electronics
Article
Compact 2 × 2 Circularly Polarized Aperture-Coupled Antenna
Array for Ka-Band Satcom-on-the-Move Applications
Hisham Baghdadi 1 , Guillermo Royo 1,2, *, Ismael Bel 1 , Francisco Javier Cortés 1 and Santiago Celma 2






Citation: Baghdadi, H.; Royo, G.; Bel,
I.; Cortés, F.J.; Celma, S. Compact 2 ×
2 Circularly Polarized Aperture-
Coupled Antenna Array for Ka-Band
Satcom-on-the-Move Applications.
Electronics 2021, 10, 1621. https://
doi.org/10.3390/electronics10141621
Academic Editor: Emilio Arnieri
Received: 10 June 2021
Accepted: 5 July 2021
Published: 7 July 2021
Publisher’s Note: MDPI stays neutral
with regard to jurisdictional claims in
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iations.
Copyright: © 2021 by the authors.
Licensee MDPI, Basel, Switzerland.
This article is an open access article
distributed under the terms and
conditions of the Creative Commons
Attribution (CC BY) license (https://
creativecommons.org/licenses/by/
4.0/).
Electronics 2021, 10, 1621. https://doi.org/10.3390/electronics10141621
1 TELNET Redes Inteligentes, 50198 Zaragoza, Spain; hbaghdadi@telnet-ri.es (H.B.);
ismael.bel@telnet-ri.es (I.B.); fcortes@telnet-ri.es (F.J.C.)
2 Department of Electronic Engineering and Communications, Universidad de Zaragoza,
50009 Zaragoza, Spain; scelma@unizar.es
* Correspondence: royo@unizar.es
Abstract: This paper presents a novel design of a wideband circular polarization 2 × 2 microstrip
antenna array working at Ka-band frequencies, from 27.5 to 31 GHz. This module is highly integrable
with new silicon beamformer chips, creating a unit cell that can be part of a large electronically steer-
able antenna for compact, ultra-low-profile, Satcom-on-the-move (SOTM) platforms. A multi-layer
structure fabricated in standard printed circuit board (PCB) technology with high-yield substrates
has been used. The radiating elements consist of double-stacked circular patches housed in a cavity
and fed by H-shaped aperture coupling. It achieves a bandwidth of 16.5 % with a wide beam-width
of 95◦ in the desired band, which is necessary for wide scanning angles in a large phased array. In
the 2 × 2 unit cell, the antenna elements are distributed by means of a sequential rotation technique
where the separation between two of them is 5.3 mm in the XY-plane. Broadside beam-widths
ranging from 53.4◦ at 27.5 GHz to 42.1◦ at 31 GHz are achieved, with boresight directivities from
10.7 to 12.9 dBi, respectively, in both the RHCP and LHCP polarization. Moreover, mutual coupling
levels below −20 dB and an axial ratio less than 3 dB in the whole band guarantee a good circular
polarization purity.
Keywords: active electronically scanned arrays (AESA); Ka-band; printed circuit board (PCB);
Satcom-on-the-move (SOTM); silicon beamformer
1. Introduction
The interest in satellite communications has grown exponentially in recent years.
With the massive deployment of non-geostationary orbit (NGSO) LEO/MEO satellite
constellations, a great variety of high-speed and low-latency communication applications
are showing up [1–4]. The upcoming scenario is driving the development of new antenna
front-ends capable of tracking one or more satellites while providing a high data rate and
low-latency two-way communications. Traditionally, tracking GEO satellites has been
a relatively easy task, since a parabolic antenna pointed towards the satellite position
can provide good communication with the satellite transceiver, and mechanical steering
could provide uninterrupted communication with the satellite. However, the antenna
front-end configuration is not that simple for NGSO networks, where satellites are moving
with respect to the land-terminal. Although tracking the satellite as it moves may seem
easily solved with a mechanical structure that follows its movement, which is the basic
principle of Satcom-on-the-move (SOTM), the satellite eventually crosses the horizon and
the antenna must perform a handover to track a new satellite in the line of sight. Mechanical
systems show very poor behavior at switching between satellites, with very slow responses
that imply periodic losses of the communication link, thus greatly reducing their reliability.
In this context, active antenna arrays with electronical steering are a great alternative
to mechanical positioners. These terminals can achieve response times of the order of one
millisecond to continuously track the satellite or to perform a satellite handover with a
https://www.mdpi.com/journal/electronics
 Electronics 2021, 10, x FOR PEER REVIEW 2 of 13

