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FDP6030BL/FDB6030BL

July 2000

FDP6030BL/FDB6030BL
N-Channel Logic Level PowerTrench MOSFET
General Description Features

This N-Channel Logic Level MOSFET has been designed • 40 A, 30 V. RDS(ON) = 0.018 Ω @ VGS = 10 V
specifically to improve the overall efficiency of DC/DC RDS(ON) = 0.024 Ω @ VGS = 4.5 V.
converters using either synchronous or conventional
switching PWM controllers. • Critical DC electrical parameters specified at elevated
temperature.
These MOSFETs feature faster switching and lower gate
charge than other MOSFETs with comparable RDS(on) • Rugged internal source-drain diode can eliminate the
specifications resulting in DC/DC power supply designs need for an external Zener diode transient suppressor.
with higher overall efficiency.
• High performance trench technology for
extremely low RDS(ON).

• 175°C maximum junction temperature rating.

D
D

G
G
TO-220
G
D
S FDP Series S TO-263AB
S
FDB Series

Absolute Maximum Ratings TC = 25°C unless otherwise noted

Symbol Parameter FDP6030BL FDB6030BL Units


VDSS Drain-Source Voltage 30 V
VGSS Gate-Source Voltage ±20 V
ID Maximum Drain Current - Continuous (Note 1) 40 A
- Pulsed 120
PD Total Power Dissipation @ TC = 25°C 60 W
Derate above 25°C 0.36 W/°C
TJ, TSTG Operating and Storage Junction Temperature Range -65 to +175 °C

Thermal Characteristics
RθJC Thermal Resistance, Junction-to-Case 2.5 °C/W
RθJA Thermal Resistance, Junction-to-Ambient 62.5 °C/W

Package Marking and Ordering Information


Device Marking Device Reel Size Tape Width Quantity
FDB6030BL FDB6030BL 13’’ 24mm 800
FDP6030BL FDP6030BL Tube N/A 45

200 Fairchild Semiconductor International FDP6030BL/FDB6030BL Rev.C


FDP6030BL/FDB6030BL
Electrical Characteristics TC = 25°C unless otherwise noted

Symbol Parameter Test Conditions Min Typ Max Units

DRAIN-SOURCE AVALANCHE RATINGS (Note 1)


WDSS Single Pulse Drain-Source VDD = 15 V, ID = 40 A 150 mJ
Avalanche Energy
IAR Maximum Drain-Source Avalnche Current 40 A

Off Characteristics
BVDSS Drain-Source Breakdown Voltage VGS = 0 V, ID = 250 µA 30 V
∆BVDSS Breakdown Voltage Temperature ID = 250 µA, Referenced to 25°C 23 mV/°C
∆TJ Coefficient
IDSS Zero Gate Voltage Drain Current VDS = 24 V, VGS = 0 V 1 µA
IGSSF Gate-Body Leakage Current, VGS = 20 V, VDS = 0 V 100 nA
Forward
IGSSR Gate-Body Leakage Current, VGS = -20 V, VDS = 0 V -100 nA
Reverse

On Characteristics (Note 1)
VGS(th) Gate Threshold Voltage VDS = VGS, ID = 250 µA 1 1.6 3 V
∆VGS(th) Gate Threshold Voltage ID = 250 µA, Referenced to 25°C -4.5 mV/°C
∆TJ Temperature Coefficient
RDS(on) Static Drain-Source VGS = 10 V, ID = 20 A, 0.015 0.018 Ω
On-Resistance VGS = 10 V, ID = 20 A, TJ = 125°C 0.021 0.030
VGS = 4.5 V,ID = 17 A 0.019 0.024
ID(on) On-State Drain Current VGS = 10 V, VDS = 10 V 40 A
gFS Forward Transconductance VDS = 5 V, ID = 20 A 30 S

Dynamic Characteristics
Ciss Input Capacitance VDS = 15 V, VGS = 0 V, 1160 pF
Coss Output Capacitance f = 1.0 MHz 250 pF
Crss Reverse Transfer Capacitance 100 pF

