Webinar: Design recommendations HDI – HDI Design Guide

Würth Elektronik Circuit Board Technology

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Agenda

Nomenclature and definition

Why Microvia technology?

Possibilities

Costs

Fence out a BGA

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Nomenclature and definition

HDI
• High Density Interconnection

Microvia
• Smallest, laser drilled holes

Buried Via
• Buried drills on the inner layers

Pitch
• Middle of a pad to the middle of a pad

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 Nomenclature and definition

Number Microvia layers Number inner layers Number Microvia layers

between the Microvias

Number Microvia layers Number inner layers with Number Microvia layers
buried vias

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 Nomenclature and definition

Number Microvia layers

Number Microvia layers
Number inner layers with buried vias

Number inner layers

between the Microvias

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 Why Microvia technology?

Fence out
smallest BGA High reliability
pitch 

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Why Microvia technology?

TCT i.d.R -45° / + 125° C

Solderprocess
Aspect Ratio
AR= h / 
IPC-2221/2122

Copper thickness t t


h
Basic material
CTEz 
Standard-FR4 Z-Achse Cu
70
Expand Z-axis

60
50
40
[µm]

h 30
20
10
Expand! 0
25 50 75 100 125 150 175 200 225 250
T [°C]

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 Why Microvia technology?

Future-proof
Cost-effective
Fence out Miniaturisation technology –
generation of
smallest BGA High reliability with ‘Via in Pad’ components are
high wiring
pitch  technology     becoming smaller
density    
all the time    

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We will have a…

Whats the reason for, that plated thorugh holes / vias could not be
reduced to any small size?

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 Possibilities – Standard Microvias

Standard - Microvia

FinalØ 100µm

Pad Ø 300µm

With 60-70µm
dielectric

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 Possibilities –Microvias with impedance

Standard - Microvia

FinalØ 125µm

Pad Ø 325µm

With 85-110µm
dielectric - 1 x pressed

- 1 x electroplated

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Possibilities – Staggered Microvias

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Possibilities – Staggered Microvias

- 2 x pressed

- 2 x electroplated

- Filling of the Micro- and buriedvias with epoxy

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Via Filling Prozess

Copper
FR4
Hardening
Copper

Drilling

Polish

Mteallization

Vacuum filling
process

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 Possibilities – Staggered Microvias

Staggered Microvias

Pitch ≥ 300µm

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Possibilities – Staggered Microvias

- 3 x pressed

- 3 x electroplated

- Filling of the Micro- and buriedvias with epoxy

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 Possibilities – Staggered Microvias and Buried Vias

Pitch ≥ 400µm

PadØ 550µm

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Possibilities – Staggered Microvias und Buried Vias

- 3 x pressed

- 3 x electroplated

- Filling of the buried vias with epoxy

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 Possibilities – Stacked Microvias

Stacked microvia

Copper filled

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Possibilities – Stacked Microvias

- 3 x pressed

- Filling of Buried Vias with epoxy

- Filling of Microvias with epoxy

- 4 x electroplated, metallization of µVias have to be done seperated to the buried vias

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 Possibilities – Stacked Microvias on Buried Vias

Stacked Microvia on
Buried Via

Buried Via filled and

capped

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We will have a…

Why to use staggered Microvias with respect to the costs

compared with the stacked option?

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Via Filling Prozess

Copper
FR4
Hardening
Copper

Drilling

Polish

Metallization

Metallization

Vacuum filling
process

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Possibilities – Stacked Microvias on Buried Vias

- 3 x pressed

- Filling of Buried Vias with epoxy and capping

- Filling of Microvias with epoxy

- 4 x electroplated

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 Costs

175 %
3 x pressed
1 x pressed 2 x pressed
150 %
extra 2 + 4b + 2
142 % buried
3.
buried Vias Microvias 1. 2.

120 %
2 + 4(6b) + 2 Microvias 1 to 2
Staggered 1 + 6b + 1 2.
2 to 3
115 % 1. 7 to 6
Microvias 2.
8 to 7
Laserdrilling 1.
Costs

PTH 1 to 8
1 to 3 2+4+2 Microvias 1 to 2 Buried Via 3 to 6
Microvias 1 to 2 2 to 3
2+4+2 2. 8 to 7 7 to 6
3 x pressed
1. 3 x electroplated
PTH 1 to 8 8 to 7
100 % 1.
2. 2 x laserdrilled
Buried Via 2 to 7 PTH 1 to 8 2 x mech. drilled
90 % 1+6+1 Microvias 1 to 2 2 x pressed Buried Via 2 to 7
2 to 3 2 x electroplated 2 x pressed
ML08 Microvias 1 to 2 1 x laserdrilled 2 x electroplated
1. 7 to 6
ohne + 1 to 3 2 x mech. drilled 2 x laserdrilled
8 to 7
µ-Vías 8 to 6 2 x mech. drilled
PTH 1 to 8
Microvias 1 to 2 8 to 7
2 x pressed
8 to 7 PTH 1 to 8
2 x electroplated
PTH 1 to 8 2 x pressed
2 x laserdrilled
1 x pressed 1 x electroplated
1 x mech. drilled
1 x electroplated 1 x laserdrilled
1 x laserdrilled 1 x mech. drilled
1 x mech. drilled Microvia Filling?

Complexity
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Fence out

BGA Pitch 0,8mm

Fence out with mech. vias

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Fence out

BGA Pitch 0,8mm

Fence out with Microvias, Dogbone

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Fence out

BGA Pitch 0,8mm

Fence out with Via in Pad

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Fence out

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Thank you for your attention!

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