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Key features and benefits Specifications
• RAD750 V2 or V3 processor throughput of up to 500 SpaceVPX Slot profiles:
Dhrystone million instructions per second offers up to 2x System controller without data plane
higher throughput than earlier RAD750 SBCs Module profiles:
• With the optional 1 MByte L2 cache, the RAD750 V2 Controller: MOD6-CON-4T12U-12.6.2-21-22
can efficiently handle larger programs and data at lower Mechanical size: 6U-220
latency for enhanced system performance Card pitch: 1.2 inches
• Radiation-hardened SRAM with error correction and Cooling: conduction
up to 128 Mbytes of capacity offer the largest high Power profile
reliability main memory capacity of any RAD750-based 5.0 V (+/- 10%): 2.163 Amps
SBC, supporting more complex applications in very 3.3 V AUX: 0.033 Amps
stringent environments User-defined I/O: Differential
• Designed for insertion into the SpaceVPX backplane Temperature Operating at -55 to +125 degrees Celsius
to support the SpaceWire control plane and system Radiation- Total ionizing dose: 100 Krad (Si)
management inter-integrated circuit utility plane for hardness Single event upset: 3.5e-3 upsets/card-day
interoperability with other SpaceVPX-compliant boards (with L2 cache and 128 MB of SRAM)
Latchup immune
• Triple modular redundant flash memory enables high-
density non-volatile storage with high reliability Power 10.9 Watts at 95 degrees Celsius and +5 percent
dissipation voltage
• Redundant MIL-STD-1553B and 32-bit parallel PCI Interfaces Up to 4 SpaceWire serial links to the backplane up
interfaces provide connection to legacy hardware,
to 256 Mb/s each
supporting backwards compatibility with existing
components and systems I2C and related utility plane control signals
Redundant A/B MIL-STD-1553B
• For flexibility, the MIL-STD-1553B interface may be sent 32-bit, 33 MHz parallel PCI
either to the backplane or the header
JTAG test and debug