UNIVERSIDAD TECNOLOGICA DE ALTAMIRA

Activity #2: Research

“The Chapiza”
Members

Herbert Avila Fabian

Labra Elvira Jose Alejandro
Garza Aguilar Salvador
Dantes Mellado Jesus Gael
Requena Cornejo Carlos Manuel

MEC 4B
 Logic Families
Logic families are groups of logic circuits that are based on particular types of
elements (resistors, transistors, and so forth). Families are identified by the manner
in which the elements are connected, and, in some cases, by the types of elements
used.
Logic circuits of a particular family can be interconnected without having to use
additional circuitry. In other words, the output of one logic circuit can be used as the
input to another logic circuit. This feature is known as compatibility. All circuits within
a logic family will be compatible with the other circuits within that family.
Several logic-circuit groups or families have been introduced. They differ primarily in
the methods for carrying out the logic and the coupling to the inverter stages. For
example, the transistor-transistor logic (TTL) uses a multimeter transistor instead of
the diodes found in DTL circuits. In emitter-coupled logic (ECL), the circuits are
coupled by a common-emitter resistor, and complementary transistor logic (CTL)
uses a combination of PNP and NPN transistors.

Transistor Transitor Logic (TTL)

The Transistor-Transistor Logic (TTL) is a logic family made up of BJTs (bipolar
junction transistors). As the name suggests, the transistor performs two functions
like logic as well as amplifying. The best examples of TTL are logic gates namely
the 7402 NOR Gate & the 7400 NAND gate.
The designing of TTL logic gates can be done with resistors and BJTs. There are
several variants of TTL which are developed for different purposes such as the
radiation-hardened TTL packages for space applications and Low power Schottky
diodes that can provide an excellent combination of speed and lesser power
consumption.
 Characteristics of TTL
Fan Out: Number of loads the output of a GATE can drive without affecting its usual
performance. By load we mean the amount of current required by the input of
another Gate connected to the output of the given gate.
Power Dissipation: It represents the amount of power needed by the device. It is
measured in mW. It is usually the product of supply voltage and the amount of
average current drawn when the output is high or low.
Propagation Delay: It represents the transition time that elapses when the input
level changes. The delay which occurs for the output to make its transition is the
propagation delay.

Noise Margin: It represents the amount of noise voltage allowed at the

input, which doesn’t affect the standard output.

Complementary Metal-Oxide Semiconductor (CMOS)

A complementary metal-oxide semiconductor (CMOS) is the semiconductor
technology used in most of today's integrated circuits (ICs), also known as chips or
microchips. CMOS transistors are based on metal-oxide semiconductor field-effect
transistor (MOSFET) technology. MOSFETs serve as switches or amplifiers that
control the amount of electricity flowing between source and drain terminals, based
on the amount of applied voltage.
MOSFETs use semiconductor materials to conduct electricity under certain
conditions but not others. A semiconductor falls somewhere between a conductor
and insulator in terms of conductivity. It typically consists of silicon and a mix of
impurities that together strike the right balance of conductivity. Silicon in its pure form
is not conductive.
 Characteristics of CMOS
Fan in and Fan out: Number of inputs and outputs connected to the gate, which
does not affect the usual performance and does not degrade the voltage. Fan in and
Fan out is usually 10 for CMOS.

Power dissipation: It is amount of power the device needs. It is the product of

the voltage which is supplied and current needed to produce the output. It is
measured in mW. Usually, it is 10mW at 1MHZ and 0.1mW at 100KHZ.

Noise Margin: It is the amount of noise voltage allowed at the input and it should
not affect the output. The noise margin in CMOS is 45% of the supply voltage. It is
usually 2.25V for 5V input.

Propagation Delay: It is the time taken from applying the input to the output
produced. It is normally 25 to 150ns.
 Security Measures in the conservation and drived of TTL and
CMOS Logic Families
(TTL)Apart from tracing the route packets take across the Internet, time-to-live is
used in the context of caching information for a set period. Instead of measuring time
in hops between routers, each of which can take a variable amount of time, some
networking use cases operate in a more traditional fashion.
As CMOS embrace data-driven marketing and companies compile more and more
customer data, marketers need to learn to use customer data efficiently to extract
pertinent insights while also shouldering the responsibility of securing this highly-
identifying personal data.
Beyond the possible impact to your sales and revenue, a data breach puts your
customers at risk for hacking, defrauding, and financial difficulty depending on the
type of personally identifiable information (PII) collected by your data management
systems.

Detection, Location and Elimination of Fails

Methods for the detection and location of faults in digital circuits.
We simply measure the resistance at different points on the track, focusing on the
points with a lower value. There will be the component, track or solder causing the
short circuit. The problem, is that this is very easy when we measure a few meters
of wire.
Locating short circuits with thermal imaging cameras.
A thermography is a thermal image similar to a photograph, but with colors
proportional to the temperature. In this way, hot areas have a very contrasting color
with cold areas. A short circuit causes the current to be very high in the affected
area. Therefore, it is sometimes easy to locate a short circuit with a thermal imaging
camera. However, it is also possible that not a specific point is marked, but a whole
area, or several tracks of the printed circuit board where there are many
components.
 Detection, Location and Elimination of Fails
1. Voltage Indicator: This instrument is to check whether the voltage exists across
two points in a circuit. There is the Analogue meter with a deflective finger indicator
and the Digital meter which displays the exact value of the electronic device even
in decimal. The digital meter is easier to read. However, in the absence of these
meters, a simple voltage indicator of a lamp connected to a lamp holder and two-
wireterminals can be used.
2. Electric Current Tester: This looks like a screwdriver that has a red bulb inside
it when the tip torches a live wire while a finger is placed on the cap of the
insulated handle.
3. Continuity Tester: This is also known as a multimeter. It can be used to test the
flow of current, as a voltage indicator, as insulation tester and other tests.
4. The Oscilloscope: This is a general-purpose instrument used for measuring
small voltages and current. Its as o used for the maintenance of electronic
equipment and laboratory work. They have UCD or LED screens and fast
analogue-to-digital converters and digital signal processors.
5. Insulation Tester: The insulation tester is known as the megger, which is used
to test earth leakages that results in shocks.
6. Soldering Iron: It is used to solder electronic elements to the panel. It can also
be used to melt soldered components for proper examination.

Techniques for insure and correction of Fails in Digital

Circuits.
These techniques change the original circuit by adding logic for error detection and
correction or error masking. At system-level (for example microprocessor, System
on Chip (SoC) etc.) these circuit-level fault tolerance techniques are generally
categorized as hardware-based techniques because they mostly rely on hardware
replication and additional hardware modules to protect system against faults.
Moreover software-based fault-tolerance techniques are also widely implemented
at system-level because of their non-intrusiveness, high flexibility, low development
time and cost. However, software-based fault tolerance techniques cannot achieve
full system protection because of their inability to handle all the possible
control flow errors. In this section we focus on some circuit-level fault-tolerance
techniques commonly used as building block of fault-tolerant architectures.