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CuIn(S,Se)2 thin films prepared from a novel


thioacetic acid-based solution and their
Cite this: Phys. Chem. Chem. Phys.,
2014, 16, 7548 photovoltaic application†
Yian Xie,a Yufeng Liu,*a Yaoming Wang,a Xiaolong Zhu,a Aimin Li,a Lei Zhang,a
Mingsheng Qin,a Xujie Lüa and Fuqiang Huang*ab

Low-cost and high-yield preparation of CuInSe2 films is the bottleneck for promising CuInSe2-based
thin film solar cells. Here, we developed a simple, safe and cost-effective method using thioacetic acid
to fabricate the absorber films of CuIn(S,Se)2 (CISSe). Dissolution of Cu2O and In(OH)3 in thioacetic acid
was attributed to the strong coordination ability of S. The adhesive precursor solution can be prepared
without any heating, centrifugation and inert gas protection, superior to the previously reported
Received 6th January 2014, methods. The precursor CISSe layer was easily deposited in air by spin coating to ensure low cost.
Accepted 25th February 2014 Uniform and compact CISSe thin films with well-crystallized and pure-phased CISSe grains were
DOI: 10.1039/c4cp00045e obtained after one step annealing. The as-prepared CISSe thin films were successfully applied to
solar cells and a energy conversion efficiency of 6.75% was achieved. This facile preparation provides a
www.rsc.org/pccp low-cost and easy method to fabricate Cu-based thin film solar cells.

1. Introduction such as bad atomic stoichiometry control because of the wide


differences in the standard potentials of Cu, In, Ga and Se.19
Cu-based chalcopyrite is one of the most important light In contrast, pure precursor solution methods generally provide
absorber materials for thin film solar cells due to high absorp- a high yield, are simple in the scale-up process, and have
tion coefficients, good photo durability and a desired band gap precise stoichiometry control at the molecular scale.20,21 The
range. These materials include CuInS2 (CIS), CuInSe2 (CISe), hydrazine-based solution method has been successfully used to
CuIn(S,Se)2 (CISSe) and Cu(In,Ga)Se2 (CIGS) with record photo- fabricate high-efficiency thin film solar cells because of the
voltaic efficiencies of 12.5% (CIS) and 20.4% (CIGS) in lab.1,2 excellent ability of the solution to dissolve metal chalcogenides
However, the deposition of Cu-based absorbers by the vacuum- such as Cu2S and In2S3,9,22–24 Nevertheless, the highly toxic and
based methods (e.g. sputtering3,4 and co-evaporation5–7) involves explosive hydrazine is a barrier for the mass production of those
highcost and produces a lowyield, which hinders mass-production films. It is essential to develop a facile, green and low-cost method
of large-area solar cells. to prepare an air-stable precursor containing Cu, In and S
Non-vacuum solution-based deposition methods possess the (and/or Se), which is an important direction for the current
advantages of simplicity, high throughput and inherent low invest- non-vacuum CISSe-based solar cells.
ment requirements. So far, promising conversion efficiencies In this paper, we proposed a thioacetic acid-based solution
(410%) have been achieved.8,9 Solution-based deposition method to fabricate CISSe thin films. The raw materials copper(I)
techniques include nanoparticle ink-based techniques,10–12 oxide and indium(III) hydroxide were found for the first time
electrochemical depositions,13–15 pure precursor solution to be dissolved in a thioacetic acid-based solution with the
methods,16–18 etc. While nanoparticle ink-based techniques assistance of ammonia. Compared with other metal sources
usually involve complicated synthesis and purification processes, (metal chloride, nitrate, etc.), using Cu2O and In(OH)3 could
electrochemical depositions also have significant drawbacks lead to pure CISSe films without introduction of impurity
anions like Cl, N, etc. In addition, thioacetic acid was stable
a
CAS Key Laboratory of Materials for Energy Conversion, Shanghai Institute of enough to operate without inert gas protection, and it can be
Ceramics, Chinese Academy of Sciences, Shanghai 200050, P.R. China. easily removed completely by heating (boiling point, 93 1C), leading
E-mail: liuyf@mail.sic.ac.cn, huangfq@mail.sic.ac.cn; Fax: +86-21-52416360
b
to no carbon residue. A sulfide raw film was formed before
State Key Laboratory of Rare Earth Materials Chemistry and Applications, College
of Chemistry and Molecular Engineering, Peking University, Beijing 100871, China
annealing with thioacetic acid as the sulfur source, avoiding the
† Electronic supplementary information (ESI) available. See DOI: 10.1039/ long annealing time25 or usage of explosive H226 which was required
c4cp00045e in the annealing process for oxide raw films. More importantly,

