Defect Explanation of the Reason for the occurrence
defect
 Incomplete Adhesives are not
curing. completely cured
therefore bond between
the adherents are not
strong. Adherent can be
slip each other.
 Air entrapment Air entrapment can be
source of failure especially
in small applications.
 Adhesion Failure Due to contamination of
impurities can potentially
cause loss of adhesion
over time
Remedies to avoid
 Total curing time and  The final strength of
the sufficient air the adhesive bond is
content were not got achieved only after
for the curing. curing; the adhesive
needs a particular
wait time to solidify
before bonding two
materials. And it
would like to take
good air content.
 Air gaps could prevent  Removal of air from a
the adhesive from system , prior to
interfacing fully with application may be a
the substrate surface necessary processing
which may result in step.
decrease strength.
 Poor bonding process  Controlling the
cleaning process
 Components may have
been improperly
cleaned
 Incorrect cure This defect may occur
locally, but it is more likely
to occur throughout the
whole bond line.
 Because of  Controlling the
contaminants or poor cleaning process at
mixing, because of the usage sight, not
incorrect formulation using of any silicone
or mixing, or thermal compounds. Mixing
exposure. of the original
container, Ensuring a
homogenous mix of
each component
prior to mixing (for
two parts) is vital to
achieve maximum
properties.
 Tensile, Cohesive failure of the  Shear stresses  By using good
Compressive, or adhesive occurs when the produced by tensile, bonding design. But
shear failure of load exceeds the inherent torsional or pure shear joints are best used
the adherents. adhesive strength loads on substrate. when stresses
concentrated along
the bond line and
perpendicular forces
are minimal.