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Surface and Coatings Technology 88 (1996) 70-78

Microstructural evolution in pulse plated nickel electrodeposits


A.M. El-Sherik as*, U. Erb a, J. Page b
aDepartmentof Materials and Metallurgical Engineering, Queen’s University, Kingston, Ontario, Canada K7LN36
b Chemistry Department, Queen’s University, Kingston, Ontario, Canada K7L3N6
Received10May 1995;acceptedin final form 30April 1996

Abstract

Square-wavecathodic current modulation wasusedto electrodepositultra-fine-grainednickel from an additive-freeWatts bath.


The influenceof pulseparameters,namely,pulseon-time,off-time and peak current density on the grain size,surfacemorphology
and crystal orientation was determined.The study showed that an increasein peak current density resultedin considerable
refinementin crystal sizeof the deposit.The crystal orientation progressivelychangedfrom an almostrandom distribution at the
lowest peak current density of 400 mA cm-’ to a strong (200) texture at a peak current density of 1600mA cm-‘. At constant
peak current densityand off-time, the crystal sizeof the depositwasfound initially to decreasewith pulseon-timebeforeit started
to increasewith further increasein on-time.The crystal orientation progressivelychangedfrom an almostrandomdistribution at
the shorteston-time of 1 ms to a strong (200) fibre texture at an on-time of 8 ms. An increasein the pulseoff-time at constant
on-time and peak current density resultedin a progressiveincreasein crystal size. However, the crystal orientation remained
unaffectedwith increasingoff-time.

Keywords: Nickel electrodeposition;Microstructure

1. Introduction higher instantaneous current density in comparison to


direct current plating [7], pulse plating has received
The grain size, surface morphology and preferred considerable attention in recent years as an economically
orientation of thick nickel electrodeposits depend on viable processing technique for producing nanocrystal-
both the electrolysis conditions and the electrolyte com- line materials [8]. These materials with grain sizes in
position [I]. It has been shown [2-4] that nickel the order of 10 nm are of considerable interest due to
electrodeposits produced from an organic-free Watts their unique and, in many cases, improved properties
bath under DC conditions develop (200), (220), (420) over their coarser-grained counterparts [9].
or (422) preferred orientations. This textural develop- In general, the results of pulse-plating experiments
ment in nickel deposits has been attributed to the obtained by different researchers are difficult to compare
existence or formation of different interfacial inhibitors and, in many cases, contradictory. This is because of (1)
such as Hz, Had8 or Ni(OH),, in the nickel-electrolyte the complexity of the electrodeposition process, (2) the
interface during the deposition process [ 1,5]. These rather large number of experimental variables involved
interfacial inhibitors were also found to affect the surface in pulse plating and (3) the lack of a standardized
morphology of electrodeposits [6]. It was argued that procedure in investigating the general effect of a particu-
the selective adsorption of these species on the metal lar pulse-plating parameter. Regarding the last point,
surface can affect the growth mode of the crystals most researchers (e.g., [ 10,111) usually cite the influence
CL5,61. of duty cycle, y, where y = To&& + T,,,), or pulse fre-
Pulse electrodeposition has been found to be an quency, J; where f= l/(Ton+ Ton), on deposit structure
effective means of perturbing the adsorption-desorption and morphology. However, these are extracted mathe-
processes occurring at the nickel/electrolyte interface matical quantities from the actual pulse parameters,
and hence offers an opportunity of controlling the micro- namely, pulse on-time (Z&J and pulse off-time (T,,,), and
structure of nickel electrodeposits [5]. Because of the therefore do not reflect the effects of 7’&, or 7&r sepa-
rately. For example, Tai-Ping Sun et al. [lo] and also
* Corresponding author. Kim et al. [ 1 l] studied the effect of pulse on- and off-
0257~8972/96/$15.00 0 1996 Elsevier Science S.A. All rights reserved
PII SO257-8972(96)02928-3
A.M. El-Sherik et aL/Surface and Coatings Techrzology 88 (1996) 70-78 11