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the metal ion and thioacetic acid form stable and soluble metal
complexes owing to the strong coordination ability of thioacetic
acid. Above all, thioacetic acid was an ideal sulfur source and
essential ligand in the precursor. The preparation process of the
precursor was simple and secure without heating, centrifugation20
and inert gas shielding.27 All processes could be operated in air
using the safe and stable precursor. Small molecule organic
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solvents (isopropanol, ethylene glycol, propylene glycol, etc.) could


Fig. 1 Scheme of the preparation process of CISSe thin films and CISSe
be easily evaporated, leading to a low carbon content in the final
thin film solar cells.
films. The starting materials were commercially available and
cheap, further lowering the cost. Uniform and compact CISSe thin
films with good crystallization and large grains can be obtained layer and a transparent conduct electrode (TCO). The Ag grid
through this facile solution-based method. The CISSe thin film electrodes were deposited by DC planar magnetron sputtering.
solar cells were successfully assembled and a conversion efficiency The solar cell area was then calculated to be 0.4 cm2
of 6.75% was achieved. by mechanical scribing. Fig. 1 illustrates the whole process
including deposition of CISSe thin films and fabrication of
CISSe solar cells.
2. Experimental
2.1. Precursor solution preparation 2.4. Characterization

All chemicals were used as received without further purifica- The crystalline and phase identification of the CISSe thin films
tion. 0.8 mM of copper(I) oxide (Cu2O, analytical grade) and was performed by X-ray diffraction (XRD Bruker D8 Focus)
2 mM of indium(III) hydroxide (In(OH)3, 98%) (Cu/In = 0.8) were using a monochromatized source of Cu Ka1 radiation (l =
added to a solvent mixture of 6 mL isopropanol (C3H8O, 0.15405 nm) at 1.6 kW (40 kV, 40 mA). Raman spectra were
analytical grade), 1 mL ethylene glycol (C2H6O2, analytical grade) recorded on a Thermal Dispersive Spectrometer using a laser
and 1 mL propylene glycol (C3H8O2, analytical grade). After stirring with an excitation wavelength of 532 nm at a laser power of
for a few minutes, 2 mL of thioacetic acid (CH3COSH, 93%) was 10 mW. UV-vis absorbance spectra were recorded from 500 to
added, and the color of the suspension turned from dark white 2000 nm on a Hitachi U-3010 spectrophotometer with a scanning
to black. Then ammonia was added into the suspension under velocity of 300 nm min 1. Top-view field emission scanning
continuous stirring at room temperature until an orange-red, electron microscopy (FESEM) images were acquired using a FEI
clear precursor solution was obtained. The other two precursor Sirion 200 by energy dispersive X-ray (EDS) analysis. Cross-sectional
solutions with a Cu/In of 0.9 and 1.0 were also prepared under FESEM images were acquired using a Hitachi S-4800 by EDS
identical conditions for comparison. analysis. The energy conversion efficiency of solar cells was
measured using a Keithley Model 2440 source meter under AM
2.2. Deposition of CISSe thin films 1.5 illumination. The external quantum efficiency (EQE) was
measured using a Newport QE system equipped with a 300 mW
The CIS thin films were deposited via a spin-coating method
xenon light and a lock-in amplifier.
from the as-prepared precursor solution on a fluorine-doped tin
oxide (FTO) transparent conducting glass or molybdenum-coated
soda-lime glass (SLG) substrates. Each layer was spin-coated at
1500 rpm for 20 seconds and subsequently dried on a heating
3. Results and discussion
plate at 300 1C for 3 minutes to evaporate the organic solvents. 3.1. Dissolution mechanism
Spin-coating and drying processes were performed several times A facile thioacetic acid-based solution method to fabricate
until the desired thickness was obtained. Finally, the CISSe thin CISSe thin films was proposed. Thioacetic acid was always
films were formed through one step sulfuration and selenization used in organic reactions but seldom applied for synthesis of
at 500 1C for 30 minutes in a graphite box annealing system inorganic sulfide.28–30 In this work, thioacetic acid was a special
with H2S gas and some elemental Se powders. constituent which assisted the dissolution of Cu2O and In(OH)3.
The S in thioacetic acid had a strong coordination ability to
2.3. Device fabrication coordinate with metal ions and form soluble and stable metal
CISSe-based thin film solar cells were fabricated with the complexes. However, a sulfide precipitate rather than a clear and
structure of glass/Mo/CISSe/CdS/i-ZnO/Al-doped zinc oxide transparent precursor was formed when thioacetic acid was
(AZO)/Ag. The Mo layer was deposited onto the SLG substrate added alone. So addition of alkali (NaOH, ammonia or amines)
by direct current (DC) planar magnetron sputtering. The was necessary to obtain the precursor solution. The alkali can
B60 nm thick CdS buffer layer was deposited on the CISSe draw off the H of –SH to exhibit the strong coordination ability
layer by chemical bath deposition (CBD). Then i-ZnO (B60 nm) of S. In our study, ammonia was chosen because it could be
and AZO (B800 nm) layers were deposited by radio frequency eliminated easily. The N in ammonia was not considered as the
(RF) magnetron sputtering on top of a CdS layer as the buffer dominant ligand to coordinate with metal ions because the

