby
communication
equipment

No.1
No.2

Standby
EGS4

No.3

Active
communication
equipment
Standby
communication
equipment

PPS Protection

For the PPS protection, when the active board detects the Linkdown fault of any link or any
board fault, the cross-connect board switches all services to the standby board. In this way,
services are protected. The solid lines in Figure 7-25 show how the PPS protection is performed.
Only the service numbered 1 is switched to the standby EGS4 and the standby communication
equipment.

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Figure 7-25 Principle of the PPS protection for the EGS4

No.1

Active
communication
equipment

Active
EGS4

Standby
communication
equipment

No.2

No.3
Active
communication
equipment

XCS

B
Standby
communication
equipment

No.1
No.2

Standby
EGS4

No.3

Active
communication
equipment

Standby
communication
equipment

The conditions that trigger the protection for the EGS4 are as follows:
l

Fault at at the PHY layer of the MAC port, also Linkdown

Fault in key board hardware units, such as the power supply module and the optical module

WARNING
When the protection is performed, the GE ports support auto-negotiation and 1000M full duplex
modes.

Board Configuration
Two EGS4 boards should be configured for the protection. One EGS4 is the active board and
the other is the standby board. For the protection, the access capacity of the slot for the standby
board must be larger than that of the slot for the active board.

7.9.8 Board Configuration Reference

You can use the T2000 to set parameters for the EGS4.
You can use the T2000 to set the following parameters for the EGS4:
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l

Working mode

Enabling of the LCAS

Maximum packet length

Mapping protocol

For details on the parameters, refer to F Board Configuration Reference.

7.9.9 Technical Specifications

The specifications of the EGS4 cover the optical interface specifications, laser safety class,
mechanical specifications and power consumption.

Optical Interface Specifications

Table 7-37 lists the specifications of the interfaces of the EGS4.
Table 7-37 Specifications of the optical interfaces of the EGS4
Item

Specification

Optical interface
type

1000Base-ZX
(70 km)

1000Base-ZX
(40 km)

1000Base-LX
(10 km)

1000Base-SX
(0.55 km)

Optical source
type

MLM

MLM

MLM

MLM

Launched optical
power (dBm)

4 to +2

2 to +5

9 to 3

9.5 to 0

Central
wavelength (nm)

14801580

12701355

12701355

770860

Overload optical
power (dBm)

Receiver
sensitivity (dBm)

22

23

19

17

Extinction ratio
(dB)

Laser Safety Class

The safety class of the laser on the board is CLASS 1.
The maximum launched optical power of the optical interfaces is lower than 10 dBm (10 mW).

Mechanical Specifications
The mechanical specifications of the EGS4 are as follows:

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Board dimensions (mm): 262.05 (H) x 220 (D) x 25.4 (W)

Weight (kg): 1.1

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Power Consumption
In the normal temperature (25), the maximum power consumption of the EGS4 is 70 W.

7.10 EGR2
This section describes the EGR2, a 2 x GE Ethernet processing board, in terms of the version,
function, principle, front panel, configuration and specifications.
7.10.1 Version Description
The functional version of the EGR2 board is N2.
7.10.2 Function and Feature
The EGR2 supports Layer 2 switching, port convergence, and RPR.
7.10.3 Working Principle and Signal Flow
The EGR2 consists of the ethernet processing module, network processor module, RPR protocol
processing module and so on.
7.10.4 Front Panel
On the front panel of the EGR2, there are indicators, interfaces, barcode and laser safety class
label.
7.10.5 Valid Slots
The EGR2 can be housed in any of slots 1213 in the OptiX OSN 1500A subrack. The EGR2
can be housed in any of slots 1113 in the OptiX OSN 1500B subrack.
7.10.6 Board Feature Code
The code behind the board name in the barcode is the board feature code. The board feature code
of the EGR2 indicates the optical interface type.
7.10.7 Board Configuration Reference
You can use the T2000 to set parameters for the EGR2.
7.10.8 Technical Specifications
The technical specifications of the EGR2 cover the optical interface specifications, board
dimensions, weight and power consumption.

7.10.1 Version Description

The functional version of the EGR2 board is N2.

7.10.2 Function and Feature

The EGR2 supports Layer 2 switching, port convergence, and RPR.
Table 7-38 lists the functions and features of the EGR2.
Table 7-38 Functions and features of the EGR2

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Function and
Feature

EGR2

Basic function

Accesses and processes 2 x GE services. Supports the RPR feature.

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Function and
Feature

EGR2

Specification of the
optical interface

The optical interfaces are 1000Base-SX/LX/ZX Ethernet optical

interfaces. The optical interfaces support the auto-negotiation,
compliant with IEEE 802.3z.
The optical interfaces use the hot-swappable optical module SFP.
When multimode optical fiber is used, the maximum transmission
distance is 550 m. When single-mode optical fiber is used, the
maximum transmission distance is 10 km. The optical modules can be
used for different requirements for the transmission distance, such as
40 km and 70 km.

Format of service
frames

Supports Ethernet II, IEEE 802.3, and IEEE 802.1q TAG.

Supports frames with a length ranging from 64 bytes to 9600 bytes.
Supports Jumbo frames with a length less than 9600 bytes.

Max. uplink
bandwidth

2.5 Gbit/s.

Mapping
granularity

Supports VC-3, VC-3-2v, VC-4, and VC-4-Xv (X8).

Encapsulation
format

Supports GFP-F and LAPS.

EVPL

Supports EVPL services. The frame format can be Ethernet II, IEEE
802.3, IEEE 802.1q TAG, or MPLS Martini.
Supports the MPLS encapsulation and forwarding based on port and
port+VLAN.
Supports five types of LSP, including ingress LSP, egress LSP, transit
LSP, RPR ingress LSP, and RPR transit LSP. Supports 512 LSPs.
Supports EVPLAN services and uses the stack VLAN encapsulation.

EVPLAN

Supports the function of self-learning the source MAC address. For the
N2EGR2, the capacity of the MAC address table is 64k. The aging time
of the MAC address can be set and queried.
Supports the configuration of static MAC routes (maximum: 4k).
Supports data isolation based on VB+VLAN.
Supports the creation, deletion and query of the VB. The maximum
number of the VBs is 16. The maximum number of logical ports for
each VB is 32.

7-80

MPLS

Supports MartinioE.

Stack VLAN

Supported.

VLAN

Supports 4096 VLAN labels, the addition and deletion of VLAN labels,
and the switching function, compliant with IEEE 802.1q/p.

VLAN
convergence

Supported (4k VLAN).

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Function and
Feature

EGR2

VLAN switching

Supports the replacement of VLAN in Ethernet signal frames.

Port convergence

Supports the convergence at a maximum of two GE ports.

RPR

Supports RPR, compliant with IEEE 802.17.

The ring network supports a maximum of 255 nodes, and it supports
the dropping of sink nodes and weighted fairness algorithm.
Supports five priority levels, including A0, A1, B_EIR, B_CIR and C.
Provides topology automatic discovery function, and detects the
network status in real time.
Supports three protection modes, including Steering, Wrapping, and
Wrapping+Steering. The invalid time for signals is less than 50 ms.
Supports the manual configuration of the ringlet route in the RPR ring
network.
Supports the ringlet self-learning, which learns the mapping relation
between the MAC address and node number.

RSTP

Supports broadcast packet suppression and RSTP, compliant with

IEEE 802.1w.

Multicast (IGMP
Snooping)

Supported.

CAR

Supported.
The granularity is 64 kbit/s.

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Flow classification

Supports the port flow, port+VLAN ID flow, and port+VLAN ID

+VLAN PRI flow.

LCAS

Dynamically increases or decreases the bandwidth, and realizes the

protection function, compliant with ITU-T G.7042.

Flow control
function

Supports the IEEE 802.3x flow control based on port.

Echo test frame

Supports the Echo function of the PRP OAM, which is used to test the
availability of the link.

Loopback function

Supports inloop at the Ethernet port (PHY layer or MAC layer).

Ethernet
performance
monitoring

Supports Ethernet performance monitoring at the port level.

Alarm and
performance event

Provides rich alarms and performance events for easy management and
maintenance of the equipment.

Weighted fairness
algorithm

Supported.

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Function and
Feature

EGR2

Topology
automatic
discovery

Supported.

Max. number of
nodes

255.

Service priority
level

Supports A0, A1, B_CIR, B_EIR and C.

7.10.3 Working Principle and Signal Flow

The EGR2 consists of the ethernet processing module, network processor module, RPR protocol
processing module and so on.
Figure 7-26 shows the block diagram for the functions of the EGR2.
Figure 7-26 Block diagram for the functions of the EGR2

E
N
C
P

Control
singnal
GE/FE Ethernet

Switch
fabric

Network
processor

access
module

Data
Network processor module

RPR
MAC

RPR
MAC

east

west

D
N
C
P

RPR protocol
process module

Crossconnect
unit
V
C
P

Interface
conversion
module

Mapping module

Laser shut down

Communication

Communication and
control module

LOS

Crossconnect
unit

SCC unit

Reference clock and frame header

Cross-connect
unit

50 MHZ
77 MHZ
125 MHZ

Clock module

100 MHZ
+3.3 V
+1.5 V
+2.5 V

DC/DC
+1.8 V converter

DC/DC
converter

Fuse

-48 V/ -60 V
-48 V/ -60 V

Fuse

+3.3 V backup
power

RPR: resilient package ring

The function modules are described as follows:

Ethernet Access Module

In the receive direction, the optical signals from Ethernet equipment, such as switch and router,
are converted into electrical signals. For the signals accessed from electrical interfaces, O/E
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conversion is unnecessary. At PHY layer, the electrical signals are decoded and the ETH_LOS
alarms are tested. The electrical signals are converted from serial signals to parallel signals and
then sent to network processor.
In the transmit direction, the parallel signals are converted to serial signals. At the PHY layer,
signals are encoded and converted from electrical signals to optical signals.

Network Processor Module

The network processor module consists of network processor and switch fabric. The network
processor first performs MAC functions, which include code conversion, framing of Ethernet
packets, CRC check and Ethernet performance statistics.
After the striped Ethernet frame enters the core of network processor, the flow is classified as
per service type and configuration requirements. The frame is encapsulated or decapsulated.
These packets formats are supported:
l

MPLS

L2MPLS VPN

Ethernet/ VLAN

In the receive direction, services are mapped and forwarded by adding Tunnel and VC double
labels as per service configuration. In the transmit direction, Tunnel or VC is extracted as per
the level (P or PE) of the equipment. Services are then routed or forwarded.
The network processor module:
l

Supports flow sense and flow classification

Supports uni-cast, multi-cast and broadcast of the flow

Provides data priority setting

Provides weighted fair queuing (WFQ)

Provides four classes of services (CoS)

RPR Protocol Processing Module

RPR realizes fair weight and statistic multiplex for ring bandwidth. RPR provides protection
switching schemes. By applying the RPR protocol and RPR weight fair algorithm, this module
controls the bandwidth of each node to access the ring network. Therefore, the RPR ring features
spatial reuse and statistic multiplex. Bandwidth utilization is then improved.
Topology auto-discovery ensures the plug-and-play feature of the RPR. The protocol for
topology auto-discovery provides correct and reliable means to fast find topologies of all nodes
and the changes to these topologies.
RPR uni-cast frames are striped at the destination node and thus bandwidth in the ring is reused
spatially.
The entire RPR ring accommodates 255 nodes to the maximum.

Mapping Module
The mapping module consists of encapsulation and mapping.
In the upstream direction, the virtual concatenation supports LCAS function. The encapsulation
formats are LAPS and GFP.
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In the downstream direction, virtual concatenations are received. The time delay of virtual
concatenation is compensated. After aligning, packets are decapsulated as per encapsulation
format. The decapsulated data are transmitted to the RPR protocol processing module in packets.

Interface Converting Module

The interface converting module mainly converts 622 Mbit/s low voltage differential signals
(LVDS) bus of SDH system into serial bus. Through this module, the high-rate backplane
interface connects to low-rate interface chip of the transmitting system.

Communication and Control Module

The communication and control module consists of CPU, register, oscillator, Ethernet port and
HDLC controller. This module connects to external circuits through bus. The communication
and control module:
l

Manages and configures other modules of the boards.

Performs inter-board communication through internal Ethernet interface.

The control module also contains basic logic units. This module enjoys the following functions:
l

Writes and reads register

Provides interface for CPU

Checks, selects clock

Performs phase discrimination and frequency division to the clock

Checks the in-service state of the cross-connect, the SCC and the line boards

Controls the shutting down of the optical module

Processes communication

Control indicators

Clock Unit
This clock unit tracing the system reference clock and generates the required working clocks for
each chip. The frequencies of these clocks are: 50 MHz, 77MHz, 125 MHz and 100 MHz.

DC/DC Converter Module

Through the DC/DC module, the power unit generates required voltages for each chip on the
board. The following DC voltages are provided: +1.5 V, +1.8 V, +2.5 V and +3.3 V. In addition,
this unit also provides protection for the board +3.3 V power supply.

7.10.4 Front Panel

On the front panel of the EGR2, there are indicators, interfaces, barcode and laser safety class
label.

Appearance of the Front Panel

Figure 7-27 shows the appearance of the front panel of the EGR2.
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Figure 7-27 Front panel of the EGR2

EGR2
STAT
ACT
PROG
SRV
LINK1
ACT1
LINK2
ACT2

CLASS 1
LASER
PRODUCT

OUT1 IN1
OUT2 IN2
EGR2

Indicators
The following indicators are present on the front panel of the board:
l

Board hardware state indicator (STAT), which is green or red when lit.

Service activating state indicator (ACT), which is green when lit.

Board software state indicator (PROG), which is green or red when lit.

Service alarm indicator (SRV), which is red, green or yellow when lit.

Connection status indicator (LINK), which is green when lit.

Data receiving and transmission indicator (ACT), which is orange when lit.

For indication of these indicators, see A Equipment and Board Alarm Indicators.

Interfaces
There are two optical interfaces on the front panel of the EGR2. Table 7-39 lists the type and
usage of the optical interfaces.

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Table 7-39 Optical interfaces of the EGR2

Interface

Interface Type

Usage

OUT1/IN1

LC (pluggable)

Transmits and receives the 1000Base-SX/LX/ZX

signals.

OUT2/IN2

LC (pluggable)

Transmits and receives the 1000Base-SX/LX/ZX

signals.

7.10.5 Valid Slots

The EGR2 can be housed in any of slots 1213 in the OptiX OSN 1500A subrack. The EGR2
can be housed in any of slots 1113 in the OptiX OSN 1500B subrack.

7.10.6 Board Feature Code

The code behind the board name in the barcode is the board feature code. The board feature code
of the EGR2 indicates the optical interface type.
Table 7-40 lists the relation between the board feature code and optical interface type for the
EGR2.
Table 7-40 Relation between the board feature code and the optical interface type
Board Barcode

Feature Code

Optical Interface Type

SSN2EGR210

10

1000Base-SX (0.55 km)

SSN2EGR211

11

1000Base-LX (10 km)

SSN2EGR212

12

1000Base-ZX (40 km)

SSN2EGR213

13

1000Base-ZX (70 km)

7.10.7 Board Configuration Reference

You can use the T2000 to set parameters for the EGR2.
You can use the T2000 to set the following parameters for the EGR2:
l

Working mode

Enabling of the LCAS

Maximum packet length

Mapping protocol

For details on the parameters, refer to F Board Configuration Reference.

7.10.8 Technical Specifications

The technical specifications of the EGR2 cover the optical interface specifications, board
dimensions, weight and power consumption.
Table 7-41 lists the specifications of the interfaces of the EGR2.
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Table 7-41 Specifications of the interfaces of the EGR2

Optical
Optical
Interface Type Source
Type

Launched
Optical
Power
(dBm)

Central
Wavele
ngth
(nm)

Overloa
d Optical
Power
(dBm)

Receiver
Sensitivit
y (dBm)

Extin
ction
Ratio
(dB)

1000Base-ZX
(70 km)

MLM

4 to +2

1480 to
1580

22

1000Base-ZX
(40 km)

MLM

2 to +5

1270 to
1355

23

1000Base-LX
(10 km)

MLM

9 to 3

1270 to
1355

19

1000Base-SX
(0.55 km)

MLM

9.5 to 0

770 to
860

17

Laser Safety Class

The safety class of the laser on the board is CLASS 1.
The maximum launched optical power of the optical interfaces is lower than 10 dBm (10 mW).

Mechanical Specifications
The mechanical specifications of the EGR2 are as follows:
l

Board dimensions (mm): 262.05 (H) x 220 (D) x 25.4 (W)

Weight (kg): 1.1

Power Consumption
In the normal temperature (25), the maximum power consumption of the EGR2 is 40 W.

7.11 EMR0
This section describes the EMR0, a 12 x FE and 1 x GE Ethernet ring processing board, in terms
of the version, function, principle, front panel, configuration and specifications.
7.11.1 Version Description
The EMR0 has two versions, N1 and N2. The production of the N1 version is stopped.
7.11.2 Function and Feature
The EMR0 supports Layer 2 switching, port convergence, and RPR.
7.11.3 Working Principle and Signal Flow
The EMR0 consists of the ethernet processing module, network processor module, RPR protocol
processing module, mapping module and so on.
7.11.4 Front Panel
On the front panel of the EMR0, there are indicators, interfaces, barcode and laser safety class
label.
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7.11.5 Valid Slots

The EMR0 can be housed in any of slots 1213 in the OptiX OSN 1500A subrack. Without the
interface board, the EMR0 can be housed in any of slots 1113 in the OptiX OSN 1500B subrack.
With the interface board, the EMR0 can be housed in any of slots 1213 in the OptiX OSN
1500B subrack.
7.11.6 Board Feature Code
The code behind the board name in the barcode is the board feature code. The board feature code
of the EMR0 indicates the optical interface type.
7.11.7 Board Configuration Reference
You can use the T2000 to set parameters for the EMR0.
7.11.8 Technical Specifications
The technical specifications of the EMR0 cover the optical interface specifications, board
dimensions, weight and power consumption.

7.11.1 Version Description

The EMR0 has two versions, N1 and N2. The production of the N1 version is stopped.
Table 7-42 lists the details on the versions of the EMR0 board.
Table 7-42 Version description of the EMR0
Item

Description

Functional
version

The EMR0 has two versions, N1 and N2.

Difference

The N2EMR0 supports all functions of the N1EMR0. The N2EMR0 also
has some new functions and extends some functions of the N1EMR0. For
details, see Table 7-43.

Replaceability

The N2EMR0 can replace the N1EMR0.

Table 7-43 Comparison of features of the N1EMR0 and N2EMR0

7-88

Item

N1EMR0

N2EMR0

Port convergence
function

Supports the convergence function at a

maximum of eight FE ports.

VLAN label
switching

Supports the VLAN label switching for

the Ethernet data.

EVPLAN services

Supports EVPLAN services

and uses the stack VLAN
encapsulation.

Supports EVPLAN services and uses

the stack VLAN encapsulation.

MAC address table

Supports the 16k MAC

address table.

Supports the 64k MAC address table.

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Item

N1EMR0

N2EMR0

VB features

Supports the creation,

deletion and query of the VB.
The maximum number of the
VBs is 32. The maximum
number of logical ports for
each VB is 16.

Supports the creation, deletion and

query of the VB. The maximum number
of the VBs is 16. The maximum number
of logical ports for each VB is 32.

PRP ring network

Supports the manual configuration of

the ringlet route in the RPR ring
network.

RPR OAM

Supports the Echo function of the PRP

OAM, which is used to test the
availability of the link.

CAR

Supported.

Supported.

Flow classification

Supports the port flow, port

+VLAN ID flow, and port
+VLAN PRI flow.

Supports the port flow, port+VLAN ID

flow, and port+VLAN ID+VLAN PRI
flow.

7.11.2 Function and Feature

The EMR0 supports Layer 2 switching, port convergence, and RPR.
Table 7-44 lists the functions and features of the EMR0.
Table 7-44 Functions and features of the EMR0
Function and
Feature

EMR0

Basic function

Accesses and processes 12 x FE services and 1 x GE services. Supports

the RPR feature.

Used with the

interface board

Supports four FE ports and one GE ports.

Accesses 12 x FE signals at the electrical interface when used with the
ETF8.
Accesses 8 x FE signals at the optical interface when used with the
EFF8.

Specification of the
optical interface

Supports the 10Base-T/100Base-TX signals when used with the ETF8.

The maximum transmission distance is 100 m.
Supports the 100Base-FX signals when used with the EFF8, compliant
with IEEE 802.3u.

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Format of service
frames

Supports Ethernet II, IEEE 802.3, and IEEE 802.1q TAG . Supports
frames with a length ranging from 64 bytes to 9600 bytes. Supports
Jumbo frames with a length less than 9600 bytes.

Max. uplink
bandwidth

2.5 Gbit/s.

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Function and
Feature

EMR0

Mapping
granularity

VC-3, VC-3-2v, VC-4, and VC-4-Xv (X8).

Encapsulation
format

Supports GFP-F and LAPS.

EVPL

Supports EVPL services. The frame format can be Ethernet II, IEEE
802.3, IEEE 802.1q TAG, or MPLS Martini. EVPL services support
the MPLS encapsulation and forwarding based on port and port
+VLAN. Supports five types of LSP, including ingress LSP, egress
LSP, transit LSP, RPR ingress LSP, and RPR transit LSP. Supports 512
LSPs.

EVPLAN

Supports EVPLAN services and uses the stack VLAN encapsulation.

Supports the function of self-learning the source MAC address. For the
N2EMR0, the capacity of the MAC address table is 16k. The aging time
of the MAC address can be set and queried.
Supports the configuration of static MAC routes (maximum: 4k).
Supports data isolation based on VB+VLAN.
Supports the creation, deletion and query of the VB. The N2EMR0
supports a maximum of 16 VBs. The maximum number of logical ports
for each VB is 32. The N1EMR0 supports a maximum of 32 VBs. The
maximum number of logical ports for each VB is 16.

7-90

MPLS

Supports MartinioE.

Stack VLAN

Supported.

VLAN

Supports 4096 VLAN labels, the addition and deletion of VLAN labels,
and the switching function, compliant with IEEE 802.1q/p.

VLAN
convergence

Supported (4k VLAN).

VLAN switching

Supports the replacement of VLAN in Ethernet signal frames.

Port convergence

Supports the convergence function at a maximum of eight FE ports.

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Function and
Feature

EMR0

RPR

Supported and compliant with IEEE 802.17.

7 Data Processing Boards

Supports a maximum of 255 nodes in the ring network, and the dropping
of sink nodes.
Supports weighted fairness algorithm.
Supports five priority levels, including A0, A1, B_EIR, B_CIR and C.
Provides topology automatic discovery function, and detects the
network status in real time. Supports three protection modes, including
Steering, Wrapping, and Wrapping+Steering. The invalid time for
signals is less than 50 ms.
Supports the ringlet self-learning, which learns the mapping relation
between the MAC address and node number.
The N2EMR0 supports the manual configuration of the ringlet route in
the RPR ring network.
RSTP

Supports broadcast packet suppression and RSTP, compliant with IEEE

802.1w.

Multicast (IGMP
Snooping)

Supported.

CAR

Supported.
The granularity is 64 kbit/s.

Flow classification

The N1EMR0 supports the port flow, port+VLAN ID flow, and port
+VLAN PRI flow.
The N2EMR0 supports the port flow, port+VLAN ID flow, and port
+VLAN ID+VLAN PRI flow.

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LCAS

Dynamically increases or decreases the bandwidth and realizes the

protection function, compliant with ITU-T G.7042.

Flow control
function

Supports the IEEE 802.3x flow control based on port.

Echo test frame

Supports the Echo function of the PRP OAM, which is used to test the
availability of the link.

Loopback function

Supports inloop at the Ethernet port (PHY layer or MAC layer).

Ethernet
performance
monitoring

Supports Ethernet performance monitoring at the port level.

Alarm and
performance
events

Provides rich alarms and performance events for easy management and
maintenance of the equipment.

Weighted fairness
algorithm

Supported.

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Function and
Feature

EMR0

Topology
automatic
discovery

Supported.

Max. number of
nodes

255.

Service priority
levels

Supports A0, A1, B_CIR, B_EIR and C.

7.11.3 Working Principle and Signal Flow

The EMR0 consists of the ethernet processing module, network processor module, RPR protocol
processing module, mapping module and so on.
Figure 7-28 shows the block diagram for the functions of the EMR0.
Figure 7-28 Block diagram for the functions of the EMR0

E
N
C
P

Control
singnal
GE/FE Ethernet

Switch
fabric

Network
processor

access
module

Data
Network processor module

RPR
MAC

RPR
MAC

east

west

D
N
C
P

RPR protocol
process module

Crossconnect
unit
V
C
P

Interface
conversion
module

Mapping module

Laser shut down

Communication

Communication and
control module

LOS

Crossconnect
unit

SCC unit

Reference clock and frame header

Cross-connect
unit

50 MHZ
77 MHZ
125 MHZ

Clock module

100 MHZ
+3.3 V
+1.5 V
+2.5 V

DC/DC
+1.8 V converter

DC/DC
converter

Fuse

-48 V/ -60 V
-48 V/ -60 V

Fuse

+3.3 V backup
power

RPR: resilient package ring

The function modules are described as follows:

Ethernet Access Module

In the receive direction, the optical signals from Ethernet equipment, such as switch and router,
are converted into electrical signals. For the signals accessed from electrical interfaces, O/E
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conversion is unnecessary. At PHY layer, the electrical signals are decoded and the ETH_LOS
alarms are tested. The electrical signals are converted from serial signals to parallel signals and
then sent to network processor.
In the transmit direction, the parallel signals are converted to serial signals. At the PHY layer,
signals are encoded and converted from electrical signals to optical signals.

Network Processor Module

The network processor module consists of network processor and switch fabric. The network
processor first performs MAC functions, which include code conversion, framing of Ethernet
packets, CRC check and Ethernet performance statistics.
After the striped Ethernet frame enters the core of network processor, the flow is classified as
per service type and configuration requirements. The frame is encapsulated or decapsulated.
These packets formats are supported:
l

MPLS

L2MPLS VPN

Ethernet/ VLAN

In the receive direction, services are mapped and forwarded by adding Tunnel and VC double
labels as per service configuration. In the transmit direction, Tunnel or VC is extracted as per
the level (P or PE) of the equipment. Services are then routed or forwarded.
The network processor module:
l

Supports flow sense and flow classification

Supports uni-cast, multi-cast and broadcast of the flow

Provides data priority setting

Provides weighted fair queuing (WFQ)

Provides four classes of services (CoS)

RPR Protocol Processing Module

RPR realizes fair weight and statistic multiplex for ring bandwidth. RPR provides protection
switching schemes. By applying the RPR protocol and RPR weight fair algorithm, this module
controls the bandwidth of each node to access the ring network. Therefore, the RPR ring features
spatial reuse and statistic multiplex. Bandwidth utilization is then improved.
Topology auto-discovery ensures the plug-and-play feature of the RPR. The protocol for
topology auto-discovery provides correct and reliable means to fast find topologies of all nodes
and the changes to these topologies.
RPR uni-cast frames are striped at the destination node and thus bandwidth in the ring is reused
spatially.
The entire RPR ring accommodates 255 nodes to the maximum.

Mapping Module
The mapping module consists of encapsulation and mapping.
In the upstream direction, the virtual concatenation supports LCAS function. The encapsulation
formats are LAPS and GFP.
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In the downstream direction, virtual concatenations are received. The time delay of virtual
concatenation is compensated. After aligning, packets are decapsulated as per encapsulation
format. The decapsulated data are transmitted to the RPR protocol processing module in packets.

Interface Converting Module

The interface converting module mainly converts 622 Mbit/s low voltage differential signals
(LVDS) bus of SDH system into serial bus. Through this module, the high-rate backplane
interface connects to low-rate interface chip of the transmitting system.

Communication and Control Module

The communication and control module consists of CPU, register, oscillator, Ethernet port and
HDLC controller. This module connects to external circuits through bus. The communication
and control module:
l

Manages and configures other modules of the boards.

Performs inter-board communication through internal Ethernet interface.

The control module also contains basic logic units. This module enjoys the following functions:
l

Writes and reads register

Provides interface for CPU

Checks, selects clock

Performs phase discrimination and frequency division to the clock

Checks the in-service state of the cross-connect, the SCC and the line boards

Controls the shutting down of the optical module

Processes communication

Control indicators

Clock Unit
This clock unit tracing the system reference clock and generates the required working clocks for
each chip. The frequencies of these clocks are: 50 MHz, 77MHz, 125 MHz and 100 MHz.

DC/DC Converter Module

Through the DC/DC module, the power unit generates required voltages for each chip on the
board. The following DC voltages are provided: +1.5 V, +1.8 V, +2.5 V and +3.3 V. In addition,
this unit also provides protection for the board +3.3 V power supply.

7.11.4 Front Panel

On the front panel of the EMR0, there are indicators, interfaces, barcode and laser safety class
label.

Appearance of the Front Panel

Figure 7-29 shows the appearance of the front panel of the N1EMR0.
Figure 7-30 shows the appearance of the front panel of the N2EMR0.
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Figure 7-29 Front panel of the N1EMR0

EMR0
STAT
ACT
PROG
SRV
LINK
ACT

CLASS 1
LASER
PRODUCT

OUT1 IN1

FE1

FE2

FE3

FE4

EMR0

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Figure 7-30 Front panel of the N2EMR0

EMR0
STAT
ACT
PROG
SRV
LINK
ACT

CLASS 1
LASER
PRODUCT

OUT1
IN1

FE1

FE2

FE3

FE4

EMR0

Indicators
The following indicators are present on the front panel of the board:
l

Board hardware state indicator (STAT), which is green or red when lit.

Service activating state indicator (ACT), which is green when lit.

Board software state indicator (PROG), which is green or red when lit.

Service alarm indicator (SRV), which is red, green or yellow when lit.

Connection status indicator (LINK), which is green when lit.

Data receiving and transmission indicator (ACT), which is orange when lit.

For indication of these indicators, see A Equipment and Board Alarm Indicators.
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Interfaces
There are five interfaces on the front panel of the EMR0. Table 7-45 lists the type and usage of
the interfaces.
Table 7-45 Optical interfaces of the EMR0
Interface

Interface Type

Usage

OUT1/IN1

LC (pluggable)

Transmits and receives the 1000Base-SX/LX/ZX

signals.

FE1

RJ-45

Transmits and receives the 10Base-T/100Base-TX

signals.

FE2

RJ-45

Transmits and receives the 10Base-T/100Base-TX

signals.

FE3

RJ-45

Transmits and receives the 10Base-T/100Base-TX

signals.

FE4

RJ-45

Transmits and receives the 10Base-T/100Base-TX

signals.

7.11.5 Valid Slots

The EMR0 can be housed in any of slots 1213 in the OptiX OSN 1500A subrack. Without the
interface board, the EMR0 can be housed in any of slots 1113 in the OptiX OSN 1500B subrack.
With the interface board, the EMR0 can be housed in any of slots 1213 in the OptiX OSN
1500B subrack.
The EMR0 can be used with the ETF8 and EFF8.
Table 7-46 and Table 7-47 list the valid slots for the EMR0 and corresponding slots for the
ETF8 and EFF8.
Table 7-46 Valid slots for the EMR0 and corresponding slots for the ETF8 and EFF8 in the
OptiX OSN 1500A subrack
Valid Slot for the EMR0

Corresponding Slot for the ETF8 and EFF8

Slot 12

Without the interface board

Slot 13

Without the interface board

Table 7-47 Valid slots for the EMR0 and corresponding slots for the ETF8 and EFF8 in the
OptiX OSN 1500B subrack

Issue 02 (2007-09-10)

Valid Slot for the EMR0

Corresponding Slot for the ETF8 and EFF8

Slot 11

Without the interface board

Slot 12

Slot 15

Slot 13

Slot 17
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7.11.6 Board Feature Code

The code behind the board name in the barcode is the board feature code. The board feature code
of the EMR0 indicates the optical interface type.
Table 7-48 lists the relation between the board feature code and optical interface type for the
EMR0.
Table 7-48 Relation between the board feature code and the optical interface type
Board Barcode

Feature Code

Optical Interface Type

SSN2EMR010

10

1000Base-SX (0.55 km)

SSN2EMR011

11

1000Base-LX (10 km)

SSN2EMR012

12

1000Base-ZX (40 km)

SSN2EMR013

13

1000Base-ZX (70 km)

7.11.7 Board Configuration Reference

You can use the T2000 to set parameters for the EMR0.
You can use the T2000 to set the following parameters for the EMR0:
l

Working mode

Enabling of the LCAS

Maximum packet length

Mapping protocol

For details on the parameters, refer to F Board Configuration Reference.

7.11.8 Technical Specifications

The technical specifications of the EMR0 cover the optical interface specifications, board
dimensions, weight and power consumption.
Table 7-49 lists the specifications of the interfaces of the EMR0.
Table 7-49 Specifications of the optical interfaces of the EMR0

7-98

Item

Specification

Optical interface
type

1000Base-ZX
(70 km)

1000Base-ZX
(40 km)

1000Base-LX
(10 km)

1000Base-SX
(0.55 km)

Optical source
type

MLM

MLM

MLM

MLM

Launched optical
power (dBm)

4 to +2

2 to +5

9 to 3

9.5 to 0

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Item

Specification

Central
wavelength (nm)

1480 to 1580

1270 to 1355

1270 to 1355

770 to 860

Overload optical
power (dBm)

Receiver
sensitivity (dBm)

22

23

19

17

Extinction ratio
(dB)

Laser Safety Class

The safety class of the laser on the board is CLASS 1.
The maximum launched optical power of the optical interfaces is lower than 10 dBm (10 mW).

Mechanical Specifications
The mechanical specifications of the EMR0 are as follows:
l

Board dimensions (mm): 262.05 (H) x 220 (D) x 25.4 (W)

Weight (kg): 1.2

Power Consumption
In the normal temperature (25), the maximum power consumption of the EMR0 is 50 W.

7.12 ADL4
This section describes the ADL4, a 1 x STM-4 ATM processing board, in terms of the version,
function, principle, front panel, configuration and specifications.
7.12.1 Version Description
The functional version of the ADL4 board is N1.
7.12.2 Function and Feature
The ADL4 supports the ATM switching and ATM protection.
7.12.3 Working Principle and Signal Flow
The ADL4 consists of the O/E converting module, physical layer module, ATM module and so
on.
7.12.4 Front Panel
On the front panel of the ADL4, there are indicators, interfaces, barcode and laser safety class
label.
7.12.5 Valid Slots
The ADL4 can be housed in any of slots 1213 in the OptiX OSN 1500A subrack. The ADL4
can be housed in any of slots 1113 in the OptiX OSN 1500B subrack.
7.12.6 Board Feature Code
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The code behind the board name in the barcode is the board feature code. The board feature code
of the ADL4 indicates the optical interface type.
7.12.7 Board Configuration Reference
You can use the T2000 to set parameters for the ADL4.
7.12.8 Technical Specifications
The technical specifications of the ADL4 cover the optical interface specifications, board
dimensions, weight and power consumption.

7.12.1 Version Description

The functional version of the ADL4 board is N1.

7.12.2 Function and Feature

The ADL4 supports the ATM switching and ATM protection.
Table 7-50 lists the functions and features of the ADL4.
Table 7-50 Functions and features of the ADL4

7-100

Function and
Feature

ADL4

Basic function

Accesses and processes 1 x STM-4 ATM services.

Optical interface type

Supports the optical interfaces of the S-4.1, L-4.1, L-4.2 and Ve-4.2
types.

Connector type

LC.

Optical module type

SFP.

E3 ATM interface

Supports 12 x E3 signals, which are accessed by the PD3/PL3/

N1PL3A.

IMA function

Not supported.

Max. uplink bandwidth

Supports 8 x VC-4, or 12 x VC-3 and 4 x VC-4.

ATM switching
capability

1.2 Gbit/s.

Mapping granularity

Supports VC-3, VC-4, or VC-4-Xv (X: 14).

Service type

Supports CBR, rt-VBR, nrt-VBR and UBR.

ATM connection

2048.

Statistical multiplexing

Supported.

Flow type and QoS

Supports IETF RFC2514, ATM forum TM4.0.

ATM multicast
connection

Supports spacial multicast and logical multicast.

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Function and
Feature

ADL4

ATM protection (ITUT I.630)

Supports unidirectional or bidirectional 1+1, 1:1, VP-Ring, VCRing protection schemes.

OAM function (ITU-T

I.610)

Supports AIS, RDI, LB , and CC.

Maintenance feature

Supports inloop and outloop at the ATM layer levels, supports

inloop at the optical interface, which are used for maintenance and
fault locating.

Alarm and performance

event

Provides rich alarms and performance events. The loopback is used

for maintenance and fault locating.

7.12.3 Working Principle and Signal Flow

The ADL4 consists of the O/E converting module, physical layer module, ATM module and so
on.
Figure 7-31 shows the block diagram for the functions of the ADL4.
Figure 7-31 Block diagram for the functions of the ADL4
622Mbit/s

E/O

622Mbit/s

high speed bus

PHY
module

ATM
module

Mapping
module
high speed bus

E3
module

O/E
622Mbit/s

622Mbit/s

LOS

Reference clock and frame header

Communication
and control module

Laser shut down

Cross-connet unit A

Communication

Cross-connet unit B

Cross-connet unit

Scc unit

50 MHz
77 MHz
100 MHz

Clock module
3.3 V

DC/DC
converter

Fuse

-48 V/ -60 V
-48 V/ -60 V

+1.2 V
Fuse
+1.5 V
+1.8 V

DC/DC
converter

+3.3 V backup
power

+2.5 V

The function modules are described as follows.

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O/E Converting Module

In the receive direction, optical signals are converted to electrical signals. In the transmit
direction, electrical signals are converted to optical signals.

Physical Layer Module

The physical layer module mainly:
l

Mappings ATM cells into SDH frames

Demappings SDH frames to ATM cells

Processes ATM service physical layer functions: cell delimitation, test and generation of
HEC series

ATM Module
The ATM module mainly performs ATM layer functions in the ATM protocol. These functions
include:
l

Flow control

Extraction and generation of cell headers

ATM switching

E3 Module
The E3 module mainly processes the ATM services at E3 rate. This module:
l

Mappings the ATM cells into E3 containers

Demappings E3 containers to ATM cells

Perform ATM physical layer function to the ATM service at E3 rate

Mapping Module
The mapping module:
l

Mappings ATM cells into SDH frame payload

Demappings SDH frame payload to ATM cells

Supports ATM physical layer functions

Supports VC-4-Xv (X4) virtual concatenation

Communication and Control Module

The communication and control module:

7-102

Controls writing and reading of each chip

Communicates with the NE

Issues configured services

Reports alarms of each functional module

Checks R_LOS alarms of optical modules

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Controls the shutting of transmission

Clock Module
This module mainly generates working clocks for each chip. The frequencies of the clocks are
50 MHz, 77 MHz and 100 MHz.

DC/DC Converter Module

Through the DC/DC module, the power unit generates required voltages for each chip on the
board. The following DC voltages are provided: +1.2 V, +1.5 V, +1.8 V, +2.5 V and +3.3 V. In
addition, this unit also provides protection for the board +3.3 V power supply.

7.12.4 Front Panel

On the front panel of the ADL4, there are indicators, interfaces, barcode and laser safety class
label.

Appearance of the Front Panel

Figure 7-32 shows the appearance of the front panel of the ADL4.
Figure 7-32 Front panel of the ADL4

ADL4
STAT
ACT
PROG
SRV

CLASS 1
LASER
PRODUCT

OUT1 IN1
ADL4

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Indicators
The following indicators are present on the front panel of the board:
l

Board hardware state indicator (STAT), which is green or red when lit.

Service activating state indicator (ACT), which is green when lit.

Board software state indicator (PROG), which is green or red when lit.

Service alarm indicator (SRV), which is red, green or yellow when lit.

For indication of these indicators, see A Equipment and Board Alarm Indicators.

Interfaces
There is one optical interface on the front panel of the ADL4. Table 7-51 lists the type and usage
of the optical interface.
Table 7-51 Optical interface of the ADL4
Interface

Interface
Type

Usage

OUT1/IN1

LC
(pluggable)

Transmits and receives STM-4 optical signals.

7.12.5 Valid Slots

The ADL4 can be housed in any of slots 1213 in the OptiX OSN 1500A subrack. The ADL4
can be housed in any of slots 1113 in the OptiX OSN 1500B subrack.

7.12.6 Board Feature Code

The code behind the board name in the barcode is the board feature code. The board feature code
of the ADL4 indicates the optical interface type.
Table 7-52 lists the relation between the board feature code and optical interface type of the
ADL4.
Table 7-52 Relation between the board feature code and the optical interface type
Board

Feature Code

Optical Interface Type

SSN1ADL410

10

S-4.1

SSN1ADL411

11

L-4.1

SSN1ADL412

12

L-4.2

SSN1ADL413

13

Ve-4.2

7.12.7 Board Configuration Reference

You can use the T2000 to set parameters for the ADL4.
You can use the T2000 to set the following parameters for the ADL4:
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Port type

Flow type

Service type

Peak cell rate (PCR)

Sustainable cell rate (SCR)

Maximum cell burst size

Cell delay variation tolerance (CDVT)

For details on these parameters, refer to F Board Configuration Reference.

7.12.8 Technical Specifications

The technical specifications of the ADL4 cover the optical interface specifications, board
dimensions, weight and power consumption.

Optical Interface Specifications

Table 7-53 lists the specifications of the optical interfaces of the ADL4.
Table 7-53 Specifications of the optical interfaces of the ADL4
Item

Specification

Optical interface
type

S-4.1

L-4.1

L-4.2

Ve-4.2

Optical source
type

MLM

SLM

SLM

SLM

Transmission
distance (km)

215

1540

4080

80100

Wavelength (nm)

12741356

12801335

14801580

14801580

Overload optical
power (dBm)

Receiver
sensitivity (dBm)

23

28

28

33

Launched optical
power (dBm)

15 to 8

3 to +2

3 to +2

2 to +2

Laser Safety Class

The safety class of the laser on the board is CLASS 1.
The maximum launched optical power of the optical interfaces is lower than 10 dBm (10 mW).

Mechanical Specifications
The mechanical specifications of the ADL4 are as follows:
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l

Board dimensions (mm): 262.05 (H) x 220 (D) x 25.4 (W)

Weight (kg): 0.9

Power Consumption
In the normal temperature (25), the maximum power consumption of the ADL4 is 41 W.

7.13 ADQ1
This section describes the ADQ1, a 4 x STM-1 ATM processing board, in terms of the version,
function, principle, front panel, configuration and specifications.
7.13.1 Version Description
The functional version of the ADQ1 board is N1.
7.13.2 Function and Feature
The ADQ1 supports the ATM switching and ATM protection.
7.13.3 Working Principle and Signal Flow
The ADQ1 consists of the O/E converting module, physical layer module, ATM module and so
on.
7.13.4 Front Panel
On the front panel of the ADQ1, there are indicators, interfaces, barcode and laser safety class
label.
7.13.5 Valid Slots
The ADQ1 can be housed in any of slots 1213 in the OptiX OSN 1500A subrack. The ADQ1
can be housed in any of slots 1113 in the OptiX OSN 1500B subrack.
7.13.6 Board Feature Code
The code behind the board name in the barcode is the board feature code. The board feature code
of the ADQ1 indicates the optical interface type.
7.13.7 Board Configuration Reference
You can use the T2000 to set parameters for the ADQ1.
7.13.8 Technical Specifications
The technical specifications of the ADQ1 cover the optical interface specifications, board
dimensions, weight and power consumption.

7.13.1 Version Description

The functional version of the ADQ1 board is N1.

7.13.2 Function and Feature

The ADQ1 supports the ATM switching and ATM protection.
Table 7-54 lists the functions and features of the ADQ1.

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Table 7-54 Functions and features of the ADQ1

Function and
Feature

ADQ1

Basic function

Accesses and processes 4 x STM-1 ATM services.

Optical interface type

Supports the optical interfaces of the Ie-1, S-1.1, L-1.1, L-1.2 and
Ve-1.2 types.

Connector type

LC.

Optical module type

SFP.

E3 ATM interface

Supports 12 x E3 signals, which are accessed by the PD3/PL3/

N1PL3A.

IMA function

Not supported.

Max. uplink bandwidth

Supports 8 x VC-4, or 12 x VC-3 and 4 x VC-4.

ATM switching
capability

1.2 Gbit/s.

Mapping granularity

Supports VC-3, VC-4, or VC-4-Xv (X: 14).

Service type

Supports CBR, rt-VBR, nrt-VBR and UBR.

ATM connection

2048.

Statistical
multiplexing

Supported.

Flow type and QoS

Supports IETF RFC2514 and ATM forum TM4.0.

ATM multicast
connection

Supports spacial multicast and logical multicast.

ATM protection (ITUT I.630)

Supports unidirectional or bidirectional 1+1, 1:1, VP-Ring, VCRing protection schemes.

OAM function (ITU-T

I.610)

Supports AIS, RDI, LB , and CC.

Maintenance feature

Supports inloop and outloop at the ATM layer levels, supports

inloop at the optical interface, which are used for maintenance and
fault locating.

Alarm and
performance event

Provides rich alarms and performance events, which are used for
maintenance and fault locating.

7.13.3 Working Principle and Signal Flow

The ADQ1 consists of the O/E converting module, physical layer module, ATM module and so
on.
Figure 7-33 shows the block diagram for the functions of the ADQ1.

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Figure 7-33 Block diagram for the functions of the ADQ1

4x155 Mbit/s

4x155Mbit/s

E/O

high speed bus

PHY
module
4x155Mbit/s

ATM
module

4x155Mbit/s

O/E

Mapping
module
high speed bus

E3
module

LOS

Reference clock and frame header

Communication
and control module

Laser shut down

Cross-connet unit A

Communication

Cross-connet unit B

Cross-connet unit

Scc unit

50 MHz
77 MHz
100 MHz

Clock module
3.3 V

DC/DC
converter

Fuse

-48 V/ -60 V
-48 V/ -60 V

+1.2 V
Fuse
+1.5 V
+1.8 V

DC/DC
converter

+3.3 V backup
power

+2.5 V

The function modules are described as follows.

O/E Converting Module

In the receive direction, optical signals are converted to electrical signals. In the transmit
direction, electrical signals are converted to optical signals.

Physical Layer Module

The physical layer module mainly:
l

Mappings ATM cells into SDH frames

Demappings SDH frames to ATM cells

Processes ATM service physical layer functions: cell delimitation, test and generation of
HEC series

ATM Module
The ATM module mainly performs ATM layer functions in the ATM protocol. These functions
include:

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Flow control

Extraction and generation of cell headers

ATM switching
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E3 Module
The E3 module mainly processes the ATM services at E3 rate. This module:
l

Mappings the ATM cells into E3 containers

Demappings E3 containers to ATM cells

Perform ATM physical layer function to the ATM service at E3 rate

Mapping Module
The mapping module:
l

Mappings ATM cells into SDH frame payload

Demappings SDH frame payload to ATM cells

Supports ATM physical layer functions

Supports VC-4-Xv (X4) virtual concatenation

Communication and Control Module

The communication and control module:
l

Controls writing and reading of each chip

Communicates with the NE

Issues configured services

Reports alarms of each functional module

Checks R_LOS alarms of optical modules

Controls the shutting of transmission

Clock Module
This module mainly generates working clocks for each chip. The frequencies of the clocks are
50 MHz, 77 MHz and 100 MHz.

DC/DC Converter Module

Through the DC/DC module, the power unit generates required voltages for each chip on the
board. The following DC voltages are provided: +1.2 V, +1.5 V, +1.8 V, +2.5 V and +3.3 V. In
addition, this unit also provides protection for the board +3.3 V power supply.

7.13.4 Front Panel

On the front panel of the ADQ1, there are indicators, interfaces, barcode and laser safety class
label.

Appearance of the Front Panel

Figure 7-34 shows the appearance of the front panel of the ADQ1.
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Figure 7-34 Front panel of the ADQ1

ADQ1
STAT
ACT
PROG
SRV
CLASS 1
LASER
PRODUCT

OUT1
IN1
OUT2
IN2
OUT3
IN3
OUT4
IN4
ADQ1

Indicators
The following indicators are present on the front panel of the board:
l

Board hardware state indicator (STAT), which is green or red when lit.

Service activating state indicator (ACT), which is green when lit.

Board software state indicator (PROG), which is green or red when lit.

Service alarm indicator (SRV), which is red, green or yellow when lit.

For indication of these indicators, see A Equipment and Board Alarm Indicators.

Interfaces
There are four pairs of optical interfaces on the front panel of the ADQ1. Table 7-55 lists the
type and usage of the optical interfaces.

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Table 7-55 Optical interfaces of the ADQ1

Interface

Interface Type

Usage

OUT1/IN1

LC (pluggable)

Transmits and receives STM-1 optical signals.

OUT2/IN2

LC (pluggable)

Transmits and receives STM-1 optical signals.

OUT3/IN3

LC (pluggable)

Transmits and receives STM-1 optical signals.

OUT4/IN4

LC (pluggable)

Transmits and receives STM-1 optical signals.

7.13.5 Valid Slots

The ADQ1 can be housed in any of slots 1213 in the OptiX OSN 1500A subrack. The ADQ1
can be housed in any of slots 1113 in the OptiX OSN 1500B subrack.

7.13.6 Board Feature Code

The code behind the board name in the barcode is the board feature code. The board feature code
of the ADQ1 indicates the optical interface type.
Table 7-56 lists the relation between the board feature code and optical interface type for the
ADQ1.
Table 7-56 Relation between the board feature code and the optical interface type
Board

Feature Code

Optical Interface Type

SSN1ADQ110

10

S-1.1

SSN1ADQ111

11

L-1.1

SSN1ADQ112

12

L-1.2

SSN1ADQ113

13

Ve-1.2

SSN1ADQ114

14

Ie-1

7.13.7 Board Configuration Reference

You can use the T2000 to set parameters for the ADQ1.
You can use the T2000 to set the following parameters for the ADQ1:
l

Port type

Flow type

Service type

Peak cell rate (PCR)

Sustainable cell rate (SCR)

Maximum cell burst size

Cell delay variation tolerance (CDVT)

For details on the parameters, refer to F Board Configuration Reference.

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7.13.8 Technical Specifications

The technical specifications of the ADQ1 cover the optical interface specifications, board
dimensions, weight and power consumption.

Optical Interface Specifications

Table 7-57 lists the specifications of the optical interfaces of the ADQ1.
Table 7-57 Specifications of the optical interfaces of the ADQ1
Item

Specification

Optical
interface type

Ie-1

S-1.1

L-1.1

L-1.2

Ve-1.2

Optical source
type

MLM

MLM

MLM, SLM

SLM

SLM

Wavelength
(nm)

1260 to
1360

1261 to 1360

1263 to 1360

1480 to
1580

1480 to 1580

Transmission
distance (km)

0 to 0.5

2 to 15

15 to 40

40 to 80

80 to 100

Launched
optical power
(dBm)

19 to 14

15 to 8

5 to 0

5 to 0

3 to 0

Receiving
optical power
(dBm)

31

28

34

34

34

Overload
optical power
(dBm)

14

10

10

10

Laser Safety Class

The safety class of the laser on the board is CLASS 1.
The maximum launched optical power of the optical interfaces is lower than 10 dBm (10 mW).

Mechanical Specifications
The mechanical specifications of the ADQ1 are as follows:
l

Board dimensions (mm): 262.05 (H) x 220 (D) x 25.4 (W)

Weight (kg): 0.9

Power Consumption
In the normal temperature (25), the maximum power consumption of the ADQ1 is 37 W.
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7.14 IDL4
This section describes the IDL4, a 1 x STM-4 ATM processing board, in terms of the version,
function, principle, front panel, configuration and specifications.
7.14.1 Version Description
The functional version of the IDL4 board is N1.
7.14.2 Function and Feature
The IDL4 supports the ATM switching, IMA, and ATM protection.
7.14.3 Working Principle
The IDL4 consists of the O/E converting module, physical layer module, ATM module and so
on.
7.14.4 Front Panel
On the front panel of the IDL4, there are indicators, interfaces, barcode and laser safety class
label.
7.14.5 Valid Slots
The IDL4 can be housed in any of slots 1213 in the OptiX OSN 1500A subrack. The IDL4 can
be housed in any of slots 1113 in the OptiX OSN 1500B subrack.
7.14.6 Board Feature Code
The code behind the board name in the barcode is the board feature code. The board feature code
of the IDL4 indicates the optical interface type.
7.14.7 Board Protection
The IDL4 supports the 1+1 board-level protection. The active and standby IDL4 should be
housed in paired slots.
7.14.8 Board Configuration Reference
You can use the T2000 to set parameters for the IDL4.
7.14.9 Technical Specifications
The technical specifications of the IDL4 cover the optical interface specifications, board
dimensions, weight and power consumption.

7.14.1 Version Description

The functional version of the IDL4 board is N1.

7.14.2 Function and Feature

The IDL4 supports the ATM switching, IMA, and ATM protection.
Table 7-58 lists the functions and features of the IDL4.

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Table 7-58 Functions and features of the IDL4

Function and
Feature

IDL4

Basic function

Accesses and processes 1 x STM-4 ATM services.

Optical interface
type

Supports the optical interfaces of the S-4.1, L-4.1, L-4.2 and Ve-4.2
types.

Connector type

LC.

Optical module
type

SFP.

E3 ATM interface

Not supported.

IMA function
(ATM Forum IMA
1.1 standard)

Accesses and processes IMA services when used with E1 service

processing board N1PQ1/N1PQM.
Supports a maximum of 63 IMA E1 services.
One ATM port supports a maximum of 16 IMA groups. Each IMA group
supports 132 E1 signals.
One ATM port supports a maximum of E1 links of 16 non-IMA groups.
The maximum IMA multichannel delay is 226 ms.

Max. uplink
bandwidth

Supports 8 x VC-4, or 63 x VC-12 and +7 x VC-4.

ATM switching
capability

1.0 Gbit/s.

Mapping
granularity

Supports VC-12, VC-4, or VC-4-Xc (X:14), VC-12-Xv (X:132).

IMA feature

Accesses and processes IMA services when used with E1 service

processing board.
Processes IMA services for a maximum of 63 x E1 signals.
Supports a maximum of 16 IMA groups. Each IMA group supports 1
32 E1 signals.
The maximum IMA multichannel delay is 226 ms.

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Service type

Supports CBR, rt-VBR, nrt-VBR and UBR.

ATM connection

2048.

Statistical
multiplexing

Supported.

Flow type and QoS

Supports IETF RFC2514 and ATM forum TM4.0.

ATM multicast
connection

Supports spacial multicast and logical multicast.

ATM protection
(ITU-T I.630)

Supports unidirectional or bidirectional 1+1, 1:1, VP-Ring, VC-Ring

protection schemes.

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Function and
Feature

IDL4

Board level 1+1

protection

Supported.

OAM function
(ITU-T I.610)

Supports AIS, RDI, LB , and CC.

Maintenance
feature

Supports inloop and outloop at the ATM layer levels, supports inloop
at the optical interface, which are used for maintenance and fault
locating.

Alarm and
performance event

Provides rich alarms and performance events, which are used for
maintenance and fault locating.

Note: The IMA function can encapsulate ATM cells into E1 signals. The IMA group can
coexist with single E1. The IMA group can dynamically increase or decrease the bandwidth
to enhance the bandwidth utilization. The IMA group can also converge 2M services, and can
connect to other IMA equipment.

7.14.3 Working Principle

The IDL4 consists of the O/E converting module, physical layer module, ATM module and so
on.
Figure 7-35 shows the block diagram for the functions of the IDL4.
Figure 7-35 Block diagram for the functions of the IDL4

622 Mbit/s

E/O

high speed bus

622 Mbit/s

Cross-connet unit A

PHY
module

ATM
module

high speed bus

IMA
module

O/E
622 Mbit/s

Mapping
module

622 Mbit/s

LOS

Communication
and control module

Laser shut down

Cross-connet unit B

Reference clock and frame header

Communication

Cross-connet unit
Scc unit

50 MHz
77 MHz
100 MHz

Clock
module
+3.3 V

+1.2 V
+1.5 V
+1.8 V
+2.5 V

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DC/DC
converter

Fuse

-48 V/ -60 V
Fuse

DC/DC
converters

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-48 V/ -60 V

+3.3 V backup
power

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E/O Converting Module

The E/O converting module is responsible for E/O conversion.

Physical Layer Module

The physical layer module mainly:
l

Mappings ATM cells into SDH frames

Demappings SDH frames to ATM cells

Processes ATM service physical layer functions: cell delimitation, test and generation of
header error control (HEC) sequence

ATM Module
The ATM module mainly performs ATM layer functions in the ATM protocol. These functions
include:
l

Flow control

Extraction and generation of cell headers

ATM switching

IMA Module
This module mainly performs IMA protocol functions. These functions are:
l

Separation and re-creation of ATM cells

Frame synchronization

Insertion and extraction of IMA control protocol (ICP) cells

Management of IMA groups

Mapping Module
The mapping module:
l

Mappings ATM cells into SDH frame payload

Demappings SDH frame payload to ATM cells

Supports ATM physical layer functions

Supports VC-4-Xv (X4) virtual concatenation

Communication and Control Module

The communication and control module:

7-116

Controls writing and reading of each chip

Communicates with the NE

Issues configured services

Reports alarms of each functional module

Checks R_LOS alarms of optical modules

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7 Data Processing Boards

Controls the shutting of transmission

Clock Module
This module mainly generates working clocks for each chip. The frequencies of the clocks are
50 MHz, 77 MHz and 100 MHz.

DC/DC Converter Module

Through the DC/DC module, the power unit generates required voltages for each chip on the
board. The following DC voltages are provided: +1.2 V, +1.5 V, +1.8 V, +2.5 V and +3.3 V. In
addition, this unit also provides protection for the board +3.3 V power supply.

7.14.4 Front Panel

On the front panel of the IDL4, there are indicators, interfaces, barcode and laser safety class
label.

Appearance of the Front Panel

Figure 7-36 shows the appearance of the front panel of the IDL4.
Figure 7-36 Front panel of the IDL4

IDL4
STAT
ACT
PROG
SRV

CLASS 1
LASER
PRODUCT

OUT1 IN1
IDL4

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Indicators
The following indicators are present on the front panel of the board:
l

Board hardware state indicator (STAT), which is green or red when lit.

Service activating state indicator (ACT), which is green when lit.

Board software state indicator (PROG), which is green or red when lit.

Service alarm indicator (SRV), which is red, green or yellow when lit.

For indication of these indicators, see A Equipment and Board Alarm Indicators.

Interfaces
There are one optical interface on the front panel of the IDL4. Table 7-59 lists the type and
usage of the optical interface.
Table 7-59 Optical interface of the IDL4
Interface

Interface
Type

Usage

OUT1/IN1

LC
(pluggable)

Transmits and receives STM-4 optical signals.

7.14.5 Valid Slots

The IDL4 can be housed in any of slots 1213 in the OptiX OSN 1500A subrack. The IDL4 can
be housed in any of slots 1113 in the OptiX OSN 1500B subrack.

7.14.6 Board Feature Code

The code behind the board name in the barcode is the board feature code. The board feature code
of the IDL4 indicates the optical interface type.
Table 7-60 lists the relation between the board feature code and optical interface type for the
IDL4.
Table 7-60 Relation between the board feature code and the optical interface type
Board

Feature Code

Optical Interface Type

SSN1IDL410

10

S-4.1

SSN1IDL411

11

L-4.1

SSN1IDL412

12

L-4.2

SSN1IDL413

13

Ve-4.2

7.14.7 Board Protection

The IDL4 supports the 1+1 board-level protection. The active and standby IDL4 should be
housed in paired slots.
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The paired slots for the IDL4 are slots 13 and 12.

7.14.8 Board Configuration Reference

You can use the T2000 to set parameters for the IDL4.
You can use the T2000 to set the following parameters for the IDL4:
l

Port type

Flow type

Service type

Peak cell rate (PCR)

Sustainable cell rate (SCR)

Maximum cell burst size

Cell delay variation tolerance (CDVT)

For details on the parameters, refer to F Board Configuration Reference.

7.14.9 Technical Specifications

The technical specifications of the IDL4 cover the optical interface specifications, board
dimensions, weight and power consumption.

Optical Interface Specifications

Table 7-61 lists the specifications of the optical interfaces of the IDL4.
Table 7-61 Specifications of the optical interfaces of the IDL4
Item

Specification

Optical interface
type

S-4.1

L-4.1

L-4.2

Ve-4.2

Optical source type

MLM

SLM

SLM

SLM

Wavelength (nm)

1274 to 1356

1280 to 1335

1480 to 1580

1480 to 1580

Transmission
distance (km)

2 to 15

15 to 40

40 to 80

80 to 100

Launched optical
power (dBm)

15 to 8

3 to +2

3 to +2

3 to +2

Receiver sensitivity
(dBm)

28

28

28

33

Overload optical
power (dBm)

13

Laser Safety Class

The safety class of the laser on the board is CLASS 1.
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The maximum launched optical power of the optical interfaces is lower than 10 dBm (10 mW).

Mechanical Specifications
The mechanical specifications of the IDL4 are as follows:
l

Board dimensions (mm): 262.05 (H) x 220 (D) x 25.4 (W)

Weight (kg): 1.0

Power Consumption
In the normal temperature (25), the maximum power consumption of the IDL4 is 41 W.

7.15 IDQ1
This section describes the IDQ1, a 4 x STM-1 ATM processing board, in terms of the version,
function, principle, front panel, configuration and specifications.
7.15.1 Version Description
The functional version of the IDQ1 board is N1.
7.15.2 Function and Feature
The IDQ1 supports the ATM switching, IMA, and ATM protection.
7.15.3 Working Principle and Signal Flow
The ADQ1 consists of the O/E converting module, physical layer module, ATM module and so
on.
7.15.4 Front Panel
On the front panel of the IDQ1, there are indicators, interfaces, barcode and laser safety class
label.
7.15.5 Valid Slots
The IDQ1 can be housed in any of slots 1213 in the OptiX OSN 1500A subrack. The IDQ1
can be housed in any of slots 1113 in the OptiX OSN 1500B subrack.
7.15.6 Board Feature Code
The code behind the board name in the barcode is the board feature code. The board feature code
of the IDQ1 indicates the optical interface type.
7.15.7 Board Protection
The IDQ1 supports the 1+1 board-level protection. The active and standby IDQ1 should be
housed in paired slots.
7.15.8 Board Configuration Reference
You can use the T2000 to set parameters for the IDQ1.
7.15.9 Technical Specifications
The technical specifications of the IDQ1 cover the optical interface specifications, board
dimensions, weight and power consumption.

7.15.1 Version Description

The functional version of the IDQ1 board is N1.
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7.15.2 Function and Feature

The IDQ1 supports the ATM switching, IMA, and ATM protection.
Table 7-62 lists the functions and features of the IDQ1.
Table 7-62 Functions and features of the IDQ1
Function and
Feature

IDQ1

Basic function

Accesses and processes 4 x STM-1 ATM services.

Optical interface
type

Supports the optical interfaces of the Ie-1, S-1.1, L-1.1, L-1.2 and Ve-1.2
types.

Connector type

LC.

Optical module
type

SFP.

E3 ATM interface

Not supported.

IMA function
(ATM Forum IMA
1.1 standard)

Accesses and processes IMA services when used with E1 service

processing board N1PQ1/N1PQM.
Supports a maximum of 63 IMA E1 services.
One ATM port supports a maximum of 16 IMA groups. Each IMA group
supports 132 E1 signals.
One ATM port supports a maximum of E1 links of 16 non-IMA groups.
The maximum IMA multichannel delay is 226 ms.

Max. uplink
bandwidth

Supports 8 x VC-4, or 63 x VC-12 and 7 x VC-4.

ATM switching
capability

1.0 Gbit/s.

Mapping
granularity

Suppports VC-12, VC-4, or VC-4-Xc (X:14), VC-12-Xv (X:132).

IMA feature

Accesses and processes IMA services when used with E1 service

processing board.
Processes IMA services for a maximum of 63 x E1 signals.
Supports a maximum of 16 IMA groups. Each IMA group supports 1
32 E1 signals.
The maximum IMA multichannel delay is 226 ms.