In this context, active antenna arrays with electronical steering are a great alternative
Electronics 2021, 10, 1621 to mechanical positioners. These terminals can achieve response times of the 2order of 12 of one

millisecond to continuously track the satellite or to perform a satellite handover with a

much faster response without the need for mechanical actuators. Another major ad-
vantage
much faster of these
response activethe
without antenna
need forterminals
mechanicalis that they do Another
actuators. not require a parabolic
major advantage structure
of these active antenna terminals is that they do not require a parabolic structure to achieve design
to achieve the needed directivity. Therefore, the use of these systems allows for the
of ultra-low-profile
the needed directivity. Therefore, devices, thewhich has driven
use of these systems theallows
upriseforof the
a great amount
design of new SOTM
of ultra-low-
applications,
profile devices, whichsuch as unmanned
has driven the upriseaerial
of avehicle, connected
great amount of new cars,
SOTMcommercial flights, and
applications,
such asother scenarios
unmanned where
aerial satellite
vehicle, communications
connected is the only
cars, commercial choice.
flights, and other scenarios
where satelliteIn communications
particular, in recent is theyears,
only great
choice. efforts have been made on the development of
In new Ka-band
particular, SOTM
in recent terminals
years, for land
great efforts mobile,
have maritime
been made on theor development
aeronautical platforms
of new that
Ka-band SOTMlow-profile
require terminals for land mobile,
antenna maritime
front-ends or aeronautical
capable of providing platforms
high data that require
rate and low la-
low-profile
tencyantenna front-ends
of the order of 10capable of providing
milliseconds high dataLEO/MEO
from emerging rate and low latency
satellite of the com-
networks,
order ofpared
10 milliseconds
to the 300 or frommoreemerging LEO/MEO
milliseconds satellite
latency networks,
with GEO compared
satellites. In thistocontext,
the 300 phased
or morearray
milliseconds
antennas,latency
also knownwith GEO satellites.
as active In this context,
electronically scanned phased
arraysarray antennas,
(AESAs), play an im-
also known as active
portant electronically
role owing to their scanned arraysof
characteristics (AESAs), play size
low profile, an important
and weight, roleand
owinghigh relia-
to their bility
characteristics
because there of loware profile, size and
no moving weight,
parts and
to fail. high reliability
AESAs because
can also steer thereinare
beams microsec-
no moving parts to fail. AESAs can also steer beams in microseconds
onds and support multiple, simultaneous, and independent beams [5,6]. and support multiple,
simultaneous, One and keyindependent
difficulty in beams [5,6]. of Ka-band Satcom front-ends is the compact and
the design
One key difficulty in the design
cost-effective integration in a single of Ka-band
PCB of Satcom
the antennafront-ends
elements is the
withcompact
the highandnumber of
cost-effective
active integration
and passiveinradio a single PCB of(RF)
frequency the antenna
components elements
such with
as lowthenoise
highamplifiers
number of(LNAs),
active and
powerpassive radio frequency
amplifiers (PAs), phase (RF) components
shifting devices, such as low
hybrid noise amplifiers
couplers, (LNAs),not only
etc., that require
power good
amplifiers (PAs), phase shifting devices, hybrid couplers,
thermal handling but also considerable mounting space and adequate power etc., that require not con-
only good thermal handling but also considerable mounting space
sumption. The maturity reached by microwave monolithic integrated circuits (MMICs) and adequate power
consumption.
and theThe maturity
latest advances reached by microwave
in silicon technologies monolithic
such as integrated
SiGe or CMOS circuits (MMICs)
have helped to ad-
and thedress
latestthis
advances in silicon technologies
challenge for a large-scale deployment [7,8]. such as SiGe or CMOS have helped to
address this Nowadays,
challenge for a large-scale deployment [7,8].
a way to solve the integration problem is placing the antennas on-chip,
Nowadays, a way atoW-band
as in [9], where solve the 4 ×integration
4 wafer-scale problem
phased is array
placinghasthe antennas
been developedon-chip,
and asreported.
in [9], where a W-band 4 × 4 wafer-scale phased array has been developed
However, it is important to note that this approach requires identical sizes for the chip and reported.
However, it is important to note that this approach requires identical sizes for the chip and
and the antenna aperture to be efficient, making it very useful at frequencies above
the antenna aperture to be efficient, making it very useful at frequencies above 60 GHz,
60 GHz, and to drastically reduce the price of phased arrays.
and to drastically reduce the price of phased arrays.
Nevertheless, for frequencies below 60 GHz, there are other alternatives that combine
Nevertheless, for frequencies below 60 GHz, there are other alternatives that combine
printed circuit boards (PCB), surface mount technology (SMT) and silicon beamformer
printed circuit boards (PCB), surface mount technology (SMT) and silicon beamformer
chips, resulting in a cost-effective solution alternative. As shown in Figure 1, in this con-
chips, resulting in a cost-effective solution alternative. As shown in Figure 1, in this
figuration the radiating elements are typically placed on one side of the PCB, while the
configuration the radiating elements are typically placed on one side of the PCB, while
opposite side is employed to mount all SMD devices, so that the chips can be placed very
the opposite side is employed to mount all SMD devices, so that the chips can be placed
close to the radiating elements, which minimizes feed losses and maximizes the gain-to-
very close to the radiating elements, which minimizes feed losses and maximizes the
noise-temperature (G/T) of the antenna receiver and the effective isotropic radiated power
gain-to-noise-temperature (G/T) of the antenna receiver and the effective isotropic radiated
(EIRP) of the antenna transmitter.
power (EIRP) of the antenna transmitter.

