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Vishay Telefunken
Features
D Very high radiant intensity
D Suitable for pulse operation
D Narrow angle of half intensity ϕ = ± 5°
D Peak wavelength lp = 950 nm
94 8483
D High reliability
D Good spectral matching to Si photodetectors
Applications
Radiation source in near infrared range
x
Rise Time IF = 1.5 A, tp/T = 0.01, tr 400 ns
tp 10 ms
x
Fall Time IF = 1.5 A, tp/T = 0.01, tf 400 ns
tp 10 ms
500 250
IF – Forward Current ( mA )
400 200
RthJC
300 150
RthJA
200 100
RthJA
100 50
0 0
0 25 50 75 100 125 0 20 40 60 80 100
94 8017 e Tamb – Ambient Temperature ( °C ) 94 8018 e Tamb – Ambient Temperature ( °C )
Figure 1. Power Dissipation vs. Ambient Temperature Figure 2. Forward Current vs. Ambient Temperature
101 1000
TSTS 7102
IFSM = 2.5 A ( Single Pulse ) 100
0.5 tp / T = 0.01 , tp = 20 ms
10–1 0.1
10–2 10–1 100 101 102 100 101 102 103 104
94 8003 e tp – Pulse Duration ( ms ) 94 8001 e IF – Forward Current ( mA )
Figure 3. Pulse Forward Current vs. Pulse Duration Figure 6. Radiant Intensity vs. Forward Current
104 1000
IF – Forward Current ( mA )
103
Fe – Radiant Power ( mW ) 100
102
10
101
1
100
10–1 0.1
0 1 2 3 4 100 101 102 103 104
94 7996 e VF – Forward Voltage ( V ) 94 7977 e IF – Forward Current ( mA )
Figure 4. Forward Current vs. Forward Voltage Figure 7. Radiant Power vs. Forward Current
1.2 1.6
V Frel – Relative Forward Voltage
1.1
1.2
IF = 10 mA
I e rel ; Fe rel
IF = 20 mA
1.0
0.8
0.9
0.4
0.8
0.7 0
0 20 40 60 80 100 –10 0 10 50 100 140
94 7990 e Tamb – Ambient Temperature ( °C ) 94 7993 e Tamb – Ambient Temperature ( °C )
Figure 5. Relative Forward Voltage vs. Figure 8. Rel. Radiant Intensity\Power vs.
Ambient Temperature Ambient Temperature
1.0
40°
0.75 1.0
0.9 50°
0.5
0.8 60°
0.25 70°
0.7
IF = 100 mA 80°
0
900 950 1000 0.6 0.4 0.2 0 0.2 0.4 0.6
94 7994 e l – Wavelength ( nm ) 94 8019 e
Figure 9. Relative Radiant Power vs. Wavelength Figure 10. Relative Radiant Intensity vs.
Angular Displacement
Dimensions in mm
14486
1. Meet all present and future national and international statutory requirements.
2. Regularly and continuously improve the performance of our products, processes, distribution and operating
systems with respect to their impact on the health and safety of our employees and the public, as well as their
impact on the environment.
It is particular concern to control or eliminate releases of those substances into the atmosphere which are known as
ozone depleting substances ( ODSs ).
The Montreal Protocol ( 1987 ) and its London Amendments ( 1990 ) intend to severely restrict the use of ODSs and
forbid their use within the next ten years. Various national and international initiatives are pressing for an earlier ban
on these substances.
Vishay Semiconductor GmbH has been able to use its policy of continuous improvements to eliminate the use of
ODSs listed in the following documents.
1. Annex A, B and list of transitional substances of the Montreal Protocol and the London Amendments respectively
2 . Class I and II ozone depleting substances in the Clean Air Act Amendments of 1990 by the Environmental
Protection Agency ( EPA ) in the USA
3. Council Decision 88/540/EEC and 91/690/EEC Annex A, B and C ( transitional substances ) respectively.
Vishay Semiconductor GmbH can certify that our semiconductors are not manufactured with ozone depleting
substances and do not contain such substances.
We reserve the right to make changes to improve technical design and may do so without further notice.
Parameters can vary in different applications. All operating parameters must be validated for each customer application
by the customer. Should the buyer use Vishay-Telefunken products for any unintended or unauthorized application, the
buyer shall indemnify Vishay-Telefunken against all claims, costs, damages, and expenses, arising out of, directly or
indirectly, any claim of personal damage, injury or death associated with such unintended or unauthorized use.