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Service type

Supports CBR, rt-VBR, nrt-VBR and UBR.

ATM connection

2048.

Statistical
multiplexing

Supported.

Flow type and QoS

Supports IETF RFC2514 and ATM forum TM4.0.

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Function and
Feature

IDQ1

ATM multicast
connection

Supports spacial multicast and logical multicast.

ATM protection
(ITU-T I.630)

Supports unidirectional or bidirectional 1+1, 1:1, VP-Ring, VC-Ring

protection schemes.

Board level 1+1

protection

Supported.

OAM function
(ITU-T I.610)

Supports AIS, RDI, LB , and CC.

Maintenance
feature

Supports inloop and outloop at the ATM layer levels, supports inloop
at the optical interface, which are used for maintenance and fault
locating.

Alarm and
performance event

Provides rich alarms and performance events, which are used for
maintenance and fault locating.

Note: The IMA function can encapsulate ATM cells into E1 signals. The IMA group can
coexist with single E1. The IMA group can dynamically increase or decrease the bandwidth
to enhance the bandwidth utilization. The IMA group can also converge 2M services, and can
connect to other IMA equipment.

7.15.3 Working Principle and Signal Flow

The ADQ1 consists of the O/E converting module, physical layer module, ATM module and so
on.
Figure 7-37 shows the block diagram for the functions of the IDQ1.

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Figure 7-37 Block diagram for the functions of the IDQ1

4 x 155
Mbit/s

4 x 155
Mbit/s

E/O

O/E

4 x 155
Mbit/s

4 x 155
Mbit/s

high speed bus

Cross-connet unit A

PHY
module

ATM
module

Mapping
module
high speed bus

IMA
module

LOS

Communication
and control module

Laser shut down

Cross-connet unit B

Reference clock and frame header

Communication

Cross-connet unit
Scc unit

50 MHz
77 MHz
100 MHz

Clock
module
+3.3 V

+1.2 V
+1.5 V
+1.8 V
+2.5 V

DC/DC
converter

Fuse

-48 V/ -60 V
Fuse

DC/DC
converters

-48 V/ -60 V

+3.3 V backup
power

E/O Converting Module

The E/O converting module is responsible for E/O conversion.

Physical Layer Module

The physical layer module mainly:
l

Mappings ATM cells into SDH frames

Demappings SDH frames to ATM cells

Processes ATM service physical layer functions: cell delimitation, test and generation of
header error control (HEC) sequence

ATM Module
The ATM module mainly performs ATM layer functions in the ATM protocol. These functions
include:
l

Flow control

Extraction and generation of cell headers

ATM switching

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IMA Module
This module mainly performs IMA protocol functions. These functions are:
l

Separation and re-creation of ATM cells

Frame synchronization

Insertion and extraction of IMA control protocol (ICP) cells

Management of IMA groups

Mapping Module
The mapping module:
l

Mappings ATM cells into SDH frame payload

Demappings SDH frame payload to ATM cells

Supports ATM physical layer functions

Supports VC-4-Xv (X4) virtual concatenation

Communication and Control Module

The communication and control module:
l

Controls writing and reading of each chip

Communicates with the NE

Issues configured services

Reports alarms of each functional module

Checks R_LOS alarms of optical modules

Controls the shutting of transmission

Clock Module
This module mainly generates working clocks for each chip. The frequencies of the clocks are
50 MHz, 77 MHz and 100 MHz.

DC/DC Converter Module

Through the DC/DC module, the power unit generates required voltages for each chip on the
board. The following DC voltages are provided: +1.2 V, +1.5 V, +1.8 V, +2.5 V and +3.3 V. In
addition, this unit also provides protection for the board +3.3 V power supply.

7.15.4 Front Panel

On the front panel of the IDQ1, there are indicators, interfaces, barcode and laser safety class
label.

Appearance of the Front Panel

Figure 7-38 shows the appearance of the front panel of the IDQ1.
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Figure 7-38 Front panel of the IDQ1

IDQ1
STAT
ACT
PROG
SRV
CLASS 1
LASER
PRODUCT

OUT1
IN1
OUT2
IN2
OUT3
IN3
OUT4
IN4
IDQ1

Indicators
The following indicators are present on the front panel of the board:
l

Board hardware state indicator (STAT), which is green or red when lit.

Service activating state indicator (ACT), which is green when lit.

Board software state indicator (PROG), which is green or red when lit.

Service alarm indicator (SRV), which is red, green or yellow when lit.

For indication of these indicators, see A Equipment and Board Alarm Indicators.

Interfaces
There are four optical interfaces on the front panel of the IDQ1. Table 7-63 lists the type and
usage of the optical interfaces.

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Table 7-63 Optical interfaces of the IDQ1

Interface

Interface Type

Usage

OUT1/IN1

LC (pluggable)

Transmits and receives STM-1 optical signals.

OUT2/IN2

LC (pluggable)

Transmits and receives STM-1 optical signals.

OUT3/IN3

LC (pluggable)

Transmits and receives STM-1 optical signals.

OUT4/IN4

LC (pluggable)

Transmits and receives STM-1 optical signals.

7.15.5 Valid Slots

The IDQ1 can be housed in any of slots 1213 in the OptiX OSN 1500A subrack. The IDQ1
can be housed in any of slots 1113 in the OptiX OSN 1500B subrack.

7.15.6 Board Feature Code

The code behind the board name in the barcode is the board feature code. The board feature code
of the IDQ1 indicates the optical interface type.
Table 7-64 lists the relation between the board feature code and optical interface type for the
IDQ1.
Table 7-64 Relation between the board feature code and the optical interface type
Board Barcode

Feature Code

Optical Interface Type

SSN1IDQ110

10

S-1.1

SSN1IDQ111

11

L-1.1

SSN1IDQ112

12

L-1.2

SSN1IDQ113

13

Ve-1.2

SSN1IDQ114

14

Ie-1

7.15.7 Board Protection

The IDQ1 supports the 1+1 board-level protection. The active and standby IDQ1 should be
housed in paired slots.
The paired slots for the IDQ1 are slots 13 and 12.

7.15.8 Board Configuration Reference

You can use the T2000 to set parameters for the IDQ1.
You can use the T2000 to set the following parameters for the IDQ1:

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Port type

Flow type

Service type
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Peak cell rate (PCR)

Sustainable cell rate (SCR)

Maximum cell burst size

Cell delay variation tolerance (CDVT)

7 Data Processing Boards

For details on the parameters, refer to F Board Configuration Reference.

7.15.9 Technical Specifications

The technical specifications of the IDQ1 cover the optical interface specifications, board
dimensions, weight and power consumption.

Optical Interface Specifications

Table 7-65 lists the specifications of the optical interfaces of the IDQ1.
Table 7-65 Specifications of the optical interfaces of the IDQ1
Item

Specification

Optical
interface type

Ie-1

S-1.1

L-1.2

Ve-1.2

L-1.1

Optical source
type

MLM

MLM

SLM

SLM

MLM, SLM

Wavelength
(nm)

1260 to
1360

1261 to 1360

1480 to
1580

1480 to 1580

1263 to 1360

Transmission
distance (km)

0 to 0.5

2 to 15

40 to 80

80 to 100

15 to 40

Launched
optical power
(dBm)

19 to 14

15 to 8

5 to 0

3 to 0

5 to 0

Receiver
sensitivity
(dBm)

31

28

34

34

34

Overload
optical power
(dBm)

14

10

10

10

Laser Safety Class

The safety class of the laser on the board is CLASS 1.
The maximum launched optical power of the optical interfaces is lower than 10 dBm (10 mW).

Mechanical Specifications
The mechanical specifications of the IDQ1 are as follows:
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l

Board dimensions (mm): 262.05 (H) x 220 (D) x 25.4 (W)

Weight (kg): 1.0

Power Consumption
In the normal temperature (25), the maximum power consumption of the IDQ1 is 41 W.

7.16 MST4
This section describes the MST4, a 4-channel multi-service transparent transmission board, in
terms of the version, function, principle, front panel, configuration and specifications.
7.16.1 Version Description
The functional version of the MST4 board is N1.
7.16.2 Function and Feature
The MST4 is used to access multiple services, and to maintain alarms.
7.16.3 Working Principle and Signal Flow
The MST4 consists of the client-side access module, FC protocol processing module,
encapsulation and mapping module, Communication and control module and so on.
7.16.4 Front Panel
On the front panel of the MST4, there are indicators, interfaces and barcode.
7.16.5 Valid Slots
The MST4 can be housed in any of slots 1213 in the OptiX OSN 1500A subrack. The MST4
can be housed in any of slots 1113 in the OptiX OSN 1500B subrack.
7.16.6 Board Feature Code
The code behind the board name in the barcode is the board feature code. The board feature code
of the MST4 indicates the service type, optical interface type and transmission distance.
7.16.7 Board Configuration Reference
You can use the T2000 to set parameters for the MST4.
7.16.8 Technical Specifications
The specifications of the MST4 cover the optical interface specifications, mechanical
specifications and power consumption.

7.16.1 Version Description

The functional version of the MST4 board is N1.

7.16.2 Function and Feature

The MST4 is used to access multiple services, and to maintain alarms.
Table 7-66 lists the functions and features of the MST4.

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Table 7-66 Functions and features of the MST4

Function and
Feature

MST4

Basic function

Provides four independent ports to access multiple services, and supports

the transparent transmission of the SAN and Video services.

Connector type

LC.

Optical module
type

SFP.

Service type

Supports the FC100/FICON, FC200, ESCON, and DVB-ASI

services.Table 7-67 lists types and rates of the services.
Accesses four-channel FC services (FC100/FICON and FC200) at the
same time, and the total bandwidth is less than 2.5 Gbit/s.
Supports the full-rate transmission of the FC services (one-channel FC200
services or two-channel FC100 services).
Accesses four-channel ESCON or DVB-ASI services, and the total
bandwidth is less than 2.5 Gbit/s.

Distance
extension

The first and second ports support the distance extension function at the
SDH side. (FC100: 3000 km; FC200: 1500 km)

Max. uplink
bandwidth

2.5 Gbit/s (Four 622 Mbit/s buses are present on the backplane to directly
connect to the cross-connect unit.)

Mapping
granularity

Supports VC-4-Xc (X: 4, 8, 16).

ESCON

Accesses four-channel ESCON services, and the total bandwidth is less

than 2.5 Gbit/s.

DVB-ASI

Accesses four-channel DVB-ASI services, and the total bandwidth is less

than 2.5 Gbit/s.

Encapsulation
format

Supports GFP-T, compliant with ITU-T G.7041.

Maintenance
feature

Supports the inloop and outloop at the port level of the client side. The
loopack is used for maintenance and fault locating.

Alarm and
performance
event

Provides rich alarms and performance events, which are used for
maintenance and fault locating.

Table 7-67 Services and service rates provided by the MST4

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Service Type

Rate

Remarks

FC100/FICON

1062.5 Mbit/s

SAN service

FC200

2125 Mbit/s

SAN service

ESCON

200 Mbit/s.

SAN service.

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Service Type

Rate

Remarks

DVB-ASI

270 Mbit/s

Video service

7.16.3 Working Principle and Signal Flow

The MST4 consists of the client-side access module, FC protocol processing module,
encapsulation and mapping module, Communication and control module and so on.
Figure 7-39 shows the block diagram for the functions of the MST4.
Figure 7-39 Block diagram for the functions of the MST4

FC50
FC100
FC200
FICON
DVB-ASI
ESCON

FC1_
RCV

Clientside
access
module

FC2

FC1_
SND

Cross-connect
unit A/B

Encaps
ulation
Mapping

FC1_
SND

FC2

FC1_
RCV

Decaps
ulation

Interface
conversion
module

Cross-connect
unit A/B

FC processing module
Encapsulation and
mapping module
Communication

Communication and control

module

100 MHz
125 MHz
135 MHz
212.5 MHz
622 MHz

SCC unit

Reference clock and frame header

Crossconnect unit

Clock
module
+3.3 V
+1.2 V
+1.5 V
+1.8 V
+2.5 V

DC/DC
converter
DC/DC
converter

Fuse

-48 V/ -60 V
-48 V/ -60 V

Fuse

+3.3 V backup
power

The function modules are described as follows:

Client-side Access Module

The client-side access module accesses FC50, FC100, FC200, FICON, DVB-ASI and ESCON
services. The client-side interface unit performs O/E conversion for services and monitors the
optical signals at client side.
In the upstream direction, the client-side data interface (CDI) receives serial data signals input
by the SFP optical module. The serial data signals are then transmitted to the PCS function
module for physical layer and 8B/10B line performance monitoring.
In the downstream direction, 8B/ 10B conversion is performed to the signals from FC. The
signals are then adapted into client reference clock by inserting or discarding idle packets. After
being converted from parallel signals to serial signals, the signals are transmitted through the
CDI interface to the optical module at client side.

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FC protocol Processing Module

The FC protocol processing unit mainly extends the distance the FC services. This module
supports transmitting 2 x FC100 services up to 3,000 km or 1 x FC200 services up to 1500 km.
The FC protocol processing unit performs FC1 layer and FC2 layer functions. The FC1 layer
functions include:
l

8B/10B conversion

Synchronous processing

Extraction of primitive signal and primitive sequence

The FC2 layer functions include:

l

Check and statistics of all special frames

Modification of values of some special frames (FLOG1, PLOG1 and ELP)

CRC check

Encapsulation and Mapping Module

The encapsulation and mapping module mainly:
l

Encapsulates and mappings data

Decapsulates and demappings data

According to signal flow direction, the function modules inside the chip can be classified into
modules in ingress direction and ones in egress direction. The ingress direction is for processing
from client side to line side. The egress direction is for line-side processing.
Ingress direction:
Through GFP-T encapsulation, 64B/65B conversion is performed to data bytes after decoding.
The data bytes are then mapped under GFP-T protocol.
Egress direction:
SDH data frames are received from the line-side interface module. After the overhead is
processed, GFP-T data frames are extracted from SDH concatenated channels and then are
transmitted to the decapsulating module for decapsulation.

Communication and Control Module

The communication and control module consists of CPU, register, oscillator, Ethernet port and
HDLC controller. This module connects to external circuits through bus. The communication
and control module manages and configures other modules of the boards. This module contains
basic logic units:
l

Writes and reads register

Provides interface for CPU

Checks and selects clock

Performs phase discrimination and frequency division to the clock

Checks the in-service state of the cross-connect, the SCC and the line boards

Checks reset control circuits of each chip

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l

Controls the shutting down of the optical module

Processes communications

Controls indicators

System Clock Module

This module provides required reference clocks for boards. The clock frequencies are 100 MHz,
125 MHz and so on.

DC/DC Converter Module

Through the DC/DC module, the power unit generates direct currents for each chip on the board.
The 48 V/ 60 V powers are converted to the following direct currents: +1.2 V, +1.8 V, +2.5
V and +3.3 V. In addition, this unit also provides protection for the board +3.3 V power.

7.16.4 Front Panel

On the front panel of the MST4, there are indicators, interfaces and barcode.

Appearance of the Front Panel

Figure 7-40 shows the appearance of the front panel of the MST4.
Figure 7-40 Front panel of the MST4
MST4
STAT
ACT
PROG
SRV

OUT1 IN1
OUT2 IN2
OUT3 IN3
OUT4 IN4

MST4

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Indicators
The following indicators are present on the front panel of the board:
l

Board hardware state indicator (STAT), which is green or red when lit.

Service activating state indicator (ACT), which is green when lit.

Board software state indicator (PROG), which is green or red when lit.

Service alarm indicator (SRV), which is red, green or yellow when lit.

For indication of these indicators, see A Equipment and Board Alarm Indicators.

Interfaces
There are four pairs of optical interfaces on the front panel of the MST4. Table 7-68 lists the
type and usage of the optical interfaces.
Table 7-68 Optical interfaces of the MST4
Interface

Interface
Type

Usage

IN1-IN4

LC

Receives multi-service optical signals.

OUT1-OUT4

LC

Transmits multi-service optical signals.

7.16.5 Valid Slots

The MST4 can be housed in any of slots 1213 in the OptiX OSN 1500A subrack. The MST4
can be housed in any of slots 1113 in the OptiX OSN 1500B subrack.

7.16.6 Board Feature Code

The code behind the board name in the barcode is the board feature code. The board feature code
of the MST4 indicates the service type, optical interface type and transmission distance.
Table 7-69 lists the relation between the board feature code and service type.
Table 7-69 Relation between the board feature code and service type

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Board Barcode

Feature
Code

Service Type (Optical Interface

Type)

Transmission
Distance

SSN1MST410

10

2 x FC (SM)

2 km

SSN1MST411

11

2 x FC (SM)

15 km

SSN1MST412

12

2 x FC (MM)

0.5 km

SSN1MST413

13

4 x ESCON/DVB-ASI (SM)

15 km

SSN1MST414

14

4 x ESCON/DVB-ASI (MM)

2 km

SSN1MST415

15

1 x FC2 (MM)

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Board Barcode

Feature
Code

Service Type (Optical Interface

Type)

Transmission
Distance

ESCON/DVB-ASI (MM)
SSN1MST416

16

1 x FC2 (MM)

ESCON/DVB-ASI (SM)
SSN1MST417

SSN1MST418

17

18

1 x FC (SM)

2 km

2 x ESCON/DVB-ASI (SM)

1 x FC (SM)

2 km

2 x ESCON/DVB-ASI (MM)

7.16.7 Board Configuration Reference

You can use the T2000 to set parameters for the MST4.
You can use the T2000 to set the following parameters for the MST4:
l

J1 byte

C2 byte

For details on the parameters, refer to F Board Configuration Reference.

7.16.8 Technical Specifications

The specifications of the MST4 cover the optical interface specifications, mechanical
specifications and power consumption.

Optical Interface Specifications

The optical interfaces of the MST4 can use several types of the optical interfaces. Table 7-70
lists the specifications of the optical interfaces.
Table 7-70 Specifications of the optical interfaces of the MST4
Item

Specification

Optical interface
type

X3.296/(DVB-ASI )
EN50083-9
200-M5-SN-I

7-134

200-SM-LC-I

Optical module
code

34060277

34060287

34060325

34060288

Service type

ESCON/DVB

Service rate

STM-4

STM-1

2.125 Gbit/s

STM-16

Optical source
type

SLM

LED

LED

MLM

34060278

FC200, FC100

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Item

Specification

Wavelength
(nm)

1310

Transmission
distance (km)

15

Max. launched
optical power
(dBm)

7 Data Processing Boards

850

1310

0.5

15

14

-2.5

-3

Min. launched
optical power
(dBm)

15

19

-9.5

-10

-5

Receiver
sensitivity
(dBm)

31

30

17

21

Overload optical
power (dBm)

14

Mechanical Specifications
The mechanical specifications of the MST4 are as follows:
l

Board dimensions (mm): 262.05 (H) x 220 (D) x 25.4 (W)

Weight (kg): 0.9

Power Consumption
In the normal temperature (25), the maximum power consumption of the MST4 is 26 W.

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Interface Boards and Switching Boards

About This Chapter

This chapter describes the interface and switching boards. The interface boards are used to access
cables and fibers. The switching boards are used to provide the TPS protection.
8.1 L12S
This section describes the L12S, a 16 x E1/T1 electrical interface switching board, in terms of
the version, function, principle, front panel and specifications.
8.2 D12B
This section describes the D12B, a 32 x E1/T1 electrical interface board, in terms of the version,
function, principle, front panel and specifications.
8.3 D12S
This section describes the D12S, a 32 x E1/T1 electrical interface switching board, in terms of
the version, function, principle, front panel and specifications.
8.4 L75S
This section describes the L75S, a 16 x E1 electrical interface switching board, in terms of the
version, function, principle, front panel and specifications.
8.5 D75S
This section describes the D75S, a 32 x E1/T1 electrical interface switching board, in terms of
the version, function, principle, front panel and specifications.
8.6 D34S
This section describes the D34S, a 6 x E3/T3 electrical interface switching board, in terms of
the version, function, principle, front panel and specifications.
8.7 C34S
This section describes the C34S, a 3 x E3/T3 electrical interface switching board, in terms of
the version, function, principle, front panel and specifications.
8.8 EU04
This section describes the EU04, a 4 x STM-1 electrical interface board, in terms of the version,
function, working principle, front panel and specifications.
8.9 EU08
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This section describes the EU08, an 8 x STM-1 electrical interface board, in terms of the version,
function, working principle, front panel and specifications.
8.10 OU08
This section describes the OU08, an 8 x STM-1 optical interface board, in terms of the version,
function, working principle, front panel and parameters.
8.11 MU04
This section describes the MU04, a 4 x E4/STM-1 electrical interface board, in terms of the
version, function, principle, front panel and specifications.
8.12 TSB8
This section describes the TSB8, an 8-channel optical interface switching board, in terms of the
version, function, principle, front panel and specifications.
8.13 EFF8
This section describes the EFF8, an 8 x 100M Ethernet optical interface board, in terms of the
version, function, principle, front panel and specifications.
8.14 ETF8
This section describes the ETF8, an 8 x 100M Ethernet twisted pair interface board, in terms of
the version, function, principle, front panel and specifications.
8.15 ETS8
This section describes the ETS8, an 8 x 10/100M Ethernet twisted pair interface switching board,
in terms of the version, function, principle, front panel and specifications.
8.16 DM12
This section describes the DM12, a DDN interface board, in terms of the version, function,
principle, front panel and specifications.

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8.1 L12S
This section describes the L12S, a 16 x E1/T1 electrical interface switching board, in terms of
the version, function, principle, front panel and specifications.
8.1.1 Version Description
The functional version of the L12S is R1.
8.1.2 Function and Feature
The L12S is used to receive and transmit 16 x E1/T1 electrical signals, and the L12S must be
used with the PD1.
8.1.3 Working Principle and Signal Flow
The L12S consists of the interface module, switch matrix module, and power supply module.
8.1.4 Front Panel
On the front panel of the L12S, there are interfaces and barcode.
8.1.5 Valid Slots
As the interface board for the PD1, the L12S can be housed in any of slots 6 and 7 in the OptiX
OSN 1500A subrack.
8.1.6 Technical Specifications
The technical specifications of the L12S cover the board dimensions, weight and power
consumption.

8.1.1 Version Description

The functional version of the L12S is R1.

8.1.2 Function and Feature

The L12S is used to receive and transmit 16 x E1/T1 electrical signals, and the L12S must be
used with the PD1.

8.1.3 Working Principle and Signal Flow

The L12S consists of the interface module, switch matrix module, and power supply module.
Figure 8-1 shows the block diagram for the functions of the L12S.
Figure 8-1 Block diagram for the functions of the L12S
Backplane
Crossconnect
board
E1/T1

Swictch
matrix
module

Interface
module

PD1

E1/T1

+3.3 V

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PD1

Power
supply
module

Fuse

+3.3 V

Power

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Interface Module
The interface module receives and transmits the E1/T1 electrical signals.

Switch Matrix Module

In the receive direction, the switch matrix module accesses signals from the interface module,
and selects the output direction of the signals according to the TPS protection control signals
from the cross-connect board. When the TPS protection is not performed, the switch matrix
module transmits the signals to the PD1 board. When the TPS protection is performed, the switch
matrix module transmits the signals to the protection board for bridging.
In the transmit direction, the working direction of the switch matrix module is the reverse of the
receive direction.

Power Supply Module

The power supply module provides the DC voltages required by the modules of the board.

8.1.4 Front Panel

On the front panel of the L12S, there are interfaces and barcode.

Appearance of the Front Panel

Figure 8-2 shows the appearance of the front panel of the L12S.
Figure 8-2 Front panel of the L12S

L12S

1-16

Interfaces
On the front panel of the L12S, there are two 2mmHM connectors, which are used to access 16
x E1/T1 electrical signals.

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8.1.5 Valid Slots

As the interface board for the PD1, the L12S can be housed in any of slots 6 and 7 in the OptiX
OSN 1500A subrack.
Table 8-1 lists the valid slots for the PD1 and corresponding slots for the L12S. The L12S housed
in the slot with a smaller number accesses the first 16 (116) channels of E1/T1 electrical signals.
The L12S housed in the slot with a larger number accesses the last 16 (1732) channels of E1/
T1 electrical signals.
Table 8-1 Valid slots for the PD1 and corresponding slots for the L12S in the OptiX OSN 1500A
subrack
Valid Slot for the PD1

Corresponding Slot for the L12S

Slot 12

Slots 6 and 7

8.1.6 Technical Specifications

The technical specifications of the L12S cover the board dimensions, weight and power
consumption.

Mechanical Specifications
The mechanical specifications of the L12S are as follows:
l

Board dmensions (mm): 111.8 (H) x 220 X (D) x 25.4 (W)

Weight (kg): 0.27

Power Consumption
In the normal temperature (25), the maximum power consumption of the L12S is 4.5 W.

8.2 D12B
This section describes the D12B, a 32 x E1/T1 electrical interface board, in terms of the version,
function, principle, front panel and specifications.
8.2.1 Version Description
The functional version of the D12B board is N1.
8.2.2 Function and Feature
The D12B is used to receive and transmit 32 x E1/T1 electrical signals, and the D12B must be
used with the PQ1 or PQM.
8.2.3 Working Principle and Signal Flow
The D12B consists of the interface module and power supply module.
8.2.4 Front Panel
On the front panel of the D12B, there are interfaces and barcode.
8.2.5 Valid Slots
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The D12B can be housed in any of slots 1417 in the OptiX OSN 1500B subrack. The D12B
can be used as the interface board for the PQ1 or PQM.
8.2.6 Technical Specifications
The technical specifications of the D12B cover the board dimensions, weight and power
consumption.

8.2.1 Version Description

The functional version of the D12B board is N1.

8.2.2 Function and Feature

The D12B is used to receive and transmit 32 x E1/T1 electrical signals, and the D12B must be
used with the PQ1 or PQM.

8.2.3 Working Principle and Signal Flow

The D12B consists of the interface module and power supply module.
Figure 8-3 shows the block diagram for the functions of the D12B.
Figure 8-3 Block diagram for the functions of the D12B
Backplane

PQ1/PQM

E1/T1

Interface
module
PQ1/PQM

E1/T1

+3.3 V

Power
supply
module

Fuse

+3.3 V
Power

Interface Module
The interface module receives and transmits the E1/T1 electrical signals.

Power Supply Module

The power supply module provides the DC voltages required by the modules of the board.

8.2.4 Front Panel

On the front panel of the D12B, there are interfaces and barcode.

Appearance of the Front Panel

Figure 8-4 shows the appearance of the front panel of the D12B.
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Figure 8-4 Front panel of the D12B

D12B

18
916
1724
2532

D12B

Interfaces
There are four DB44 interfaces on the front panel of the D12B. Table 8-2 lists the type and
usage of the interfaces.
Table 8-2 Interfaces on the front panel of the D12B
Interface

Interface
Type

Usage

18

DB44

Receive eight channels (18) of E1/T1 signals.

916

DB44

Receive eight channels (916) of E1/T1 signals.

1724

DB44

Receive eight channels (1724) of E1/T1 signals.

2532

DB44

Receive eight channels (25-32) of E1/T1 signals.

Table 8-3 lists the pins of the DB44 interfaces.

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Table 8-3 Pins of the DB44 interfaces of the D12B

Front View
1

Pin

Usage

Pin

Usage

38

R1 to receive the
first channel of
signals.

34

R5 to receive the
fifth channel of
signals.

R2 to receive the
second channel of
signals.

33

R3 to receive the
third channel of
signals.

32

R4 to receive the
fourth channel of
signals.

31

T1 to transmit the
first channel of
signals.

11

T2 to transmit the
second channel of
signals.

10

T3 to transmit the
third channel of
signals.

T4 to transmit the
fourth channel of
signals.

23
37
22
36
21
35

44

20
15
30
14
29
13
28
12
27

19

18

17

16

26

25

24

R6 to receive the
sixth channel of
signals.
R7 to receive the
seventh channel of
signals.
R8 to receive the
eighth channel of
signals.
T5 to transmit the
fifth channel of
signals.
T6 to transmit the
sixth channel of
signals.
T7 to transmit the
seventh channel of
signals.
T8 to transmit the
eighth channel of
signals.

8.2.5 Valid Slots

The D12B can be housed in any of slots 1417 in the OptiX OSN 1500B subrack. The D12B
can be used as the interface board for the PQ1 or PQM.
Table 8-4 lists the valid slots for the PQ1/PQM and corresponding slots for the D12B. The D12B
housed in the slot with a smaller number accesses the first 32 (132) channels of E1/T1 electrical
signals. The D12B housed in the slot with a larger number accesses the last 31 (3363) channels
of E1/T1 electrical signals.
Table 8-4 Valid slots for the PQ1/PQM and corresponding slots for the D12B in the OptiX OSN
1500B subrack

8-8

Valid Slot for the PQ1/PQM

Corresponding Slot for the D12B

Slot 12

Slots 14 and 15

Slot 13

Slots 16 and 17

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8.2.6 Technical Specifications

The technical specifications of the D12B cover the board dimensions, weight and power
consumption.

Mechanical Specifications
The mechanical specifications of the D12B are as follows:
l

Board dimensions (mm): 262.05 (H) x 110 (D) x 22 (W)

Weight (kg): 0.3

Power Consumption
In the normal temperature (25), the maximum power consumption of the D12B is 0 W.

8.3 D12S
This section describes the D12S, a 32 x E1/T1 electrical interface switching board, in terms of
the version, function, principle, front panel and specifications.
8.3.1 Version Description
The functional version of the D12S board is N1.
8.3.2 Function and Feature
The D12S is used to receive and transmit 32 x E1/T1 electrical signals, and the D12S must be
used with the PQ1 or PQM.
8.3.3 Working Principle and Signal Flow
The D12S consists of the interface module, switch matrix module, and power supply module.
8.3.4 Front Panel
On the front panel of the D12S, there are interfaces and barcode.
8.3.5 Valid Slots
The D12S can be housed in any of slots 1417 in the OptiX OSN 1500B subrack. The D12S
can be used as the interface board for the PQ1 or PQM.
8.3.6 Technical Specifications
The technical specifications of the D12S cover the board dimensions, weight and power
consumption.

8.3.1 Version Description

The functional version of the D12S board is N1.

8.3.2 Function and Feature

The D12S is used to receive and transmit 32 x E1/T1 electrical signals, and the D12S must be
used with the PQ1 or PQM.

8.3.3 Working Principle and Signal Flow

The D12S consists of the interface module, switch matrix module, and power supply module.
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Figure 8-5 shows the block diagram for the functions of the D12S.
Figure 8-5 Block diagram for the functions of the D12S
Backplane
Crossconnect
board
E1/T1

Swictch
matrix
module

Interface
module

PQ1/
PQM

PQ1/
PQM

E1/T1

+3.3 V

Power
supply
module

Fuse

+3.3 V

Power

Interface Module
The interface module receives and transmits the E1/T1 electrical signals.

Switch Matrix Module

In the receive direction, the switch matrix module accesses signals from the interface module,
and selects the output direction of the signals according to the TPS protection control signals
from the cross-connect board. When the TPS protection is not performed, the switch matrix
module transmits the signals to the PD1 or PQM board. When the TPS protection is performed,
the switch matrix module transmits the signals to the protection board for bridging.
In the transmit direction, the working direction of the switch matrix module is the reverse of the
receive direction.

Power Supply Module

The power supply module provides the DC voltages required by the modules of the board.

8.3.4 Front Panel

On the front panel of the D12S, there are interfaces and barcode.

Appearance of the Front Panel

Figure 8-6 shows the appearance of the front panel of the D12S.

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Figure 8-6 Front panel of the D12S

D12S

18
916
1724
2532

D12S

Interfaces
There are four DB44 interfaces on the front panel of the D12S. Table 8-5 lists the type and usage
of the optical interfaces.
Table 8-5 Interfaces on the front panel of the D12S
Interface

Interface
Type

Usage

18

DB44

Receive eight channels (18) of E1/T1 signals.

916

DB44

Receive eight channels (916) of E1/T1 signals.

1724

DB44

Receive eight channels (1724) of E1/T1 signals.

2532

DB44

Receive eight channels (2532) of E1/T1 signals.

Table 8-6 lists the pins of the DB44 interfaces.

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Table 8-6 Pins of the DB44 interfaces of the D12S

Front View
1

Pin

Usage

Pin

Usage

38

R1 to receive the
first channel of
signals.

34

R5 to receive the fifth

channel of signals.

R2 to receive the
second channel of
signals.

33

R3 to receive the
third channel of
signals.

32

R4 to receive the
fourth channel of
signals.

31

T1 to transmit the
first channel of
signals.

11

T2 to transmit the
second channel of
signals.

10

T3 to transmit the
third channel of
signals.

T4 to transmit the
fourth channel of
signals.

23
37
22
36
21
44

35
20
15
30
14
29
13
28
12
27

19

18

17

16

26

25

24

R6 to receive the sixth

channel of signals.
R7 to receive the
seventh channel of
signals.
R8 to receive the
eighth channel of
signals.
T5 to transmit the
fifth channel of
signals.
T6 to transmit the
sixth channel of
signals.
T7 to transmit the
seventh channel of
signals.
T8 to transmit the
eighth channel of
signals.

8.3.5 Valid Slots

The D12S can be housed in any of slots 1417 in the OptiX OSN 1500B subrack. The D12S
can be used as the interface board for the PQ1 or PQM.
Table 8-7 lists the valid slots for the PQ1/PQM and corresponding slots for the D12S. The D12S
housed in the slot with a smaller number accesses the first 32 (132) channels of E1/T1 electrical
signals. The D12S housed in the slot with a larger number accesses the last 31 (3363) channels
of E1/T1 electrical signals.
Table 8-7 Valid slots for the PQ1/PQM and corresponding slots for the D12S in the OptiX OSN
1500B subrack

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Valid Slot for the PQ1/PQM

Corresponding Slot for the D12S

Slot 12

Slots 14 and 15

Slot 13

Slots 16 and 17

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8.3.6 Technical Specifications

The technical specifications of the D12S cover the board dimensions, weight and power
consumption.

Mechanical Specifications
The mechanical specifications of the D12S are as follows:
l

Board dimensions (mm): 262.05 (H) x 110 (D) x 22 (W)

Weight (kg): 0.4

Power Consumption
In the normal temperature (25), the maximum power consumption of the D12S in the switching
state is 9 W and that of the D12S in the normal state is 0 W.

8.4 L75S
This section describes the L75S, a 16 x E1 electrical interface switching board, in terms of the
version, function, principle, front panel and specifications.
8.4.1 Version Description
The functional version of the L75S is R1.
8.4.2 Function and Feature
The L75S is used to receive and transmit 16 x E1 electrical signals, and the L75S must be used
with the PD1.
8.4.3 Working Principle and Signal Flow
The L75S consists of the interface module, switch matrix module, and power supply module.
8.4.4 Front Panel
On the front panel of the L75S, there are interfaces and barcode.
8.4.5 Valid Slots
The L75S can be housed in any slots of 67 in the subrack. The L75S can be used as the interface
board for the PD1.
8.4.6 Technical Specifications
The technical specifications of the L75S cover the board dimensions, weight and power
consumption.

8.4.1 Version Description

The functional version of the L75S is R1.

8.4.2 Function and Feature

The L75S is used to receive and transmit 16 x E1 electrical signals, and the L75S must be used
with the PD1.
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8.4.3 Working Principle and Signal Flow

The L75S consists of the interface module, switch matrix module, and power supply module.
Figure 8-7 shows the block diagram for the functions of the L75S.
Figure 8-7 Block diagram for the functions of the L75S
Backplane
Crossconnect
board
E1

Swictch
matrix
module

Interface
module

PD1

PD1

E1

+3.3 V

Power
supply
module

Fuse

+3.3 V

Power

Interface Module
The interface module receives and transmits the E1 electrical signals.

Switch Matrix Module

In the receive direction, the switch matrix module accesses signals from the interface module,
and selects the output direction of the signals according to the TPS protection control signals
from the cross-connect board. When the TPS protection is not performed, the switch matrix
module transmits the signals to the PD1 board. When the TPS protection is performed, the switch
matrix module transmits the signals to the protection board for bridging.
In the transmit direction, the working direction of the switch matrix module is the reverse of the
receive direction.

Power Supply Module

The power supply module provides the DC voltages required by the modules of the board.

8.4.4 Front Panel

On the front panel of the L75S, there are interfaces and barcode.

Appearance of the Front Panel

Figure 8-8 shows the appearance of the front panel of the L75S.

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Figure 8-8 Front panel of the L75S

L75S

1-16

Interfaces
On the front panel of the L75S, there are two 2mmHM connectors, which are used to access 16
x E1 electrical signals.

8.4.5 Valid Slots

The L75S can be housed in any slots of 67 in the subrack. The L75S can be used as the interface
board for the PD1.
Table 8-8 lists the valid slots for the PD1 and corresponding slots for the L75S. The L75S housed
in the slot with a smaller number accesses the first 16 (116) channels of E1 electrical signals.
The L75S housed in the slot with a larger number accesses the last 16 (1732) channels of E1
electrical signals.
Table 8-8 Valid slots for the PD1 and corresponding slots for the L75S
Valid Slot for the PD1

Corresponding Slot for the L75S

Slot 12

Slots 6 and 7

8.4.6 Technical Specifications

The technical specifications of the L75S cover the board dimensions, weight and power
consumption.

Mechanical Specifications
The mechanical specifications of the L75S are as follows:
l

Board dmensions (mm): 111.8 (H) x 220 X (D) x 25.4 (W)

Weight (kg): 0.24

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Power Consumption
In the normal temperature (25), the maximum power consumption of the L75S is 2.7 W.

8.5 D75S
This section describes the D75S, a 32 x E1/T1 electrical interface switching board, in terms of
the version, function, principle, front panel and specifications.
8.5.1 Version Description
The functional version of the D75S board is N1.
8.5.2 Function and Feature
The D75S is used to receive and transmit 32 x E1/T1 electrical signals, and the D75S must be
used with the PQ1 or PQM.
8.5.3 Working Principle and Signal Flow
The D75S consists of the interface module, switch matrix module, and power supply module.
8.5.4 Front Panel
On the front panel of the D75S, there are interfaces and barcode.
8.5.5 Valid Slots
As the interface board for the PQ1 or PQM, the D75S can be housed in any of slots 1417 in
the OptiX OSN 1500B subrack.
8.5.6 Technical Specifications
The technical specifications of the D75S cover the board dimensions, weight and power
consumption.

8.5.1 Version Description

The functional version of the D75S board is N1.

8.5.2 Function and Feature

The D75S is used to receive and transmit 32 x E1/T1 electrical signals, and the D75S must be
used with the PQ1 or PQM.

8.5.3 Working Principle and Signal Flow

The D75S consists of the interface module, switch matrix module, and power supply module.
Figure 8-9 shows the block diagram for the functions of the D75S.

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Figure 8-9 Block diagram for the functions of the D75S

Backplane
Crossconnect
board
E1/T1

Swictch
matrix
module

Interface
module

PQ1/
PQM

PQ1/
PQM

E1/T1

+3.3 V

Power
supply
module

Fuse

+3.3 V

Power

Interface Module
The interface module receives and transmits the E1/T1 electrical signals.

Switch Matrix Module

In the receive direction, the switch matrix module accesses signals from the interface module,
and selects the output direction of the signals according to the TPS protection control signals
from the cross-connect board. When the TPS protection is not performed, the switch matrix
module transmits the signals to the PQ1 or PQM board. When the TPS protection is performed,
the switch matrix module transmits the signals to the protection board for bridging.
In the transmit direction, the working direction of the switch matrix module is the reverse of the
receive direction.

Power Supply Module

The power supply module provides the DC voltages required by the modules of the board.

8.5.4 Front Panel

On the front panel of the D75S, there are interfaces and barcode.

Appearance of the Front Panel

Figure 8-10 shows the appearance of the front panel of the D75S.

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Figure 8-10 Front panel of the D75S

D75S

18
916
1724
25 32

D75S

Interfaces
There are four DB44 interfaces on the front panel of the D75S. Table 8-9 lists the type and usage
of the DB44 interfaces.
Table 8-9 Interfaces on the front panel of the D75S
Interface

Interface
Type

Usage

18

DB44

Receive eight channels (18) of E1/T1 signals.

916

DB44

Receive eight channels (916) of E1/T1 signals.

1724

DB44

Receive eight channels (1724) of E1/T1 signals.

2532

DB44

Receive eight channels (2532) of E1/T1 signals.

Table 8-10 lists the pins of the DB44 interface.

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Table 8-10 Pins of the DB44 interfaces of the D75S

Front View
1

Pin

Usage

Pin

Usage

38

R1 to receive the
first channel of
signals.

34

R5 to receive the fifth

channel of signals.

R2 to receive the
second channel of
signals.

33

R3 to receive the
third channel of
signals.

32

R4 to receive the
fourth channel of
signals.

31

T1 to transmit the
first channel of
signals.

11

T2 to transmit the
second channel of
signals.

10

T3 to transmit the
third channel of
signals.

T4 to transmit the
fourth channel of
signals.

23
37
22
36
21
44

35
20
15
30
14
29
13
28
12
27

19

18

17

16

26

25

24

R6 to receive the sixth

channel of signals.
R7 to receive the
seventh channel of
signals.
R8 to receive the
eighth channel of
signals.
T5 to transmit the
fifth channel of
signals.
T6 to transmit the
sixth channel of
signals.
T7 to transmit the
seventh channel of
signals.
T8 to transmit the
eighth channel of
signals.

8.5.5 Valid Slots

As the interface board for the PQ1 or PQM, the D75S can be housed in any of slots 1417 in
the OptiX OSN 1500B subrack.
Table 8-11 lists the valid slots for the PQ1/PQM and corresponding slots for the D75S. The
D75S housed in the slot with a smaller number accesses the first 32 (132) channels of E1/T1
electrical signals. The D75S housed in the slot with a larger number accesses the last 31 (33
63) channels of E1/T1 electrical signals.
Table 8-11 Valid slots for the PQ1/PQM and corresponding slots for the D75S in the OptiX
OSN 1500B subrack

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Valid Slot for the PQ1/PQM

Corresponding Slot for the D75S

Slot 12

Slots 14 and 15

Slot 13

Slots 16 and 17

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8.5.6 Technical Specifications

The technical specifications of the D75S cover the board dimensions, weight and power
consumption.

Mechanical Specifications
The mechanical specifications of the D75S are as follows:
l

Board dimensions (mm): 262.05 (H) x 110 (D) x 22 (W)

Weight (kg): 0.4

Power Consumption
In the normal temperature (25), the maximum power consumption of the D75S in the switching
state is 6 W and that of the D75S in the normal state is 0 W.

8.6 D34S
This section describes the D34S, a 6 x E3/T3 electrical interface switching board, in terms of
the version, function, principle, front panel and specifications.
8.6.1 Version Description
The functional version of the D34S board is N1.
8.6.2 Function and Feature
The D34S is used to receive and transmit 6 x E3/T3 electrical signals, and the D34S must be
used with the PD3.
8.6.3 Working Principle and Signal Flow
The D34S consists of the interface module, switch matrix module, and power supply module.
8.6.4 Front Panel
On the front panel of the D34S, there are interfaces and barcode.
8.6.5 Valid Slots
As the interface board for the PD3, the D34S can be housed in any of slots 14 and 16 in the
OptiX OSN 1500B subrack.
8.6.6 Technical Specifications
The technical specifications of the D34S cover the electrical interface specifications, board
dimensions, weight and power consumption.

8.6.1 Version Description

The functional version of the D34S board is N1.

8.6.2 Function and Feature

The D34S is used to receive and transmit 6 x E3/T3 electrical signals, and the D34S must be
used with the PD3.
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8.6.3 Working Principle and Signal Flow

The D34S consists of the interface module, switch matrix module, and power supply module.
Figure 8-11 shows the block diagram for the functions of the D34S.
Figure 8-11 Block diagram for the functions of the D34S
Backplane
Crossconnect
board
E3/T3
Swictch
matrix
module

Interface
module
E3/T3

+3.3 V

Power
supply
module

Fuse

PD3
TSB8
TSB8
PD3

+3.3 V Power

Interface Module
The interface module receives and transmits the E3/T3 electrical signals.

Switch Matrix Module

In the receive direction, the switch matrix module accesses signals from the interface module,
and selects the output direction of the signals according to the TPS protection control signals
from the cross-connect board. When the TPS protection is not performed, the switch matrix
module transmits the signals to the PD3 board. When the TPS protection is performed, the switch
matrix module transmits the signals to the TSB8 board for bridging.
In the transmit direction, the working direction of the switch matrix module is the reverse of the
receive direction.

Power Supply Module

The power supply module provides the DC voltages required by the modules of the board.

8.6.4 Front Panel

On the front panel of the D34S, there are interfaces and barcode.

Appearance of the Front Panel

Figure 8-12 shows the appearance of the front panel of the D34S.

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Figure 8-12 Front panel of the D34S

D34S

OUT1
IN1
OUT2
IN2
OUT3
IN3
OUT4
IN4
OUT5
IN5
OUT6
IN6

D34S

Interfaces
There are six pairs of electrical interfaces on the front panel of the D34S.
Table 8-12 lists the type and usage of interfaces on the D34S.
Table 8-12 Interfaces of the D34S
Interface

Interface
Type

Usage

IN1IN6

SMB

Receive six channels (16) of E3/T3 electrical signals.

OUT1OUT6

SMB

Transmit six channels (16) of E3/T3 electrical signals.

8.6.5 Valid Slots

As the interface board for the PD3, the D34S can be housed in any of slots 14 and 16 in the
OptiX OSN 1500B subrack.
Table 8-13 lists the valid slots for the PD3 and corresponding slots for the D34S.

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Table 8-13 Valid slots for the PD3 and corresponding slots for the D34S in the OptiX OSN
1500B subrack
Valid Slot for the PD3

Corresponding Slot for the D34S

Slot 12

Slot 14

Slot 13

Slot 16

8.6.6 Technical Specifications

The technical specifications of the D34S cover the electrical interface specifications, board
dimensions, weight and power consumption.

Electrical Interface Specifications

Table 8-14 lists the specifications of the electrical interfaces of the D34S.
Table 8-14 Specifications of the electrical interfaces of the D34S
Item

Specification

Interface type

34368 kbit/s and 44736k bit/s

Code

HDB3 (E3) and B3ZS (T3)

Output signal bit rate

Compliant with ITU-T G.703

Allowed input frequency

deviation
Allowed input attenuation
Input jitter tolerance

Mechanical Specifications
The mechanical specifications of the D34S are as follows:
l

Board dimensions (mm): 262.05 (H) x 110 (D) x 22 (W)

Weight (kg): 0.4

Power Consumption
In the normal temperature (25), the maximum power consumption of the D34S in the switching
state is 2 W and that of the D34S in the normal state is 0 W.

8.7 C34S
This section describes the C34S, a 3 x E3/T3 electrical interface switching board, in terms of
the version, function, principle, front panel and specifications.
8.7.1 Version Description
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The functional version of the C34S board is N1.

8.7.2 Function and Feature
The C34S is used to receive and transmit 3 x E3/T3 electrical signals, and the C34S must be
used with the PL3.
8.7.3 Working Principle and Signal Flow
The C34S consists of the interface module, switch matrix module, and power supply module.
8.7.4 Front Panel
On the front panel of the C34S, there are interfaces and barcode.
8.7.5 Valid Slots
As the interface board for the PL3, the C34S can be housed in any of slots 14 and 16 in the OptiX
OSN 1500B subrack.
8.7.6 Technical Specifications
The technical specifications of the C34S cover the electrical interface specifications, board
dimensions, weight and power consumption.

8.7.1 Version Description

The functional version of the C34S board is N1.

8.7.2 Function and Feature

The C34S is used to receive and transmit 3 x E3/T3 electrical signals, and the C34S must be
used with the PL3.

8.7.3 Working Principle and Signal Flow

The C34S consists of the interface module, switch matrix module, and power supply module.
Figure 8-13 shows the block diagram for the functions of the C34S.
Figure 8-13 Block diagram for the functions of the C34S
Backplane
Crossconnect
board
E3/T3

Interface
module

Swictch
matrix
module

E3/T3

+3.3 V

Power
supply
module

Power
supply
module

Fuse

PL3
TSB8
TSB8
PL3

-48 V/-60 V
-48 V/-60 V

Fuse

+3.3 V
backeup
power

Interface Module
The interface module receives and transmits the E3/T3 electrical signals.
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Switch Matrix Module

In the receive direction, the switch matrix module accesses signals from the interface module,
and selects the output direction of the signals according to the TPS protection control signals
from the cross-connect board. When the TPS protection is not performed, the switch matrix
module transmits the signals to the PL3 board. When the TPS protection is performed, the switch
matrix module transmits the signals to the TSB8 board for bridging.
In the transmit direction, the working direction of the switch matrix module is the reverse of the
receive direction.

Power Supply Module

The power supply module provides the DC voltages required by the modules of the board.

8.7.4 Front Panel

On the front panel of the C34S, there are interfaces and barcode.

Appearance of the Front Panel

Figure 8-14 shows the appearance of the front panel of the C34S.
Figure 8-14 Front panel of the C34S
C34S

OUT1
IN1
OUT2
IN2
OUT3
IN3

C34S

Interfaces
There are three pairs of electrical interfaces on the front panel of the C34S.
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Table 8-15 lists the type and usage of interfaces on the C34S.
Table 8-15 Interfaces of the C34S
Interface

Interface
Type

Usage

IN1IN3

SMB

Receive the first three channels (13) of E3/T3 electrical

signals.

OUT1OUT3

SMB

Transmit the first three channels (13) of E3/T3 electrical

signals.

8.7.5 Valid Slots

As the interface board for the PL3, the C34S can be housed in any of slots 14 and 16 in the OptiX
OSN 1500B subrack.
Table 8-16 lists the valid slots for the PL3 and corresponding slots for the C34S.
Table 8-16 Valid slots for the PL3 and corresponding slots for the C34S in the OptiX OSN
1500B subrack
Valid Slot for the PL3

Corresponding Slot for the C34S

Slot 12

Slot 14

Slot 13

Slot 16

8.7.6 Technical Specifications

The technical specifications of the C34S cover the electrical interface specifications, board
dimensions, weight and power consumption.

Electrical Interface Specifications

Table 8-17 lists the specifications of the electrical interfaces of the C34S.
Table 8-17 Specifications of the electrical interfaces of the C34S
Item

Specification

Interface type

34368 kbit/s and 44736 kbit/s

Code

HDB3 (E3) and B3ZS (T3)

Output signal bit rate

Compliant with ITU-T G.703

Allowed input frequency

deviation
Allowed input attenuation
Input jitter tolerance
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Mechanical Specifications
The mechanical specifications of the C34S are as follows:
l

Board dimensions (mm): 262.05 (H) x 110 (D) x 22 (W)

Weight (kg): 0.3

Power Consumption
In the normal temperature (25), the maximum power consumption of the C34S in the switching
state is 2 W and that of the C34S in the normal state is 0 W.

8.8 EU04
This section describes the EU04, a 4 x STM-1 electrical interface board, in terms of the version,
function, working principle, front panel and specifications.
8.8.1 Version Description
The functional version of the EU04 board is N1.
8.8.2 Function and Feature
The EU04 is used to receive and transmit 4 x STM-1 electrical signals, and the EU04 must be
used with the SEP.
8.8.3 Working Principle and Signal Flow
The EU04 consists of the interface module, switch matrix module, and power supply module.
8.8.4 Front Panel
On the front panel of the EU04, there are interfaces and barcode.
8.8.5 Valid Slots
As the interface board for the SEP, the EU04 can be housed in any of slots 14 and 16 in the
OptiX OSN 1500B subrack.
8.8.6 Technical Specifications
The technical specifications of the EU04 cover the electrical interface specifications, board
dimensions, weight and power consumption.

8.8.1 Version Description

The functional version of the EU04 board is N1.

8.8.2 Function and Feature

The EU04 is used to receive and transmit 4 x STM-1 electrical signals, and the EU04 must be
used with the SEP.

8.8.3 Working Principle and Signal Flow

The EU04 consists of the interface module, switch matrix module, and power supply module.
Figure 8-15 shows the block diagram for the functions of the EU04 when it processes 1 x STM-1
signals.
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Figure 8-15 Block diagram for the functions of the EU04

Backplane
Crossconnect
board

STM-1(e)

Interface
module
STM-1(e)

Swictch
matrix
module

SEP
TSB8
TSB8
SEP

+3.3 V

Power
supply
module

Power
supply
module

Fuse

-48 V/-60 V
-48 V/-60 V

Fuse

+3.3 V
backeup
power

Interface Module
The interface module receives and transmits the STM-1 electrical signals.

Switch Matrix Module

In the receive direction, the switch matrix module accesses signals from the interface module,
and selects the output direction of the signals according to the TPS protection control signals
from the cross-connect board. When the TPS protection is not performed, the switch matrix
module transmits the signals to the SEP board. When the TPS protection is performed, the switch
matrix module transmits the signals to the TSB8 board for bridging.
In the transmit direction, the working direction of the switch matrix module is the reverse of the
receive direction.

Power Supply Module

The power supply module provides the DC voltages required by the modules of the board.

8.8.4 Front Panel

On the front panel of the EU04, there are interfaces and barcode.

Appearance of the Front Panel

Figure 8-16 shows the appearance of the front panel of the EU04.

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Figure 8-16 Front panel of the EU04

EU04

OUT1 IN1
OUT2 IN2
OUT3 IN3 OUT4
IN4
EU04

Interfaces
There are four pairs of electrical interfaces on the front panel of the EU04.
Table 8-18 lists the type and usage of interfaces on the EU04.
Table 8-18 Interfaces of the EU04
Interface

Interface
Type

Usage

IN1IN4

SMB

Receive four (14) channels of electrical interfaces.

OUT1OUT4

SMB

Transmit four (14) channels of electrical interfaces.

8.8.5 Valid Slots

As the interface board for the SEP, the EU04 can be housed in any of slots 14 and 16 in the
OptiX OSN 1500B subrack.
Table 8-19 lists the valid slots for the SEP and corresponding slots for the EU04.

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Table 8-19 Valid slots for the SEP and corresponding slots for the EU04
Valid Slot for the SEP

Corresponding Slot for the EU04

Slot 12

Slot 14

Slot 13

Slot 16

8.8.6 Technical Specifications

The technical specifications of the EU04 cover the electrical interface specifications, board
dimensions, weight and power consumption.

Electrical Interface Specifications

Table 8-20 lists the specifications of the electrical interfaces of the EU04.
Table 8-20 Specifications of the electrical interfaces of the EU04
Item

Specification

Interface Type

155520 kbit/s

Code

CMI

Output signal bit rate

Compliant with ITU-T G.703

Allowed input frequency

deviation
Allowed input attenuation

Mechanical Specifications
The mechanical specifications of the EU04 are as follows:
l

Board dimensions (mm): 262.05 (H) x 110 (D) x 22 (W)

Weight (kg): 0.4

Power Consumption
In the normal temperature (25), the maximum power consumption of the EU04 is 6 W.

8.9 EU08
This section describes the EU08, an 8 x STM-1 electrical interface board, in terms of the version,
function, working principle, front panel and specifications.
8.9.1 Version Description
The functional version of the EU08 board is N1.
8.9.2 Function and Feature
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The EU08 is used to receive and transmit 8 x STM-1 electrical signals, and the EU08 must be
used with the SEP.
8.9.3 Working Principle and Signal Flow
The EU08 consists of the interface module, switch matrix module, and power supply module.
8.9.4 Front Panel
On the front panel of the EU08, there are interfaces and barcode.
8.9.5 Valid Slots
As the interface board for the SEP, the EU08 can be housed in any of slots 14 and 16 in the
OptiX OSN 1500B subrack.
8.9.6 Technical Specifications
The technical specifications of the EU08 cover the electrical interface specifications, board
dimensions, weight and power consumption.

8.9.1 Version Description

The functional version of the EU08 board is N1.

8.9.2 Function and Feature

The EU08 is used to receive and transmit 8 x STM-1 electrical signals, and the EU08 must be
used with the SEP.

8.9.3 Working Principle and Signal Flow

The EU08 consists of the interface module, switch matrix module, and power supply module.
Figure 8-17 shows the block diagram for the functions of the EU08.
Figure 8-17 Block diagram for the functions of the EU08
Backplane
Crossconnect
board

STM-1(e)

Interface
module
STM-1(e)

Swictch
matrix
module

SEP
TSB8
TSB8
SEP

+3.3 V

Power
supply
module

Fuse

+3.3 V
backeup
power

Interface Module
The interface module receives and transmits the STM-1 electrical signals.

Switch Matrix Module

In the receive direction, the switch matrix module accesses signals from the interface module,
and selects the output direction of the signals according to the TPS protection control signals
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from the cross-connect board. When the TPS protection is not performed, the switch matrix
module transmits the signals to the SEP board. When the TPS protection is performed, the switch
matrix module transmits the signals to the TSB8 board for bridging.
In the transmit direction, the working direction of the switch matrix module is the reverse of the
receive direction.

Power Supply Module

The power supply module provides the DC voltages required by the modules of the board.

8.9.4 Front Panel

On the front panel of the EU08, there are interfaces and barcode.

Appearance of the Front Panel

Figure 8-18 shows the appearance of the front panel of the EU08.
Figure 8-18 Front panel of the EU08
EU08

OUT1 IN1 OUT2 IN2 OUT3 IN3 OUT4 IN4 OUT5 IN5 OUT6 IN6 OUT7 IN7 OUT8 IN8
EU08

Interfaces
There are eight pairs of electrical interfaces on the front panel of the EU08.
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Table 8-21 lists the type and usage of interfaces on the EU08.
Table 8-21 Interfaces of the EU08
Interface

Interface
Type

Usage

IN1IN8

SMB

Receive eight (18) channels of electrical interfaces.

OUT1OUT8

SMB

Transmit eight (18) channels of electrical interfaces.

8.9.5 Valid Slots

As the interface board for the SEP, the EU08 can be housed in any of slots 14 and 16 in the
OptiX OSN 1500B subrack.
Table 8-22 lists the valid slots for the SEP and corresponding slots for the EU08 in the OptiX
OSN 1500B.
NOTE

The OptiX OSN 1500A does not support the EU08 board.

Table 8-22 Valid slots for the SEP and corresponding slots for the EU08
Valid Slot for the SEP

Corresponding Slot for the EU08

Slot 12

Slot 14

Slot 13

Slot 16

8.9.6 Technical Specifications

The technical specifications of the EU08 cover the electrical interface specifications, board
dimensions, weight and power consumption.

Electrical Interface Specifications

Table 8-23 lists the specifications of the electrical interfaces of the EU08.
Table 8-23 Specifications of the electrical interfaces of the EU08
Item

Specification

Interface type

155520 kbit/s

Code

CMI

Output signal bit rate

Compliant with ITU-T G.703

Allowed input frequency deviation

Allowed input attenuation
Input jitter tolerance
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Mechanical Specifications
The mechanical specifications of the EU08 are as follows:
l

Board dimensions (mm): 262.05 (H) x 110 (D) x 22 (W)

Weight (kg): 0.4

Power Consumption
In the normal temperature (25), the maximum power consumption of the EU08 is 11 W.

8.10 OU08
This section describes the OU08, an 8 x STM-1 optical interface board, in terms of the version,
function, working principle, front panel and parameters.
8.10.1 Version Description
The OU08 has two versions, N1 and N2. The main difference between the two versions lies in
the connector type for optical interfaces and the pluggability of the optical modules.
8.10.2 Function and Feature
The OU08 is used to receive and transmit 8 x STM-1 optical signals, and the OU08 must be
used with the SEP.
8.10.3 Working Principle and Signal Flow
The OU08 consists of the interface module and power supply module.
8.10.4 Front Panel
On the front panel of the OU08, there are interfaces and barcode.
8.10.5 Valid Slots
As the interface board for the SEP, the OU08 can be housed in any of slots 14 and 16 in the
OptiX OSN 1500B subrack.
8.10.6 Technical Specifications
The technical specifications of the OU08 cover the optical interface specifications, board
dimensions, weight and power consumption.

8.10.1 Version Description

The OU08 has two versions, N1 and N2. The main difference between the two versions lies in
the connector type for optical interfaces and the pluggability of the optical modules.
Table 8-24 lists the details on the two versions of the OU08 board.
Table 8-24 Version description of the OU08

8-34

Item

Specification

Functional
version

The OU08 has two versions, N1 and N2.

Commonness

The N1 and N2 versions share the same working principle.

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Item

Specification

Difference

The optical interface of the N1OU08 uses the LC connector. The optical
interface of the N2OU08 uses the SC connector. The N1OU08 uses the
pluggable optical module. The N2OU08 does not use the pluggable
optical module.

Replaceability

None.

8.10.2 Function and Feature

The OU08 is used to receive and transmit 8 x STM-1 optical signals, and the OU08 must be
used with the SEP.

8.10.3 Working Principle and Signal Flow

The OU08 consists of the interface module and power supply module.
Figure 8-19 shows the block diagram for the functions of the OU08.
Figure 8-19 Block diagram for the functions of the OU08
Backplane

STM-1(o)

SEP
Interface
module

STM-1(o)

SEP

+3.3 V

Power
supply
module

Fuse

+3.3 V
Power

Interface Module
In the receive direction, the interface module performs O/E convertion for the STM-1 signals,
and transmits the signals to the SEP board.
In the transmit direction, the interface module performs the E/O convertion for the STM-1
signals, and transmits the signals to the optical interface.

Power Supply Module

The power supply module provides the DC voltages required by the modules of the board.

8.10.4 Front Panel

On the front panel of the OU08, there are interfaces and barcode.
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Appearance of the Front Panel

Figure 8-20 and Figure 8-21 show the appearance of the front panels of the N1OU08 and
N2OU08 respectively.
Figure 8-20 Front panel of the N1OU08
OU08

OUT1IN1OUT2 IN2 OUT3IN3 OUT4 IN4OUT5IN5 OUT6IN6 OUT7IN7OUT8 IN8

OU08

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Figure 8-21 Front panel of the N2OU08

OU08

OUT1
IN1
OUT2
IN2
OUT3
IN3
OUT4
IN4
OUT5
IN5
OUT6
IN6
OUT7
OUT8
IN7
IN8
OU08

Interfaces
There are eight pairs of optical interfaces on each front panel of the N1OU08 and N2OU08.
Table 8-25 lists the interface type and usage for the N1OU08. Table 8-26 lists the interface type
and usage for the N2OU08.
Table 8-25 Interfaces of the N1OU08

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Interface

Interface
Type

Usage

IN1IN8

LC

Receive eight (18) channels of STM-1 optical signals.

OUT1OUT8

LC

Transmit eight (18) channels of STM-1 optical signals.

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Table 8-26 Interfaces of the N2OU08

Interface

Interface
Type

Usage

IN1IN8

SC

Receive eight (18) channels of STM-1 optical signals.

OUT1OUT8

SC

Transmit eight (18) channels of STM-1 optical signals.

8.10.5 Valid Slots

As the interface board for the SEP, the OU08 can be housed in any of slots 14 and 16 in the
OptiX OSN 1500B subrack.
Table 8-27 lists the valid slots for the SEP and corresponding slots for the OU08.
Table 8-27 Valid slots for the SEP and corresponding slots for the OU08
Valid Slot for the SEP

Corresponding Slot for the OU08

Slot 12

Slot 14

Slot 13

Slot 16

8.10.6 Technical Specifications

The technical specifications of the OU08 cover the optical interface specifications, board
dimensions, weight and power consumption.

Optical Interface Specifications

Table 8-28 lists the specifications of the optical interfaces of the OU08.
Table 8-28 Specifications of the optical interfaces of the OU08

8-38

Item

Specification

Nominal bit rate

155520 kbit/s

Line code

NRZ

Optical interface type

S-1.1

Working wavelength
(nm)

N1OU08 (12601360)

Optical source type

MLM

Mean launched optical

power (dBm)

15 to 8

Receiver sensitivity
(dBm)

28

N2OU08 (12611360)

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Mechanical Specifications
The mechanical specifications of the OU08 are as follows:
l

Board dimensions (mm): 262.05 (H) x 110 (D) x 22 (W)

Weight (kg): 0.4

Power Consumption
In the normal temperature (25), the maximum power consumption of the OU08 is 6 W.