time on electrodeposition of nickel, by varying the pulse electrodeposits prepared under well-defined pulse
frequency at constant duty cycle and peak current parameters and (2) to produce ultra-fine-grained nickel
density. However, by varying the pulse frequency in electrodeposits from organic-free Watts bath.
this manner, both the on-time and off-time change
simultaneously and hence it is difKcult to ascertain the
influence of on-time or off-time separately. 2. Experimental procedure
Similarly, the effect of peak current density on the
crystal size of the deposit is commonly investigated in A conventional Watts-type solution, as shown in
two ways [ 121: one way is to increase JP at a constant Table 1, in a standard 2-l reaction kettle was used to
on-time and constant average current density, J, , where produce approximately 300~urn thick nickel electro-
J,=J, . y, as represented in Fig. 1. This method has deposits. Analytical grade chemicals and distilled water
the disadvantage that the off-time cannot be kept con- were used to prepare the solutions. The bath temperature
stant, and hence the observed effect on the microstruc- was maintained at 60 5 O.lo”C and its pH was adjusted
ture of the deposit could be due to increased off-time to 4.5 by adding nickel carbonate.
and/or higher JP [ 121. One can also increase Jr, at a A high purity (99.99%) electrolytic nickel sheet con-
constant pulse charge (i.e., the number of coulombs per tained in a titanium mesh basket was used as the soluble
pulse is kept constant) and at a constant average current anode. Its surface area was approximately 10 times
density, J, ClZ]. Although the Z’& is then only very greater than that of the cathode to ensure that there
slightly changed, To, changes considerably, as can be were no problems arising from anode polarization, par-
seen in Fig. 2, and hence it becomes difficult to ascertain ticularly at high current densities [13]. The cathode
the effect of J, on the microstructure. substrate was made of titanium sheet with an exposed
The aim of this paper is two fold: (1) to investigate surface area of 1 or 2 cm2, which was ground on 600
the structural and morphological modifications of nickel grit SiC paper. The anode was placed at a distance of
6 cm from the cathode. The nickel electrodeposits were
electroplated onto the Ti cathode and subsequently
mechanically stripped for microstructural char-
? . TO, :: Toff * acterization.
JP Electrodeposition was carried out galvanostatically
------------ -_ ___ 1 _
nr using square-wave pulsed current with current cut-off
:_ ’ tJm during the interval between the pulses. The plating
0 t
parameters were varied within a range which has pre-

I r viously been shown [14] to produce extremely fine-


grained (i.e., nanocrystalline) deposits from a Watts’ bath
containing saccharin. These parameters are summarized
in Table 2. It is clear from this table that the plating
times and the ,average current densities varied as a
function of the plating duty cycles so that electrodeposits
Fig. 1. Scheme for investigating changes in Jp with constant pulse
on-time and constant average current density (adapted from Ref. [ 121): of 300-urn thicknesses were produced. This was necessary
J,, average current density; Jr,, peak current density; T,,, pulse dura- to eliminate possible thickness effects on morphology
tion; and T,, pulse off-time. Waveform as generated by pulse power and preferred orientation. The peak current densities
supply. were computed based on the geometric cathode area
and no corrections were made for the actual surface

w_) Ton
_‘ +&yg?, JP
TOE l -
roughness of the deposit.
The pulse parameters were selected such that in all
cases the pulse on-time was less than the transition time,

I- I’----- ;+pg 41 ---------A-- z (the time required for the interfacial concentration to
reach zero [15J) and much longer than the charging
tJm
0 t
Table 1
Bath composition and plating conditions for Ni deposition from
Watts-type baths

NiS04. 7Hz0 300 g/l


NiC1,.6H,O 4.5g/l
Boric acid 45 g/l
PH 4.5
Fig. 2. Scheme for investigating changes in Jp with constant (J; T,,,) Temperature 60°C
and T,, The shaded areas are equal (adapted from Ref. [ 121).
72 A.M. El-Sherik et al./Surface and Coatings Technology 88 (1996) 70-78