Switching Characteristics (Note 1)


td(on) Turn-On Delay Time VDD = 15 V, ID = 1 A, 9 17 ns
tr Turn-On Rise Time VGS = 10 V, RGEN = 6 Ω 11 20 ns
td(off) Turn-Off Delay Time 23 37 ns
tf Turn-Off Fall Time 8 16 ns
Qg Total Gate Charge VDS = 15 V, 12 17 nC
Qgs Gate-Source Charge ID = 20 A, VGS = 5 V 3.2 nC
Qgd Gate-Drain Charge 3.7 nC

Drain-Source Diode Characteristics and Maximum Ratings


IS Maximum Continuous Drain-Source Diode Forward Current (Note 1) 40 A
VSD Drain-Source Diode Forward VGS = 0 V, IS = 20 A (Note 1) 0.95 1.2 V
Voltage
Note:
1. Pulse Test: Pulse Width ≤ 300 µs, Duty Cycle ≤ 2.0%

FDP6030BL/FDB6030BL Rev.C
FDP6030BL/FDB6030BL
Typical Characteristics

80 2 .6
VGS = 10V
6.0V
ID, DRAIN-SOURCE CURRENT (A)

D R A IN -SO U RC E O N -R E SISTA N C E
70 2 .4
5.0V
2 .2
60

R DS(ON) , N O R M A LIZ ED
4.5V V GS = 3 .0 V
2
50 4.0V
1 .8
40 3 .5 V
1 .6
3.5V 4 .0 V
30 4 .5 V
1 .4
20 5 .0 V
1 .2
3.0V 7 .0 V
10 1 10V

0 0 .8
0 1 2 3 4 5 0 10 20 30 40 50

VDS, DRAIN-SOURCE VOLTAGE (V) I D, D R AIN C U R R EN T (A )

Figure 1. On-Region Characteristics. Figure 2. On-Resistance Variation


with Drain Current and Gate Voltage.

1 .8 0.06
I D = 2 0A ID = 10 A
D RA IN -S O U RC E O N -R ES ISTA N C E

RDS(ON), ON-RESISTANCE (OHM)


1 .6 V GS = 1 0V 0.05
R DS(ON) , N O R M A LIZE D

1 .4 0.04

1 .2 0.03
o
TA = 125 C
1 0.02

0 .8 TA = 25 C
o
0.01

0 .6
0
-5 0 -2 5 0 25 50 75 1 00 1 25 1 50
2 4 6 8 10
o
T J, JUN C TIO N TE M P ER A TU RE ( C ) VGS, GATE TO SOURCE VOLTAGE (V)

Figure 3. On-Resistance Variation Figure 4. On-Resistance Variation


with Temperature. with Gate-to-Source Voltage.

50 100
o
TA = -55 C VGS = 0V
IS, REVERSE DRAIN CURRENT (A)

VDS = 5V
o
25 C 10
40
ID, DRAIN CURRENT (A)

o o
125 C TA = 125 C
1
o
30 25 C
o
0.1 -55 C
20
0.01

10
0.001

0 0.0001
1 2 3 4 5 0 0.2 0.4 0.6 0.8 1 1.2 1.4
VGS, GATE TO SOURCE VOLTAGE (V) VSD, BODY DIODE FORWARD VOLTAGE (V)

Figure 5. Transfer Characteristics. Figure 6. Body Diode Forward Voltage


Variation with Source Current
and Temperature.

FDP6030BL/FDB6030BL Rev.C
FDP6030BL/FDB6030BL
Typical Characteristics (continued)

10 1600
ID = 20A VDS = 5V f = 1 MHz
VGS, GATE-SOURCE VOLTAGE (V)

10V 1400 VGS = 0 V


8 15V 1200

CAPACITANCE (pF)
CISS

1000
6
800

4 600

400
2
200 COSS
CRSS
0
0
0 5 10 15 20 25 30
0 5 10 15 20 25
VDS, DRAIN TO SOURCE VOLTAGE (V)
Qg, GATE CHARGE (nC)

Figure 7. Gate-Charge Characteristics. Figure 8. Capacitance Characteristics.