8.11 MU04
This section describes the MU04, a 4 x E4/STM-1 electrical interface board, in terms of the
version, function, principle, front panel and specifications.
8.11.1 Version Description
The functional version of the MU04 board is N1.
8.11.2 Function and Feature
The MU04 is used to receive and transmit 4 x E4/STM-1 electrical signals, and the MU04 must
be used with the SPQ4.
8.11.3 Working Principle and Signal Flow
The MU04 consists of the interface module, switch matrix module, and power supply module.
8.11.4 Front Panel
On the front panel of the MU04, there are interfaces and barcode.
8.11.5 Valid Slots
As the interface board for the SPQ4, the MU04 can be housed in any of slots 14 and 16 in the
OptiX OSN 1500B subrack.
8.11.6 Technical Specifications
The technical specifications of the MU04 cover the optical interface specifications, board
dimensions, weight and power consumption.

8.11.1 Version Description

The functional version of the MU04 board is N1.

8.11.2 Function and Feature

The MU04 is used to receive and transmit 4 x E4/STM-1 electrical signals, and the MU04 must
be used with the SPQ4.

8.11.3 Working Principle and Signal Flow

The MU04 consists of the interface module, switch matrix module, and power supply module.
Figure 8-22 shows the block diagram for the functions of the MU04.

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Figure 8-22 Block diagram for the functions of the MU04

Backplane
Crossconnect
board

E4/STM-1(e)

Interface
module
E4/STM-1(e)

+3.3 V

Swictch
matrix
module

Power
supply
module

Fuse

SPQ4
TSB8
TSB8
SPQ4
+3.3 V
backeup
power

Interface Module
The interface module receives and transmits the E4/STM-1 electrical signals.

Switch Matrix Module

In the receive direction, the switch matrix module accesses signals from the interface module,
and selects the output direction of the signals according to the TPS protection control signals
from the cross-connect board. When the TPS protection is not performed, the switch matrix
module transmits the signals to the SPQ4 board. When the TPS protection is performed, the
switch matrix module transmits the signals to the TSB8 board for bridging.
In the transmit direction, the working direction of the switch matrix module is the reverse of the
receive direction.

Power Supply Module

The power supply module provides the DC voltages required by the modules of the board.

8.11.4 Front Panel

On the front panel of the MU04, there are interfaces and barcode.

Appearance of the Front Panel

Figure 8-23 shows the appearance of the front panel of the MU04.

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Figure 8-23 Front panel of the MU04

MU04

OUT1
IN1
OUT2
IN2
OUT3 IN3
OUT4
IN4

MU04

Interfaces
There are four pairs of electrical interfaces on the front panel of the MU04.
Table 8-29 lists the type and usage of interfaces on the MU04.
Table 8-29 Interfaces of the MU04
Interface

Interface
Type

Usage

IN1IN4

SMB

Receive four (14) channels of E4/STM-1 electrical

interfaces.

OUT1OUT4

SMB

Transmit four (14) channels of E4/STM-1 electrical

interfaces.

8.11.5 Valid Slots

As the interface board for the SPQ4, the MU04 can be housed in any of slots 14 and 16 in the
OptiX OSN 1500B subrack.
Table 8-30 lists the valid slots for the SPQ4 and corresponding slots for the MU04.

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Table 8-30 Valid slots for the SPQ4 and corresponding slots for the MU04
Valid Slot for the SPQ4

Corresponding Slot for the MU04

Slot 12

Slot 14

Slot 13

Slot 16

8.11.6 Technical Specifications

The technical specifications of the MU04 cover the optical interface specifications, board
dimensions, weight and power consumption.

Electrical Interface Specifications

Table 8-31 lists the specifications of the electrical interfaces of the MU04.
Table 8-31 Specifications of the electrical interfaces of the MU04
Item

Specification

Interface Type

139264 kbit/s and 155520 kbit/s

Code

CMI

Output signal bit rate

Compliant with ITU-T G.703

Allowed input frequency deviation

Allowed input attenuation

Mechanical Specifications
The mechanical specifications of the MU04 are as follows:
l

Board dimensions (mm): 262.05 (H) x 110 (D) x 22 (W)

Weight (kg): 0.4

Power Consumption
In the normal temperature (25), the maximum power consumption of the MU04 is 2 W.

8.12 TSB8
This section describes the TSB8, an 8-channel optical interface switching board, in terms of the
version, function, principle, front panel and specifications.
8.12.1 Version Description
The functional version of the TSB8 board is N1.
8.12.2 Function and Feature
The TSB8, an eight-channel electrical interface switching board, is used to provide the TPS
protection.
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8.12.3 Working Principle and Signal Flow

The TSB8 consists of the switch matrix module and power supply module.
8.12.4 Front Panel
On the front panel of the TSB8, there is the barcode.
8.12.5 Valid Slots
When used with different processing boards and interface boards to realize the TPS protection,
the TSB8 can be housed in different slots. The OptiX OSN 1500A does not support the TSB8.
8.12.6 Technical Specifications
The technical specifications of the TSB8 cover the board dimensions, weight and power
consumption.

8.12.1 Version Description

The functional version of the TSB8 board is N1.

8.12.2 Function and Feature

The TSB8, an eight-channel electrical interface switching board, is used to provide the TPS
protection.
l

When used with the MU04, the TSB8 provides the TPS protection for the SPQ4.

When used with the C34S, the TSB8 provides the TPS protection for the PL3.

When used with the D34S, the TSB8 provides the TPS protection for the PD3.

When used with the EU04, the TSB8 provides the TPS protection for the SEP1.

When used with the EU08, the TSB8 provides the TPS protection for the SLH1/SEP1.

When used with the ETS8, the TSB8 provides the TPS protection for the EFS0.

8.12.3 Working Principle and Signal Flow

The TSB8 consists of the switch matrix module and power supply module.
Figure 8-24 shows the block diagram for the functions of the TSB8 when it processes onechannel signals.
Figure 8-24 Block diagram for the functions of the TSB8
Backplane

Backplane
Crossconnect
board

Interface
board 1
Interface
board 2
Interface
board 3

Standby
processing
board
Swictch
matrix
module
+3.3
V

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module

Fuse

+3.3 V
Power

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Switch Matrix Module

In the receive direction, the switch matrix module selects signals from one of the three interface
boards according to the TPS protection control signals from the cross-connect board, and outputs
the signals to the backup processing board.
In the transmit direction, the working direction of the switch matrix module is the reverse of the
receive direction.

Power Supply Module

The power supply module provides the DC voltages required by the modules of the board.

8.12.4 Front Panel

On the front panel of the TSB8, there is the barcode.

Appearance of the Front Panel

Figure 8-25 shows the appearance of the front panel of the TSB8.
Figure 8-25 Front panel of the TSB8
TSB8

TSB8

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8.12.5 Valid Slots

When used with different processing boards and interface boards to realize the TPS protection,
the TSB8 can be housed in different slots. The OptiX OSN 1500A does not support the TSB8.
Table 8-32 lists the valid slots for the TSB8 and corresponding slots for the SPQ4 and MU04.
Table 8-32 Valid slots for the TSB8 and corresponding slots for the SPQ4 and MU04
Valid Slot for the TSB8

Valid Slot for the SPQ4

Corresponding Slot for

the MU04

Slot 14

Slot 13

Slot 16

Table 8-33 lists the valid slots for the TSB8 and corresponding slots for the PD3 and D34S.
Table 8-33 Valid slots for the TSB8 and corresponding slots for the PD3 and D34S
Valid Slot for the TSB8

Valid Slot for the PD3

Corresponding Slot for

the D34S

Slot 14

Slot 13

Slot 16

Table 8-34 lists the valid slots for the TSB8 and corresponding slots for the SEP and EU04.
Table 8-34 Valid slots for the TSB8 and corresponding slots for the SEP and EU04
Valid Slot for the TSB8

Valid Slot for the SEP

Corresponding Slot for

the EU04

Slot 14

Slot 13

Slot 16

Table 8-35 lists the valid slots for the TSB8 and corresponding slots for the SEP and EU08.
Table 8-35 Valid slots for the TSB8 and corresponding slots for the SEP and EU08
Valid Slot for the TSB8

Valid Slot for the SEP

Corresponding Slot for

the EU08

Slot 14

Slot 13

Slot 16

NOTE

On the T2000, the SEP is displayed as the SEP or SEP1. When interfaces are available on the front panel
of the SEP, the SEP is displayed as the SEP1 on the T2000. When the SEP is used with the interface board
to realize the TPS protection, the SEP is displayed as the SEP on the T2000.

Table 8-36 lists the valid slots for the TSB8 and corresponding slots for the EFS0 and ETS8.

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Table 8-36 Valid slots for the TSB8 and corresponding slots for the EFS0 and ETS8
Valid Slot for the TSB8

Valid Slot for the EFS0

Corresponding Slot for

the ETS8

Slot 14

Slot 13

Slot 16

Table 8-37 lists the valid slots for the TSB8 and corresponding slots for the PL3 and C34S.
Table 8-37 Valid slots for the TSB8 and corresponding slots for the PL3 and C34S
Valid Slot for the TSB8

Valid Slot for the PL3

Corresponding Slot for

the C34S

Slot 14

Slot 13

Slot 16

8.12.6 Technical Specifications

The technical specifications of the TSB8 cover the board dimensions, weight and power
consumption.

Mechanical Specifications
The mechanical specifications of the TSB8 are as follows:
l

Board dimensions (mm): 262.05 (H) x 110 (D) x 22 (W)

Weight (kg): 0.3

Power Consumption
In the normal temperature (25), the maximum power consumption of the TSB8 in the
switching state is 5 W and that of the TSB8 in the normal state is 0 W.

8.13 EFF8
This section describes the EFF8, an 8 x 100M Ethernet optical interface board, in terms of the
version, function, principle, front panel and specifications.
8.13.1 Version Description
The functional version of the EFF8 board is N1.
8.13.2 Function and Feature
The EFF8 is used to receive and transmit 8 x 100M Ethernet optical signals, and the EFF8 must
be used with the Ethernet processing board.
8.13.3 Working Principle and Signal Flow
The EFF8 consists of the interface module, switch matrix module, and power supply module.
8.13.4 Front Panel
On the front panel of the EFF8, there are indicators, interfaces, barcode and laser safety class
label.
8.13.5 Valid Slots
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When used with different Ethernet processing boards, the EFF8 can be housed in different slots.
8.13.6 Technical Specifications
The technical specifications of the EFF8 cover the optical interface specifications, board
dimensions, weight and power consumption.

8.13.1 Version Description

The functional version of the EFF8 board is N1.

8.13.2 Function and Feature

The EFF8 is used to receive and transmit 8 x 100M Ethernet optical signals, and the EFF8 must
be used with the Ethernet processing board.

8.13.3 Working Principle and Signal Flow

The EFF8 consists of the interface module, switch matrix module, and power supply module.
Figure 8-26 shows the block diagram for the functions of the EFF8 when it processes 1 x 100M
Ethernet signals.
Figure 8-26 Block diagram for the functions of the EFF8
Backplane

EFT8/ EFS0/EMS4/EMR0

100M

Interface
module
EFT8/EFS0/EMS4/EMR0

100M

+3.3 V

Power
module

Fuse

+3.3 V Backup Power

Interface Module
In the receive direction, the interface module performs the O/E convertion for the Ethernet
signals, and transmits the signals to the EFT8, EFS0, EMS4, or EMR0 board.
In the transmit direction, the interface module performs the E/O convertion for the Ethernet
signals, and transmits the signals to the optical interface.

Power Supply Module

The power supply module provides the DC voltages required by the modules of the board.

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8.13.4 Front Panel

On the front panel of the EFF8, there are indicators, interfaces, barcode and laser safety class
label.

Appearance of the Front Panel

Figure 8-27 shows the appearance of the front panel of the EFF8.
Figure 8-27 Front panel of the EFF8

EFF8

1
2
3
4
5
6
7
8
LINKACT

OUT1 IN1 OUT2 IN2 OUT3 IN3 OUT4 IN4 OUT5 IN5 OUT6 IN6 OUT7 IN7 OUT8 IN8
CLASS 1
LASER
PRODUCT

EFF8

Indicators
For indication of indicators, see A Equipment and Board Alarm Indicators.

Interfaces
There are eight pairs of optical interfaces on the front panel of the EFF8.
Table 8-38 lists the type and usage of interfaces on the EFF8.

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Table 8-38 Interfaces of the EFF8

Interface

Interface
Type

Usage

IN1IN8

LC

Receives eight (18) channels of Ethernet optical signals.

OUT1 OUT8

LC

Transmits eight (18) channels of Ethernet optical

signals.

8.13.5 Valid Slots

When used with different Ethernet processing boards, the EFF8 can be housed in different slots.
The slots valid for the EFF8 are as follows:
l

As the interface board for the EFT8, the EFF8 can be housed in any of slots 1417 in the
OptiX OSN 1500B subrack.

As the interface board for the EFS0, the EFF8 can be housed in any of slots 1417 in the
OptiX OSN 1500B subrack.

As the interface board for the EMS4, the EFF8 can be housed in any of slots 1417 in the
OptiX OSN 1500B subrack.

As the interface board for the EMR0, the EFF8 can be housed in any of slots 1417 in the
OptiX OSN 1500B subrack.

Table 8-39 lists the valid slots for the EFT8 and corresponding slots for the EFF8.
Table 8-39 Valid slots for the EFT8 and corresponding slots for the EFF8
Valid Slot for the EFT8

Corresponding Slot for the EFF8

Slot 12

Slots 14 and 15

Slot 13

Slots 16 and 17

Table 8-40 lists the valid slots for the EFS0 and corresponding slots for the EFF8.
Table 8-40 Valid slots for the EFS0 and corresponding slots for the EFF8
Valid Slot for the EFS0

Corresponding Slot for the EFF8

Slot 12

Slots 14 and 15

Slot 13

Slots 16 and 17

Table 8-41 lists the valid slots for the EMS4 and corresponding slots for the EFF8.
Table 8-41 Valid slots for the EMS4 and corresponding slots for the EFF8

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Valid Slot for the EMS4

Corresponding Slot for the EFF8

Slot 12

Slots 14 and 15
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Valid Slot for the EMS4

Corresponding Slot for the EFF8

Slot 13

Slots 16 and 17

Table 8-42 lists the valid slots for the EMR0 and corresponding slots for the EFF8.
Table 8-42 Valid slots for the EMR0 and corresponding slots for the EFF8
Valid Slot for the EMR0

Corresponding Slot for the EFF8

Slot 12

Slots 14 and 15

Slot 13

Slots 16 and 17

8.13.6 Technical Specifications

The technical specifications of the EFF8 cover the optical interface specifications, board
dimensions, weight and power consumption.

Optical Interface Specifications

Table 8-43 lists the specifications of the optical interfaces of the EFF8.
Table 8-43 Specifications of the optical interfaces of the EFF8
Item

Specification

Nominal bit rate

10 Mbit/s or 100 Mbit/s

Line code

Manchester encoding signal (10M) or MLT-3 encoding signal

(100M)

Optical interface type

100Base-FX

Working wavelength
(nm)

100Base-FX (15 km): 1261 to 1360

Optical source type

MLM

Mean launched
optical power (dBm)

100Base-FX (15 km): 15 to 8

Receiver sensitivity
(dBm)

100Base-FX (15 km): 28

Min. overload (dBm)

100Base-FX (15 km): 7

100Base-FX (2 km): 1270 to 1380

100Base-FX (2 km): 19 to 14

100Base-FX (2 km): 30

100Base-FX (2 km): 14
Min. extinction ratio
(dB)

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Mechanical Specifications
The mechanical specifications of the EFF8 are as follows:
l

Board dimensions (mm): 262.05 (H) x 110 (D) x 22 (W)

Weight (kg): 0.4

Power Consumption
In the normal temperature (25), the maximum power consumption of the EFF8 is 6 W.

8.14 ETF8
This section describes the ETF8, an 8 x 100M Ethernet twisted pair interface board, in terms of
the version, function, principle, front panel and specifications.
8.14.1 Version Description
The functional version of the ETF8 board is N1.
8.14.2 Function and Feature
The ETF8 is used to receive and transmit 8 x 100M Ethernet electrical signals, and the ETF8
must be used with the Ethernet processing board.
8.14.3 Working Principle and Signal Flow
The ETF8 consists of the interface module, switch matrix module, and power supply module.
8.14.4 Front Panel
On the front panel of the ETF8, there are interfaces and barcode.
8.14.5 Valid Slots
When used with different Ethernet processing boards, the ETF8 can be housed in different slots.
8.14.6 Technical Specifications
The technical specifications of the ETF8 cover the electrical interface specifications, board
dimensions, weight and power consumption.

8.14.1 Version Description

The functional version of the ETF8 board is N1.

8.14.2 Function and Feature

The ETF8 is used to receive and transmit 8 x 100M Ethernet electrical signals, and the ETF8
must be used with the Ethernet processing board.

8.14.3 Working Principle and Signal Flow

The ETF8 consists of the interface module, switch matrix module, and power supply module.
Figure 8-28 shows the block diagram for the functions of the ETF8 when it processes 1 x 100M
Ethernet signals.

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Figure 8-28 Block diagram for the functions of the ETF8

Backplane

EFT8/ EFS0/EMS4/EMR0

100M

Interface
module
EFT8/EFS0/EMS4/EMR0

100M

+3.3 V

Power
module

Fuse

+3.3 V Power

Interface Module
In the receive direction, the interface module performs the O/E convertion for the Ethernet
signals, and transmits the signals to the EFT8, EFS0, EMS4, or EMR0 board.
In the transmit direction, the interface module performs the E/O convertion for the Ethernet
signals, and transmits the signals to the optical interface.

Power Supply Module

The power supply module provides the DC voltages required by the modules of the board.

8.14.4 Front Panel

On the front panel of the ETF8, there are interfaces and barcode.

Appearance of the Front Panel

Figure 8-29 shows the appearance of the front panel of the ETF8.

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Figure 8-29 Front panel of the ETF8

ETF8

FE1
FE2
FE3
FE4
FE5
FE6
FE7
FE8
ETF8

Interfaces
There are eight electrical interfaces on the front panel of the ETF8.
Table 8-44 lists the type and usage of interfaces on the ETF8.
Table 8-44 Interfaces of the ETF8
Interface

Interface
Type

Usage

FE1FE8

RJ-45

Receive eight (18) channels of Ethernet electrical

signals.

Table 8-45 lists the pins of the RJ-45 connector of the ETF8.

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Table 8-45 Pins of the RJ-45 connector of the ETF8

Front View

8 7

6 5

3 2

Pin

Specification

Transmitting
positive

Transmitting
negative

Receiving positive

Grounding

Grounding

Receiving
negative

Grounding

Grounding

8.14.5 Valid Slots

When used with different Ethernet processing boards, the ETF8 can be housed in different slots.
The slots valid for the ETF8 are as follows:
l

As the interface board for the EFT8, the ETF8 can be housed in any of slots 1417 in the
OptiX OSN 1500B subrack.

As the interface board for the EFS0, the ETF8 can be housed in any of slots 1417 in the
OptiX OSN 1500B subrack.

As the interface board for the EMS4, the ETF8 can be housed in any of slots 1417 in the
OptiX OSN 1500B subrack.

As the interface board for the EMR0, the ETF8 can be housed in any of slots 1417 in the
OptiX OSN 1500B subrack.

Table 8-46 lists the valid slots for the EFT8 and corresponding slots for the ETF8.
Table 8-46 Valid slots for the EFT8 and corresponding slots for the ETF8
Valid Slot for the EFT8

Corresponding Slot for the ETF8

Slot 12

Slots 14 and 15

Slot 13

Slots 16 and 17

Table 8-47 lists the valid slots for the EFS0 and corresponding slots for the ETF8.

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Table 8-47 Valid slots for the EFS0 and corresponding slots for the ETF8
Valid Slot for the EFS0

Corresponding Slot for the ETF8

Slot 12

Slots 14 and 15

Slot 13

Slots 16 and 17

Table 8-48 lists the valid slots for the EMS4 and corresponding slots for the ETF8.
Table 8-48 Valid slots for the EMS4 and corresponding slots for the ETF8
Valid Slot for the EMS4

Corresponding Slot for the ETF8

Slot 12

Slots 14 and 15

Slot 13

Slots 16 and 17

Table 8-49 lists the valid slots for the EMR0 and corresponding slots for the ETF8.
Table 8-49 Valid slots for the EMR0 and corresponding slots for the ETF8
Valid Slot for the EMR0

Corresponding Slot for the ETF8

Slot 12

Slots 14 and 15

Slot 13

Slots 16 and 17

8.14.6 Technical Specifications

The technical specifications of the ETF8 cover the electrical interface specifications, board
dimensions, weight and power consumption.

Electrical Interface Specifications

Table 8-50 lists the specifications of the electrical interfaces of the ETF8.
Table 8-50 Specifications of the electrical interfaces of the ETF8
Item

Specification

Rate

10 Mbit/s or 100 Mbit/s

Code

Manchester encoding signal (10M) or MLT-3 encoding signal

(100M)

Interface standard

Compliant with IEEE 802.3u

Mechanical Specifications
The mechanical specifications of the ETF8 are as follows:
l

Board dimensions (mm): 262.05 (H) x 110 (D) x 22 (W)

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l

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Weight (kg): 0.4

Power Consumption
In the normal temperature (25), the maximum power consumption of the ETF8 is 2 W.

8.15 ETS8
This section describes the ETS8, an 8 x 10/100M Ethernet twisted pair interface switching board,
in terms of the version, function, principle, front panel and specifications.
8.15.1 Version Description
The functional version of the ETS8 board is N1.
8.15.2 Function and Feature
The ETS8 is used to provide the TPS protection for 8 x FE signals at the electrical interface, and
the ETS8 must be used with the EFS0.
8.15.3 Working Principle and Signal Flow
The ETS8 consists of the interface module, switch matrix module, and power supply module.
8.15.4 Front Panel
On the front panel of the ETS8, there are interfaces and barcode.
8.15.5 Valid Slots
As the interface board for the EFS0, the ETS8 can be housed in any of slots 14 and 16 in the
OptiX OSN 1500B subrack.
8.15.6 Technical Specifications
The technical specifications of the ETS8 cover the electrical interface specifications, board
dimensions, weight and power consumption.

8.15.1 Version Description

The functional version of the ETS8 board is N1.

8.15.2 Function and Feature

The ETS8 is used to provide the TPS protection for 8 x FE signals at the electrical interface, and
the ETS8 must be used with the EFS0.

8.15.3 Working Principle and Signal Flow

The ETS8 consists of the interface module, switch matrix module, and power supply module.
Figure 8-30 shows the block diagram for the functions of the ETS8 when it processes 1 x 100M
Ethernet signals.

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Figure 8-30 Block diagram for the functions of the ETS8

Backplane
Crossconnect
board

100M

Swictch
matrix
module

Interface
module
100M

+3.3 V

Power
supply
module

Fuse

EFS0
TSB8
TSB8
EFS0
+3.3 V
backeup
power

Interface Module
The interface module receives and transmits the Ethernet optical signals.

Switch Matrix Module

In the receive direction, the switch matrix module accesses signals from the interface module,
and selects the output direction of the signals according to the TPS protection control signals
from the cross-connect board. When the TPS protection is not performed, the switch matrix
module transmits the signals to the EFS0 board. When the TPS protection is performed, the
switch matrix module transmits the signals to the TSB8 board for bridging.
In the transmit direction, the working direction of the switch matrix module is the reverse of the
receive direction.

Power Supply Module

The power supply module provides the DC voltages required by the modules of the board.

8.15.4 Front Panel

On the front panel of the ETS8, there are interfaces and barcode.

Appearance of the Front Panel

Figure 8-31 shows the appearance of the front panel of the ETS8.

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Figure 8-31 Front panel of the ETS8

ETS8

FE1
FE2
FE3
FE4
FE5
FE6
FE7
FE8
ETS8

Interfaces
There are eight electrical interfaces on the front panel of the ETS8.
Table 8-51 lists the type and usage of interfaces on the ETS8.
Table 8-51 Interfaces of the ETS8
Interface

Interface
Type

Usage

FE1FE8

RJ-45

Receive eight (18) channels of Ethernet electrical

signals.

Table 8-52 lists the pins of the RJ-45 connector of the ETS8.

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Table 8-52 Pins of the RJ-45 connector of the ETS8

Front View

8 7

6 5

3 2

Pin

Specification

Transmitting positive

Transmitting negative

Receiving positive

Grounding

Grounding

Receiving negative

Grounding

Grounding

8.15.5 Valid Slots

As the interface board for the EFS0, the ETS8 can be housed in any of slots 14 and 16 in the
OptiX OSN 1500B subrack.
Table 8-53 lists the valid slots for the EFS0 and corresponding slots for the ETS8.
Table 8-53 Valid slots for the EFS0 and corresponding slots for the ETS8
Valid Slot for the EFS0

Corresponding Slot for the ETS8

Slot 12

Slot 14

Slot 13

Slot 16

8.15.6 Technical Specifications

The technical specifications of the ETS8 cover the electrical interface specifications, board
dimensions, weight and power consumption.

Electrical Interface Specifications

Table 8-54 lists the specifications of the electrical interfaces of the ETS8.
Table 8-54 Specifications of the electrical interfaces of the ETS8

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Item

Specification

Rate

10 Mbit/s or 100 Mbit/s

Code

Manchester encoding signal (10M) or MLT-3 encoding

signal (100M)

Interface standard

Compliant with IEEE 802.3u

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Mechanical Specifications
The mechanical specifications of the ETS8 are as follows:
l

Board dimensions (mm): 262.05 (H) x 110 (D) x 22 (W)

Weight (kg): 0.37

Power Consumption
In the normal temperature (25), the maximum power consumption of the ETS8 in the switching
state is 3 W and that of the ETS8 in the normal state is 0 W.

8.16 DM12
This section describes the DM12, a DDN interface board, in terms of the version, function,
principle, front panel and specifications.
8.16.1 Version Description
The functional version of the DM12 board is N1.
8.16.2 Function and Feature
The DM12 is used to receive and transmit four channels of N x 64 kbit/s and 8 x framed E1
electrical signals, and the DM12 must be used with the DX1.
8.16.3 Working Principle and Signal Flow
The DM12 consists of the interface module, switch matrix module, and power supply module.
8.16.4 Front Panel
On the front panel of the DM12, there are interfaces and barcode.
8.16.5 Valid Slots
As the interface board for the DX1, the DM12 can be housed in any of slots 1417 in the OptiX
OSN 1500B subrack.
8.16.6 Technical Specifications
The technical specifications of the DM12 cover the board dimensions, weight and power
consumption.

8.16.1 Version Description

The functional version of the DM12 board is N1.

8.16.2 Function and Feature

The DM12 is used to receive and transmit four channels of N x 64 kbit/s and 8 x framed E1
electrical signals, and the DM12 must be used with the DX1.

8.16.3 Working Principle and Signal Flow

The DM12 consists of the interface module, switch matrix module, and power supply module.
Figure 8-32 shows the block diagram for the functions of the DM12 when it processes one
channel of N x 64 kbit/s or framed E1 electrical signals.
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Figure 8-32 Block diagram for the functions of the DM12

Backplane
Crossconnect
board

Nx64kbit/s /
Frame E1

Nx64kbit/s /
Frame E1

Swictch
matrix
module

Interface
module

DX1

DX1

+3.3 V

Power
supply
module

Fuse

+3.3 V
Power

Interface Module
The interface module receives and transmits one channel of N x 64 kbit/s or framed E1 electrical
signals.

Switch Matrix Module

In the receive direction, the switch matrix module accesses signals from the interface module,
and selects the output direction of the signals according to the TPS protection control signals
from the cross-connect board. When the TPS protection is not performed, the switch matrix
module transmits the signals to the DX1 board. When the TPS protection is performed, the switch
matrix module transmits the signals to the DX1 board for bridging.
In the transmit direction, the working direction of the switch matrix module is the reverse of the
receive direction.

Power Supply Module

The power supply module provides the DC voltages required by the modules of the board.

8.16.4 Front Panel

On the front panel of the DM12, there are interfaces and barcode.

Appearance of the Front Panel

Figure 8-33 shows the appearance of the front panel of the DM12.

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Figure 8-33 Front panel of the DM12

DM12

E1(1-8)
DDN1
DDN2
DDN3
DDN4
DM12

Interfaces
On the front panel of the DM12, there are DB44 and DB28 interfaces. Table 8-55 lists the
specifications of the interfaces.
Table 8-55 Interfaces on the front panel of the DM12
Interface

Interface
Type

Usage

E1 (18)

DB44

Access 8 x framed E1 signals.

DDN1DDN4

DB28

Access four channels of N x 64 kbit/s signals.

Table 8-56 lists the pins of the DB44 interfaces.

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Table 8-56 Pins of the DB44 interfaces of the DM12

Front View
1

Pin

Specification

Pin

Specification

30

T1 to transmit
the first channel
of signals.

T8 to transmit the
eighth channel of
signals.

15
29
14
28
13
44

27
12
26
11
25
10
24
9
38
23
37
22

T2 to transmit
the second
channel of
signals.
T3 to transmit
the third channel
of signals.
T4 to transmit
the fourth
channel of
signals.
T5 to transmit
the fifth channel
of signals.
T6 to transmit
the sixth channel
of signals.
T7 to transmit
the seventh
channel of
signals.
R1 to receive the
first channel of
signals.

7
36
21
35
20
34
19
33
18
32
17
31

R3 to receive the
third channel of
signals.
R4 to receive the
fourth channel of
siganls.
R5 to receive the
fifth channel of
signals.
R6 to receive the
sixth channel of
signals.
R7 to receive the
seventh channel of
signals.

16

R8 to receive the
eighth channel of
signals.

4439, 61

Grounding

R2 to receive the
second channel
of signals.

Table 8-57 lists the pins of the DB28 interfaces.

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Table 8-57 Pins of the DB28 interfaces of the DM12

Front View
1

Pin

Specification

Pin

Specification

Transmits data
signals.

19

Receives data signals.

Transmits the
clock signals.

21

Grounds.

22

Loopbacks the
control signals.

Detects the
carrier.

23

Permits the
transmission.

Requests for
transmission.

25

Transmits the
clock of the
external
equipment.

27

Receives the
clock signals.

2
3
4
11
12
13

28

14
15
16
17
18

20

24

26

28

Prepares the
terminating
equipment.
Prepares the terminal
equipment.

8.16.5 Valid Slots

As the interface board for the DX1, the DM12 can be housed in any of slots 1417 in the OptiX
OSN 1500B subrack.
Table 8-58 lists the valid slots for the DX1 and corresponding slots for the DM12. The DM12
housed in the slot with a smaller number accesses the 8 x framed E1 signals and four channels
of N x 64 kbit/s signals. The DM12 housed in the slot with a larger number accesses only four
channels of N x 64 kbit/s signals.
Table 8-58 Valid slots for the DX1 and corresponding slots for the DM12
Valid Slot for the DX1

Corresponding Slot for the DM12

Slot 12

Slots 1 and 2

Slot 13

Slots 3 and 4

8.16.6 Technical Specifications

The technical specifications of the DM12 cover the board dimensions, weight and power
consumption.

Mechanical Specifications
The mechanical specifications of the DM12 are as follows:
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Board dimensions (mm): 262.05 (H) x 220 (D) x 25.4 (W)

Weight (kg): 0.5

Power Consumption
In the normal temperature (25), the maximum power consumption of the DM12 in the
switching state is 8 W and that of the DM12 in the normal state is 0 W.

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9 Cross-Connect and System Control Boards

Cross-Connect and System Control Boards

About This Chapter

The chapter describes the integrated boards of the cross-connect, SCC and line units at different
rates.
9.1 CXL1
This section describes the CXL1, an integrated board of the SCC, cross-connect and line units,
in terms of the version, principle, function, principle, front panel and specifications.
9.2 CXL4
This section describes the CXL4, an integrated board of the SCC, cross-connect and line units,
in terms of the version, principle, function, principle, front panel and specifications.
9.3 CXL16
This section describes the CXL16, an integrated board of the SCC, cross-connect and line units,
in terms of the version, principle, function, principle, front panel and specifications.

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9.1 CXL1
This section describes the CXL1, an integrated board of the SCC, cross-connect and line units,
in terms of the version, principle, function, principle, front panel and specifications.
9.1.1 Version Description
The functional version of the CXL1 is Q2. The Q1CXL1 is not manufactured any more. The
OptiX OSN NG-SDH equipment of V100R004 and later versions does not support the Q1CXL1.
9.1.2 Function and Feature
The CXL1 is used to process SDH signals, control communication, groom services, and to input
and output the clock.
9.1.3 Working Principle and Signal Flow
The CXL1 consists of the SDH overhead processing module, RST, MST and so on.
9.1.4 Front Panel
On the front panel of the CXL1, there are indicators, interfaces, barcode and laser safety class
label.
9.1.5 Valid Slots
The CXL1 can be housed in any of slots 45 in the subrack.
9.1.6 Board Feature Code
The code behind the board name in the barcode is the board feature code. The board feature code
of the CXL1 indicates the optical interface type.
9.1.7 Board Configuration Reference
The physical slot that houses the CXL1 is different from the logical slot displayed on the T2000.
You can use the T2000 to set parameters for the CXL1.
9.1.8 Technical Specifications
The technical specifications of the CXL1 cover the optical interface specifications, board
dimensions, weight and power consumption.

9.1.1 Version Description

The functional version of the CXL1 is Q2. The Q1CXL1 is not manufactured any more. The
OptiX OSN NG-SDH equipment of V100R004 and later versions does not support the Q1CXL1.

9.1.2 Function and Feature

The CXL1 is used to process SDH signals, control communication, groom services, and to input
and output the clock.

SDH Processing Unit

Table 9-1 lists the function and feature of the SDH processing unit of the CXL1.

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Table 9-1 Function and feature of the SDH processing unit of the CXL1
Function and
Feature

CXL1

Basic function

Transmits and receives 1 x STM-1 optical signals.

Specification of the
optical interface

Supports the optical interfaces of the I-1, S-1.1, L-1.1, L-1.2, and
Ve-1.2 types.

Specification of the
optical module

Supports detection and query of the information on the optical

module.

Supports the function of setting the on/off state of the laser and the
ALS function.

Service processing

Supports the processing of the VC-12, VC-3 and VC-4 services.

Overhead processing

Supports the processing of the SOH bytes of the STM-1 signals.

Supports the transparent transmission and termination of the POH

bytes. Supports the setting and query of the J0/J1/C2 bytes.

Alarm and
performance event

Provides rich alarms and performance events for easy management

and maintenance of the equipment.

Protection scheme

Supports the two-fiber MSP protection ring, four-fiber MSP

protection ring, linear MSP protection, and SNCP.

Maintenance feature

Supports inloop and outloop for optical interfaces.

Supports the warm reset and cold reset. The warm reset does not
affect services.

Supports the function of querying the manufacturing information

of the board.

Supports the in-service loading of the FPGA.

Supports the upgrade of the board software without affecting

services.

SCC Unit
Table 9-2 lists the function and feature of the SCC unit of the CXL1.
Table 9-2 Function and feature of the SCC unit of the CXL1

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Function and
Feature

CXL1

Basic function

Configures and monitors services, monitors the service performance,

and collects performance events and alarm information.

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Function and
Feature

CXL1

Specification of the
optical interface

Provides 10M/100M compatible Ethernet NMS interface.

Provides the F&f interface to manage the COA, and the F&f
interface is present on the auxiliary interface board.

Provides one 10M/100M Ethernet interface, which is used for

inter-board communication.

Provides one 10M Ethernet interface, which is used for

communication between the active and standby SCC boards.

Provides the RS232 OAM interface that is present on the auxiliary

interface board to connect to the PC or workstation. Supports the
remote maintenance by using the RS232 DCE modem.

DCC processing
capability

Processes 40-channel DCC.

Fan alarm
management

Manages fan alarms.

PIU management

Provides the in-service check function for the PIU board, and the
failure check function for the lightning protection module of the PIU.

Protection scheme

Supports 1+1 hot backup for the SCC unit.

Cross-Connect Unit
Table 9-3 lists the function and feature of the cross-connect unit of the CXL1.
Table 9-3 Function and feature of the cross-connect unit of the CXL1
Function and
Feature

CXL1

Basic function

Completes 20 Gbit/s non-blocking full cross-connection at the VC-4

level, and 20 Gbit/s non-blocking full cross-connection at the VC-12
or VC-3 level.

Fast emergency
channel

Provides two 4M HDLC fast emergency channels, which are used for
the MSP and SNCP protection switching.

Service processing

Dynamically grooms services.

Adds or deletes services without interrupting services.

Supports the SNCP protection at the VC-3 and VC-12 levels.

Supports concatenation services at the VC-4-4c, VC-4-8c, and

VC-4-16c levels.

Protection scheme

9-4

Supports the 1+1 hot backup (non-revertive) for the cross-connect

unit.

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Clock Unit
Table 9-4 lists the function and feature of the clock unit of the CXL1.
Table 9-4 Function and feature of the clock unit of the CXL1
Function and
Feature

CXL1

Basic function

Provides standard system synchronization clock.

Other function

Supports the extraction, insertion and management of the SSM and

clock ID.

Input and output

Inputs two-channel 2048 kHz or 2048 kbit/s timing signals, and

selects the external timing source.

Outputs two-channel 2048 Hz or 2048 kbit/s timing signals.

9.1.3 Working Principle and Signal Flow

The CXL1 consists of the SDH overhead processing module, RST, MST and so on.
Figure 9-1 shows the block diagram for the functions of the CXL1.

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Figure 9-1 Block diagram for the functions of the CXL1

Time &
synchronizaton
(SETS)

38MHz
OSC

T1
T2

SETG

T3
T4(Clock external output)

T0

Frame header
T0 (reference clock)

155MHz PLL

Line units
Tributary units
PIU
AUX

Service units
Service units

155 MHz

STM-1

DEMUX

O/E

16x155
Mbit/s data

SDH overhead processing module

RST

MST

MSA

high speed bus

Cross-connect
unit A

HPT

high speed bus

16x155
Mbit/s data

STM-1

MUX

K1/K2
insertion/
extration

Performance report

Laser shut down

O/E

K1/K2 bytes

XC
Cross Connect
(HPC)
high speed bus
SCC unit

K1/K2 bytes
process

Another
connect unit

XC
Cross Connect
(LPC)

DCC

Cross-connect
unit B

high speed bus

Laser control

Another CXL
unit

DCC

DCC
process

Line unit

ETH channels comunication

Communication and
control module

Master and slaver board comunication

ETH interface

Other unit
Another CXL

AUX

OAM interface
AUX
F&f interface

FLASH

RAM

Power monitor

Boot ROM

Phone interface

NVRAM

+3.3 V
+5V
+1.6V
+1.8V

EOW

S1-S4 interface

DC/DC
converter

Fuse

-48 V/-60V
-48 V/-60V

DC/DC
converter

+1.2V

The function modules are described as follows:

Synchronous Timing Unit

The synchronous timing unit provides system clock T0 to the service board, the control unit and
the cross-connect unit in central timing distribution mode. This unit also selects one from 12
reference clock sources as the reference clock for synchronous timing. The 12 reference clock
sources are from the line board (T1), the tributary board (T2), the external synchronous clock
source (T3) and so on. The synchronous system clock source (T0) and 2 M external synchronous
source (T4) are generated. The boards apply 1 + 1 hot backup. Therefore, both the active and
the standby boards tracing the same reference source to ensure the identity between the system
clocks of the active and the standby boards.
The synchronous timing unit can extract timing from three types of timing signal:
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Timing signal (T1) from STM-N

Timing signal (T2) from PDH

Reference signal (T3) from external synchronous clock source (2MHz or 2Mbit/s)

The clock module outputs:

l

T0, system clock (38 MHz)

T4, external timing (2 Mbit/s or 2 MHz) output by line

O/E Conversion Module

l

In receive direction, it converts the received optical signals into electrical signals.

In transmit direction, it converts the electrical signals into SDH optical signals, and then
send optical signals to fibers for transmission.

The SPI detects the R_LOS alarm and provides the laser shut down function.

MUX/DEMUX Module
l

In receive direction, the DEMUX part demultiplexes the high rate electrical signals into
multiple parallel electrical signals, and recovery the clock signal at the same time.

In transmit direction, the MUX part multiplexes the parallel electrical signals received from
the SDH overhead processing module into high rate electrical signals.

SDH Overhead Processing Module

It includes RST, MST, MSA and HPT, provides inloop and outloop function.

RST
l

In receiving direction, performs frame alignment detection (A1, A2), regenerator section
trace recovery (J0) and mismatch detection, BIP-8 errored block count.

In transmitting direction, it performs frame alignment insertion, regenerator section path

trace insertion, BIP-8 calculation and insertion.

In receiving direction, performs BIP-24 errored block count, MS_REI recovery, MS_RDI
and MS_AIS detection.

In transmitting direction, it performs BIP-24 calculation and insertion, MS_REI, MS_RDI

and MS_AIS insertion.

Provides extraction or insertion of K1 byte and K2 byte.

In receiving direction, performs AU4's pointer interpretation, LOP and AIS detection,
pointer justification.

In transmitting direction, it performs AUG assembly, AU-4 pointer regeneration, AU_AIS

generation.

MST

MSA

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HPT
l

OH termination

J1 path trace message recovery

REI information recovering

HP_RDI detection (path status monitoring

UNEQ and AIS detection (signal label monitoring)

VC-4 BIP-8 errored block count

Communication and Control Module

l

Traces the clock signal from the active and the standby cross-connect unit.

Implements laser controlling function.

Selects the clock and frame header from the active or the standby cross-connect units.

Controls the indicator on the board.

CPU control unit, which controls and monitors other function modules. The unit also
initializes other function modules after power on.

ETH interface, which provides 10/ 100 Mbit/s Ethernet interface for network management.

OAM interface, which provides serial port for network management. This port can be used
as the MODEM port and thus can be configured as a serial port to connect to MODEM port
in running state.

F&f interface, which provides F&f interface to manage COA. This serial port multiplexes
with the commissioning serial port and is the commissioning serial port in BIOS state.

COM interface for commissioning port

Ethernet port for inter-board communication: 10 Mbit/s Ethernet port between the active
and the standby CXL unit.

Cross-connect Module
The cross-connect module consists of two parts:
l

SNCP module, which tests relative alarms and reports the alarm to software to trigger SNCP
switching

Higher and lower order cross-connect module, which performs the functions of higher and
lower order cross-connect units. This module consists of higher order cross-connect unit
and lower order cross-connect unit.

Figure 9-2 illustrates the block diagram of higher and lower order cross-connect modules.

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Figure 9-2 Block diagram of higher and lower order cross-connect modules

high speed bus

high speed bus

Input
interface

Data

XC
connection

Data

Ouput
interface

Higher order
connection

XC_TOP

TX_TOP

VC_DATA_
FIFO

RX_TOP

Lower order
connection

The upper half part is the higher order cross-connect unit, which fully cross-connects 20 G higher
order services with VC-4 as the minimum service grooming granularity.
The lower half part is the lower order cross-connect unit, which cross-connects 20 G lower order
services.

Other Functions
l

Responses to and processes k bytes

Collects performance data of the optical module and shuts output of the optical module

Collects and processes DCC of each board

Inserts the DCC back into each line board after processing

Monitors the power supply of the board

Resets the unit

Cuts alarms

DC/DC Converter Module

This module provides the board with required DC voltages. It converts the 48/60 V power
supply to the following voltages: +5V, +1.6V, +1.8V +1.2V and+3.3V.

9.1.4 Front Panel

On the front panel of the CXL1, there are indicators, interfaces, barcode and laser safety class
label.

Appearance of the Front Panel

Figure 9-3 shows the front panel of the CXL1.
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Figure 9-3 Front panel of the CXL1

CXL1
STAT
ACTX
ACTC
PROG
SRVX
SRVL
SYNC
ALMC
CLASS 1
LASER
PRODUCT

OUT IN

RESET
ALM CUT

CXL1

Indicators
The following indicators are present on the front panel of the board:
l

Board hardware state indicator (STAT), which is green or red when lit.

Activating state indicator for the services at the cross-connect unit (ACTX), which is green
when lit.

Active/standby state indicator for the SCC units (ACTC), which is green when lit.

Board software state indicator (PROG), which is green or red when lit.

Alarm indicator (SRVX) for services at the cross-connect unit, which is red, green or yellow
when lit.

Alarm indicator (SRVL) for services at the line units , which is red, green or yellow when
lit.

Synchronization clock state indicator (SYNC), which is red or green when lit.

Alarm cutting indicator (ALMC), which is yellow when lit.

For indication of these indicators, see A Equipment and Board Alarm Indicators.

Interfaces
On the front panel of the CXL1, there are one optical interface and two switches. Table 9-5 lists
the type and usage of the optical interface and switches on the CXL1.

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Table 9-5 Optical interface and switches on the CXL1

Interface

Interface
Type

Usage

IN

LC

Receives optical signals. The pluggable optical module is

used for easy maintenance.

OUT

LC

Transmits optical signals. The pluggable optical module is

used for easy maintenance.

RESET

Warm reset
switch

Press the switch to reset the SCC unit.

ALM CUT

Alarm cut
switch

Press the switch to mute the alarm. Press the switch for three
seconds to mute the alarm permanently. Press the switch
again for three seconds to resume the alarm sound.

9.1.5 Valid Slots

The CXL1 can be housed in any of slots 45 in the subrack.

9.1.6 Board Feature Code

The code behind the board name in the barcode is the board feature code. The board feature code
of the CXL1 indicates the optical interface type.
Table 9-6 lists the relation between the board feature code and optical interface type for the
CXL1.
Table 9-6 Relation between the board feature code and the optical interface type
Board Barcode

Feature Code

Optical Interface Type

SSQ2CXL110 or
SSQ1CXL110

10

S-1.1 (LC)

SSQ2CXL111 or
SSQ1CXL111

11

L-1.1 (LC)

SSQ2CXL112 or
SSQ1CXL112

12

L-1.2 (LC)

SSQ2CXL113 or
SSQ1CXL113

13

Ve-1.2 (LC)

SSQ2CXL114 or
SSQ1CXL114

14

I-1 (LC)

9.1.7 Board Configuration Reference

The physical slot that houses the CXL1 is different from the logical slot displayed on the T2000.
You can use the T2000 to set parameters for the CXL1.
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Displayed Slot
The CXL1 is housed in one slot in the subrack.
The logical boards for the CXL1 are the Q1SL1, EXCL and GSCC.
Table 9-7 lists the logical slots displayed on the T2000.
Table 9-7 Logical slots displayed on the T2000 for the CXL1
Board

Logical Board

Logical Slot

CXL1

Q1SL1

Slots 45

ECXL

Slots 8081

GSCC

Slots 8283

Board Parameters
l

J1 byte

C2 byte

Clock parameters

For details on the parameters, refer to F Board Configuration Reference.

9.1.8 Technical Specifications

The technical specifications of the CXL1 cover the optical interface specifications, board
dimensions, weight and power consumption.

Optical Interface Specifications

Table 9-8 lists the specifications of the optical interfaces of the CXL1.
Table 9-8 Specifications of the optical interfaces of the CXL1

9-12

Item

Specification

Nominal bit rate

155520 kbit/s

Line code

NRZ

Optical interface
type

I-1

S-1.1

L-1.1

L-1.2

Ve-1.2

Working
wavelength (nm)

1260 to
1360

1261 to
1360

1263 to
1360

1480 to
1580

1480 to
1580

Optical source
type

MLM, LED

MLM

MLM, SLM

SLM

SLM

Mean launched
optical power
(dBm)

15 to 8

15 to 8

5 to 0

5 to 0

3 to 0

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Item

Specification

Receiver
sensitivity (dBm)

23

28

34

34

34

Min. overload
(dBm)

10

10

10

Min. extinction
ratio (dB)

8.2

8.2

10

10

10

Cross-Connect Capacity
The cross-connect capacity of the CXL1 is as follows:
l

Higher order cross-connect capacity: 20 Gbit/s

Lower order cross-connect capacity: 20 Gbit/s

Access capacity: 18.75 Gbit/s

Clock Access Capability

The clock access capability of the CXL1 is described as follows:
l

External input clock: two channels, 2048 kbit/s or 2048 kHz

External output clock: two channels, 2048 kbit/s or 2048 kHz

Laser Safety Class

The safety class of the laser on the board is CLASS 1.
The maximum launched optical power of the optical interfaces is lower than 10 dBm (10 mW).

Mechanical Specifications
The mechanical specifications of the CXL1 are as follows:
l

Board dimensions (mm): 262.05 (H) x 220 (D) x 25.4 (W)

Weight (kg): 1.1

Power Consumption
In the normal temperature (25), the maximum power consumption of the CXL1 is 40 W.

9.2 CXL4
This section describes the CXL4, an integrated board of the SCC, cross-connect and line units,
in terms of the version, principle, function, principle, front panel and specifications.
9.2.1 Version Description
The functional version of the CXL4 is Q2. The Q1CXL4 is not manufactured any more. The
OptiX OSN NG-SDH equipment of V100R004 and later versions does not support the Q1CXL4.
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9.2.2 Function and Feature

The CXL4 is used to process SDH signals, control communication, groom services, and to input
and output the clock.
9.2.3 Working Principle and Signal Flow
The CXL4 consists of the SDH overhead processing module, RST, MST and so on.
9.2.4 Front Panel
On the front panel of the CXL4, there are indicators, interfaces, barcode and laser safety class
label.
9.2.5 Valid Slots
The CXL4 can be housed in any of slots 45 in the subrack.
9.2.6 Board Feature Code
The code behind the board name in the barcode is the board feature code. The board feature code
of the CXL4 indicates the optical interface type.
9.2.7 Board Configuration Reference
The physical slot that houses the CXL4 is different from the logical slot displayed on the T2000.
You can use the T2000 to set parameters for the CXL4.
9.2.8 Technical Specifications
The technical specifications of the CXL4 cover the optical interface specifications, board
dimensions, weight and power consumption.

9.2.1 Version Description

The functional version of the CXL4 is Q2. The Q1CXL4 is not manufactured any more. The
OptiX OSN NG-SDH equipment of V100R004 and later versions does not support the Q1CXL4.

9.2.2 Function and Feature

The CXL4 is used to process SDH signals, control communication, groom services, and to input
and output the clock.

SDH Processing Unit

Table 9-9 lists the function and feature of the SDH processing unit of the CXL4.
Table 9-9 Function and feature of the SDH processing unit of the CXL4

9-14

Function and
Feature

CXL4

Basic function

Transmits and receives 1 x STM-4 optical signals.

Specifications of
optical interfaces

Supports the optical interfaces of the I-4, S-4.1, L-4.1, L-4.2, and
Ve-4.2 types.

Specifications of the
optical module

Supports detection and query of the information on the optical

module.

Supports the function of setting the on/off state of the laser and the
ALS function.

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Function and
Feature

CXL4

Service processing

Supports VC-12, VC-3, and VC-4 services and VC-4-4c

concatenation services.

Overhead processing

Supports the processing of the SOH bytes of the STM-4 signals.

Supports the transparent transmission and termination of the POH

bytes. Supports the setting and query of the J0/J1/C2 bytes.

Alarms and
performance events

Provides rich alarms and performance events for easy management

and maintenance of the equipment.

Protection schemes

Supports the two-fiber MSP protection ring, four-fiber MSP

protection ring, linear MSP protection, and SNCP.

Maintenance
features

Supports inloop and outloop for optical interfaces.

Supports warm reset and cold reset. The warm reset does not affect
services.

Supports the function of querying the manufacturing information

of the board.

Supports the in-service loading of the FPGA.

Supports the upgrade of the board software without affecting

services.

SCC Unit
Table 9-10 lists the function and feature of the SCC unit of the CXL4
Table 9-10 Function and feature of the SCC unit of the CXL4
Function and
Feature

CXL4

Basic function

Configures and monitors services, monitors the service performance,

and collencts performance events and alarm information.

Specification of the
optical interface

Provides 10M/100M compatible Ethernet NMS interface.

Provides the F&f interface to manage the COA, and the F&f
interface is on the auxiliary interface board.

Provides one 10M/100M Ethernet interface, which is used for

inter-board communication.

Provides one 10M Ethernet interface, which is used for

communication between the active and standby SCC boards.

Provides the RS232 OAM interface that is present on on the

auxiliary interface board to connect to the PC or workstation.
Supports the remote maintenance by using the RS232 DCE
modem.

DCC processing
capability
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Processes 40-channel DCC.

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Function and
Feature

CXL4

Fan alarm
management

Manages fan alarms.

PIU management

Provides the in-service check function for the PIU board, and the
failure check function for the lightning protection module of the PIU.

Protection scheme

Supports 1+1 hot backup for the SCC unit.

Cross-Connect Unit
Table 9-11 lists the function and feature of the cross-connect unit of the CXL4.
Table 9-11 Function and feature of the cross-connect unit of the CXL4
Function and
Feature

CXL4

Basic function

Completes 20 Gbit/s non-blocking full cross-connection at the VC-4

level, and 20 Gbit/s non-blocking full cross-connection at the VC-12
or VC-3 level.

Fast emergency
channel

Provides two 4M HDLC fast emergency channels, which are used for
the MSP and SNCP protection switching.

Service processing

Dynamically grooms services.

Adds or deletes services without interrupting services.

Supports the SNCP protection at the VC-3 and VC-12 levels.

Supports concatenation services at the VC-4-4c level.

Protection scheme

Supports the 1+1 hot backup (non-revertive) for the cross-connect

unit.

Clock Unit
Table 9-12 lists the function and feature of the clock unit of the CXL4.
Table 9-12 Function and feature of the clock unit of the CXL4

9-16

Function and
Feature

CXL4

Basic function

Provides standard system synchronization clock.

Other function

Supports the extraction, insertion and management of the SSM and

clock ID.

Input and output

Inputs two-channel 2048 kHz or 2048 kbit/s timing signals, and

selects the external timing source.

Outputs two-channel 2048 Hz or 2048 kbit/s timing signals.

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9.2.3 Working Principle and Signal Flow

The CXL4 consists of the SDH overhead processing module, RST, MST and so on.
Figure 9-4 shows the block diagram for the functions of the CXL4.
Figure 9-4 Block diagram for the functions of the CXL4
Time &
synchronizaton
(SETS)

38MHz
OSC

T1
T2

SETG

T3
T4(Clock external output)

T0

Frame header
T0 (reference clock)

155MHz PLL

Line units
Tributary units
PIU
AUX

Service units
Service units

155 MHz

STM-4

DEMUX

O/E

16x155
Mbit/s data

SDH overhead processing module

RST

MST

MSA

high speed bus

Cross-connect
unit A

HPT

high speed bus

16x155
Mbit/s data

STM-4

MUX

K1/K2
insertion/
extration

Performance report

Laser shut down

O/E

K1/K2 bytes

XC
Cross Connect
(HPC)
high speed bus
SCC unit

K1/K2 bytes
process

Another
connect unit

XC
Cross Connect
(LPC)

DCC

Cross-connect
unit B

high speed bus

Laser control

Another CXL
unit

DCC

DCC
process

ETH channels comunication

Communication and
control module

Master and slaver board comunication

ETH interface

Line unit

Other unit
Another CXL

AUX

OAM interface
AUX
F&f interface

FLASH

RAM

Power monitor

Boot ROM

Phone interface

NVRAM

+3.3 V
+5V
+1.6V
+1.8V

EOW

S1-S4 interface

DC/DC
converter

Fuse

-48 V/-60V
-48 V/-60V

DC/DC
converter

+1.2V

The function modules are described as follows:

Synchronous Timing Unit

The synchronous timing unit provides system clock T0 to the service board, the control unit and
the cross-connect unit in central timing distribution mode. This unit also selects one from 12
reference clock sources as the reference clock for synchronous timing. The 12 reference clock
sources are from the line board (T1), the tributary board (T2), the external synchronous clock
source (T3) and so on. The synchronous system clock source (T0) and 2 M external synchronous
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source (T4) are generated. The boards apply 1 + 1 hot backup. Therefore, both the active and
the standby boards tracing the same reference source to ensure the identity between the system
clocks of the active and the standby boards.
The synchronous timing unit can extract timing from three types of timing signal:
l

Timing signal (T1) from STM-N

Timing signal (T2) from PDH

Reference signal (T3) from external synchronous clock source (2MHz or 2Mbit/s)

The clock module outputs:

l

T0, system clock (38 MHz)

T4, external timing (2 Mbit/s or 2 MHz) output by line

O/E Conversion Module

l

In receive direction, it converts the received optical signals into electrical signals.

In transmit direction, it converts the electrical signals into SDH optical signals, and then
send optical signals to fibers for transmission.

The SPI detects the R_LOS alarm and provides the laser shut down function.

MUX/DEMUX Module
l

In receive direction, the DEMUX part demultiplexes the high rate electrical signals into
multiple parallel electrical signals, and recovery the clock signal at the same time.

In transmit direction, the MUX part multiplexes the parallel electrical signals received from
the SDH overhead processing module into high rate electrical signals.

SDH Overhead Processing Module

It includes RST, MST, MSA and HPT, provides inloop and outloop function.

RST
l

In receiving direction, performs frame alignment detection (A1, A2), regenerator section
trace recovery (J0) and mismatch detection, BIP-8 errored block count.

In transmitting direction, it performs frame alignment insertion, regenerator section path

trace insertion, BIP-8 calculation and insertion.

In receiving direction, performs BIP-24 errored block count, MS_REI recovery, MS_RDI
and MS_AIS detection.

In transmitting direction, it performs BIP-24 calculation and insertion, MS_REI, MS_RDI

and MS_AIS insertion.

Provides extraction or insertion of K1 byte and K2 byte.

In receiving direction, performs AU4's pointer interpretation, LOP and AIS detection,
pointer justification.

MST

MSA

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In transmitting direction, it performs AUG assembly, AU-4 pointer regeneration, AU_AIS

generation.

OH termination

J1 path trace message recovery

REI information recovering

HP_RDI detection (path status monitoring

UNEQ and AIS detection (signal label monitoring)

VC-4 BIP-8 errored block count

HPT

Communication and Control Module

l

Traces the clock signal from the active and the standby cross-connect unit.

Implements laser controlling function.

Selects the clock and frame header from the active or the standby cross-connect units.

Controls the indicator on the board.

CPU control unit, which controls and monitors other function modules. The unit also
initializes other function modules after power on.

ETH interface, which provides 10/ 100 Mbit/s Ethernet interface for network management.

OAM interface, which provides serial port for network management. This port can be used
as the MODEM port and thus can be configured as a serial port to connect to MODEM port
in running state.

F&f interface, which provides F&f interface to manage COA. This serial port multiplexes
with the commissioning serial port and is the commissioning serial port in BIOS state.

COM interface for commissioning port

Ethernet port for inter-board communication: 10 Mbit/s Ethernet port between the active
and the standby CXL unit.

Cross-connect Module
The cross-connect module consists of two parts:
l

SNCP module, which tests relative alarms and reports the alarm to software to trigger SNCP
switching

Higher and lower order cross-connect module, which performs the functions of higher and
lower order cross-connect units. This module consists of higher order cross-connect unit
and lower order cross-connect unit.

Figure 9-5 illustrates the block diagram of higher and lower order cross-connect modules.

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Figure 9-5 Block diagram of higher and lower order cross-connect modules

high speed bus

high speed bus

Input
interface

Data

XC
connection

Data

Ouput
interface

Higher order
connection

XC_TOP

TX_TOP

VC_DATA_
FIFO

RX_TOP

Lower order
connection

The upper half part is the higher order cross-connect unit, which fully cross-connects 20 G higher
order services with VC-4 as the minimum service grooming granularity.
The lower half part is the lower order cross-connect unit, which cross-connects 20 G lower order
services.

Other Functions
l

Responses to and processes k bytes

Collects performance data of the optical module and shuts output of the optical module

Collects and processes DCC of each board

Inserts the DCC back into each line board after processing

Monitors the power supply of the board

Resets the unit

Cuts alarms

DC/DC Converter Module

This module provides the board with required DC voltages. It converts the 48/60 V power
supply to the following voltages: +5V, +1.6V, +1.8V +1.2V and+3.3V.

9.2.4 Front Panel

On the front panel of the CXL4, there are indicators, interfaces, barcode and laser safety class
label.

Appearance of the Front Panel

Figure 9-6 shows the front panel of the CXL4.
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Figure 9-6 Front panel of the CXL4

CXL4
STAT
ACTX
ACTC
PROG
SRVX
SRVL
SYNC
ALMC
CLASS 1
LASER
PRODUCT

OUT IN

RESET

ALM CUT

CXL4

Indicators
The following indicators are present on the front panel of the board:
l

Board hardware state indicator (STAT), which is green or red when lit.

Activating state indicator for the services at the cross-connect unit (ACTX), which is green
when lit.

Active/standby state indicator for the SCC units (ACTC), which is green when lit.

Board software state indicator (PROG), which is green or red when lit.

Alarm indicator (SRVX) for services at the cross-connect unit, which is red, green or yellow
when lit.

Alarm indicator (SRVL) for services at the line units , which is red, green or yellow when
lit.

Synchronization clock state indicator (SYNC), which is red or green when lit.

Alarm cutting indicator (ALMC), which is yellow when lit.

For indication of these indicators, see A Equipment and Board Alarm Indicators.

Interfaces
On the front panel of the CXL4, there are one optical interface and two switches. Table 9-13
lists the type and usage of the optical interface and switches on the CXL4.
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Table 9-13 Optical interface and switches on the CXL4

Interface

Interface
Type

Usage

IN

LC

Receives optical signals. The pluggable optical module is

used for easy maintenance.

OUT

LC

Transmits optical signals. The pluggable optical module is

used for easy maintenance.

RESET

Warm reset
switch

Press the switch to reset the SCC unit.

ALM CUT

Alarm cut
switch

Press the switch to mute the alarm. Press the switch for three
seconds to mute the alarm permanently. Press the switch
again for three seconds to resume the alarm sound.

9.2.5 Valid Slots

The CXL4 can be housed in any of slots 45 in the subrack.

9.2.6 Board Feature Code

The code behind the board name in the barcode is the board feature code. The board feature code
of the CXL4 indicates the optical interface type.
Table 9-14 lists the relation between the board feature code and optical interface type for the
CXL4.
Table 9-14 Relation between the board feature code and the optical interface type
Board Barcode

Feature Code

Optical Interface Type

SSQ2CXL410 or
SSQ1CXL410

10

S-4.1 (LC)

SSQ2CXL411 or
SSQ1CXL411

11

L-4.1 (LC)

SSQ2CXL412 or
SSQ1CXL412

12

L-4.2 (LC)

SSQ2CXL413 or
SSQ1CXL413

13

Ve-4.2 (LC)

SSQ2CXL414 or
SSQ1CXL414

14

I-4 (LC)

9.2.7 Board Configuration Reference

The physical slot that houses the CXL4 is different from the logical slot displayed on the T2000.
You can use the T2000 to set parameters for the CXL4.
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Displayed Slot
The CXL4 is housed in one slot in the subrack.
The logical boards for the CXL4 are the Q1SL4, EXCL and GSCC.
Table 9-15 lists the logical slots displayed on the T2000.
Table 9-15 Logical slots displayed on the T2000 for the CXL4
Board

Logical Board

Logical Slot

CXL4

Q1SL4

Slots 45

ECXL

Slots 8081

GSCC

Slots 8283

Board Parameters
l

J1 byte

C2 byte

Clock parameters

For details on the parameters, refer to F Board Configuration Reference.

9.2.8 Technical Specifications

The technical specifications of the CXL4 cover the optical interface specifications, board
dimensions, weight and power consumption.

