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Datasheet TDA3681J FORD FIESTA PDF
Datasheet TDA3681J FORD FIESTA PDF
DATA SHEET
TDA3681
Multiple voltage regulator with
switch and ignition buffer
Product specification 2002 Apr 10
Supersedes data of 2001 Aug 24
Philips Semiconductors Product specification
ORDERING INFORMATION
TYPE PACKAGE
NUMBER NAME DESCRIPTION VERSION
TDA3681J DBS17P plastic DIL-bent-SIL power package; 17 leads (lead length 7.7 mm) SOT243-3
TDA3681JR DBS17P plastic DIL-bent-SIL (special bent) power package; 17 leads SOT475-1
(lead length 12 mm)
TDA3681TH HSOP20 plastic, heatsink small outline package; 20 leads; low stand-off height SOT418-2
2002 Apr 10 2
Philips Semiconductors Product specification
2002 Apr 10 3
Philips Semiconductors Product specification
BLOCK DIAGRAMS
11 TEMPERATURE
ENSW & LOAD DUMP
PROTECTION
(14 V/
BACKUP SWITCH 14 100 mA)
BU
BACKUP CONTROL
(5 V/
15 300 mA)
REGULATOR 2 REG2
3
VP2
(3.3 V/
4 1 A)
REGULATOR 4 REG4
&
9
EN4
(5 V/
2 1400 mA)
REGULATOR 3 REG3
&
TDA3681J
TDA3681JR
(8.5 V/
1 600 mA)
REGULATOR 1 REG1
&
10
EN1/3
12
HOLD
+
OR
&
7
RES
8
CRES
5 6
IGNIN IGNITION BUFFER IGNOUT
13
MGL902
GND
2002 Apr 10 4
Philips Semiconductors Product specification
8 TEMPERATURE
ENSW & LOAD DUMP
PROTECTION
(14 V/
BACKUP SWITCH 13 100 mA)
BU
BACKUP CONTROL
(5 V/
12 300 mA)
REGULATOR 2 REG2
20
VP2
(3.3 V/
1 1 A)
REGULATOR 4 REG4
&
6
EN4
11
HEATTAB (5 V/
n.c. 15 19 1400 mA)
REGULATOR 3 REG3
18 &
n.c.
TDA3681TH
(8.5 V/
17 600 mA)
REGULATOR 1 REG1
&
7
EN1/3
9
HOLD
+
OR
&
4
RES
5
CRES
2 3
IGNIN IGNITION BUFFER IGNOUT
10
MGU353
GND
2002 Apr 10 5
Philips Semiconductors Product specification
PINNING
Pin description of TDA3681J and TDA3681JR
SYMBOL PIN DESCRIPTION handbook, halfpage
REG1 1
REG1 1 regulator 1 output
REG3 2
REG3 2 regulator 3 output
VP2 3
VP2 3 second supply voltage
REG4 4
REG4 4 regulator 4 output
IGNIN 5 ignition input IGNIN 5
2002 Apr 10 6
Philips Semiconductors Product specification
Note
1. The pin is used for final test purposes. In the
application it should be connected directly to ground.
2002 Apr 10 7
Philips Semiconductors Product specification
2002 Apr 10 8
Philips Semiconductors Product specification
internal
output stage
voltage REG1
reference 2
output of
regulation
enable detector
EN1/3
REGULATOR 1
output stage
REG3
output of
regulation
enable detector OR &
REGULATOR 3
output stage
REG4
OR
HOLD
output of buffer
regulation
enable detector POWER SWITCH
TEMPERATURE
EN4 LOAD DUMP FOLDBACK
PROTECTION
REGULATOR 4 MODE
MGL904
2002 Apr 10 9
Philips Semiconductors Product specification
VP1
6.5 V
VBU
5.4 V
5.0 V
regulator 2
0V
reset 5.0 V
delay 3.0 V
capacitor 0V
5.0 V
reset
load dump
VP1 = VP2
50 V
ignition
input 0V
−100 V
5.0 V
ignition
output 0V
>22 V
VP1 = VP2
enable >1.8 V
regulator 4 <1.3 V
enable >1.8 V
regulator 1/3 <1.3 V
regulator 1
and 3
regulator 4
temperature active
protection
150 °C passive
HIGH
HOLD
LOW
2002 Apr 10 10
Philips Semiconductors Product specification
enable ≥1.8 V
regulator 1/3 1.3 V
8.5 V
regulator 1
0V
5.0 V
regulator 3
0V
enable >1.8 V
regulator 4
<1.3 V
3.3 V
regulator 4
0V
load dump
16.9 V
VP 7.0 V
4.0 V
enable >1.8 V
power
switch <1.3 V
16 V
power
switch
output
0V
MGL906
Power switch behaviour
2002 Apr 10 11
Philips Semiconductors Product specification
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 60134).
SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT
VP1 supply voltage 1
operating − 18 V
reverse polarity non-operating − 18 V
jump start t ≤ 10 minutes − 30 V
load dump protection t ≤ 50 ms; tr ≥ 2.5 ms − 50 V
VP2 supply voltage 2
operating − 18 V
reverse polarity non-operating − 18 V
jump start t ≤ 10 minutes − 30 V
load dump protection t ≤ 50 ms; tr ≥ 2.5 ms − 50 V
Ptot total power dissipation − 62 W
Tstg storage temperature non-operating −55 +150 °C
Tamb ambient temperature operating −40 +85 °C
Tj junction temperature operating −40 +150 °C
THERMAL CHARACTERISTICS
QUALITY SPECIFICATION
In accordance with “General Quality Specification For Integrated Circuits (SNW-FQ-611D)”.
2002 Apr 10 12
Philips Semiconductors Product specification
CHARACTERISTICS
VP = VP1 =VP2 = 14.4 V; Tamb = 25 °C; measured in test circuits of Figs 10 and 11; unless otherwise specified.
2002 Apr 10 13
Philips Semiconductors Product specification
2002 Apr 10 14
Philips Semiconductors Product specification
2002 Apr 10 15
Philips Semiconductors Product specification
2002 Apr 10 16
Philips Semiconductors Product specification
C 3
6. The delay time depends on the value of the reset delay capacitor: t d(SW) = ------ × V C(th) = C × ( 375 × 10 ) [ s ]
I ch
7. The drop-out voltage of regulators 1 and 2 is measured between pins VP1 and REGn. The drop-out voltage of
regulators 3 and 4 is measured between pins VP2 and REGn.
8. At current limit, Im(REGn) is held constant (see Fig.8).
9. The foldback current protection limits the dissipated power at short-circuit (see Fig.8).
10. The drop-out voltage is measured between pins BU and REG2.
11. The drop-out voltage of the power switch is measured between pins VP1 and SW.
12. The maximum output current of the power switch is limited to 1.8 A when the supply voltage exceeds 18 V.
13. At short-circuit, Isc(SW) of the power switch is held constant to a lower value than the continuous current after a delay
of at least 10 ms.
2002 Apr 10 17
Philips Semiconductors Product specification
8.5 V Vo(REG2)
MGL908
5.0 V
Vo(REG1)
Isc(REG2) Im(REG2)
IREG2
Isc(REG1) Im(REG1)
IREG1
a. Regulator 1. b. Regulator 2.
Vo(REG3) Vo(REG4)
MGL909 MGL910
5.0 V 3.3 V
c. Regulator 3. d. Regulator 4.
VSW
VP − 3.3 V
not
generates delayed delayed
hold
2VBE
1A >1.8 A >3 A
ISW
2002 Apr 10 18
Philips Semiconductors Product specification
reset delay
capacitor reset
8 output
C8 7
47 nF (3) C9
50 pF
R3
10 kΩ
backup hold output
14 12
C10 C12
VBU (2) (3)
100 µF 50 pF
(1) A minimum capacitor of 220 nF on the supply lines VP1 and VP2 is required for stability.
(2) A minimum capacitor of 1 µF for backup supply is required for stability.
(3) Capacitor represents the typical input capacitance of CMOS logic connected to the reset and hold outputs.
2002 Apr 10 19
Philips Semiconductors Product specification
reset delay
capacitor reset
5 output
C8 4
47 nF (3)
C9
50 pF
R3
10 kΩ
backup hold output
13 9
(3)
C12
VBU (2) C10 50 pF
100 µF
R6 ignition input ignition output
2 3
10 kΩ C11 MGU355
VIGNIN 11 10
1 nF
heat tab ground
(1) A minimum capacitor of 220 nF on the supply lines VP1 and VP2 is required for stability.