1000 2500
VGS = 10V
SINGLE PULSE SINGLE PULSE
o 2000
ID, DRAIN CURRENT (A)

RθJC = 2.5 C/W R θJC =2.5°C/W


o 10µs TC = 25°C
100 TC = 25 C
100µs
POWER (W)

1500
1ms
RDS(ON) LIMIT 10ms
100ms 1000
10 DC

500

1 0
0.01 0.1 1 10 100 1,000
0.1 1 10 100
SINGLE PULSE TIME (mSEC)
VDS, DRAIN-SOURCE VOLTAGE (V)

Figure 9. Maximum Safe Operating Area. Figure 10. Single Pulse Maximum
Power Dissipation.

1
TRANSIENT THERMAL RESISTANCE

D = 0.5
0.5
r(t), NORMALIZED EFFECTIVE

0.3 R θJC (t) = r(t) * RθJC


0.2
0.2 R θJC = 2.5 °C/W
0.1
0.1
0.05 P(pk)

0.05 0.02 t1
t2
0.03 0.01
Single Pulse TJ - TC = P * R θJC (t)
0.02
Duty Cycle, D = t1 /t2
0.01
0.01 0.1 1 10 100 1000
t1 ,TIME (ms)

Figure 11. Transient Thermal Response Curve.

FDP6030BL/FDB6030BL Rev.C
TO-220 Tape and Reel Data and Package Dimensions

TO-220 Tube Packing


Configuration: Figur e 1.0
Packaging Description:
TO-220 parts are ship ped normally in tube. The tube is
made of PVC plastic treated with anti -stati c agent.These
tubes in standard option are placed inside a dissipative
plastic bag, barcode labeled, and placed inside a box
45 unit s per Tube made of recyclable corrugated pa per. One box contains
two ba gs maximum (see fig. 1.0). And one or several o f
these boxes are placed inside a labeled shipp ing bo x
whic h c omes in different sizes dependi ng on the nu mber
of parts ship ped. The other option comes in bulk as
described in the Packagin g Information table. The unit s in
this option are placed inside a small box laid w ith anti-
static bubble sheet. These smaller boxes are individually
labeled and placed ins ide a larger box (see fig. 3.0).
12 Tubes per Bag These larger or intermediate boxes then will b e placed
finally inside a labeled shipping box whic h still comes in
different sizes depending on the number of units shipped.

530mm x 130mm x 83mm


Intermediate box
2 bag s per Box

Conduct ive Plasti c B ag

TO-220 Packaging FSCINT Labe l samp le


Information: Figure 2.0 FAIRCHILD SEMICONDUCTOR CORPORATION HTB:B
LOT: CBVK741B019 QTY: 1080
1080 uni ts maxi mum
TO-220 Packaging Information
quant it y per bo x
NSID: FDP7060 SPEC:

Standard
Packaging Option S62Z
(no f l ow code )
D/C1: D9842 SPEC REV: B2
Packaging type Rail/Tube BULK QA REV:

Qty per Tube/Box 45 300


FSCINT Label (FSCINT)
Box Dimension (mm) 530x130x83 114x102x51
Max qty per Box 1,080 1,500
Weight per unit (gm) 1.4378 1.4378

Note/Comments

TO-220 bulk Packing


Configuration: Figure 3.0
An ti-stati c
530mm x 130mm x 83mm
FSCINT Label Bubbl e Sheet s
Intermediate box

1500 uni ts maxi mum


quant it y per intermediate box
300 units per 5 EO70 boxe s per per
EO70 box Interm ediate Bo x

114mm x 102mm x 51mm


EO70 Immed iate Box FSCINT Label

TO-220 Tube
0.123
Configuration: Figure 4.0 +0.001 0.165
-0.003
Note: All dim ensions are in inches 0.080

0.450 0.275
±.030
F 9852 F 9852 F 9852 F 9852 F 9852 F 9852 F 9852 F 9852 F 9852 F 9852 F 9852 F 9852
NDP4060L NDP4060L NDP4060L NDP4060L NDP4060L NDP4060L NDP4060L NDP4060L NDP4060L NDP4060L NDP4060L NDP4060L
1.300
±.015
0.160
0.032
±.003

