This document appears to be an exam for a course on lithography. It contains 5 questions with 3 parts each, covering various topics related to lithography. The questions ask students to define and explain key lithography concepts and processes. Specifically, they cover topics like positive and negative resists, photochemistry of resists, photoresists, soft vs hard bakes, the history and importance of lithography, nanoimprinting, dry etching, X-ray lithography, metrology techniques like ellipsometry and CD metrology, and the use of tools like SEM in lithography.
This document appears to be an exam for a course on lithography. It contains 5 questions with 3 parts each, covering various topics related to lithography. The questions ask students to define and explain key lithography concepts and processes. Specifically, they cover topics like positive and negative resists, photochemistry of resists, photoresists, soft vs hard bakes, the history and importance of lithography, nanoimprinting, dry etching, X-ray lithography, metrology techniques like ellipsometry and CD metrology, and the use of tools like SEM in lithography.
This document appears to be an exam for a course on lithography. It contains 5 questions with 3 parts each, covering various topics related to lithography. The questions ask students to define and explain key lithography concepts and processes. Specifically, they cover topics like positive and negative resists, photochemistry of resists, photoresists, soft vs hard bakes, the history and importance of lithography, nanoimprinting, dry etching, X-ray lithography, metrology techniques like ellipsometry and CD metrology, and the use of tools like SEM in lithography.
BE - SEMESTER–VII (NEW) EXAMINATION – WINTER 2021 Subject Code:3173907 Date:15/12/2021 Subject Name:Lithography Time:10:30 AM TO 01:00 PM Total Marks: 70 Instructions: 1. Attempt all questions. 2. Make suitable assumptions wherever necessary. 3. Figures to the right indicate full marks. 4. Simple and non-programmable scientific calculators are allowed.
MARKS
Q.1 (a) Define: Lithography? 3
(b) Differentiate: Positive and negative resists. 4 (c) Explain: Photochemistry of resists in the vicinity of lithography. 7
Q.2 (a) What do you mean by Photoresist? 3
(b) Differentiate: Soft Bake vs Hard bake 4 (c) Write a short note on history of lithography. 7 OR Write a short note on importance of 3D atomic force microscopy (c) 7 (AFM3D) in lithography. Q.3 (a) Define: Residual Layer 3 (b) In brief explain :Adhesion Promotion 4 (c) Write a shote note on Nano imprint with its applications. 7 OR Q.3 (a) What do mean by dry etching? 3 (b) Write the applications of XRL. 4 Explain: Ellipsometry characterization during and after the (c) 7 lithography. Q.4 (a) What do mean by pattern sidewall angle (SWA)? 3 (b) Explain: Physics of X-ray lithography 4 (c) Write a shot note basic principle and working of X-ray lithography. 7 OR Q.4 (a) Define: Optical diffractometry 3 (b) Explain: The residual layer problem in Nano Imprint lithography. 4 (c) Explain: Critical Dimension (CD) metrology. 7 Q.5 (a) Define: High aspect ratio. 3 (b) Explain: need of metrological during a lithograph. 4 (c) Explain : X-ray absorption in a resist 7 OR Q.5 (a) What do mean by transfer of the pattern? 3 (b) Explain: Matter–electron interaction 4 Explain: Scanning electron microscopy (SEM) in the vicinity of (c) 7 lithography. *************