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Organic field-effect transistors (OFETs) are currently the the attractive processing properties of polymers while it sim-
focus of intense research efforts in numerous academic and plifies device fabrication by utilizing a single semiconductor
industrial research laboratories around the world. Over the layer. However, despite these promising preliminary results
past decade OFETs have emerged as promising candidates there is still a drawback associated with most ambipolar
for electronic device applications requiring low cost and OFETs reported to date, which is the relatively low carrier
large area coverage, mechanical flexibility, and low tempera- mobility.7–10 For example, in the work by Meijer et al. the
ture processing.1 Several groups have demonstrated OFET- maximum ambipolar carrier mobilities reported were in the
based circuits with performances sufficient for practical ap- order of 10−5 cm2 / V s (for both electrons and holes) for nar-
plications. Few examples of such applications include row band gap based polymeric OFETs, and 10−5 cm2 / V s
switching devices for flat panel displays2–4 and integrated (electrons) 10−3 cm2 / V s (holes) for OFETs based on
circuits.4–6 To date the largest organics-based electronic cir- polymer-small molecule interpenetrating networks.7 More-
cuit reported is the standard logic based 32-stage shift regis- over, Dodabalapur et al. have observed that the electron mo-
ters that consists of 1888 transistors capable of operating at a bility in ambipolar OFETs employing an organic heterostruc-
frequency of 5 kHz.4 As the number of transistors per circuit ture of C60 / ␣-6T is lower by a factor of 16 when compared
increases there is an increasing need for circuits character- with the electron mobility measured in pristine C60
ized by low power dissipation, high noise margin, and OFETs.8,11 Since carrier mobility is the main limiting factor
greater operation stability. In silicon-based microelectronics in the operating frequency of complementary organic cir-
such requirements are met through the use of complementary cuits, ideally, one would like to have materials with much
metal–oxide–semiconductor (CMOS) logic where an n- and higher mobilities for both electrons and holes.12,13
a p-type transistor are combined to built logic circuits. In- We have recently discovered that OFETs based on the
deed, examples of organic CMOS logic have show that it is solution processable methanofullerene derivative [6,6]-
possible to make large-scale integrated circuits (up to 864 phenyl-C61-butyric acid methyl ester (PCBM) exhibit ambi-
transistors per circuit) with much lower power dissipation.6 polar transport characteristics even when a high work func-
In the work by Crone et al., however, the transistor channels tion metal (Au) is employed as the source and drain
had to be spatially separated in order to facilitate the separate electrodes.14 We found that the carrier mobilities in this par-
vacuum deposition of the two semiconductors (an n- and a ticular methanofullerene are in the order of 1
p-type), thus making circuit fabrication difficult and poten- ⫻ 10−2 cm2 / V s for electrons and 8 ⫻ 10−3 cm2 / V s for holes
tially expensive. with on-off current ratios ⬃106. Here, we demonstrate that
Recently an alternative approach towards organic CMOS PCBM based ambipolar OFETs can be used for fabrication
circuits has been proposed.7 In their work Meijer et al. have of CMOS-like logic inverters with good operating
demonstrated that by employing identical ambipolar OFETs characteristics.
based on polymer-small molecule interpenetrating networks Field-effect transistors were made using heavily doped
as well as narrow band gap polymers, CMOS-like voltage p-type Si wafers as the common gate electrode with a
inverters can be fabricated. This approach makes full use of 200 nm thermally oxidized SiO2 layer as the gate dielectric.
Using conventional photolithography, gold source and drain
a)
Author to whom correspondence should be addressed; electronic mail: electrodes were defined in a bottom contact configuration
thomas.anthopoulos@philips.com with channel width of 1000 m and lengths in the range
FIG. 2. (a) Extracted contact resistance 共RC兲 vs gate bias 共VG兲 for PCBM
FIG. 1. Room temperature transfer characteristics for a PCBM based OFET based OFETs. The value of RC was calculated in the linear regime 共兩VD兩
with a characteristic channel length and width of 20 and 1000 m, respec- = 2 V兲 in both p- and n-channel mode of operation. (b) Simplified energy
tively. (a) Transistor operation in electron accumulation at VD = + 20 V. Inset level diagram for Au and PCBM before and after contact.
