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PROTECTED
2543
Data Sheet
29317.2B
QUAD POWER DRIVERS
PROTECTED
1 16 QUAD POWER DRIVERS
Providing interface between low-level logic and power loads to
UDN/UDQ2543B 100 W, the UDx2543B and UDx2543EB quad power drivers combine
NAND logic gates and high-current bipolar outputs. Each of the four
independent outputs can sink up to 700 mA in the ON state. The
OUT4 1 16 IN 4 outputs have a minimum breakdown voltage (load dump) of 60 V and
a sustaining voltage of 35 V. The inputs are compatible with most
K 2 15 IN 3
TTL, DTL, LSTTL, and 5 V CMOS and PMOS logic systems.
OUT3 3 14 ENABLE
Over-current protection has been designed into each channel of
GROUND 4 13 GROUND the UDx2543B/EB and typically occurs at 1 A. It protects any one
channel from output short circuits with supply voltages up to 25 V.
GROUND 5 12 GROUND When the maximum output current is reached, that output stage is
driven linearly. If the over-current condition continues, that output’s
OUT2 6 11 V CC
thermal limiting will operate, limiting that output’s power dissipation to
K 7 10 IN 2 approximately 2.4 W. The outputs also include diodes for voltage
clamping with inductive loads such as relays, solenoids, or dc stepper
OUT1 8 9 IN 1 motors.
Dwg. PP-017-1 These devices are supplied in a 16-pin power DIP of batwing
construction (suffix ‘B’) to provide for maximum package power dissi-
pation. They are also available in a 28-lead PLCC (suffix ‘EB’) for
surface-mount applications. All devices are rated for continuous
operation over the temperature range of -20°C to +85°C (UDN2543B/
EB) or for use in automotive applications over an extended tempera-
ture range as the UDQ2543B/EB.
V CC K
OUTN
ENABLE
IN N
THERMAL
LIMIT
<<1 Ω
Dwg. FP-041
NOTE: These devices do not include an absolute thermal shutdown. Package power dissipation under fault conditions (2.4 W in the faulted
channel) must therefore be evaluated at maximum operating temperature.
UDN/UDQ2543EB CONNECTION
10
ALLOWABLE PACKAGE POWER DISSIPATION IN WATTS
ENABLE
OUT2
OUT1
IN 1
IN 2
NO
K
26
27
28
8
4
1
3
R θJT = 6°C/W NC
GROUND 5 25 GROUND
6 6 24
7 23
8 22
4
9 21
SUFFIX 'EB', R θJA = 36°C/W
10 20
2 GROUND 11 19 GROUND
NC VCC
SUFFIX 'B', R θJA = 43°C/W
15
16
14
12
13
17
18
0
IN 3
IN 4
K
NO
CONNECTION
OUT 4
OUT 3
SUPPLY
* Pulse test, allowable package power dissipation will be exceeded at increased ambient temperatures.
† All inputs simultaneously, all other tests are performed with each input tested separately.
2543
PROTECTED
QUAD POWER DRIVERS
0.430
MAX
0.280
0.240 0.300
BSC
1 8
0.070 0.100 0.005
0.045 BSC MIN
0.775
0.735
0.210
MAX
0.015 0.150
MIN 0.115
0.022
0.014 Dwg. MA-001-17A in
Dimensions in Millimeters
(Based on 1” = 25.4 mm)
0.508
0.204
16 NOTE 4 9
10.92
MAX
7.11
6.10 7.62
BSC
1 8
1.77 2.54 0.13
1.15 BSC MIN
19.68
18.67
5.33
MAX
0.39 3.81
MIN 2.93
0.558
0.356 Dwg. MA-001-17A mm
NOTES: 1. Exact body and lead configuration at vendor’s option within limits shown.
2. Lead spacing tolerance is non-cumulative
3. Lead thickness is measured at seating plane or below.
4. Webbed lead frame. Leads 4, 5, 12, and 13 are internally one piece.
2543
PROTECTED
QUAD POWER DRIVERS
0.013 19 11
0.021
0.219
0.191 0.026
0.032
0.456
0.450
INDEX AREA
0.495
0.050 0.485
BSC
0.219
0.191 25 5
26 28 1 4
0.020 0.456
MIN 0.450
0.165 0.495
0.180 0.485
Dwg. MA-005-28A in
Dimensions in Millimeters
(Based on 1” = 25.4 mm)
18 12
0.331
19 11
0.533
5.56
4.85 0.812
0.661
11.58
11.43
INDEX AREA
12.57
1.27 12.32
BSC
5.56
4.85 25 5
26 28 1 4
0.51 11.582
MIN 11.430
4.57 12.57
4.20 12.32
Dwg. MA-005-28A mm
NOTES: 1. Exact body and lead configuration at vendor’s option within limits shown.
2. Lead spacing tolerance is non-cumulative
3. Webbed lead frame. Leads 5 through 11 and 19 through 25 are internally one piece.
Allegro MicroSystems, Inc. reserves the right to make, from time to time, such departures from
the detail specifications as may be required to permit improvements in the design of its products.
Components made under military approvals will be in accordance with the approval requirements.
The information included herein is believed to be accurate and reliable. However, Allegro
MicroSystems, Inc. assumes no responsibility for its use; nor for any infringements of patents or
other rights of third parties which may result from its use.