(2) A minimum capacitor of 1 µF for backup supply is required for stability.
(3) Capacitor represents the typical input capacitance of CMOS logic connected to the reset and hold outputs.
2002 Apr 10 20
Philips Semiconductors Product specification
Application information The output capacitors can be selected by using the graphs
given in Figs 12 and 13. When an electrolytic capacitor is
NOISE
used, its temperature behaviour can cause oscillations at
Table 1 Noise figures a low temperature. The two examples below show how an
output capacitor value is selected.
NOISE FIGURE (µV)(1)
REGULATOR
Co = 10 µF Co = 47 µF Co = 100 µF Example 1
1 170 110 110 Regulators 1, 3 and 4 are stabilized with an electrolytic
2 440 240 190 output capacitor of 220 µF (ESR = 0.15 Ω). At
Tamb = −30 °C, the capacitor value is decreased to 73 µF
3 120 100 80
and the ESR is increased to 1.1 Ω. The regulator remains
4 85 70 55 stable at Tamb = −30 °C (see Fig.12).
Note
Example 2
1. Measured at a bandwidth of 30 kHz.
Regulator 2 is stabilized with a 10 µF electrolytic capacitor
(ESR = 3 Ω). At Tamb = −30 °C, the capacitor value is
The noise on the supply line depends on the value of the decreased to 3 µF and the ESR is increased to 23.1 Ω.
supply capacitor and is caused by a current noise (the As can be seen from Fig.13, the regulator will be unstable
output noise of the regulators is translated to a current at Tamb = −30 °C.
noise by the output capacitors). The noise is minimal when
a high frequency capacitor of 220 nF in parallel with an Solution
electrolytic capacitor of 100 µF is connected directly to the
supply pins VP1, VP2 and GND. To avoid problems with stability at low temperatures, the
use of tantalum capacitors is recommended. Use a
STABILITY tantalum capacitor of 10 µF or a larger electrolytic
capacitor.
The regulators are stabilized by the externally connected
output capacitors.
8
maximum ESR
10 stable region
6
4
5 stable region 2
minimum ESR
0
0 −2
0.1 1 10 100 0.22 1 10 100
C (µF) C (µF)
Fig.12 Curve for selecting the value of the output Fig.13 Curve for selecting the value of the output
capacitor for regulators 1, 3 and 4. capacitor for regulator 2.
2002 Apr 10 21
Philips Semiconductors Product specification
PACKAGE OUTLINES
DBS17P: plastic DIL-bent-SIL power package; 17 leads (lead length 7.7 mm) SOT243-3
non-concave
Dh
x
Eh
d A2
j E
L3
Q c v M
1 17
Z e1 w M m e2
bp
e
0 5 10 mm
scale
17.0 4.6 0.75 0.48 24.0 20.0 12.2 6 3.4 8.4 2.4 2.1 2.00
mm 10 2.54 1.27 5.08 4.3 0.6 0.25 0.03
15.5 4.4 0.60 0.38 23.6 19.6 11.8 3.1 7.0 1.6 1.8 1.45
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
97-12-16
SOT243-3
99-12-17
2002 Apr 10 22
Philips Semiconductors Product specification
DBS17P: plastic DIL-bent-SIL (special bent) power package; 17 leads (lead length 12 mm) SOT475-1
non-concave
Dh
x
D
Eh
d A2
j E
L3
L Q
1 17
Z e1 w M c v M
bp
e m e2
0 5 10 mm
scale
17.0 4.6 0.75 0.48 24.0 20.0 12.2 6 3.4 12.4 2.4 2.1 2.00
mm 10 2.54 1.27 5.08 4.3 0.8 0.4 0.03
15.5 4.4 0.60 0.38 23.6 19.6 11.8 3.1 11.0 1.6 1.8 1.45
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
97-05-20
SOT475-1
99-12-17
2002 Apr 10 23
Philips Semiconductors Product specification
HSOP20: plastic, heatsink small outline package; 20 leads; low stand-off height SOT418-2
E A
D
x X
y E2
HE v M A
D1
D2
1 10
pin 1 index
A2 A
E1 (A3)