shows the schematic diagram of the top view of the ring-type transistor
geometry used and the molecular structure of PCBM. (b) Transistor opera-
tion in hole accumulation at VD = −20 V. The drain current in (b) observed
for VG in the range 兩VD兩 ⬎ 兩VG兩 艌 0 V is due to electron contribution (see
In order to obtain some insight in the contact effects
Refs. 7, 10, and 14). present in our devices we have calculated the contact resis-
tance RC (drain+ source contacts) using the transmission line
method described elsewhere.16–18 Figure 2(a) shows the de-
0.75– 40 m. A 10 nm layer of titanium was used acting as rived values of RC as a function of gate voltage in n- as well
an adhesion layer for the gold on SiO2. The SiO2 layer was as p-channel operating regime. It is evident that for both
treated with the primer hexamethyldisilazane prior to semi- channels RC is strongly dependent on VG. The contact resis-
conductor deposition in order to passivate its surface. The tance for the p channel, however, is several orders of mag-
drain electrode was contained within a circular source elec- nitude higher than the values measured for the n channel,
trode [inset Fig. 1(a)] in order to minimize parasitic leakage implying a severely contact limited device operation. Such
currents.15 Films were spun from a 10 mg/ ml solution of high resistance is consistent with the presence of a rather
PCBM in chlorobenzene at 500 rpm for 1 min. The molecu- large injection barrier for holes14 and can be better under-
lar structure of PCBM is shown in inset of Figs. 1(a) and stood in terms of the energy level diagram shown in Fig.
1(b). All freshly prepared devices were annealed in vacuum 2(b). In this diagram the energy difference between the
of 10−7 mbar at 120 ° C for several hours. All electrical mea- Fermi level of Au and the energy levels of PCBM, before
surements were performed in high vacuum of 10−7 mbar at and after contact, are shown. For simplicity, here the energy
levels are drawn flat but in reality band bending occurs upon
room temperature 共24 ° C兲 using an HP 4156B semiconduc-
contact as well as upon application of a gate bias. From the
tor parameter analyzer.
band offsets (before contact), potential barriers ⌽B共h兲
Figure 1 shows the transfer characteristics of an ambipo-
⬃ 1 eV for holes and ⌽B共e兲 ⬃ 1.4 eV for electrons, are ex-
lar PCBM based OFET (L = 20 m, W = 1000 m) in elec-
pected. Contrary to our expectations, however, such barrier
tron enhancement [Fig. 1(a)] and hole enhancement [Fig.
heights are in contrast with the experimental data of Fig. 1.
1(b)] operating mode. Maximum electron and hole mobilities We ascribe this discrepancy to a shift in the vacuum potential
measured are 1 ⫻ 10−2 cm2 / V s (at VG = 20 V, VD = 20 V), at the interface 共⌽D兲 towards the LUMO level of PCBM by
and 8 ⫻ 10−3 cm2 / V s (at VG = −75 V, VD = −20 V), ⬃0.64 eV, upon contact.19 Taking this shift into account the
respectively.14 From Fig. 1(b) it is evident that for p-channel injection barrier for electrons is expected to decrease
operation the transistor exhibit a high switch-on voltage of 关⌽B共e兲 − ⌽D = 0.76 eV兴, while the barrier for holes to in-
approximately −40 V. This observation suggests either the crease by an equal amount 关⌽B共h兲 + ⌽D = 1.64 eV兴. Although
presence of a significant density of hole traps at the these predictions are based on the simplified energy level
SiO2 / PCBM interface and/or the existence of a large contact model of Fig. 2(b), they are qualitatively consistent with the
barrier for hole injection from Au into the higher occupied experimental data of Figs. 1 and 2(a).
molecular orbital of PCBM.14 The barrier to electron injec- The transfer characteristics of a PCBM-based
tion from Au into the lower unoccupied molecular orbital complementary-like inverter are shown in Fig. 3. The inset in
(LUMO) of PCBM, on the other hand, appears to be rela- Fig. 3(a) displays the schematic of the CMOS-like inverter
tively small exhibiting a switch-on voltage of only +3 V [see circuit employed. The channel dimensions for both OFETs
Fig. 1(a)]. were identical and equal to L = 10 m, W = 1000 m. In the
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Appl. Phys. Lett., Vol. 85, No. 18, 1 November 2004 Anthopoulos et al. 4207
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