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  • PCB Design Notes

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    tyler bretes
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    The document provides guidelines for PCB design including through hole clearance sizes, pad diameters, temperature rise, trace width and clearance based on IPC standards. Minimum hole sizes are specified as the maximum lead diameter plus a tolerance ranging from 0.15mm to 0.25mm depending on the required production level. Pad diameter is calculated as the minimum hole size plus an annular ring and fabrication allowance where the required tolerances decrease from level A to C production. Designs should allow for a maximum 10 degree Celsius temperature rise at an ambient of 25 degrees Celsius. Trace width for a 1 amp capacity board is recommended at 15 mils and clearances of 0.1mm for low voltage and 0.25mm for power devices.

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    Basic set of design notes needed for PCB design

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    The document provides guidelines for PCB design including through hole clearance sizes, pad diameters, temperature rise, trace width and clearance based on IPC standards. Minimum hole sizes are specified as the maximum lead diameter plus a tolerance ranging from 0.15mm to 0.25mm depending on the required production level. Pad diameter is calculated as the minimum hole size plus an annular ring and fabrication allowance where the required tolerances decrease from level A to C production. Designs should allow for a maximum 10 degree Celsius temperature rise at an ambient of 25 degrees Celsius. Trace width for a 1 amp capacity board is recommended at 15 mils and clearances of 0.1mm for low voltage and 0.25mm for power devices.

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    © All Rights Reserved
    Download as TXT, PDF, TXT or read online from Scribd
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    12 views1 page

    PCB Design Notes

    Uploaded by

    tyler bretes
    The document provides guidelines for PCB design including through hole clearance sizes, pad diameters, temperature rise, trace width and clearance based on IPC standards. Minimum hole sizes are specified as the maximum lead diameter plus a tolerance ranging from 0.15mm to 0.25mm depending on the required production level. Pad diameter is calculated as the minimum hole size plus an annular ring and fabrication allowance where the required tolerances decrease from level A to C production. Designs should allow for a maximum 10 degree Celsius temperature rise at an ambient of 25 degrees Celsius. Trace width for a 1 amp capacity board is recommended at 15 mils and clearances of 0.1mm for low voltage and 0.25mm for power devices.

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    © All Rights Reserved
    Download as TXT, PDF, TXT or read online from Scribd
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    PCB DESIGN NOTES

    Through Hole Clearance


    Minimum Hole Size = Maximum Lead Diameter + 0.25mm (for Level A of IPC-2222)
    Minimum Hole Size = Maximum Lead Diameter + 0.20mm (for Level B of IPC-2222)
    Minimum Hole Size = Maximum Lead Diameter + 0.15mm (for Level C of IPC-2222)

    Larger Holes = Easier to Produce and Assemble

    Pad Diameter = Minimum Hole Size + Minimum Annular Ring X 2 + Minimum Fabrication
    Allowance
    Pad Diameter = Minimum Hole Size + 0.1mm + 0.60mm (for Level A of IPC-2221)
    Pad Diameter = Minimum Hole Size + 0.1mm + 0.50mm (for Level B of IPC-2221)
    Pad Diameter = Minimum Hole Size + 0.1mm + 0.40mm (for Level C of IPC-2221)

    Level A: General Design Producibility — Preferred


    Level B: Moderate Design Producibility — Standard
    Level C: High Design Producibility — Reduced

    Larger Pads = Easier to Produce and Assemble

    Design for 10C T rise at ambient temperature (25C)

    1A capacity, 2oz copper, trace width = 15 mils

    For Low Voltage, Use .1mm trace clearance generally (per IPC 2221 standards), .25mm
    for power conversion devices (per IPC 9592 standards)

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