20.000
+0.031 0.800
-0.065 0.275

August 1999, Rev. B


TO-220 Tape and Reel Data and Package Dimensions, continued

TO-220 (FS PKG Code 37)

1:1
Scale 1:1 on letter size paper
Dimensions shown below are in:
inches [millimeters]

Part Weight per unit (gram): 1.4378

September 1998, Rev. A


TO-263AB/D2PAK Tape and Reel Data and Package
Dimensions
TO-263AB/D2PAK Packaging
Configuration: Figure 1.0

Packaging Description:
TO-263/D2PAK parts are shipped in tape. The carrier tape
EL ECT ROST AT IC
SEN SIT IVE DEVICES
DO NO T SHI P OR STO RE N EAR ST RO NG EL ECT ROST AT IC
EL ECT RO M AGN ETI C, M AG NET IC O R R ADIO ACT IVE FI ELD S
is made from a dissipative (carbon filled) polycarbonate
TNR D ATE resin. The cover tape is a multilayer film (Heat Activated
PT NUMB ER

PEEL STREN GTH MIN ___ __ ____ __ ___gms Adhesive in nature) primarily composed of polyester film,
MAX ___ ___ ___ ___ _ gms

adhesive layer, sealant, and anti-static sprayed agent.


Antistatic Cover Tape These reeled parts in standard option are shipped with
ESD Label 800 units per 13" or 330cm diameter reel. The reels are
dark blue in color and is made of polystyrene plastic (anti-
static coated). This and some other options are further
described in the Packaging Information table.
These full reels are individually barcode labeled, dry
packed, and placed inside a standard intermediate box
(illustrated in figure 1.0) made of recyclable corrugated
brown paper. One box contains one reel maximum. And
these boxes are placed inside a barcode labeled shipping
CAUTION box which comes in different sizes depending on the
number of parts shipped.

Static Dissipative
Embossed Carrier Tape
Moisture Sensitive
Label

F63TNR
Label

Customized
Label FDB603AL FDB603AL FDB603AL FDB603AL
F9835 F9835 F9835 F9835

TO-263AB/D2PAK Packaging Information


Standard
L86Z
TO-263AB/D2PAK Unit Orientation
Packaging Option (no flow code)
Packaging type TNR Rail/Tube
Qty per Reel/Tube/Bag 800 45
Reel Size 13" Dia -
Box Dimension (mm) 359x359x57 530x130x83
Max qty per Box 800 1,080
Weight per unit (gm) 1.4378 1.4378
359mm x 359mm x 57mm
Weight per Reel 1.6050 - Standard Intermediate box
Note/Comments ESD Label

Moisture Sensitive
Label

F63TNR Label sample


F63TNR Label
LOT: CBVK741B019 QTY: 800

FSID: FDB6320L SPEC:


DRYPACK Bag
D/C1: D9842 QTY1: SPEC REV:
D/C2: QTY2: CPN:
N/F: F (F63TNR)3

TO-263AB/D2PAK Tape Leader and Trailer


Configuration: Figure 2.0

Carrier Tape

Cover Tape
Components
Trailer Tape Leader Tape
400mm minimum or 1520mm minimum or
25 empty pockets 95 empty pockets

September 1999, Rev. B


TO-263AB/D2PAK Tape and Reel Data and Package Dimensions, continued
TO-263AB/D2PAK Embossed Carrier Tape
Configuration: Figure 3.0 P0 D0
T
E1

K0 W
E2
Wc B0

Tc
A0 P1 D1

User Direction of Feed

Dimensions are in millimeter

Pkg type A0 B0 W D0 D1 E1 E2 F P1 P0 K0 T Wc Tc

TO263AB/
10.60 15.80 24.0 1.55 1.60 1.75 22.25 11.50 16.0 4.0 4.90 0.450 21.0 0.06
D2PAK +/-0.10 +/-0.10 +/-0.3 +/-0.05 +/-0.10 +/-0.10 min +/-0.10 +/-0.1 +/-0.1 +/-0.10 +/-0.150 +/-0.3 +/-0.02
(24mm)

