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Description
Features
E183209
Applications
R50120008 •C
ustomer Premises • LAN/WAN equipment
Equipment (CPE) • Access equipment
•C
entral Office (CO)/
Additional Information telecom centers
Electrical Characteristics
Agency
Device Time to Trip at 1A Resistance
I hold I trip V max I max Pd typ. Approvals
Part Number Mounting
(A) (A) (Vint /Vop) (A) (W) Typical Maximum R min R max R 1max
Layout
(Sec.) (Sec.) (Ω) (Ω) (Ω)
250S130 0.13 0.26 250/60 3 1.2 0.9 4.0 4 13 20 –
250S130–RA 0.13 0.26 250/60 3 1.2 1.4 4.0 6.5 10 15 –
Horizontal
250S130–RB 0.13 0.26 250/60 3 1.2 0.7 4.0 9 13 20 –
250S130–RC 0.13 0.26 250/60 3 1.2 1.1 4.0 7 11 17 –
250S130V Vertical 0.13 0.26 250/60 3 1.2 2.0 4.0 4 13 20 –
I hold = Hold current: maximum current device will pass without tripping in 20°C still air. R min = Minimum resistance of device in initial (un-soldered) state.
I trip = Trip current: minimum current at which the device will trip in 20°C still air. R max = Maximum resistance of device in initial (un-soldered) state.
Vint = Maximum voltage the device can withstand without damage at rated current (I max) R 1max = Maximum resistance of device at 20°C measured one hour after tripping.
Vop= The device regular operation voltage Caution: Operation beyond the specified rating may result in damage and possible arcing
I max = Maximum fault current device can withstand without damage at rated voltage (Vmax) and flame.
P d = Power dissipated from device when in the tripped state at 20°C still air.
WARNING
• Users shall independently assess the suitability of these devices for each of their • Exposure to silicon-based oils, solvents, electrolytes, acids, and similar materials can
applications adversely affect the performance of these PPTC devices
• Operation of these devices beyond the stated maximum ratings could result in damage to • These devices undergo thermal expansion under fault conditions, and thus shall be
the devices and lead to electrical arcing and/or fire provided with adequate space and be protected against mechanical stresses
• These devices are intended to protect against the effects of temporary over-current or over- • Circuits with inductance may generate a voltage (L di/dt) above the rated voltage of the
temperature conditions and are not intended to perform as protective devices where such PPTC device.
conditions are expected to be repetitive or prolonged in duration
Temperature Rerating
200.00
L 250S
1000
160.00
100
80.00
Time in Seconds
40.00
10
0.00
-40.00 0.00 40.00 80.00 120.00
Device Ambient Temperature ºC
1
Agency Specification Selection Guide For Telecom
and Networking Applications
Region/ Device
Application
Specification Selection
Access network equipment 250S130
South America/ Remote terminal 250S130V
Asia/Europe Repeaters 250S130-RA
ITU K.45 WAN equipment 250S130-RB
Cross –connect 250S130-RC
Customer and IT equipment
250S130
Analog modems
South America/ 250S130V
ADSL, xDSL
Asia/Europe 250S130-RA
Phone sets, PBX systems
ITU K.21 250S130-RB
Internet appliances
250S130-RC
POS terminals
Central Office 250S130
South America/ POTS/ISDN linecards 250S130V
Asia/Europe T1/E1/J1 linecards 250S130-RA
ITU K.20 ADSL/VDSL splitters 250S130-RB
CSU/DSU 250S130-RC
Soldering Parameters
Temperature
Time (Min to Max) (ts)
Preheat
Time Maintained Temperature (TL) 217°C TS(min)
Above: Temperature (tL) 60 – 150 seconds tS
Peak / Classification Temperature (TP) 260+0/-5 °C
25
Time within 5°C of actual peak time to peak temperature
Time
20 – 40 seconds
Temperature (tp)
Ramp-down Rate 6°C/second max
-- All temperature refer to topside of the package, measured on the package body surface
Time 25°C to peak Temperature (TP) 8 minutes Max. -- If reflow temperature exceeds the recommended profile, devices may not meet the
performance requirements
-- Recommended reflow methods: IR, vapor phase oven, hot air oven, N2 environment
for lead
-- Recommended maximum paste thickness is 0.25mm(0.010inch)
-- Devices can be cleaned usingstandard industry methods and solvents
-- Devices can be reworked using the standard industry practices
Dimensions
C H
B F
D E
A C G H G
Soldering Pad Layout
B F
A B C D E F G H
Part
Number
Inch mm Inch mm Inch Dmm E
Inch mm Inch mm Material Inch mm Inch mm Inch mm
Max. Max. Max. AMax. Max. Max. Max. Max. Max. Max. G Max. GMax. Max. Max. Max. Max.
250S130 0.37 9.4 0.15 3.7 0.29 7.4 0.016 0.4 0.15 3.8 Soldering
Sn/Ni/Cu Pad Layout
0.18 4.6 0.07 1.8 0.24 6.1
250S130–RA 0.37 9.4 0.15 3.7
A 0.29 7.4 C
0.016 0.4 0.15 3.8 Sn/Ni/Cu 0.18 4.6 0.07 1.8 0.24 6.1
250S130–RB 0.37 9.4 0.15 3.7 0.29 7.4 0.016 0.4 0.15 3.8 Sn/Ni/CuI 0.18 4.6 0.07 1.8 0.24 6.1
250S130–RC 0.37 9.4 0.15 3.7 0.29 7.4 0.016 0.4 0.15 3.8 GSn/Ni/Cu 0.18 4.6 0.07 1.8 0.24 6.1
B G J
A C H
H
I
D Soldering Pad Layout
F E G
B G J
H
H
D Soldering Pad Layout
F E
A B C D E F G H I J
Part
Inch mm Inch mm Inch mm Inch mm Inch mm Inch mm Material Inch mm Inch mm Inch mm Inch mm
Number
Max. Max. Max. Max. Max. Max. Max. Max. Max. Max. Max. Max. Max. Max. Max. Max. Max. Max. Max. Max.
250S130V .24 6.1 .27 6.9 .13 3.2 .04 1.6 .07 1.9 .09 2.3 Sn/Ni/Cu .09 2.3 .09 2.4 .25 6.4 .14 3.43
Packaging
D1 1.00(MIN) C Ø340+/- 1.0
K0 3.4 +/- 0.15
H
P1 P2
D0
P0 E1
W4 W3
D C
F
W
W2
F W
T D2
W1
H1
A0 K0 B0
Disclaimer Notice - Information furnished is believed to be accurate and reliable. However, users should independently evaluate the suitability of and
test each product selected for their own applications. Littelfuse products are not designed for, and may not be used in, all applications.
Read complete Disclaimer Notice at www.littelfuse.com/disclaimer-electronics.
Authorized Distributor
Littelfuse:
250S130DR 250S130-RADR 250S130-RBDR 250S130-RCDR 250S130VDR 250S130VZR