Figure 1. Cross-section
Figure 1. of the Ka-bandofantenna
Cross-section array. antenna array.
the Ka-band

The proposed 2 × 2 circularly polarized antenna Tx array is based on this concept and
some examples can be found in the literature [9,10]. In [11,12], dual-band phased arrays are
presented to cover Tx/Rx satellite communications, interleaving in the same space K/Ka-
Electronics 2021, 10, 1621 3 of 12

band radiating elements with Ka-band elements, but introducing new integration problems
that they will have to solve and with reduced bandwidths of 4.3% in Tx (29.5–30.8 GHz)
and 4.8% in Rx (20.2–21.2 GHz).
Focusing on this type of RF beamforming structure, in the literature we find state-of-
the-art beamformers which include low-noise amplifiers (LNA), power amplifiers (PA),
phase shifters, variable gain amplifiers (VGAs), power combiners, simple pole double
throw (SPDT) switches, together with SPI control and even biasing networks all in a
single chip, working at frequencies up to 95 GHz, for 4, 8 or 16 channels, and with a high
yield [13–15]. To feed the beamformers array, an RF distribution network is implemented
with cascaded Wilkinson dividers so that all chips are fed with a balanced RF signal.
On the other hand, regarding the antenna radiating elements, many techniques
have been developed to improve the circular polarization radiation bandwidth at the
Ka-band, which include air- or substrate-integrated cavity-backed structure [16,17], stacked
patches [18], aperture-coupled patches [19] and multilayered structures [20,21]. Microstrip
antennas are commonly used due to their great advantages in terms of simplicity, versatility
and low profile, while they are inexpensive and easy to manufacture [22].
Three different single circularly polarized radiating elements with different beam-
widths and working at 30 GHz have been investigated in [23]. The first design implements
a classical microstrip patch antenna fed through a U-shaped slot and where the circular
polarization is achieved by trimming opposite corners. The second and third use the same
radiating element but are inserted in a cavity and enclosed by folded conducting walls,
respectively. In [24], an antenna element using aperture-coupled stacked patches and a
fork-based feeding network in asymmetric stripline technology, from 17.6 to 30.3 GHz, is
presented. Their main advantage resides in the fact of having a single radiating element
with a good circular polarization over a great bandwidth. However, this can limit the
beamforming performance in a phased array at some frequencies.
In this work, a circularly polarized, sequentially rotated, aperture-coupled antenna
array with highly integrable, cost-effective silicon beamformers is proposed for SOTM
applications. The 2 × 2 antenna array presented in this work will be the basic modular unit
of a full Ka-band AESA.
This paper is organized as follows: Section 2 describes the system architecture, the
antenna fabrication technology and the proposed multilayer stack-up. Section 3 shows
the experimental measurements of the radiating element, discusses its design and perfor-
mance, and provides a complete experimental characterization of the 2 × 2 antenna array
configuration. Finally, conclusions are drawn in Section 4.