Table 2
Range of pulse-plating parameters investigated in this study

T,, W T,ff bs) Current density, (mA cm-‘) Duty cycle (%) Plating time (min)

JP Jl?i
1 15 400 2.5 6 194
3 15 400 68 17 71
5 15 400 100 25 48
8 15 400 140 35 35
1 5 400 68 17 71
1 15 400 25 6 194
1 22 400 17 4 215
1 32 400 12 3 403
1 42 400 9 2 537
1 15 400 25 6 194
1 15 800 75 6 64
1 15 1600 100 6 48

time, t, in microseconds, of the double layer as calculated are not due to the influence of mass transport phen-
from Eq. (1) and Eq. (2), respectively [ 16,151. omena [ 121.
Macrographs of all nickel electrodeposits were taken
z = {~D(C,)Z(ZF)2)/4(5,)2 (1) using a 35-mm camera equipped with a macrolens
t, = 17/J, (2) attachment. Scanning electron microscopy was used for
the observation of the surface morphology of the
where J, is the peak current density (A/cm2), z is the
as-plated surface of the electrodeposits. SEM micro-
number of electrons (2, for the case of nickel), F is
graphs were taken normal to the as-plated surface at
Faraday’s number (96,500 coulombs), C, is the bulk
magnifications up to 10 000 x . For fine-grained electro-
concentration of Ni2” ions (mol/L) and D is the diffusion deposits dark-field transmission electron micrographs
coefficient of Ni2+ (cm2/sec). In addition, the pulse off- were taken for the examination of the structure. Thin
time was selected such that the shortest pulse off-time
foils for transmission electron microscopy (TEM) exami-
was several orders of magnitude longer than the dis-
nation were prepared by electropolishing using an
charge time, td, of the double layer as calculated from
electrolyte comprising 6% perchloric acid, 15% methanol
equation (3) I: 161.
and 79% acetic acid at a temperature of -10°C and a
td = 120/J, (3) voltage of 15 V d.c. The grain size of these electrodeposits
was determined directly from dark field transmission
where td and Jp are as defined above in @s) and
electron micrographs by measuring approximately 250
(A mm2), respectively.
grains. X-ray diffraction patterns were obtained using
In calculating z, a bulk concentration (C,= Cu-Ka radiation (A= 1.54184 A) on a standard 8-20
1.26 mall-I) of nickel ions as calculated from the
diffractometer.
total Ni content given in Table 1 was used. In addition,
for the diffusion coefficient of nickel ions in solution the
value of D=0.76 x 10m5 cm2 s-i was used [ 171. The
limitation pertaining to the transition time is important 3. Results and discussion
so that the depletion of Ni2+ cations in the pulsating
diffusion layer at the end of the pulse is small [ 121.
The range of current densities shown in Table 2 was 3.1. Effect of on-time
selected such that the highest average value (140
mA cm-“) was well below the limiting current density Table 3 illustrates the pulse-plating parameters and
for the bath used in the present work. Although a average current densities, J,, used to investigate the
measurement of the limiting current density was not effect of pulse on-time on crystal size, surface morphol-
conducted in the present study, it is safe to assume that ogy and crystal orientation of these deposits. Fig. 3
its value is higher than 240 mA crnm2 as previously shows the surface morphologies and the macrographs
measured for d.c. plating using a Watts’ bath with similar (insets) of the nickel deposits obtained at pulse on-times
composition and operated at 52°C and a pH of 4 [ 171. of 1, 3, 5 and 8 ms. The pulse off-time and the peak
The limitation on the average current density is impor- current density were kept constant at 15 ms and 400
tant so that the depletion in the stationary diffusion mA cmm2, respectively (see Table 3). It is obvious from
layer is small and the microstructural changes, therefore, the optical insets that at the shortest on-time (Fig. 3a)
A.M. El-Sherik et al./Swface and Coatings Technology 88 (1996) 70-78 73