Notes: A0, B0, and K0 dimensions are determined with respect to the EIA/Jedec RS-481
rotational and lateral movement requirements (see sketches A, B, and C). 0.9mm
10 deg maximum maximum

Typical
component
cavity 0.9mm
B0 center line maximum

10 deg maximum component rotation

Typical
Sketch A (Side or Front Sectional View) component Sketch C (Top View)
A0 center line
Component Rotation Component lateral movement
Sketch B (Top View)
2PAK
TO-263AB/D Reel Configuration: Component Rotation
Figure 4.0
W1 Measured at Hub

Dim A
Max
B Min

Dim C

Dim A
max Dim N Dim D
min

DETAIL AA

See detail AA
W3

13" Diameter Option W2 max Measured at Hub

Dimensions are in inches and millimeters

Reel
Tape Size Dim A Dim B Dim C Dim D Dim N Dim W1 Dim W2 Dim W3 (LSL-USL)
Option
13.00 0.059 512 +0.020/-0.008 0.795 4.00 0.961 +0.078/-0.000 1.197 0.941 – 0.1.079
24mm 13" Dia
330 1.5 13 +0.5/-0.2 20.2 100 24.4 +2/0 30.4 23.9 – 27.4

August 1999, Rev. B


TO-263AB/D2PAK Tape and Reel Data and Package Dimensions, continued

TO-263AB/D2PAK (FS PKG Code 45)

1:1
Scale 1:1 on letter size paper
Dimensions shown below are in:
inches [millimeters]

Part Weight per unit (gram): 1.4378

August 1998, Rev. A


TRADEMARKS
The following are registered and unregistered trademarks Fairchild Semiconductor owns or is authorized to use and is
not intended to be an exhaustive list of all such trademarks.

ACEx™ HiSeC™ SuperSOT™-8


Bottomless™ ISOPLANAR™ SyncFET™
CoolFET™ MICROWIRE™ TinyLogic™
CROSSVOLT™ POP™ UHC™
E2CMOSTM PowerTrench  VCX™
FACT™ QFET™
FACT Quiet Series™ QS™
FAST Quiet Series™
FASTr™ SuperSOT™-3
GTO™ SuperSOT™-6
DISCLAIMER

FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER


NOTICE TO ANY PRODUCTS HEREIN TO IMPROVE RELIABILITY, FUNCTION OR DESIGN. FAIRCHILD
DOES NOT ASSUME ANY LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT
OR CIRCUIT DESCRIBED HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT
RIGHTS, NOR THE RIGHTS OF OTHERS.

LIFE SUPPORT POLICY

FAIRCHILD’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT
DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF FAIRCHILD SEMICONDUCTOR CORPORATION.
As used herein:
1. Life support devices or systems are devices or 2. A critical component is any component of a life
systems which, (a) are intended for surgical implant into support device or system whose failure to perform can
the body, or (b) support or sustain life, or (c) whose be reasonably expected to cause the failure of the life
failure to perform when properly used in accordance support device or system, or to affect its safety or
with instructions for use provided in the labeling, can be effectiveness.
reasonably expected to result in significant injury to the
user.

PRODUCT STATUS DEFINITIONS

Definition of Terms

Datasheet Identification Product Status Definition

Advance Information Formative or This datasheet contains the design specifications for
In Design product development. Specifications may change in
any manner without notice.

Preliminary First Production This datasheet contains preliminary data, and


supplementary data will be published at a later date.
Fairchild Semiconductor reserves the right to make
changes at any time without notice in order to improve
design.

No Identification Needed Full Production This datasheet contains final specifications. Fairchild
Semiconductor reserves the right to make changes at
any time without notice in order to improve design.

Obsolete Not In Production This datasheet contains specifications on a product


that has been discontinued by Fairchild semiconductor.
The datasheet is printed for reference information only.

Rev. E

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