Professional Documents
Culture Documents
Proponents:
Ausan, Arvin
Professor:
October 3, 2022
I. DEFINITION
An extruded heat sink is a device made of conductive metal used to
absorb heat from high-temperature parts and dissipates it to the surrounding.
It is commonly used in industrial devices such as computer processors and air
conditioning systems. If extruded heat sinks are not provided for electronic
circuits, then there will be a chance of failure of components such as
transistors, voltage regulators, ICs, LEDs, and power transistors. Extruded
heat sink can optimize cooling and can be used for natural or forced
convection with the use of a fan.
Extruded heat sinks are usually made from extruded aluminum. The
process is useful for most applications. Extruded heat sinks come at a low
cost and custom specifications can be easily manufactured. The performance
of extruded heat sinks can range from low to high. Their main downside,
though, is that dimensions are limited by the maximum width of extrusion.
II. PURPOSE
Fan
A cooling solution used to cool down integrated circuits in computer systems, that is
common in the central processing unit (CPU). Heat sinks are passive, which means
they have no moving parts. In most cases, however, the heatsink is combined with a
brushless fan that blows the hot air away or a liquid cooling solution that carries the
heat halfway through the pipes.
4 Pin Plug
Is an AC power plug and socket that is connected to electric equipment (Heat Sink)
and to the alternating current (AC) power (Fan) that has a fast heat dissipation with a
2200 RPM fan speed. Electrical plugs and sockets differ from one another in voltage
and current rating, shape, size, and connector type.
1. The source generates heat: This source may be any system that creates
heat and requires the removal of said heat to function accordingly, such as
mechanical, electrical, chemical, nuclear, solar, and friction.
2. Heat transfers away from the source: In direct heat sink-contact
applications, heat moves into the heat sink and away from the source via
natural conduction. The heat sink material's thermal conductivity directly
impacts this process. That is why high thermal conductivity materials such as
copper and aluminum are extremely common in the construction of heat
sinks.
3. Heat distributed throughout the heat sinks: Heat will naturally travel
through the heat sink via natural conduction moving across the thermal
gradient from a high-temperature to a low-temperature environment. This
ultimately means that the heat sink's thermal profile will not be consistent. As
a result, heat sinks will often be hotter towards the source and cooler towards
the sink's extremities.
4. Heat moves away from the heat sink: This process relies on the heat sink's
temperature gradient and its working fluid--most commonly air or a
non-electrically-conductive liquid.
a. The working fluid passes across the surface of the warm heat sink and
utilizes thermal diffusion and convection to remove heat away from the
surface and into the surrounding environment.
b. This stage relies on, yet again, a temperature gradient to remove heat
from the heat sink. Therefore, if the surrounding temperature is not
cooler than the heat sink, no convection and subsequent heat removal
will occur.
c. This stage is also where the total surface area of the heat sink
becomes most advantageous. A large surface area provides an
increased area for thermal diffusion and convection to occur.
𝑘 𝐴 (𝑇𝑎 − 𝑇𝑏)
𝑄 = 𝑋
Eq. 1
The extruded heat sink has convection because of the presence of a fan
which is used to blow the heat in the heat sink. The forced air passes through the
fins and heat transferred from the heat sink into the air before it is expelled outside.
To solve for the Area of the Heat Sink:
𝐴𝐻= 2𝐻[𝐿 + 𝑊] 𝐿𝑊
𝑤ℎ𝑒𝑟𝑒:
𝐴𝐻 = 𝐴𝑟𝑒𝑎 𝑜𝑓 𝐻𝑒𝑎𝑡 𝑆𝑖𝑛𝑘
𝐻 = 𝐻𝑒𝑖𝑔ℎ𝑡 𝑜𝑓 𝑡ℎ𝑒 𝐻𝑒𝑎𝑡 𝑆𝑖𝑛𝑘
𝑊 = 𝑊𝑖𝑑𝑡ℎ 𝑜𝑓 𝑡ℎ𝑒 𝐻𝑒𝑎𝑡 𝑆𝑖𝑛𝑘
𝐿 = 𝐿𝑒𝑛𝑔𝑡ℎ 𝑜𝑓 𝑡ℎ𝑒 𝐻𝑒𝑎𝑡 𝑆𝑖𝑛𝑘
Dimensions:
Height 0.04
Width 0.06
Length 0.06
V. Design Calculations:
This part discusses and presents the data calculations on the analysis of heat
transfer within a heat sink exchanger.
Aluminum 204
Source: (2022). https://kimsen.vn/heat-sink-pe137.html
Here are the temperatures present in the heat exchanger. It is necessary to identify
the final temperature of the air being emitted by the fan. With the energy balance
equation, the final temperature can be solved.
Temperature ℃
T1 air 25
TA CPU 80
T2 air ?
TB CPU 55
𝑄 = ṁ𝐶𝑝△𝑇 = ṁ𝐶𝑝△𝑇
0. 250𝑘𝑊 = ṁ𝐶𝑝△𝑇
𝑘𝑔 𝑘𝐽
0. 250𝑘𝑊 = (0. 01 𝑠
)(1. 0035 𝑘𝑔 − 𝐾
)(𝑇 − 25)𝐶°
𝑇 = 50°𝐂
In this heat sink, both air going through the system where they both go
through the same direction, thus creating a parallel flow heat transfer. Below is the
Logarithmic Mean Temperature Difference (LMTD) diagram and analysis for the
extruded heat sink.