2. Antenna Array Design

The Ka-band transmit beamformer chip, shown in Figure 2, is based on a SiGe BiCMOS
technology and consists of eight identical channels that feed the orthogonal polarizations
of four radiating elements of the phased array.
Each channel contains a power amplifier, a variable gain amplifier with 16 dB gain
control and a phase-shifter programmable with a 5-bit control. At the frequency range of
operation from 27.5 to 30 GHz, the maximum gain per channel is 22 dB with a 12 dBm
compression point at 1 dB (P1dB), while the total power consumption at P1dB is 1.35 W
from a 1.8 V voltage supply.
Within current flat antenna technologies, a multilayer structure printed circuit board
(PCB) has been chosen for the overall design, due to its low cost and mass production
approach. Figure 3 shows a microphotography of a transversal cut of the manufactured
PCB, in which the multi-layer stack-up structure consists of thirteen copper layers and
different dielectric substrates, alternating cores and prepregs.
Electronics
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10, xx FOR
FOR PEER REVIEW of 13
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Figure
Figure 2.Block
Figure2.
2. Blockdiagram
Block diagramof
diagram ofthe
of theKa-band
the Ka-bandtransmit
Ka-band transmitbeamformer
transmit beamformerchip.
beamformer chip.
chip.

Figure 3.
Figure3.
Figure Transversal
3.Transversal cut
Transversalcut of
cutof the
ofthe multi-layer
themulti-layer PCB
multi-layerPCB showing
PCBshowing the
showingthe stack-up
thestack-up structure.
stack-upstructure.
structure.

This
ThisPCB
This PCBcan
PCB can
canbebe
divided
be intointo
divided
divided fourfour
into functional
four parts:parts:
functional
functional Antenna
parts: elements
Antenna
Antenna are implemented
elements
elements are
are imple-
imple-
using
mented
mented layers
using
using from L1 to
layers
layers L6. L1
from
from Layers
L1 to L6Layers
to L6.
L6. to L10L6
Layers areto
L6 used
to L10for
L10 arerouting
are used
used forDC
for powerDC
routing
routing andpower
DC the serial-
power and
and
peripheral
the interface (SPI)
the serial-peripheral
serial-peripheral bus to
interface
interface program
(SPI)
(SPI) bus
bus to to the beamformer
program
program the chips. Layers
the beamformer
beamformer chips.L10
chips. to L12
Layers
Layers L10
L10are
to
to
assigned
L12 are to the
assigned RF
to signal
the RFdistribution
signal network
distribution in stripline
network in technology
stripline with
technology
L12 are assigned to the RF signal distribution network in stripline technology with inte- integrated
with inte-
Wilkinson
grated power dividers,
grated Wilkinson
Wilkinson power and finally,
power dividers,
dividers, and layers L12
and finally,
finally, to L12
layers
layers L13,
L12 to interconnection
to L13, lines between
L13, interconnection
interconnection lines
lines be-
be-
PCB
tweenand
tween PCB surface
PCB and mount
and surface components
surface mount in
mount components grounded
components in coplanar
in grounded waveguide
grounded coplanar (GCPW)
coplanar waveguide
waveguide technology,
(GCPW)
(GCPW)
are integrated.
technology,
technology, are
are integrated.
integrated.
To
Tocarry
To carryout
carry outthe
out thedesign,
the design,digital
design, digitaland
digital andDC
and DClayers
DC layersare
layers arefabricated
are fabricatedusing
fabricated usingFR4
using FR4substrates
FR4 substrates
substrates
because
because of its lower cost, while the rest of the structure employs ceramic materialsfrom
because of
of its
its lower
lower cost,
cost, while
while the
the rest
rest of
of the
the structure
structure employs
employs ceramic
ceramic materials
materials from
from
Electronics 2021, 10, x FOR PEER REVIEW 5 of 13
Electronics 2021, 10, 1621 5 of 12

