Electronic Packaging System Chapter I

Introduction:

1.1 GOALS AND OBJECTIVES

(integrated circuits)
packaging




Analog Digital

packaging



packaging packaging chip
carrier packaging packaging

packaging
electromechanical

packaging 1.1 packaging chip
silicon chip chip carrier
() chip carrier
()

I. Boonpikum, Electronic Engineering Department, KMITL : kbittibh@kmitl.ac.th 1

Electronic Packaging System Chapter I
Introduction:
(photolithography)


input output(I/O)
packaging

packaging
packaging
packaging

chip


hardware

1.1 packaging

I. Boonpikum, Electronic Engineering Department, KMITL : kbittibh@kmitl.ac.th 2

Electronic Packaging System Chapter I
Introduction:

1.2 MECHANICAL DEVELOPMENT IN DESIGN OF ELECTRONIC SYSTEMS

packaging


logical CAD
1.2

analog digital
logic
ground rules
computer

Back panel
(power distribution busses) gates chassis drawer

I. Boonpikum, Electronic Engineering Department, KMITL : kbittibh@kmitl.ac.th 3

Electronic Packaging System Chapter I
Introduction:

Operating panel()

CAD tapes artwork glass master

back panel

Prototype()
debugging

(soft wires)
artwork
hardware
package

Corporate Electrical Mechanical Operation Test and

shipping
planning Development Development manufacture integrate

Software
Development

1.2 packaging

I. Boonpikum, Electronic Engineering Department, KMITL : kbittibh@kmitl.ac.th 4

Electronic Packaging System Chapter I
Introduction:
1.3 MECHANICAL DESIGN ASPECTS OF PACKAGING
packaging

1. (Connections)
2. (Thermal management)
3. (Manufacturing)
4. (Maintenance)
5. (Shock and Vibration)
6. Ergonomics ()
7. (Environment)

1.3.1 Connections :
6
chip input output(I/O) chip
carrier 2 chip carrier (PCBs)
PCB 3
PCBs
PCBs 2-3
back panel
back panel 4 back panel drawer
gate
4 I/O
bus bar()
5 gate drawer

I. Boonpikum, Electronic Engineering Department, KMITL : kbittibh@kmitl.ac.th 5

Electronic Packaging System Chapter I
Introduction:
I/O I/O bus bar
6


coaxial

fiber optic
digital gate chip
supercomputer Cray I 1970
1.3 logic chip 278000 16 logic chip
PCBs 1056 24 Cray I 10500
8 A
B
Cray
20000

Clayfish

1.3 Cray 1 super computer logic chip 278000, circuit board() 1056
24 power supply() 12

I. Boonpikum, Electronic Engineering Department, KMITL : kbittibh@kmitl.ac.th 6

Electronic Packaging System Chapter I
Introduction:
1.3.2 Thermal Management


AC DC
I2R chip
computer () signal processor



chip chip

Arrhenium

(T j ) = A + Be C [1 /(T j +273)1 / 298] (1.1)

A, B, C chip carrier Tj chip

( dot matrix
)



freon Mainframe computer
IBM Super computer Supercomputer Cray 2

I. Boonpikum, Electronic Engineering Department, KMITL : kbittibh@kmitl.ac.th 7

Electronic Packaging System Chapter I
Introduction:

1.3.3 Manufacturing
1.2





package
packages (chip carriers)
pin in-hole, gull wing, surface mount,, J lead surface mount, leadless
() chip carrier
package


yield

package PCB
package
package
chip carrier

I. Boonpikum, Electronic Engineering Department, KMITL : kbittibh@kmitl.ac.th 8

Electronic Packaging System Chapter I
Introduction:

heat frame()
die
frame

1.3.4 Maintenance



ATM computer ?

delay



(Field Replaceable Units FRUs) PCBs


FRU
PCB
PCB

I. Boonpikum, Electronic Engineering Department, KMITL : kbittibh@kmitl.ac.th 9

Electronic Packaging System Chapter I
Introduction:
35 lb PCB panel 6 oz/
100 lever() / jack
screw()

100

5-10%

1.3.5 Shock and Vibration

3


( G)

I. Boonpikum, Electronic Engineering Department, KMITL : kbittibh@kmitl.ac.th 10

Electronic Packaging System Chapter I
Introduction:

computer signal processor
/

MIL-Standard 167-1 G
1.4 4-34
Hz.
resonance
, ,

15-2000 Hz
resonances
resonances
(displacement)