Optical Interface Specifications

Table 9-16 lists the specifications of the optical interfaces of the CXL4.
Table 9-16 Specifications of the optical interfaces of the CXL4

Issue 02 (2007-09-10)

Item

Specification

Nominal bit rate

622080 kbit/s

Line code

NRZ

Optical interface
type

I-4

S-4.1

L-4.1

L-4.2

Ve-4.2

Working
wavelength (nm)

1261 to
1360

1274 to
1356

1280 to
1335

1480 to
1580

1480 to
1580

Optical source
type

MLM

MLM

SLM

SLM

SLM

Mean launched
optical power
(dBm)

15 to 8

15 to 8

3 to 2

3 to 2

3 to 2

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Item

Specification

Receiver
sensitivity (dBm)

23

28

28

28

34

Min. overload
(dBm)

13

Min. extinction
ratio (dB)

8.2

8.2

10

10

10.5

Cross-Connect Capacity
The cross-connect capacity of the CXL4 is described as follows:
l

Higher order cross-connect capacity: 20 Gbit/s

Lower order cross-connect capacity: 20 Gbit/s

Access capacity: 18.75 Gbit/s

Clock Access Capability

The clock access capability of the CXL4 is described as follows:
l

External input clock: two channels, 2048 kbit/s or 2048 kHz

External output clock: two channels, 2048 kbit/s or 2048 kHz

Laser Safety Class

The safety class of the laser on the board is CLASS 1.
The maximum launched optical power of the optical interfaces is lower than 10 dBm (10 mW).

Mechanical Specifications
The mechanical specifications of the CXL4 are as follows:
l

Board dimensions (mm): 262.05 (H) x 220 (D) x 25.4 (W)

Weight (kg): 1.1

Power Consumption
In the normal temperature (25), the maximum power consumption of the CXL4 is 40 W.

9.3 CXL16
This section describes the CXL16, an integrated board of the SCC, cross-connect and line units,
in terms of the version, principle, function, principle, front panel and specifications.
9.3.1 Version Description
The functional version of the CXL16 is Q2. The Q1CXL16 is not manufactured any more. The
OptiX OSN NG-SDH equipment of V100R004 and later versions does not support the
Q1CXL16.
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9.3.2 Function and Feature

The CXL16 is used to process SDH signals, control communication, groom services, and to
input and output the clock.
9.3.3 Working Principle and Signal Flow
The CXL16 consists of the SDH overhead processing module, RST, MST and so on.
9.3.4 Front Panel
On the front panel of the CXL16, there are indicators, interfaces, barcode and laser safety class
label.
9.3.5 Valid Slots
The CXL16 can be housed in any of slots 45 in the subrack.
9.3.6 Board Feature Code
The code behind the board name in the barcode is the board feature code. The board feature code
of the CXL16 indicates the optical interface type.
9.3.7 Board Configuration Reference
The physical slot that houses the CXL16 is different from the logical slot displayed on the T2000.
You can use the T2000 to set parameters for the CXL16.
9.3.8 Technical Specifications
The technical specifications of the CXL16 cover the optical interface specifications, board
dimensions, weight and power consumption.

9.3.1 Version Description

The functional version of the CXL16 is Q2. The Q1CXL16 is not manufactured any more. The
OptiX OSN NG-SDH equipment of V100R004 and later versions does not support the
Q1CXL16.

9.3.2 Function and Feature

The CXL16 is used to process SDH signals, control communication, groom services, and to
input and output the clock.

SDH Processing Unit

Table 9-17 lists the function and feature of the SDH processing unit of the CXL16.
Table 9-17 Function and feature of the SDH processing unit of the CXL16

Issue 02 (2007-09-10)

Function and
Feature

CXL16

Basic function

Transmits and receives 1 x STM-16 optical signals.

Specification of the
optical interface

Supports the optical interfaces of the I-16, S-16.1, L-16.1, and L-16.2
types.

Specification of the
optical module

Supports detection and query of the information on the optical

module.

Supports the function of setting the on/off state of the laser and the
ALS function.
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Function and
Feature

CXL16

Service processing

Supports VC-12, VC-3, and VC-4 services and VC-4-4c, VC-4-8c,

and VC-4-16c concatenation services.

Overhead processing

Supports the processing of the SOH bytes of the STM-16 signals.

Supports the transparent transmission and termination of the POH

bytes. Supports the setting and query of the J0/J1/C2 bytes.

Alarm and
performance event

Provides rich alarms and performance events for easy management

and maintenance of the equipment.

Protection scheme

Supports the two-fiber MSP protection ring, four-fiber MSP

protection ring, linear MSP protection, and SNCP.

Maintenance feature

Supports inloop and outloop for optical interfaces.

Supports warm reset and cold reset. The warm reset does not affect
services.

Supports the function of querying the manufacturing information

of the board.

Supports the in-service loading of the FPGA.

Supports the upgrade of the board software without affecting

services.

SCC Unit
Table 9-18 lists the function and feature of the SCC unit of the CXL16
Table 9-18 Function and feature of the SCC unit of the CXL16
Function and
Feature

CXL16

Basic function

Configures and monitors services, monitors the service performance,

and collects performance events and alarm information.

Specification of the
optical interface

Provides 10M/100M compatible Ethernet NMS interface.

Provides the F&f interface to manage the COA, and the F&f
interface is on the auxiliary interface board.

Provides one 10M/100M Ethernet interface, which is used for

inter-board communication.

Provides one 10M Ethernet interface, which is used for

communication between the active and standby SCC boards.

Provides the RS232 OAM interface that is present on on the

auxiliary interface board to connect to the PC or workstation.
Supports the remote maintenance by using the RS232 DCE
modem.

DCC processing
capability
9-26

Processes 40-channel DCC.

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Function and
Feature

CXL16

Fan alarm
management

Manages fan alarms.

PIU management

Provides the in-service check function for the PIU board, and the
failure check function for the lightning protection module of the PIU.

Protection scheme

Supports 1+1 hot backup for the SCC unit.

Cross-Connect Unit
Table 9-19 lists the function and feature of the cross-connect unit of the CXL16.
Table 9-19 Function and feature of the cross-connect unit of the CXL16
Function and
Feature

CXL16

Basic function

Completes 20 Gbit/s non-blocking full cross-connection at the VC-4

level, and 20 Gbit/s non-blocking full cross-connection at the VC-12
or VC-3 level.

Fast emergency
channel

Provides two 4M HDLC fast emergency channels, which are used for
the MSP and SNCP protection switching.

Service processing

Dynamically grooms services, such as the cross-connect and

broadcast services.

Adds or deletes services without interrupting services.

Supports the SNCP protection at the VC-3 and VC-12 levels.

Supports concatenation services at the VC-4-4c, VC-4-8c, and

VC-4-16c levels.

Protection scheme

Supports the 1+1 hot backup (non-revertive) for the cross-connect

unit.

Clock Unit
Table 9-20 lists the function and feature of the clock unit of the CXL16.
Table 9-20 Function and feature of the clock unit of the CXL16

Issue 02 (2007-09-10)

Function and
Feature

CXL16

Basic function

Provides standard system synchronization clock.

Other function

Supports the extraction, insertion and management of the SSM and

clock ID.

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Function and
Feature

CXL16

Input and output

Inputs two-channel 2048 kHz or 2048 kbit/s timing signals, and

selects the external timing source.

Outputs two-channel 2048 Hz or 2048 kbit/s timing signals.

9.3.3 Working Principle and Signal Flow

The CXL16 consists of the SDH overhead processing module, RST, MST and so on.
Figure 9-7 shows the block diagram for the functions of the CXL16.
Figure 9-7 Block diagram for the functions of the CXL16
Time &
synchronizaton
(SETS)

38MHz
OSC

T1
T2

SETG

T3
T4(Clock external output)

T0

Frame header
T0 (reference clock)

155MHz PLL

Line units
Tributary units
PIU
AUX

Service units
Service units

155 MHz

STM-16

DEMUX

O/E

16x155
Mbit/s data

SDH overhead processing module

RST

MST

MSA

high speed bus

Cross-connect
unit A

HPT

high speed bus

16x155
Mbit/s data

STM-16

MUX

K1/K2
insertion/
extration

Performance report

Laser shut down

O/E

K1/K2 bytes

XC
Cross Connect
(HPC)
high speed bus
SCC unit

K1/K2 bytes
process

Another
connect unit

XC
Cross Connect
(LPC)

DCC

Cross-connect
unit B

high speed bus

Laser control

Another CXL
unit

DCC

DCC
process

Line unit

ETH channels comunication

Communication and
control module

Master and slaver board comunication

ETH interface

Other unit
Another CXL

AUX

OAM interface
AUX
F&f interface

FLASH

RAM

Power monitor

Boot ROM

Phone interface

NVRAM

+3.3 V
+5V
+1.6V
+1.8V

EOW

S1-S4 interface

DC/DC
converter

Fuse

-48 V/-60V
-48 V/-60V

DC/DC
converter

+1.2V

The function modules are described as follows:

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Synchronous Timing Unit

The synchronous timing unit provides system clock T0 to the service board, the control unit and
the cross-connect unit in central timing distribution mode. This unit also selects one from 12
reference clock sources as the reference clock for synchronous timing. The 12 reference clock
sources are from the line board (T1), the tributary board (T2), the external synchronous clock
source (T3) and so on. The synchronous system clock source (T0) and 2 M external synchronous
source (T4) are generated. The boards apply 1 + 1 hot backup. Therefore, both the active and
the standby boards tracing the same reference source to ensure the identity between the system
clocks of the active and the standby boards.
The synchronous timing unit can extract timing from three types of timing signal:
l

Timing signal (T1) from STM-N

Timing signal (T2) from PDH

Reference signal (T3) from external synchronous clock source (2MHz or 2Mbit/s)

The clock module outputs:

l

T0, system clock (38 MHz)

T4, external timing (2 Mbit/s or 2 MHz) output by line

O/E Conversion Module

l

In receive direction, it converts the received optical signals into electrical signals.

In transmit direction, it converts the electrical signals into SDH optical signals, and then
send optical signals to fibers for transmission.

The SPI detects the R_LOS alarm and provides the laser shut down function.

MUX/DEMUX Module
l

In receive direction, the DEMUX part demultiplexes the high rate electrical signals into
multiple parallel electrical signals, and recovery the clock signal at the same time.

In transmit direction, the MUX part multiplexes the parallel electrical signals received from
the SDH overhead processing module into high rate electrical signals.

SDH Overhead Processing Module

It includes RST, MST, MSA and HPT, provides inloop and outloop function.

RST
l

In receiving direction, performs frame alignment detection (A1, A2), regenerator section
trace recovery (J0) and mismatch detection, BIP-8 errored block count.

In transmitting direction, it performs frame alignment insertion, regenerator section path

trace insertion, BIP-8 calculation and insertion.

In receiving direction, performs BIP-24 errored block count, MS_REI recovery, MS_RDI
and MS_AIS detection.

MST

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In transmitting direction, it performs BIP-24 calculation and insertion, MS_REI, MS_RDI

and MS_AIS insertion.

Provides extraction or insertion of K1 byte and K2 byte.

In receiving direction, performs AU4's pointer interpretation, LOP and AIS detection,
pointer justification.

In transmitting direction, it performs AUG assembly, AU-4 pointer regeneration, AU_AIS

generation.

OH termination

J1 path trace message recovery

REI information recovering

HP_RDI detection (path status monitoring

UNEQ and AIS detection (signal label monitoring)

VC-4 BIP-8 errored block count

MSA

HPT

Communication and Control Module

l

Traces the clock signal from the active and the standby cross-connect unit.

Implements laser controlling function.

Selects the clock and frame header from the active or the standby cross-connect units.

Controls the indicator on the board.

CPU control unit, which controls and monitors other function modules. The unit also
initializes other function modules after power on.

ETH interface, which provides 10/ 100 Mbit/s Ethernet interface for network management.

OAM interface, which provides serial port for network management. This port can be used
as the MODEM port and thus can be configured as a serial port to connect to MODEM port
in running state.

F&f interface, which provides F&f interface to manage COA. This serial port multiplexes
with the commissioning serial port and is the commissioning serial port in BIOS state.

COM interface for commissioning port

Ethernet port for inter-board communication: 10 Mbit/s Ethernet port between the active
and the standby CXL unit.

Cross-connect Module
The cross-connect module consists of two parts:
l

SNCP module, which tests relative alarms and reports the alarm to software to trigger SNCP
switching

Higher and lower order cross-connect module, which performs the functions of higher and
lower order cross-connect units. This module consists of higher order cross-connect unit
and lower order cross-connect unit.

Figure 9-8 illustrates the block diagram of higher and lower order cross-connect modules.
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Figure 9-8 Block diagram of higher and lower order cross-connect modules

high speed bus

high speed bus

Input
interface

Data

XC
connection

Data

Ouput
interface

Higher order
connection

XC_TOP

TX_TOP

VC_DATA_
FIFO

RX_TOP

Lower order
connection

The upper half part is the higher order cross-connect unit, which fully cross-connects 20 G higher
order services with VC-4 as the minimum service grooming granularity.
The lower half part is the lower order cross-connect unit, which cross-connects 20 G lower order
services.

Other Functions
l

Responses to and processes k bytes

Collects performance data of the optical module and shuts output of the optical module

Collects and processes DCC of each board

Inserts the DCC back into each line board after processing

Monitors the power supply of the board

Resets the unit

Cuts alarms

DC Converter Module
This module provides the board with required DC voltages. It converts the 48/60 V power
supply to the following voltages: +5V, +1.6V, +1.8V +1.2V and+3.3V.

9.3.4 Front Panel

On the front panel of the CXL16, there are indicators, interfaces, barcode and laser safety class
label.

Appearance of the Front Panel

Figure 9-9 shows the front panel of the CXL16.
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Figure 9-9 Front panel of the CXL16

CXL16
STAT
ACTX
ACTC
PROG
SRVX
SRVL
SYNC
ALMC
CLASS 1
LASER
PRODUCT

OUT IN

RESET
ALM CUT

CXL16

Indicators
The following indicators are present on the front panel of the board:
l

Board hardware state indicator (STAT), which is green or red when lit.

Activating state indicator for the services at the cross-connect unit (ACTX), which is green
when lit.

Active/standby state indicator for the SCC units (ACTC), which is green when lit.

Board software state indicator (PROG), which is green or red when lit.

Alarm indicator (SRVX) for services at the cross-connect unit, which is red, green or yellow
when lit.

Alarm indicator (SRVL) for services at the line units , which is red, green or yellow when
lit.

Synchronization clock state indicator (SYNC), which is red or green when lit.

Alarm cutting indicator (ALMC), which is yellow when lit.

For indication of these indicators, see A Equipment and Board Alarm Indicators.

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Interfaces
On the front panel of the CXL16, there are one optical interface and two switches. Table 9-21
lists the type and usage of the optical interface and switches on the CXL16.
Table 9-21 Optical interface and switches on the CXL16
Interface

Interface
Type

Usage

IN

LC

Receives optical signals. The pluggable optical module is

used for easy maintenance.

OUT

LC

Transmits optical signals. The pluggable optical module is

used for easy maintenance.

RESET

Warm reset
switch

Press the switch to reset the SCC unit.

ALM CUT

Alarm cut
switch

Press the switch to mute the alarm. Press the switch for three
seconds to mute the alarm permanently. Press the switch
again for three seconds to resume the alarm sound.

9.3.5 Valid Slots

The CXL16 can be housed in any of slots 45 in the subrack.

9.3.6 Board Feature Code

The code behind the board name in the barcode is the board feature code. The board feature code
of the CXL16 indicates the optical interface type.
Table 9-22 lists the relation between the board feature code and optical interface type for the
CXL16.
Table 9-22 Relation between the board feature code and the optical interface type
Board Barcode

Feature Code

Optical Interface Type

SSQ2CXL1601

01

I-16

SSQ2CXL1602

02

S-16.1

SSQ2CXL1603

03

L-16.1

SSQ2CXL1604

04

L-16.2

9.3.7 Board Configuration Reference

The physical slot that houses the CXL16 is different from the logical slot displayed on the T2000.
You can use the T2000 to set parameters for the CXL16.

Displayed Slot
The CXL16 is housed in one slot in the subrack.
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The logical boards for the CXL16 are the Q1SL16, EXCL and GSCC.
Table 9-23 lists the logical slots displayed on the T2000.
Table 9-23 Logical slots displayed on the T2000 for the CXL16
Board

Logical Board

Logical Slot

CXL16

Q1SL16

Slots 45

ECXL

Slots 8081

GSCC

Slots 8283

Board Parameters
l

J1 byte

C2 byte

Clock parameters

For details on the parameters, refer to F Board Configuration Reference.

9.3.8 Technical Specifications

The technical specifications of the CXL16 cover the optical interface specifications, board
dimensions, weight and power consumption.

Optical Interface Specifications

Table 9-24 lists the specifications of the optical interfaces of the CXL16.
Table 9-24 Specifications of the optical interfaces of the CXL16

9-34

Item

Specification

Nominal bit rate

2488320 kbit/s

Line code

NRZ

Optical interface
type

I-16

S-16.1

L-16.1

L-16.2

Working
wavelength (nm)

1266 to 1360

1260 to 1360

1280 to 1335

1500 to 1580

Optical source
type

MLM

SLM

SLM

SLM

Mean launched
optical power
(dBm)

10 to 3

5 to 0

2 to 3

2 to 3

Receiver
sensitivity (dBm)

18

18

27

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Item

Specification

Min. overload
(dBm)

Min. extinction
ratio (dB)

8.2

8.2

8.2

8.2

Cross-Connect Capacity
The cross-connect capacity of the CXL16 described as follows:
l

Higher order cross-connect capacity: 20 Gbit/s

Lower order cross-connect capacity: 20 Gbit/s

Access capacity: 18.75 Gbit/s

Clock Access Capability

The clock access capability of the CXL16 is described as follows:
l

External input clock: two channels, 2048 kbit/s or 2048 kHz

External output clock: two channels, 2048 kbit/s or 2048 kHz

Laser Safety Class

The safety class of the laser on the board is CLASS 1.
The maximum launched optical power of the optical interfaces is lower than 10 dBm (10 mW).

Mechanical Specifications
The mechanical specifications of the CXL16 are as follows:
l

Board dimensions (mm): 262.05 (H) x 220 (D) x 25.4 (W)

Weight (kg): 1.1

Power Consumption
In the normal temperature (25), the maximum power consumption of the CXL16 is 40 W.

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10

10 Auxiliary Boards

Auxiliary Boards

About This Chapter

This chapter describes the auxiliary boards, such as the EOW, AUX, AMU, and FANA.
10.1 EOW
This section describes the EOW, an orderwire processing board, in terms of the version, function,
principle, front panel and specifications.
10.2 AUX
This section describes the AUX, a system auxiliary interface board, in terms of the version,
function, working principle, front panel and specifications.
10.3 AMU
This section describes the AMU, an orderwire processing and alarm concatenation board, in
terms of the version, function, principle, front panel and specifications.
10.4 FAN
This section describes the FAN, a fan control board, in terms of the version, function, principle,
front panel, configuration and specifications.

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10.1 EOW
This section describes the EOW, an orderwire processing board, in terms of the version, function,
principle, front panel and specifications.
10.1.1 Version Description
The functional version of the EOW is R1.
10.1.2 Function and Feature
The EOW is used to extract, insert, and process the overhead bytes E1 and E2, and other data
bytes.
10.1.3 Working Principle and Signal Flow
The EOW consists of the clock module, switch module, OHP module, and DC/DC converter
module.
10.1.4 Front Panel
On the front panel of the EOW, there are indicators and interfaces.
10.1.5 Valid Slots
The EOW can be housed in slot 9 in the subrack.
10.1.6 Technical Specifications
The technical specifications of the EOW cover the board dimensions, weight and power
consumption.

10.1.1 Version Description

The functional version of the EOW is R1.

10.1.2 Function and Feature

The EOW is used to extract, insert, and process the overhead bytes E1 and E2, and other data
bytes.
Table 10-1 lists the functions and features of the EOW.
Table 10-1 Functions and features of the EOW
Function and
Feature

EOW

Auxiliary interface

Provides four broadcast data interfaces (Serial 14).

Orderwire interface

Provides one orderwire interface.

Overhead
processing

Processes the E1, E2, and Serial 14 bytes.

10.1.3 Working Principle and Signal Flow

The EOW consists of the clock module, switch module, OHP module, and DC/DC converter
module.
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Figure 10-1 shows the block diagram for the functions of the EOW.
Figure 10-1 Block diagram for the functions of the EOW
Clock
module

S1~S4
interface

Reference clock and frame header

CXL unit A/B

S1~S4

Phone interface

SLIC

Switch
module

OHP module
E1/E2

+3.3 V

+3.3 V
+5 V
+1.8 V

DC/DC
converter

DC/DC
converter

CXL unit A/B

Fuse

-48 V/ -60 V
-48 V/ -60 V

Fuse

+3.3 V backup
power from AUX

Clock Module
The clock module first divides frequencies of the system clock and header sent from the crossconnect board. The system clock and header are then transmitted to other modules as OHP
Process module and the switch module.

Switch Module
The switch module performs non-blocking switching of 4096 x 4096 or 1024 x 1024 timeslots
under control of micro processor. The switch module can switch any timeslot of overhead signal
sent from the SCC to any timeslot of output overhead signals.

OHP Module
l

Processes E1 and E2 bytes sent by the CXL board.

Realizes interconnection between orderwire audio interface.

Interconnects with orderwire phone port through SLIC unit.

Processes serial1serial4 sent from the CXL board.

Provides S1S4 as RS232/RS422 serial transparent data interfaces, the level of which can
be set by software.

DC/DC Converter
Through the DC/DC converter module, the power converting module generates required DC
voltages for each chip. The following DC voltages are provided: +1.8 V, +3.3 V, +5 V. In
addition, protection is provided to board +3.3 V power supply.

10.1.4 Front Panel

On the front panel of the EOW, there are indicators and interfaces.
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Appearance of the Front Panel

Figure 10-2 shows the appearance of the front panel of the EOW.
Figure 10-2 Front panel of the EOW

EOW
STAT
PROG

PHONE
S1
S2
S3
S4
EOW

Indicators
The following indicators are present on the front panel of the board:
l

Board hardware state indicator (STAT), which is green or red when lit.

Board software state indicator (PROG), which is green or red when lit.

Connection status indicator (LINK), which is green when lit.

Data receiving and transmission indicator (ACT), which is orange when lit.

For indication of these indicators, see A Equipment and Board Alarm Indicators.

Interfaces
There are five interfaces on the front panel of the EOW. Table 10-2 lists the type and usage of
these interfaces.
Table 10-2 Interfaces on the front panel of the EOW

10-4

Interface

Interface
Type

Usage

PHONE

RJ-11

Orderwire phone interface

S1

RJ-45

Broadcast data interface S1

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Interface

Interface
Type

Usage

S2

RJ-45

Broadcast data interface S2

S3

RJ-45

Broadcast data interface S3

S4

RJ-45

Broadcast data interface S4

Table 10-3 lists the pins of the PHONE interface.

Table 10-3 Pins of the PHONE interface of the EOW
Front View

Pin

Usage

Signal 1

Signal 2

13 and 68

Not defined

Table 10-4 lists the pins of the S1, S2, S3 and S4 interfaces.
Table 10-4 Pins of the S1, S2, S3 and S4 interfaces of the EOW
Front View

Pin

Usage

RS-422 data transmitting positive

RS-422 data transmitting negative

RS-422 data receiving positive

RS232 data receive end

Grounding

RS-422 data receiving negative

Not defined

RS232 data transmit end

10.1.5 Valid Slots

The EOW can be housed in slot 9 in the subrack.

10.1.6 Technical Specifications

The technical specifications of the EOW cover the board dimensions, weight and power
consumption.
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Mechanical Specifications
The mechanical specifications of the EOW are as follows:
l

Board dmensions (mm): 111.8 (H) x 220 X (D) x 25.4 (W)

Weight (kg): 0.4

Power Consumption
In the normal temperature (25), the maximum power consumption of the EOW is 10 W.

10.2 AUX
This section describes the AUX, a system auxiliary interface board, in terms of the version,
function, working principle, front panel and specifications.
10.2.1 Version Description
The AUX has two versions, R1 and R2.
10.2.2 Function and Feature
The AUX is used to provide various management and auxiliary interfaces, and to provide the
central backup of the +3.3 V power supply for the boards in the subrack.
10.2.3 Working Principle and Signal Flow
The AUX consists of the control module, communication module, DC/DC converter module
and so on.
10.2.4 Jumper
A jumper, J9, is present on the lower right of the AUX. The jumper is used to set the subrack as
the main subrack or extended subrack.
10.2.5 Front Panel
On the front panel of the AUX, there are many types of interfaces.
10.2.6 Valid Slots
The AUX can be housed in slot 10 in the subrack.
10.2.7 Technical Specifications
The technical specifications of the AUX cover the board dimensions, weight and power
consumption.

10.2.1 Version Description

The AUX has two versions, R1 and R2.
The R1AUX and R2AUX are two versions developed in different periods. The two versions can
be replaced by each other.

10.2.2 Function and Feature

The AUX is used to provide various management and auxiliary interfaces, and to provide the
central backup of the +3.3 V power supply for the boards in the subrack.
Table 10-5 lists the functions and features of the AUX.
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Table 10-5 Functions and features of the AUX

Item

AUX

Management
interface

Provides the OAM/F&f interface, which supports the X.25 protocol.

Clock interface

Provides two BITS clock input interfaces and two BITS clock output
interfaces (impedance: 120 ohms).

Alarm interface

Provides three alarm input and one alarm output interfaces.

Commissioning
interface

Provides one commissioning COM interface.

Internal
communication

Realizes the inter-board communication among boards in the

subrack.

Backup and check of

the power supply

Monitors the two independent 48 power supplies in the subrack,

and performs the overvoltage (72 V) check and undervoltage (38.4
V) check.

Provides the ETH NMS interface.

Provides the central backup of the +3.3 V power supply for the
boards in the subrack, which is the 1:N protection for the secondary
power supply of each board. The power of the +3.3 V power supply
is 80 W.
Performs the overvoltage (3.8 V) check and undervoltage (3.1 V)
check on the output of the +3.3 V backup power supply.
Audible alarm

Supports the audible alarm and the clearing of the audible alarm.

10.2.3 Working Principle and Signal Flow

The AUX consists of the control module, communication module, DC/DC converter module
and so on.
Figure 10-3 shows the block diagram for the functions of the R1AUX.

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Figure 10-3 Block diagram for the functions of the R1AUX

F&f/OAM
interface

CXL

CLK
interface

CXL

Housekeeping
input/output

3 x input and
1 x output

-48 V/BAK 3.3 V

power test &
thunder-proof test

-48 V/ -60 V

Control module

COM
interface
ETH
interface

2 X 100/10 Mbit/s

100/10 Mbit/s

CXL

Communication module
100/10 Mbit/s

100/10 Mbit/s Ehernet bus

Other unit
+3.3 V

+1.8 V

DC/DC
converter

DC/DC
converter

Fuse

-48 V/ -60 V
-48 V/ -60 V
+3.3 V backup
power

Figure 10-4 shows the block diagram for the functions of the R2AUX.

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Figure 10-4 Block diagram for the functions of the R2AUX

F&f/OAM
interface

CXL

CLK
interface

CXL

Housekeeping
input/output

3 x input and
1 x output

-48 V/BAK 3.3 V

power test &
thunder-proof test

-48 V/ -60 V

Control module

COM
interface

CXL

2 x 100/10 Mbit/s

100/10 Mbit/s

CXL

Communication module
ETH
interface

100/10 Mbit/s

100/10 Mbit/s Ehernet bus

+3.3 V
+1.8 V

DC/DC
converter

DC/DC
converter

Fuse

Other
unit
-48 V/ -60 V
-48 V/ -60 V
+3.3 V backup
power

The function modules of the R1AUX board are described below:

Communication Module
This module applies LAN Switch principle to construct inter-board communication for the OptiX
OSN 1500. This module provides:
l

13 x 10/100 Mbit/s FE interfaces (12 for other boards and 1 for the local board) to connect
the SCC, the cross-connect, the line and the tributary boards for inter-board communication
of the OptiX OSN 1500.

2 x 10/100 Mbit/s FE interfaces on the front panel. One interface is the commissioning
network interface for service slots, which forms a VLAN with the 13 inter-board
communication network interfaces. The other interface is the interface for network
management.

2 x 10/100 Mbit/s FE interfaces to connect network interfaces of the CXLA and the CXLB
boards. These two interfaces and one network interface on the front panel are of the same
VLAN.

Control Module
The control module mainly consists of CPUs and monitors the running state of the board.

Alarm Input and Output Module

This module reads and sets 3 x input and 1 x output alarms.
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Detection of 48 V and Backup +3.3 V Powers and Lightening Protection Module

This module detects:
l

Over-voltage and under-voltage of 48 V and backup +3.3 V powers

System lightening protection fault

Other Function
l

F&f interface

OAM serial interface for network management

Two-in and two-out BITS clock interface (120 ohms)

COM, ETH, F&f and OAM interfaces

DC/DC Converter Module

Through the DC/DC converter module, the power converting module provides required DC
voltages for each chip on the board. +1.8 V and +3.3 V DC voltages are provided. It also provides
40 W/+3.3 V backup power supply for the system.
The function modules of the R2AUX board are described below:

Communication Module
This module applies LAN Switch principle to construct inter-board communication for the OptiX
OSN 1500. This module provides:
l

13 x 10/100 Mbit/s FE interfaces (12 for other boards and 1 for the local board) to connect
the SCC, the cross-connect, the line and the tributary boards for inter-board communication
of the OptiX OSN 1500.

2 x 10/100 Mbit/s FE interfaces on the front panel. One interface is the commissioning
network interface for service slots, which forms a VLAN with the 13 inter-board
communication network interfaces. The other interface is the interface for network
management.

2 x 10/100 Mbit/s FE interfaces to connect network interfaces of the CXLA and the CXLB
boards. These two interfaces and one network interface on the front panel are of the same
VLAN.

Control Module
The control module mainly consists of CPLDs and reports the local board state to the CXL board
through the control bus with the CXL board. This module also obtains the control information
of the local board.

Alarm Input and Output Module

This module reads and sets 3 x input and 1 x output alarms.

Detection of 48 V and Backup +3.3 V Powers and Lightening Protection Module

This module detects:
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l

Over-voltage and under-voltage of 48 V and backup +3.3 V powers

System lightening protection fault

10 Auxiliary Boards

Other Function
l

F&f interface

OAM serial interface for network management

Two-in and two-out BITS clock interface (120 ohms)

COM, ETH, F&f and OAM interfaces

DC/DC Converter Module

Through the DC/DC converter module, the power converting module provides required DC
voltages for each chip on the board. +1.8 V and +3.3 V DC voltages are provided. It also provides
40 W/+3.3 V backup power supply for the system.

10.2.4 Jumper
A jumper, J9, is present on the lower right of the AUX. The jumper is used to set the subrack as
the main subrack or extended subrack.
Figure 10-5 shows where the jumper J9 is located on the AUX board.
Figure 10-5 Position of J9 on the AUX

Power
Module
J9

Use the J9 to set the subrack as follows:

l

Cap the jumper to set the subrack as the main subrack.

Remove the cap from the jumper to set the subrack as the extended subrack.

10.2.5 Front Panel

On the front panel of the AUX, there are many types of interfaces.
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Appearance of the Front Panel

Figure 10-6 shows the appearance of the front panel of the AUX.
Figure 10-6 Front panel of the AUX

AUX

ETH
COM
CLK
ALM
OAM/F&f
AUX

Interfaces
There are five interfaces on the front panel of the AUX. Table 10-6 lists the type and usage of
these interfaces.
Table 10-6 Interfaces on the front panel of the AUX
Interface

Interface
Type

Usage

ETH

RJ-45

NM interface

COM

RJ-45

Commissioning interface

CLK

RJ-45

120-ohm external clock input/output interface

ALM

RJ-45

3 x input and 1 x output alarm interface

OAM/F&f

RJ-45

Serial NM and management interface

Table 10-7 lists the pins of the CLK interface.

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Table 10-7 Pins of the CLK interface of the AUX

Front View

Pin

Usage

Receiving negative for 120-ohm clock 1

Receiving positive for 120-ohm clock 1

Receiving negative for 120-ohm clock 2

Transmitting negative for 120-ohm clock 1

Transmitting positive for 120-ohm clock 1

Receiving positive for 120-ohm clock 2

Transmitting negative for 120-ohm clock 2

Transmitting positive for 120-ohm clock 2

Table 10-8 lists the pins of the ETH and COM interfaces.
Table 10-8 Pins of the ETH and COM interfaces of the AUX
Front View

Pin

Usage

Transmitting positive

Transmitting negative

Receiving positive

Not defined

Not defined

Receiving negative

78

Not defined

Table 10-9 lists the pins of the ALM interface.

Table 10-9 Pins of the ALM interface of the AUX
Front View

Issue 02 (2007-09-10)

Pin

Usage

Positive for critical and major alarm signal

output

Negative for critical and major alarm signal

output

Positive for minor and warning alarm signal

output

Positive for alarm signal output 1

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Front View

Pin

Usage

Negative for alarm signal output 1

Negative for minor and warning alarm signal

output

Positive for alarm signal output 2

Negative for alarm signal output 2

Controlled by the software, a specific interface can be used as the OAM or F&f interface. Table
10-10 lists pins of the interface used as the OAM interface.
Table 10-10 Pins of the OAM interface of the AUX
Front View

Pin

Usage

Requests for transmission.

Prepares the DTE.

Transmits data.

Grounds.

Grounds.

Receives data.

Prepare the DCE.

Prepares for the receiving of

signals.

Table 10-11 lists the pins of the interface used as the F&f interface.
Table 10-11 Pins of the F&f interface of the AUX
Front View

Pin

Usage

RS232 receive end

Grounding end

RS232 transmit end

13 and 67

Not defined

10.2.6 Valid Slots

The AUX can be housed in slot 10 in the subrack.
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10.2.7 Technical Specifications

The technical specifications of the AUX cover the board dimensions, weight and power
consumption.

Mechanical Specifications
The mechanical specifications of the AUX are as follows:
l

Board dmensions (mm): 111.8 (H) x 220 X (D) x 25.4 (W)

Weight (kg): 1.0

Power Consumption
In the normal temperature (25), the maximum power consumption of the AUX is 19 W.

10.3 AMU
This section describes the AMU, an orderwire processing and alarm concatenation board, in
terms of the version, function, principle, front panel and specifications.
10.3.1 Version Description
The functional version of the AMU board is R1.
10.3.2 Function and Feature
The AMU is used to provide various auxiliary, orderwire and broadcast data interfaces for the
equipment.
10.3.3 Working Principle and Signal Flow
The AMU consists of the clock module, overhead processing module and power supply module.
10.3.4 Front Panel
On the front panel of AMU, there are board indicators and interfaces of many types.
10.3.5 Valid Slots
The AMU can be housed in slot 9 in the subrack.
10.3.6 Technical Specifications
The technical specifications of the AMU cover the board dimensions, weight and power
consumption.

10.3.1 Version Description

The functional version of the AMU board is R1.

10.3.2 Function and Feature

The AMU is used to provide various auxiliary, orderwire and broadcast data interfaces for the
equipment.
Table 10-12 lists the functions and features of the AMU.

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Table 10-12 Functions and features of the AMU

Item

AMU

Auxiliary interface

Provides two broadcast data interfaces (Serial 12).

Cabinet alarm
indicator

Drives and concatenates the four cabinet indicators.

Orderwire interface

Provides one orderwire interface.

Commissioning
interface

Supports the commissioning serial port and 100M commissioning

network port, when connected to the AUX.

Overhead processing

Processes the E1, E2, and Serial 12 bytes.

Backup and check of

the power supply

Performs the overvoltage/undervoltage check on the output of the

power supply modules.

10.3.3 Working Principle and Signal Flow

The AMU consists of the clock module, overhead processing module and power supply module.
Figure 10-7 shows the block diagram for the functions of the AMU.
Figure 10-7 Block diagram for the functions of the AMU
Backplane
Clock
module

S1~S4
E1/E2

Reference clock

Overhead
process
module

CXL unit

CXL unit

Power
supply
module
3.3 V

-48 V

+3.3 V power backup

from AUX

Clock Module
The clock module extracts and processes the reference clock signals from the CXL.

Overhead Processing Module

The overhead processing module processes the E1 and E2 bytes transmitted by the CXL, and
uses the orderwire bytes for the connection of the orderwire phones. This module also processes
Serial1 and Serial2 bytes, provides transparent data interfaces RS232 and RS422, drives and
concatenates the cabinet indicators. Figure 10-8 shows the positions of the orderwire bytes in
the SDH frame.
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Figure 10-8 Positions of orderwire bytes in the SDH frame

A1

A1

A1

A2

B1

E1

D1

D2

A2

A2

J0

D3

Serial 1 Serial 2

AU_PTR
B2

B2

B2

K1

K2

D4

D5

D6

D7

D8

D9

D10

D11

D12

S1

M1

E2

Power Supply Module

The power supply module provides supplies power to the AMU board and provides centralized
+3.3 V power backup for other boards.

10.3.4 Front Panel

On the front panel of AMU, there are board indicators and interfaces of many types.

Appearance of the Front Panel

Figure 10-9 shows the appearance of the front panel of the AMU.

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Figure 10-9 Front panel of the AMU

AMU
STAT
PROG

PHONE
S1
S2
LAMP1
LAMP2
AMU

Indicators
The following indicators are present on the front panel of the board:
l

Board hardware state indicator (STAT), which is green or red when lit.

Board software state indicator (PROG), which is green or red when lit.

Connection status indicator (LINK), which is green when lit.

Data receiving and transmission indicator (ACT), which is orange when lit.

For indication of these indicators, see A Equipment and Board Alarm Indicators.

Interfaces
There are five interfaces on the front panel of the AMU. Table 10-13 lists the type and usage
of these interfaces.
Table 10-13 Interfaces on the front panel of the AMU

10-18

Interface

Interface Type

Usage

PHONE

RJ-11

Orderwire phone interface

S1

RJ-45

Broadcast data interface S1

S2

RJ-45

Broadcast data interface S2

LAMP1

RJ-45

Cabinet alarm indicator output interface

LAMP2

RJ-45

Cabinet concatenated alarm indicator input

interface

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Table 10-14 lists the pins of the PHONE interface.

Table 10-14 Pins of the PHONE interface of the AMU
Front View

Pin

Usage

Signal 1

Signal 2

13 and 68

Not defined

Table 10-15 lists the pins of the S1 and S2 interfaces.

Table 10-15 Pins of the S1 and S2 interfaces of the AMU
Front View

Pin

Usage

RS-422 data transmitting

positive

RS-422 data transmitting

negative

RS-422 data receiving positive

RS232 data receive end

Grounding

RS-422 data receiving negative

Not defined

RS232 data transmit end

Table 10-16 lists the pins of the LAMP1 and LAMP2 interfaces.
Table 10-16 Pins of the LAMP1 and LAMP2 interfaces of the AMU
Front View

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Pin

Usage

Positive for critical alarm

signals

Negative for critical alarm

signals

Positive for major alarm

signals

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Front View

Pin

Usage

Positive for power indicator

signals

Negative for power indicator

signals

Negative for major alarm

signals

Positive for minor alarm

signals

Negative for minor alarm

signals

Connection for Alarm Concatenation

The AMU provides the concatenation interface for the cabinet alarm indicators. Connect the
LAMP1 of the subrack 2 to the LAMP2 of the subrack 1. Finally, connect the LAMP1 of the
subrack 1 to the indicator interface on the top of the cabinet.
Figure 10-10 shows how to connect the cabinet alarm indicators.
Figure 10-10 Connection of the cabinet alarm indicators
Cabinet
indicators
LAMP1

LAMP2

Subrack 2
LAMP1

LAMP2

Subrack 1
Cabinet

10.3.5 Valid Slots

The AMU can be housed in slot 9 in the subrack.

10.3.6 Technical Specifications

The technical specifications of the AMU cover the board dimensions, weight and power
consumption.

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Mechanical Specifications
The mechanical specifications of the AMU are as follows:
l

Board dmensions (mm): 111.8 (H) x 220 X (D) x 25.4 (W)

Weight (kg): 0.5

Power Consumption
In the normal temperature (25), the maximum power consumption of the AMU is 8 W.

10.4 FAN
This section describes the FAN, a fan control board, in terms of the version, function, principle,
front panel, configuration and specifications.
10.4.1 Version Description
The functional version of the FAN board is R1.
10.4.2 Function and Feature
The FAN is used to adjust the fan speed, check the fan status, report the fault of the fan control
board, and to report the off-service alarm of the fan.
10.4.3 Working Principle and Signal Flow
The FAN consists of the power interface unit, soft start unit, state detecting unit and fans.
10.4.4 Front Panel
There are no indicators on the front panel of the FAN.
10.4.5 Valid Slots
The FAN can be housed in slot 20 in the subrack.
10.4.6 Technical Specifications
The technical specifications of the FAN cover the board dimensions, weight, power consumption
and working voltage.

10.4.1 Version Description

The functional version of the FAN board is R1.

10.4.2 Function and Feature

The FAN is used to adjust the fan speed, check the fan status, report the fault of the fan control
board, and to report the off-service alarm of the fan.
Table 10-17 lists the functions and features of the FAN.
Table 10-17 Functions and features of the FAN

Issue 02 (2007-09-10)

Function and
Feature

FAN

Hot swap function

Provides the hot swap function for the fan frame.

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Function and
Feature

FAN

Status check
function

Provides the function of fan status check.

Alarm check
function

Reports the fan alarm and in-service information.

10.4.3 Working Principle and Signal Flow

The FAN consists of the power interface unit, soft start unit, state detecting unit and fans.
Figure 10-11 shows the block diagram for the functions of the FAN.
Figure 10-11 Block diagram for the functions of the FAN
- 48 V 1

GND1
GND2

GND
Power
access
unit

GND

- 48 V

Delay
start unit

Fan
- 48 V

48 V

GND

- 48 V 2

Fan alarm
signals
Voltage
drop unit

- 48 V

Status
detection
unit

GND

Power Interface Unit

The power interface unit accesses the 48 V power supply for the FAN.

State Detecting Unit

This unit detects the on/off state of the fans. If any of the six fans stops, the unit reports the alarm
to the CXL to indicate the off state of the fan and drives the alarm indicator.

10.4.4 Front Panel

There are no indicators on the front panel of the FAN.

Appearance of the Front Panel

The OptiX OSN equipment applies a modular fan platform.
One OptiX OSN 1500 subrack uses one fan tray assembly.
Figure 10-12 shows the appearance of the front panel of the FAN.
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Figure 10-12 Front panel of the FAN

FAN
RUN
ALM

Indicators
The following indicators are present on the front panel of the board:
l

Board running state (RUN), which is green when lit.

Fan alarm indicator (ALM), which is red when lit.

For indication of these indicators, see A Equipment and Board Alarm Indicators.

10.4.5 Valid Slots

The FAN can be housed in slot 20 in the subrack.

10.4.6 Technical Specifications

The technical specifications of the FAN cover the board dimensions, weight, power consumption
and working voltage.

Mechanical Specifications
The mechanical specifications of the FAN are as follows:
l

Board dimensions (mm): 120 (H) x 220 (D) x 25.4 (W)

Weight (kg): 1.0

Power Consumption
In the normal temperature (25) and with 48 V input voltage, the maximum power
consumption of the FAN is 20 W.

Working Voltage
The working voltage for the FAN can be 48 V20% DC.
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11 WDM Processing Boards

WDM Processing Boards

About This Chapter

This chapter describes the WDM processing boards, such as the CMR2, CMR4, MR2, MR2A,
MR2B, MR2C, MR4, LWX, OBU1, and FIB.
11.1 CMR2
This section describes the TN11CMR2, a dual-channel optical add/drop multiplexing board, in
terms of the version, function, principle, front panel, configuration and specifications.
11.2 CMR4
This section describes the TN11CMR4, a four-channel optical add/drop multiplexing board, in
terms of the version, function, principle, front panel, configuration and specifications.
11.3 MR2
This section describes the TN11MR2, a dual-channel optical add/drop multiplexing board, in
terms of the version, function, principle, front panel, configuration and specifications.
11.4 MR2A
This section describes the MR2A, a dual-channel optical add/drop multiplexing board, in terms
of the version, function, principle, front panel, configuration and specifications.
11.5 MR2B
This section describes the MR2B, a dual-channel optical add/drop multiplexing board, in terms
of the version, function, principle, front panel, configuration and specifications.
11.6 MR2C
This section describes the MR2C, a dual-channel optical add/drop multiplexing board, in terms
of the version, function, principle, front panel, configuration and specifications.
11.7 MR4
This section describes the TN11MR4, a four-channel optical add/drop multiplexing board, in
terms of the version, function, principle, front panel, configuration and specifications.
11.8 LWX
This section describes the LWX, an arbitrary rate wavelength converting board, in terms of the
version, function, principle, front panel, configuration and specifications.
11.9 OBU1
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This section describes the TN11OBU1, an optical booster amplifier board, in terms of the
version, function, principle, front panel, configuration and specifications.
11.10 FIB
This section describes the FIB, a wavelength filter and isolation board, in terms of the version,
function, principle, front panel, configuration and specifications.

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11.1 CMR2
This section describes the TN11CMR2, a dual-channel optical add/drop multiplexing board, in
terms of the version, function, principle, front panel, configuration and specifications.
11.1.1 Version Description
The functional version of the CMR2 board is TN11.
11.1.2 Function and Feature
The CMR2 is used to the coarse code division multiple access (CDMA) system. The spacing
wavelength is 20 nm. The CMR2 supports functions and features such as add/drop multiplexing,
channel expansion and query of wavelengths.
11.1.3 Working Principle and Signal Flow
The CMR2 consists of the OADM optical module, control and communication module, and DC/
DC converter module.
11.1.4 Front Panel
On the front panel of the CMR2, there are board indicators, interfaces and laser safety class label.
11.1.5 Valid Slots
The CMR2 can be housed in any of slots 1213 in the OptiX OSN 1500A subrack, or any of
slots 1113 in the OptiX OSN 1500B subrack.
11.1.6 Board Feature Code
The board feature code of the CMR2 contains eight characters, which indicate the wavelengths
for the 2-channel optical signals processed by the board.
11.1.7 Technical Specifications
The technical specifications of the CMR2 cover the optical interface specifications, board
dimensions, weight, power consumption and laser safety class.

11.1.1 Version Description

The functional version of the CMR2 board is TN11.

11.1.2 Function and Feature

The CMR2 is used to the coarse code division multiple access (CDMA) system. The spacing
wavelength is 20 nm. The CMR2 supports functions and features such as add/drop multiplexing,
channel expansion and query of wavelengths.
Table 11-1 lists the functions and features of the CMR2.
Table 11-1 Functions and features of the CMR2

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Function and
Feature

CMR2

Basic function

Adds/Drops two wavelengths to/from the multiplexed signals.

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Function and
Feature

CMR2

Channel expansion

Provides the intermediate port used for expansion. Under certain

conditions, the capacity of upstream and downstream channels can be
expanded when the intermediate port is connected to other optical
add/drop multiplexing boards.

Wavelength query

Specifies and queries the added/dropped wavelengths.

11.1.3 Working Principle and Signal Flow

The CMR2 consists of the OADM optical module, control and communication module, and DC/
DC converter module.
Figure 11-1 shows the block diagram for the functions of the CMR2.
Figure 11-1 Block diagram for the functions of the CMR2
D01

D02

MO

MI

A01

Drop

IN

A02

Add

OUT

OADM module

Control and communication module

Power supply module

+5 V

DC/DC
converter
Delayed
startup
Fuse
SCC

Back plane

-48 V/-60 V

-48 V/-60 V

SCC

The CMR2 mainly includes the optical add/drop multiplexer (OADM) module adding/dropping
two channels of signals. The OADM adds/drops and multiplexes two channels of signals. It also
provides concatenation interfaces to connect other add/drop multiplexing boards for more
powerful add/drop capability. The CMR2 is a passive board that has no interface with the
backplane.

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OADM module
The board receives through IN one multiplexed optical signal that travels from the upstream
station. The Drop optical module drops through optical interfaces D01 and D02 two wavelengths
from the signal. These two dropped wavelengths are output from the MO optical interface.
The MI optical interface receives one multiplexed signal that travels over the main optical path.
The Add optical module adds two wavelengths through optical interfaces A01 and A02 and
multiplexes them with the signal in the main optical path into one signal. This multiplexed signal
is output through OUT.

Control and communication module

l

Controls the entire board operation.

Collects the information, such as the alarms and performance events, working status, and
voltage detection, of each functional module of the board.

Communicates data with the SCC.

DC/DC converter module

Converts 48 V DC or 60 V DC to a voltage required by each module of the board.

11.1.4 Front Panel

On the front panel of the CMR2, there are board indicators, interfaces and laser safety class label.

Appearance of the Front Panel

Figure 11-2 shows the appearance of the front panel of the CMR2.

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Figure 11-2 Front panel of the CMR2

CMR2
STAT

LASER
RADIATION
DO NOT VIEW DIRECTLY
WITH OPTICAL
INSTRUMENTS

CLASS 1M LASER
PRODUCT

OUT
IN
MO
MI
D1
A1
D2
A2

CMR2

Indicator
On the front panel of the CMR2, there is one board hardware state indicator (STAT), which is
red or green when lit.
For indication of the indicator, see A Equipment and Board Alarm Indicators.

Interfaces
There are eight optical interfaces on the front panel of the CMR2. Table 11-2 lists the type and
usage of the optical interfaces.

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Table 11-2 Optical interfaces of the CMR2

Interface

Interface
Type

Usage

A1A2

LC

Receive the signals output from the optical wavelength

converting board or centralized client-side equipment.

D1D2

LC

Transmit signals to the optical wavelength converting board

or centralized client-side equipment.

IN

LC

Receives multiplexed signals.

OUT

LC

Transmits multiplexed signals.

MO

LC

Acts as a concatenation output optical interface and connects

to the input optical interfaces of other OADM boards.

MI

LC

Acts as a concatenation input optical interface and connects

to the output optical interfaces of other OADM boards.

11.1.5 Valid Slots

The CMR2 can be housed in any of slots 1213 in the OptiX OSN 1500A subrack, or any of
slots 1113 in the OptiX OSN 1500B subrack.

11.1.6 Board Feature Code

The board feature code of the CMR2 contains eight characters, which indicate the wavelengths
for the 2-channel optical signals processed by the board.
Table 11-3 lists the details on the board feature code.
Table 11-3 Feature code of the CMR2
Barcode

Indication

Description

First four characters

Wavelength for the optical

signals

The wavelength is for the

first channel of optical
signals processed by the
board.

Last four characters

Wavelength for the optical

signals

The wavelength is for the

second channel of optical
signals processed by the
board.

For example, the feature code of the TN11CMR2 is 14711571.

l

"1471" indicates that the wavelength for the first channel of optical signals is 1471 nm.

"1571" indicates that the wavelength for the second channel of optical signals is 1571 nm.

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11.1.7 Technical Specifications

The technical specifications of the CMR2 cover the optical interface specifications, board
dimensions, weight, power consumption and laser safety class.

Optical Interface Specifications

Table 11-4 lists the specifications of optical interfaces of the CMR2.
Table 11-4 Specifications of the optical interfaces of the CMR2
Optical
Interface

Item

Specification

Working wavelength range

(nm)

12711611

Channel spacing (GHz)

20

IN-D1
IN-D2

0.5 dB passband bandwidth

(nm)

6.5

Insertion loss (dB) in the

channel for dropping
wavelengths

1.5

Adjacent channel isolation

(dB)

> 25

Non-adjacent channel
isolation (dB)

> 35

0.5 dB passband bandwidth

(nm)

6.5

Insertion loss (dB) in the

channel for adding
wavelengths

1.5

IN-MO
MI-OUT

Insertion loss (dB)

1.0

Isolation (dB)

> 13

Return loss (dB)

> 40

A1-OUT
A2-OUT

Laser Safety Class

The safety class of the laser on the board is CLASS 1M.
The maximum launched optical power of the optical interfaces ranges from 10 dBm (10 mW)
to 22.15 dBm (164 mW).

Mechanical Specifications
l

11-8

Board dimensions (mm): 262.05 (H) x 220 (D) x 25.4 (W)

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11 WDM Processing Boards

Weight (kg): 0.8

Power Consumption
l

In the normal temperature (25), the maximum power consumption of the CMR2 is 0.2
W.

In the high temperature (55), the maximum power consumption of the CMR2 is 0.3 W.

11.2 CMR4
This section describes the TN11CMR4, a four-channel optical add/drop multiplexing board, in
terms of the version, function, principle, front panel, configuration and specifications.
11.2.1 Version Description
The functional version of the CMR4 board is TN11.
11.2.2 Function and Feature
The CMR4 is used to the coarse code division multiple access (CDMA) system. The spacing
wavelength is 20 nm. The CMR4 supports functions and features such as add/drop multiplexing,
channel expansion and query of wavelengths.
11.2.3 Working Principle and Signal Flow
The CMR4 consists of the OADM optical module, control and communication module, and DC/
DC converter module.
11.2.4 Front Panel
On the front panel of the CMR4, there are board indicators, interfaces and laser safety class label.
11.2.5 Valid Slots
The CMR4 can be housed in any of slots 1213 in the OptiX OSN 1500A subrack, or any of
slots 1113 in the OptiX OSN 1500B subrack.
11.2.6 Board Feature Code
The board feature code of the CMR4 contains eight characters, which indicate the wavelengths
for the 4-channel optical signals processed by the board.
11.2.7 Technical Specifications
The technical specifications of the CMR4 cover the optical interface specifications, board
dimensions, weight, power consumption and laser safety class.

11.2.1 Version Description

The functional version of the CMR4 board is TN11.

11.2.2 Function and Feature

The CMR4 is used to the coarse code division multiple access (CDMA) system. The spacing
wavelength is 20 nm. The CMR4 supports functions and features such as add/drop multiplexing,
channel expansion and query of wavelengths.
Table 11-5 lists the functions and features of the CMR4.

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Table 11-5 Functions and features of the CMR4

Function and
Feature

CMR4

Basic function

Adds/Drops four wavelengths to/from the multiplexed signals.

Channel expansion

Provides the intermediate port used for expansion. Under certain

conditions, the capacity of upstream and downstream channels can be
expanded when the intermediate port is connected to other optical
add/drop multiplexing boards.

Wavelength query

Specifies and queries the added/dropped wavelengths.

11.2.3 Working Principle and Signal Flow

The CMR4 consists of the OADM optical module, control and communication module, and DC/
DC converter module.
Figure 11-3 shows the block diagram for the functions of the CMR4.
Figure 11-3 Block diagram for the functions of the CMR4
D01 D02 D03 D04

MO

MI

A01 A02 A03 A04

Drop

IN

Add

OUT

OADM module

Control and communication module

Power supply module

+5 V

DC/DC
converter
Delayed
startup
Fuse
SCC

Back plane

-48 V/-60 V

-48 V/-60 V

SCC

OADM module
The board receives through IN one multiplexed optical signal that travels from the upstream
station. The Drop optical module drops through optical interfaces D01D04 four wavelengths
from the signal. These four dropped wavelengths are output from the MO optical interface.
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The MI optical interface receives one multiplexed signal that travels over the main optical path.
The Add optical module adds four wavelengths through optical interfaces A01A04 and
multiplexes them with the signal in the main optical path into one signal. This multiplexed signal
is output through OUT.

Control and communication module

l

Controls the entire board operation.

Collects the information, such as the alarms and performance events, working status, and
voltage detection, of each functional module of the board.

Communicates data with the SCC.

DC/DC converter module

Converts 48 V DC or 60 V DC to a voltage required by each module of the board.

11.2.4 Front Panel

On the front panel of the CMR4, there are board indicators, interfaces and laser safety class label.

Appearance of the Front Panel

Figure 11-4 shows the appearance of the front panel of the CMR4.

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Figure 11-4 Front panel of the CMR4

CMR4
STAT

LASER
RADIATION
DO NOT VIEW DIRECTLY
WITH OPTICAL
INSTRUMENTS

CLASS 1M LASER
PRODUCT

OUT
IN
MO
MI
D1
A1
D2
A2
D3
A3
D4
A4

CMR4

Indicator
One the front panel of the CMR4, there is one board hardware state indicator (STAT), which is
red or green when lit.
For indication of the indicator, see A Equipment and Board Alarm Indicators.

Interfaces
There are twelve optical interfaces on the front panel of the CMR4. Table 11-6 lists the type
and usage of these optical interfaces.

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Table 11-6 Optical interfaces of the CMR4

Interface

Interface
Type

Usage

A1A4

LC

Receive the signals output from the optical wavelength

converting board or centralized client-side equipment.

D1D4

LC

Transmit signals to the optical wavelength converting

board or centralized client-side equipment.

IN

LC

Receives multiplexed signals.

OUT

LC

Transmits multiplexed signals.

MI

LC

Acts as a concatenation input optical interface and

connects to the output optical interfaces of other
OADM boards.

MO

LC

Acts as a concatenation output optical interface and

connects to the input optical interfaces of other OADM
boards.

11.2.5 Valid Slots

The CMR4 can be housed in any of slots 1213 in the OptiX OSN 1500A subrack, or any of
slots 1113 in the OptiX OSN 1500B subrack.

11.2.6 Board Feature Code

The board feature code of the CMR4 contains eight characters, which indicate the wavelengths
for the 4-channel optical signals processed by the board.
Table 11-7 lists the details on the board feature code.
Table 11-7 Feature code of the CMR4

Issue 02 (2007-09-10)

Barcode

Indication

Description

Characters 12

Wavelength for the optical

signals

The characters are two

middle characters of the four
that indicate the wavelength
for the first channel of optical
signals.

Characters 34

Wavelength for the optical

signals

The characters are two

middle characters of the four
that indicate the wavelength
for the second channel of
optical signals.

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Barcode

Indication

Description

Characters 56

Wavelength for the optical

signals

The characters are two

middle characters of the four
that indicate the wavelength
for the third channel of
optical signals.

Characters 78

Wavelength for the optical

signals

The characters are two

middle characters of the four
that indicate the wavelength
for the fourth channel of
optical signals.

For example, the feature code of the TN11CMR4 is 47495961.

l

"47" indicates that the wavelength for the first channel of optical signals is 1471 nm.

"49" indicates that the wavelength for the second channel of optical signals is 1491 nm.

"59" indicates that the wavelength for the third channel of optical signals is 1591 nm.

"61" indicates that the wavelength for the fourth channel of optical signals is 1611 nm.

11.2.7 Technical Specifications

The technical specifications of the CMR4 cover the optical interface specifications, board
dimensions, weight, power consumption and laser safety class.

Optical Interface Specifications

Table 11-8 lists the specifications of the optical interfaces of the CMR4.
Table 11-8 Specifications of the optical interfaces of the CMR4

11-14

Optical
Interface

Item

Specification

Working wavelength range

(nm)

1291 to 1611 (1371 nm excluded)

Channel spacing (GHz)

20

IN-D1
IN-D2
IN-D3
IN-D4

0.5 dB passband bandwidth

(nm)

6.5

Insertion loss (dB) in the

channel for dropping
wavelengths

Adjacent channel isolation

(dB)

> 25

Non-adjacent channel
isolation (dB)

> 35

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Optical
Interface

Item

Specification

A1-OUT
A2-OUT
A3-OUT
A4-OUT

0.5 dB passband bandwidth

(nm)

6.5

Insertion loss (dB) in the

channel for adding
wavelengths

IN-MO
MI-OUT

Insertion loss (dB)

1.5

Isolation (dB)

> 13

Return loss (dB)

> 40

Laser Safety Class

The safety class of the laser on the board is CLASS 1M.
The maximum launched optical power of the optical interfaces ranges from 10 dBm (10 mW)
to 22.15 dBm (164 mW).

Mechanical Specifications
l

Board dimensions (mm): 262.05 (H) x 220 (D) x 25.4 (W)

Weight (kg): 0.9

Power Consumption
l

In the normal temperature (25), the maximum power consumption of the CMR4 is 0.2
W.

In the high temperature (55), the maximum power consumption of the CMR4 is 0.3 W.

11.3 MR2
This section describes the TN11MR2, a dual-channel optical add/drop multiplexing board, in
terms of the version, function, principle, front panel, configuration and specifications.
11.3.1 Version Description
The functional version of the MR2 board is TN11.
11.3.2 Function and Feature
The MR2 is used to the coarse code division multiple access (CDMA) system. The spacing
wavelength is 0.8 nm. The MR2 supports functions and features such as add/drop multiplexing,
channel expansion and query of wavelengths.
11.3.3 Working Principle and Signal Flow
The MR2 consists of the OADM optical module, control and communication module, and DC/
DC converter module.
11.3.4 Front Panel
On the front panel of the MR2, there are board indicators, interfaces and laser safety class label.
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11.3.5 Valid Slots

The MR2 can be housed in any of slots 1213 in the OptiX OSN 1500A subrack, or any of slots
1113 in the OptiX OSN 1500B subrack.
11.3.6 Board Feature Code
The board feature code of the MR2 contains eight characters, which indicate the frequency for
the 2-channel optical signals processed by the board.
11.3.7 Technical Specifications
The technical specifications of the MR2 cover the optical interface specifications, board
dimensions, weight, power consumption and laser safety class.

11.3.1 Version Description

The functional version of the MR2 board is TN11.

11.3.2 Function and Feature

The MR2 is used to the coarse code division multiple access (CDMA) system. The spacing
wavelength is 0.8 nm. The MR2 supports functions and features such as add/drop multiplexing,
channel expansion and query of wavelengths.
Table 11-9 lists the functions and features of the MR2.
Table 11-9 Functions and features of the MR2
Function and
Feature

MR2

Basic function

Adds/Drops two wavelengths to/from the multiplexed signals.

Channel expansion

Provides the intermediate port used for expansion. Under certain

conditions, the capacity of upstream and downstream channels can be
expanded when the intermediate port is connected to other optical
add/drop multiplexing boards.

Wavelength query

Specifies and queries the added/dropped wavelengths.

11.3.3 Working Principle and Signal Flow

The MR2 consists of the OADM optical module, control and communication module, and DC/
DC converter module.
Figure 11-5 shows the block diagram for the functions of the MR2.

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Figure 11-5 Block diagram for the functions of the MR2

D01

D02

MO

MI

A01

Drop

IN

A02

Add

OUT

OADM module

Control and communication module

Power supply module

+5 V

DC/DC
converter
Delayed
startup
Fuse
SCC

Back plane

-48 V/-60 V

-48 V/-60 V

SCC

OADM module
The board receives through IN one multiplexed optical signal that travels from the upstream
station. The Drop optical module drops through optical interfaces D01 and D02 two wavelengths
from the signal. These two dropped wavelengths are output from the MO optical interface.
The MI optical interface receives one multiplexed signal that travels over the main optical path.
The Add optical module adds two wavelengths through optical interfaces A01 and A02 and
multiplexes them with the signal in the main optical path into one signal. This multiplexed signal
is output through OUT.

Control and communication module

l

Controls the entire board operation.

Collects the information, such as the alarms and performance events, working status, and
voltage detection, of each functional module of the board.

Communicates data with the SCC.

DC/DC converter module

Converts 48 V DC or 60 V DC to a voltage required by each module of the board.

11.3.4 Front Panel

On the front panel of the MR2, there are board indicators, interfaces and laser safety class label.
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Appearance of the Front Panel

Figure 11-6 shows the appearance of the front panel of the MR2.
Figure 11-6 Front panel of the MR2

MR2
STAT

LASER
RADIATION
DO NOT VIEW DIRECTLY
WITH OPTICAL
INSTRUMENTS

CLASS 1M LASER
PRODUCT

OUT
IN
MO
MI
D1
A1
D2
A2

MR2

Indicator
On the front panel of the MR2, there is one board hardware state indicator (STAT), which is red
or green when lit.
For indication of these indicators, see A Equipment and Board Alarm Indicators.

Interfaces
There are eight optical interfaces on the front panel of the MR2. Table 11-10 lists the type and
usage of the optical interfaces.

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Table 11-10 Optical interfaces of the MR2

Interface

Interface
Type

Usage

A1A2

LC

Receive the signals output from the optical wavelength

converting board or centralized client-side equipment.

D1D2

LC

Transmit signals to the optical wavelength converting

board or centralized client-side equipment.

IN

LC

Receives multiplexed signals.

OUT

LC

Transmits multiplexed signals.

MO

LC

Acts as a concatenation output optical interface and

connects to the input optical interfaces of other OADM
boards.

MI

LC

Acts as a concatenation input optical interface and

connects to the output optical interfaces of other
OADM boards.

11.3.5 Valid Slots

The MR2 can be housed in any of slots 1213 in the OptiX OSN 1500A subrack, or any of slots
1113 in the OptiX OSN 1500B subrack.