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dissolution could be achieved by adding NaOH instead of with the CIS raw film and a few of the Se atoms replaced S
ammonia. The dissolution procedure is shown below: atoms in the crystalline lattice of CIS below 400 1C. When the
annealing temperature was increased to 500 1C, the intensity
of XRD peaks of the CISSe phase increased significantly,
indicating the formation of the CISSe thin film with good
crystallization. Meanwhile, the diffraction peaks systematically
The dissolution process could be finished in five minutes under shifted to lower theta values compared with CIS since Se
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continuous stirring at room temperature. The precursor could be substituted for S in adequate amount. The XRD patterns of
directly used for spin-coating without any post-treatment and CISSe films with diverse Cu/In ratios annealed at 500 1C are
was stable for more than 3 months in air at 4 1C, indicating its shown in Fig. 2b. All of the diffraction peaks could be assigned
long-term stability. to the CISSe phase without any detection of the impurity peak.
Raman spectroscopy was used to further investigate the
3.2. Structural analysis composition of CISSe thin films. The Raman spectra of the
XRD analysis was performed to verify the crystallization of the as-obtained CIS and CISSe thin films annealed at different
as-prepared CIS and CISSe thin films on FTO glass. Fig. 2a temperatures with a Cu/In ratio of 0.8 are shown in Fig. 2c.
shows the XRD patterns of thin films annealed at different The peak at 300 cm 1 with a shoulder at around 328 cm 1 of
temperatures with a Cu/In ratio of 0.8. The observation of the as-obtained CIS thin film could be assigned to the typical
characteristic peaks of CIS with weak intensity and a broad molecular vibration of CIS.28 The full width at half maximum
shape indicated the formation of the CIS phase even before (FWHM) of the peak was comparatively wide, which was
annealing.25,26 The crystallization increased slightly after probably caused by the low crystallization of the CIS thin film,
annealing at 300 1C, and without an obvious increase after consistent with the XRD result.31 After annealing at 300 1C, a
annealing at 400 1C. The diffraction peaks rarely shifted to a relatively weak peak appeared at 194 cm 1 in addition to the
lower theta value, which indicated that Se vapor hardly reacted vibration of CIS, suggesting the formation of CISSe, as the peak

Fig. 2 (a) XRD patterns and (c) Raman spectra of the CIS raw film and CISSe films annealed at different temperatures for 30 minutes. (b) XRD patterns and
(d) Raman spectra of CISSe films with different Cu/In ratios after annealing at 500 1C for 30 minutes. JCPDS files: CuInS2 (85-1575), SnO2 (88-0287).

