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High-Density Power Management
Applications that demand: high density + efficiency
Application Trends
0603
Capacitors
0402
%
% 𝐵&'$
∝ 𝜀 # 𝐸!"#$ # 𝑉𝑜𝑙 ∝ # 𝑉𝑜𝑙
0201
𝜇
Relatively higher Relatively lower
Inductors
General tradeoffs: winding and core *coilcraft/murata SMD
loss, thermal and saturation limits… (w/ factor in Isat/Imax)
Volume
97% efficiency Buck
[Renz & Wicht
𝝋𝟏 1 VOUT VOUT
VOUT
Perspective: Perspective:
• Min cap (dielectric) volume to block VIN-VOUT • Min switch rating (area etc.) to block VIN-VOUT
• ..But requires switches to absorb high • ..But requires capacitors to absorb high
voltage stress voltage stress
t
[Pasternak et al., “Modeling and Performance Limits of [Lei et al., “A General Method for Analyzing Resonant and
Switched-Capacitor DC–DC Converters Capable of Soft-Charging Operation of Switched-Capacitor
Resonant Operation with a Single Inductor,” JESTPE ’17] Converters,” TPEL ’15] 8
Other Considerations: Hybrid/Resonant πIDC/2 iLx indirect
t
Direct vs indirect conversion [Schaef TPEL ’18; Kesarwani TPEL’15]
VDD VDD
πIDC/2
iLx direct • Power loss in inductor
t
(depends on current PSD)
vs • Voltage stress limits
πIDC/2 iCbp
iLx indirect
-IDC/2
t (difft. for direct vs indirect)
t • Multimode Operation
[Kesarwani APEC ’15] (CCM à DCM, Resonant vs PWM)
πIDC/2
iLx direct
Bypass (decoupling) capacitance Flying Capacitor Voltage Balance
Vin Iin,dc t
VOUT ¼ VIN
iCbp
iin,ReSC t Vx
-IDC/2 C +
io -
iio Iout
+ iout,ReSC iL
Cig iig ReSC Vout
-
Converter • Inductor ‘decouples’ flying capacitor voltages
Cog
+
iog Iout,dc
• High-order system dynamics, voltage drift
-
• Imbalance à higher voltage stress & ripple
[Rentmeister COMPEL ’17] [Meynard, Prodic, Corradini, Ruderman, Reusch, etc. ]
Topology Comparison
Many possible hybrid-SC topologies, Which is best?
Vin Vin Vin
SN 1x 1x SN* Φ1
Φ2 (N-1)x
Φ1 Φ2
CN-1
1x 1x Φ1
CN-1
• Active device utilization?
CN-1
CN-1
(N-1)x 1x (N-1)x
(N-1)x
Φ1 1x 1x
(N-1)x
Φ2 • Passive component utilization?
• Other considerations?
(N-1)x Φ2
S3 1x 1x S3* 1x
Φ1 Φ1
Φ2 1x 1x Φ1
C2
2x
C2
1x
2x
C2
2x
Φ1
2x
C2
Exercise: Pasternak, Kiani, McLaughlin
1x 1x Φ2
2x Φ2 [Compel ’17,’18; TPEL ‘21]
S2 1x 1x S2 *
Φ1 1x Φ1
C1
Φ2 1x 1x Φ1
C1
• Minimum power loss FOM
C1 C1
1x
1x
1x
1x
1x
Φ1 1x Vout 1x
1x
Φ2 (active devices and inductor)
Φ2
S1 1x
Vx
1x S1*
1x Vx
IL
Φ2 1x 1x Φ1
IL
• Size constraints on passive
IL IL Φ1 1x 1x Φ2
components
Vout Vout
[McLaughlin et al., “Analysis and Comparison of Hybrid-
FCML Series Parallel Dickson Resonant Switched-Capacitor DC–DC Converters With
(Direct) (Direct) (Indirect) Passive Component Size Constraints,” TPEL ’21]
Comparison Development: minimum
power loss in arbitrary dc-dc converter
Φ2
Vin
(N-1)x
*V
PSW = in
å
iÎswitches
Psw* ,i V= 2 Rsp 0 Esp 0 ´ V f sw
SN
in in
ΦiÎ
å
switches
I rms ,i × vra,i/2
Φ2 1x 1x 1
Φ1 Φ1 SN 1x 1x SN* 1x SN* CN-1 CN-1
CN-1 CN-1 1x CN-1 Charge multiplier Switch voltage rating
Convex optimization, Φ1 1x Φ2
1x
(DC current)
Vx
(N-1)x
Φ2
(N-1)x
optimal switch sizing
1x RMS/DC ratio
S3
Modified Sum(AV)
å
1x S3 1x 1x S3* 2x S3*
b r ,i ar ,i vra,i/2
Φ1 Φ1
P *
= 2 I out Rsp 0 Esp 0 ´ f sw
Φ2 1x 1x Φ1
C2 C2 1x C2 C2 C2
2x 2x SW
Φ
Φ2
Vx
1x iÎswitches
1 1x 1x Φ2
S2 1x 1x S2* S2 2x S2* Φ2 1x
Φ1 1x Φ1 1x Φ1
C1 C 1x C1
C1 α =C Voltage scaling parameter
1
1x 1x DC load current
1
Φ1 1x Vout 1x Φ2
Φ2
Baseline Specific
1x IL α ≈ 3I L
CMOS (constant field)
S1 1x 1x * 1x *
S1 Relative/normalized Φ2 1x 1x Φ1
Vx Vx Parameters
S1 Vx S1
1x
switching frequencyΦ1
α≈2 CMOS (cascode)
IL IL IL 1x 1x Φ2
(depends on L & C) 0<α<2 GaN, SiC, discrete Si
Vout Vout Vout
(a) Series Parallel [Kiani, Compel
(b) FCML ’18] (c) Dickson (d) Stacked-Ladder (Dickson)
@ 𝛼 = 0 →All devices same rating
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Comparison Development: minimum
power loss in arbitrary dc-dc converter
Active device @Same VCR, Iload, fsw: Topology with
