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4.1 INTRODUCTION 31
4.2 SUPERSTRATE LAYER 31
4.3 ANTENNA DESIGN 32
4.4 FRESNEL LENS 34
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Chapter 4: Functional chip package for gain enhancement
4.1 INTRODUCTION
The optimization of a square patch-based AMC was discussed in Chapter
3. The AMC surface significantly improves the gain of the on-chip antenna. In this
chapter, the superstrate layer and Fresnel lens are examined to act as functional chip
packages, giving features of both gain enhancement and chip protection in order to
improve on-chip antenna radiation performance. In this final chapter, the completed
antenna design, along with the functional package, is given as a SoP solution.
Figure 4.1 Cross section view of AoC stackup with superstrate layer
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Chapter 4: Functional chip package for gain enhancement
The sketching tools in the CST are used to create the 72.5 GHz
monopole antenna for a silicon substrate illustrated in Figure 4.2. The antenna's position
is entered using the Property Editor, and the dimensions are added as variables with set
values. To enable parametric optimization, it is advantageous to express every design
parameter as a variable. The material library for the material can be used to assign the
antenna's material qualities, just like it can for the substrate. According to the
requirements of the foundry, copper is chosen as the antenna material in this design.
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Chapter 4: Functional chip package for gain enhancement
In this work, only a 1.5×0.8 mm2 chip area over the whole chip area of
1.5×1.5 mm2 was used for the AoC design. So, the monopole antenna is a good choice
for the design of the on-chip antenna whose dimensions are given as follows and the
calculated and the actual dimensions for the antenna are calculated with the given
equations [24]:
c
Width of the antenna, w=2w 2+2 w3 + w4 =¿ . √❑ (4.1)
2fr
ε r +1 ε r −1
Effective dielectric constant, ε eff = + .¿ (4.2)
2 2
c
Effective length, Leff or l 1= (4.3)
2 f r √❑
Where, c is speed of the light; ε ris the permittivity of the substrate, f r is the resonant
frequency, and h is the thickness of the substrate.
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Chapter 4: Functional chip package for gain enhancement
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Chapter 4: Functional chip package for gain enhancement
[25]. This method may produce a flat Fresnel lens devoid of grooves as well as enhance
lens performance. The difficulty of production is increased by the incorporation of
several dielectric materials. A Fresnel lens with grooves was constructed in this design
using a single dielectric material.
The EM waves from the AoC at the focal point travel an extra distance,
from the surface of the sphere to the edge of each zone plate, as seen in Figure 4.3.
λo
Δ= n . (4.7)
P
r n =√ ❑ (4.8)
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Chapter 4: Functional chip package for gain enhancement
Fresnel lens is far enough to be in the AoC's far-field region thanks to its 2.7 mm focal
length.
The lens was grooved into four-layer zone plates with depths of d, 2d,
and 3d for a quarter-wavelength lens. In [18], the depth d is provided.
λo
d= (4.9)
4.¿¿
Where ε r represents the lens material's permittivity. It should be noted that the
permittivity has an inverse relationship with lens thickness. To achieve a small design,
PREFERM 3D ABS filament, a high permittivity and low-loss material, was used. The
comparison for the dimensions in fresnel lens given in [1] and the calculated ones are
given in table 4.2.
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