Amkor Confidential 1

Packaging ICs to Survive the

Automotive Environment
Prasad Dhond l Sr. Director Quad Leadframe Products

Amkor Confidential 2
Agenda

End Market Opportunity

What We Do Differently for Automotive

Cu Wire in Automotive

Conclusion

Amkor Confidential 3
End Market Opportunity

Amkor Confidential 4
Automotive Electronic Systems
Powertrain Body Chassis
TAM: $22.7B TAM: $21.9B TAM: $21.8B
5-yr CAGR: 3% 5-yr CAGR: 5% 5-yr CAGR: 5%
Engine control Comfort, Antilock brakes,
unit, fuel injection lighting, HVAC traction control

Infotainment Instrument Safety

TAM: $17.5B
5-yr CAGR: 8% Cluster TAM: $8.9B
TAM: $8.9B 5-yr CAGR: 3%
A/V, centerstack,
5-yr CAGR: 6% Braking, airbag
telematics, HUD

ADAS
Aftermarket TAM: $5.5B EV/HEV
TAM: $5.7B 5-yr CAGR: 17% TAM: $5.2B
5-yr CAGR: -3% Park assist, 5-yr CAGR: 10%
blind spot det.

Source: Gartner, Dec 2013

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New Car Market
New vehicle sales growth largely from 5 yr CAGR of 9%
emerging markets – led by China 75% of TAM is analog & MCU

Source: IHS Automotive

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Addressing Challenges

Challenges Amkor Solutions

 Quality, reliability  Zero defect mindset
 Cost  BOM development
 Evolving requirements  Ability to invest

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What We Do Differently for Automotive

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Manufacturing Footprint
Korea
 Manufacturing facilities Japan
– All Amkor factories are TS 16949 China
certified and run HVM automotive Taiwan
products
Philippines
– Amkor Technology Philippines
(ATP) has Amkor’s largest base of
automotive qualified products, Malaysia
customers and OEMs Singapore

 Established processes and

systems for automotive
manufacturing

Amkor Confidential 9
J-Devices Acquisition
 Acquired Toshiba, Fujitsu and >$900M
Renesas Japan-based factories 2014
SALES
 Broad cooperation between
J-Devices and Amkor
Strategy:
 Automotive, industrial and Consolidate
consumer end markets and Fill

 Amkor’s 66% interest currently

treated as an equity investment
 Expect to increase ownership to
80% by 2016
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J-Devices in Japan
 Strong reputation in automotive
electronics segment
 Services the major
manufacturers in Japan and
worldwide
 Automotive packaging and test
= 43% of J-Devices business

J-Devices Total

Amkor Confidential 11
Amkor Package Families Popular in Automotive

SOIC, TSSOP, MLF®/QFN, TQFP, BGA, Stacked CSP, fcCSP, fcBGA, TMV®

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Zero Defect Mindset
Quality management systems in place

Automotive Controls

Automotive Process Flow

AEC Q-100 Qual Support

Amkor Confidential 13
Zero Defect Mindset
Quality management systems in place

Automotive Controls  Designated automotive equipment

 Certified operators
 Automotive lot identification
Automotive Process Flow

AEC Q-100 Qual Support

Amkor Confidential 14
Designated Automotive Equipment

Wafer Mount
Wafer Saw
Die Attach Sticker attached on
designated machine for
identification

Wirebond

Automold

Lasermark
Debur/Dejunk DTFS

Amkor Confidential 15
Designated Automotive Lines
DA Automotive Module WB Automotive Module

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Other Automotive Controls
 Automotive trained
and certified operators
 Process control
automation

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Zero Defect Mindset
Quality management systems in place

Automotive Controls  Recommended automotive

process flow

Automotive Process Flow

AEC Q-100 Qual Support

Amkor Confidential 18
Zero Defect Mindset
Quality management systems in place

Automotive Controls  AEC Q-100 grade 0 and beyond

 BOM characterization and rel
capability
Automotive Process Flow

AEC Q-100 Qual Support

Amkor Confidential 19
AEC Q-100 Qualification Test Flow
AEC-Q100 ambient operating temperature ranges
 Grade 0 (-40°C to 150°C)
 Grade 1 (-40°C to 125°C)
 Grade 2 (-40°C to 105°C)
 Grade 3 (-40°C to 85°C)
 Grade 4 (0 to 70°C)
“In Process”
Tests

Qualification tests
specifically related
to package and
assembly

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AEC Q-100 Test Group A
JEDEC J-STD-020, JESD22-A113
Test @ Room SAT

Precondition Precondition Precondition

Level 1 Level 2 Level 3
Test @ Hot
85°C, 85% RH, 168 hours 85°C, 60% RH, 168 hours 30°C, 60% RH, 192 hours

