Heat and Mass Transfer (MEL 242)

IIT Jammu
Tutorial 1, 15th January 2019

Problem 1.22 The free convection heat transfer coefficient on a thin hot vertical plate suspended in still air can be
determined from observations of the change in plate temperature with time as it cools. Assuming the
plate is isothermal and radiation exchange with its surroundings is negligible, evaluate the convection
coefficient at the instant of time when the plate temperature is 225°C and the change in plate temper-
ature with time (dT /dt) is –0.022 K/s. The ambient air temperature is 25°C and the plate measures
0.3 m×0.3 m with a mass of 3.75 kg and a specific heat of 2770 J/kg·K.
Answer: 6.35 W/m2 ·K

Problem 1.25 A common procedure for measuring the velocity of an airstream involves the insertion of an electrically
heated wire (called a hot-wire anemometer) into the airflow, with the axis of the wire oriented perpen-
dicular to the flow direction. The electrical energy dissipated in the wire is assumed to be transferred
to the air by forced convection. Hence, for a prescribed electrical power, the temperature of the wire
depends on the convection coefficient, which, in turn, depends on the velocity of the air. Consider a wire
of length L = 20 mm and diameter D = 0.5 mm, for which a calibration of the form V = 6.25 × 10−5 h
has been determined. The velocity V and the convection coefficient h have units of m/s and W/m2 ·K,
respectively. In an application involving air at a temperature of T = 25°C, the surface temperature of
the anemometer is maintained at T = 75°C with a voltage drop of 5 V and an electric current of 0.1
A. What is the velocity of the air?
Answer: 6.25 m/s

Problem 1.38 An internally reversible refrigerator has a modified coefficient of performance accounting for realistic
heat transfer processes of
Q̇in Q̇in Tc,i
COPm = = =
Ẇ Q̇out − Q̇in Th,i − Tc,i
where Q̇in is the refrigerator cooling rate, Q̇out is the heat rejection rate, and Ẇ is the power input.
Show that COPm can be expressed in terms of the reservoir temperatures Tc and Th , the cold and hot
thermal resistances Rt,c and Rt,h , and Q̇in , as

Tc − Q̇in Rtot
COPm =
Th − Tc + Q̇in Rtot
where Rtot = Rt,c + Rt,h . Also, show that the power input may be expressed as

Th − Tc + Q̇in Rtot
Ẇ = Q̇in
Tc − Q̇in Rtot

Problem 1.39 A household refrigerator operates with cold- and hot-temperature reservoirs of Tc = 5°C and Th = 25°C,
respectively. When new, the cold and hot side resistances are Rc,n = 0.05 K/W and Rh,n = 0.04 K/W,
respectively. Over time, dust accumulates on the refrigerators condenser coil, which is located behind
the refrigerator, increasing the hot side resistance to Rh,d = 0.1 K/W. It is desired to have a refrigerator
cooling rate of Q̇in = 750 W. Using the results of Problem 1.38, determine the modified coefficient of
performance and the required power input Ẇ under (a) clean and (b) dusty coil conditions.
Answers: (a) 2.41 & 311.8 W; (b) 1.25 & 600 W

Problem 1.56 In the thermal processing of semiconductor materials, annealing is accomplished by heating a silicon
wafer according to a temperature-time recipe and then maintaining a fixed elevated temperature for
a prescribed period of time. For the process tool arrangement shown as follows, the wafer is in an
evacuated chamber whose walls are maintained at 27°C and within which heating lamps maintain
a radiant flux Q̇′′s at its upper surface. The wafer is 0.78 mm thick, has a thermal conductivity of

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30 W/m·K, and an emissivity that equals its absorptivity to the radiant flux (ǫ = α = 0.65). For
Q̇′′s = 3.0 × 105 W/m2 , the temperature on its lower surface is measured by a radiation thermometer
and found to have a value of Tw,l = 997°C. To avoid warping the wafer and inducing slip planes in the
crystal structure, the temperature difference across the thickness of the wafer must be less than 2°C.
Is this condition being met?
Answer: No