11.3.6 Board Feature Code

The board feature code of the MR2 contains eight characters, which indicate the frequency for
the 2-channel optical signals processed by the board.
Table 11-11 lists the details on the board feature code.
Table 11-11 Feature code of the MR2
Barcode

Indication

Description

First four (14) characters

Frequency of optical signals

The four characters are the

last four characters of the
figure that marks the
frequency of the first channel
of optical signals.

Last four (58) characters

Frequency of optical signals

The four characters are the

last four characters of the
figure that marks the
frequency of the second
channel of optical signals.

For example, the feature code of the TN11MR2 is 93609370.

l

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"9360" indicates that the frequency of the first channel of optical signals is 193.60 THz.
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l

"9370" indicates that the frequency of the second channel of optical signals is 193.70 THz.

11.3.7 Technical Specifications

The technical specifications of the MR2 cover the optical interface specifications, board
dimensions, weight, power consumption and laser safety class.

Optical Interface Specifications

Table 11-12 lists the specifications of the optical interfaces of the MR2.
Table 11-12 Specifications of the optical interfaces of the MR2
Optical
Interface

Item

Specification

Working wavelength range

(nm)

1529 to 1561

Channel spacing (GHz)

100

IN-D1
IN-D2

0.5 dB passband bandwidth

(nm)

0.11

Insertion loss (dB) in the

channel for dropping
wavelengths

1.5

Adjacent channel isolation

(dB)

> 25

Non-adjacent channel
isolation (dB)

> 35

0.5 dB passband bandwidth

(nm)

0.11

Insertion loss (dB) in the

channel for adding
wavelengths

1.5

IN-MO
MI-OUT

Insertion loss (dB)

1.0

Isolation (dB)

> 13

Return loss (dB)

> 40

A1-OUT
A2-OUT

Laser Safety Class

The safety class of the laser on the board is CLASS 1.
The maximum launched optical power of the optical interfaces is lower than 10 dBm (10 mW).

Mechanical Specifications
l

11-20

Board dimensions (mm): 262.05 (H) x 220 (D) x 25.4 (W)

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11 WDM Processing Boards

Weight (kg): 0.9

Power Consumption
l

In the normal temperature (25), the maximum power consumption of the MR2 is 0.2 W.

In the high temperature (55), the maximum power consumption of the MR2 is 0.3 W.

11.4 MR2A
This section describes the MR2A, a dual-channel optical add/drop multiplexing board, in terms
of the version, function, principle, front panel, configuration and specifications.
11.4.1 Version Description
The functional version of the MR2A board is N1.
11.4.2 Function and Feature
The MR2A is used to the coarse code division multiple access (CDMA) system. The spacing
wavelength is 0.8 nm. The MR2A supports functions and features such as add/drop multiplexing,
channel expansion and query of wavelengths.
11.4.3 Working Principle and Signal Flow
The MR2A consists of the OADM module, control and communication module, and DC/DC
converter module.
11.4.4 Front Panel
On the front panel of the MR2A, there are interfaces and laser safety class label.
11.4.5 Valid Slots
The MR2A can be housed in any of slots 1213 in the OptiX OSN 1500A subrack, or any of
slots 1113 in the OptiX OSN 1500B subrack.
11.4.6 Technical Specifications
The technical specifications of the MR2A cover the optical interface specifications, board
dimensions, weight, power consumption and laser safety class.

11.4.1 Version Description

The functional version of the MR2A board is N1.

11.4.2 Function and Feature

The MR2A is used to the coarse code division multiple access (CDMA) system. The spacing
wavelength is 0.8 nm. The MR2A supports functions and features such as add/drop multiplexing,
channel expansion and query of wavelengths.
Table 11-13 lists the functions and features of the MR2A.

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Table 11-13 Functions and features of the MR2A

Function and
Feature

MR2A

Basic function

Adds/Drops two arbitrary adjacent wavelengths, which are compliant

with ITU-T G.692 (DWDM). The signals are transparently
transmitted, and the working wavelength ranges from 1535.82 nm to
1560.61 nm.

OTM function

The MR2A can be used as the two-channel wavelength adding/

dropping OTM station. Two MR2C boards can be concatenated and
upgraded to the four-channel wavelength adding/dropping OTM
station. See Figure 11-7.

OADM function

Realizes the two-channel wavelength adding/dropping OADM station,

when used with the LWX. See Figure 11-8.

Central wavelength

Supports the ITU-T-compliant standard wavelength with a channel

spacing of 100 GHz.

Figure 11-7 MR2A used as the OTM station

D2

D1

IN

D1

MO IN

Drop

OUT

MI

Add
MR2A

D2

D1

MO IN

Drop

OUT
MR2A

A1

A2

MO

Drop

MI OUT

Add

D2

MI

Add
MR2A

A1

A2

(1)

A1

A2

(2)

(1)

MR2A can serve as an OTM station adding/dropping two channels.

(2)

Two MR2A boards connected in serial can serve as an OTM station adding/dropping four channels.

Figure 11-8 MR2A and LWX used as the two-channel wavelength adding/dropping OADM
station

LWX
A2

D2
MO

Out
MR2A

In
D1

MI
A1

LWX

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11.4.3 Working Principle and Signal Flow

The MR2A consists of the OADM module, control and communication module, and DC/DC
converter module.
Figure 11-9 shows the block diagram for the functions of the MR2A.
Figure 11-9 Block diagram for the functions of the MR2A
D01

D02

MO

MI

A01

Drop

IN

A02

Add

OUT

OADM module

Control and communication module

Power supply module

+5 V

DC/DC
converter
Delayed
startup
Fuse
SCC

Back plane

-48 V/-60 V

-48 V/-60 V

SCC

The MR2A mainly includes the optical add/drop multiplexer (OADM) module adding/dropping
two channels of signals. The OADM adds/drops and multiplexes two channels of signals. It also
provides concatenation interfaces to connect other add/drop multiplexing boards for more
powerful add/drop capability. The MR2A is a passive board that has no interface with the
backplane.

OADM module
The board receives through IN one multiplexed optical signal that travels from the upstream
station. The Drop optical module drops through optical interfaces D01 and D02 two wavelengths
from the signal. These two dropped wavelengths are output from the MO optical interface.
The MI optical interface receives one multiplexed signal that travels over the main optical path.
The Add optical module adds two wavelengths through optical interfaces A01 and A02 and
multiplexes them with the signal in the main optical path into one signal. This multiplexed signal
is output through OUT.

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Control and communication module

l

Controls the entire board operation.

Collects the information, such as the alarms and performance events, working status, and
voltage detection, of each functional module of the board.

Communicates data with the SCC.

DC/DC converter module

Converts 48 V DC or 60 V DC to a voltage required by each module of the board.

11.4.4 Front Panel

On the front panel of the MR2A, there are interfaces and laser safety class label.

Appearance of the Front Panel

Figure 11-10 shows the appearance of the front panel of the MR2A.
Figure 11-10 Front panel of the MR2A
MR2A

CLASS 1
LASER
PRODUCT

OUT AO1
AO2 M I
M O DO2
DO1 IN
MR2A

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Interfaces
There are four pairs of LC optical interfaces on the front panel of the MR2A. Table 11-14 lists
the type and usage of the optical interfaces.
Table 11-14 Optical interfaces of the MR2A
Interface

Interface
Type

Usage

A01A02

LC

Adds two wavelengths of signals from the local.

D01D02

LC

Drops two wavelengths of signals to the local.

IN

LC

Receives multiplexed signals of two wavelengths.

OUT

LC

Transmits multiplexed signals of two wavelengths.

MO/MI

LC

Acts as a concatenation optical interface and concatenates

several MR2A boards.

11.4.5 Valid Slots

The MR2A can be housed in any of slots 1213 in the OptiX OSN 1500A subrack, or any of
slots 1113 in the OptiX OSN 1500B subrack.

11.4.6 Technical Specifications

The technical specifications of the MR2A cover the optical interface specifications, board
dimensions, weight, power consumption and laser safety class.

Optical Interface Specifications

Table 11-15 lists the specifications of the optical interfaces of the MR2A.
Table 11-15 Specifications of the optical interfaces of the MR2A

Issue 02 (2007-09-10)

Item

Description

Working wavelength

1535.82 nm to 1560.61 nm. The working wavelengths can be

any two adjacent standard wavelengths defined in ITU-T G.692
(DWDM).

Line code

NRZ

Channel spacing (GHz)

100

Insertion loss (dB) in the

channel for adding or
dropping wavelengths

<2

Adjacent channel isolation

(dB)

> 25

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Item

Description

Non-adjacent channel
isolation (dB)

> 35

0.5 dB channel bandwidth

(nm)

< 0.11

Laser Safety Class

The safety class of the laser on the board is CLASS 1M.
The maximum launched optical power of the optical interfaces ranges from 10 dBm (10 mW)
to 22.15 dBm (164 mW).

Mechanical Specifications
The mechanical specifications of the MR2A are as follows:
l

Board dimensions (mm): 262.05 (H) x 220 (D) x 25.4 (W)

Weight (kg): 1.0

Power Consumption
In the normal temperature (25), the MR2A does not consume power.

11.5 MR2B
This section describes the MR2B, a dual-channel optical add/drop multiplexing board, in terms
of the version, function, principle, front panel, configuration and specifications.
11.5.1 Version Description
The functional version of the MR2B board is N1.
11.5.2 Function and Feature
The MR2B is used to the coarse code division multiple access (CDMA) system. The spacing
wavelength is 0.8 nm. The MR2B supports functions and features such as add/drop multiplexing,
channel expansion and query of wavelengths.
11.5.3 Working Principle and Signal Flow
The MR2B consists of the OADM module, control and communication module, and DC/DC
converter module.
11.5.4 Front Panel
On the front panel of the MR2B, there are interfaces and laser safety class label.
11.5.5 Valid Slots
The MR2B can be housed in any of slots 23, 69, and 1213 in the OptiX OSN 1500A subrack,
or any of slots 13, 69, and 1113 in the OptiX OSN 1500B subrack.
11.5.6 Technical Specifications
The technical specifications of the MR2B cover the optical interface specifications, board
dimensions, weight, power consumption and laser safety class.
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11.5.1 Version Description

The functional version of the MR2B board is N1.

11.5.2 Function and Feature

The MR2B is used to the coarse code division multiple access (CDMA) system. The spacing
wavelength is 0.8 nm. The MR2B supports functions and features such as add/drop multiplexing,
channel expansion and query of wavelengths.
Table 11-16 lists the functions and features of the MR2B.
Table 11-16 Functions and features of the MR2B
Function and
Feature

MR2B

Basic function

Adds/Drops two arbitrary adjacent wavelengths, which are

compliant with ITU-T G.692 (DWDM). The signals are
transparently transmitted, and the working wavelength ranges from
1535.82 nm to 1560.61 nm.

OTM function

The MR2B can be used as the two-channel wavelength adding/

dropping OTM station. Two MR2B boards can be concatenated and
upgraded to the four-channel wavelength adding/dropping OTM
station. See Figure 11-11.

OADM function

Realizes the two-channel wavelength adding/dropping OADM

station, when used with the LWX. See Figure 11-12.

Central wavelength

Supports the ITU-T-compliant standard central wavelength with a

channel spacing of 100 GHz.

Figure 11-11 MR2B used as the OTM station

D2

D1

IN

D1

MO IN

Drop

OUT

MI

Add
MR2B

D2

D1

MO IN

Drop

OUT
MR2B

A1

A2

MO

Drop

MI OUT

Add

D2

MI

Add
MR2B

A1

A2

(1)

A1

A2

(2)

(1) MR2B can serve as an OTM station adding/dropping two channels.

(2) Two MR2B boards connected in serial can serve as an OTM station adding/dropping four channels.

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Figure 11-12 MR2B and LWX used as the two-channel wavelength adding/dropping OADM
station

LWX
A2

D2
MO

Out

MI

MR2B

In
D1

A1
LWX

11.5.3 Working Principle and Signal Flow

The MR2B consists of the OADM module, control and communication module, and DC/DC
converter module.
Figure 11-13 shows the block diagram for the functions of the MR2B.
Figure 11-13 Block diagram for the functions of the MR2B
D01

D02

MO

MI

A01

Drop

IN

A02

Add

OUT

OADM module

Control and communication module

Power supply module

+5 V

DC/DC
converter
Delayed
startup
Fuse
SCC

Back plane

-48 V/-60 V

-48 V/-60 V

SCC

The MR2B mainly includes the optical add/drop multiplexer (OADM) module adding/dropping
two channels of signals. The OADM adds/drops and multiplexes two channels of signals. It also
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provides concatenation interfaces to connect other add/drop multiplexing boards for more
powerful add/drop capability. The MR2B is a passive board that has no interface with the
backplane.

OADM module
The board receives through IN one multiplexed optical signal that travels from the upstream
station. The Drop optical module drops through optical interfaces D01 and D02 two wavelengths
from the signal. These two dropped wavelengths are output from the MO optical interface.
The MI optical interface receives one multiplexed signal that travels over the main optical path.
The Add optical module adds two wavelengths through optical interfaces A01 and A02 and
multiplexes them with the signal in the main optical path into one signal. This multiplexed signal
is output through OUT.

Control and communication module

l

Controls the entire board operation.

Collects the information, such as the alarms and performance events, working status, and
voltage detection, of each functional module of the board.

Communicates data with the SCC.

DC/DC converter module

Converts 48 V DC or 60 V DC to a voltage required by each module of the board.

11.5.4 Front Panel

On the front panel of the MR2B, there are interfaces and laser safety class label.

Appearance of the Front Panel

Figure 11-14 shows the appearance of the front panel of the MR2B.
Figure 11-14 Front panel of the MR2B
MR
2B

MR2B
CLASS 1
LASER
PRODUCT

OUT AO1 AO2 M I

MO DO2 DO1 IN
MR2B

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Interfaces
There are four pairs of optical interfaces on the front panel of the MR2B. Table 11-17 lists the
type and usage of the optical interfaces.
Table 11-17 Optical interfaces of the MR2B
Interface

Interface
Type

Usage

A01A02

LC

Adds two wavelengths of signals from the local.

D01D02

LC

Drops two wavelengths of signals to the local.

IN

LC

Receives multiplexed signals of two wavelengths.

OUT

LC

Transmits multiplexed signals of two wavelengths.

MO/MI

LC

Acts as a concatenation optical interface and concatenates

several MR2B boards.

11.5.5 Valid Slots

The MR2B can be housed in any of slots 23, 69, and 1213 in the OptiX OSN 1500A subrack,
or any of slots 13, 69, and 1113 in the OptiX OSN 1500B subrack.

11.5.6 Technical Specifications

The technical specifications of the MR2B cover the optical interface specifications, board
dimensions, weight, power consumption and laser safety class.

Optical Interface Specifications

Table 11-18 lists the specifications of the optical interfaces of the MR2B.
Table 11-18 Specifications of the optical interfaces of the MR2B

11-30

Item

Description

Working wavelength

1535.82 nm to 1560.61 nm. The working wavelengths can be

any two adjacent standard wavelengths defined in ITU-T G.
692.

Line code

NRZ

Channel spacing (GHz)

100

Insertion loss in the

wavelength-adding
channel (dB)

<2

Adjacent channel isolation

(dB)

> 25

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Item

Description

Non-adjacent channel
isolation (dB)

> 35

0.5 dB channel bandwidth

(nm)

< 0.11

11 WDM Processing Boards

Laser Safety Class

The safety class of the laser on the board is CLASS 1.
The maximum launched optical power of the optical interfaces is lower than 10 dBm (10 mW).

Mechanical Specifications
The mechanical specifications of the MR2B are as follows:
l

Board dmensions (mm): 111.8 (H) x 220 X (D) x 25.4 (W)

Weight (kg): 1.0

Power Consumption
In the normal temperature (25), the MR2B does not consume power.

11.6 MR2C
This section describes the MR2C, a dual-channel optical add/drop multiplexing board, in terms
of the version, function, principle, front panel, configuration and specifications.
11.6.1 Version Description
The functional version of the MR2C board is N1.
11.6.2 Function and Feature
The MR2C is used to the coarse code division multiple access (CDMA) system. The spacing
wavelength is 0.8 nm. The MR2C supports functions and features such as add/drop multiplexing,
channel expansion and query of wavelengths.
11.6.3 Working Principle and Signal Flow
The MR2C consists of the OADM module, control and communication module, and DC/DC
converter module.
11.6.4 Front Panel
On the front panel of the MR2C, there are interfaces and laser safety class label.
11.6.5 Valid Slots
The MR2C can be housed in any of slots 1417 in the OptiX OSN 1500B subrack.The MR2C
can be housed in any of slots 1926 and 2936 in the subrack. If an extended subrack is used,
the MR2C can also be housed in any of slots 6976 and 7986.
11.6.6 Technical Specifications
The technical specifications of the MR2C cover the optical interface specifications, board
dimensions, weight, power consumption and laser safety class.
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11.6.1 Version Description

The functional version of the MR2C board is N1.

11.6.2 Function and Feature

The MR2C is used to the coarse code division multiple access (CDMA) system. The spacing
wavelength is 0.8 nm. The MR2C supports functions and features such as add/drop multiplexing,
channel expansion and query of wavelengths.
Table 11-19 lists the functions and features of the MR2C.
Table 11-19 Functions and features of the MR2C
Function and
Feature

MR2C

Basic function

Adds/Drops two arbitrary adjacent wavelengths, which are

compliant with ITU-T G.692 (DWDM). The signals are
transparently transmitted, and the working wavelength ranges from
1535.82 nm to 1560.61 nm.

OTM function

The MR2C can be used as the two-channel wavelength adding/

dropping OTM station. Two MR2C boards can be concatenated and
upgraded to the four-channel wavelength adding/dropping OTM
station. See Figure 11-15.

OADM function

Realizes the two-channel wavelength adding/dropping OADM

station, when used with the LWX. See Figure 11-16.

Central wavelength

Supports the ITU-T-compliant standard wavelength with a channel

spacing of 100 GHz.

Figure 11-15 MR2C used as the OTM station

D2

D1

IN

D1

MO IN

Drop

OUT

MI

Add
MR2C

D2

D1

MO IN

Drop

OUT
MR2C

A1

A2

MO

Drop

MI OUT

Add

D2

MI

Add
MR2C

A1

A2

(1)

A1

A2

(2)

(1) MR2C can serve as an OTM station adding/dropping two channels.

(2) Two MR2C boards connected in serial can serve as an OTM station adding/dropping four channels.

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Figure 11-16 Two-channel wavelength adding/dropping OADM station realized by the MR2C
and LWX

LWX
A2

D2
MO

Out

MI

MR2C

In
D1

A1
LWX

11.6.3 Working Principle and Signal Flow

The MR2C consists of the OADM module, control and communication module, and DC/DC
converter module.
Figure 11-17 shows the block diagram for the functions of the MR2C.
Figure 11-17 Block diagram for the functions of the MR2C
D01

D02

MO

MI

A01

Drop

IN

A02

Add

OUT

OADM module

Control and communication module

Power supply module

+5 V

DC/DC
converter
Delayed
startup
Fuse
SCC

Back plane

-48 V/-60 V

-48 V/-60 V

SCC

The MR2C mainly includes the optical add/drop multiplexer (OADM) module adding/dropping
two channels of signals. The OADM adds/drops and multiplexes two channels of signals. It also
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provides concatenation interfaces to connect other add/drop multiplexing boards for more
powerful add/drop capability. The MR2C is a passive board that has no interface with the
backplane.

OADM module
The board receives through IN one multiplexed optical signal that travels from the upstream
station. The Drop optical module drops through optical interfaces D01 and D02 two wavelengths
from the signal. These two dropped wavelengths are output from the MO optical interface.
The MI optical interface receives one multiplexed signal that travels over the main optical path.
The Add optical module adds two wavelengths through optical interfaces A01 and A02 and
multiplexes them with the signal in the main optical path into one signal. This multiplexed signal
is output through OUT.

Control and communication module

l

Controls the entire board operation.

Collects the information, such as the alarms and performance events, working status, and
voltage detection, of each functional module of the board.

Communicates data with the SCC.

DC/DC converter module

Converts 48 V DC or 60 V DC to a voltage required by each module of the board.

11.6.4 Front Panel

On the front panel of the MR2C, there are interfaces and laser safety class label.

Appearance of the Front Panel

Figure 11-18 shows the appearance of the front panel of the MR2C.

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Figure 11-18 Front panel of the MR2C

MR2C

CLASS 1
LASER
PRODUCT

OUT AO1
AO2 M I
M O DO2
DO1 IN
MR2C

Interfaces
There is four pairs of optical interfaces on the front panel of the MR2C. Table 11-20 lists the
type and usage of the optical interfaces.
Table 11-20 Optical interfaces of the MR2C

Issue 02 (2007-09-10)

Interface

Interface
Type

Usage

A01A02

LC

Adds two wavelengths of signals from the local.

D01D02

LC

Drops two wavelengths of signals to the local.

IN

LC

Receives multiplexed signals of two wavelengths.

OUT

LC

Transmits multiplexed signals of two wavelengths.

MO/MI

LC

Acts as a concatenation optical interface and concatenates

several MR2C boards.

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11.6.5 Valid Slots

The MR2C can be housed in any of slots 1417 in the OptiX OSN 1500B subrack.The MR2C
can be housed in any of slots 1926 and 2936 in the subrack. If an extended subrack is used,
the MR2C can also be housed in any of slots 6976 and 7986.

11.6.6 Technical Specifications

The technical specifications of the MR2C cover the optical interface specifications, board
dimensions, weight, power consumption and laser safety class.

Optical Interface Specifications

Table 11-21 lists the specifications of the optical interfaces of the MR2C.
Table 11-21 Specifications of the optical interfaces of the MR2C
Item

Description

Working wavelength

1535.82 nm to 1560.61 nm. The working wavelengths can be

any two adjacent standard wavelengths defined in ITU-T G.
692.

Line code

NRZ

Channel spacing (GHz)

100

Insertion loss in the add/

drop channel (dB)

<2

Adjacent channel isolation

(dB)

> 25

Non-adjacent channel
isolation (dB)

> 35

0.5 dB channel bandwidth

(nm)

< 0.11

Laser Safety Class

The safety class of the laser on the board is CLASS 1.
The maximum launched optical power of the optical interfaces is lower than 10 dBm (10 mW).

Mechanical Specifications
The mechanical specifications of the MR2C are as follows:
l

Board dimensions (mm): 262.05 (H) x 110 (D) x 22 (W)

Weight (kg): 1.0

Power Consumption
In the normal temperature (25), the MR2C does not consume power.
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11.7 MR4
This section describes the TN11MR4, a four-channel optical add/drop multiplexing board, in
terms of the version, function, principle, front panel, configuration and specifications.
11.7.1 Version Description
The functional version of the MR4 board is TN11.
11.7.2 Function and Feature
The MR4 is used to the coarse code division multiple access (CDMA) system. The spacing
wavelength is 0.8 nm. The MR4 supports functions and features such as add/drop multiplexing,
channel expansion and query of wavelengths.
11.7.3 Working Principle and Signal Flow
The MR4 consists of the OADM optical module, control and communication module, and DC/
DC converter module.
11.7.4 Front Panel
On the front panel of the MR4, there are board indicators, interfaces and laser safety class label.
11.7.5 Valid Slots
The MR4 can be housed in any of slots 1213 in the OptiX OSN 1500A subrack, or any of slots
1113 in the OptiX OSN 1500B subrack.
11.7.6 Board Feature Code
The feature code of the MR4 has eight numbers, which identify the frequency of the first and
fourth channels of optical signals the board process.
11.7.7 Technical Specifications
The technical specifications of the MR4 cover the optical interface specifications, board
dimensions, weight, power consumption and laser safety class.

11.7.1 Version Description

The functional version of the MR4 board is TN11.

11.7.2 Function and Feature

The MR4 is used to the coarse code division multiple access (CDMA) system. The spacing
wavelength is 0.8 nm. The MR4 supports functions and features such as add/drop multiplexing,
channel expansion and query of wavelengths.
Table 11-22 lists the functions and features of the MR4.
Table 11-22 Functions and features of the MR4

Issue 02 (2007-09-10)

Function and
Feature

MR4

Basic function

Adds/Drops four wavelengths to/from the multiplexed signals.

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Function and
Feature

MR4

Channel expansion

Provides the intermediate port used for expansion. Under certain

conditions, the capacity of upstream and downstream channels can be
expanded when the intermediate port is connected to other optical
add/drop multiplexing boards.

Wavelength query

Specifies and queries the added/dropped wavelengths.

11.7.3 Working Principle and Signal Flow

The MR4 consists of the OADM optical module, control and communication module, and DC/
DC converter module.
Figure 11-19 shows the block diagram for the functions of the MR4.
Figure 11-19 Block diagram for the functions of the MR4
D01 D02 D03 D04

MO

MI

A01 A02 A03 A04

Drop

IN

Add

OUT

OADM module

Control and communication module

Power supply module

+5 V

DC/DC
converter
Delayed
startup
Fuse
SCC

Back plane

-48 V/-60 V

-48 V/-60 V

SCC

OADM module
The board receives through IN one multiplexed optical signal that travels from the upstream
station. The Drop optical module drops through optical interfaces D01D04 four wavelengths
from the signal. These four dropped wavelengths are output from the MO optical interface.
The MI optical interface receives one multiplexed signal that travels over the main optical path.
The Add optical module adds four wavelengths through optical interfaces A01A04 and
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multiplexes them with the signal in the main optical path into one signal. This multiplexed signal
is output through OUT.

Control and communication module

l

Controls the entire board operation.

Collects the information, such as the alarms and performance events, working status, and
voltage detection, of each functional module of the board.

Communicates data with the SCC.

DC/DC converter module

Converts 48 V DC or 60 V DC to a voltage required by each module of the board.

11.7.4 Front Panel

On the front panel of the MR4, there are board indicators, interfaces and laser safety class label.

Appearance of the Front Panel

Figure 11-20 shows the appearance of the front panel of the MR4.

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Figure 11-20 Front panel of the MR4

MR4
STAT

LASER
RADIATION
DO NOT VIEW DIRECTLY
WITH OPTICAL
INSTRUMENTS

CLASS 1M LASER
PRODUCT

OUT
IN
MO
MI
D1
A1
D2
A2
D3
A3
D4
A4

MR4

Indicator
On the front panel of the MR4, there is one board hardware state indicator (STAT), which is red
or green when lit.
For indication of these indicators, see A Equipment and Board Alarm Indicators.

Interfaces
There are twelve optical interfaces on the front panel of the MR4. Table 11-23 lists the type and
usage of the optical interfaces.

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Table 11-23 Optical interfaces of the MR4

Interface

Interface
Type

Usage

A1A4

LC

Receive the signals output from the optical wavelength

converting board or centralized client-side equipment.

D1D4

LC

Transmit signals to the optical wavelength converting

board or centralized client-side equipment.

IN

LC

Receives multiplexed signals.

OUT

LC

Transmits multiplexed signals.

MI

LC

Acts as a concatenation input optical interface and

connects to the output optical interfaces of other
OADM boards.

MO

LC

Acts as a concatenation output optical interface and

connects to the input optical interfaces of other OADM
boards.

11.7.5 Valid Slots

The MR4 can be housed in any of slots 1213 in the OptiX OSN 1500A subrack, or any of slots
1113 in the OptiX OSN 1500B subrack.

11.7.6 Board Feature Code

The feature code of the MR4 has eight numbers, which identify the frequency of the first and
fourth channels of optical signals the board process.
Table 11-24 lists the details on the board feature code.
Table 11-24 Board feature code
Barcode

Indication

Description

First four characters

Frequency of optical signals

The four characters are the

last four characters of the
figure that marks the
frequency of the first channel
of optical signals.

Last four characters

Frequency of optical signals

The four characters are the

last four characters of the
figure that marks the
frequency of the fourth
channel of optical signals.

For example, the feature code of the TN11MR4 is 92109240.

l

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"9210" indicates that the frequency of the first channel of optical signals is 192.10 THz.
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l

"9240" indicates that the frequency of the fourth channel of optical signals is 192.40 THz.

The four channels of optical signals the MR4 processes are successive:
l

The frequency of the second channel of optical signals is 192.20 THz.

The frequency of the third channel of optical signals is 192.30 THz.

11.7.7 Technical Specifications

The technical specifications of the MR4 cover the optical interface specifications, board
dimensions, weight, power consumption and laser safety class.

Optical Interface Specifications

Table 11-25 lists the specifications of the optical interfaces of the MR4.
Table 11-25 Specifications of the optical interfaces of the MR4
Optical
Interface

Item

Specification

Working wavelength range

(nm)

1529 to 1561

Channel spacing (GHz)

100

IN-D1
IN-D2
IN-D3
IN-D4

0.5 dB passband bandwidth

(nm)

0.11

Insertion loss in the

wavelength-dropping
channel (dB)

2.2

Adjacent channel isolation

(dB)

> 25

Non-adjacent channel
isolation (dB)

> 35

A1-OUT
A2-OUT
A3-OUT
A4-OUT

0.5 dB passband bandwidth

(nm)

0.11

Insertion loss in the

wavelength-adding channel
(dB)

2.2

IN-MO
MI-OUT

Insertion loss (dB)

1.5

Isolation (dB)

> 13

Return loss (dB)

> 40

Laser Safety Class

The safety class of the laser on the board is CLASS 1M.
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The maximum launched optical power of the optical interfaces ranges from 10 dBm (10 mW)
to 22.15 dBm (164 mW).

Mechanical Specifications
l

Board dimensions (mm): 262.05 (H) x 220 (D) x 25.4 (W)

Weight (kg): 0.9

Power Consumption
l

In the normal temperature (25), the maximum power consumption of the MR4 is 0.2 W.

In the high temperature (55), the maximum power consumption of the MR4 is 0.3 W.

11.8 LWX
This section describes the LWX, an arbitrary rate wavelength converting board, in terms of the
version, function, principle, front panel, configuration and specifications.
11.8.1 Version Description
The functional version of the LWX board is N1.
11.8.2 Function and Feature
The LWX is used to realize the convertion between the wavelength at an arbitrary rate (10 Mbit/
s to 2.7 Gbit/s, NRZ code) at the client side and the G.692 wavelength.
11.8.3 Working Principle and Signal Flow
The LWX consists of the O/E conversion module, cross-connect module, CDR module and so
on.
11.8.4 Front Panel
On the front panel of the LWX, there are indicators and interfaces.
11.8.5 Valid Slots
The LWX can be housed in any of slots 1213 in the OptiX OSN 1500A subrack, or any of slots
1113 in the OptiX OSN 1500B subrack.
11.8.6 Board Feature Code
The code behind the board name in the barcode is the board feature code. The feature code of
the LWX indicates the schemes the optical interfaces use to receive and transmit signals.
11.8.7 Technical Specifications
The technical specifications of the LWX cover the optical interface specifications, board
dimensions, weight and power consumption.

11.8.1 Version Description

The functional version of the LWX board is N1.

11.8.2 Function and Feature

The LWX is used to realize the convertion between the wavelength at an arbitrary rate (10 Mbit/
s to 2.7 Gbit/s, NRZ code) at the client side and the G.692 wavelength.
The LWX supports the optical wavelength convertion, 3R, protection, and loopback.
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Table 11-26 lists the functions and features of the LWX.

Table 11-26 Functions and features of the LWX
Function
and Feature

LWX

Basic
function

Realizes the convertion between the wavelength at an arbitrary rate at the

client side and the wavelength compliant with ITU-T G.692 (DWDM).
Transparently transmits signals.

3R function

Provides the 3R function for the signals at the client side ranging from 10
Mbit/s to 2.7 Gbit/s. Recovers the clock, and monitors the rate.

Protection
scheme

Single fed and single

receiving

Supports the inter-board protection and 1+1 interboard hot backup. The switching time is less than 50
ms.

Dual fed and

selective receiving

Supports the intra-board protection. The optical

channel protection can be realized by one board. The
switching time is less than 50 ms.

ALS function

Supports the ALS function. When no signals are received, the corresponding
optical transmit module is automatically turned off.

Loopback
function

Provides the inloop and outloop at the optical interface level, which are used
for locating faults.

Performance
and alarm
monitoring

Provides rich alarms and performance events for easy maintenance.

Central
wavelength

Supports the ITU-T-compliant standard wavelength with a channel spacing

of 100 GHz.

11.8.3 Working Principle and Signal Flow

The LWX consists of the O/E conversion module, cross-connect module, CDR module and so
on.
Figure 11-21 shows the block diagram for the functions of the LWX.

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Figure 11-21 Block diagram for the functions of the LWX

Loopback control

10 Mbit/s~2.7 Gbit/s
Optical module at

O/
E

WDM side
loopback

Multi-rate

22 Crossconnection

CDR

client side
10 Mbit/s~2.7 Gbit/s

O/
E

Data
LOS
Laser shut down

LOS

10 Mbit/s~2.7 Gbit/s

communication
and control
module

Client side loopback

O/
E

Optical module 2
at WDM side

22 Crossconnection

Multi-rate
CDR

Loopback control

10 Mbit/s~2.7 Gbit/s
Optical module 1
at WDM side

Reference clock

Reference
clock

O/
E
Clock

10 Mbit/s~2.7 Gbit/s

Optical
splitter

O/
E

Data

LOS

communication
and control
module

Laser shut down

+3.3 V
+1.5 V
+5V
+1.8 V

DC/DC
converter
module

DC/DC
converter
module

Communication

Fuse

SCC Unit

-48 V/ -60 V
-48 V/ -60 V

Fuse

+3.3 V backup
power

O/E Conversion Module

l

The optical module at client side applies SFP encapsulation and can be configured as
different types of optical module. This module supports accessing optical signals at the rate
of 10 Mbit/s-2.7 Gbit/s.

At WDM side, the module can be configured as an optical tranceiver module or an optical
tranceiver module and an optical receiver module. When two modules are configured at
WDM side, an optical splitter is used to realize dual feeding.

In the receive direction, the module converts the received optical signals into electrical
signals.

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l

In the transmit direction, the module converts the electrical signals into SDH optical signals,
and then send optical signals to fibers for transmission.

Detect the R_LOS alarm and provide the function to shut down the laser.

Cross-connect Module
l

Supports data selection from client side to WDM side and from WDM side to client side

Supports WDM side optical module selection

Supports loopback of client side signals

Supports loopback of WDM side signals

Supports recovering data and clock signals from 10 Mbit/s to 2.7 Gbit/s

Supports reading rates of accessed services

CDR Module

Communication and Control Module

l

Supports Ethernet communication

Supports reference clock of the CDR module

Selects and configures services of other modules

Implements laser controlling function

Selects the clock from the active or the standby cross-connect board

Control the indicator on the board

DC/DC Converter Module

Through the DC/DC converter module, the power converting module provides required DC
voltages for each chip on the board. The 48 V/60 V voltage is converted to the following
voltages: +1.5 V, +3.3 V, +1.8 V and 5 V. In addition, this module provides protection for the
board +3.3 V power supply.

11.8.4 Front Panel

On the front panel of the LWX, there are indicators and interfaces.

Appearance of the Front Panel

Figure 11-22 shows the appearance of the front panel of the LWX.

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Figure 11-22 Front panel of the LWX

LWX
STAT
ACT
PROG
SRV
CLASS 1
LASER
PRODUCT

TX RX
OUT1 IN1
OUT2 IN2
LWX

Indicators
The following indicators are present on the front panel of the board:
l

Board hardware state indicator (STAT), which is green or red when lit.

Service activating state indicator (ACT), which is green when lit.

Board software state indicator (PROG), which is green or red when lit.

Service alarm indicator (SRV), which is red, green or yellow when lit.

For indication of these indicators, see A Equipment and Board Alarm Indicators.

Interfaces
There are six optical interfaces on the front panel of the LWX. Table 11-27 lists the type and
usage of the optical interfaces.

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Table 11-27 Optical interfaces on the front panel of the LWX

Interface

Interface
Type

Usage

IN1/IN2

LC

Receives signals from the optical add/drop multiplexing

board, MR2A.

OUT1/OUT2

LC

Transmits signals to the optical add/drip multiplexing

board, MR2A.

TX

LC

Transmits signals to the client-side equipment.

RX

LC

Receives signals from the client-side equipment.

Note: IN1/OUT1 and IN2/OUT2 are two pairs of optical interfaces.

11.8.5 Valid Slots

The LWX can be housed in any of slots 1213 in the OptiX OSN 1500A subrack, or any of slots
1113 in the OptiX OSN 1500B subrack.

11.8.6 Board Feature Code

The code behind the board name in the barcode is the board feature code. The feature code of
the LWX indicates the schemes the optical interfaces use to receive and transmit signals.
Table 11-28 lists the relation between the board feature code and the receive/transmit scheme.
Table 11-28 Relation between the board feature code and the receive/transmit scheme
Board Barcode

Feature Code

Receive/Transmit Scheme

SSN1LWX01

01

Single-fed single selective

SSN1LWX02

02

Dual-fed single selective

11.8.7 Technical Specifications

The technical specifications of the LWX cover the optical interface specifications, board
dimensions, weight and power consumption.

Optical Interface Specifications

Table 11-29 and Table 11-30 list the specifications of the client-side and WDM-side optical
interfaces of the LWX.
Table 11-29 Specifications of the client-side optical interfaces of the LWX

11-48

Item

Specification

Nominal bit rate

10 Mbit/s to 2.7 Gbit/s

Line code

NRZ
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Item

Specification

Optical source type

SLM

SLM

SLM

Transmission
distance (km)

15

40

80

Feature of the transmitter at S point

Working wavelength
range (nm)

1260 to 1360

1260 to 1360

1500 to 1580

Max. mean launched

optical power (dBm)

+3

+3

Min. mean launched

optical power (dBm)

Min. extinction ratio

(dB)

+8.2

+8.2

+8.2

Side mode
suppression ratio
(dB)

30

30

30

Eye pattern

Compliant with the

template defined in
ITU-T G.957
Recommendations

Compliant with the

template defined in
ITU-T G.957
Recommendations

Compliant with the

template defined in
ITU-T G.957
Recommendations

Feature of the receiver at S point

Receiver type

PIN

PIN

APD

Wavelength range
(nm) of the received
signals

1200 to 1600

1200 to 1600

1200 to 1600

Receiver sensitivity
(dBm)

18

18

28

Min. overload (dBm)

Max. reflection
coefficient (dB)

27

27

27

Table 11-30 Specifications of the WDM-side optical interfaces of the LWX

Item

Specification

Channel
spacing (GHz)

100

Line code

NRZ

Feature of the transmitter at Sn point

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Item

Specification

Target
transmission
distance (km) of
optical
interfaces

640

170 (2 mW)

170 (10 mW)

360

Max. mean
launched optical
power (dBm)

+7

Min. mean
launched optical
power (dBm)

+3

+3

+5

+3

Min. extinction
ratio (dB)

+10

+10

+10

+10

Nominal central
frequency
(THz)

192.10 to
196.00

192.10 to
196.00

192.10 to
196.00

192.10 to
196.00

Central
frequency
deviation (GHz)

12.5

12.5

12.5

12.5

Max. 20 dB
spectral width
(nm)

0.2

0.4

0.4

0.4

Min. side mode

suppression
ratio (dB)

35

35

35

35

Dispersion
compensation
(ps/nm)

12800

2400

3200

1600

Eye pattern

Compliant with
the template
defined in ITUT G.957
Recommendati
ons

Compliant with
the template
defined in ITUT G.957
Recommendati
ons

Compliant with
the template
defined in ITUT G.957
Recommendati
ons

Compliant with
the template
defined in ITUT G.957
Recommendati
ons

Feature of the receiver at Rn point

11-50

Receiver type

APD

PIN

Receiving
wavelength
range (nm)

1200 to 1600

1200 to 1600

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Item

Specification

Receiver
sensitivity
(dBm)

28

18

Min. overload
(dBm)

Max. reflection
coefficient (dB)

27

27

Mechanical Specifications
The mechanical specifications of the LWX are as follows:
l

Board dimensions (mm): 262.05 (H) x 220 (D) x 25.4 (W)

Weight (kg): 1.1

Power Consumption
In the normal temperature (25), the maximum power consumption of the LWX is 30 W.

11.9 OBU1
This section describes the TN11OBU1, an optical booster amplifier board, in terms of the
version, function, principle, front panel, configuration and specifications.
11.9.1 Version Description
The functional version of the OBU1 is TN11.
11.9.2 Function and Feature
The OBU1 supports the in-service optical performance monitoring, gain-locking technology,
and transient control technology.
11.9.3 Working Principle and Signal Flow
The OBU1 consists of the EDFA optical module, optical splitter, and the control and
communication module.
11.9.4 Front Panel
On the front panel of the OBU1, there are indicators, interfaces, and laser safety class label.
11.9.5 Valid Slots
The OBU1 can be housed in any of slots 1213 in the OptiX OSN 1500A subrack, or any of
slots 1113 in the OptiX OSN 1500B subrack.
11.9.6 Board Feature Code
The feature code of the OBU1 contains six characters and indicates the gain and maximum
nominal input optical power of the optical signals.
11.9.7 Technical Specifications
The technical specifications of the OBU1 cover the optical interface specifications, board
dimensions, weight, power consumption and laser safety class.
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11.9.1 Version Description

The functional version of the OBU1 is TN11.

11.9.2 Function and Feature

The OBU1 supports the in-service optical performance monitoring, gain-locking technology,
and transient control technology.
Table 11-31 lists the functions and features of the OBU1.
Table 11-31 Functions and features of the OBU1
Function and
Feature

OBU1

Basic function

Amplifies a maximum of 40-channel optical signals (channel spacing:

100 GHz) at the same time.
Supports the transmission without electrical trunks for different spans.

Typical gain

The typical gain of the OBU101 is 20 dB. The typical gain of the
OBU102 is 23 dB.

In-service optical
performance
monitoring

Provides in-service performance monitoring optical interface. A small

volume of optical signals are output at the optical interface to the optical
spectrum analyzer or optical spectrum analyzing board. The optical
spectrum analyzer or optical spectrum analyzing board monitors the
multiplexed optical signals and optical performance without
interrupting services.

Gain-locking
technology

The EDFA of the board has the gain-locking function. When one or
more channels are added or dropped, or optical signals of certain
channels fluctuate, the signal gains of other channels are not affected.

Transient control
technology

The EDFA of the board has the transient control function. When
channels are added or dropped, the system can be upgraded or expanded
without interrupting services if the optical power fluctuation is
suppressed.

Performance and
alarm monitoring

Checks and reports the optical power.

Controls the temperature of the pumping laser.
Checks the pumping drive current, back facet current, cooling current,
temperature of the pumping laser, and the ambient temperature of the
board.

NOTE

The OBU1 is of two types: OBU101 and OBU102. The OBU101 is used at the receive end. The OBU102
is used at the transmit end.

11.9.3 Working Principle and Signal Flow

The OBU1 consists of the EDFA optical module, optical splitter, and the control and
communication module.
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Figure 11-23 shows the block diagram for the functions of the OBU1.
Figure 11-23 Block diagram for the functions of the OBU1
EDFA optical module

Splitter

IN

Pumping
current

Detecting for
temperature and
pumping current

PIN

Pumping and detection module

Control and communication module

Power supply module

+5 V

DC/DC
converter

+5 V

DC/DC
converter

+5 V

Delayed
startup
Fuse

Backplane
-48 V/-60 V

-48 V/-60 V

SCC

Signal Flow
The OBU1 accesses the multiplexed optical signals, which are amplified by the EDFA optical
module. The OBU1 then outputs the amplified optical signals through the OUT port. The OBU1
also outputs few monitoring signals to the test instrument for performance analysis.

EDFA Optical Module

The EDFA module is used to amplify the input optical signals. The EDFA optical module applies
the gain auto-adjustment technology. With this technology, the EDFA can change the gain of
working wavelength signals in the allowed range.

Optical Splitter
The splitter is used to split the optical signals received from the EDFA optical module into two
channels of signals with different power. One channel of signlas are output from OUT optical
interface and then transmitted in the main optical channel. The other channel of signals are output
to the MON port for sepctrum detection and monitoring. The power of signals at the MON is
one ninety-nineth of that at the OUT interface. In other words, the power of signals at MON is
20 dB lower than that at the OUT interface.

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Control and Communication Module

The control and communication module is used to control and monitor the functional modules
of the board, and to manage the communication.
This module collects the information on alarms and performance events, and data of working
status and voltage detection of each functional module. This module then reports the information
and data to the SCC.
The control and communication module receives commands from the SCC to control and
coordinate the working of each functional module.

11.9.4 Front Panel

On the front panel of the OBU1, there are indicators, interfaces, and laser safety class label.

Appearance of the Front Panel

Figure 11-24 shows the appearance of the front panel of the OBU1.
Figure 11-24 Front panel of the OBU1

OBU1
STAT
ACT
PROG
SRV
LASER
RADIATION
DO NOT VIEW DIRECTLY
WITH OPTICAL
INSTRUMENTS

CLASS 1M LASER
PRODUCT

MON
OUT
IN

OBU1

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Indicators
The following indicators are present on the front panel of the board:
l

Board hardware state indicator (STAT), which is green or red when lit.

Service activating state indicator (ACT), which is green when lit.

Board software state indicator (PROG), which is green or red when lit.

Service alarm indicator (SRV), which is red, green or yellow when lit.

For indication of these indicators, see A Equipment and Board Alarm Indicators.

Interfaces
There are three pairs of optical interfaces on the front panel of the OBU1. Table 11-32 lists the
type and usage of the optical interfaces.
Table 11-32 Optical interfaces of the OBU1
Interface

Interface
Type

Usage

IN

LC

Inputs multiplexed signals to be amplified.

OUT

LC

Outputs the amplified multiplexed signals.

MON

LC

Connects to the test instrument to monitor the inservice performance.

11.9.5 Valid Slots

The OBU1 can be housed in any of slots 1213 in the OptiX OSN 1500A subrack, or any of
slots 1113 in the OptiX OSN 1500B subrack.

11.9.6 Board Feature Code

The feature code of the OBU1 contains six characters and indicates the gain and maximum
nominal input optical power of the optical signals.
Table 11-33 lists the details on the board feature code.
Table 11-33 Feature code of the OBU1

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Barcode

Indication

Description

First character

Fixed as G

Next two (23) characters

Gain

Gain

Fourth character

Fixed as I

Last two (56) characters

Maximum nominal input

optical power

Maximum nominal input

optical power

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For example, the feature code of the TN11OBU1 is G23I-3. The feature code indicates that the
gain is 23 dB and the maximum nominal input optical power is 3 dBm.

11.9.7 Technical Specifications

The technical specifications of the OBU1 cover the optical interface specifications, board
dimensions, weight, power consumption and laser safety class.

Optical Interface Specifications

Table 11-34 lists the specifications of the optical interfaces of the OBU1.
Table 11-34 Specifications of optical interfaces of the OBU1
Item

Specification
OBU1C01

OBU1C02

Working wavelength range (nm)

1529 to 1561

1529 to 1561

Range of input optical power

(dBm)

32 to 4

32 to 3

Range of output optical power

(dBm)

12 to 16

9 to 20

Input power (dBm) of a typical

single wavelength

20

19

Maximum nominal output optical

power (dBm) of a single
wavelength

Path gain (dB)

201.5

231.5

Noise figure (dB)

5.5

6.0

Gain flatness (dB)

2.0

2.0

Pre-incline of the gain spectral

form

00.2

1.00.2

Laser Safety Class

The safety class of the laser on the board is CLASS 1M.
The maximum launched optical power of the optical interfaces ranges from 10 dBm (10 mW)
to 22.15 dBm (164 mW).

Mechanical Specifications

11-56

Board dimensions (mm): 262.05 (H) x 220 (D) x 25.4 (W)

Weight (kg): 1.3

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Power Consumption
l

The power consumption of OBU101:

In the normal temperature (25), the maximum power consumption of the OBU1 is
16 W.

In the high temperature (55), the maximum power consumption of the OBU1 is 17.6
W.
The power consumption of OBU102:

In the normal temperature (25), the maximum power consumption of the OBU1 is
18 W.

In the high temperature (55), the maximum power consumption of the OBU1 is 19.8
W.

11.10 FIB
This section describes the FIB, a wavelength filter and isolation board, in terms of the version,
function, principle, front panel, configuration and specifications.
11.10.1 Version Description
The functional version of the FIB board is N1.
11.10.2 Function and Feature
The FIB, a filter and isolation board, is used to filter and isolate 1 x STM-16 optical signals.
11.10.3 Working Principle and Signal Flow
The FIB consists of an isolator and a filter.
11.10.4 Front Panel
On the front panel of the FIB, there are two pairs of optical interfaces.
11.10.5 Valid Slots
The FIB can be housed in any of slots 1213 in the subrack.
11.10.6 Technical Specifications
The technical specifications of the FIB cover the optical interface specifications, board
dimensions, weight and power consumption.

11.10.1 Version Description

The functional version of the FIB board is N1.

11.10.2 Function and Feature

The FIB, a filter and isolation board, is used to filter and isolate 1 x STM-16 optical signals.
The FIB is used in the remote optical pump amplifier (ROPA) system. Used with the ROP, a
single-wavelength long distance board, the FIB can realize long-distance optical regeneration
transmission. Figure 11-25 shows the position of the FIB in an optical transmission system.
Figure 11-25 Location of the FIB in the optical transmission system.
C (single span)

Single span

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BA17

G.652

FIB

b(18dB)

a(54dB)

Erbium doped

G.652

ROP

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ISO

Filter
1550.12

Optical receiver

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Table 11-35 lists the functions and features of the FIB.

Table 11-35 Functions and features of the FIB
Function and
Feature

FIB

Optical isolator

The isolator lets optical signals pass in a unidirectional manner. The

working wavelength ranges from 1529 nm to 1561 nm.

Optical filter

The filter filters all signals carried in wavelengths except those in the
1550.12 nm wavelength.

11.10.3 Working Principle and Signal Flow

The FIB consists of an isolator and a filter.
Figure 11-26 shows the block diagram for the functions of the FIB.
Figure 11-26 Block diagram for the working principle of the FIB
Isolator

Filter

After travelling for a long distance in fibers, optical signals are heavily attenuated and then
degraded. The degraded signals cannot be normally received by optical receiver. In this case,
the ROP should be used to amplify the gain of the optical signals. The ROP has high optical
power. To prevent other factors from affecting the ROP, use the FIB to filter wavelengths.
The filter of the FIB lets optical signals pass in a unidirectional manner. The filter filters all
signals carried in other wavelengths except those in the 1550.12 nm wavelength. In this way,
the optical receiver can normally receive optical signals.

11.10.4 Front Panel

On the front panel of the FIB, there are two pairs of optical interfaces.

Appearance of the Front Panel

Figure 11-27 shows the appearance of the front panel of the FIB.

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Figure 11-27 Front panel of the FIB

FIB

CLASS1
LASER
PRODUCT

OUT
IN
FIB

Interfaces
On the front panel of the FIB, there are a LC optical interface and a E2000 optical interface,
which are used to receive and transmit 1-channel 2.5 Gbit/s optical signals. The optical interfaces
use pluggable optical modules for easy maintenance.
Table 11-36 Optical interfaces of the FIB
Interface

Interface
Type

Usage

IN

E2000

Receive 1-channel 2.5 Gbit/s optical signals.

OUT

LC

Transmit 1-channel 2.5 Gbit/s optical signals.

11.10.5 Valid Slots

The FIB can be housed in any of slots 1213 in the subrack.

11.10.6 Technical Specifications

The technical specifications of the FIB cover the optical interface specifications, board
dimensions, weight and power consumption.
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Optical Interface Specifications

Table 11-37 lists the specifications of the optical interfaces of the FIB.
Table 11-37 Specifications of the optical interfaces of the FIB
Item

Specification

Nominal bit rate

2488320 kbit/s

Line code

NRZ

Central wavelength
(nm)

1550.120.05

0.5 dB bandwidth
(nm)

> 0.4

Mechanical Specifications
The mechanical specifications of the FIB are as follows:
l

Board dimensions (mm): 262.05 (H) x 220 (D) x 25.4 (W)

Weight (kg): 0.4

Power Consumption
The FIB does not consume power.

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12 Optical Amplifier Boards and Dispersion Compensation

Boards

Optical Amplifier Boards and

Dispersion Compensation Boards

About This Chapter

This chapter describes the optical amplifier boards, such as the BA2, BPA, and COA, and the
dispersion compensation boards, such as the DCU.
12.1 BA2
This section describes the BA2, 2-channel optical booster amplifier board, in terms of the
version, function, working principle, front panel and specifications.
12.2 BPA
This section describes the BPA, one-channel amplifier and one-channel pre-amplifier board, in
terms of the version, function, principle, front panel and specifications.
12.3 COA
This section describes the COA, a case-shaped optical amplifier, in terms of the version, function,
principle, front panel, installation position and specifications.

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12.1 BA2
This section describes the BA2, 2-channel optical booster amplifier board, in terms of the
version, function, working principle, front panel and specifications.
12.1.1 Version Description
The functional version of the BA2 board is N1.
12.1.2 Function and Feature
During the long-haul transmission of optical signals, the attenuation of signals is high. The BA
should be used, and thus the optical receiver can normally receive optical signals.
12.1.3 Working Principle and Signal Flow
The BA2 consists of the EDFA module, control module, communication module, and DC/DC
converter module.
12.1.4 Front Panel
On the front panel of the BA2, there are indicators and interfaces.
12.1.5 Valid Slots
The BA2 can be housed in any of slots 1213 in the OptiX OSN 1500A subrack, or any of slots
1113 in the OptiX OSN 1500B subrack.
12.1.6 Board Feature Code
The code behind the board name in the barcode is the board feature code. The board feature code
of the BA2 indicates the output optical power of the optical interfaces.
12.1.7 Technical Specifications
The technical specifications of the BA2 cover the optical interface specifications, board
dimensions, weight and power consumption.

12.1.1 Version Description

The functional version of the BA2 board is N1.

12.1.2 Function and Feature

During the long-haul transmission of optical signals, the attenuation of signals is high. The BA
should be used, and thus the optical receiver can normally receive optical signals.
Figure 12-1 shows the location of the BA in the optical transmission system.
Figure 12-1 Location of the BA in the optical transmission system
Transmit

BA

Receive

The BA2 amplifies the power of two-channel optical signals. Table 12-1 lists the functions and
features of the BA2.

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Table 12-1 Functions and features of the BA2

Function and
Feature

BA2

Basic function

Increases the launched optical power of the line board to 1315 dBm
or 1518 dBm. Thus, when the G.652 optical fiber with a loss of 0.275
dB/km is used, the transmission distance can be 120 km, 130 km, or
above.

EDFA

Automatically controls the optical power and laser temperature of the

EDFA module.
Automatically monitors the input and output optical power of the EDFA
module and queries the optical power.
Protects the EDFA module. When no optical signals are input, the laser
is automatically turned off. When optical signals are input, the laser is
automatically turned on.

Performance and
alarm monitoring

Reports the performance parameters of the laser. Provides rich alarms

and performance events for easy management and maintenance of the
equipment.

Software upgrade

Supports the software upgrade and expansion without interrupting

services.

NOTE

The BA2 provides the IPA function. When the IPA function is enabled, the pumping laser is turned off if
no input signals are detected on the receive end of the line board. Thus, this function is used to prevent the
high laser power from damaging eyes.

12.1.3 Working Principle and Signal Flow

The BA2 consists of the EDFA module, control module, communication module, and DC/DC
converter module.
Figure 12-2 shows the block diagram for the functions of the BA2.

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Figure 12-2 Block diagram for the functions of the BA2

Optical input

EDFA module
Doped
erbium
fiber

Input
isolate

Fiber
distributor

WDM
coupler

Input
power
monitor
(Pin1)

Output
isolate

Pump
current

Pump
current Temperature
detect

Laser
shutdown

Manual
control

Optical output

Output
power
monitor
(Pin2)

Laser pump

Input
power

Optical
splitter

Filter

Output
power

Pump
temperature
control

LOS in

AD/DA

Control&Generation alarms
Control module

Communication
module

+3.3 V
5V

DC/DC
converter
module

DC/DC
converter
module

Communication
SCC unit

Fuse

-48 V/ -60 V
-48 V/ -60 V

Fuse

+3.3 V backup
power

EDFA Module
The optical amplifier unit consists of two EDFA modules. One is BA and the other PA. When
the board is used as a pre-amplifier (PA), an optical filter with 1550.12 nm as the central
wavelength is added to the optical output end of the module. A booster amplifier (BA) does not
have the filter. A semi-conductor laser bump with 980 nm as the central wavelength is in the
erbium fiber inside the EDFA module. Bump light and input signal light are coupled into the
erbium fiber through an optical coupler. The input and output optical signals of the module are
led out by two fiber splitters as per a specific coupling ratio. The optical signals are then converted
to optical current by two PIN photoelectrical diodes. The input and output powers of the EDFA
module are determined as per the optical signals. The module also applies optical isolating
measures at the input and the output ends to improve the performance of the module.

Control Module
The control module:
l

Detects and drives bump electricity

Controls the pump temperature of laser

Detects input and output power

Reports alarms

The control module consists of A/D converting unit, D/A converting unit and CPU. The A/D
converting unit converts the temperature value of the cooling electricity and the input/output
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Boards

optical power from analog values to digital values. The converted values are then sent to CPU,
which generates performance reporting event or alarm. The A/D converting unit also converts
bump electricity from analog values to digital values. The converted values are then sent to CPU.
After the CPU processes the converted values, the D/A converting unit controls precisely the
driving analog circuit of the bump laser of the EDFA optical module. The internal temperature
of the bump laser module is kept at 25. The temperature sensor inside the bump laser outputs
temperature change to drive cooler to keep the internal temperature of the bump laser module
at 25.

Communication Module
The communication module supports ethernet communication.

DC/DC Converter Module

Through the DC/DC converter module, the power converting module provides required DC
voltages for each chip on the board. The following voltages are provided: 5 V and +3.3 V. In
addition, this module provides protection to the board +3.3 V power supply.

12.1.4 Front Panel

On the front panel of the BA2, there are indicators and interfaces.

Appearance of the Front Panel

Figure 12-3 shows the appearance of the front panel of the BA2.

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Figure 12-3 Front panel of the BA2

BA2
STAT
ACT
PROG
SRV

OUT1 IN1
OUT2 IN2
BA2

Indicators
The following indicators are present on the front panel of the board:
l

Board hardware state indicator (STAT), which is green or red when lit.

Service activating state indicator (ACT), which is green when lit.

Board software state indicator (PROG), which is green or red when lit.

Service alarm indicator (SRV), which is red, green or yellow when lit.

For indication of these indicators, see A Equipment and Board Alarm Indicators.

Interfaces
On the front panel of the BA2, there are two pairs of LC optical interfaces, which use the
pluggable optical modules for easy maintenance. Table 12-2 lists the type and usage of these
optical interfaces.

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Table 12-2 Optical interfaces of the BA2

Interface

Interface
Type

Usage

IN1

LC

Receives the first channel of optical signals.

OUT1

LC

Transmits the first channel of optical signals.

IN2

LC

Receives the second channel of optical signals.

OUT2

LC

Transmits the second channel of optical signals.

12.1.5 Valid Slots

The BA2 can be housed in any of slots 1213 in the OptiX OSN 1500A subrack, or any of slots
1113 in the OptiX OSN 1500B subrack.

12.1.6 Board Feature Code

The code behind the board name in the barcode is the board feature code. The board feature code
of the BA2 indicates the output optical power of the optical interfaces.
Table 12-3 lists the relation between the board feature code and the output optical power.
Table 12-3 Relation between the board feature code and output optical power for the BA2
Board Barcode

Feature Code

Output Optical Power

SSN1BA201

01

14 dBm for dual-channel

optical power amplification

SSN1BA202

02

17 dBm for dual-channel

optical power amplification

SSN1BA203

03

14 dBm for optical power

amplification

SSN1BA204

04

17 dBm for optical power

amplification

SSN1BA205

05

14 or 17 dBm for dual-channel

optical power amplification

12.1.7 Technical Specifications

The technical specifications of the BA2 cover the optical interface specifications, board
dimensions, weight and power consumption.

Optical Interface Specifications

Table 12-4 lists the specifications of the optical interfaces of the BA2.

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Table 12-4 Specifications of the optical interfaces of the BA2

Item

Specification

Nominal bit rate

2488320 kbit/s and 9953280 kbit/s

Optical interface type

V-16.2, U-16.2, L-64.2, V-64.2, U-64.2

Line code

NRZ

Input wavelength (nm)

BA: 1530 to 1565

Range of input optical

power (dBm)

BA: 6 to +3

Output optical power

(dBm)

BA: 13 to 15 or 15 to 17

Noise figure (dB)

BA: < 6.5

Mechanical Specifications
The mechanical specifications of the BA2 are as follows:
l

Board dimensions (mm): 262.05 (H) x 220 (D) x 25.4 (W)

Weight (kg): 1.0

Power Consumption
In the normal temperature (25), the maximum power consumption of the BA2 is 20 W.

12.2 BPA
This section describes the BPA, one-channel amplifier and one-channel pre-amplifier board, in
terms of the version, function, principle, front panel and specifications.
12.2.1 Version Description
The functional version of the BPA board is N1.
12.2.2 Function and Feature
During the long-haul transmission of optical signals, the attenuation of signals is high. The BA
and PA should be used, and thus the optical receiver can normally receive optical signals.
12.2.3 Working Principle and Signal Flow
The BPA consists of the EDFA module, control module, communication module, and DC/DC
converter module.
12.2.4 Front Panel
On the front panel of the BPA, there are indicators and interfaces.
12.2.5 Valid Slots
The BPA can be housed in any of slots 1213 in the OptiX OSN 1500A subrack, or any of slots
1113 in the OptiX OSN 1500B subrack.
12.2.6 Board Feature Code
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The code behind the board name in the barcode is the board feature code. The board feature code
of the BPA indicates the output optical power of the optical interfaces.
12.2.7 Technical Specifications
The technical specifications of the BPA cover the optical interface specifications, board
dimensions, weight and power consumption.

12.2.1 Version Description

The functional version of the BPA board is N1.

12.2.2 Function and Feature

During the long-haul transmission of optical signals, the attenuation of signals is high. The BA
and PA should be used, and thus the optical receiver can normally receive optical signals.
Figure 12-4 shows the location of the BA and PA in the optical transmission system.
Figure 12-4 Location of the BA and PA in the optical transmission system
Transmit

Receive

BA

Transmit

PA

Receive

Table 12-5 lists the functions and features of the BPA.

Table 12-5 Functions and features of the BPA

Issue 02 (2007-09-10)

Function and
Feature

BPA

Basic function

Increases the launched optical power of the line board to 1315 dBm
or 1518 dBm. Thus, when the G.652 optical fiber with a loss of 0.275
dB/km is used, the transmission distance can be 120 km, 130 km, or
above.

Function of the PA

Provides the PA module to preamplify the received optical signals.

Increases the power of the small volume of optical signals by 2225
dB, and thus enhances the sensitivity of the receiver to 37 dBm.

EDFA

Automatically controls the optical power and laser temperature of

the EDFA module.

Automatically monitors the input and output optical power of the

EDFA module and queries the optical power.

Protects the EDFA module. When no optical signals are input, the
laser is automatically turned off. When optical signals are input, the
laser is automatically turned on.
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Hardware Description

Function and
Feature

BPA

Performance and
alarm monitoringa

Reports the performance parameters of the laser. Provides rich alarms

and performance events for easy management and maintenance of the
equipment.

Software upgrade

Supports the software upgrade and expansion without interrupting

services.

a:The BPA does not support the alarm in the test state and the query of the power supply
voltage.