Rogers and Isola with relative dielectric constants of 3.6 and low losses at high frequencies
Rogers and Isola with relative dielectric constants of 3.6 and low losses at high frequencies
to achieve a better RF performance. This combination results in obtaining the advantages
to achieve a better RF performance. This combination results in obtaining the advantages
of high gain, low cost, and easy processing.
of high gain, low cost, and easy processing.
Vertical transitions are fabricated by through-hole, blind or buried vias, and micro-
Vertical transitions are fabricated by through-hole, blind or buried vias, and micro-
via connections with a diameter of 0.2 and 0.15 mm, respectively, creating coaxial-like
via connections with a diameter of 0.2 and 0.15 mm, respectively, creating coaxial-like
structures to ensure the RF signal integrity [25]. In this kind of structure, it is known that
structures to ensure the RF signal integrity [25]. In this kind of structure, it is known that
the electric field is more tightly constrained inside the ground vias as the amount of these
the electric field is more tightly constrained inside the ground vias as the amount of these
increases [26]. For this reason, the number of grounded vias implemented in the design
increases [26]. For this reason, the number of grounded vias implemented in the design
corresponds to the maximum allowed if fabrication rules are considered.
corresponds to the maximum allowed if fabrication rules are considered.
Radiating
Radiating Element
Element Design
Design
In
In this
thissubsection,
subsection,thetheantenna
antennaradiating
radiating element
elementstructure will
structure willbe be
described. TheThe
described. ra-
diating element, which is shown in Figure 4, is based on double-stacked circular
radiating element, which is shown in Figure 4, is based on double-stacked circular patches, patches,
aa 2.7
2.7 mm diameter driven
mm diameter drivenpatch
patch(L1)
(L1)and
anda a2.3
2.3mm
mm diameter
diameter parasitic
parasitic patch
patch (L3),
(L3), which
which are
are surrounded by an artificial metallic wall formed by twenty vias (L1 to
surrounded by an artificial metallic wall formed by twenty vias (L1 to L3) whose diameterL3) whose di-
ameter
is 200 µm.is 200 µm.
The The stacked
stacked patchespatches technique
technique is usedisto
used to enhance
enhance the impedance
the impedance band-
bandwidth,
width, while backing
while cavity cavity backing is employed
is employed for surface
for surface wave suppression.
wave suppression.

Figure
Figure 4.
4. Three-dimensional
Three-dimensional diagram
diagram of
of the
the radiating
radiating element
element structure.
structure.

This element
This elementworks
worksatatKa-band
Ka-bandfrequencies,
frequencies, from
from 27.5
27.5 to GHz,
to 31 31 GHz,
withwith a double
a double cir-
circular
cular polarization,
polarization, switchable
switchable by means
by means of electronic
of electronic control
control circuitry.
circuitry. To achieve
To achieve this,this,
the
the driven
driven patchpatch
is fedis by
fedelectromagnetic
by electromagnetic coupling
coupling in twoin orthogonal
two orthogonal
pointspoints through
through both
both H-shaped slots. The aperture-coupled feeding technique has advantages such as no
 Electronics 2021, 10, x FOR PEER REVIEW 6 of 13

Electronics 2021, 10, 1621 6 of 12

H-shaped slots. The aperture-coupled feeding technique has advantages such as no phys-
ical contact between the feed and radiator, wider bandwidths, and better isolation be-
physical contactpoints.
tween feeding between the feed and radiator, wider bandwidths, and better isolation
between feedingthe
Likewise, points.
input feeding network which excites each aperture is made up of a 50 Ω
Likewise,
ground coplanarthewaveguide
input feeding network
(GCPW) which
trace, excites each
a quasi-coax aperture
vertical is madeand
transition, a 50 Ω
up aofstripline
ground coplanar waveguide (GCPW) trace, a quasi-coax vertical transition, and a stripline
to the H-slot. It is especially important to use the coaxial-like structures to provide reliable
to thehigh-performance
and H-slot. It is especially important
vertical to usebetween
transitions the coaxial-like structures
layers L5 and L13, towhere
provide reliable
eight vias
and high-performance
allocated vertical
in a 500 µm radius transitions
circle are usedbetween layers
to surround L5vertical
the and L13, where eight
transition viasa
to create
allocated in a 500
pseudocoaxial µm radius circle are used to surround the vertical transition to create a
waveguide.
pseudocoaxial waveguide.
3. Experimental Results
3. Experimental Results
The prototypes have been fabricated in a multilayer PCB with the highest perfor-
The prototypes have been fabricated in a multilayer PCB with the highest performance
mance and tolerances provided by the manufacturer Lab Circuits.
and tolerances provided by the manufacturer Lab Circuits.
3.1. Single Radiating Element
3.1. Single Radiating Element
TheS-parameters
The S-parametersofofa asingle
singleradiating
radiatingelement,
element, which
which areare shown
shown in Figure
in Figures 5 and
5 and 6,
Figure 6, have been measured using a 40 GHz vector network analyzer.
have been measured using a 40 GHz vector network analyzer. The radiating element The radiating
element aachieves
achieves a 10 dB impedance
10 dB impedance bandwidth bandwidth that is16.5
that is roughly roughly 16.5 %,
%, which which is
is greater greater
than the
than the Ka-band requires, and it overcomes the bandwidth achieved
Ka-band requires, and it overcomes the bandwidth achieved in recently published works, in recently pub-
lished
such asworks,
[27,28],such
5%,as [27,28],
and [29]. 5%,
Theand [29]. The
isolation isolation
between between
ports ports
is lower thanis lower
−25 dB than −25
from
dB from 27.5 to 31 GHz. Simulation and measurement outcomes are
27.5 to 31 GHz. Simulation and measurement outcomes are quite similar, although there quite similar, alt-
hough there are slight differences owing to fabrication tolerances and
are slight differences owing to fabrication tolerances and measurement errors, as well measurement er-
rors, as well as the uncertainty in the dielectric constant parameter of dielectric
as the uncertainty in the dielectric constant parameter of dielectric substrates at 30 GHz, substrates
at 30 GHz,
whose value whose value can be
can be influenced by influenced by other such
other characteristics characteristics such anisotropy,
as the material as the material
the
anisotropy,
substrate the substrate
thickness, or the thickness, or the copper roughness.
copper roughness.