lowest ∑𝛽𝑎𝑣 achieves lower loss; better
utilization:
use of available semiconductor Rsp*Esp
Series-Parallel Dickson
*Dickson Topologies: 1. Split Phase Dickson: [Lei & Pilawa, TPEL ’16]
à Competing ‘dual’ advantages: 2. Stacked Ladder: [Li & Sanders, ECCE ’16]
rallel
-Pa ML
ML ri es
FC
F C Se
el
Lower
s-P arall Lower
is Serie is
better better
Dickson Dickson
Boundary
FSL/SSL
~Q
ß
Hi
C Realistic inductor
gh
er (fixed size, fixed L/R)
@
Boundary
FSL/SSL
L
fix Optimum L
ed Lo (or # turns)
s w
ize er L @fixed volume
à
~Q
Boundary
FSL/SSL
L
fix
ed Lo
s we
ize rL
à
Larger Smaller
Increasing
inductor volume
Ideal inductor model
-1
PMIN µ f SW µ L 4
ReSC Larger = Higher L/R
fsw/fFSL 17
@ Fixed Total Passive Component Size
@Large C, Small L: @Large L, Small C: Optimal Sizing
[Kiani COMPEL ’18]
[McLaughlin TPEL ’21]
35%
𝑉𝑜𝑙, 𝐿
ore Loss)
on C
30% r (D epends
o
red-Induct
Co
25% Winding AC-resistance dominant
on
Dicks
arallel
Series-P Dickson
3 N = 4:1
FOM,DC (Normalized)
2.5 FCML
Dickson
2
-P arallel
s
Serie
1.5
0 1 2 3
∝𝒓 (switch scaling parameter)
@𝛼( = 0, All same switches @𝛼( = 2, Cascode scaling: @Long-channel (constant field):
• Series Parallel = Best: • Dickson ~ Better: use of • FCML starts to win (all same
no penalty for HV switches switches more effective *low* voltage switches)
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Caveats to Analysis/Conclusions Rentmeister:
ReSC w/ ZVS APEC ‘19
• Assumes Passive Size is dominant!
(if ‘switch sizes’ are dominant à Dickson-based!)
Cascaded Resonant Converter Lego-PoL: high VCR Dual-Inductor Hybrid DSD/Series Cap Buck
[Ye & Pilawa, TPEL ’20] [Baek & Chen ’19-’21] [Seo/Das & HP. Le ’19-’21] [Nishijima ’05; Shenoy ‘15]
CF La
VIN VOUT
Lb
Ca La
Cb Lb
Cc Lc
Ln
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Some References
J. T. Stauth, “Pathways to mm-scale DC-DC converters: Trends, opportunities, and limitations,” in 2018 IEEE Custom Integrated Circuits
Conference (CICC), 2018, pp. 1–8.
S. R. Pasternak, M. H. Kiani, J. S. Rentmeister, and J. T. Stauth, “Modeling and Performance Limits of Switched-Capacitor DC–DC Converters
Capable of Resonant Operation With a Single Inductor,” IEEE J. Emerg. Sel. Top. Power Electron., vol. 5, no. 4, pp. 1746–1760, Dec. 2017.
P. H. McLaughlin, J. S. Rentmeister, M. H. Kiani, and J. T. Stauth, “Analysis and Comparison of Hybrid-Resonant Switched-Capacitor DC–
DC Converters With Passive Component Size Constraints,” IEEE Trans. Power Electron., vol. 36, no. 3, pp. 3111–3125, Mar. 2021.
Z. Xia and J. Stauth, “17.1 A Two-Stage Cascaded Hybrid Switched-Capacitor DC-DC Converter with 96.9% Peak Efficiency Tolerating
0.6V/μs Input Slew Rate During Startup,” in 2021 IEEE International Solid- State Circuits Conference (ISSCC), 2021, pp. 256–258.
C. Schaef, J. Rentmeister, and J. T. Stauth, “Multimode Operation of Resonant and Hybrid Switched-Capacitor Topologies,” IEEE Trans.
Power Electron., vol. 33, no. 12, pp. 10512–10523, Dec. 2018.
M. H. Kiani and J. T. Stauth, “Passive Component Modeling and Optimal Size Allocation for Hybrid-Resonant Switched Capacitor DC-DC
Converters,” in 2018 IEEE 19th Workshop on Control and Modeling for Power Electronics (COMPEL), 2018, pp. 1–8.
M. H. Kiani and J. T. Stauth, “Optimization and comparison of hybrid-resonant switched capacitor DC-DC converter topologies,” in 2017 IEEE
18th Workshop on Control and Modeling for Power Electronics (COMPEL), 2017, pp. 1–8.
J. S. Rentmeister and J. T. Stauth, “Bypass capacitance and voltage ripple considerations for resonant switched capacitor converters,” in 2017
IEEE 18th Workshop on Control and Modeling for Power Electronics (COMPEL), 2017, pp. 1–8.
K. Kesarwani, R. Sangwan, and J. T. Stauth, “Resonant-Switched Capacitor Converters for Chip-Scale Power Delivery: Design and
Implementation,” IEEE Trans. Power Electron., vol. 30, no. 12, pp. 6966–6977, Dec. 2015.
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