12.2.3 Working Principle and Signal Flow

The BPA consists of the EDFA module, control module, communication module, and DC/DC
converter module.
Figure 12-5 shows the block diagram for the functions of the BPA.
Figure 12-5 Block diagram for the working principle of the BPA
Optical input

EDFA module
Doped
erbium
fiber

Input
isolate

Fiber
distributor

WDM
coupler

Input
power
monitor
(Pin1)

Output
isolate

Pump
current

Pump
current Temperature
detect

Laser
shutdown

Manual
control

Optical output

Output
power
monitor
(Pin2)

Laser pump

Input
power

Optical
splitter

Filter

Output
power

Pump
temperature
control

LOS in

AD/DA

Control&Generation alarms
Control module

Communication
module

+3.3 V
5V

DC/DC
converter
module

DC/DC
converter
module

Communication
SCC unit

Fuse

-48 V/ -60 V
-48 V/ -60 V

Fuse

+3.3 V backup
power

EDFA Module
The optical amplifier unit consists of two EDFA modules. One is BA and the other PA. When
the board is used as a pre-amplifier (PA), an optical filter with 1550.12 nm as the central
wavelength is added to the optical output end of the module. A booster amplifier (BA) does not
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have the filter. A semi-conductor laser bump with 980 nm as the central wavelength is in the
erbium fiber inside the EDFA module. Bump light and input signal light are coupled into the
erbium fiber through an optical coupler. The input and output optical signals of the module are
led out by two fiber splitters as per a specific coupling ratio. The optical signals are then converted
to optical current by two PIN photoelectrical diodes. The input and output powers of the EDFA
module are determined as per the optical signals. The module also applies optical isolating
measures at the input and the output ends to improve the performance of the module.

Control Module
The control module:
l

Detects and drives bump electricity

Controls the pump temperature of laser

Detects input and output power

Reports alarms

The control module consists of A/D converting unit, D/A converting unit and CPU. The A/D
converting unit converts the temperature value of the cooling electricity and the input/output
optical power from analog values to digital values. The converted values are then sent to CPU,
which generates performance reporting event or alarm. The A/D converting unit also converts
bump electricity from analog values to digital values. The converted values are then sent to CPU.
After the CPU processes the converted values, the D/A converting unit controls precisely the
driving analog circuit of the bump laser of the EDFA optical module. The internal temperature
of the bump laser module is kept at 25. The temperature sensor inside the bump laser outputs
temperature change to drive cooler to keep the internal temperature of the bump laser module
at 25.

Communication Module
The communication module supports ethernet communication.

DC/DC Converter Module

Through the DC/DC converter module, the power converting module provides required DC
voltages for each chip on the board. The following voltages are provided: 5 V and +3.3 V. In
addition, this module provides protection to the board +3.3 V power supply.

12.2.4 Front Panel

On the front panel of the BPA, there are indicators and interfaces.

Appearance of the Front Panel

Figure 12-6 shows the appearance of the front panel of the BPA.

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Figure 12-6 Front panel of the BPA

BPA
STAT
ACT
PROG
SRV

BOUT BIN
POUT
PIN
BPA

Indicators
The following indicators are present on the front panel of the board:
l

Board hardware state indicator (STAT), which is green or red when lit.

Service activating state indicator (ACT), which is green when lit.

Board software state indicator (PROG), which is green or red when lit.

Service alarm indicator (SRV), which is red, green or yellow when lit.

For indication of these indicators, see A Equipment and Board Alarm Indicators.

Interfaces
On the front panel of the BPA, there are two pairs of LC optical interfaces, which use the
pluggable optical modules for easy maintenance. Table 12-6 lists the type and usage of these
optical interfaces.

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Table 12-6 Optical interfaces of the BPA

Interface

Interface
Type

Usage

BIN

LC

Receives one channel of optical signals for amplification.

BOUT

LC

Transmits one channel of amplified optical signals.

PIN

LC

Receives one channel of optical signals for preamplification.

POUT

LC

Transmits one channel of pre-amplified optical signals.

12.2.5 Valid Slots

The BPA can be housed in any of slots 1213 in the OptiX OSN 1500A subrack, or any of slots
1113 in the OptiX OSN 1500B subrack.

12.2.6 Board Feature Code

The code behind the board name in the barcode is the board feature code. The board feature code
of the BPA indicates the output optical power of the optical interfaces.
Table 12-7 lists the relation between the board feature code and the output optical power.
Table 12-7 Relation between the board feature code and output optical power for the BPA
Board Barcode

Feature Code

Description

SSN1BPA01

01

Receiver sensitivity of the PA

module: 37 dBm
Output optical power of the BA
module: 14 dBm

SSN1BPA02

02

Receiver sensitivity of the PA

module: 37 dBm
Output optical power of the BA
module: 17 dBm

12.2.7 Technical Specifications

The technical specifications of the BPA cover the optical interface specifications, board
dimensions, weight and power consumption.

Optical Interface Specifications

Table 12-8 lists the specifications of the optical interfaces of the BPA.

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Table 12-8 Specifications of the optical interfaces of the BPA

Item

Specification

Nominal bit rate

2488320 kbit/s and 9953280 kbit/s

Optical interface type

V-16.2, U-16.2, L-64.2, V-64.2, U-64.2

Line code

NRZ

Input wavelength (nm)

BA: 1530 to 1565

PA: 1550.12

Range of input optical

power (dBm)

BA: 6 to +3

Output optical power

(dBm)

BA: +13 to +15 or +15 to +17

Sensitivity (dBm)

PA: 37

Noise figure (dB)

BA: < 6.5

PA: 10 to 37

PA: < 6
NOTE

When performing loopback to the PA module of the BPA, prevent the damage caused by high input optical
power to the optical module.

Mechanical Specifications
The mechanical specifications of the BPA are as follows:
l

Board dimensions (mm): 262.05 (H) x 220 (D) x 25.4 (W)

Weight (kg): 1.0

Power Consumption
In the normal temperature (25), the maximum power consumption of the BPA is 20 W.

12.3 COA
This section describes the COA, a case-shaped optical amplifier, in terms of the version, function,
principle, front panel, installation position and specifications.
12.3.1 Version Description
The COA has three versions, 61, 62 and N1.
12.3.2 Function and Feature
The COA is used to integrate the EDFA module, drive circuit, and communication circuit in an
aluminium case.
12.3.3 Working Principle and Signal Flow
The 61COA and N1COA consist of the EDFA module, control module, communication module,
and DC/DC converter module.
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12.3.4 Front Panel

On the front panel of the COA, there are indicators and interfaces.
12.3.5 Installation Position
The COA is case-shaped, and thus it is does not occupy a slot in the subrack.
12.3.6 Board Feature Code
The code behind the board name in the barcode is the board feature code. The board feature code
of the 61COA indicates the output optical power of the optical interfaces.
12.3.7 Technical Specifications
The technical specifications of the COA cover the dimensions, weight and power consumption.

12.3.1 Version Description

The COA has three versions, 61, 62 and N1.
The 62COA, 61COA and N1COA share the working principle. The difference among them lies
in the optical amplifier modules they use. The 62COA uses the Raman optical amplifier module.
The 61COA and N1COA use the EDFA optical amplifier module.
Table 12-9 lists the details on the versions of the COA.
Table 12-9 Version Description of the COA
Item

Description

Functional
version

The COA has three versions, 61, 62, and N1.

Difference

The 61COA is the EDFA optical amplifier in the 1550-nm fiber

communication window.
The N1COA is the EDFA optical amplifier in the 1530 nm to 1560 nm
fiber communication window.
The N1COA does not have the filter and is a multi-wavelength amplifier.
The 62COA uses the Raman optical amplifier module.

Replaceability

The versions cannot be replaced by each other.

12.3.2 Function and Feature

The COA is used to integrate the EDFA module, drive circuit, and communication circuit in an
aluminium case.
The COA is an external and independent amplifier, which does not occupy a slot and can work
independently. The maximum numbers of the 61COA, N1COA, and 62COA that can be
configured in a system are two, two, and one respectively.

61COA and N1COA

The 61COA and N1COA, erbium doped amplifiers, can be configured with only one EDFA
optical module and be used as the BA, PA, or LA. Figure 12-7 shows the appearance of the
61COA and N1COA.
The optical features of the 61COA are the same as those of the BPA and BA2. The main
difference is that the 61COA and N1COA are external optical amplifier units, which are directly
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installed in the ETSI cabinetwithout occupying slots in the subrack and are independently
powered.
Figure 12-7 Appearance of the case-shaped 61COA and N1COA (PA)

The application of the 61COA and N1COA in the optical transmission system is the same as
that of the BA2 and BPA. Table 12-10 lists the functions and features of the 61COA and N1COA.
Table 12-10 Functions and features of the 61COA and N1COA
Function and
Feature

61COA and N1COA

Function of the BA

The 61COA enhances the launched optical power to 1315 dBm or

1517 dBm, and thus the valid transmission distance of optical
signals can be extended.

Function of the PA

The N1COA is a PA, with a receiver sensitivity of 38 dBm.

Automatic laser shutdown

Supports the ALS function.

Function of the serial

communication

Communicates with the CXL through the RS232 serial port, reports
the alarms and performance events from the COA to the T2000, and
receives the configuration commands issued by the T2000.

62COA
The 62COA, a case-shaped Raman optical amplifier, is used at the receive end of the SDH
equipment.
The 62COA inputs counter-propagated pumping optical signals to fibers for distributed Raman
amplification. Different from that of the 61COA, the gain medium of Raman amplification is
the line fiber that can realize better noise performance. Thus, the 62COA can extend the
transmission distance, lower the signal-to-noise ratio and realize ultra long hop transmission for
a single span.
Figure 12-8 lists the appearance of the 62COA.

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Figure 12-8 Appearance of the case-shaped 62COA

4

2
3

1. Captive screw
4. ESD jack

2. Ejector lever
5. Power access board

3. COA board

The 62COA, a case-shaped Raman optical amplifier, is used at the receive end of the transmission
system. During the transmission, the 62COA amplifies optical signals based on the stimulated
Raman scattering of the fiber. The 62COA provides optical transmission for more than 170 km,
when used with the EDFA. See Figure 12-9.
Figure 12-9 Application of the optical Raman amplifier (62COA)
Raman Amplifier
Signal light
EDFA

Pump light
Fiber

Transmitting end

Pump light

Optical
receiver

Laser

Coupler

Receiving end

During the optical transmission, the Raman amplifier amplifies optical signals by inputing
counter-propagated pumping optical signals to fibers for distributed Raman amplification. Thus,
the phase of optical signals is significantly different from that of pumping signals. The power
fluctuation of the Raman pumping is offset in the counter-propagation, and thus the noise caused
by the pumping can be effectively suppressed.
Table 12-11 lists the functions and features of the 62COA.

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Table 12-11 Functions and features of the 62COA

Function and
Feature

62COA

Basic function

Configured at the receive end of the SDH system, and provides extra
long-haul transmission (more than 170 km), when used with an
EDFA at the transmit end with an output power of 17 dBm.

Function of the PA

The 62COA is a PA, with a receiver sensitivity of -39 dBm.

Automatic laser shutdown

Supports the ALS function.

Function of the serial

communication

Communicates with the CXL through the RS232 serial port, reports
the alarms and performance events from the COA to the T2000, and
receives the configuration commands issued by the T2000.

12.3.3 Working Principle and Signal Flow

The 61COA and N1COA consist of the EDFA module, control module, communication module,
and DC/DC converter module.
The working principle of the N1COA is similar to that of the 61COA. The 61COA has the filter
unit but the N1COA does not.
Figure 12-10 shows the block diagram for the functions of the 61COA and N1COA.
Figure 12-10 Block diagram for the functions of the 61COA and N1COA
Optical input

EDFA module
Doped
erbium
fiber

Input
isolate

Fiber
distributor

WDM
coupler

Input
power
monitor
(Pin1)

Output
isolate

Pump
current

Pump
current Temperature
detect

Laser
shutdown

Manual
control

Optical output

Output
power
monitor
(Pin2)

Laser pump

Input
power

Optical
splitter

Filter

Output
power

Pump
temperature
control

LOS in

AD/DA

Control&Generation alarms
Control module

Communication
module

+3.3 V
5V

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DC/DC
converter
module

Communication
SCC unit

Fuse

-48 V/ -60 V
-48 V/ -60 V

Fuse

+3.3 V backup
power

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EDFA Module
The optical amplifier unit consists of two EDFA modules. One is BA and the other PA. When
the board is used as a pre-amplifier (PA), an optical filter with 1550.12 nm as the central
wavelength is added to the optical output end of the module. A booster amplifier (BA) does not
have the filter. A semi-conductor laser bump with 980 nm as the central wavelength is in the
erbium fiber inside the EDFA module. Bump light and input signal light are coupled into the
erbium fiber through an optical coupler. The input and output optical signals of the module are
led out by two fiber splitters as per a specific coupling ratio. The optical signals are then converted
to optical current by two PIN photoelectrical diodes. The input and output powers of the EDFA
module are determined as per the optical signals. The module also applies optical isolating
measures at the input and the output ends to improve the performance of the module.

Control Module
The control module:
l

Detects and drives bump electricity

Controls the pump temperature of laser

Detects input and output power

Reports alarms

The control module consists of A/D converting unit, D/A converting unit and CPU. The A/D
converting unit converts the temperature value of the cooling electricity and the input/output
optical power from analog values to digital values. The converted values are then sent to CPU,
which generates performance reporting event or alarm. The A/D converting unit also converts
bump electricity from analog values to digital values. The converted values are then sent to CPU.
After the CPU processes the converted values, the D/A converting unit controls precisely the
driving analog circuit of the bump laser of the EDFA optical module. The internal temperature
of the bump laser module is kept at 25. The temperature sensor inside the bump laser outputs
temperature change to drive cooler to keep the internal temperature of the bump laser module
at 25.

Communication Module
The communication module supports ethernet communication.

DC/DC Converter Module

Through the DC/DC converter module, the power converting module provides required DC
voltages for each chip on the board. The following voltages are provided: 5 V and +3.3 V. In
addition, this module provides protection to the board +3.3 V power supply.

12.3.4 Front Panel

On the front panel of the COA, there are indicators and interfaces.

Appearance of the Front Panel

Figure 12-11 shows the appearance of the front panels of the 61COA and N1COA.
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Figure 12-11 Front panel of the 61COA and N1COA

9

1. ID DIP switch
5. RS232-2
9. OUT optical port

2. Running indicator
6. MONITOR-1
10. Power switch

10

11

3. Alarm indicator
4. RS232-1
7. MONITOR-2
8. IN optical port
11. 48 V power interface

Figure 12-12 shows the appearance of the front panel of the 62COA.
Figure 12-12 Front panel of the 62COA

1. SC/PC optical interface

4. Fan board
7. RS232 -2
10. Power input interface

2. E2000 optical interface

5. RJ-45
8. DIP switch (85 bits)
11. Power switch

3. Air filter
6. RS232-1
9. DIP switch (41 bits)

Indicators
The following indicators are present on the front panel of the board:
l

Board running state (RUN), which is green when lit.

Fan alarm indicator (ALM), which is red when lit.

For indication of these indicators, see A Equipment and Board Alarm Indicators.

Interfaces
On the front panel of the 61COA and N1COA, there are one pair of SC/PC optical interfaces,
which are used to input or output one channel of optical signals. The input optical interface of
the 62COA is connected to the E2000 flange and the output optical interface is connected to the
SC flange. Figure 12-13 shows the SC/PC optical interfaces of the 61COA and N1COA.
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Figure 12-13 SC/PC fiber connector

Figure 12-14 shows the flange and fiber connector used at the input optical interface of the
62COA.
Figure 12-14 E2000 flange and fiber connector

NOTE

The dust cap is specially designed for the E2000 fiber jumper. Do not remove the cap during fiber
connection. For normal fiber connection, directly insert the fiber jumper into the E2000 flange.

The COA has two RS232 serial interfaces, which are connected to the SCC unit for reporting
of alarms and performance events.
Table 12-12 lists the pins of the RS232 interface.

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Table 12-12 Pins of the RS232 interface

Front View

RS232-2

Definition

Pin for receiving

data

Pin for
transmitting data

Pin for common

grounding

RS232-1

TIP

For the communication with the CXL, the RS232-1 interface of the COA is connected to the F&f interface
through the serial control cable.

The RS232-2 interface is used in the case of several COA on one NE.
Use the serial interface cable to connect the RS232-2 interface of the COA numbered 1 to the
RS232-1 interface of the COA numbered 2. Then connect the RS232-2 interface of the COA
numbered 2 to the RS232-1 of the COA numbered 1. Connect the RS232-1 and RS232-2
interfaces in this way. All the COA use the RS232-1 interface of the COA numbered 1 to
communicate with the SCC unit in the subrack.
The COA has two MONITOR interfaces. The MONITOR-1 and MONITOR-2 interfaces are
the alarm output interfaces when the 61COA is used separately. The two interfaces are the same.
Table 12-13 lists the pins of the MONITOR-1 and MONITOR-2 interfaces.
Table 12-13 Pins of the MONITOR-1 and MONITOR-2 interfaces
Front View

MONITOR-2

Definition

1, 6

1, 6

The input optical power of the

EDFA module is too low.

2, 7

2, 7

The working current of the pump

laser of the EDFA module crosses
the threshold.

3, 8

3, 8

The cooling current of the pump

laser of the EDFA module crosses
the threshold.

4, 9

4, 9

The ambient temperature of the

EDFA crosses the threshold.

Digital ground.

MONITOR1

The 62COA has one RJ-45 connector, through which the 62COA is connected to the computer
for software loading. Table 12-14 lists the pins of the RJ-45 connector of the 62COA.

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Boards

Table 12-14 Pins of the RJ-45 connector of the 62COA

Front View

8 7 6 5 4 3 2 1

Pin

Description

Transmitting positive

Transmitting negative

Receiving positive

Not defined

Not defined

Receiving negative

78

Not defined

The COA has a DIP switch.

l

The DIP switch of the 61COA or N1COA is on the lower left panel and is used to set the
ID for 61COA or N1COA. When you turn it upside, it is OFF. When you turn it downside,
it is ON. The SCC uses the IDs to identify and communicate with the 61COA or N1COA.

The DIP switch of the 62COA is used to set the ID of 62COA and the type of fibers. The
DIP switch has eight bits, from the left to right. The most left one is 8 and the most right
one is 1. For each bit, when you turn it upside, it means 0; when you turn it downside, it
means 1. The first four bits (14) are used to set the board ID, which ranges from 20 to 35
and from 20 to 27 in actual using. The fifth bit is used to set the fiber type. If it is turned
as 0, it indicates the fiber is of the G.652 type. If it is turned as 1, it indicates the fiber is of
the G.655 type.

12.3.5 Installation Position

The COA is case-shaped, and thus it is does not occupy a slot in the subrack.
In an ETSI cabinet, the 61COA or N1COA is intalled in a special bracket, and the 62COA is
installed directly in the cabinet with the mounting ears. On the T2000, the logical slots of the
61COA, N1COA, and 62COA are slots 101102.

Installation of the 61COA or N1COA

The installation of the 61COA is taken as an example. The bracket with guide rails is fixed on
the crossbars on both sides the cabinet. The 61COA is pushed into the brackets along the guide
rails and then fixed. One bracket can house two 61COA horizontally. The front panel of the
61COA is at the front side of the cabinet. Figure 12-15 shows the installation of the 61COA.

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Figure 12-15 Position of the 61COA in the ETSI cabinet

Installation of the 62COA

The case-shaped 62COA can be installed in the 300 mm or 600 mm ETSI cabinet with mounting
ears and screws. If the upward-wiring scheme is applied, the 62COA is installed at the bottom
of the ETSI cabinet (first and third floating nuts). If the downward-wiring scheme is applied,
the 62COA is installed in any idle place of the 2.6 m high cabinet or in the ETSI cabinet which
is not fully configured.

12.3.6 Board Feature Code

The code behind the board name in the barcode is the board feature code. The board feature code
of the 61COA indicates the output optical power of the optical interfaces.
Table 12-15 lists the relation between the board feature code and the output optical power.
Table 12-15 Relation between the board feature code and output optical power for the 61COA
Board Barcode

Feature Code

Output Optical Power

SS61COA01

01

14 dBm

SS61COA02

02

17 dBm

12.3.7 Technical Specifications

The technical specifications of the COA cover the dimensions, weight and power consumption.

Optical Interface Specifications

Table 12-16 lists the specifications of the optical interfaces of the COA.
Table 12-16 Specifications of the optical interfaces of the COA
Item

Specification
61COA

Line code
12-24

N1COA

62COA

NRZ
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12 Optical Amplifier Boards and Dispersion Compensation

Boards

Specification
61COA

N1COA

62COA

Working wavelength
(nm)

1550

1550.12

Range of input optical

power (dBm)

BA: -6 to +3

Output optical power

(dBm)

+13 to +15

Pump wavelength
(nm)

NA

1451.2

Max. on/off gain (dB)

NA

> 15 (for the G.652 fiber)

Noise figure (dB)

NA

< 1.5

-10 to -37

39 to 20 (2.5 Gbit/s signals

without FEC)

+15 to +17

NA

PA: -10 to -37

Mechanical Specifications
The mechanical specifications of the 61COA and N1COA are as follows:
l

Board dimensions (mm): 50 (H) x 190 (D) x 240 (W)

Weight (kg): 3.5

The mechanical specifications of the 62COA are as follows:

l

Board dimensions (mm): 86 (H) x 436 (D) x 294 (W)

Weight (kg): 8.0

Power Consumption
In the normal temperature (25), the maximum power consumption of the 61COA and N1COA
is 10 W.
In the normal temperature (25), the maximum power consumption of the 62COA is 75 W.

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13

13 Power Interface Boards

Power Interface Boards

About This Chapter

This chapter describes the power interface boards, such as the UPM (CAU), PIU, and PIUA.
13.1 UPM
This section describes the UPM, an uninterruptable power module, in terms of the version,
function, principle, front panel and specifications.
13.2 PIU
This section describes the PIU, a power interface unit, in terms of the version, function, principle,
front panel, configuration and specifications.
13.3 PIUA
This section describes the PIUA, a power interface unit, in terms of the version, function,
principle, front panel, configuration and specifications.

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13.1 UPM
This section describes the UPM, an uninterruptable power module, in terms of the version,
function, principle, front panel and specifications.
13.1.1 Version Description
None
13.1.2 Function and Feature
The UPM, a special power supply system, is coded GIE4805S.
13.1.3 Working Principle and Signal Flow
The UPM receives power from one channel of 220 V AC mains supply, which is rectified to
48 V DC power supply by the rectifier module. Finally, the UPM provides two channels of DC
power supplies and one channel of battery power supply.
13.1.4 Rear Panel
On the rear panel of UPM, there are indicators and interfaces of many types.
13.1.5 Valid Slots
The UPM is in case shape, and thus it does not occupy a slot in the subrack. On the T2000, the
logical slot of the UPM is slot 50.
13.1.6 Technical Specifications
The technical specifications of the UPM cover dimensions and weight.

13.1.1 Version Description

None

13.1.2 Function and Feature

The UPM, a special power supply system, is coded GIE4805S.
The UPM directly converts the 110 V or 220 V AC mains to the 48 DC communication voltage.
As a result, the requirements of telecommunication carriers who cannot provide the 48 DC
power to communication equipment or who require the usage of the storage battery can be met.
The UPM consists of the power supply case (110 V or 220 V to 48 V) and storage battery. The
output power of one UPM is 2 x 270 W. Figure 13-1 shows the appearance of the power supply
case with a height of 1U. The power supply case of the UPM can be directly installed in a 19inch or ETSI cabinet.
Figure 13-1 Appearance of the power supply case

80
E4
GI

13-2

5S

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NOTE

One the T2000, the UPM is displayed as a CAU board. Thus, add a CAU on the T2000 to manage and
maintain the UPM.

The storage battery of the UPM is used with the power supply case. If the external AC current
normally charges the storage battery, the storage battery can provide power for four hours when
the external 110 V or 220 V AC current is interrupted. When the UPM provides power supply
for the OptiX OSN equipment, only one power supply case should be connected to the storage
battery group.
The OptiX OSN equipment requires two power supply cases and one storage battery group
composed of four 12 V 40 Ah storage batteries. If the equipment does not require the storage
battery, only configure one power supply case. The standard full configuration for each power
supply case requires two rectifier modules and one monitoring module.
Table 13-1 lists the functions and features of the UPM.
Table 13-1 Functions and features of the UPM
Item

UPM

Two-channel hot
backup

The converting portion of the UPM has the hot backup function of
two-channel AC/DC rectifier modules. In addition, the two rectifier
modules with the function of load balance can work at the same. If
one rectifier module fails, the other one immediately takes over the
entire load. As a result, the working equipment is not affected, and
the system stability is enhanced.

Hot swap function

In the UPM power supply system, the AC/DC rectifier modules have
the hot swap function. When the faulty rectifier module is removed,
the other rectifier module is not affected. Thus, the system
maintainability is enhanced.

Protection function
for the storage
battery

The UPM can protect the storage battery. When the mains supply is
interrupted, the power supply system can automatically switch to the
storage battery. Thus, the normal running of equipment is not
affected. The capacity of the storage battery module is 40 Ah.

Function of
monitoring

The UPM integrates the monitoring module and T2000 monitoring

module. The monitoring module monitors and controls the
parameters and states of the rectifier module, AC/DC power
distribution, and storage battery group in real time, and then reports
the parameters and states to the T2000. The storage battery
automaticallly realizes the floating charging and current limiting
management.

Band loading
capacity

The band loading capacity of each rectifier module is 270 W.

13.1.3 Working Principle and Signal Flow

The UPM receives power from one channel of 220 V AC mains supply, which is rectified to
48 V DC power supply by the rectifier module. Finally, the UPM provides two channels of DC
power supplies and one channel of battery power supply.
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When the UPM works normally, the monitoring module controls the rectifier module, battery
loop circuit and loading loop circuit, which then work according to the preset parameters and
user settings. The monitoring module also monitors their status and data.
When the mains power supply goes faulty, the battery power supply system supplies power to
the equipment. Before the mains power supply goes faulty, the battery power supply system
must be present. When the mains power supply fails and the battery starts discharging, the
monitoring module reports the alarms indicating the fault of the mains power supply. As the
battery discharges, the battery voltage decreases. When the battery voltage decreases to 45 V,
the monitoring module reports the alarm indicating the undervoltage. When the battery voltage
decreases to 43 V, the battery cuts off the connection to the equipment and protects itself.
When the mains power supply recovers, the UPM works normally.

13.1.4 Rear Panel

On the rear panel of UPM, there are indicators and interfaces of many types.

Appearance of the Front Panel

Figure 13-2 shows the rear view of the UPM (subject to the UPM on site ).
Figure 13-2 Rear view of the UPM
4
BAT

! CAUTION

BAT-

DO NOT INVERT POLARITY

BAT+
48V+
48VLOAD1

LOAD2

5
AC100~240

6
RUN

ALM Vout

ALM

ALM Vout
RS232

1
1. AC input
5. Load

2. Rectifier module/air outlet

6. Load

3
3. Communication interface

4. Battery interface

Indicators
The following indicators are for the rectifier module on the left of the UPM.
l

Rectifier module fault indicator (ALM), which is red when lit.

Rectifier module output state indicator (Vout), which is green when lit.

The following indicators are for the monitoring module on the top panel of the UPM.
l

13-4

Power supply system fault indicator (ALM), which is red when lit.
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13 Power Interface Boards

Power supply system indicator (RUN), which is green when lit.

For indication of these indicators, see A Equipment and Board Alarm Indicators.

Interfaces
There are four interfaces on the rear panel of the UPM. Table 13-2 lists the type and usage of
these interfaces.
Table 13-2 Interfaces on the rear panel of the UPM
Interface

Interface Type

Usage

AC100240

Power interface

Acts as a socket for the AC mains supply and

accesses 110 V or 220 V AC power supply.

Red switch button

Button

Locates on the right of the panel of the rectifier

module. Press the switch button to enable or
disable the functioning of the rectifier module.

RS232
communication
interface

RS232

The power supply system can connect to the

SCC of the OptiX OSN equipment through this
interface to realize the functions such as the
alarm reporting and remote control. Connect the
RS232 serial interface of one power box to the
F&f interface of the OptiX OSN equipment. The
T2000 then can monitor the battery and the
power box. Connect the RS232 interface of the
other power box to the ALM1 interface of the
OptiX OSN equipment. The T2000 then can
monitor the other power box.

Power output
interface

Power interface

Three power output interfaces are on the most

right of the power box. The top interface is a
battery interface, which can be connected to the
socket on the battery by using battery cables.
The bottom two are loading interfaces, which
can be connected to the OptiX OSN equipment
and supply power to the equipment.

Table 13-3 lists the pins of the RS232 interface.

Table 13-3 Pins of the RS232 interface of the UPM

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Item

Pin

Usage or on/off State

Pin for receiving data

Receives data.

Pin for transmitting data

Transmits data.

Pin for common grounding

Grounds.

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Item

Pin

Usage or on/off State

Pins for alarms indicating

faults of the rectifier
module

89

On

Pins for normal state of the

rectifier module

89

Off

Pins for alarms indicating

the off state of the AC
power supply

87

On

Pins for the normal state of

the AC power supply

87

Off

Pins for the alarm

indicating undervoltage
discharged from the battery

86

On

Pins for the alarm

indicating no discharge
from the battery

86

Off

13.1.5 Valid Slots

The UPM is in case shape, and thus it does not occupy a slot in the subrack. On the T2000, the
logical slot of the UPM is slot 50.

13.1.6 Technical Specifications

The technical specifications of the UPM cover dimensions and weight.

Specifications of the power supply

Table 13-4 lists the specifications of the power supply of the UPM.
Table 13-4 Specifications of the power supply of the UPM

13-6

Item

Specification

Input AC voltage range

90264 V AC

AC input

One channel of monophase three-wire AC power: 47 Hz

63 Hz

Rated input current

3.5 A

Nominal output voltage

54.00.5 V

Rated output current

8 A (Two loading outputs, each of which has the loading

voltage not more than 5 A)

Number of backup battery groups

1 (40 Ah)

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Item

Specification

Charging current of the backup

battery

3A

Fuse of the backup battery

10 A

Undervoltage DC point of the

battery

460.5 V

Termination voltage point of the

battery

43.50.5V

Floating charge voltage of the

battery

-54.00.5 V

Regulated voltage precision

1%

Non-balance of load sharing

5% (50%100% loading)

Rated efficiency of the integrated 80%

device
Peak stray noise voltage

200 mV

Voltage drop in the power panel

(20)

500 mV

Electrical network adjustment

rate

0.1%

Mechanical Specifications
The mechanical specifications of the UPM are as follows:
l

Dimensions of the UPM (mm): 438 (H) x 240 (D) x 44 (W)

Dimensions of a battery (mm): 197 (H) x 165 (D) x 170 (W)

13.2 PIU
This section describes the PIU, a power interface unit, in terms of the version, function, principle,
front panel, configuration and specifications.
The OptiX OSN 1500B supports the PIU and the OptiX OSN 1500A does not.
13.2.1 Version Description
The functional version of the PIU is R1.
13.2.2 Function and Feature
The PIU is used to access the power supply, and to provide the lightning protection and filtering.
13.2.3 Working Principle and Signal Flow
The PIU consists of the protecting unit, filter unit, power detecting unit and clock protecting
unit.
13.2.4 Front Panel
On the front panel of the PIU, there are indicators and power interfaces.
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13.2.5 Valid Slots

The PIU can be housed in any of slots 1819 in the OptiX OSN 1500B subrack.
13.2.6 Technical Specifications
The technical specifications of the PIU cover the dimensions, weight, power consumption, input
voltage and fuse tube.

13.2.1 Version Description

The functional version of the PIU is R1.

13.2.2 Function and Feature

The PIU is used to access the power supply, and to provide the lightning protection and filtering.
Table 13-5 lists the functions and features of the PIU.
Table 13-5 Functions and features of the PIU
Function and
Feature

PIU

Function of
lightning protection

Provides the lightning protection, and reports the alarm indicating the
failure of the lightning protection module.

Function of
filtering

Enhances the electromagnetic compatibility of the system by filtering

the power supply port and shielding the board.

Power supply
interface

Provides one 50 W power interface for external devices, such as the

COA.

Power supply of the

FAN

Provides 48 V 20% voltage for the FAN.

Clock interface

Provides 75-ohm clock input and output interfaces, and protects clock
signals.

Alarm monitoring

Reports the board in-service alarm.

Power supply
backup

Supports the 1+1 hot backup. Any one PIU can provide power for the
entire subrack by itself.

13.2.3 Working Principle and Signal Flow

The PIU consists of the protecting unit, filter unit, power detecting unit and clock protecting
unit.
Figure 13-3 shows the block diagram for the functions of the PIU.

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Figure 13-3 Block diagram for the functions of the PIU

NEG(-)

NEG(-)
Filter
unit

Protecting
unit

RTN(+)

RTN(+)

Power
detecting
unit

Clock input
LED
indication

Clock
protecting
unit

Clock output

Filter Unit
The filter unit uses the electromagnetic interference (EMI) filter to filter the electromagnetic
interference signals and thus to keep the equipment running in a stable manner.

Protecting Unit
This unit is used to prevent the equipment from overcurrent and lightning.

Power Detecting Unit

The power detecting unit checks whether the input power supply is valid and uses indicators to
indicate the status of the input power supply.

Clock Protecting Unit

This unit is used to protect the input clock signals.

13.2.4 Front Panel

On the front panel of the PIU, there are indicators and power interfaces.

Appearance of the Front Panel

Figure 13-4 shows the appearance of the front panel of the PIU.

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Figure 13-4 Front panel of the PIU

PIU

O
I
POWER

PWS

RTN(+)

PWR

NEG(-)

CLK IN

CLK OUT

PIU

Indicators
A power supply indicator (POWER) is present on the front panel of the board and is green when
lit..
For indication of these indicators, see A Equipment and Board Alarm Indicators.

Interfaces
There are three power interfaces on the front panel of the PIU. Table 13-6 lists the type and
usage of the interfaces.
Table 13-6 Interfaces on the front panel of the PIU
Interface

Interface
Type

Usage

PWR

Power input
interface

Inputs the 48 V power supply.

ClK IN

SMB

75-ohm clock input interface (SMB)

ClK OUT

SMB

75-ohm clock output interface (SMB)

13.2.5 Valid Slots

The PIU can be housed in any of slots 1819 in the OptiX OSN 1500B subrack.

13.2.6 Technical Specifications

The technical specifications of the PIU cover the dimensions, weight, power consumption, input
voltage and fuse tube.
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Mechanical Specifications
The mechanical specifications of the PIU are as follows:
l

Board dimensions (mm): 108 (H) x 110 (D) x 41.5 (W)

Weight (kg): 1.3

Power Consumption
In the normal temperature (25), the maximum power consumption of the PIU is 1.5 W.

Input Voltage
The input voltage of the PIU ranges from 38.4 V to 72 V.

Fuse Tube
The main loop fuse of the PIU is 250 V-10 A-0.006 ohm.

13.3 PIUA
This section describes the PIUA, a power interface unit, in terms of the version, function,
principle, front panel, configuration and specifications.
The OptiX OSN 1500A supports the PIUA and the OptiX OSN 1500B does not.
13.3.1 Version Description
The functional version of the PIUA is R1.
13.3.2 Function and Feature
The PIUA is used to access the power supply, and to provide the lightning protection and
filtering.
13.3.3 Working Principle and Signal Flow
The PIUA consists of the power interface unit, protecting unit, filter unit, power supply detecting
unit, fan power supply unit and external power supply interface unit.
13.3.4 Front Panel
On the front panel of the PIUA, there are indicators and power interfaces.
13.3.5 Valid Slots
The PIUA can be housed in any of slots 111 in the subrack.
13.3.6 Technical Specifications
The technical specifications of the PIUA cover the dimensions, weight, power consumption,
input voltage and fuse tube.

13.3.1 Version Description

The functional version of the PIUA is R1.

13.3.2 Function and Feature

The PIUA is used to access the power supply, and to provide the lightning protection and
filtering.
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Table 13-7 lists the functions and features of the PIUA.

Table 13-7 Functions and features of the PIUA
Function and
Feature

PIUA

Function of
lightning protection

Provides the lightning protection, and reports the alarm indicating the
failure of the lightning protection module.

Function of
filtering

Enhances the electromagnetic compatibility of the system by filtering

the power supply port and shielding the board.

Power supply
interface

Provides one 50 W power interface for external devices, such as the

COA.

Power supply of the

FAN

Provides 48 V 20% voltage for the FAN.

Alarm monitoring

Reports the board in-service alarm.

Power supply
backup

Supports the 1+1 hot backup. Any one PIU can provide power for the
entire subrack by itself.

13.3.3 Working Principle and Signal Flow

The PIUA consists of the power interface unit, protecting unit, filter unit, power supply detecting
unit, fan power supply unit and external power supply interface unit.
Figure 13-5 shows the block diagram for the functions of the PIUA.
Figure 13-5 Block diagram for the functions of the PIUA
External
power supply
interface
NEG(-)
RTN(+)

Lightning
protection
module

Filter
module

Power
detection

NEG(-)
RTN(+)

Fan power
module

LED
indication

Power Interface Unit

This unit accesses the 48 V or 60 V power supply for the system.

Protection Unit
This unit is used to prevent the equipment from overcurrent and lightning.
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Filter Unit
The filter unit uses the electromagnetic interference (EMI) filter to filter the electromagnetic
interference signals and thus to keep the equipment running in a stable manner.

Power Detecting Unit

The power detecting unit checks whether the input power supply is valid and uses indicators to
indicate the status of the input power supply.

Fan Power Supply Unit

This unit is used to supply stable power to the fans.

External Power Supply Interface Unit

This unit supplies 48 V power to the external equipment, such as the COA. The interfaces are
present on the panel.

13.3.4 Front Panel

On the front panel of the PIUA, there are indicators and power interfaces.

Appearance of the Front Panel

Figure 13-6 shows the appearance of the front panel of the PIUA.
Figure 13-6 Front panel of the PIUA

PIUA
POWER

PWS
I
O
NEG(-)
RTN(+)

PIUA

Indicators
A power supply indicator (POWER) is present on the front panel of the board and is green when
lit..
For indication of these indicators, see A Equipment and Board Alarm Indicators.
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Interfaces
On the front panel of the PIUA, there are two interfaces and one switch. Table 13-8 lists the
type and usage of the interfaces and switch.
Table 13-8 Interfaces and switch on the front panel of the PIUA
Interface

Interface Type

Usage

PWR

Inputs the 48 V
power supply.

Inputs the 48 V power supply.

PWS

Output interface
for the 50 W
power supply

Outputs the 50 W power supply for the COA or HUB.

Power switch

Switch

Turn the switch to position 1 or ON to supply power

to the equipment. Turn the switch to position 0 or OFF
to shut the power supply to the equipment.

13.3.5 Valid Slots

The PIUA can be housed in any of slots 111 in the subrack.

13.3.6 Technical Specifications

The technical specifications of the PIUA cover the dimensions, weight, power consumption,
input voltage and fuse tube.

Mechanical Specifications
The mechanical specifications of the PIUA are as follows:
l

Board dimensions (mm): 111.8 (H) x 220 (D) x 25.4 (W)

Weight (kg): 1.5

Power Consumption
In the normal temperature (25), the maximum power consumption of the PIUA is 3 W.

Input Voltage
The input voltage of the PIUA ranges from 38.4 V to 72 V.

Fuse tube
The main loop fuse of the PIU is 250 V-10 A-0.006 ohm.

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14 Cables

14

Cables

About This Chapter

This chapter describes the cables used for the equipment. The cables include the fiber jumpers,
power cables, alarm cables, management cables, signal cables and clock cables.
14.1 Fiber Jumper
The following section describes the types of fiber jumpers and connectors.
14.2 Power Cables and Grounding Cables
The power cables and grounding cables include the cabinet power cable, equipment supply cable,
and UPM power cable.
14.3 Alarm Cable
The alarm cables for the equipment include the alarm input/output cable, cabinet indicator cable,
alarm concatenation cable and alarm input/output cable.
14.4 Management Cable
The management cable includes the serial port cable, ordinary phone wire, COA concatenating
cable and network cable.
14.5 Signal Cable
The signal cable includes the E1/E3 signal cable, framed E1 signal cable and N x 64 kbit/s signal
cable. The OptiX OSN 1500A supports only the E1/E3 signal cable.
14.6 Clock Cable
The clock cable includes the clock cable and clock transfer cable.

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14.1 Fiber Jumper

The following section describes the types of fiber jumpers and connectors.
14.1.1 Types of Fiber Jumpers
The OptiX OSN equipment can use various types of fiber jumpers.
14.1.2 Connector
The OptiX OSN equipment can use various types of connectors.

14.1.1 Types of Fiber Jumpers

The OptiX OSN equipment can use various types of fiber jumpers.
Table 14-1 lists the types of fiber jumpers used by the OptiX OSN equipment.
Table 14-1 Types of fiber jumpers
Usage

Connector
1

Connector
2

Cable

Length

Optical fiber that

connects the
OptiX OSN
equipment to the
ODF or connects
the interface
board of the
OptiX OSN
equipment to the
optical fiber of
other equipment

LC/PC

FC/PC

2 mm SLM
optical fiber

6 m, 10 m, 20 m, 30 m,
50 m

2 mm MLM
optical fiber

3 m, 5 m, 10 m, 20 m,
30 m, 50 m

2 mm SLM
optical fiber

5m, 10 m, 20 m, 30 m,
50 m

2 mm MLM
optical fiber

10 m, 20 m, 30 m, 50
m

SC/PC

SC/PC

2 mm SLM
optical fiber

2m, 5 m, 10 m, 20 m,
30 m, 50 m, 80 m

Optical fiber that

interconnects the
OptiX OSN
equipment

LC/PC

LC/PC

2 mm SLM
optical fiber

1.5 m, 3 m, 5 m, 10 m,
20 m, 30 m

2 mm MLM
optical fiber

3 m, 5 m, 10 m, 20 m,
30 m

LC/PC

SC/PC

LC/PC

FC/PC

2 mm SLM
optical fiber

6 m, 10 m, 20 m, 30 m,
50 m

LC/PC

SC/PC

2 mm SLM
optical fiber

5m, 10 m, 20 m, 30 m,
50 m

Select the fiber connector and the fiber length according to the on-site survey.

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CAUTION
When selecting the fiber connector, make sure that the single-longitudinal mode or multilongitudinal mode optical transmitting module is connected to the single-mode fiber.

14.1.2 Connector
The OptiX OSN equipment can use various types of connectors.
The four types of fiber connectors are listed as follows:
l

Interfaces on the front panel of boards are mostly the LC/PC optical interfaces. See Figure
14-1.

The N2OU08 and 61COA provide the SC/PC optical interfaces.

The "IN" interface on the externally-installed case-shaped 62COA uses the E2000/APC
connector. See Figure 14-4.

The ODF at the client side uses the FC/PC or SC/PC optical interface. Figure 14-3 and
Figure 14-2 show the corresponding FC/PC and SC/PC optical connectors.

Table 14-2 lists the description of the four optical connectors.

Table 14-2 Types of connectors
Internal Fiber
Connector

Description

LC/PC

Plug-in square fiber connector/protruding polished

E2000/APC

Connector with dust-proof cover/protruding polished (8 degrees)

FC/PC

Round fiber connector/protruding polished

SC/PC

Square fiber connector/protruding polished

LC/PC Optical Connector

Figure 14-1 shows the appearance of the LC/PC optical connector.
Figure 14-1 LC/PC optical connector

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The axial operation instead of rotation is required to insert or remove the LC/PC optical interface.
Align the head of the fiber jumper with the optical interface with proper strength to insert the
fiber jumper into the LC/PC connector. To remove the LC/PC fiber jumper, first press the clip,
and then push fiber connector inward slightly, and pull out the connector.

SC/PC Optical Connector

Figure 14-2 shows the appearance of the SC/PC optical connector.
Figure 14-2 SC/PC optical connector

FC/PC Optical Connector

Figure 14-3 shows the appearance of the FC/PC optical connector.
Figure 14-3 FC/PC optical connector

E2000/APC Optical Interface

Figure 14-4 shows the appearance of the E2000/APC optical interface.

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Figure 14-4 E2000/APC optical connector

14.2 Power Cables and Grounding Cables

The power cables and grounding cables include the cabinet power cable, equipment supply cable,
and UPM power cable.
14.2.1 Cabinet 48 V/BGND/PGND Power Cable
The 48 V, BGND and PGND power cables are used to supply power to the equipment in the
cabinet. One end of the power cable connects to the power distribution cabinet and grounding
bar in the equipment room, and the other end connects to the power distribution unit at the cabinet
top.
14.2.2 Equipment 48 V/60 V Power Cable/PGND Grounding Cable
The equipment 48 V/60 V power cable/PGND grounding cable directly connects to the
external 48 V/60 Vpower supply and the PIU of the OptiX OSN 1500, and unit at the cabinet
top and the PIU board on the subrack. The external 48 V/60 V power supply is led out to the
OptiX OSN 1500 equipment.
14.2.3 UPM Power Cable
This section describes the UPM power cable in terms of the structure, connection and technical
specifications.

14.2.1 Cabinet 48 V/BGND/PGND Power Cable

The 48 V, BGND and PGND power cables are used to supply power to the equipment in the
cabinet. One end of the power cable connects to the power distribution cabinet and grounding
bar in the equipment room, and the other end connects to the power distribution unit at the cabinet
top.

Structure
Figure 14-5 shows the structure of the 48 V cabinet power cable/BGND power grounding
cable. Figure 14-6 and Figure 14-7 show the structure of the PGND protection grounding cable.

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Figure 14-5 Cabinet 48 V power cable and BGND power grounding cable
1

3
1. Cord end terminal

2. Bare connector-OT type

3. Cable tie

Figure 14-6 Cabinet PGND protection grounding cable (JG2)

1. Bare connector-OT type

2. Cable tie

3. Bare connector (JG2)

4. Heat-shrink tube

5. Main tag

6. Wire

7. Heat-shrink tube

Figure 14-7 Cabinet PGND protection grounding cable (OT)

1. Bare connector-OT type

2. Cable tie

3. Bare connector (OT)

4. Heat-shrink tube

5. Main tag

6. Wire

7. Heat-shrink tube

Pin Assignment
None
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Technical Specifications
Item
48 V cabinet
power cable

Cabinet BGND
power
grounding cable

Cabinet PGND
protection
grounding cable

Description
Connector 2

Bare crimping terminal-OT type-16 mm2-M8-tin platingbare ring terminal

Connector 1

Single cord end terminal-16 mm2-length 24 mm-inserted 12

mm deep-80A-green

Cable type

Power cable-450 V/750 V-16 mm2-round and bllue-85A

Connector 2

Bare crimping terminal-OT type-16 mm2-M8-tin platingbare ring terminal

Connector 1

Single cord end terminal-16 mm2-length 24 mm-inserted 12

mm deep-80A-green

Cable type

Power cable-450 V/750 V-16 mm2-round and black-85A

Connector 1

Bare crimping terminal-OT type-25mm2-M8-tin platingbare ring terminal

Connector 3

Bare crimping connector-JG2-25 mm2-M6-95A-tin

plating, or bare crimping connector-JG2-25 mm2-M8-95Atin plating, or bare crimping terminal-OT type-25 mm2-M8tin plating-bare ring terminal

Cable type

Power cable-450 V/750 V-25 mm2-yellow and green-85 A

Fireproof level

CM

Length

10 m, 20 m, 30 m

14.2.2 Equipment 48 V/60 V Power Cable/PGND Grounding

Cable
The equipment 48 V/60 V power cable/PGND grounding cable directly connects to the
external 48 V/60 Vpower supply and the PIU of the OptiX OSN 1500, and unit at the cabinet
top and the PIU board on the subrack. The external 48 V/60 V power supply is led out to the
OptiX OSN 1500 equipment.

Structure
Figure 14-8 shows the structure of the equipment 48 V/60 V power cable. Figure 14-9 shows
the structure of the PGND grounding cable.

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Figure 14-8 Structure of the equipment 48 V/60 V Power Cable

A3

A2
A1

Figure 14-9 PGND power cable

1. Bare connector-OT type

2. Cable tie

3. Bare connector

5. Main tag

6. Wire

7. Heat-shrink tube

4. Heat-shrink tube

Pin Assignment
For details on the pin assignment, refer to Table 14-3.
Table 14-3 Equipment 48 V/60 V power cable
Cable connector

Corresponding cable

Core color

A1

W1

Blue (48 V/60 V power)

A3

W2

Black (power ground)

Technical Specifications

14-8

Item

Equipment 48 V/60 V
power cable

PGND grounding cable

Cable connector

Cable connector-D
type-3PIN-female

Bare crimping connector-OT-6 mm2M4-tin plating-pre-insulated ring

terminal-1210AWG bare crimping
connector-OT-6 mm2-M8-tin platinginsulated ring terminal-1210AWG

Cable

Wire-300 V-16AWGblack (the core is blue and

black)-13A

Wire-600 V-10AWG-yellow/green-50A

Type

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Item

14 Cables

Equipment 48 V/60 V
power cable

PGND grounding cable

Number of
cores

Fireproof
level

CM

CM

Color

Blue or black

Yellow and green

Length

15 m, 30 m

15 m, 30 m

14.2.3 UPM Power Cable

This section describes the UPM power cable in terms of the structure, connection and technical
specifications.

Structure
Figure 14-10 shows the power cable that is used to connect the UPM to the OptiX OSN 1500.
Figure 14-10 Structure of the UPM power cable
A
A1
A2

B
1
2

A3

X2

X1

Connection of the UPM Power Cable

Table 14-4 lists the connections of the UPM power cables.
Table 14-4 Connection of the UPM power cable

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Cable
Connector X1

Correspondi
ng Cable

Cable Connector
X2

Core Color

A1

W1

Blue (48 V/60 V power

supply)

A3

W2

Black (ground for the power

supply)

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Specifications of the UPM Power Cable

Table 14-5 Specifications of the UPM power cable
Item

UPM Power Cable

Cable connector X1

Cable connector-D type-3PIN-female (two female and one male)

Cable connector X2

Common plug-2PIN-single row

Cable

Type

Cable-300 V-1.31 mm2-16 AWG-black (core: blue or black)-13 A

Number of
cores

Fireproof
class

CM

Color

Core: blue or black

Length

2.5 m

14.3 Alarm Cable

The alarm cables for the equipment include the alarm input/output cable, cabinet indicator cable,
alarm concatenation cable and alarm input/output cable.
14.3.1 Alarm Input/Output Cable
The alarm input cable is used to input the alarm signals of the external equipment to the OptiX
OSN equipment. The alarm output cable is used to output the alarm signals to the central alarm
monitoring equipment.

14.3.1 Alarm Input/Output Cable

The alarm input cable is used to input the alarm signals of the external equipment to the OptiX
OSN equipment. The alarm output cable is used to output the alarm signals to the central alarm
monitoring equipment.
One end of the alarm input/output cable uses an RJ-45 connector to connect to the alarm input/
output interface of the equipment. The other end uses a connector to connect to the external
equipment or central alarm monitoring equipment. The connector should be made according to
the on-site equipment. Each alarm input/output alarm cable can transmits four channels of alarm
signals.

Structure
Figure 14-11 shows the structure of the alarm input/output cable.

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Figure 14-11 Structure of the alarm input/output cable

1. Network interface connectorRJ-45

2. Main tag

A-A. Sectional view in direction A

Pin Assignment
Table 14-6 lists the pin assignment of the alarm input/output cable.
Table 14-6 Pin assignment of the alarm input/output cable
Connect
or X1

Color

Relation

Alarm Output

Alarm Input

X1.1

Blue

Twisted pair

Positive for critical and major

alarms

SW_INPUT 1+

X1.2

White

Negative for critical and

major alarms

SW_INPUT 1

X1.3

Orange

Positive for minor and

warning alarms

SW_INPUT 2+

X1.6

White

Negative for minor and

warning alarms

SW_INPUT 2

X1.4

Green

Positive for alarm signal

output 1

SW_INPUT 3+

X1.5

White

Negative for alarm signal

output 1

SW_INPUT 3

X1.7

Brown

Positive for alarm signal

output 2

SW_INPUT 4+

X1.8

White

Negative for alarm signal

output 2

SW_INPUT 4

Twisted pair

Twisted pair

Twisted pair

Technical Specifications

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Item

Description

Connector X1

Network interface connector-8PIN-8 bit-shielded-crystal plug

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Item

Description

Cable type

Twisted pair cable-120 ohms-SEYPVPV-0.5 mm-24AWG-8 coresPANTONE 430U

Twisted pair cable-10015 ohms-shielded enhanced type 5 CAT5E
SFTP-24AWG-8 core-PANTONE445U

Number of
cores

Fireproof class

CM

Core diameter

0.5 mm

Length

10 m, 20 m, 30 m

14.4 Management Cable

The management cable includes the serial port cable, ordinary phone wire, COA concatenating
cable and network cable.
14.4.1 OAM Serial Port Cable
The OAM serial port cable is used for management and remote maintenance of the OptiX OSN
equipment.
14.4.2 Serial 14/F1/F&f Serial Port Cable
Use the RJ-45 connector to connect one end of the serial port cable to the Serial 14 interface,
F1 or F&f serial port. Use the DB9 connector to connect the other end to the external detecting
device or managed external device.
14.4.3 RS232/RS-422 Serial Port Cable
The RS232/RS-422 serial port cable is used to transmit the management signaling between
different subnets.
14.4.4 Ordinary Telephone Wire
The telephone wire is used for orderwire communication. Use the RJ-11 connectors at both ends.
Connect one end to PHONE interface of the equipment and connect the other end to the interface
of the orderwire phone.
14.4.5 COA Concatenating Cable
When several COA are installed in one cabinet, use the RS232 or RS-422 serial port cables to
connect these COA.
14.4.6 Straight Through Cable
The straight through cable is used for the communication between the OptiX OSN equipment,
the T2000 equipment and the Ethernet. Use the RJ-45 connectors at both ends.
14.4.7 Crossover Cable
The crossover cable is used to directly connect the T2000 computer to the OptiX OSN equipment.

14.4.1 OAM Serial Port Cable

The OAM serial port cable is used for management and remote maintenance of the OptiX OSN
equipment.
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Use the RJ-45 connector to connect one end of the cable to the OAM interface of the equipment.
Use the DB25 or DB9 connector to connect the other end to a laptop, T2000 computer or modem.

Structure
Figure 14-12 shows the structure of the OAM serial port cable (DB25 connector).
Figure 14-12 Structure of the OAM serial port cable

1. Network interface
connectorRJ-45

2. Main tag 3. Cable connectorDB25 male

A-A. Sectional view in B-B. Sectional view in

direction A
direction B

Pin Assignment
Table 14-7 lists the pin assignment of the alarm input/output cable.
Table 14-7 Pin assignment of the OAM serial port cable
Connector
X1

Connector X2

Relation

Description

X1.2

X2.20

Single

Data terminal ready (DTR)

X1.3

X2.2

Single

Transmit data (TD)

X1.6

X2.3

Single

Receive data (RD)

X1.4

X2.7

Twisted pair

Signaling ground (SG)

X1.5

Technical Specifications

Issue 02 (2007-09-10)

Item

Description

Connector X1

Network interface connector-8PIN-8 bit-shielded-crystal plug

Connector X2

Cable connector-D type-25PIN-male or cable connector-D type-9PINmale

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Item

Description

Type

Twisted pair cable-120 ohms-SEYPVPV-0.5 mm-24AWG-8 corePANTONE 430U

Number of
cores

Fireproof class

CM

Length

5000 mm

14.4.2 Serial 14/F1/F&f Serial Port Cable

Use the RJ-45 connector to connect one end of the serial port cable to the Serial 14 interface,
F1 or F&f serial port. Use the DB9 connector to connect the other end to the external detecting
device or managed external device.
The Serial 14/F1/F&f serial port cable is used for the following functions:
l

Transparently transmits the environment detecting data signals.

Manages the external device such as the COA.

Structure
Figure 14-13 shows the structure of the Serial 14/F1/F&f serial port cable.
Figure 14-13 Structure of the Serial 14/F1/F&f serial port cable

1. Network interface
connectorRJ-45

2. Main tag 3. Cable connectorDB25 male

A-A. Sectional view in B-B. Sectional view in

direction A
direction B

Pin Assignment
Table 14-8 lists the pin assignment of the Serial 14/F1/F&f cable.

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Table 14-8 Pin assignment of the Serial 14/F1/F&f serial port cable
Connector X1

Connector X2

Relation

Description

X1.1

X2.8

Twisted pair

RS-422RX+

X1.2

X2.9

X1.3

X2.6

X1.6

X2.7

X1.4

X2.3

X1.8

X2.2

X1.5

X2.5

RS-422RX
Twisted pair

RS-422TX+
RS-422TX

Twisted pair

RS232RX
RS232TX

Single

SG

Technical Specifications
Item

Description

Connector X1

Network interface connector-8PIN-8 bit-shielded-crystal plug

Connector X2

Cable connector-D type-9 PIN-male

Cable type

1. Twisted pair-120 ohms-SEYPVPV-0.5 mm-24AWG-8 core-PANTONE

430U 2. Twisted pair-100 ohms-SEYVP-0.48 mm-26AWG-8 core-black

Number of
cores

Fireproof class

CM

Length

15 m for cable type 1 and 3 m for cable type 2

14.4.3 RS232/RS-422 Serial Port Cable

The RS232/RS-422 serial port cable is used to transmit the management signaling between
different subnets.
Use the RJ-45 connectors at both ends. Connect one end to the RS232 or RS-422 serial port of
the equipment. Connect the other end to the RS232 or RS-422 serial port of the equipment that
requires the orderwire phone communication.

Structure
Figure 14-14 shows the structure of the RS232/RS-422 serial port cable.

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Figure 14-14 Structure of the RS232/RS-422 serial port cable

1. Network interface connectorRJ-45

2. Main tag

A-A. Sectional view in direction A

Pin Assignment
Table 14-9 lists the pin assignment of the RS232/RS-422 serial port cable.
Table 14-9 Pin assignment of the RS232/RS-422 serial port cable
Connector
X1

Connector X2

Relation

Description

X1.3

X2.1

Twisted pair

RX+

X1.6

X2.2

X1.1

X2.3

X1.2

X2.6

X1.5

X2.5

X1.4

X2.8

X1.8

X2.4

RX
Twisted pair

TX+
TX

Twisted pair

SG
232RX

Single

232TX

Technical Specifications

14-16

Item

Description

Connector X1/X2

Network interface connector-8PIN-8 bit-shielded-crystal plug

Cable type

Twisted pair cable-120 ohms-SEYPVPV-0.5 mm-24AWG-8 corePANTONE 430U

Number of cores

Fireproof class

CM

Length

15 m

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14.4.4 Ordinary Telephone Wire

The telephone wire is used for orderwire communication. Use the RJ-11 connectors at both ends.
Connect one end to PHONE interface of the equipment and connect the other end to the interface
of the orderwire phone.

Structure
Figure 14-15 shows the structure of the ordinary telephone wire.
Figure 14-15 Structure of the ordinary telephone wire

1. Phone connector-RJ-11crystal plug

2. Main tag

Pin Assignment
Table 14-10 lists the pin assignment of the ordinary telephone wire.
Table 14-10 Pin assignment of the ordinary telephone wire
Connector X1

Connector X2

Description

X1.1

X2.1

No connected

X1.2

X2.2

No connected

X1.3

X2.3

TIP

X1.4

X2.4

RING

X1.5

X2.5

No connected

X1.6

X2.6

No connected

Technical Specifications

Issue 02 (2007-09-10)

Item

Description

Connector X1/X2

Network interface connector-6PIN-26 to 28AWG

Cable type

Power cable-150 V-UL20251-0.08 mm2-28AWG-black-1A-2-core

telephone wire

Number of cores

Fireproof class

CM

Length

15 m
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14.4.5 COA Concatenating Cable

When several COA are installed in one cabinet, use the RS232 or RS-422 serial port cables to
connect these COA.
Use the DB9 connectors at both ends. Connect one end to the RS232-1 of one COA and connect
the other end to the RS232-2 of another COA.

Structure
Figure 14-16 shows the structure of the COA concatenating cable.
Figure 14-16 Structure of the COA concatenating cable

1. Cable connector-DB25 male

2. Tag

A-A. Sectional view in direction A

Pin Assignment
Table 14-11 lists the pin assignment of the COA concatenating cable.
Table 14-11 Pin assignment of the COA concatenating cable
Connector X1

Connector X2

Remarks

One pair

Grounding

Technical Specifications

14-18

Item

Description

Connector X1/X2

Cable connector-D type-9 PIN-male

Cable type

Twisted pair-100 ohms-UL2464-0.32 mm-28AWG-2P-Huawei

gray

Number of cores

Two pairs

Fireproof class

CM

Length

0.6 m, 2.5 m
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14.4.6 Straight Through Cable

The straight through cable is used for the communication between the OptiX OSN equipment,
the T2000 equipment and the Ethernet. Use the RJ-45 connectors at both ends.

Structure
Figure 14-17 shows the structure of the straight through cable.
Figure 14-17 Structure of the straight through cable

1. Network interface connectorRJ-45

2. Tag 1

3. Main tag

4. Tag 2

Pin Assignment
Table 14-12 lists the pin assignment of the straight through cable.
Table 14-12 Pin assignment of the straight through cable

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Connector
X1

Connector X2

Color

Relation

X1.1

X2.1

White or orange

Twisted pair

X1.2

X2.2

Orange

X1.3

X2.3

White or orange

X1.6

X2.6

Green

X1.4

X2.4

Blue

X1.5

X2.5

White or orange

X1.7

X2.7

White or brown

X1.8

X2.8

Brown

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Twisted pair

Twisted pair

Twisted pair

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Technical Specifications
Item

Description

Connector X1/X2

Network interface connector-crystal plug-8PIN-8bit-shielded-24 to

26AWG-CAT 6/used with SFTP network cable

Cable type

Communication cable-10015 ohms-shielded enhance type 5CAT5E-SFTP 24AWG-8 cores-PANTONE 445U

Number of cores

Fireproof class

CM

Length

5 m, 10 m, 20 m, 30 m

14.4.7 Crossover Cable

The crossover cable is used to directly connect the T2000 computer to the OptiX OSN equipment.
Uses the RJ-45 connectors at both ends. Connect one end to the ETH interface of the equipment
and connect the other end to the network interface of the computer.

Structure
Figure 14-18 shows the structure of the crossover cable.
Figure 14-18 Structure of the crossover cable

1. Network interface connectorRJ-45

2. Tag 1

3. Main tag

4. Network cable

5. Tag 2

Pin Assignment
Table 14-13 lists the pin assignment of the crossover cable.
Table 14-13 Pin assignment of the crossover cable

14-20

Connector
X1

Connector X2

Color

Relation

X1.6

X2.2

Orange

Twisted pair

X1.3

X2.1

White or orange

X1.1

X2.3

White or green

X1.2

X2.6

Green

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Twisted pair

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Connector
X1

Connector X2

Color

Relation

X1.4

X2.4

Blue

Twisted pair

X1.5

X2.5

White or blue

X1.7

X2.7

White or brown

X1.8

X2.8

Brown

Twisted pair

Technical Specifications
Item

Description

Connector X1/X2

Network interface connector-crystal plug-8PIN-8bit-shielded-24 to

26AWG-CAT 6/used with SFTP network cable

Cable type

Communication cable-1005 ohms-CAT5E-SFTP 24AWG-8 coresPANTONE 445U

Number of cores

Fireproof class

CM

Length

5 m, 30 m

14.5 Signal Cable

The signal cable includes the E1/E3 signal cable, framed E1 signal cable and N x 64 kbit/s signal
cable. The OptiX OSN 1500A supports only the E1/E3 signal cable.
14.5.1 75-ohm 8 x E1 Cable
The 75-ohm 8 x E1 cable is used to input and output E1 signals.
14.5.2 75-ohm 16 x E1 Cable
The 75-ohm 16 x E1 cable is used to input and output E1 signals, and is usually connected to
the interface of the L75S interface board.
14.5.3 120-ohm 8 x E1 Cable
The 120-ohm 8 x E1 cable is used to input and output E1 signals.
14.5.4 120-ohm 16 x E1 Cable
The 120-ohm 8 x E1 cable is used to input and output E1 signals.
14.5.5 E3/T3/STM-1 Cable
The E3/T3/STM-1 cable is used to input and output E3/T3/STM-1 signals. Use the SMB
connector at one end to connect the cable to the E3/T3/STM-1 interface board. Use a connector
to connect the other end to the DDF. The connector should be made according to the on-site
requirements.
14.5.6 Framed E1 Cable
The framed E1 cable is connected to the DB44 connector of the DM12 to access 8 x framed E1
signals.
14.5.7 N x 64 kbit/s Cables
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Hardware Description

14 Cables

The N x 64 kbit/s cable is connected to the DB28 connector of the DM12 to access one channel
of N x 64 kbit/s services.