Table 3 a Watts-type bath. Similarly, the increase in hydrogen


Plating parameters used to investigate the influence of pulse on-time evolution was explained in terms of an increase in
T,ff (m4 Current density (mA cm-“) overpotential for longer on-times [19].
Closer examination of the deposit surface in the SEM
JP J, revealed subtle changes in the deposit morphology. It
1 15 400 25 can be seen that for the shortest on-time (Fig. 3a), the
3 15 400 68 surface morphology of the deposit consists of large
5 15 400 100 (1-5 pm) well-facetted pyramidal-shaped crystal&es sur-
8 15 400 140 rounded by unfacetted finer grains. The pyramidal
growth is typical of a field-oriented texture, which exhib-
its preferential growth habit in the direction of the
electric field [20]. Increasing the pulse on-time led to a
decrease in size of the large pyramidal-shaped crystallites
and, ultimately, to their complete disappearance and
replacement with the finer unfacetted structure at an
on-time of 5 ms (Fig. 3~). However, a further increase in
the on-time to 8 ms resulted in the reappearance of the
larger crystallite structure (Fig. 3d).
The initial change in the deposit surface structure
from large and facetted crystallites at the shortest
on-time (Fig. 3a) to a finer structure for pulse on-time
of 5 ms (Fig. 3c) supports our argument that the depos-
ition overpotential may have increased, leading to finer
crystal size deposits [12]. The increase in deposition
overpotential at longer on-times may, in part, be attrib-
uted to the fact that at longer on-times a decreasing
portion of the on-time is used for charging the double
layer resulting in an increase in the faradaic current and
thus higher (more negative) cathode overpotential [ 191.
Fig. 3. Influence of T,, on surface morphology of 30091 thick nickel The larger concentration polarization resulting from the
deposits with constant T& of 15 ms and Jr of 400 mAcme2: (a) increased thickness of the pulsating diffusion layer at
T,,,=l ms; (b) To,=3 ms; (c) Z&,=5 ms; and (d) T,,=S ms.
longer on-times can also lead to higher deposition
overpotentials [ 213. Another plausible explanation for
the deposit surface was smooth with no apparent pits. the refinement in crystal size with increased on-time is
However, longer on-times resulted in an increase in the that longer on-times lead to an increase in the amount
number and size of pits on the deposit surface. It is of hydrogen evolved. This in turn shifts the pH of the
believed that these pits are the result of hydrogen gas nickel/electrolyte interface toward more basic values,
bubbles which remain attached to the cathode surface enhancing the adsorption and co-deposition of basic
for extended periods of time [6,18]. Increasing densities insoluble compounds such as Ni(OH)2. The adsorption
of hydrogen gas bubbles at the cathode surface at longer or incorporation of these insoluble species at the active
on-times is indicative of a higher (m&e negative) overpo- growth sites is believed to have growth-inhibiting effect,
tential for nickel deposition. This is consistent with the leading to a finer-grained equiaxed structure [ 191.
work by Abdulin et al. [19] who reported that the The re-appearance of large grain structure at the
amount of evolved hydrogen increased with increasing longest on-time of 8 ms (Fig. 3d) may be explained in
on-time during pulsed electrodeposition of nickel from terms of the redistribution of the partial currents for
reduction of nickel and hydrogen ions. At such a long
Table 4
Plating parameters used to investigate the influence of off-time on-time, it is believed that a larger portion of the applied
current is consumed by the hydrogen ion reduction
T, @s) Gf (ms) Current density (mA cmM2) reaction leading to lower efficiency for nickel deposition
and coarser grains [ 191. Yoshimura et al. [21] reported
JP Jnl such a decrease in the current efficiency for palladium
1 5 400 67 deposition and a corresponding increase in co-deposited
1 15 400 25 hydrogen at longer on-times.
1 22 400 17 The influence of on-time on the crystal orientation of
1 32 400 12 the nickel deposits at constant peak current density of
1 42 400 9
400 mA cmm2 and off-time of 15 ms is illustrated in
A.M. El-Sheiik et al.JSurfuce and Coatings Technology 88 (1996) 70-78

