01044048 ELECTRONICS PACKAGING SYSTEMS : Final Exam

1 2548
4C 3R
01044048 ELECTRONICS PACKAGING SYSTEMS
7 2548 9:30-12:30 .

1
Transcript.

(1) 5 Parts 8
(2) This exam is Open Note, Open Book, Open Calculator, Close discussion
(3)

Part I: Definitions (10 )

1.)(10 )

SMT MLPCB
C4 SSI
CSP MSI
MCP LSI
TCM ULSI

Part II: Compute (20 )

b
2.)(10 ) Characteristic Impedance coax Z 0 = ln( ) b
2 a

a = intrinsic impedance Dielectric

) b/a Characteristic impedance coax 50

1

 01044048 ELECTRONICS PACKAGING SYSTEMS : Final Exam

) L C coax Characteristic
impedance coax 50
) Characteristic impedance coax
Polyethylene( r = 2.3 )
) ) 3 GHz.

3.)(10 ) ) 50 Load 75-25j

) 10 m 0.3 m input impedance
j130 Characteristic Impedance
) input impedance (Z(z)) V(z) P(z)

V0+ jz Z Z0
V ( z ) = V0+ (e jz + R e jz ), I ( z ) = (e R e jz ), R = L
Z0 Z L + Z0

Part III: Explain (10 )

4. (10 )

Ergonomics System Reliability

Rents Rule Vias
Footprint Thermal Expansion Coefficient
Solder Pad Encapsulation
Failure Rate Bath-tub curve

Part IV: Solve (20 )

5.) (10 ) Thermal Resistance

glass-epoxy 100 mils thermal resistance 5
1 Oz. 20 mils
?

6.) (10 ) 6.1 Survival Probability

6.1 Survival Probability

2

 01044048 ELECTRONICS PACKAGING SYSTEMS : Final Exam

Survival Probability Survival Probability

0.999999 1, 10, 102, 103, 104, 105,
106

Part V: Judge integrate idea

()
Packaging (40 )

7.) (20 ) 10 8.32 heat input(qi) 8

heat sink (
: component placement 5.52 )

8.) (20 ) multi-level PCB()

2 oz. 5 glass-epoxy 4
1 mm 1
Ts= 20 x-y

q=1 W 3

 01044048 ELECTRONICS PACKAGING SYSTEMS : Final Exam

x y 0-4 mm. y
(isothermal lines)
1mm
Plane 1 y

2mm

Plane 5 Ts= 20 C
x