1.4 (Vibration Specification) MIL-STD-167-1

I. Boonpikum, Electronic Engineering Department, KMITL : kbittibh@kmitl.ac.th 11

Electronic Packaging System Chapter I
Introduction:




hardware
/

1.3.6 Ergonomics:
Ergonomics

ergonomics



3 ergonomics

I. Boonpikum, Electronic Engineering Department, KMITL : kbittibh@kmitl.ac.th 12

Electronic Packaging System Chapter I
Introduction:




CRTs

1.4 RANGE OF PRODUCTS

3
(high end)

main frame Supercomputers signal
processor
$1-$10
10-100


(intermediate)
critical

I. Boonpikum, Electronic Engineering Department, KMITL : kbittibh@kmitl.ac.th 13

Electronic Packaging System Chapter I
Introduction:

$100,000-$1000,000
(low end)

microcomputers consumer electronics

1.5 BUSINESS ASPECTS:

20
$400 10-15%



/

(ICs)
1.5
silicon chip
chip
1

I. Boonpikum, Electronic Engineering Department, KMITL : kbittibh@kmitl.ac.th 14

Electronic Packaging System Chapter I
Introduction:
bit (memory bit) logic gate chip 1 cells
logic gate chip
switching chip

IC

1.5 chip

I. Boonpikum, Electronic Engineering Department, KMITL : kbittibh@kmitl.ac.th 15

Electronic Packaging System Chapter I
Introduction:

Want to be the part of team work engineer for this job?

I. Boonpikum, Electronic Engineering Department, KMITL : kbittibh@kmitl.ac.th 16

Electronic Packaging System Chapter I
Introduction:
EXERCISES

1.1 Inspect the computer system that you personally use most of the time. Describe the keyboard
features that help you type more accurately and those features that help you from becoming
tired as you type. What do you think of the keyboard layout? Is it optimized in any sense?
Clearly it is not, but do you know the story behind why the keyboard layout is so poor.
1.2 Are the switches to your PC placed on the rear panel instead of on the front panel where they
would be more available? Why are the switches placed in a location that is not easily
accessible?
1.3 Why are the vents for the cooling air placed on the side panels of your PC? The top of the PC
provides a larger area and would permit including more vents for enhanced air flow with a
lower head loss.
1.4 The sound pressure level issued by a product is measured in decibels. What is the typical
sound pressure level produced by a rock and roll band? This is clearly too high for any
product, but what are acceptable sound pressure levels? What common product usually
exceeds the acceptable limits in an office environment?
1.5 List the different types of connectors with which you are familiar.
1.6 Take the cover off of your PC and identify as many of the subassemblies as possible.
1.7 Without removing a circuit card, identify as many of the components on the card as possible.
If you dont follow these instructions and you do remove the card for a better view make sure
you wear a grounding strap on your wrist. The strap will prevent electrostatic damage to one
ore more of the components.
1.8 Estimate the number of connections on this PC circuit card.
1.9 Describe the thermal management system in five different electronic products that you
encounter on a day to day basis.
1.10 Prepare a graph of , the failure rate, as a function of junction temperature of Tj ranging
from 20-150 0C. Let A = B = C = 1 for this initial determination. Discuss the effect of the
higher temperatures on the failure rate.

I. Boonpikum, Electronic Engineering Department, KMITL : kbittibh@kmitl.ac.th 17

Electronic Packaging System Chapter I
Introduction:
1.11 Give an example of good design for manufacturing of an electronic product. If you cant
think of one for an electronic product, give an example for an automotive product.
1.12 Give an example of poor design for manufacturing for electronic products.
1.13 If you drop a box on the floor from say a height of 3 ft, determine the deceleration during
impact. What assumptions did you have to make in your analysis?
1.14 What is your opinion of the ergonomics design of the chair in your office or your classroom?
Why do you think management selected the chair you use?
1.15 Give an example of a high end product and estimate its cost.
1.16 Give an example of an intermediate product and estimate its cost.
1.17 Give an example of a low end product and estimate its cost.
1.18 What is the least expensive electronic product that you can identify? Is it produced in a large
volume? How many electronic components does it contain? Is it designed for ease of
manufacturing? Is it designed for ease of maintenance?
1.19 What is a venture capitalist? Do they serve an important function in the development of small
business in the United States?
1.20 The 1M bit memory chip was introduced into new products by select companies in 1988.
When do you estimate that the 4M memory chip will be introduced?
1.21 If your PC memory card contains 640 kbytes, how many memory chips are installed on the
board if the chips are:
(a) 64 kbit
(b) 256 kbit
(c) 1 Mbit
(d) 4 Mbit

Show also the relative size of the card for the four cases.

I. Boonpikum, Electronic Engineering Department, KMITL : kbittibh@kmitl.ac.th 18