111)(200)
Fig. 4a. For comparison purposes, an X-ray diffraction
(220) (311)(222)
pattern for a standard Ni powder showing peak inten-
sities for a random grain distribution is also represented
in Fig. 4b. It is clear from Fig. 4a that longer pulse
on-times lead to a progressive change in the crystal
orientation from an almost random texture to a strong
(200) fibre texture. The observed transition in crystal
orientation may be attributed to the effect of increased
8msec
pulse on-times on: (1) the depletion of cations at the
cathode film; (2) the overpotential; (3) the thickness
of the pulsating diffusion layer; (4) hydrogen
adsorption/evolution; and (5) other adsorption pro-
b 1 1 . 5msec cesses. However, it is difficult to assess how these
variables separately or in combination could have caused
the observed transition in crystal orientation.

3.2. Efect of off-time


j/J ~ h _ 3msec
Fig. 5 shows nickel deposits obtained at pulse off-
times of 5, 15, 22, 32 and 42 ms with constant on-time
of 1 ms and a peak current density of 400 mA cm-’ (see
Table 4). The low magnification optical insets clearly
show that hydrogen gas cavities are apparent on the
surface of the deposits produced at the shortest off-time
(Fig. 5a). It is reasonable to assume that in this case the
40 60 80 100

(4 2 THETA (DEG.)

:lll)(Boo) (220) (311)(222)


I / / I ,

60 80 100

(b) 2 THETA (DEG.)


Fig. 4. (a) XRD patterns showing the influence of T,, on the crystal Fig. 5. Influenceof T&r on surface morphology of 300qm thick nickel
orientation of nickel deposits with constant JP of 400 mA crnm2 and deposits at constant T,, of 1 ms and J, of 400 mA cm-*: (a) &=5
TOEof 15 ms. (b) XRD pattern of a random nickel powder sample. ms; (b) T,,= 15 ms; (c) Z&= 22 ms; (d) Tan= 32 ms; and (e) T,,= 42 ms.
A.M. El-Sherik et al./Swface and Coatings Technology 88 (1996) 70-78 75

Table S
Plating parameters used to investigate the influence of peak current 111)(200) (220) (311)(222)
density

T,, W T,fi W Current density (mA cmW2)