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Table 1 Cu/In ratio at each processing step, measured by EDS processing step with different Cu/In ratios in the precursor
solution. However, the Cu/In ratios in CISSe thin films were
Precursor solution (calculated) Raw film Annealed at 500 1C
a little less than that in the precursor solution. Given that the
0.80 0.74 0.76 Cu/In ratios in CIS raw thin films were almost the same as that
0.90 0.88 0.87
1.00 0.98 0.98 of the annealed CISSe thin films, this loss of Cu might be
caused by the formation of volatile Cu-organic species in the
precursor solution which were volatilized in the spin-coating
position was located between that of CIS at 300 cm 1 and CISe at
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process.25 As shown in Fig. 3a, the Cu/In ratios in annealed


179 cm 1. After annealing at 400 1C, the peak intensity was CISSe thin films could be effectively adjusted by controlling the
enhanced with position shifting from 194 cm 1 to 199 cm 1, Cu2O and In(OH)3 components in the precursor solution.
indicating an increased Se/S ratio in the annealed thin film. When As calculated from the UV-vis absorption measurements
the annealing temperature increased to 500 1C, the typical Raman (Fig. S2, ESI†), the band gap Eg of CISSe thin films annealed
peak of CISe was found at 179 cm 1 with a shoulder at around at 500 1C could be slightly adjusted by the Cu/In ratios (Fig. 3a).
214 cm 1. Additionally, one small peak at 295 cm 1, near the peak The Eg values of CISSe thin films deposited from the precursor
at 300 cm 1 of CIS, indicated the formation of CISSe thin films. solution with Cu/In ratios of 0.8, 0.9, and 1.0 were 1.18 eV,
The high intensity with narrow FWHM of the peak at 179 cm 1 1.14 eV, and 1.09 eV, respectively.
showed the good crystallization of the annealed thin film, Otherwise, the S/(S + Se) ratios in CISSe thin films (Cu/In =
consistent with the XRD result as well. Considering the stronger 0.8 in the precursor solution) decreased with increasing
peak intensity of CISe at 179 cm 1 with the weaker peak intensity annealing temperature, as shown in Fig. 3b. When the anneal-
of CIS at 295 cm 1, the Se content was much more than the S ing temperature was below 400 1C, the S content accounted for
content in the annealed CISSe thin films. Furthermore, a weak more than 50% in CISSe thin films. The relatively high Se
peak near 258 cm 1 should come from copper selenide15 at an content (440%) could be originated from the copper selenide
annealing temperature below 400 1C, suggesting the appearance and preliminary formation of the CISSe phase, suggested by the
of copper selenide at low temperature. However, this weak peak XRD and Raman results. The S content decreased obviously
disappeared and no other signal of copper sulfides and selenides after annealing at 500 1C, which could be attributed to the
was detected when the annealing temperature reached 500 1C. As substitution of Se with S in the crystalline lattice and the
shown in Fig. 2d, copper selenide could still be detected for CISSe formation of the CISSe phase. The band gap Eg of the annealed
thin films deposited with Cu/In ratios of 0.9 and 1.0 solution after thin films changed with the annealing temperature, namely the
annealing at 500 1C, and the peak intensity of copper selenide S/(S + Se) ratios. As the annealing temperature increased, the Eg
increased with the increasing Cu/In ratios. As we can see from decreased from 1.42 eV to 1.18 eV due to the increasing
Fig. S1 (ESI†), copper selenide was formed after the low tempera- Se content in thin films (Eg of CuInS2: 1.52 eV, Eg of CuInSe2:
ture annealing process, the same as that observed in the case of a 1.04 eV), as shown in Fig. 3b.
Cu/In ratio of 0.8. Therefore, the residual copper selenide phase in
CISSe films probably resulted from the copper selenide that arose
at an early stage of the annealing process and could not be 3.4. Absorber morphology
eliminated to form a single CISSe phase after annealing at 500 1C. The morphology of as-prepared CISSe thin films was studied by
FESEM. The top-view FESEM images of CISSe films with a Cu/In
3.3. Composition and optical band gap ratio of 0.8 annealed at different temperatures are shown in
EDS was used to measure the content of elements in thin films. Fig. S3 (ESI†). No grain was formed and the surface appeared
Table 1 summarizes the changes in the Cu/In ratios at each amorphous in the CIS raw film. When the annealing temperature

Fig. 3 (a) Cu/In ratio and Eg variation in CISSe thin films annealed at 500 1C as a function of the composition of Cu, In precursor solution (molar ratio of
Cu2O to In(OH)3). (b) S/(S + Se) ratio and Eg variation in CISSe thin films (Cu/In = 0.8 in precursor solution) as a function of the annealing temperature.

