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Product Structure
Features & Application:
i g n ▼ ▼
to m
* To help you go pass the CE/FCC standard. 2005 RoHS Compliant - SGS Certified Result
s
Cu
鉛 鎘 汞 六價鉻 溴化聯苯 溴化聯苯
* MainBoard / NB / IPC / Server / VRM moudle...etc. Pb Cd Hg Cr+6 PBB 醚PBDE
<1000ppm ND ND ND ND ND
A A C A
D
E E
C E
A B 11
22
1.6
UL Tube
8.5
C
E D
DIMENSION Unit : mm
A (Max.) B (Max.) C (+/- 1.0) D (+/-1.5) E (+/-0.1)
22.00 11.00 5.00 8.50 1.20
CORE
BRAND SIZE CODE COLOR
MPP T66 Deep Blue / Light Blue
WIRE
BRAND SIZE COLOR TURNS (Ref.)
PACIFIC 2UEW 1.2 mm copper yellow 11.5 TS
ELEC. SPEC
L ( +/-20% ) Isat (Typ.)
DCR ( Max. ) Irms (Typ.)
( 200KHz / 1.0V ) L = 5.5uH (Ref.)
10.0 uH 5.50 m Ohm 10.0 A 13.0 A
TEST CONTITION
8 Soldering Heat Resistance Preheat:120 ~ 150 o C (60 sec) The chip must have no cracks.More than 75% of
Solder:H63A(eutectic solder) the terminal electrode must be covered with
耐熱 焊性試驗
Solder Temp.: 260 ± 5 o C solder.
Flux: Rosin For 96.5 Sn / 3.5 Ag Solder Past: > 217 o C / 90
Dip time: 10± 1 seconds Seconds.
For 63.0 Sn / 37 Pb Solder Past: > 183 o C / 120
Seconds.
BOX Package: cm 34
MFD :XXXXX-XXXXX
PN :XXX XXXXXX
QTY :XXXXX
Note :XXXXXXXX 34
Cucstomer Label:
PN:
BarCode:
PO:
Descriptin:
...........etc. Request
15 Bi
g
15 Bo 17
Li
ttl
e
x
Bo 3 16 Little Box in
x