14.5.1 75-ohm 8 x E1 Cable

The 75-ohm 8 x E1 cable is used to input and output E1 signals.
Use the DB44 connector at one end to connect the cable to the 75-ohm 8 x E1 electrical interface
board. Use a connector to connect the other end to the digital distribution frame (DDF). The
connector should be made according to the on-site requirements. Each cable can transmit eight
channels of E1 signals.

Structure
Figure 14-19 shows the structure of the 75-ohm 8 x E1 cable.
Figure 14-19 Structure of the 75-ohm 8 x E1 cable

1. Cable connector-D type-44 PIN-male

2. Tag 1, marked: "W1 (E1:1 to 4)"

3. Tag 3, marked: "W2 (E1:5 to 8)"

4. Main tag

Pin Assignment
Table 14-14 lists the pin assignment of the 75-ohm 8 x E1 cable.
Table 14-14 Pin assignment of the 75-ohm 8 x E1 cable

14-22

Conne
ctor

Cable W1
Core

No.

38

Ring

23

Tip

37

Ring

22

Tip

36

Ring

21

Tip

Remarks

R1

R2

R3

Huawei Technologies Proprietary

Connector

Cable W2

Remark
s

Core

No.

34

Ring

R5

19

Tip

33

Ring

R6

18

Tip

32

Ring

R7

17

Tip
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OptiX OSN 1500 Intelligent Optical Transmission System

Hardware Description

Conne
ctor

Cable W1
Core

No.

35

Ring

20

Tip

15

Ring

30

Tip

14

Ring

29

Tip

13

Ring

28

Tip

12

Ring

27
Shell

14 Cables

Remarks

Connector

Cable W2

Remark
s

Core

No.

31

Ring

R8

16

Tip

11

Ring

T5

26

Tip

10

Ring

T6

25

Tip

Ring

T7

24

Tip

Ring

T8

Tip

Tip

External braid shield layer

Shell

External braid shield layer

R4

T1

T2

T3

T4

Technical Specifications
Item

Description

Connector X

Cable connector-D type-44 PIN-male

Cable type

Coaxial cable-SYFVZP-75-1-1x8(A)-75 ohm-9.65 mm-1.2

mm-0.252 mm-Huawei white

Fireproof class

CM

Number of cores

8 x E1

Cover diameterinsulation diameterconductor diameter

9.65 mm-1.2 mm-0.252 mm

Length

3 m, 10 m, 15 m, 20 m, 25 m, 30 m, 40 m

CAUTION
The pin assignment table for the E1 cable is placed in the same packing case with the cable. Do
not discard it before installation.

14.5.2 75-ohm 16 x E1 Cable

The 75-ohm 16 x E1 cable is used to input and output E1 signals, and is usually connected to
the interface of the L75S interface board.
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Hardware Description

14 Cables

Use the 2mmHM connector at one end to connect the cable to the 75-ohm E1 electrical interface
board. Use a connector to connect the other end to the DDF. The connector should be made
according to the on-site requirements. Each cable can transmit 16 channels of E1 signals.

Structure
Figure 14-20 shows the structure of the 75-ohm 16 x E1 cable.
Figure 14-20 Structure of the 75-ohm 16 x E1 cable
Main tag

1. Cable connector

2. Terminal

Pin Assignment
Table 14-15 lists the pin assignment of the 75-ohm 16 x E1 cable.
Table 14-15 Pin assignment of the 75-ohm 16 x E1 cable

14-24

Connec
tor X

Cable W
Core

No.

a1

Tip

a2

Ring

a3

Tip

a4

Ring

a6

Tip

a7

Ring

a8

Tip

a9

Ring

b1

Tip

b2

Ring

b3

Tip

b4

Ring

Remar
ks

Connec
tor X

Cable W
Core

No.

R1

a10

Tip

17

R9

a11

Ring

a12

Tip

18

T9

a13

Ring

a15

Tip

19

R10

a16

Ring

a17

Tip

20

T10

a18

Ring

b10

Tip

21

R11

b11

Ring

b12

Tip

22

T11

b13

Ring

T1

R2

T2

R3

T3

Huawei Technologies Proprietary

Remark
s

Issue 02 (2007-09-10)

OptiX OSN 1500 Intelligent Optical Transmission System

Hardware Description

Connec
tor X

Cable W
Core

No.

b6

Tip

b7

Ring

b8

Tip

b9

Ring

c1

Tip

c2

Ring

c3

Tip

c4

Ring

c6

Tip

c7

Ring

c8

Tip

a9

Ring

d1

Tip

d2

Ring

d3

Tip

d4

Ring

d6

Tip

d7

Ring

d8

Tip

d9

Ring

14 Cables

Remar
ks

Connec
tor X

Cable W
Core

No.

R4

b15

Tip

23

R12

b16

Ring

b17

Tip

24

T12

b18

Ring

c10

Tip

25

R13

c11

Ring

c12

Tip

26

T13

c13

Ring

c15

Tip

27

R14

c16

Ring

c17

Tip

28

T14

c18

Ring

d10

Tip

29

R15

d11

Ring

d12

Tip

30

T15

d13

Ring

d15

Tip

31

R16

d16

Ring

d17

Tip

32

T16

d18

Ring

T4

R5

10

T5

11

R6

12

T6

13

R7

14

T7

15

R8

16

T8

Remark
s

Technical Specifications

Issue 02 (2007-09-10)

Item

Description

Connector X

2mmHM conductor connector-4 x 18PIN-28 to 30AWG-crimp

Cable type W

Coaxial cable-SYFVZP-75-1-1x32(A)-75 ohms-18 mm-1.2

mm-0.254 mm-Huawei gray

Fireproof class

CM

Number of cores

16 x E1

Huawei Technologies Proprietary

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OptiX OSN 1500 Intelligent Optical Transmission System

Hardware Description

14 Cables

Item

Description

Cover diameterinsulation diameterconductor diameter

18mm-1.2 mm-0.254mm

Length

10 m, 15 m, 20 m, 25 m, 30 m

CAUTION
The pin assignment table for the E1 cable is placed in the same packing case with the cable. Do
not discard it before installation.

14.5.3 120-ohm 8 x E1 Cable

The 120-ohm 8 x E1 cable is used to input and output E1 signals.
Use the DB44 connector at one end to connect the cable to the 120-ohm E1 electrical interface
board. Use a connector to connect the other end to the DDF. The connector should be made
according to the on-site requirements. Each cable can transmit 8 channels of E1 signals.

Structure
Figure 14-21 shows the structure of the 120-ohm 8 x E1 cable.
Figure 14-21 Structure of the 120-ohm 8 x E1 cable

1. Cable connector-D type-44PIN-male

2. Tag 1, marked:" W1 (TX1~8) "

3. Tag 3, marked:" W2 (RX1~8) "

4. Main tag

Pin Assignment
Table 14-16 lists the pin assignment of the 120-ohm 8 x E1 cable.

14-26

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14 Cables

Table 14-16 Pin assignment of the 120-ohm E1 cable

Connecto
r

Cable W1

Remar
ks

Connecto
r

Cable W2
Core

No.

38

Blue

Rx1

23

White

Twisted
pair

37

Orang
e

Twisted
pair

R2

22

White

36

Green

R3

21

White

Twisted
pair

35

Brown

Twisted
pair

R4

20

White

34

Grey

R5

19

White

Twisted
pair

33

Blue

R6

18

Red

Twisted
pair

32

Orang
e

Twisted
pair

R7

17

Red

31

Green

R8

16

Red

Twisted
pair

Shell

External braid shield layer

Core

No.

15

Blue

Tx1

30

White

Twisted
pair

14

Orang
e

Twisted
pair

T2

29

White

13

Green

28

White

12

Brow
n

27

White

11

Grey

26

White

10

Blue

25

Red

Orang
e

24

Red

Green

Red

Shell

External braid shield layer

Twisted
pair

T3

Twisted
pair

T4

Twisted
pair

T5

Twisted
pair

T6

Twisted
pair

T7

Twisted
pair

T8

Remar
ks

Technical Specifications

Issue 02 (2007-09-10)

Item

Description

Connector X

Cable connector-D type-44PIN-male

Cable type

Communication cable-120 ohms-SEYPVPV-0.5 mm-24AWG-16

core-PANTONE 430U

Number of cores

16

Inner conductor
diameter

0.5 mm

Fireproof class

CM

Huawei Technologies Proprietary

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OptiX OSN 1500 Intelligent Optical Transmission System

Hardware Description

14 Cables

Item

Description

Length

10 m, 15 m, 20 m, 30 m, 40 m

14.5.4 120-ohm 16 x E1 Cable

The 120-ohm 8 x E1 cable is used to input and output E1 signals.
Use the 2mmHM connector at one end to connect the cable to the 120-ohm E1 electrical interface
board, L12S or PL1B. Use a connector to connect the other end to the DDF. The connector
should be made according to the on-site requirements. Each cable can transmit 16 channels of
E1 signals.

Structure
Figure 14-22 shows the structure of the 120-ohm 16 x E1 cable.
Figure 14-22 Structure of the 120-ohm 16 x E1 cable
3
W2

W1

1. Cable connector

2. Terminal

3. Main tag

Pin Assignment
Table 14-17 lists the pin assignment of the 120-ohm 16 x E1 cable.
Table 14-17 Pin assignment of the 120-ohm 16 x E1 cable
Conne
ctor X

14-28

Cable W1

Remark
s

Connect
or X

Cable W2
Core

No.

a3

Blue

Tx1

a4

White

Twiste
d pair

a8

Orange

Tx2

a9

White

Twiste
d pair

b3

Green

Tx3

b4

White

Twiste
d pair

Core

No.

a1

Blue

Rx1

a2

White

Twiste
d pair

a6

Orange

Rx2

a7

White

Twiste
d pair

b1

Green

Rx3

b2

White

Twiste
d pair

Huawei Technologies Proprietary

Remarks

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Hardware Description

Issue 02 (2007-09-10)

Conne
ctor X

Cable W1
Core

No.

b6

Brown

b7

White

c1

Grey

c2

White

c6

Blue

c7

Red

d1

Orange

d2

Red

d6

Green

d7

Red

a10

Brown

a11

Red

a15

Grey

a16

Red

b10

Blue

b11

Black

b15

Orange

b16

Black

c10

Green

c11

Black

c15

Brown

c16

Black

d10

Grey

d11

Black

d15

Blue

d16

Yellow

a5

Shell

14 Cables

Remark
s

Connect
or X

Cable W2
Core

No.

Twiste
d pair

Rx4

b8

Brown

Tx4

b9

White

Twiste
d pair

Twiste
d pair

Rx5

c3

Grey

Tx5

c4

White

Twiste
d pair

Twiste
d pair

Rx6

c8

Blue

Tx6

c9

Red

Twiste
d pair

Twiste
d pair

Rx7

d3

Orange

Tx7

d4

Red

Twiste
d pair

Twiste
d pair

Rx8

d8

Green

Tx8

d9

Red

Twiste
d pair

Twiste
d pair

Rx9

a12

Brown

Tx9

a13

Red

Twiste
d pair

Twiste
d pair

Rx10

a17

Grey

Tx10

a18

Red

Twiste
d pair

Twiste
d pair

Rx11

b12

Blue

Tx11

b13

Black

Twiste
d pair

Twiste
d pair

Rx12

b17

Orange

Tx12

b18

Black

Twiste
d pair

Twiste
d pair

Rx13

c12

Green

Tx13

c13

Black

Twiste
d pair

Twiste
d pair

Rx14

c17

Brown

Tx14

c18

Black

Twiste
d pair

Twiste
d pair

Rx15

d12

Grey

Tx15

d13

Black

Twiste
d pair

Twiste
d pair

Rx16

d17

Blue

Tx16

d18

Yellow

Twiste
d pair

a14

Shell

External braid shield

layer

Huawei Technologies Proprietary

Remarks

External braid shield

layer

14-29

OptiX OSN 1500 Intelligent Optical Transmission System

Hardware Description

14 Cables

Technical Specifications
Item

Description

Connector X

2mmHM conductor connector-4 x 18PIN-24 to 26AWG-crimp

Cable type
W1/W2

Nominal twisted pair cable-120 ohms-SEYPVPV-0.5 mm-24AWG-32

core-PANTONE 430U

Number of
cores

32

Inner
conductor
diameter

0.5 mm

Fireproof class

CM

Length

10 m, 15 m, 20 m, 25 m, 30 m

14.5.5 E3/T3/STM-1 Cable

The E3/T3/STM-1 cable is used to input and output E3/T3/STM-1 signals. Use the SMB
connector at one end to connect the cable to the E3/T3/STM-1 interface board. Use a connector
to connect the other end to the DDF. The connector should be made according to the on-site
requirements.

Structure
Figure 14-23 shows the structure of the E3/T3/STM-1 cable.
Figure 14-23 Structure of the E3/T3/STM-1 cable

1. Coaxial connector-SMB

2. Main tag

3. Coaxial cable

Pin Assignment
None

Technical Specifications

14-30

Item

Description

Connector

Coaxial connector-SMB-75 ohms-straight and female

Cable I

Coaxial cable-75 ohms-3.9 mm-2.1 mm-0.34 mm-shielded

Huawei Technologies Proprietary

Issue 02 (2007-09-10)

OptiX OSN 1500 Intelligent Optical Transmission System

Hardware Description

Item

14 Cables

Description
Cover diameter 3.9 mm-insulation diameter 2.1 mm-conductor diameter 0.34
mm
Length: 10 m, 15 m, 20 m, 30 m

Cable II

Coaxial cable-75 ohms-4.4 mm-2.4 mm-0.4 mm-shielded-gray

Cover diameter 4.4 mm-insulation diameter 2.4 mm-conductor diameter 0.4
mm
Length: 15 m, 20 m, 25 m, 30 m, 40 m

Cable III

Coaxial cable-75 ohms-6.7 mm-3.8 mm-0.61 mm-shielded-gray

Cover diameter 6.7 mm-insulation diameter 3.8 mm-conductor diameter 0.61
mm
Length: 15 m, 20 m, 25 m, 30 m, 130 m

Cable IV

Coaxial cable-75 ohms-5.80 mm-3.71 mm-0.643 mm-black

Cover diameter 5.80 mm-insulation diameter 3.71 mm-conductor diameter
0.643 mm
Length: 30 cm

Fireproof
class

CM

14.5.6 Framed E1 Cable

The framed E1 cable is connected to the DB44 connector of the DM12 to access 8 x framed E1
signals.
The framed E1 cables of 75 ohms and 120 ohms are available.
l

See the section that describes the 75-ohm 8 x E1 cable for details on the structure, pin
assignment and technical specifications of the 75-ohm framed E1 cable.

See the section that describes the 120-ohm 8 x E1 cable for details on the structure, pin
assignment and technical specifications of the 120-ohm framed E1 cable.

14.5.7 N x 64 kbit/s Cables

The N x 64 kbit/s cable is connected to the DB28 connector of the DM12 to access one channel
of N x 64 kbit/s services.
Table 14-18 lists the pin assignment of the DB28 connector.
Table 14-18 Pin assignment of the DB28 connector of the DM12

Issue 02 (2007-09-10)

Pin

Signal

Directi
on

Description

TXD+

--->

Transmits data.

Huawei Technologies Proprietary

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OptiX OSN 1500 Intelligent Optical Transmission System

Hardware Description

14 Cables

14-32

Pin

Signal

Directi
on

Description

TXD

--->

Transmits data.

TXC+

<-->

The DCE provides the transmitting clock to the

DTE.

TXC

<-->

The DCE provides the transmitting clock to the

DTE.

NC

GND

-----

Circuit_GND

MODE0

<---

Identifies the cable type.

MODE1

<---

Identifies the cable type.

MODE2

<---

Identifies the cable type.

10

MODE_DCE

<---

Identifies the DCE/DTE cable type.

11

DCD+

<-->

Detects the carrier.

12

DCD

<-->

Detects the carrier.

13

RTS+

--->

Requests for transmission.

14

RTS

--->

Requests for transmission.

15

TXCE+

--->

Transmitting data clock for DCE and loopback

clock for DTE.

16

TXCE

--->

Transmitting data clock for DCE and loopback

clock for DTE.

17

RXC+

<---

Receives clock.

18

RXC

<---

Receives clock.

19

RXD+

<---

Receives data.

20

RXD

<---

Receives data.

21

GND

-----

Shield_GND

22

LL

<-->

Loopback control signals.

23

CTS+

<---

Prepares for transmission.

24

CTS

<---

Prepares for transmission.

25

DSR+

<---

Prepares the DCE.

26

DSR

<---

Prepares the DCE.

27

DTR+

--->

Prepares the DTE.

28

DTR

--->

Prepares the DTE.

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Issue 02 (2007-09-10)

OptiX OSN 1500 Intelligent Optical Transmission System

Hardware Description

14 Cables

According to the protocols for the N x 64 kbit/s signals, the N x 64 kbit/s cables are classified
into the following ten types.
l

V.35 DCE cable

V.35 DTE cable

V.24 DCE cable

V.24 DTE cable

X.21 DCE cable

X.21 DTE cable

RS449 DCE cable

RS449 DTE cable

RS530 DCE cable

RS530 DTE cable

V.35 DCE Cable

Figure 14-24 shows the structure of the V.35 DCE cable.
Figure 14-24 Structure of the V.35 DCE cable
A-A

B-B

Pos.28
W

Pos.1
A

X1

X2

M
S
W
AA
EE
KK

K
P
U
Y
CC
HH
MM

1. Cable connector-D28 male

D
J
N
T
X
BB
FF
LL

B
F
L
R
V
Z
DD
JJ
NN

2. Main tag

3. Cable connector-D34 female + D34 plastic shell

Table 14-19 lists the pin assignment of the V.35 DCE cable.
Table 14-19 Pin assignment of the V.35 DCE cable

Issue 02 (2007-09-10)

Connector X1

Connector X2

Relation

19

Twisted pair

20

T
Huawei Technologies Proprietary

Twisted pair

14-33

OptiX OSN 1500 Intelligent Optical Transmission System

Hardware Description

14 Cables

Connector X1

Connector X2

Relation

15

Twisted pair

16

AA

17

18

11

22

23

13

25

27

21

6+7+8

Short circuiting for 68

Twisted pair

Twisted pair

The technical specifications of the V.35 DCE cable are as follows.

Item

Description

Connector X1

Cable connector-D type dual-edge tube-28PIN-straight male-cable

solder-spacing 0.8 mm-28 to 30AWG, exclusively used for OEM

Connector X2

Cable connector-V35 plug-34PIN-injection molding shell-tube,

exclusively used for OEM
Cable connector-V35 DCE plug-34PIN-female-cable crimping-core,
exclusively used for OEM

Cable type

Twisted pair cable-100 ohms-0.38 mm-28AWG-5 pairs and 8 corePANTONE 296U-exclusively used by OEM

Number of cores

5 pairs and 8 cores

Core diameter

0.32 mm

Length

3m

V.35 DTE Cable

Figure 14-25 shows the structure of the V.35 DTE cable.

14-34

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Hardware Description

14 Cables

Figure 14-25 Structure of the V.35 DTE cable

A-A

B-B

Pos.28

Pos.1

X1

X2

1. Cable connector-D28 male

2. Main tag

4. Ordinary terminal

5. Cable connector-D34 male

A
B
C
D
E
F
H
J
L N K M
R T P S
V X U W
Z BB Y AA
DD FF CC EE
JJ LL HH KK
NN MM

3. Cable connector-D34 plastic shell

Table 14-20 lists the pin assignment of the V.35 DTE cable.
Table 14-20 Pin assignment of the V.35 DTE cable

Issue 02 (2007-09-10)

Connector X1

Connector X2

Relation

Twisted pair

19

20

17

18

AA

15

16

11

22

13

23

27

25

21

6+10+7+8

Short circuiting 6, 7, 8 and 10

Huawei Technologies Proprietary

Twisted pair

Twisted pair

Twisted pair

Twisted pair

14-35

OptiX OSN 1500 Intelligent Optical Transmission System

Hardware Description

14 Cables

The technical specifications of the V.35 DTE cable are as follows.

Item

Description

Connector
X1

Cable connector-D type dual-edge tube-28PIN-straight male-cable solderspacing 0.8 mm-28 to 30AWG, exlusively used for OEM

Connector
X2

Cable connector-V35 plug-34PIN-injection molding shell-tube, exclusively

used for OEM
Cable connector-V35 DTE plug-34PIN-male-cable crimping-core,
exclusively used for OEM

Cable type

Twisted pair cable-100 ohms-0.38 mm-28AWG-5 pairs and 8 corePANTONE 296U-exclusively used by OEM

Number of
cores

5 pairs and 8 cores

Core
diameter

0.32 mm

Length

3m

V.24 DCE Cable

Figure 14-26 shows the structure of the V.24 DCE cable.
Figure 14-26 Structure of the V.24 DCE cable
A-A

B-B

Pos.25
Pos.1

Pos.28
Pos.1

X1

X2

1. Cable connector-D25 female

2. Main tag

3. Cable connector-D28 male

Table 14-21 lists the pin assignment of the V.24 DCE cable.
Table 14-21 Pin assignment of the V.24 DCE cable

14-36

Connector X1

Connector X2

Relation

19

Twisted pair

23

13

5
Huawei Technologies Proprietary

Twisted pair

Issue 02 (2007-09-10)

OptiX OSN 1500 Intelligent Optical Transmission System

Hardware Description

14 Cables

Connector X1

Connector X2

Relation

25

20

Twisted pair

27

11

22

18

15

17

24

15

17

21

Single

6+7

Short circuiting 6 and 7

Twisted pair

Twisted pair

The technical specifications of the V.24 DCE cable are as follows.

Table 14-22 Technical specifications of the V.24 DCE cable
Item

Description

Connector X1

Cable connector-D type dual-edge tube-28PIN-straight male-cable solderspacing 0.8 mm-28 to 30AWG, exlusively used for OEM

Connector X2

Cable connector-D type-25PIN-female-cable solder

Cable type

Twisted pair cable-100 ohms-0.38 mm-28AWG-5 pairs and 8 corePANTONE 296U-exclusively used by OEM

Number of
cores

5 pairs and 8 cores

Core diameter

0.32 mm

Length

3m

V.24 DTE Cable

Figure 14-27 shows the structure of the V.24 DTE cable.

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Figure 14-27 Structure of the V.24 DTE cable

A-A

B-B
1

Pos.1
Pos.1

Pos.28
Pos.25

X1

X2

1. Cable connector-D25 male

2. Main tag

3. Cable connector-D28 male

Table 14-23 lists the pin assignment of the V.24 DTE cable.
Table 14-23 Pin assignment of the V.24 DTE cable
Connector X1

Connector X2

Relation

Twisted pair

19

13

23

27

20

25

11

22

18

15

15

24

17

17

21

Single

6+10+7

Short circuiting 6, 10 and 7

Twisted pair

Twisted pair

Twisted pair

Twisted pair

The technical specifications of the V.24 DTE cable are as follows.

Table 14-24 Technical specifications of the V.24 DTE cable

14-38

Item

Description

Connector
X1

Cable connector-D type dual-edge tube-28PIN-straight male-cable solderspacing 0.8 mm-28 to 30AWG, exlusively used for OEM

Connector
X2

Cable connector-D type-25PIN-male-cable solder

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Item

Description

Cable type

Twisted pair cable-100 ohms-0.38 mm-28AWG-5 pairs and 8 corePANTONE 296U-exclusively used by OEM

Number of
cores

5 pairs and 8 cores

Core
diameter

0.32 mm

Length

3m

X.21 DCE Cable

Figure 14-28 shows the structure of the X.21 DCE cable.
Figure 14-28 Structure of the X.21 DCE cable
A-A

B-B
2

Pos.15

Pos.1

Pos.28

Pos.1

X1

X2

1. Cable connector-D15 female

2. Main tag

3. Cable connector-D28 male

Table 14-25 lists the pin assignment of the X.21 DCE cable.
Table 14-25 Pin assignment of the X.21 DCE cable

Issue 02 (2007-09-10)

Connector X1

Connector X2

Relation

13

Twisted pair

14

12

23

24

10

19

20

11

15

6
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Twisted pair

Twisted pair

Twisted pair

Twisted pair
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Hardware Description

14 Cables

Connector X1

Connector X2

Relation

16

13

21

6+9

Short circuiting 6 and 9

The technical specifications of the X.21 DCE cable are as follows.

Table 14-26 Technical specifications of the X.21 DCE cable
Item

Description

Connector
X1

Cable connector-D type dual-edge tube-28PIN-straight male-cable solderspacing 0.8 mm-28 to 30AWG, exlusively used for OEM

Connector
X2

Cable connector-D type-15PIN-female-cable solder

Cable type

Twisted pair cable-100 ohms-0.38 mm-28AWG-5 pairs and 8 corePANTONE 296U-exclusively used by OEM

Number of
cores

5 pairs and 8 cores

Core
diameter

0.32 mm

Length

3m

X.21 DTE Cable

Figure 14-29 shows the structure of the X.21 DTE cable.
Figure 14-29 Structure of the X.21 DTE cable
A-A

B-B
2

Pos.1

Pos.1

Pos.28

Pos.15

X2

1. Cable connector-D15 male

X1

2. Main tag

3. Cable connector-D28 male

Table 14-27 lists the pin assignment of the X.21 DTE cable.

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Table 14-27 Pin assignment of the X.21 DTE cable

Connector X1

Connector X2

Relation

13

Twisted pair

14

10

23

24

12

19

20

11

15

16

13

17

18

13

21

6+10+9

Short circuiting 6, 10 and 9

Twisted pair

Twisted pair

Pair

Twisted pair

Twisted pair

The technical specifications of the X.21 DTE cable are as follows.

Table 14-28 Technical specifications of the X.12 DTE cable
Item

Description

Connector X1

Cable connector-D type dual-edge tube-28PIN-straight male-cable solderspacing 0.8 mm-28 to 30AWG, exlusively used for OEM

Connector X2

Cable connector-D type-15PIN-male-cable solder

Cable type

Twisted pair cable-100 ohms-0.38 mm-28AWG-5 pairs and 8 corePANTONE 296U-exclusively used by OEM

Number of
cores

5 pairs and 8 cores

Core diameter

0.32 mm

Length

3m

RS449 DCE Cable

Figure 14-30 shows the structure of the RS449 DCE cable.

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Figure 14-30 Structure of the RS449 DCE cable

A-A

B-B
2

Pos.1

Pos.1

Pos.28

Pos.15

X2

X1

1. Cable connector-D28 male

2. Main tag

3. Cable connector-D37 female-I

Table 14-29 lists the pin assignment of the RS449 DCE cable.
Table 14-29 Pin assignment of the RS449 DCE cable

14-42

Connector X1

Connector X2

Relation

27

11

Twisted pair

28

29

25

12

26

30

13

14

27

23

24

25

11

13

12

31

19

20

22

24

15

16

26

17

17

18

35

23
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Twisted pair

Twisted pair

Twisted pair

Twisted pair

Twisted pair

Twisted pair

Twisted pair

Twisted pair

Twisted pair

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14 Cables

Connector X1

Connector X2

Relation

22

10

21

6+8

19

Short circuiting 6 and 8

The technical specifications of the RS449 DCE cable are as follows.

Table 14-30 Specifications of the RS449 DCE cable
Item

Description

Connector X1

Cable connector-D type dual-edge tube-28PIN-straight male-cable

solder-spacing 0.8 mm-28 to 30AWG, exlusively used for OEM

Connector X2

Cable connector-D type-37PIN-female-cable solder-exclusively used

for OEM

Cable type

Twisted pair-100 ohms-communication cable-0.32 mm-28AWG-26

core-PANTONE 296U-exclusively used for OEM

Number of cores

26

Core diameter

0.32 mm

Length

3m

RS449 DTE Cable

Figure 14-31 shows the structure of the RS449 DTE cable.
Figure 14-31 Structure of the RS449 DTE cable
A-A

B-B
1

3
Pos.37

Pos.28

Pos.1

X1
X2

1. Cable connector-D28 male

2. Main tag

Pos.1

3. Cable connector-D37 male-I

Table 14-31 lists the pin assignment of the RS449 DTE cable.
Table 14-31 Pin assignment of the RS449 DTE cable

Issue 02 (2007-09-10)

Connector X1

Connector X2

Relation

27

12

Twisted pair

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Connector X1

Connector X2

Relation

28

30

25

11

26

29

13

14

25

23

24

27

11

13

12

31

19

20

24

22

15

17

16

35

17

18

26

23

22

10

21

6+8+10

19

Short circuiting 6, 8 and 10

Twisted pair

Twisted pair

Twisted pair

Twisted pair

Twisted pair

Twisted pair

Twisted pair

Twisted pair

Twisted pair

The technical specifications of the RS449 DTE cable are as follows.

Table 14-32 Specifications of the RS449 DTE cable

14-44

Item

Description

Connector
X1

Cable connector-D type dual-edge tube-28PIN-straight male-cable solderspacing 0.8 mm-28 to 30AWG, exlusively used for OEM

Connector
X2

Cable connector-D type-SUB plug-37PIN-straight male-cable solder-2 row,

standard installation hole, exclusively used for OEM

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Item

Description

Cable type

Twisted pair-100 ohms-communication cable-0.32 mm-28AWG-26 corePANTONE 296U-exclusively used for OEM

Number of
cores

26

Core
diameter

0.32 mm

RS530 DCE Cable

Figure 14-32 shows the structure of the RS530 DCE cable.
Figure 14-32 Structure of the RS530 DCE cable
A-A
Pos.25

B-B
3

Pos.1

X1
Pos.1

Pos.28

X2

1. Cable connector-D25 female

2. Main tag

3. Cable connector-D28 male

Table 14-33 lists the pin assignment of the RS530 DCE cable.
Table 14-33 Pin assignment of the RS530 DCE cable

Issue 02 (2007-09-10)

Connector X1

Connector X2

Relation

28

22

Twisted pair

27

26

23

25

20

24

19

23

22

18

Single

21

Single

20

14

Twisted pair

19

2
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Twisted pair

Twisted pair

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14 Cables

Connector X1

Connector X2

Relation

18

11

Twisted pair

17

24

16

15

17

14

13

13

12

10

11

12

15

16

6+7+9

Twisted pair

Twisted pair

Twisted pair

Twisted pair

Twisted pair

Short circuiting 6, 7 and 9

The technical specifications of the RS530 DCE cable are as follows.

Table 14-34 Specifications of the RS530 DCE cable
Item

Description

Connector
X1

Cable connector-D type dual-edge tube-28PIN-straight male-cable solderspacing 0.8 mm-28 to 30AWG, exlusively used for OEM

Connector
X2

Cable connector-D type-25PIN-female-cable solder

Cable type

Twisted pair-100 ohms-communication cable-0.32 mm-28AWG-26 corePANTONE 296U-exclusively used for OEM

Number of
cores

26

Core
diameter

0.32 mm

Length

3m

RS530 DTE Cable

Figure 14-33 shows the structure of the RS530 DTE cable.

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Figure 14-33 Structure of the RS530 DTE cable

B-B

A-A
1

Pos.1
Pos.1

X1
Pos.25

Pos.28

X2

1. Cable connector-D25 male

2. Main tag

3. Cable connector-D28 male

Table 14-35 lists the pin assignment of the RS530 DTE cable.
Table 14-35 Pin assignment of the RS530 DTE cable

Issue 02 (2007-09-10)

Connector X1

Connector X2

Relation

27

20

Twisted pair

28

23

25

26

22

13

14

19

23

24

13

11

12

10

19

20

16

14

15

24

16

11

17

17

18

15

12
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Twisted pair

Twisted pair

Twisted pair

Twisted pair

Twisted pair

Twisted pair

Twisted pair

Twisted pair

Twisted pair

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Hardware Description

14 Cables

Connector X1

Connector X2

Relation

22

18

21

6+7+9+10

Short circuiting 6, 7, 9 and 10

The technical specifications of the RS530 DTE cable are as follows.

Table 14-36 Specifications of the RS530 DTE cable
Item

Description

Connector
X1

Cable connector-D type dual-edge tube-28PIN-straight male-cable solderspacing 0.8 mm-28 to 30AWG, exlusively used for OEM

Connector
X2

Cable connector-D type-25PIN-male-cable solder

Cable type

Twisted pair-100 ohms-communication cable-0.32 mm-28AWG-26 corePANTONE 296U-exclusively used for OEM

Number of
cores

26

Core
diameter

0.32 mm

Length

3m

14.6 Clock Cable

The clock cable includes the clock cable and clock transfer cable.
14.6.1 Clock Cable
The clock cable includes 75-ohm clock cable and 120-ohm clock cable, which are used to input
and output external clock signals.
14.6.2 One-Channel and Two-Channel Clock Transfer Cables
The clock transfer cable includes one-channel clock transfer cable (75 ohms to 120 ohms) and
two-channel clock transfer cable (75 ohms to 120 ohms).

14.6.1 Clock Cable

The clock cable includes 75-ohm clock cable and 120-ohm clock cable, which are used to input
and output external clock signals.
For the 75-ohm clock cable, use the SMB connector at one end to connect the cable to the external
clock interface of the OptiX OSN equipment. Use a connector to connect the other end to the
external clock equipment. The connector should be made according to the on-site requirements.
For the 120-ohm clock cable, use the RJ-45 connector at one end to connect the cable to the
external clock interface of the OptiX OSN equipment. Use a connector to connect the other end
to the external clock equipment. The connector should be made according to the on-site
requirements.
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Structure
Figure 14-34 and Figure 14-35 show the structure of the 75-ohm clock cable and the 120-ohm
clock cable respectively.
Figure 14-34 Structure of the 75-ohm clock cable

1. Coaxial connector-SMB

2. Tag

Figure 14-35 Structure of the 120-ohm 8 x E1 cable

1. Tag 1 (R) and Tag2 (T)

2. Communication cable

3. Main tag 4. Network interface connector-RJ-45

Pin Assignment
Table 14-37 lists the pin assignment of the 120-ohm clock cable.
Table 14-37 Pin assignment of the 120-ohm clock cable
X1

Remark

X1.1

Blue

W1

X1.2

White

X1.4

Orange

X1.5

White

W2

Technical Specifications
Item

Description

75-ohm
clock cable

Connector: coaxial connector-SMB-75 ohms-straight and female

Cable type: coaxial cable-75 ohms-3.9 mm-2.1mm-0.34 mm-shielded
Cover diameter 3.9 mm-insulation diameter 2.1 mm-conductor diameter 0.34
mm

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Item

Description
Length: 10 m, 15 m, 20 m, 30 m

120-ohm
clock cable

Connector X: network interface connector-8PIN-8 bit-shielded-crystal model

connector
Cable type: twisted pair-120 ohms-SEYPVPV-0.4 mm-26AWG-2 pairsPantone 430U
Inner conductor diameter: 0.4 mm/26AWG
Length: 5 m, 10 m, 20 m, 30 m, 40 m, 50 m, 70 m, 100 m

14.6.2 One-Channel and Two-Channel Clock Transfer Cables

The clock transfer cable includes one-channel clock transfer cable (75 ohms to 120 ohms) and
two-channel clock transfer cable (75 ohms to 120 ohms).

Structure
Figure 14-36 and Figure 14-37 show the structure of the one-channel clock transfer cable and
two-channel clock transfer cable respectively.
Figure 14-36 Structure of the one-channel clock transfer cable (75 ohms to 120 ohms)

1. Coaxial connector-SMB-75 ohms-straight/plug-female

2. Main tag 3. 75 ohms/120 ohms transfer PCB

Figure 14-37 Structure of the two-channel clock transfer cable (75 ohms to 120 ohms)

1. Coaxial connector-SMB-75 ohms-straight/plug-female

2. Tag 1:"1#" 3. Tag 2:"2#" 4. Main tag

5. 75 ohms/120 ohms transfer PCB

6. Tag 3:"1#" 7. Tag 4:"2#"

Pin Assignment
Table 14-38 lists the pin assignment of the two-channel clock transfer cable (75 ohms to 120
ohms).
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Table 14-38 Pin assignment of the two-channel clock transfer cable (75 ohms to 120 ohms)
Connector

75-ohm Cable

Color

120-ohm Cable

X1

Core

Blue

W3

Shielding layer

White

Core

Blue

Shielding layer

White

X2

W4

Technical Specifications
Item

Description

One
channel

Connector: coaxial connector-SMB-75 ohms-straight and female

75 ohms cable type: coaxial cable-75 ohms-3.9 mm-2.1 mm-0.34 mm-shielded
75 ohms Cover diameter 3.9 mm-insulation diameter 2.1 mm-conductor
diameter 0.34 mm
120 ohms cable type: twisted pair-120 ohms-SEYPVPV-0.4 mm-26AWG-2
pairs-Pantone 430U
Inner conductor diameter: 0.4 mm/26AWG
Length: 30 m

Two
channels

Connector X1/X2: coaxial connector-SMB-75 ohms-straight and female

75 ohms cable type: coaxial cable-75 ohms-3.9 mm-2.1 mm-0.34 mm-shielded
75 ohms cable: cover diameter 3.9 mm-insulation diameter 2.1 mm-conductor
diameter 0.34 mm
120 ohms cable type: twisted pair-120 ohms-SEYPVPV-0.4 mm-26AWG-2
pairs-Pantone 430U
Inner conductor diameter of the 120-ohm cable: 0.4 mm/26AWG
Length: 30 m

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Hardware Description

A Equipment and Board Alarm Indicators

Equipment and Board Alarm Indicators

This chapter describes the equipment and board alarm indicators for the OptiX OSN equipment.
A.1 Indicators on the Cabinet
This section describes the indicators on the cabinet for the OptiX OSN equipment.
A.2 Board Alarm Indicator
This section describes the board alarm indicators and their indications.

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OptiX OSN 1500 Intelligent Optical Transmission System

Hardware Description

A.1 Indicators on the Cabinet

This section describes the indicators on the cabinet for the OptiX OSN equipment.
Indicator

Indication

Normal power supply indicator: Power

(green)

When it is lit, it indicates that the power is supplied

to the equipment.
When it is unlit, it indicates that no power is
supplied to the equipment.

Critical alarm indicator: Critical (red)

When it is lit, it indicates that critical alarms are

generated in the equipment.
When it is unlit, it indicates that no critical alarms
are generated in the equipment.

Major alarm indicator: Major (orange)

When it is lit, it indicates that major alarms are

generated in the equipment.
When it is unlit, it indicates that no major alarms are
generated in the equipment.

Minor alarm indicator: Minor (yellow)

When it is lit, it indicates that minor alarms are

generated in the equipment.
When it is unlit, it indicates that no minor alarms
are generated in the equipment.

A.2 Board Alarm Indicator

This section describes the board alarm indicators and their indications.

Board Hardware State Indicator (STAT)

Status Description

Indication

Lit (green)

The board is working normally.

Lit (red)

The board hardware is faulty.

Unlit

No power is supplied to the board.

Service Activating State Indicator (ACT)

A-2

Status Description

Indication

Lit (green)

The service is in the activating state and the board is

working.

Unlit

The service is in the non-activating state.

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A Equipment and Board Alarm Indicators

Board Software State Indicator (PROG)

Status Description

Indication

Lit (green)

The board software or software for FPGA is loaded

successfully, or the board software is initialized
normally.

Circularly lit for 100 ms and unlit for

100 ms (green)

The board software or FPGA is being loaded to the

FLASH.

Circularly lit for 300 ms and unlit for

300 ms (green)

The board software is being initialized and is in the

BIOS boot state.

Lit (red)

The board software or FPGA in the FLASH is lost.

The loading and initialization of the board software
fails.

Unlit

No power is input.

Service Alarm Indicator (SRV)

Status Description

Indication

Lit (green)

The service is running normally and no service alarms

are generated.

Lit (red)

Critical or major alarms occur to the service.

Lit (yellow)

Minor or remote alarms occur to the service.

Unlit

The board is not configured with services and no

alarms is generated, or no power is supplied to the
board.

Synchronization Clock State Indicator

Status Description

Indication

Lit (green)

The clock is working in the free-run mode and the

system clock priority list is not set. By default, the
system clock priority list contains only the internal
source.

The clock is working in the tracing mode and

tracing the clock source rather than the internal
source in the priority list.

Lit (red)

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The system clock priority list is set. Except the

internal clock source, all clock sources are lost. The
clock is working in the hold-over or free-run mode.

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A Equipment and Board Alarm Indicators

Alarm Cutting Indicator (ALMC)

Status Description

Indication

Lit (yellow)

The board is in the alarm cutting state.

Unlit

Sound is generated to indicate the alarm.

Ethernet Indicator
Indicator

Status
Description

Indication

Connection status indicator

(LINK), which is green when
lit.

Lit

The network cable is successfully

connected to the equipment.

Unlit

The network cable is not connected to

the equipment.

Data receiving and

transmitting indicator (ACT),
which is orange when lit.

Flashing

The data is being transmitted or

received.

Unlit

No data is being transmitted or

received.

Service activating state indicator of the cross-connect unit (ACTX)

Status Description

Indication

Lit (green)

The cross-connect unit is in the active state.

Unlit

The cross-connect unit is in the standby state.

Active/standby state indicator (ACTC) of the SCC unit

Status Description

Indication

Lit (green)

The cross-connect unit is in the active state.

Unlit

The cross-connect unit is in the standby state.

Service alarm indicator of the line unit (SRVL)

A-4

Status Description

Indication

Lit (green)

The line service is normal and no alarms are

generated.

Lit (red)

Critical alarms or major alarms occur to the line

service.

Lit (yellow)

Minor or remote alarms occur to the line service.

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A Equipment and Board Alarm Indicators

Status Description

Indication

Unlit

The unit is not configured with services and no alarms

is generated, or no power is supplied to the unit.

Fan tray assembly indicator

Indicator

Status Description

Indication

Board running
state indicator
(RUN)

Lit (green)

The board is working normally.

Unlit

The board is not powered on.

Fan alarm
indicator (ALM)

Lit (red)

The fan stops.

Unlit

The fan is running normally.

Indicator on the panel of the COA

Indicator

Status Description

Indication

Green running
indicator (RUN)

Flash once every two

seconds (green)

The COA is running normally.

Flash once every four

seconds (green)

The COA in in the database protection

mode. The communication between the
COA and the SCC fails.

Flash five times every

second (green)

The program is starting or being loaded.

Lit (red)

The self-check of the memory fails.

Flash thrice every other

second (red)

Critical alarms are generated.

Flash twice every other

second (red)

Major alarms are generated.

Flash once every other

second (red)

Minor alarms are generated.

Alarm indicator
(ALM)

Power indicator (POWER)

Issue 02 (2007-09-10)

Status Description

Indication

Lit (green)

The input of the power supply is normal.

Unlit

No power supply is input or the power supply fails.

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A Equipment and Board Alarm Indicators

Indicator on the UPM

A-6

Module

Indicator

Status
Description

Indication

Rectifier
module

ALM

Lit (red)

The rectifier module fails. Normally, it is unlit.

Vout

Lit (green)

The output of the rectifier module is normal.

Monitorin
g module

RUN

Flashes (green)

The entire power supply system is normal.

ALM

Lit (red)

The entire power supply system becomes

faulty. Normally, it is unlit.

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Hardware Description

B Labels

Labels

This chapter describes various labels for the OptiX OSN equipment, including the safety labels,
optical module labels, and cable labels.
B.1 Safety Label
Many safety labels are stuck on the equipment. This section describes the suggestions and
locations of these safety labels.
B.2 Optical Module Labels
Optical module labels are used to recognize different types of optical modules. Optical module
label is stuck to the optical module.
B.3 Engineering Labels
The engineering labels should be made according to the the local engineering specifications or
Huawei engineering specifications.

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Hardware Description

B Labels

B.1 Safety Label

Many safety labels are stuck on the equipment. This section describes the suggestions and
locations of these safety labels.
B.1.1 Label Description
On the subrack, there are labels such as the ESD protection label, subrack grounding label and
fan warning label.
B.1.2 Label Position
The ESD protection label and the subrack grounding label are stuck on the subrack. The laser
class label and the APD warning label are stuck on the front panel of each board.

B.1.1 Label Description

On the subrack, there are labels such as the ESD protection label, subrack grounding label and
fan warning label.
Table B-1 Labels on the equipment
Label

LASER
RADIATION

CLASS 1
LASER
PRODUCT

Type

Suggestion

ESD protection label

The equipment is electrostatic

sensitive.

Laser safety class

The label suggests the class of

the laser source.

Subrack grounding label

This label suggests the

grounding position.

Regular cleaning label

Regularly clean the air filter.

Fan warning label

Do not the fan leaves before

the fan stops.

APD warning label

The overload point of the

indicator is 9 dBm.

DO NOT VIEW DIRECTLY

WITH OPTICAL
INSTRUMENTS

CLASS 1M
LASER
PRODUCT

! ATTENTION
CLEAN PERIODICALLY

DON'T TOUCH THE

FANLEAVESBEFORE
THEYSLOW DOWN !

APD

Receiver
MAX:-9dBm

B-2

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OptiX OSN 1500 Intelligent Optical Transmission System

Hardware Description

Label

OptiX OSN 1500A

POWER RATING:

B Labels

Type

Suggestion

RoHS label

The equipment is in line with

the RoHS-related
environment-friendly
requirements.

Product nameplate label

The label suggests the

product name and
certification.

Qualification card label

The equipment is qualified.

-48 -60V ; 4.5A

This device complies with Part 15 of the FCC Rules.

Operation is subject to the following two conditions:
(1) this device may not cause harmful interference,
and (2) this device must accept any interference
received, including interference that may cause
undesired operation.
N14036

HUAWEI TECHNOLOGIES CO.,LTD.

MADE IN CHINA

OptiX OSN 1500

POWER RATING:

-48 -60V ; 6A

This device complies with Part 15 of the FCC Rules.

Operation is subject to the following two conditions:
(1) this device may not cause harmful interference,
and (2) this device must accept any interference
received, including interference that may cause
undesired operation.
N14036

HUAWEI TECHNOLOGIES CO.,LTD.

MADE IN CHINA

For the enhanced subrack:

OptiX OSN 1500A
POWER RATING:

-48 -60V ; 8.2A

This device complies with Part 15 of the FCC Rules.

Operation is subject to the following two conditions:
(1) this device may not cause harmful interference,
and (2) this device must accept any interference
received, including interference that may cause
undesired operation.
N14036

HUAWEI TECHNOLOGIES CO.,LTD.

MADE IN CHINA

OptiX OSN 1500

POWER RATING:

-48 -60V ; 10.4A

This device complies with Part 15 of the FCC Rules.

Operation is subject to the following two conditions:
(1) this device may not cause harmful interference,
and (2) this device must accept any interference
received, including interference that may cause
undesired operation.
N14036

HUAWEI TECHNOLOGIES CO.,LTD.

MADE IN CHINA

/QUALIFICATION CARD

HUAWEI

HUAWEI TECHNOLOGIES CO.,LTD.

MADE IN CHINA

B.1.2 Label Position

The ESD protection label and the subrack grounding label are stuck on the subrack. The laser
class label and the APD warning label are stuck on the front panel of each board.

Issue 02 (2007-09-10)

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OptiX OSN 1500 Intelligent Optical Transmission System

Hardware Description

B Labels

Figure B-1 Labels on the OptiX OSN 1500B subrack

/QUALIFICATION CARD

HUAWEI

HUAWEI TECHNOLOGIES CO.,LTD.

MADE IN CHINA

OptiX OSN 1500

POWER RATING:

-48 -60V ; 6A

This device complies with Part 15 of the FCC Rules.

Operation is subject to the following two conditions:
(1) this device may not cause harmful interference,
and (2) this device must accept any interference
received, including interference that may cause
undesired operation.
N14036

HUAWEI TECHNOLOGIES CO.,LTD.

MADE IN CHINA

DON'T TOUCH THE

FAN LEAVES BEFORE
THEY SLOW DOWN !

ATTENTION
CLEAN PERIODICALLY

Figure B-2 Labels on the OptiX OSN 1500A subrack

/QUALIFICATION CARD

HUAWEI

HUAWEI TECHNOLOGIES CO.,LTD.

MADE IN CHINA

OptiX OSN 1500A

POWER RATING:

-48 -60V ; 4.5A

This device complies with Part 15 of the FCC Rules.

Operation is subject to the following two conditions:
(1) this device may not cause harmful interference,
and (2) this device must accept any interference
received, including interference that may cause
undesired operation.
N14036

HUAWEI TECHNOLOGIES CO.,LTD.

MADE IN CHINA

DON'T TOUCH THE

FAN LEAVES BEFORE
THEY SLOW DOWN !

ATTENTION
CLEAN PERIODICALLY

B-4

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Hardware Description

B Labels

Figure B-3 Labels on a board

SL16

CLASS 1
LASER
PRODUCT

APD

Receiver
MAX:-9dBm

BA2

LASER
RADIATION
DO NOT VIEW DIRECTLY
WITH OPTICAL
INSTRUMENTS
CLASS 1M LASER
PRODUCT

B.2 Optical Module Labels

Optical module labels are used to recognize different types of optical modules. Optical module
label is stuck to the optical module.
Figure B-4 shows the optical module labels.
Figure B-4 Optical module labels

As shown in Table B-2, different types of optical module have different codes.
Table B-2 Optical module code and type mapping table

Issue 02 (2007-09-10)

Optical
Module Code

Optical Type

34060288

Optical transceiver-ESFP (internal and external alignment)-1310 nmSTM-16-3 dBm-10 dBm-21 dBm-LC-2 km

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OptiX OSN 1500 Intelligent Optical Transmission System

Hardware Description

B Labels

B-6

Optical
Module Code

Optical Type

34060278

Optical transceiver-ESFP (internal and external alignment)-1310STM-16-0 dBm-5 dBm-21 dBm-LC-15 km

34060289

Optical transceiver-ESFP (internal and external alignment)-1310 nmSTM-16-3 dBm-2 dBm-30 dBm-LC-40 km

34060279

Optical transceiver-ESFP (internal and external alignment)-1550STM-16-3 dBm-2 dBm-30 dBm-LC-80 km

34060277

Optical transceiver-ESFP (internal and external alignment)-1310 nmSTM-4-8 dBm-15 dBm-31 dBm-LC-15 km

34060280

Optical transceiver-ESFP (internal and external alignment)-1310 nmSTM-4-2 dBm-3 dBm-30 dBm-LC-40 km

34060284

Optical transceiver-ESFP (internal and external alignment)-1550 nmSTM-4-2 dBm-3 dBm-30 dBm-LC-80km

34060285

Optical transceiver-ESFP (internal and external alignment)-1550 nmSTM-4-2 dBm-3 dBm--36 dBm-LC-100km

34060276

Optical transceiver-ESFP (internal and external alignment)-1310 nmSTM-1-8 dBm-15 dBm-31 dBm-LC-15 km

34060281

Optical transceiver-ESFP (internal and external alignment)-1310 nmSTM1-0 dBm-5 dBm-37 dBm-LC-40 km

34060282

Optical transceiver-ESFP (internal and external alignment)-1550STM-1-0 dBm-5 dBm-37 dBm-LC-80 km

34060299

Optical transceiver-ESFP (internal and external alignment)-1310 nmSTM-1-8 dBm-15 dBm-31 dBm-LC (private)-15 km

34060286

Optical transceiver-ESFP (internal and external alignment)-850

nm-2.125G multirate-2.5 dBm-9.5 dBm-17 dBm-LC-0.5 km

34060219

Optical transceiver-ESFP (internal and external alignment)-1310

nm-1.25 Gbit/s-3 dBm-9.5 dBm-20 dBm-LC-10 km

34060298

Optical transceiver-ESFP (internal and external alignment)-1310

nm-1.25 Gbit/s-3 dBm-4.5 dBm-22.5 dBm-LC-40 km

34060274

Optical transceiver-ESFP (internal and external alignment)-1550

nm-1.25 Gbit/s-5 dBm-2 dBm-23 dBm-LC-80 km

34060325

Optical transceiver-ESFP (internal and external alignment)-850

nm-2.125 G multirate-2.5 dBm-9.5dBm-17 dBm-LC (private)multimode-0.5 km

34060049

Optical transceiver-SFP-850 nm-1.25 Gbit/s-0 dBm-9.5 dBm-17

dBm-LC-0.55 km

34060050

Optical transceiver-SFP-1310 nm-1.25 Gbit/s-3 dBm-9 dBm-20

dBm-LC-10 km

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OptiX OSN 1500 Intelligent Optical Transmission System

Hardware Description

B Labels

Optical
Module Code

Optical Type

34060207

Optical transceiver-SFP-1310 nm-1.25 Gbit/s-5 dBm-2 dBm-23 dBmLC-40 km

34060051

Optical transceiver-SFP-1550 nm-1.25 Gbit/s-2 dBm-4 dBm-22 dBmLC-70 km

34060287

Optical transceiver-SFP-1310 nm-STM-1-14 dBm-19 dBm-30 dBmLC (TX disable)-2 km

34060053

Optical transceiver-SFP-1310 nm-STM-1-8 dBm-15 dBm-28 dBmLC-15 km

34060209

Optical transceiver-SFP-1310 nm-STM-1-0 dBm-5 dBm-34 dBmLC-40 km

B.3 Engineering Labels

The engineering labels should be made according to the the local engineering specifications or
Huawei engineering specifications.
The engineering labels should be made according to the the local engineering specifications or
Huawei engineering specifications. Table B-3 lists the Huawei engineering specifications for
engineering labels.
For details on how to make and stick cable labels, see the OptiX OSN 1500 Intelligent Optical
Transmission System Installation Guide.
Table B-3 Huawei specifications for engineering labels
Label
Engineer
ing
labels for
power
cables

Illustration
TO:
A01
B08

(1)

-48V2

Suggestion
TO:
B03

-48V2

(2)

(1) Indicates the label on the loaded

cabinet side, which carries the
information about the position of
the cable on the power distribution
unit.
(2) Indicates the label on the
distribution unit side, which carries
the information about the position
of the cable on the loaded cabinet
side.

Issue 02 (2007-09-10)

(1) On the loaded cabinet side, the label

marked "A01/B08-48V2" on the cable
indicates that the cable is 48V2 DC power
supply, which is from the eighth connecter
on the second row of the 48V bus bar in
the cabinet on Row A, and Column 1 in the
equipment room.
(2) On the distribution unit side, the label
marked "B03--48V2" indicates that the
cable is 48V2 DC power supply, which is
from the loaded cabinet on Row B, Column
03 in the equipment room. For PGND and
BGND, it is only necessary to give the row
and column of the power distribution unit,
instead of the specific serial number of the
terminal block on the copper bar.

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OptiX OSN 1500 Intelligent Optical Transmission System

Hardware Description

B Labels

Label

Illustration

Engineer
ing
labels for
alarm
external
cables

Suggestion
The external alarm cables are connected to
the first subscriber cabinet of each row
(used for power distribution). Engineering
labels posted on the first cabinet of each
row should indicate which equipment is
using the access terminal. Engineering
labels are not needed on the equipment side
unless there are special requirements.
The label marked "A01" indicates that the
alarm cable connects the first cabinet and
the cabinet on Row A, Column 01 in the
equipment room.
"A01-03-06-05" indicates that on the local
end of the Ethernet cable is connected to
Ethernet Port 05, Slot 6, Frame 03 of the
cabinet on Row A, Column 01 in the
equipment room.

Engineer
ing
labels for
Ethernet
cables

"B02-03-12" indicates that the other end of

the Ethernet cable is connected to Ethernet
Port 12, Frame 03 of the cabinet on Row
B, Column 02 in the equipment room. No
slot number is specified.

B-8

Engineer
ing
labels for
fibers
that
connect
equipme
nt

"A01-01-05-05-R" indicates that the local

end of the fiber jumper is connected with
Optical Receiving Interface 05 on Slot 5,
Frame 01 in the cabinet on Row A, Column
01 in the equipment room.

Labels
for fibers
that
connect
the
equipme
nt to the
ODF

"ODF-G01-01-01-R" indicates that the

local end of the fiber jumper is connected
to the optical receiving terminal on Row
01, Column 01 of the ODF in Row G
Column 01 in the equipment room.

"G01-01-01-01-T" indicates that the

opposite end of the fiber jumper is
connected with optical transmitting
interface 01 on Slot 01, Frame 01 in the
cabinet on Row G, Column 01 in the
equipment room.

"A01-01-05-05-R" indicates that the other

end of the fiber jumper is connected to
optical receiving interface 5 on Slot 05,
frame 01 in the cabinet on Row A, Column
01 in the equipment room.

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Hardware Description

Label

Illustration

B Labels

Suggestion

Labels
for trunk
cables
that
connect
the
equipme
nt to the
ODF

"A01-03-01-01-R" indicates that local end

of the trunk cable connects with the
receiving terminal of Trunk Cable 01 in
Slot 01, Frame 03 of the cabinet on Row
A, Column 01 in the equipment room.

Engineer
ing
labels for
subscrib
er cables

"A01-03-01-01" indicates that the local

end of the subscriber cable connects with
Terminal 01 on Slot 1, Frame 03 of the
cabinet on Row A, Column 01 in the
equipment room.

"DDF-G01-01-01-AR" indicates that the

opposite end of the trunk cable connects
the receiving terminal of Direction A
(connected to optical network equipment)
on Row 01, Column 01 of the DDF on Row
G and Column 01 in the equipment room.

TO:

"MDF-G01-01-01" indicates that the

opposite end of the cable connects with the
terminal on Row 01, Column 01 of the
MDF on Row G, Column 01 in the
equipment room.

Issue 02 (2007-09-10)

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OptiX OSN 1500 Intelligent Optical Transmission System

Hardware Description

C Power Consumption and Weight

Power Consumption and Weight

This chapter describes the power consumption and weight of each board for the OptiX OSN
1500.
Table C-1 Power consumption and weight of each board for the OptiX OSN 1500

Issue 02 (2007-09-10)

Board

Consumpti
on (W)

Weight (kg)

Board

Consumpt
ion (W)

Weight (kg)

N1ADL4

41

0.9

N1LWX

30

1.1

N1ADQ1

41

1.0

N1MR2B

1.0

AUX

19

1.0

N1MR2C

1.0

R1AMU

0.5

N1FIB

0.4

N1BA2

20

1.0

N1MST4

26

0.9

N1BPA

20

1.0

N1MU04

0.4

Q2CXL16

40

1.1

N1OU08

0.4

Q2CXL4

40

1.1

N2OU08

0.4

Q2CXL1

40

1.1

R1PD1

15

0.5

N1EFT8A

26

1.0

N3SL16

22

1.1

N3SL16A

17

0.9

N2PQ3

13

0.9

N2PD3

12

0.9

N2PL3

12

0.9

N2PL3A

12

0.9

TN11OBU1

16

1.3

TN11MR2

0.2

0.9

TN11MR4

0.2

0.9

TN11CMR
2

0.2

0.8

TN11CMR4

0.2

0.9

N1D12B

0.3

N1PD3

19

1.1

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Hardware Description

C Power Consumption and Weight

Board

Consumpti
on (W)

Weight (kg)

Board

Consumpt
ion (W)

Weight (kg)

N1D12S

9
(switching),

0.4

PIU

1.5

1.3

0.4

R1PL1A

6.7

0.5

0.4

R1PL1B

6.7

0.5

0 (normal)
9
N1D34S

2
(switching),
0 (normal)

N1D75S

6
(switching),
0 (normal)

N1EFF8

0.4

N1PL3

15

1.0

N1EFS0

35

1.0

N1PQ1

19

1.0

N2EFS0

35

1.0

N1PQM

22

1.0

N4EFS0

35

1.0

R2PD1

10

0.6

N1EFS4

30

1.0

N1PL3A

15

1.1

N2EFS4

30

1.0

N1SEP1

17

1.0

R1EFT4

14

0.5

N1SF16

26

1.1

N1EFT8

26

1.0

N1SL1

14

1.0

N1EGS2

40

1.0

N2SL1

14

1.0

N2EGS2

43

1.0

N1SL16,
N1SL16A

20

1.1

N1EGT2

29

0.9

N2SL16

20

1.1

N1EMR0

50

1.2

N1SL4

15

1.0

N2EMR0

50

1.2

N2SL4

15

1.0

EOW

10

0.4

N1SLD4

15

1.0

N1ETF8

0.4

N2SLD4

15

1.0

N1ETS8

3
(switching),

0.4

N1SLQ1

15

1.0

0 (normal)

C-2

N1EU04

0.4

N2SLQ1

15

1.0

N1EU08

11

0.4

N1SLQ4

16

1.0

R1FAN

20

1.0

N2SLQ4

16

1.0

N1IDL4

41

1.0

N1SLT1

15

1.2

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Hardware Description

C Power Consumption and Weight

Board

Consumpti
on (W)

Weight (kg)

Board

Consumpt
ion (W)

Weight (kg)

N1IDQ1

41

1.0

N1SPQ4

24

0.9

R1L12S

2.7

0.2

N2SPQ4

24

0.9

R1L75S

4.5

0.3

R1SL1

10

0.5

N1TSB4

2.5

0.3

R1SL4

10

0.5

N1C34S

2
(switching),

0.3

R1SLD4

11

0.5

0.3

R1SLQ1

12

0.5

0 (normal)
N1TSB8

5
(switching),
0 (normal)

Issue 02 (2007-09-10)

N1EGS4

70

1.1

N1DX1

15

1.0

N1EMS4

65 (not used
with the
interface
board), 75
(used with
the interface
board)

1.1

N2PQ1

13

1.0

N1DXA

10

0.8

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OptiX OSN 1500 Intelligent Optical Transmission System

Hardware Description

D Board Version Configuration

Board Version Configuration

This chapter describes the version compatibility for each board.

Table D-1 lists the board versions that are compatible with the OptiX OSN products.
Table D-1 Board versions that are compatible with the OptiX OSN products

Issue 02 (2007-09-10)

Product

OptiX
OSN
7500

OptiX
OSN
3500

OptiX
OSN
3500T

OptiX
OSN
2500

OptiX
OSN 2500
REG

OptiX
OSN
1500A

OptiX
OSN
1500B

N1SL64

N2SL64

T2SL64

T2SL64A

N1SF64

N1SLD64

N1SL16

N2SL16

N3SL16

N1SL16A

N2SL16A

N3SL16A

N1SLD16

N2SLQ16

N1SF16

N1SL4

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OptiX OSN 1500 Intelligent Optical Transmission System

Hardware Description

D Board Version Configuration

D-2

Product

OptiX
OSN
7500

OptiX
OSN
3500

OptiX
OSN
3500T

OptiX
OSN
2500

OptiX
OSN 2500
REG

OptiX
OSN
1500A

OptiX
OSN
1500B

N2SL4

R1SL4

N1SLQ4

N2SLQ4

N1SLD4

N2SLD4

R1SLD4

N1SLT1

N1SLQ1

N2SLQ1

R1SLQ1

N1SL1

N2SL1

R1SL1

N1SLH1

N1SEP1

N2SLO1

R1PL1

R1PD1

R2PD1

N1PQ1

N2PQ1

N1PQM

N1PL3

N2PL3

N1PL3A

N2PL3A

N1PD3

N2PD3

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Hardware Description

Issue 02 (2007-09-10)

D Board Version Configuration

Product

OptiX
OSN
7500

OptiX
OSN
3500

OptiX
OSN
3500T

OptiX
OSN
2500

OptiX
OSN 2500
REG

OptiX
OSN
1500A

OptiX
OSN
1500B

N2PQ3

N1DX1

N1DXA

N1SPQ4

N2SPQ4

R1EFT4

N1EFT8

N1EFT8A

N1EGT2

N1EFS0

N2EFS0

N4EFS0

N1EFS4

N2EFS4

N1EGS2

N2EGS2

N1EMS4

N1EGS4

N2EGR2

N1EMR0

N2EMR0

N1ADL4

N1ADQ1

N1IDL4

N1IDQ1

N1MST4

N1EU08

N1OU08

N2OU08

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OptiX OSN 1500 Intelligent Optical Transmission System

Hardware Description

D Board Version Configuration

D-4

Product

OptiX
OSN
7500

OptiX
OSN
3500

OptiX
OSN
3500T

OptiX
OSN
2500

OptiX
OSN 2500
REG

OptiX
OSN
1500A

OptiX
OSN
1500B

N1D75S

N1MU04

N1D34S

N1C34S

N1EU04

N1D12S

N1D12B

R1L12S

R1L75S

N1EFF8

N1ETF8

N1ETS8

N1DM12

N1TSB4

N1TSB8

Q2CXL1

Q2CXL4

Q2CXL16

T1GXCSA

N1GXCSA

T1EXCSA

N1EXCSA

T2UXCSA

N1UXCSA

N1UXCSB

T1SXCSA

T2SXCSA

N1SXCSA

N1SXCSB

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OptiX OSN 1500 Intelligent Optical Transmission System

Hardware Description

Issue 02 (2007-09-10)

D Board Version Configuration

Product

OptiX
OSN
7500

OptiX
OSN
3500

OptiX
OSN
3500T

OptiX
OSN
2500

OptiX
OSN 2500
REG

OptiX
OSN
1500A

OptiX
OSN
1500B

T1IXCSA

N1IXCSA

N1IXCSB

N1XCE

N1GSCC

N2GSCC

N3GSCC

CRG

T1EOW

R1EOW

T1AUX

N1AUX

R1AUX

R2AUX

R1AMU

Q1SAP

Q2SAP

Q1SEI

N1FAN

R1FAN

N1FANA

TN11CMR
2

TN11CMR
4

TN11MR2

TN11MR4

N1MR2A

N1MR2B

N1MR2C

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OptiX OSN 1500 Intelligent Optical Transmission System

Hardware Description

D Board Version Configuration

D-6

Product

OptiX
OSN
7500

OptiX
OSN
3500

OptiX
OSN
3500T

OptiX
OSN
2500

OptiX
OSN 2500
REG

OptiX
OSN
1500A

OptiX
OSN
1500B

N1LWX

TN11OBU
1

N1FIB

N1BA2

N1BPA

61COA

62COA

N1COA

N1DCU

N2DCU

UPM

T1PIU

N1PIU

Q1PIU

R1PIU

R1PIUA

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Hardware Description

E Board Loopbacks

Board Loopbacks

The SDH, PDH, data processing board for the OptiX OSN equipment support various types of
loopbacks.
In the case of the SDH boards for the OptiX OSN equipment, Table E-1 lists the capability of
supporting the loopbacks.
Table E-1 Loopbacks of the SDH boards for the OptiX OSN equipment

Issue 02 (2007-09-10)

Board

Port Inloop

Port Outloop

VC-4 Inloop

VC-4 Outloop

Q2SL1

Supported.