Figure5.5.Return
Figure Returnloss
lossand
andisolation
isolationresults
resultsfor
foraasingle
singleradiating
radiatingelement.
element.

In order to measure the circular polarization radiation pattern of the manufactured

radiating element prototype, a beamformer chip is assembled to feed the orthogonal
polarizations of each radiating element. This beamformer chip includes a 5-bit phase control
and a 5-bit gain control for each of its eight channels, in a 6 mm × 6 mm QFN package.
Electronics 2021, 10, 1621 7 of 12
Electronics 2021, 10, x FOR PEER REVIEW 7 of 13

Figure6.6.Smith
Figure Smithchart
chartofofthe
thereturn
returnloss
lossand
andisolation
isolationresults
resultsfor
foraasingle
singleradiating
radiatingelement
elementininthe
theKa
Ka
band frequencies from 27.5 to 31
band frequencies from 27.5 to 31 GHz. GHz.

In generate
To order to the measure
RHCPthe circular
and LHCPpolarization radiation
radiation patterns, wepattern
feed theof the manufactured
input ports with
radiating
the same RF element prototype,
signal but a beamformer
with a phase chip the
shift between is assembled
vertical andto horizontal
feed the orthogonal po-
polarization
90◦ or −90
oflarizations of◦ each radiating The
, respectively. element.
RHCP This
andbeamformer chip includes
LHCP normalized a 5-bit
radiation phase control
patterns in the
ϕand= 0◦a plane
5-bit gain
at 28control
and 30for
GHzeachareofdepicted
its eightinchannels,
Figure 7.inThe
a 6 measurement
mm × 6 mm QFN package.
results show a
rippleTo generate
caused by thethemeasurement
RHCP and LHCP system radiation
effect aspatterns,
well as the wefinite
feed ground
the input ports
plane of with
the
the same RF
prototype thatsignal but with
produces edgeadiffraction.
phase shift Forbetween the vertical and
both polarizations, 28horizontal
and 30 GHz polarization
co-polar
components
of 90° or −90°, show a maximum
respectively. Thedirectivity
RHCP and of 6.5
LHCPdBi normalized
with a wide radiation
beam-width of about
patterns 95◦φ
in the .
= 0° plane at 28 and 30 GHz are depicted in Figure 7. The measurement results show a
3.2. 2 ×caused
ripple 2 Arrayby Performance
the measurement system effect as well as the finite ground plane of the
The 2 ×that
prototype 2 array shownedge
produces in Figure 8 is the For
diffraction. basicboth
unitpolarizations,
cell of the Ka-band
28 and transmitter. In the
30 GHz co-polar
× 2 array, theshow
2components antenna elements are
a maximum configured
directivity by using
of 6.5 a sequentially
dBi with rotated manner,
a wide beam-width where
of about 95°.
two adjacent radiators are separated by 5.3 mm. This configuration leads to an improvement
of both polarization purity and radiation pattern symmetry [30], and its size allows for the
subsequent assembly of the MMIC component on the bottom side of the PCB.
The complete Ka-band antenna will be built with many of these unit cells, so to
maintain the distance of 5.3 mm between antenna elements, the 2 × 2 array must not be
larger than 10.6 mm × 10.6 mm. Because of this, the H-slots (L4) and the input ports in
the bottom layer are orthogonally placed in order to achieve the integration of the whole
feeding network, from chipset to patch, in a minimum space.