△𝑇 − △𝑇𝐵
𝐿𝑀𝑇𝐷 = △𝑇𝐴
𝑙𝑛 ( △𝑇𝐵 )
LMTD = 20.8℃
𝐴𝐻= 2𝐻[𝐿 + 𝑊] 𝐿𝑊
𝐴𝐻= 2(1𝑚)[0. 5 + 2. 7675]𝑚 (0. 5)(2. 7675)𝑚
𝐴𝐻= 9.04 m2
𝑄 = 𝑈 (𝐴𝐻)(𝐿𝑀𝑇𝐷)
𝑄
𝑈 = 𝐴𝐻 𝑥 𝐿𝑀𝑇𝐷
𝑊
0.25𝑘𝑤(1000 𝑘𝑊 )
𝑈 = 2
9.04𝑚 (20.8 ℃)
𝑊
𝑈 = 1.33 2
𝑚 −℃
Thermal Resistances:
1
𝑈 =
∑𝑅
1
𝑈 =
∑𝑅(𝑐𝑜𝑛𝑑𝑢𝑐𝑡𝑖𝑜𝑛) + ∑𝑅(𝑐𝑜𝑛𝑣𝑒𝑐𝑡𝑖𝑜𝑛)
1
𝑈 = 1 𝑥
ℎ𝐴
+ 𝑘𝐴
𝑥
∑ 𝑅Cond =
𝑘𝐴
(𝐴)
0.5𝑚 2
∑ 𝑅Cond = 𝑊 2 (9. 04𝑚 )
204 𝑚−𝐶
(9.04 𝑚 )
2
-3 𝑚𝐶
∑ 𝑅Cond = 2.45 x 10 𝑊
1
𝑈 = 1 𝑥
ℎ𝐴
+ 𝑘𝐴
𝑊 1
1.33 2 = 2
𝑚 −𝐶 −3 𝑚 𝐶
2.45 𝑥 10 𝑊
+∑ 𝑅𝑐𝑜𝑛𝑣
2
𝑚 𝐶
∑ 𝑅conv = 0. 75 𝑊
Checking:
Q = Qcond + Qconv
𝐴𝐻 (𝐿𝑀𝑇𝐷)
0.250 kW =
∑𝑅(𝑐𝑜𝑛𝑑𝑢𝑐𝑡𝑖𝑜𝑛) + ∑𝑅(𝑐𝑜𝑛𝑣𝑒𝑐𝑡𝑖𝑜𝑛)
2
9.04 𝑚 (20.8 ∁°)
0.250 kW = 2
−3 𝑚 − ∁°
2
𝑚 − ∁°
2.45 𝑥 10 𝑊
+ 0.75 𝑊
0.250 kW = 0.250 kW
VI. Conclusion:
A Heat sink has a thermal conductor that usually operates to carry away the heat
from the CPU into the fins that provide a large surface area to eliminate heat
throughout the computer. Thus, cooling the heat sink requires airflow and, therefore,
a heat sink in the CPU has fans built in where the presence of a fan is used to blow
the heat in the heat sink. The forced air passes through the fins and heat is
transferred from the heat sink and cools down the CPU.
Each heat sink usually has its own unique characteristic curve depicting the
performance in thermal impedance for a given power and air flow.
The heat sink material which is the aluminum thermal conductivity directly impacts
this process. As such, they can be a passive heat exchanger that transfers the heat
generated by an electronic or mechanical device to a fluid medium, often air or a
liquid coolant, where it is dissipated away from the device, thereby allowing
regulation of the device's temperature.
Thus, balancing the reaction, conservation of charge, and mass we can generate an
equation for the rate of heat transfer, log mean temperature difference, overall
surface area, overall heat transfer coefficient, and thermal resistances. Heat sinks
coolant flows vertically into the heat sink from the center of the top wall. The model
has four outlets near the sides of the top wall. The corresponding temperature fields,
flow fields, pressure drop, and thermal characteristics are presented based on a
verified computational model.
References:
[1] Anonymous. (n.d). The importance of radiation in heat sink design. Retrieved
from:
https://www.heatsinkcalculator.com/blog/the-importance-of-radiation-in-heat-sink-des
ign/?fbclid=IwAR1uweMfG7YZeWVxMRe-LSxNoNv1uZmw2gIJBqDkgivm_jOWJOE
6m63q7Iw
[2] “Sm Lease Design”. (n.d). Heat Sink Thermal Resistance and Size Calculation:
Heat Sink Selection. Retrieved from:
https://www.smlease.com/entries/thermal-design/how-to-select-a-heat-sink/?fbclid=I
wAR2RuNWKYW2Q0TZDnoGME6UV1CuoyNjASR6k58DUnkRSKxSVA-8S4mK8-Jc
#:~:text=To%20select%20a%20heat%20sink%2C%20firstly%20thermal%20resistan
ce%20of%20the,T1
[3] Gopalakrishnan, Venkatesan & Nithiyananthan, K.. (2017). Real time
measurements of transient thermal analysis for power factor converters in switched
reluctance motor drive. International Journal of Pure and Applied Mathematics. 117.
27-33. Retrieved from:
https://www.researchgate.net/figure/Dimensions-of-heat-sink_tbl1_321904822