Supported.

Supported.

Not supported.

Q2SL4

Supported.

Supported.

Supported.

Not supported.

Q2SL16

Supported.

Supported.

Supported.

Not supported.

N1SL64

Supported.

Supported.

Supported.

Supported.

N2SL64

Supported.

Supported.

Not supported.

Not supported.

T2SL64

Supported.

Supported.

Not supported.

Not supported.

T2SL64A

Supported.

Supported.

Not supported.

Not supported.

N1SF64

Supported.

Supported.

Supported.

Supported.

N1SLD64

Supported.

Supported.

Supported.

Supported.

N1SL16

Supported.

Supported.

Supported.

Not supported.

N2SL16

Supported.

Supported.

Not supported.

Not supported.

N3SL16

Supported.

Supported.

Supported.

Supported.

N1SL16A

Supported.

Supported.

Supported.

Not supported.

N2SL16A

Supported.

Supported.

Not supported.

Not supported.

N3SL16A

Supported.

Supported.

Supported.

Supported.

N1SLD16

Supported.

Supported.

Supported.

Supported.

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OptiX OSN 1500 Intelligent Optical Transmission System

Hardware Description

E Board Loopbacks

Board

Port Inloop

Port Outloop

VC-4 Inloop

VC-4 Outloop

N2SLQ16

Supported.

Supported.

Not supported.

Not supported.

N1SF16

Supported.

Supported.

Supported.

Not supported.

N1SL4

Supported.

Supported.

Supported.

Not supported.

N2SL4

Supported.

Supported.

Not supported.

Not supported.

R1SL4

Supported.

Supported.

Supported.

Not supported.

N1SLQ4

Supported.

Supported.

Supported.

Not supported.

N2SLQ4

Supported.

Supported.

Not supported.

Not supported.

N1SLD4

Supported.

Supported.

Supported.

Not supported.

N2SLD4

Supported.

Supported.

Not supported.

Not supported.

R1SLD4

Supported.

Supported.

Supported.

Not supported.

N1SLT1

Supported.

Supported.

Supported.

Not supported.

N1SLQ1

Supported.

Supported.

Supported.

Not supported.

N2SLQ1

Supported.

Supported.

Not supported.

Not supported.

R1SLQ1

Supported.

Supported.

Supported.

Not supported.

N1SL1

Supported.

Supported.

Supported.

Not supported.

N2SL1

Supported.

Supported.

Not supported.

Not supported.

R1SL1

Supported.

Supported.

Supported.

Not supported.

N1SLH1

Supported.

Supported.

Supported.

Not supported.

N1SEP1

Supported.

Supported.

Supported.

Not supported.

N2SLO1

Supported.

Supported.

Not supported.

Not supported.

In the case of the PDH boards for the OptiX OSN equipment, Table E-2 lists the capability of
supporting the loopbacks.
Table E-2 Loopbacks of the PDH boards for the OptiX OSN equipment

E-2

Board

Port Inloop

Port Outloop

R1PL1

Supported.

Supported.

R1PD1

Supported.

Supported.

N1PQ1

Supported.

Supported.

N1PQM

Supported.

Supported.

N1PD3

Supported.

Supported.

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Hardware Description

E Board Loopbacks

Board

Port Inloop

Port Outloop

N1PL3

Supported.

Supported.

N2SPQ4

Supported.

Supported.

In the case of the Ethernet boards for the OptiX OSN equipment, Table E-3 lists the capability
of supporting the loopbacks.
Table E-3 Loopbacks of the Ethernet boards for the OptiX OSN equipment

Issue 02 (2007-09-10)

Board

MAC
Layer
Outloo
p

MAC
Layer
Inloop

PHY
Layer
Outloop

PHY
Layer
Inloop

VC-4
Inloop,
VC-4
Outloop

VC-3
Inloop,
VC-3
Outloop

N1EFS4

Not
supporte
d.

Supported.

Not
supported.

Supported.

Not
supported.

Supported
.

N2EFS4

Not
supporte
d.

Supported.

Not
supported.

Supported.

Not
supported.

Supported
.

N1EFS0

Not
supporte
d.

Supported.

Not
supported.

Supported.

Not
supported.

Supported
.

N2EFS0

Not
supporte
d.

Supported.

Not
supported.

Supported.

Not
supported.

Supported
.

N4EFS0

Not
supporte
d.

Supported.

Not
supported.

Supported.

Not
supported.

Supported
.

N1EGS2

Not
supporte
d.

Supported.

Not
supported.

Supported.

Not
supported.

Supported
.

N1EGT2

Support
ed.

Supported.

Not
supported.

Supported.

Not
supported.

Not
supported.

N1EFT8

Support
ed.

Supported.

Not
supported.

Supported.

Not
supported.

Supported
.

N1EFT8
A

Support
ed.

Supported.

Not
supported.

Supported.

Not
supported.

Supported
.

R1EFT4

Support
ed.

Supported.

Not
supported.

Supported.

Not
supported.

Supported
.

N1EMS4

Not
supporte
d.

Not
supported.

Not
supported.

Supported.

Not
supported.

Not
supported.

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OptiX OSN 1500 Intelligent Optical Transmission System

Hardware Description

E Board Loopbacks

Board

MAC
Layer
Outloo
p

MAC
Layer
Inloop

PHY
Layer
Outloop

PHY
Layer
Inloop

VC-4
Inloop,
VC-4
Outloop

VC-3
Inloop,
VC-3
Outloop

N1EGS4

Not
supporte
d.

Not
supported.

Not
supported.

Supported.

Not
supported.

Not
supported.

N2EGS4

Not
supporte
d.

Not
supported.

Not
supported.

Supported.

Not
supported.

Not
supported.

N2EGR2

Not
supporte
d.

Supported.

Not
supported.

Supported.

Not
supported.

Not
supported.

N1EMR0

Not
supporte
d.

Supported.

Not
supported.

Supported.

Not
supported.

Not
supported.

N2EMR0

Not
supporte
d.

Supported.

Not
supported.

Supported.

Not
supported.

Not
supported.

N1MST4

Not
supporte
d.

Not
supported.

Supported.

Supported.

Not
supported.

Not
supported.

In the case of the ATM/IMA boards for the OptiX OSN equipment, Table E-3 lists the capability
of supporting the loopbacks.
Table E-4 Loopbacks of the Ethernet boards for the OptiX OSN equipment

E-4

Board

External Port
Outloop

External Port
Inloop

Internal Port
Outloop

Internal Port
Inloop

N1ADL4

Not supported.

Supported.

Supported.

Supported.

N1ADQ1

Not supported.

Supported.

Supported.

Supported.

N1IDL4

Not supported.

Supported.

Supported.

Supported.

N1IDQ1

Not supported.

Supported.

Supported.

Supported.

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Hardware Description

F Board Configuration Reference

Board Configuration Reference

The T2000 can be used to configure various parameters for SDH boards, PDH boards, data
processing boards, and cross-connect and timing boards.
F.1 SDH Processing Boards
The parameters that can be configured for the SDH processing boards include the J0 byte, J1
byte, C2 byte and V5 byte.
F.2 PDH Processing Board
The parameters that can be set to the PDH processing boards include the J1 byte, C2 byte, J2
byte , V5 byte and tributary loopback.
F.3 Data Processing Board
The parameters that should be set for data processing boards include SDH parameters, Ethernet
parameters and ATM parameters.
F.4 Cross-Connect and Timing Unit
The clock parameters should be set on the cross-connect and timing unit.

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OptiX OSN 1500 Intelligent Optical Transmission System

Hardware Description

F Board Configuration Reference

F.1 SDH Processing Boards

The parameters that can be configured for the SDH processing boards include the J0 byte, J1
byte, C2 byte and V5 byte.

J0 Byte
J0 is the section trace byte, the J0 are transmitted in a successive manner. Hence, the receive
end learns that it is in the continuous connection with the specified transmit end. The value of
J1 is "0" by default.

J1 Byte
The J1 byte is the path tracing byte. The transmit end uses the J1 byte to transmit the higher
order access point identifiers in a successive manner. Hence, the receive end learns that it is in
the continuous connection with the specified transmit end in this channel. When the receive end
detects the J1 mismatch, the corresponding VC-4 channel generates an HP_TIM alarm.
Set the J1 byte as " HuaWei SBS

" for the SL01 and as "0" for all other boards.

NOTE

By default, the J1 byte is " HuaWei SBS

". One space is present before "HuaWei SBS" and five behind.

C2 Byte
The C2 byte is the signal label byte, which is used to indicate the multiplexing structure of the
VC frames and the payload property. The received C2 should be the same as the transmitted C2.
If C2 mismatch occurs, the corresponding VC-4 channel generates the HP_SLM alarm.
Table F-1 lists the mapping relation between the service type and setting of the C2.
Table F-1 Mapping relation between the service type and setting of the C2
Input Service Type

C2 Byte (in Hex)

TUG structure

02

34M/45M asynchronously mapped into

a C-3

04

140M asynchronously mapped into a

C-4

12

Unequipped

00

F.2 PDH Processing Board

The parameters that can be set to the PDH processing boards include the J1 byte, C2 byte, J2
byte , V5 byte and tributary loopback.
F-2

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Hardware Description

F Board Configuration Reference

J1 Byte
The J1 byte is the path tracing byte. The transmit end transmits the higher order access point
identifiers in a successive manner. Hence, the receive end learns that it is in the continuous
connection with the specified transmit end. When the receive end detects the J1 mismatch, the
corresponding VC-4 channel generates an HP_TIM alarm.
By default, the J1 byte is set to "0".
NOTE

By default, the J1 byte is "HuaWei SBS ".

C2 Byte
The C2 byte is the signal label byte, which is used to indicate the multiplexing structure of the
VC frames and the payload property. The received C2 should be the same as the transmitted C2.
If C2 mismatch occurs, the corresponding VC-4 channel generates the HP_SLM alarm.
Table F-2 lists the mapping relation between the service type and setting of the C2.
Table F-2 Mapping relation between the service type and setting of the C2
Input Service Type

C2 Byte (in Hex)

TUG structure

02

34M/45M asynchronously mapped into

a C-3

04

140M asynchronously mapped into a

C-4

12

Unequipped

00

J2 Byte
The J2 is a VC-12 channel tracing byte. The transmit end uses the J2 byte to transmit the lower
order access point identifiers in a successive manner. Hence, the receive end learns that it is in
the continuous connection to the specified transmit end in this channel.

V5 Byte
The V5 is a channel status and signal identification byte. This byte is used to detect bit error and
indicate remote faults or defect in lower order channel. The LP_REI and LP_RFI alarms are
generated accordingly. Table F-3 lists the mapping relation between the service type and setting
of the V5.
Table F-3 Mapping relation between the service type and setting of the V5

Issue 02 (2007-09-10)

Input Service Type

V5 Byte (in Hex)

Asynchronization

02

Byte synchronization

04
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Hardware Description

F Board Configuration Reference

Input Service Type

V5 Byte (in Hex)

HDLC/PPP mapping

0A

Unequipped or Supervisory-Unequipped

00

Equipping Indication
When a service channel just carries the service and does not process the service, select
Unequipped or Supervisory-Unequipped.
When a service channel carries the service and also processes the service, select EquippedUnspecific Payload.

Tributary Loopback
The tributary loopback function is used to locate faults in the service channels.
The tributary loopback is also a diagnosis function. When the tributary loopback is performed,
related services are interrupted.

Path Service Type

This parameter is set to specify service type for the channel.
l

Select E1 or T1 for E1/T1 processing boards according to the actual service type in the
channel.

Select E3 or T3 for E3/T3 processing boards according to the actual service type in the
channel.

Serial Port Protocol Mode

For the DX1, select the protocol mode of the N x 64 kbit/s signals. The protocol mode includes
V.35, V.24, X.21, RS449, RS530 and RS530A.

DDN Clock Source Management

The timing scheme and working clock source can be set for the DX1.
Set the timing scheme of the DDN channels 1012 and 1416 to the DCE internal scheme, DCE
slave scheme or DTE external scheme. Set the timing scheme of the DDN channels 9 and 13 to
the DCE internal scheme, DCE slave scheme, DTE external scheme, DTE internal scheme, DTE
slave scheme or DCE external scheme. By default, the timing scheme is the DCE internal scheme
for channels 9 and 13 is the DCE internal scheme.

F.3 Data Processing Board

The parameters that should be set for data processing boards include SDH parameters, Ethernet
parameters and ATM parameters.
F.3.1 SDH Parameters
The SDH parameters that should be set for data processing boards include the J1 byte, C2 byte,
J2 byte and V5 byte.
F-4

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Hardware Description

F Board Configuration Reference

F.3.2 Ethernet Parameters

The Ethernet parameters that should be set for the Ethernet boards include the working mode
and LCAS state.
F.3.3 ATM Parameter
The ATM parameters that the ATM boards should be set include port type and flow type.

F.3.1 SDH Parameters

The SDH parameters that should be set for data processing boards include the J1 byte, C2 byte,
J2 byte and V5 byte.

J1 Byte
The J1 byte is the path tracing byte. The transmit end transmits the J1 byte in a successive manner.
Hence, the receive end learns that it is in the continuous connection to the specified transmit end
in this path.
When detecting the J1 mismatch, the receive end generates the LP_TIM_VC3 alarm in the VC-3
path and the HP_TIM_VC4 in the VC-4 path.
If the J1 byte is of the default value, "0", these alarms are not reported.
NOTE

For the N1EFS4 and MST4, the J1 byte is " HuaWei SBS " by default. For other boards, the J1
byte is "0".

For the EMS4 and EGS4, set the J1 byte as " HuaWei SBS ".

C2 Byte
The C2 byte is the signal label byte, which is used to indicate the multiplexing structure of the
VC frames and the payload property. The received C2 should be the same as the transmitted C2.
In case of the C2 mismatch, the LP_SLM_VC3 alarm is generated in the VC-3 path and the
HP_SLM_VC4 alarm is generated in the VC-4 path.

J2 Byte
The J2 is a VC-12 path tracing byte. The transmit end uses the J2 byte to transmit the lower
order access point identifiers in a successive manner. Hence, the receive end learns that it is in
the continuous connection to the specified transmit end in this path.
In case of the J2 mismatch, the LP_TIM_VC12 alarm is generated in the VC-12 path.
If the J1 byte is of the default value, "0", these alarms are not reported.

V5 Byte
The V5 is a path status and signal identification byte. This byte is used to detect bit error and
indicate remote faults or defect in lower order path. The LP_REI and LP_RFI alarms are
generated accordingly.
When detecting the V5 mismatch, the receive end generates the LP_SLM_VC12 in the VC-12
path.
Table F-4 lists the mapping relation between the service type and setting of the V5.
Issue 02 (2007-09-10)

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F-5

OptiX OSN 1500 Intelligent Optical Transmission System

Hardware Description

F Board Configuration Reference

Table F-4 Mapping relation between the service type and setting of the V5
Input Service Type

V5 Byte (in Hex)

Asynchronization

02

Byte synchronization

04

HDLC/PPP mapping

0A

Unequipped or Supervisory-Unequipped

00

F.3.2 Ethernet Parameters

The Ethernet parameters that should be set for the Ethernet boards include the working mode
and LCAS state.

Working Mode
Generally, the interconnected equipment should work in the same fixed working mode. If the
working modes at both ends mismatch, packets may be lost or the rate becomes less. In case of
large volume of data, services may be even interrupted.
For EGT2, EGS2 and EGS4, set the working mode to auto-negotiation or 1000M full-duplex.
For the EFT8 and EFT8A, set the working mode to auto-negotiation or 10/100M full-duplex.
For the EFS4 and EFS0, set the working mode to auto-negotiation, 10M half-duplex, 10M fullduplex, 100M half full-duplex or 100M full-duplex.
For the GE ports of the EMS4, EMR0 and EGR2, set the working mode to auto-negotiation or
1000M full-duplex. For the FE ports, set the working mode to auto-negotiation, 10M half-duplex,
10M full-duplex, 100M half full-duplex or 100M full-duplex.

LCAS State
Enable or disable the LCAS.

Maximum Packet Length

For external ports, set the maximum packet length, which is 1522-byte by default.

Mapping Protocol
The mapping protocols of the interconnected equipment should be the same.
For the EGT2, EFT8, EFT8A, EFF8 and ETF8, set the mapping protocol to HDLC, LAPS and
GFP-F. By default, the mapping protocol is GFP-F.
Choose the GFP-F mapping protocol for the EGS2, EFS4 and EFS0.
For the EMR0 and EGR2, set the mapping protocol to LAPS and GFP. By default, the mapping
protocol is GFP.
F-6

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Hardware Description

F Board Configuration Reference

TAG Flag
The TAG flag is used to identify the type of packets. The TAG flag can be set to TAG Aware,
Access and Hybrid.
1.

When the TAG flag is set as the TAG Aware for a port, the port transparently transmits the
packets with a TAG and discards the packets without a TAG.

2.

When the TAG flag is set as Access for a port, the port adds a TAG to the received packets
that does not contain any TAG according to the VLAN ID of the port, and discards the
packets that contain a TAG.

3.

When the TAG flag is set as Hybrid for a port, the port can process the packets with a TAG
or without any TAG. In this case, the port adds a TAG to the received packets that does
not contain any TAG according to the VLAN ID of the port.

VLAN ID
Set the default VLAN ID of the local port.

Port Type
For the boards that support the MPLS function, set the port type to P or PE. Provider edge (PE)
indicates the edge port of the service provider and provider (P) indicates the core network port
of the service provider. When configuring the EVPL and EVPLAN services, set this parameter.
Set the external port to PE and the internal port to P.

Port Encapsulation Format

The encapsulation format can be set to MartinioE or stack VLAN. When the port is of the P
type, this attribute is valid. For EVPL services, set the encapsulation format to MartinioE. For
EVPLAN services, set the encapsulation format to stack VLAN.

Port Attribute
For boards that support the QinQ function, set the port attribute to UNI, NNI, U-NNI, S-Aware
or C-Aware.

F.3.3 ATM Parameter

The ATM parameters that the ATM boards should be set include port type and flow type.

Port Type
The port types include NNI and UNI (default).

Flow Type
The flow type should meet the requirements of the port.

Service Type
There are four service types, CBR, rt-VBR, nrt-VBR, and UBR.
Issue 02 (2007-09-10)

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OptiX OSN 1500 Intelligent Optical Transmission System

Hardware Description

F Board Configuration Reference

Peak Cell Rate

Set the peak cell rate (PCR) on ATM services. The PCR should be set on all service types.

Sustainable Cell Rate

Set the sustainable cell rate (SCR) on ATM services. The SCR should be set on rt-VBR and nrtVBR services.

Maximum Cell Burst Size

Set the maximum cell burst size (MCBS) on ATM serivces. The MCBS should be set on rt-VBR
and nrt-VBR services.

Cell Delay Variation Tolerance

Set the cell delay variation tolerance (CDVT) on ATM serivces. The CDVT should be set on
CBR, rt-VBR and UBR services.

F.4 Cross-Connect and Timing Unit

The clock parameters should be set on the cross-connect and timing unit.
Set the following parameters when synchronization status message (SSM) is not enabled and
the external clock is unavailable.
l

Reference clock source

Reference clock source level

Set the following parameters when the external clock is configured and the SSM is enabled.

F-8

Reference clock source

Reference clock source level

Building integrated timing supply (BITS) type

S1 byte

Threshold for selecting the clock in case of the switching protection

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Hardware Description

G Glossary

Glossary

This document defines the following terms:

1
1:N protection

A 1:N protection architecture has N normal traffic signals, N working

SNCs/trails and one protection SNC/trail. It may have one extra traffic
signal.

1+1 protection

A 1+1 protection architecture has one normal traffic signal, one working
SNC/trail, one protection SNC/trail and a permanent bridge.

100Base-TX

Physical Layer specification for a 100 Mbit/s CSMA/CD local area

network over two pairs of Category 5 unshielded twisted-pair (UTP) or
shielded twisted-pair (STP) wire.

10BASE-T

Physical Layer specification for a 10 Mb/s CSMA/CD local area

network over two pairs of twisted-pair telephone wire.

19-inch cabinet

A cabinet which is 19 inches in width and 600mm in depth, compliant

with the standards of the IEC297.

Issue 02 (2007-09-10)

Add/Drop
Multiplexer

A multiplexer capable of extracting and inserting lower-rate signals

from a higher-rate multiplexed signal without completely
demultiplexing the signal.

ADM

add/drop multiplexer. see add/drop multiplexer.

Administrator

A user who has authority to access all the Management Domains of the
EML Core product. He has access to the whole network and to all the
management functionalities.

AIS

Alarm Indication Signal. A signal sent downstream in a digital network

if an upstream failure has been detected and persists for a certain time.

Alarm cable

The cable which is used to transmit alarm signals.

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Hardware Description

G Glossary

Alarm

A visible or an audible indication to notify the person concerned that a

failure or an emergency has occurred. See also Event.

AMI

Alternate Mark Inversion. The line-coding format in transmission

systems where successive ones (marks) are alternatively inverted (sent
with polarity opposite that of the preceding mark).

APD

Avalanche Photodiode. A semiconductor photodetector with integral

detection and amplification stages. Electrons generated at a p/n junction
are accelerated in a region where they free an avalanche of other
electrons. APDs can detect faint signals but require higher voltages than
other semiconductor electronics.

Asynchronous

A network where transmission system payloads are not synchronized

and each network terminal runs on its own clock.

ATM

Asynchronous Transfer Mode. A transfer mode in which the information

is organized into cells. It is asynchronous in the sense that the recurrence
of cells containing information from an individual user is not necessarily
periodic. It is a protocol within the OSI layer 1. An ATM cell consists
of a 5 octet header followed by 48 octets of data.

Attenuation

Reduction of signal magnitude or signal loss, usually expressed in

decibels.

Attenuator

A passive component that attenuates an electrical or optical signal.

Attribute

Property of an object.

AU

administrative unit. see administrative unit

Auto-negotiation

The rate/work mode of the communication party set as self-negotiation

is specified through negotiation according to the transmission rate of the
opposite party.

G-2

Back up

A method to copy the important data into a backing storage in case that
the original is damaged or corrupted.

Backplane

A PCB circuit board in the subrack, which is connected with all the
boards in position.

Bandwidth

Information-carrying capacity of a communication channel. Analog

bandwidth is the range of signal frequencies that can be transmitted by
a communication channel or network.

BITS

Building Integrated Timing Supply. A building timing supply that

minimises the number of synchronization links entering an office.
Sometimes referred to as a synchronization supply unit.

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Hardware Description

G Glossary

Board Version
Replacement
Function

A function that enables a board supporting several board IDs. Generally,

a board of an old version is used to the NE also of an old version, which
does not support the board of a new version. When a board of a new
version is used to replace a board of an old version, the former should
work with the ID of the board of the old version. The board of a new
version works on the NE of a new version with the ID of the board of
new version. In this way, the board of the new version has several board
IDs.

Bridge

The action of transmitting identical traffic (SPE contents) on both the

working and protection channels.

Broadcast

The act of sending a frame addressed to all stations on the network

Issue 02 (2007-09-10)

Cable tie

The tape used to bind the cables.

CBR

Constant Bit Rate. The Constant Bit Rate service category is used by
connections that request a static amount of bandwidth that is
continuously available during the connection lifetime. This amount of
bandwidth is characterized by a peak cell Rate (PCR) value.

CDVT

Cell Delay Variation Tolerance. Information sent in the forward and

backward direction to determine the upper bound of the tolerance
admitted for the time interval between cells pertaining to a given cell
flow. The backward CDVT values included in the IAM and MOD shall
be interpreted as maximum acceptable values for the cell flow in the
backward direction.

Channel spacing

The center to center difference in frequency or wavelength between

adjacent channels in a WDM device.

Channel

The smallest subdivision of a circuit that provides a type of

communication service; usually a path with only one direction.

Circuit

A communications path or network; usually a pair of channels providing

bi-directional communication.

Client

A kind of terminal (PC or workstation) connected to a network that can

send instructions to a server and get results through a user interface. See
also server.

Coded Mark
Inversion

This is the STS-3 line code. This is a two level non-return to zero code.
A binary 1 is coded by either of the amplitude levels, +A or -A, for one
full unit time interval (T) in such a way that the level alternates for
successive binary ones. For a binary zero there is always a positive
transition (-A to +A) at the mid point of the binary unit interval (T/2).

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G Glossary

Configuration data

The data that configures the NE hardware for coordination between this
NE and other NEs in the entire network, and for operation of specified
services. Configuration data is the instruction file of NEs, and it is a key
element to ensure that the network runs efficiently. The typical
configuration data includes board configuration, clock configuration
and protection relationship.

Configure

To set the basic parameters of an operation object.

Connection

A "transport entity" which consists of an associated pair of

"unidirectional connections" capable of simultaneously transferring
information in opposite directions between their respective inputs and
outputs.

Convergence

The process of developing a model of the echo path which will be used
in the echo estimator to produce the estimate of the circuit echo.

Conversion

In the context of message handling, a transmittal event in which an MTA

transforms parts of a message content from one encoded information
type to another, or alters a probe so it appears that the described messages
were so modified.

Cyclic
Redundancy
Check

A technique for using overhead bits to detect transmission errors.

D
DDF

Digital Distribution Frame. A frame which is used to transfer cables.

Dense
Wavelength
Division
Multiplexing

The higher capacity version of WDM, which is a means of increasing

the capacity of fiber-optic data transmission systems through the
multiplexing of multiple wavelengths of light. Commercially available
DWDM systems support the multiplexing of from 8 to 40 wavelengths
of light.

Drop

The port on a network element where the service to an end customer

may be connected, e.g., a tributary card on a SONET ADM. For
example, a drop for a DS1 customer service may be provided by a VT1.5
card terminating a VT1.5 trail.

Dual-Fed

A description of a ring that has entry nodes that add traffic to the ring
via the bridging function.

DWDM

Dense Wavelength Division Multiplexing. The technology utilizes the

characteristics of broad bandwidth and low attenuation of single mode
optical fiber, employs multiple wavelengths with specific frequency
spacing as carriers, and allows multiple channels to transmit
simultaneously in the same fiber.

G-4

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G Glossary

E13

A funciton used to multiplex E1 signals into E3 signals or to demultipex

E3 signals into E1 signals.

ECC

Embedded Control Channel. An ECC provides a logical operations

channel between SDH NEs, utilizing a data communications channel
(DCC) as its physical layer.

EDFA

Erbium-Doped Fiber Amplifier. The optical amplifier that its fiber

doped with the rare earth element erbium, which can amplify at 1530 to
1610 nm when the optical amplifier is pumped by an external light
source.

Ejector lever

A component at the two ends of the front panel of a board, which is used
for inserting or removing the board.

Encapsulation

In 1000BASE-X, the process by which a MAC packet is enclosed within

a PCS code-group stream

EPL

Ethernet Private Line. An EPL service is a point-to-point

interconnection between two UNIs without SDH bandwidth
sharing.Transport bandwidth is never shared between different
customers.

ESCON

Enterprise System Connection. A path protocol which connects the host

with various control units in an storage system. It is a serial bit stream
transmission protocol. The transmission rate is 200 Mbit/s.

ESD jack

Electrostatic discharge jack. A hole in the cabinet or subrack, which

connect the subrack or cabinet to the insertion of ESD wrist strap.

ESD

Electrostatic Discharge. The phenomena the energy being produced by

electrostatic resource discharge instantly.

Ethernet

A data link level protocol comprising the OSI model's bottom two layers.
It is a broadcast networking technology that can use several different
physical media, including twisted pair cable and coaxial cable. Ethernet
usually uses CSMA/CD. TCP/IP is commonly used with Ethernet
networks.

ETSI

European Telecommunications Standards Institute

EVPL

Ethernet Virtual Private Line. An EVPL service is a service that is both

a line service and a virtual private service.

Eye pattern

A graphic presentation formed by the superimposition of the waveforms

of all possible pulse sequences.

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Fan tray assembly

A module which contains fans used for heat dissipation.

Fault

A fault is the inability of a function to perform a required action. This

does not include an inability due to preventive maintenance, lack of
external resources, or planned actions.

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G Glossary

FC

Fiber Channel. A standard of data storage network for transmitting

signals at 100 Mbit/s to 4.25Gbit/s over fiber or (at slow speeds) copper.

Fiber connector

A device mounted on the end of a fiber-optic cable, light source,

receiver, or housing that mates to a similar device to couple light into
and out of optical fibers. A connector joins two fiber ends, or one fiber
end and a light source or detector.

Fiber jumper

The fiber which is used to connect the subrack with the ODF.

FICON

Fibre Connect. A new generation connection protocol which connects

the host with various control units. It carries single byte command
protocol through the physical path of fiber channel, and provides higher
rate and better performance than ESCON.

Flow

An aggregation of packets that have the same characteristics. On the

T2000 or NE software, flow is a group of classification rules. On boards,
it is a group of packets that have the same quality of service (QoS)
operation. At present, two flows are supported: port flow and port +
VLAN flow. Port flow is based on port ID and port + VLAN flow is
based on port ID and VLAN ID. The two flows cannot coexist in the
same port.

Frame

A cyclic set of consecutive time slots in which the relative position of

each time slot can be identified.

Free-run mode

An operating condition of a clock, the output signal of which is strongly

influenced by the oscillating element and not controlled by servo phaselocking techniques. In this mode the clock has never had a network
reference input, or the clock has lost external reference and has no access
to stored data, that could be acquired from a previously connected
external reference. Free-run begins when the clock output no longer
reflects the influence of a connected external reference, or transition
from it. Free-run terminates when the clock output has achieved lock to
an external reference.

Full duplex

Pertaining to both parties that can send and receive data at the same time
on the communication link.

G
Gain

The ratio between the optical power from the input optical interface of
the optical amplifier and the optical power from the output optical
interface of the jumper fiber, which expressed in dB.

Grooming

Consolidating or segregating traffic for efficiency.

Guide rail

A groove in the subrack, which ensures the correct connection of a board

to the backplane.

G-6

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Half duplex

G Glossary

Pertaining to, both parties that only one party can send data, while the
other party can only receive data on the communication link.

I
IMA frame

The IMA frame is used as the unit of control in the IMA protocol. It is
a logical frame defined as M consecutive cells, numbered 0 to M-l,
transmitted on each of the N links in an IMA group.

IMA

Inverse Multiplexing for ATM. The ATM inverse multiplexing

technique involves inverse multiplexing and de-multiplexing of ATM
cells in a cyclical fashion among links grouped to form a higher
bandwidth logical link whose rate is approximately the sum of the link
rates. This is referred to as an IMA group.

Interface board
area

The area for the interface boards on the subrack.

Isolation

A nonreciprocal optical device intended to suppress backward

reflections along an optical fiber transmission line while having
minimum insertion loss in the forward direction.

J
Jitter

Short waveform variations caused by vibration, voltage fluctuations,

control system instability, etc.

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Label

A mark on a cable, a subrack, or a cabinet for identification.

Laser

The device that generates the directional light covering a narrow range
of wavelengths. Laser light is more coherent than ordinary light.
Semiconductor diode lasers are the used light source in fiber-optic
system.

Layer

A concept used to allow the transport network functionality to be

described hierarchically as successive levels; each layer being solely
concerned with the generation and transfer of its characteristic
information.

LCAS

Link Capacity Adjustment Scheme. A solution features flexible

bandwidth and dynamic adjustment. In addition, it provides a failure
tolerance mechanism, which enhances the viability of virtual
concatenations and enables the dynamic adjustment to bandwidth (nonservice affecting).

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Hardware Description

G Glossary

Link

A "topological component" that provides transport capacity between

two endpoints in different subnetworks via a fixed (i.e., inflexible
routing) relationship. The endpoints are "subnetwork termination point
pools" for SONET, and link termination points for ATM. Multiple links
may exist between a pair of subnetworks. A link also represents a set of
"link connections".

Loopback

The fault of each path on the optical fiber can be located by setting
loopback for each path of the line. There are three kinds of loopback
modes: No loopback, Outloop, Inloop.

Lower subrack

The subrack close to the bottom of the cabinet when a cabinet contains
several subracks.

G-8

M13

A function used to multiplex T1 signals into T3 signals or to demultiplex

T3 signals into T1 signals.

MAC

Media Access Control. The data link sublayer that is responsible for
transferring data to and from the Physical Layer.

Mapping

A procedure by which tributaries are adapted into virtual containers at

the boundary of an SDH network.

Mean launched
power

The average power of a pseudo-random data sequence coupled into the

fiber by the transmitter.

Mounting ear

A component on the side of a subrack, which is used to install the subrack

in a cabinet.

MPLS

Multiprotocol Label Switching. Multi-protocol label switching. It is a

standard routing and switching technology platform, capable of
supporting various high level protocols and services. The data
transmission over an MPLS network is independent of route calculating.
MPLS, as a connection-oriented transmission technology, guarantees
QoS effectively, supports various network level technologies, and is
independent of the link layer.

MSP

The MSP function provides capability for switching a signal between

and including two MST functions, from a working to a protection
channel.

Multicast

Transmission of a frame to stations specified by a group address.

Multiplex section
protection

A function provides capability for switching a signal between and

including two MST functions, from a working to a protection channel.

Multiplex

To transmit two or more signals over a single channel.

Multiplexer

An equipment which combines a number of tributary channels onto a

fewer number of aggregate bearer channels, the relationship between
the tributary and aggregate channels being fixed.

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Multiplexing

G Glossary

A procedure by which multiple lower order path layer signals are

adapted into a higher order path or the multiple higher order path layer
signals are adapted into a multiplex section.

N
NNI

Network Node Interface. NNI identifies the interface between the ATM
network nodes. Compare SDH NNI.

Noise figure

The specification to scale the random signal in the system presenting in

addition to any wanted signal.

Non-revertive

In non-revertive mode, when a protection switch occurs, the working

service will be switched to the protection service and the status will
remain after it returns normal.

NRZ

Non Return to Zero. A digital code in which the signal level is low for
a 0 bit and high for a 1 bit and dose not return to 0 between successive
1 bits.

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OADM

Optical Add/Drop Multiplexer. A device that can be used to add the

optical signals of various wavelengths to one channel and drop the
optical signals of various wavelengths from one channel.

ODF

Optical Distribution Frame. A frame which is used to transfer and spool

fibers.

ONE

Optical Network Element. A stand-alone physical entity in an optical

transmission network that supports at least network element functions.

Optical add/drop
multiplexing

A process that add the optical signals of various wavelengths to one

channel and drop the optical signals of various wavelengths from one
channel.

Optical Amplifier

A device or subsystem in which optical signals can be amplified by

means of stimulated emission taking place in an suitable active medium.
It is used to amplify the optical signal of the optical transmission system.

Optical connector

A component normally attached to an optical cable or piece of apparatus

for the purpose of providing frequent optical interconnection/
disconnection of optical fibers or cables.

Optical interface

A device to allow two or more corresponding optical transmitting units

to be connected.

OTM

Optical Terminal Multiplexer. A device that multiplex or demultiplex

optical signals into a transmission link or into the client side.

OTU

Optical Transponder Unit. A device that access service signals

compliant with standards at the client side and convert them into
standard DWDM or CWDM wavelengths.

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G Glossary

Output optical
power

The ranger of optical energy level of output signals.

Overhead

Extra bits in a digital stream used to carry information besides traffic

signals. Orderwire, for example, would be considered overhead
information.

G-10

Packing case

A case which is used for packing the board or subrack.

Paired Slots

When SDH boards are used to configure the MSP ring, the two boards
forming a ring must be inserted in paired slots.

Pass-Through

The action of transmitting by a node exactly what is received by that

node for any given direction of transmission. A pass-through can be
unidirectional or bidirectional. For BLSRs, a pass-through refers to the
K1 and the K2 bytes and the protection channels. Three types of passthrough are used in BLSRs: K byte pass through, unidirectional full
pass-through, and bidirectional full pass-through.

Path protection

The working principle of path protection: When the system works in

path protection mode, the PDH path uses the dual-fed and signal
selection mode. Through the tributary unit and cross-connect unit, the
tributary signal is sent simultaneously to the east and west lines.
Meanwhile, the cross-connect matrix sends the signal dually sent from
the opposite end to the tributary board through the active and standby
buses, and the hardware of the tributary board automatically and
selectively receive the signal from the two groups of buses automatically
according to the AIS number of the lower order path.

Path

A logical connection between the point at which a standard frame format

for the signal at the given rate is assembled, and the point at which the
standard frame format for the signal is disassembled.

PCR

Peak Cell Rate. An upper limit on the rate at which cells can be submitted
on an ATM connection.

PDH

Plesiochronous Digital Hierarchy. PDH is the digital networking

hierarchy that was used before the advent of Sonet/SDH.

PIN

Photodiode. A semiconductor detector with an intrinsic (i) region

separating the p- and n-doped regions. It has fast linear response and is
used in fiber-optic receivers.

Plesiochronous

A network with nodes timed by separate clock sources with almost the
same timing.

Pointer

An indicator whose value defines the frame offset of a virtual container

with respect to the frame reference of the transport entity on which it is
supported.

Power unit

A direct current power distribution unit at the upper part of a cabinet,

which supplies power for the subracks in the cabinet.

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Hardware Description

G Glossary

PRBS

When there are cross-connections between a line board and a tributary/

data board, many alarms are raised on the tributary/data board if alarms
are raised on the line board. These alarms are all reported to the T2000.
Such a large number of alarms can disturb the troubleshooting and affect
the problem solution efficiency. Therefore, the inter-board alarm
suppression function is used to solve this problem.

Private line

Both communication parties are connected permanently.

Procedure

A generic term for an action.

Process

A generic term for a collection of actions.

Processing board
area

An area for the processing boards on the subrack.

Provisioning

The process of making available various telecommunications resources

(such as switching systems and transport facilities) for
telecommunication services. Provisioning includes forecasting the
demand for services, determining the additions or changes to the
network that will be needed, determining where and when they will be
needed, and installing all the necessary network elements to provide
such services.

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Receiver overload

Receiver overload is the maximum acceptable value of the received

average power at point R to achieve a 1 x 10-10 BER.

Receiver
sensitivity

Receiver sensitivity is defined as the minimum acceptable value of

average received power at point R to achieve a 1 x 10-10 BER.

Reference clock

A clock of very high stability and accuracy that may be completely

autonomous and whose frequency serves as a basis of comparison for
the frequency of other clocks.

REG

A device that performs regeneration.

Regeneration

The process of receiving and reconstructing a digital signal so that the

amplitudes, waveforms and timing of its signal elements are constrained
within specified limits.

Revertive
switching

In revertive switching, there is a working and protection line, board and

so on. Services always revert back to the original working line or board
if the switch requests are terminated; that is, when the working line or
board has recovered from the fault or the external request is cleared.

RPR

Resilient Packet Ring. A metropolitan area network (MAN) technology

supporting data transfer among stations interconnected in a dual-ring
configuration.

RS232

In the asynchronous transfer mode and there is no hand-shaking signal.

It can communicate with RS232 and RS422 of other stations in pointto-point mode and the transmission is transparent. Its highest speed is
19.2 kbit/s.
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G Glossary

S
S1 byte

The byte defined in ITU-T to transmit the network synchronization

status information.

SAN

Storage Area Network. A dedicated high-speed data storage network

which interconnects multiple independent storage systems with multiple
servers through fiber path switch or other switch equipment.

SDH

Synchronous Digital Hierarchy. A hierarchical set of digital transport

structures, standardized for the transport of suitably adapted payloads
over physical transmission networks.

Section

The portion of a SONET transmission facility, including terminating

points, between (i) a terminal network element and a regenerator or (ii)
two regenerators. A terminating point is the point after signal
regeneration at which performance monitoring is (or may be) done.

Settings

Parameters of an operation that can be selected by the user.

SF

signal fail.See signal fail.

SFP

small form-factor pluggable.see small form-factor pluggable.

Side mode
suppression ratio

The ratio of the largest peak of the total source spectrum to the second
largest peak.

Side panel

The panel on the side of the cabinet.

Signal cable

The cable which is used to transmit electrical signals, different from the
power cable or fiber.

Signal fail

A signal indicating the associated data has failed in the sense that a nearend defect condition (not being the degraded defect) is active.

SNCMP

The SNCMP is an N+1 protection scheme, which means multiple

protection paths protect a working path.

SNCTP

The SNCTP provides protection paths at the VC-4 level. When the
working path is faulty, all its services can be switched to the protection
path.

Span

The set of SONET lines between two adjacent nodes on a ring.

SSM

Synchronization Status Message. ITU-T defines S1 byte to transmit the

network synchronization status information. It uses the lower four bits
of the multiplex section overhead S1 byte to indicate 16 types of
synchronization quality grades.

Synchronous

A network where transmission system payloads are synchronized to a

master (network) clock and traced to a reference clock.

G-12

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G Glossary

T2000

The T2000 is a subnet management system (SNMS). In the

telecommunication management network architecture, the T2000 is
located between the NE level and network level, which can supports all
NE level functions and part of the network level management functions.
See also NM.

TCM

Tandem Connection Monitor. In the SDH transport hierarchy, the TCM

is located between the AU/TU management layer and HP/LP layer. It
uses the N1/N2 byte of POH overhead to monitor the quality of the
transport channels on a transmission section (TCM section).

TPS

Tributary Protection Switching. A function provided by the equipment,

is intended to protect N tributary processing boards through a standby
tributary processing board.

Tray

A discal component in the cabinet, which is used to place the chassis or

other equipment.

Tributary
loopback

A fault location method. A fault can be located for each service path by
performing loopback on each path of the tributary board. There are three
types of loopback modes: Non-loopback, Outloop and Inloop.

TUG

tributary unit group.see tributary unit group.

U
Upload

To report all or part of the configuration data of the NE to the T2000

and overwrite the configuration data saved in the NE layer on the T2000.

Upper subrack

The subrack close to the top of the cabinet when a cabinet contains
several subracks.

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VC

virtual container. see virtual container.

Virtual
concatenation

The payload whose transmission bandwidth is bigger than VC4. Virtual

concatenation combines multiple VC4 payloads (successive or nonsuccessive) to form a virtual large structure VC4-Xv in cascade mode
for transmission. The transmission of the broadband cascaded payload
is implemented via the virtual cascade, thus improving the SDH
transmission payload bandwidth capability from VC4 to VC4-4C.

VLAN

Virtual local area network. A subset of the active topology of a Bridged

Local Area Network. Associated with each VLAN is a VLAN Identifier
(VID).

VPN

Virtual Private Network. Enables IP service to be transmitted securely

over a public TCP/IP network by encrypting all service from one
network to another.

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G Glossary

W
Wavelength
Division
Multiplexing

G-14

A means of increasing the capacity of fiber-optic data transmission

systems through the multiplexing of multiple wavelengths of light.
WDM systems support the multiplexing of as many as four wavelengths.

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H Acronyms and Abbreviations

Acronyms and Abbreviations

A
ADM

Add/Drop Multiplexer

AMI

Alternate Mark Inversion

APS

Automatic Protection Switching

ATM

Asynchronous Transfer Mode

B
BITS

Building Integrated Timing Supply

C
CAR

Committed Access Rate

CBR

Constant Bit Rate

CC

Continuity Check

CMI

Coded Mark Inversion

COA

Case-shaped Optical Amplifier

CPU

Central Processing Unit

CRC

Cyclic Redundancy Check

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DC

Direct Current

DCC

Data Communication Channel

DCE

Data Circuit-terminal Equipment

DCU

Dispersion Compensation Unit

DDF

Digital Distribution Frame

DTR

Data Terminal Ready

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H Acronyms and Abbreviations

OptiX OSN 1500 Intelligent Optical Transmission System

Hardware Description

DVB-ASI

Digital Video Broadcast-Asynchronous Serial Interface

DWDM

Dense Wavelength Division Multiplexing

E
ECC

Embedded Control Channel

EDFA

Erbium-Doped Fiber Amplifier

EMC

Electromagnetic Compatibility

EMI

Electro Magnetic Interference

EPL

Ethernet Private Line

EPLAN

Ethernet Private LAN

ESCON

Enterprise Systems Connection

ETS

European Telecommunication Standards

ETSI

European Telecommunications Standards Institute

EVPL

Ethernet Virtual Private Line

EVPLAN

Ethernet Virtual Private LAN

F
FC

Fiber Channel

FE

Fast Ethernet

FEC

Forward Error Correction

FICON

Fiber Connection

FPGA

Field Programmable Gate Array

G
GE

Gigabit Ethernet

GFP

Generic Framing Procedure

H
HDB3

High Density Bipolar of order 3 code

HDLC

High level Data Link Control

H-2

IEEE

Institute of Electrical and Electronics Engineers

IS-IS

Intermedia System-Intermedia System

ITU-T

International Telecommunication Union - Telecommunication

Standardization Sector

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H Acronyms and Abbreviations

L
LAPS

Link Access Procedure-SDH

LB

LoopBack

LCAS

Link Capacity Adjustment Scheme

LCT

Local Craft Terminal

M
MPLS

Multi-protocol Label Switch

MSP

Multiplex Section Protection

MLM

Multi-Longitudinal Mode

N
NA

Not available

NRZ

Non Return to Zero

O
OAM

Operation Administration and Maintenance

OSPF

Open Shortest Path First

P
PA

Power Amplifier

PDH

Plesiochronous Digital Hierarchy

RAM

Random-access Memory

R
RD

Receive Data

RIP

Routing Information Protocol

RSTP

Rapid Spanning Tree Protocol

S
SDH

Synchronous Digital Hierarchy

SG

Signaling Ground

SLM

Single- Longitudinal Mode

SNCP

Sub-Network Connection Protection

SSM

Synchronization Status Message

T
TD

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Transmit Data

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H Acronyms and Abbreviations

TPS

OptiX OSN 1500 Intelligent Optical Transmission System

Hardware Description

Tributary Protection Switching

U
UBR

Unspecified Bit Rate

UPM

Uninterruptible Power Modules

V
VBR

Variable Bit Rate

VLAN

Virtual Local Area Network

VPN

Virtual Private Network

W
WDM

H-4

Wavelength Division Multiplexing

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Index

Index
A
ADL4
configuration reference, 7-104
feature code, 7-104
front panel, 7-103
function and feature, 7-100
principle and signal flow, 7-101
technical specifications, 7-105
valid slots, 7-104
version, 7-100
ADQ1
configuration reference, 7-111
feature code, 7-111
front panel, 7-109
function and feature, 7-106
principle and signal flow, 7-107
technical specifications, 7-112
valid slots, 7-111
version, 7-106
AMU
front panel, 10-17
function and feature, 10-15
principle and signal flow, 10-16
technical specification, 10-20
valid slot, 10-20
version, 10-15
AUX
front panel, 10-12
function and feature, 10-6
jumper, 10-11
principle and signal flow, 10-7
technical specification, 10-15
valid slot, 10-14
version, 10-6

B
BA2
board feature code, 12-7
front panel, 12-5
function and feature, 12-2
principle and signal flow, 12-3
technical specification, 12-7
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valid slot, 12-7

version, 12-2
board
barcode, 4-3
classification
Amplifier, 4-11
Auxiliary, 4-10
Compensation, 4-11
Control, 4-10
Data, 4-7
Interface, 4-9
PDH, 4-6
Power, 4-12
SDH, 4-4
Switching, 4-9
WDM, 4-11
loopbacks, E-1
version configuration, D-1
BPA
board feature code, 12-13
Front Panel, 12-11
function and feature, 12-9
principle and signal flow, 12-10
technical specification, 12-13
valid slot, 12-13
version, 12-9

C
C34S
front panel, 8-25
function and feature, 8-24
principle and signal flow, 8-24
technical specification, 8-26
valid slot, 8-26
version, 8-24
cabinet
configuration, 2-2
DC PDU, 2-3
indicator, 2-3
technical specifications, 2-5
type, 2-2
Cabinet Configuration
Other, 2-4
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Index

CMR2
feature code, 11-7
front panel, 11-5
function and feature, 11-3
principle and signal flow, 11-4
technical specification, 11-8
valid slot, 11-7
version, 11-3
CMR4
board feature code, 11-13
front panel, 11-11
function and feature, 11-9
principle and signal flow, 11-10
technical specification, 11-14
valid slot, 11-13
version, 11-9
COA
board feature code, 12-24
front panel, 12-19
function and feature, 12-15
installation position, 12-23
principle and signal flow, 12-18
technical specification, 12-24
version, 12-15
CXL1
board configuration reference, 9-11
board feature code, 9-11
front panel, 9-9
function and feature, 9-2
principle and signal flow, 9-5
technical specification, 9-12
valid slot, 9-11
version, 9-2
CXL16
board configuration reference, 9-33
board feature code, 9-33
front panel, 9-31
function and feature, 9-25
principle and signal flow, 9-28
technical specification, 9-34
valid slot, 9-33
version, 9-25
CXL4
board configuration reference, 9-22
board feature code, 9-22
front panel, 9-20
function and feature, 9-14
principle and signal flow, 9-17
technical specification, 9-23
valid slot, 9-22
version, 9-14

technical specification, 8-9

valid slot, 8-8
version, 8-6
D12S
front panel, 8-10
function and feature, 8-9
principle and signal flow, 8-10
technical specification, 8-13
valid slot, 8-12
version, 8-9
D34S
front panel, 8-21
function and feature, 8-20
principle and signal flow, 8-21
technical specification, 8-23
valid slot, 8-22
version, 8-20
D75S
front panel, 8-17
function and feature, 8-16
principle and signal flow, 8-16
technical specification, 8-20
valid slot, 8-19
version, 8-16
DM12
front panel, 8-61
function and feature, 8-60
principle and signal flow, 8-60
technical specification, 8-64
valid slot, 8-64
version, 8-60
DX1
board configuration reference, 6-70
board feature code, 6-68
front panel, 6-67
function and feature, 6-65
principle and signal flow, 6-66
technical specification, 6-70
TPS Protection, 6-69
valid slot, 6-68
version, 6-65
DXA
board configuration reference, 6-75
front panel, 6-73
function and feature, 6-72
principle and signal flow, 6-72
technical specification, 6-75
valid slot, 6-74
version, 6-71

EFF8
front panel, 8-48
function and feature, 8-47
principle and signal flow, 8-47
technical specification, 8-50
valid slot, 8-49

D12B
front panel, 8-6
function and feature, 8-6
principle and signal flow, 8-6
i-2

Huawei Technologies Proprietary

Issue 02 (2007-09-10)

OptiX OSN 1500 Intelligent Optical Transmission System

Hardware Description

version, 8-47
EFS0
configuration reference, 7-37
front panel, 7-35
function and feature, 7-30
principle and signal flow, 7-32
technical specifications, 7-37
TPS protection, 7-36
valid slots, 7-36
version, 7-29
EFS4
configuration reference, 7-45
front panel, 7-43
function and feature, 7-38
principle and signal flow, 7-40
technical specifications, 7-45
valid slots, 7-45
version, 7-38
EFT4
configuration reference, 7-8
front panel, 7-6
function and feature, 7-3
principle and signal flow, 7-4
technical specifications, 7-8
valid slots, 7-8
version, 7-3
EFT8
configuration reference, 7-15
front panel, 7-12
function and feature, 7-9
principle and signal flow, 7-10
technical specifications, 7-15
valid slots, 7-14
version, 7-9
EFT8A
configuration reference, 7-22
front panel, 7-19
function and feature, 7-16
principle and signal flow, 7-17
technical specifications, 7-22
valid slots, 7-21
version, 7-16
EGR2
configuration reference, 7-86
feature code, 7-86
front panel, 7-84
function and feature, 7-79
principle and signal Flow, 7-82
technical specifications, 7-86
valid slots, 7-86
version, 7-79
EGS2
configuration reference, 7-53
feature code, 7-53
front panel, 7-51
function and feature, 7-46
principle and signal flow, 7-49
technical specifications, 7-53
Issue 02 (2007-09-10)

Index

valid slots, 7-53

version, 7-46
EGS4
configuration reference, 7-77
feature code, 7-74
front panel, 7-72
function and feature, 7-67
principle and signal flow, 7-69
protection, 7-74
technical specifications, 7-78
valid slots, 7-74
version, 7-67
EGT2
configuration reference, 7-28
feature code, 7-27
front panel, 7-26
function and feature, 7-23
principle and signal flow, 7-24
technical specifications, 7-28
valid slots, 7-27
version, 7-23
EMR0
configuration reference, 7-98
feature code, 7-98
front panel, 7-94
function and feature, 7-89
principle and pignal Flow, 7-92
technical Specifications, 7-98
valid slots, 7-97
version, 7-88
EMS4
configuration reference, 7-65
feature code, 7-62
front panel, 7-60
function and feature, 7-55
principle and signal flow, 7-57
protection, 7-63
technical specifications, 7-66
valid slots, 7-62
version, 7-55
EOW
front panel, 10-3
function and feature, 10-2
principle and signal flow, 10-2
technical specification, 10-6
valid slot, 10-5
version, 10-2
ETF8
front panel, 8-52
function and feature, 8-51
principle and signal flow, 8-51
technical specification, 8-55
valid slot, 8-54
version, 8-51
ETS8
front panel, 8-57
function and feature, 8-56
principle and signal flow, 8-56
Huawei Technologies Proprietary

i-3

OptiX OSN 1500 Intelligent Optical Transmission System

Hardware Description

Index

technical specification, 8-59

valid slot, 8-59
version, 8-56
EU04
front panel, 8-28
function and feature, 8-27
principle and signal flow, 8-27
technical specification, 8-30
valid slot, 8-29
version, 8-27
EU08
front panel, 8-32
function and feature, 8-31
principle and signal flow, 8-31
technical specification, 8-33
valid slot, 8-33
version, 8-31

F
FAN
front panel, 10-22
function and feature, 10-21
principle and signal flow, 10-22
technical specification, 10-23
valid slot, 10-23
version, 10-21
FIB
front panel, 11-58
function and feature, 11-57
principle and signal flow, 11-58
technical specification, 11-60
valid slot, 11-59
version, 11-57

I
IDL4
board protection, 7-119
configuration reference, 7-119
feature code, 7-118
front panel, 7-117
function and feature, 7-113
principle and signal flow, 7-115
technical specifications, 7-119
valid slots, 7-118
version, 7-113
IDQ1
configuration reference, 7-126
feature code, 7-126
front panel, 7-124
function and feature, 7-121
principle, 7-122
protection, 7-126
signal flow, 7-122
technical specifications, 7-127
valid slots, 7-126
version, 7-120
i-4

indicators
alarm, A-2
cabinet, A-2

L
L12S
front panel, 8-4
function and feature, 8-3
principle and signal flow, 8-3
technical specification, 8-5
valid slot, 8-5
version, 8-3
L75S
front panel, 8-14
function and feature, 8-13
principle and signal flow, 8-14
technical specification, 8-15
valid slot, 8-15
version, 8-13
Label
description, B-2
Position, B-3
Safety Label, B-2
LWX
board feature code, 11-48
front panel, 11-46
function and feature, 11-43
principle and signal flow, 11-44
technical specification, 11-48
valid slot, 11-48
version, 11-43

M
MR2
board feature code, 11-19
front panel, 11-17
function and feature, 11-16
principle and signal flow, 11-16
technical specification, 11-20
valid slot, 11-19
version, 11-16
MR2A
front panel, 11-24
function and feature, 11-21
principle and signal flow, 11-23
technical specification, 11-25
valid slot, 11-25
version, 11-21
MR2B
front panel, 11-29
function and feature, 11-27
principle and signal flow, 11-28
technical specification, 11-30
valid slot, 11-30
version, 11-27
MR2C

Huawei Technologies Proprietary

Issue 02 (2007-09-10)

OptiX OSN 1500 Intelligent Optical Transmission System

Hardware Description

front panel, 11-34

function and feature, 11-32
principle and signal flow, 11-33
technical specification, 11-36
valid slot, 11-36
version, 11-32
MR4
board feature code, 11-41
front panel, 11-39
function and feature, 11-37
principle and signal flow, 11-38
technical specification, 11-42
valid slot, 11-41
version, 11-37
MST4
configuration reference, 7-134
feature code, 7-133
front panel, 7-132
function and feature, 7-128
principle and pignal Flow, 7-130
technical specifications, 7-134
valid slots, 7-133
version, 7-128
MU04
front panel, 8-40
function and feature, 8-39
principle and signal flow, 8-39
technical specification, 8-42
valid slot, 8-41
version, 8-39

O
OBU1
feature code, 11-55
front panel, 11-54
function and feature, 11-52
principle and signal flow, 11-52
technical specification, 11-56
valid slot, 11-55
version, 11-52
OU08
front panel, 8-35
function and feature, 8-35
principle and signal flow, 8-35
technical specification, 8-38
valid slot, 8-38
version, 8-34

P
PD1
board configuration reference, 6-17
board feature code, 6-14
front panel, 6-13
function and feature, 6-9
principle and signal flow, 6-10
technical specification, 6-17
Issue 02 (2007-09-10)

Index

TPS protection, 6-15

valid slot, 6-13
version, 6-9
PD3
board configuration reference, 6-56
front panel, 6-53
function and feature, 6-50
principle and signal flow, 6-51
technical specification, 6-57
TPS protection, 6-55
valid slot, 6-54
version, 6-50
PIU
front panel, 13-9
function and feature, 13-8
principle and signal flow, 13-8
technical specifications, 13-10
valid slot, 13-10
version, 13-8
PIUA
front panel, 13-13
function and feature, 13-12
principle and signal flow, 13-12
technical specifications, 13-14
valid slot, 13-14
version, 13-11
PL1
board configuration reference, 6-7
board feature code, 6-7
front panel, 6-6
function and feature, 6-3
principle and signal flow, 6-4
technical specification, 6-8
valid slot, 6-7
version, 6-3
PL3
board configuration reference, 6-42
front panel, 6-39
function and feature, 6-36
principle and signal flow, 6-36
technical specification, 6-42
TPS protection, 6-40
valid slot, 6-40
version, 6-35
PL3A
board configuration reference, 6-48
front panel, 6-47
function and feature, 6-44
principle and signal flow, 6-45
technical specification, 6-48
valid slot, 6-48
version, 6-43
PQ1
board configuration reference, 6-26
board feature code, 6-24
front panel, 6-22
function and feature, 6-19
principle and signal flow, 6-20
Huawei Technologies Proprietary

i-5

OptiX OSN 1500 Intelligent Optical Transmission System

Hardware Description

Index

technical specification, 6-26

TPS protection, 6-24
valid slot, 6-23
version, 6-18
PQ3
board configuration reference, 6-64
front panel, 6-61
function and feature, 6-58
principle and signal flow, 6-58
technical specification, 6-64
TPS protection, 6-62
valid slot, 6-62
version, 6-58
PQM
board configuration reference, 6-34
front panel, 6-30
function and feature, 6-27
principle and signal flow, 6-28
technical specification, 6-34
TPS protection, 6-32
valid slot, 6-31
version, 6-27

S
SEP1
configuration reference, 5-40
front panel, 5-37
function and feature, 5-33
principle and signal flow, 5-34
technical specifications, 5-41
TPS Protection, 5-39
valid slot, 5-39
version, 5-33
SF16
configuration reference, 5-86
front panel, 5-85
function and feature, 5-81
principle and signal flow, 5-83
technical specifications, 5-86
valid slots, 5-86
version, 5-81
SL1
board configuration reference, 5-9
board feature code, 5-9
front panel, 5-7
function and feature, 5-4
principle and signal flow, 5-5
technical specification, 5-9
valid slot, 5-8
version, 5-3
SL16
board feature code, 5-70
configuration reference, 5-71
front panel, 5-69
function and feature, 5-66
principle and signal flow, 5-67
technical specifications, 5-71
i-6

valid slot, 5-70

version, 5-65
SL16A
board feature code, 5-79
configuration reference, 5-79
front panel, 5-77
function and feature, 5-74
principle and signal flow, 5-75
technical specifications, 5-79
valid slot, 5-79
version, 5-73
SL4
board feature code, 5-47
configuration reference, 5-48
front panel, 5-45
function and feature, 5-42
principle and signal flow, 5-43
technical specifications, 5-48
valid slot, 5-47
version, 5-42
SLD4
board feature code, 5-55
configuration reference, 5-56
front panel, 5-53
function and feature, 5-50
principle and signal flow, 5-51
technical specifications, 5-56
valid slots, 5-55
version, 5-50
SLO1
board feature code, 5-24
configuration reference, 5-24
front panel, 5-22
function and feature, 5-19
principle and signal flow, 5-20
technical specifications, 5-25
valid slot, 5-24
version, 5-19
SLQ1
board configuration reference, 5-17
feature Code, 5-17
front panel, 5-15
function and feature, 5-12
principle and signal flow, 5-13
technical specification, 5-17
valid slot, 5-16
version, 5-11
SLQ4
board feature code, 5-63
configuration reference, 5-63
front panel, 5-61
function and feature, 5-58
principle and signal flow, 5-59
technical specifications, 5-63
valid slot, 5-63
version, 5-58
SLT1
configuration reference, 5-31

Huawei Technologies Proprietary

Issue 02 (2007-09-10)

OptiX OSN 1500 Intelligent Optical Transmission System

Hardware Description

Index

front panel, 5-29

function and feature, 5-26
principle and signal flow, 5-27
technical specifications, 5-31
valid slot, 5-31
version, 5-26
SPQ4
board configuration reference, 6-83
front panel, 6-80
function and feature, 6-76
principle and signal flow, 6-77
technical specification, 6-83
TPS protection, 6-82
valid slot, 6-81
version, 6-76
Subrack
Structure, 3-2
subrack
capacity, 3-3
technical specifications, 3-17

T
TSB8
front panel, 8-44
function and feature, 8-43
principle and signal flow, 8-43
technical specification, 8-46
valid slot, 8-45
version, 8-43

U
UPM
function and feature, 13-2
principle and signal flow, 13-3
rear panel, 13-4
technical specifications, 13-6
valid slot, 13-6

Issue 02 (2007-09-10)

Huawei Technologies Proprietary

i-7