3.2.1. Coupling
It is well known that a smaller spacing between elements is desirable for a compact
array because it helps to suppress the grating lobes when scanning. Although a half-
wavelength spacing minimizes the grating lobes, due to multiple factors, it might not
be possible to achieve this integration density. For example, the size of the beamformer
Electronics 2021, 10, 1621 8 of 12

chips that must be placed on the opposite face of the PCB limits the density of radiating
elements, because it is very challenging to bring the chips nearer and still have room for the
RF distribution or DC biasing. Furthermore, a smaller spacing results in higher coupling
between antenna elements. In Figure 9, mutual coupling outcomes for the antenna array
are plotted.
To keep a low active reflection coefficient and acceptable axial ratio of the beam
scanning array, mutual coupling levels should be lower than −20 dB [31]. Looking at
Figure 5, it is clear that almost all the S-parameters are able to meet this condition in the
frequency of interest, showing a worst case of −18 dB in a small frequency band from8 26.5
Electronics 2021, 10, x FOR PEER REVIEW of 13
to 28 GHz. Besides, it is verified that the mutual coupling is reduced when the frequency
increases because the electrical distance between the radiating elements also increases.

Figure7.7.Antenna
Figure Antenna element
element normalized
normalized radiation
radiation patterns
patterns at ϕ = at
0◦ φ
for=RHCP
0° for(above)
RHCP and
(above)
LHCP and LHCP
(below).
(below).

3.2. 2 × 2 Array Performance

The 2 × 2 array shown in Figure 8 is the basic unit cell of the Ka-band transmitter. In
the 2 × 2 array, the antenna elements are configured by using a sequentially rotated man-
ner, where two adjacent radiators are separated by 5.3 mm. This configuration leads to an
Electronics 2021, 10, 1621 9 of 12
Electronics 2021, 10, x FOR PEER REVIEW 9 of 13

Figure 8. 2 × 2 antenna array configuration (left); the manufactured prototype (right).

3.2.1. Coupling
It is well known that a smaller spacing between elements is desirable for a compact
array because it helps to suppress the grating lobes when scanning. Although a half-wave-
length spacing minimizes the grating lobes, due to multiple factors, it might not be possi-
ble to achieve this integration density. For example, the size of the beamformer chips that
must be placed on the opposite face of the PCB limits the density of radiating elements,
because it is very challenging to bring the chips nearer and still have room for the RF
distribution or DC biasing. Furthermore, a smaller spacing results in higher coupling be-
tween antenna elements. In Figure 9, mutual coupling outcomes for the antenna array are
Figure 8.
Figure
plotted.8. 22 ×
× 22antenna
antenna array
array configuration
configuration (left);
(left); the
the manufactured
manufactured prototype
prototype (right).
(right).

3.2.1. Coupling
S31 Meas S41 Meas S51 Meas S61 Meas S71 Meas S81 Meas
It is well known that a smaller spacing between elements is desirable for a compact
S31 Sim S41because
array Sim S51to
it helps Sim
suppress S61 Sim
the grating S71
lobes Simscanning.
when S81 Sim
Although a half-wave-
length spacing minimizesSthe parameters
grating lobes, due to multiple factors, it might not be possi-
-10 ble to achieve this integration density. For example, the size of the beamformer chips that
must be placed on the opposite face of the PCB limits the density of radiating elements,
because it is very challenging to bring the chips nearer and still have room for the RF
-20
distribution or DC biasing. Furthermore, a smaller spacing results in higher coupling be-
tween antenna elements. In Figure 9, mutual coupling outcomes for the antenna array are
Array Coupling (dB)

-30 plotted.

S31 Meas S41 Meas S51 Meas S61 Meas S71 Meas S81 Meas
-40
S31 Sim S41 Sim S51 Sim S61 Sim S71 Sim S81 Sim

-50 S parameters
-10

-60
-20
Array Coupling (dB)

-70
-30
26 27 28 29 30 31 32
Frequency (GHz)
-40
Figure 9. Mutual coupling results.