JP J,
1 A n R - ‘42msec
1 15 400 25
1 15 800 75
1 15 1600 100

off-time was too short for sufficient replenishment of 32msec


the Nizi- cations at the cathode surface. This resulted in A c

a significant drop in the concentration of these cations


at the pulsating diffusion layer leading to a side reaction,
in this case hydrogen evolution. A further increase in
the off-time led to the relaxation of the pulsating diffu-
sion layer and, in turn, to increased replenishment of I 22msec
Nizf. The reduced hydrogen evolution reaction is
believed to lead to the disappearance of the hydrogen
gas cavities on the deposits surface [6].
SEM micrographs of these deposits (Fig. 5a-e) show
microstructures with grain sizes in the micrometer range.
Fig. 5a shows that at the lowest o&time the deposit
surface consisted of very few well-facetted crystallites
surrounded by finer structure. However, further increase 40 60 80 100
in off-time resulted in a progressive increase in the size
and number of the pyramidal-shaped crystals and a 2 THETA (DEG.)
corresponding decrease in the surrounding fine-struc-
Fig. 6. XRD patterns showing the influence of TO, on the crystal orien-
tured matrix. It has previously been suggested that tation of nickel deposits with constant Jp of 400 mA cmT2 and T,, of
longer off-time leads to some sort of a desorption 1 ms.
process, most likely Ni(OH)2 crystals and/or Hz mole-
cules which result in an activation of growth centres and
thus larger grain sizes [5]. Another plausible explana- diffusion layer and (2) the desorption or the retrodiffu-
tion for the coarser grains with well-defined facets is sion of colloidal Ni(OH), and/or hydrogen away from
that, during longer off-times, the nickel adatoms have the cathode surface [ 51. Then it may be concluded that
more time to migrate over the crystal surface prior to the electrodeposition conditions induced by both
their incorporation into the solid. on-times predominated over any effects due to longer
Fig. 6 and Fig. 7 show the influence of off-time on the off-time. As a result, the crystal orientation attained at
crystal orientation of the deposits produced at two the shortest off-time remained unchanged with further
different pulse on-times of 1 and 8 ms, respectively but increase in off-time.
with a constant peak current density of 400 mA cmm2.
These XRD patterns show that in case of the shortest 3.3. Effect ofpeak current density
on-time (Fig. 6) the crystal orientation is almost random;
however, the crystal orientation changed to (200) at the Fig. 8 is a schematic representation showing the
longest on-time (8 ms) tested (Fig. 7). This is consistent method used in the present study to increase J,. It is
with the XRD patterns (Fig. 4a) and the arguments clear from this figure that while J, increased, both To,
presented in Section 3.1. Furthermore, Fig. 6 and Fig. 7 and Toff remained constant. Therefore, the microstruc-
show that at each on-time, the increase in off-time had tural and textural modifications can solely be attributed
no effect on the crystal orientation of the nickel deposits. to changes in JP. It should be noted that at lower J,,
Therefore it may be ,reasonable to conclude that the off- the total plating time had to be longer as compared to
time is a “dead time” with respect to changes in crystal the time required at higher J,. This was necessary so
orientation of nickel deposits. Under these electrodeposi- that deposits of equal thicknesses were produced.
tion conditions (constant on-time and peak current Fig. 9 shows the influence of the pulse peak current
density), the increase in off-time is expected to increase density on the macrostructure and surface morphology
( 1) the replenishment of Ni2’ cations in the pulsating of nickel deposits obtained at peak current densities of
A.M. El-Sherik et al./Surfuce and Coatings Technology 88 (1996) 70-78

:111)(200) (220) (311)(222)

J # a :42mec

d _ h _ 3211x.x

‘)I L I\ -22msec
Fig. 9. Influence of J, on surface morphology of 300~pm thick nickel
deposits with constant &r of 15 ms and T,, of 1 ms: (a)
J,=400mAcm-2; (b) J,=800mAcm-2; and (c) JP=1600mAcm-2.

nickel from Watts bath. The higher magnification SEM


micrographs show that increasing the peak current den-
sity led to larger colony size but finer grain structure.
60 80 100 The reduction in crystal size is due to the higher overpo-
tential and the accompanying increase in ndcleation rate
2 THETA (DEG.) [ 121. Fig. 10 shows further refinement in grain structure
Fig. 7. XRD patterns showing the influence of T,, on the crystal orien- obtained at a peak current density of 1600 mA cmm2
tation of nickel deposits with constant JP of 400 mA cm-’ and Ton of but with on-times of 3 and 5 ms. For comparison
8 ms. purposes, the SEM micrograph of the deposit obtained
at a pulse on-time of 1 ms is also shown here (Fig. lOa).

-i l Ton : 1 0 .
It is clear that further reduction in grain size was
obtained with increasing on-time. The increased refine-
ment in grain size further supports the argument that

jl ’ J ------ ---- _- ‘p--L-/r


the electrode potential must have increased with
increased on-time.
Fig. 11 shows XRD patterns illustrating the crystal
orientation of these deposits. It can be seen from this
figure that higher peak current densities resulted in a
change in the crystal orientation from an almost random
O -:--~-.~-~---~
texture at the lowest peak current density (400
mA cmm2) to a strong (200) fibre texture at 1600
mA cmm2. This may be attributed to the fact that higher
Fig. 8. Scheme for investigating changes in JP with constant z, and peak current density may lead to (1) higher electrode
T ore overpotential and (2) reduced concentration of Ni2+ at
the electrode surface.
400,800 and 1600 mA cm-‘. The pulse on-time and off- Fig. 12 shows a high magnification SEM micrograph
time are constant at 1 and 15 ms, respectively, as seen for the deposit obtained at an on-time of 3 ms. Due to
in Table 5. Close examination of the optical insets reveals deposit curling, it was not possible to obtain 3-mm discs
that basically the same surface appearance was obtained for further TEM studies. However, from Fig. 12, the
at peak current densities of 400 and 800 mA cmm2. grain size may be estimated to be around 150-200 nm,
However, further increase in peak current density visible as fine nodules in each colony. Grain size meas-
(Fig. SC) caused the deposit to curl and tear which is urements using transmission electron microscopy was
indicative of high internal stress. This is consistent with only possible for the deposit obtained at 5 ms on-time
the results obtained by Kim et al. [ 111 for pulse-plated due to reduced deposit curling and tearing. Fig. 13 shows
A.M. ELSherik et aL/Surface and Coatings Technology 88 (1996) 70-18 77

