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CRG15T60A83L, CRG15T60A93L
General Description :
VCES 600 V
Using HUAJING's proprietary trench design and advanced IC 15 A
Field Stop (FS) technology, offering superior conduction and VCE(sat) 1.7 V
Features:
● FS Trench Technology, Positive temperature coefficient
● Low saturation voltage:
VCE(sat),TYP=1.7V @IC=15A,VGE=15V;
TO-220F
Applications:
● Motor control
● UPS,PFC
Package Parameters
Type Package Marking Packing
W U X I C H I N A R E S O U R C E S H U A J I N G M I C R O E L E C T R O N I C S C O . , LT D . Page 1 of10 2 0 2 1 V0 2
CRG15T60A83L, CRG15T60A93L
Thermal Characteristics
Switching Characteristics
td(on) Turn-on Delay Time -- 30 --
tr Rise Time -- 30 --
VCE=400V,IC=15A, ns
td(off) Turn-Off Delay Time -- 45 --
Rg=10Ω,VGE=15V,
tf Fall Time -- 34 --
Inductive Load
Eon Turn-On Switching Loss ,TJ=25℃, -- 0.6 --
Eoff Turn-Off Switching Loss -- 0.19 -- mJ
Ets Total Switching Loss -- 0.79 --
VCE=480V,IC=15A,
Qg Total Gate Charge -- 59 -- nC
VGE=15V,
Electrical Characteristics of the DIODE(TC= 25℃ unless otherwise specified):
VF Diode Forward Voltage IF=10A -- 1.4 2.0 V
trr Reverse Recovery Time -- 47 -- ns
IF=10A
Irrm Reverse Recovery Current -- 7.5 -- A
di/dt=100A/uS
Qrr Reverse Recovery Charge -- 176 -- nC
Figure 17.Forward Bias Safe Operating Area(TO-220F) Figure 18.Forward Bias Safe Operating Area(TO-220AB)
Values (mm)
Items
MIN MAX
A 9.60 10.6
B 15.0 16.0
B1 8.90 9.50
C 4.30 4.80
C1 2.30 3.10
D 1.20 1.40
E 0.70 0.90
F 0.30 0.60
G 1.17 1.37
H 2.70 3.80
L 12.6 14.8
N 2.34 2.74
Q 2.40 3.00
3.50 3.90
TO-220 Package
ΦP
Q
B
B1
G
H
C1
L
E
F
N N
Values(mm)
Items
MIN MAX
A 9.60 10.4
B 15.4 16.2
B1 8.90 9.50
C 4.30 4.90
C1 2.10 3.00
D 2.40 3.00
E 0.60 1.00
F 0.30 0.60
G 1.12 1.42
H 3.40 3.80
L 12.0 14.0
N 2.34 2.74
Q 3.15 3.55
2.90 3.30
TO-220F Package
Lead Frame ○ ○ ○ ○ ○ ○ ○ ○ ○ ○
Molding ○ ○ ○ ○ ○ ○ ○ ○ ○ ○
Chip ○ ○ ○ ○ ○ ○ ○ ○ ○ ○
Wire Bonding ○ ○ ○ ○ ○ ○ ○ ○ ○ ○
Solder × ○ ○ ○ ○ ○ ○ ○ ○ ○
○:Means the hazardous material is under the criterion of 2011/65/EU.
×:Means the hazardous material exceeds the criterion of 2011/65/EU.
Note
The plumbum element of solder exist in products presently, but within the allowed range of
Eurogroup’s RoHS.
Warnings
1. Exceeding the maximum ratings of the device in performance may cause damage to the
device, even the permanent failure, which may affect the dependability of the machine. It is
suggested to be used under 80 percent of the maximum ratings of the device.
2. When installing the heat sink, please pay attention to the torsional moment and the
smoothness of the heat sink.
3. IGBTs is the device which is sensitive to the static electricity, it is necessary to protect the
device from being damaged by the static electricity when using it.
4. This publication is made by Huajing Microelectronics and subject to regular change without
notice.
W U X I C H I N A R E S O U R C E S H U A J I N G M I C R O E L E C T R O N I C S C O . , LT D . P a g e 1 0 o f 1 0 2021V02