A4
θ
Lp
detail X
20 11
Z w M
e bp
0 5 10 mm
scale
Notes
1. Limits per individual lead.
2. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
98-02-25
SOT418-2
99-11-12
2002 Apr 10 24
Philips Semiconductors Product specification
2002 Apr 10 25
Philips Semiconductors Product specification
SOLDERING METHOD
MOUNTING PACKAGE
WAVE REFLOW(1) DIPPING
Through-hole mount DBS, DIP, HDIP, SDIP, SIL suitable(2) − suitable
Surface mount BGA, HBGA, LFBGA, SQFP, TFBGA not suitable suitable −
HBCC, HLQFP, HSQFP, HSOP, HTQFP, not suitable(3) suitable −
HTSSOP, HVQFN, SMS
PLCC(4), SO, SOJ suitable suitable −
LQFP, QFP, TQFP not recommended(4)(5) suitable −
SSOP, TSSOP, VSO not recommended(6) suitable −
Notes
1. All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum
temperature (with respect to time) and body size of the package, there is a risk that internal or external package
cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the
Drypack information in the “Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods”.
2. For SDIP packages, the longitudinal axis must be parallel to the transport direction of the printed-circuit board.
3. These packages are not suitable for wave soldering as a solder joint between the printed-circuit board and heatsink
(at bottom version) can not be achieved, and as solder may stick to the heatsink (on top version).
4. If wave soldering is considered, then the package must be placed at a 45° angle to the solder wave direction.
The package footprint must incorporate solder thieves downstream and at the side corners.
5. Wave soldering is only suitable for LQFP, QFP and TQFP packages with a pitch (e) equal to or larger than 0.8 mm;
it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.
6. Wave soldering is only suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than 0.65 mm; it is
definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.
2002 Apr 10 26
Philips Semiconductors Product specification
PRODUCT
DATA SHEET STATUS(1) DEFINITIONS
STATUS(2)
Objective data Development This data sheet contains data from the objective specification for product
development. Philips Semiconductors reserves the right to change the
specification in any manner without notice.
Preliminary data Qualification This data sheet contains data from the preliminary specification.
Supplementary data will be published at a later date. Philips
Semiconductors reserves the right to change the specification without
notice, in order to improve the design and supply the best possible
product.
Product data Production This data sheet contains data from the product specification. Philips
Semiconductors reserves the right to make changes at any time in order
to improve the design, manufacturing and supply. Changes will be
communicated according to the Customer Product/Process Change
Notification (CPCN) procedure SNW-SQ-650A.
Notes
1. Please consult the most recently issued data sheet before initiating or completing a design.
2. The product status of the device(s) described in this data sheet may have changed since this data sheet was
published. The latest information is available on the Internet at URL http://www.semiconductors.philips.com.
DEFINITIONS DISCLAIMERS
Short-form specification The data in a short-form Life support applications These products are not
specification is extracted from a full data sheet with the designed for use in life support appliances, devices, or
same type number and title. For detailed information see systems where malfunction of these products can
the relevant data sheet or data handbook. reasonably be expected to result in personal injury. Philips
Semiconductors customers using or selling these products
Limiting values definition Limiting values given are in
for use in such applications do so at their own risk and
accordance with the Absolute Maximum Rating System
agree to fully indemnify Philips Semiconductors for any
(IEC 60134). Stress above one or more of the limiting
damages resulting from such application.
values may cause permanent damage to the device.
These are stress ratings only and operation of the device Right to make changes Philips Semiconductors
at these or at any other conditions above those given in the reserves the right to make changes, without notice, in the
Characteristics sections of the specification is not implied. products, including circuits, standard cells, and/or
Exposure to limiting values for extended periods may software, described or contained herein in order to
affect device reliability. improve design and/or performance. Philips
Semiconductors assumes no responsibility or liability for
Application information Applications that are
the use of any of these products, conveys no licence or title
described herein for any of these products are for
under any patent, copyright, or mask work right to these
illustrative purposes only. Philips Semiconductors make
products, and makes no representations or warranties that
no representation or warranty that such applications will be
these products are free from patent, copyright, or mask
suitable for the specified use without further testing or
work right infringement, unless otherwise specified.
modification.
2002 Apr 10 27
Philips Semiconductors – a worldwide company
Contact information
Printed in The Netherlands 753503/05/pp28 Date of release: 2002 Apr 10 Document order number: 9397 750 09266