Fig. 10. Further refinement in grain structure obtained at a peak current density of (a) 1600 mA cm-’ but with (b) T,,=3 ms and (c) To,=5 ms.

(11 l)(ZOO) (220) (311)(222)

Fig. 12. High magnification SEM micrograph for ultra-fine-grained


nickel electrodeposit.

40 60 80 100

2 THETA (DEG.)
Fig. 11. XRD patterns showing the influence of Jr on the crystal orien-
tation of nickel deposits with constant T,e of 15 ms and T,, of 1 ms.

a TEM darkfield image micrograph of this deposit.


Grain size distribution measurements of approximately
250 grains showed an average grain size of approxi- Fig. 13. Transmission electron darkfield image of ultra-fine-grained
mately 110 nm. Table 6 summarizes the plating condi- nickel electrodeposit.
78 A.M. EI-Sherik et al./Sutface and Coatings Technology 88 (1996) 70-78

Table 6 almost random distribution to a strong (200) fibre


Plating conditions used to produce extremely fine-grained nickel texture with increasing on-time and peak current density.
electrodeposits
The grain size of these deposits, as expected, became-
Parameter Optimal value smaller with increasing pulse peak current density.
Longer pulse off-time was found to result in grain size
On-time (ms) 5 coarsening. However, the crystal orientation was
Off-time (ms) 15
Peak current density (mA cm-‘) 1600 unaffected by changes in off-time.
Temperature (“C) 60
PH 4.5
Acknowledgement

tions used to produce these extremely fine-grained The authors acknowledge financial support from the
deposits. X-ray diffraction pattern studies on these Natural Sciences and Engineering Research Council of
samples were not possible due to the curling of these Canada, Energy, Mines and Resources of Canada and
deposits. the School of Graduate Studies at Queen’s University.
3.4. Production of nanocrystals by pulseplating
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100 nm. [ 151 N. Ible, XI. Puippe and H. Angerer, SurJ Techno!., 6 (1978) 287.
[16] Puippe, JCL, in Theory and Practice of Pulse Plating, AESFS,
1986.
[ 171 A.H. DuRose, Plating Surf.Finishing, 64 (1977) 48.
4. Conclusions [18] K. Hosokawa, H. Angerer, JCL Puippe and N. Ibl, Plating Sutf.
Finishing, 68 (1980) 52.
Ultra-fine-grained nickel electrodeposits with grain [l9] VS. Abdulin and V.I. Chernenko, Plot. Metals, 18 (1982) 777.
[20] H. Fischer, Electrodeposition SW& Treatment, I (1973) 319.
size down to about 100 nm were produced from an [21] S. Yoshimura, S. Chida, E. Sato and N. Kubota, Metal Finishing,
organic-free Watts’ bath using pulse plating. Increasing 84 (1986) 39.
pulse on-time in the range l-5 ms resulted in grain [22] R.T.C. Choo, J.M. Toguri, A.M. El-Sherik and U. Erb, J. Appl.
refinement which is attributed to increased overpotential. Electiochem., 25 (1995) 384.
The crystal orientation progressively changed from an [23] B.E. Conway and J.O’M. Bockris, Electrochitn. Acta, 3 (1961) 340.

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