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as a flux agent in the annealing process.33 The cross-sectional


FESEM image of the CISSe thin film with a Cu/In ratio of 0.8
annealed at 500 1C is shown in Fig. 4d. The thickness of the
CISSe thin film was about 1 mm and relatively large grains were
obtained. Quite large grains were observed from cross-sectional
images of CISSe films with Cu/In ratios of 0.9 and 1.0, as shown
in Fig. S4 (ESI†). Based on the elemental profile of the CISSe
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thin film shown in Fig. S5 (ESI†), no gradient distribution of all


elements in the depth profile was observed. The carbon content
was very low (Fig. S5, ESI†) in CISSe thin films,16,34 which was a
benefit of the easy evaporation of all the small molecule
solvents. Grain growth was not hampered by such low carbon
content therefore a large grain size layer was formed without
formation of the residual carbon layer.

Fig. 4 Top-view FESEM images of CISSe films annealed at 500 1C for 3.5. Prototype device
30 minutes with different Cu/In ratios (a) 0.8, (b) 0.9, (c) 1.0 and (d) cross-
sectional FESEM image of CISSe film annealed at 500 1C for 30 minutes CISSe thin films with diverse Cu/In ratios annealed at 500 1C
with a Cu/In ratio of 0.8. were chosen to fabricate thin film solar cells. Solar cells were
fabricated with the structure of glass/Mo/CISSe/CdS/i-ZnO/AZO/
Ag. The device properties measured under AM 1.5 with different
Table 2 Summary of devices properties with different Cu/In ratios Cu/In ratios are summarized in Table 2, and Fig. 5a shows the
typical I–V characteristics of the best device with a Cu/In ratio of
Cu/In ratio Voc (V) Jsc (mA cm 2) FF (%) Z (%) Rs (O) Rsh (O)
0.8. The I–V characteristics of devices with Cu/In ratios of 0.9
0.8 0.443 30.39 50.23 6.75 14.7 487.5
and 1.0 are provided in Fig. S6 (ESI†). The conspicuous
0.9 0.301 26.27 33.56 2.65 23.9 92.8
1.0 0.220 26.99 36.42 2.17 13.5 62.0 decrease of shunt resistances (Rsh) with increasing Cu/In ratios
was attributable to the serious shunt paths and short circuit
caused by the conductive copper selenide phase in the absorber
was below 400 1C, small grains were observed with a grain size layer.33 As a result, the open circuit voltage (Voc),35 as well as the
smaller than 100 nm, leading to the low crystallization of the fill factor (FF), decreased significantly leading to the low
thin film. A dense and compact film was formed until the performance of the devices. On the other hand, the Voc of the
annealing temperature reached 500 1C, as shown in Fig. 4a. On best device (443 mV) was much lower than that reported by Liu
the other hand, the grain size increased with increasing Cu/In et al.,23 which may be caused by recombination through the
ratios. However, large rounded grains were formed when the interface, the space charge region or the bulk of the absorber
Cu/In ratio was higher than 0.9 (Fig. 4b), even some pores could layer.36 The relatively small band gap (low S content: 17.8%)
be found in CISSe films with a Cu/In ratio of 1.0 (Fig. 4c). These may have resulted in lower Voc as well. Composition optimiza-
rounded grains should be caused due to the low melting point tion and Ga incorporation could further improve Voc. The
(525 1C)32 of the residual copper selenide in films which acted external quantum efficiency (EQE) data of the best device

Fig. 5 (a) Current–voltage (J–V) curve of the best CISSe-based thin film solar cell with a Cu/In ratio of 0.8 under a standard AM 1.5 solar illumination at
an intensity of 100 mW cm 2. (b) EQE spectrum of the best CISSe-based thin film solar cell without any applied bias.

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(Fig. 5b) showed that the efficiency stayed at around 60% at 3 N. Romeo, A. Bosio, S. Mazzamuto, D. Menossi, A. Romeo,
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This work was financially supported by the National 863 20 G. Wang, S. Wang, Y. Cui and D. Pan, Chem. Mater., 2012,
Program of China (Grant 2011AA050505), the National Science 24, 3993–3997.
Foundation of China (Grant No. 91122034, 51125006, 51121064, 21 M. Kar, H. W. Hillhouse and R. Agrawal, Thin Solid Films,
61376056, 61106088, 61204072, 51102263, 61205177), and 2012, 520, 5431–5437.
Science and Technology Commission of Shanghai Grant (No. 22 W. W. Hou, B. Bob, S. H. Li and Y. Yang, Thin Solid Films,
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23 W. Liu, D. B. Mitzi, M. Yuan, A. J. Kellock, S. J. Chey and
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