-50 3.2.2. Radiation Parameters

To carry out the circular polarization radiation parameters measurements, we connect
-60 and program the beamformer chip to feed the patches with the same amplitude RF signal,
and different phase. Figure 10 shows the normalized radiation patterns in the ϕ = 0◦ cut at
28 and 30 GHz for the RHCP and LHCP.
-70 Co-polar results present a beam-width in the range of 53.4◦ (27.5 GHz) to 42.1◦
26 (31 GHz) 27with directivity
28 values 29 in boresight 30 31 10.7 dBi 32
that varies from to 12.9 dBi, respec-
Frequency (GHz)
tively. Good cross-polar discrimination levels below − 15 dB are also achieved.
Lastly, Figure 11 shows the axial ratio in boresight as a function of frequency for both
Figureand
polarizations, RHCP 9. Mutual
LHCP.coupling results.
In the whole band of interest, values below 3 dB are achieved,
ensuring a good circular polarization purity. These data improve when frequency increases.
 Besides, it is verified that the mutual coupling is reduced when the frequency increases
because the electrical distance between the radiating elements also increases.

3.2.2. Radiation Parameters

To carry out the circular polarization radiation parameters measurements, we con-
Electronics 2021, 10, 1621 10 of 12
nect and program the beamformer chip to feed the patches with the same amplitude RF
signal, and different phase. Figure 10 shows the normalized radiation patterns in the φ =
0° cut at 28 and 30 GHz for the RHCP and LHCP.

Electronics 2021, 10, x FOR PEER REVIEW 11 of 13

Co-polar results present a beam-width in the range of 53.4° (27.5 GHz) to 42.1° (31
GHz) with directivity values in boresight that varies from 10.7 dBi to 12.9 dBi, respec-
tively. Good cross-polar discrimination levels below −15 dB are also achieved.
Lastly, Figure 11 shows the axial ratio in boresight as a function of frequency for both
polarizations, RHCP and LHCP. In the whole band of interest, values below 3dB are
achieved, ensuring a good circular polarization purity. These data improve when fre-
Figure 10.
Figure 2 2× ×
2 array normalized
2 array radiation
normalized patterns
radiation at φ = 0°
patterns atfor
ϕ RHCP (above)
= 0◦ for RHCP and LHCP and
(above) (be- LHCP (below).
quency10.
low). increases.

Figure 11.
Figure 11. Axial
Axialratio
ratiomeasurements
measurementsfor the
for 2the
× 22array
× 2 normalized radiationradiation
array normalized patterns at φ = 0° for
patterns at ϕ = 0◦ for
RHCP and LHCP.
RHCP and LHCP.
4. Discussion
In this work, a new design of a wideband and wide beam-width circularly polarized
2 × 2 antenna array covering the full Ka-band, from 27.5 to 31 GHz, has been proposed.
The proposed design is well suited for integration with cost-effective silicon beamformer
chips, and it is aimed at implementing wide scanning angles in Ka-band transmit anten-
nas in mobile platforms.
Electronics 2021, 10, 1621 11 of 12

4. Discussion
In this work, a new design of a wideband and wide beam-width circularly polarized
2 × 2 antenna array covering the full Ka-band, from 27.5 to 31 GHz, has been proposed.
The proposed design is well suited for integration with cost-effective silicon beamformer
chips, and it is aimed at implementing wide scanning angles in Ka-band transmit antennas
in mobile platforms.
The antenna array has been fabricated and a complete experimental characterization
has been provided in this paper. The results are in good agreement with simulations,
although there are some discrepancies caused by fabrication tolerances, measurement
errors, and the uncertainty of the material properties in the Ka-band.
With the aim of reaching a compromise between price and performance, in a reduced
area and a low profile, the design has been implemented in a planar technology using a
standard multilayer PCB manufacturing process. Several techniques to improve perfor-
mance have been applied, such as stacked patches, aperture coupling, cavity backing and a
sequential rotation configuration. Thus, with a radiating element that yields a bandwidth
of 16.5%, the 2 × 2 antenna array provides a wide beam-width ranging from 53.4◦ to 42.1◦ ,
while the maximum directivity varies between 10.7 and 12.9 dBi. Mutual coupling less
than −20 dB and an axial ratio below 3 dB at all frequencies are obtained.

Author Contributions: Conceptualization, methodology, 3D modelling, multi-layer PCB stack-up

definition, investigation, simulations, and experimental validation was carried out by H.B., G.R. and
I.B.; H.B. carried out the original draft preparation and G.R. contributed to the writing of the paper.
F.J.C. and S.C. were in charge of the project supervision and funding acquisition. All authors have
read and agreed to the published version of the manuscript.
Funding: This work was partially supported by Spanish MINECO-FEDER project RTC2019-007039-7.
Data Availability Statement: Data is contained within the article.
Conflicts of Interest: The authors declare no conflict of interest.

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