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Introduction to Fundamentals of

Mixed Signals and Sensors


Lesson 1
Integrated Circuit (IC) is a device where discrete circuit compose of different passive devices such as resistors, capacitors,
inductors and active devices such transistors, diode, FET and the likes are package into a tiny chip to achieve the goal of
miniaturization and simplification of complex circuits.

Operational Amplifier (OP amp) is just one product that came from such process that the industries still utilized for
commercial, industrial, medical military ……… . This module will introduce you to Integrated circuit and 741 a general
purpose OP amp.
Characteristics of electronics product such as home entertainment system using discrete components
.
•Require bigger area even for a basic circuit
•Will always require larger voltage
•Work with higher power (high power dissipation)
•It’s performance is not good (the final output comes with a lot of nose and interference)
•It is very costly

History will tell us that before the mass production and commercialization of integrated circuit electronics (IC), discrete
electronics circuit such as audio amplifier is already cumbersome and costly.

With the advent in the development of technology in the field of semiconductor processing and production, the first
semiconductor integrated circuit (IC) was developed by Robert Noyce at Fairchild Semiconductor in 1959 where active and
passive component were integrated into a single chip, this simplify some existing circuit at that time, through the years
improvement in IC fabrication, integration improve.

So where IC do came from?


It start with sand converted to a semiconductor ingot, cut into a wafer that is process through photolithography that etched
the design, then cut into single chip die then bond to lead-frame and encapsulated with resin.
With the advent in the development of technology in the field of semiconductor processing and production, the first
semiconductor integrated circuit (IC) was developed by Robert Noyce at Fairchild Semiconductor in 1959
where active (Transistors, FET, MOSFET, SCR, Triac, Diode….) and passive (resistors , capacitors,
& inductors ) component were integrated into a single chip, this simplify some existing circuit at that time, through the years
improvement in IC fabrication, integration improve.

Figure 5 shows that there are 19 transistors and 12 passive devices inside the 741 IC chips all in all there is 31 components inside
the 741 chip which means that this device fall under the small scale integration or an SSI device.
With the improvement in IC fabrication electronics circuit using IC are
•Generally small in size
•Can be designed to work on low voltage
•Work with low power (low power dissipation)
•Through improvement in integration improve performance are attainable
•Very cheap when mass produce for commercial application
Integrated Circuit, or IC, is small chip that can be designed for general purpose application or the other one is
designed specific function (or often called dedicated devices).

A general purpose OP amp IC device can be configured to function as


an amplifier, oscillator, filter, comparator, timer, signal generator, power supply etc……. by simply changing the
circuit diagram for each application. (LM741)
IC Packaging
IC are package depend on its application, with the development of technology there are about 78 or more type
of IC packages being utilize by semiconductor manufacturing companies. That is why it is very important for us
users of the device to be able to identify the right terminal and its function for the device, here are some IC
packages
OP amp Terminals
In order for us to analyze and even design electronics circuit that uses IC devices we should first be able to identify from the rest
of the electronics device that we are working with, that is why we will start with the schematic symbol of a general purpose OP
amps device. And it start with a well-known device the 741 shown in fig 10.
A single device such as 741 are used for commercial, industrial and military application, but each applications requires
different working temperature range that is why each devices uses different wire bond materials. The table below shows the
temperature range for the three application
IC Coding
If you look at fig you will see the code LM741CN this code tell us the following:
•Manufacturer
•The type of Device
•Application
•Packaging
Japanese Semiconductor
NEC UPC741C
Hitachi HD/HA1741
Toshiba T41
Zilog Z741

Ideal Characteristics of OP amp LM741


Large Open Loop Gain 200,000
High Input Impedance 1.5MWW
Low Output impedance
High Bandwidth 1.5Mz
0 Input Bias Current 80na

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