3x Reflow, 260°C

SAT
Test @ Hot Test @ Room

Temperature Cycling Unbiased HAST

High Temp Storage Life (45 units) Temp Humidity Bias
(77 units x 3 lots) (77 units x 3 lots)
Grade 0: (77 units x 3 lots)
Grade 0: 130°C/85% RH for 96 hours, or
175°C/1000 hours, 150°C/2000 hours 85°C/85% RH for 1000 hours
-55°C to 150°C for 2000 cyc 110°C/85% RH for 264 hours.
Grade 1:
Grade 1:
150°C/1000 hours, 175°C/500 hours
-55°C to 150°C for 1000 cyc JESD22-A118 JESD22-A101
(UHAST) (THB)
JESD22-A103 JESD22-A104

Test @ Room & Hot Test @ Hot Wirebond Pull Test @ Room Test @ Room & Hot

Amkor Confidential 21
AEC Q-100 Qual Tests in OSAT Scope
Stress Standard JEDEC Conditions AEC Q-100 Grade 0 AEC Q-100 Grade 1

MSL 1: 85°C/85% RH for 168 hours, unlimited floor life

MSL 2: 85°C/60% RH for 168 hours, 1 year floor life
Pre-conditioning
MSL 2a: 30°C/60% RH for 696 hours, 4 weeks floor life
MSL 3: 30°C/60% RH for 192 hours, 1 week floor life

-55°C to 150°C for

-55°C to 125°C for 1000 cycles -55°C to 150°C for 1000 cycles
Temperature Cycling
or -65°C to 150°C for 500 cycles 2000 cycles -65°C to 150°C for
500 cycles

Temperature Humidity Bias 85°C/85% RH for 1000 hours

130°C/85% RH for 96 hours

Unbiased HAST
or 110°C/85% RH for 264 hours

175°C for 1000 hours 150°C for 1000 hours

High Temp Storage Life 150°C for 1000 hours
or 150°C for 2000 hours or 175°C for 500 hours

Amkor Confidential 22
Cu Wire in Automotive

Amkor Confidential 23
Cu Wire for Automotive Applications
Market Acceptance
Amkor in volume production with
Cu wire across multiple customers

Reliability
Recent developments related
to PCC
Amkor Evaluations
Amkor BOM characterization and
evaluation efforts

Amkor Confidential 24
Cu Wire for Automotive Applications
Market Acceptance
Amkor in volume production with
Cu wire across multiple customers
Reliability
Recent developments related
to PCC
Amkor Evaluations
Amkor BOM characterization and
evaluation efforts
 Most major customers qualified or
qualifying Cu wire
 Volume production for infotainment
(CSP, leadframe) and engine control
Module (BGA) applications
 Increasing acceptance in other
applications
 Powertrain and chassis activity at
higher level
 Safety applications slower to adopt
Amkor Confidential 25
Cu Wire for Automotive Applications
Market Acceptance
Amkor in volume production with
Cu wire across multiple customers
Reliability
Recent developments related
to PCC
Amkor Evaluations
Amkor BOM characterization and
evaluation efforts
 Paper published by Bosch highlighting
concerns of PCC bond wire for very
stringent automotive applications
 HTSL testing done at Grade 0
 PCC passes AEC Q100 Grade 0 but
concerns regarding margin
 Amkor has seen similar issues during
internal Grade 0 testing
 PCC is still primary wire for Amkor
 Ongoing evaluations with PCC & bare Cu
Amkor Confidential 26
HTSL 1000h @ 175°C Results

Wire: Au Wire: PCC Wire: PCC

EMC: Standard EMC: Standard EMC: Low Sulphur

Amkor Confidential 27
Cu Wire for Automotive Applications
Market Acceptance
Amkor in volume production with
Cu wire across multiple customers
PCC Concerns
 AEC Q-100 Grade 0 evaluations being
run for TQFP, SOIC and MLF®/QFN
 Goal is to develop more robust BOM
for Grade 0

Recent developments related

 Evaluation matrix
to PCC − Wire type
Amkor Evaluations − EMC
Amkor BOM characterization and − Leadframe
evaluation efforts

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In Closing

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Summary
 Automotive assembly experience, capability and capacity
 Quality, reliability focus through “Zero Defect Mindset”
 AEC Q-100 qualified BOMs and reliability support

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Contact
 Prasad Dhond
– Sr. Director, Quad Leadframe Products
– Prasad.Dhond@Amkor.com
– Cell: 480-289-1869
– Office: 480-786-7516

Amkor Confidential 31
Q&A

Amkor Confidential 32
Thank You

Amkor Confidential 33