www.osram-os.

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Produktdatenblatt | Version 1.1
SFH 4249
 

SFH 4249
Power TOPLED ® Lens
High Power Infrared Emitter (940 nm)

Applications
——CCTV Surveillance ——Industrial Automation (Machine Controls, Light
——Gaming, Amusement, Gambling Barriers, Vision Controls)
——Safety and Security, CCTV
——Gesture Recognition
——White Goods

Features:
——Package: Epoxy, diffuse
——Qualifications: The product qualification test plan is based on the guidelines of AEC-Q101-REV-C,
Stress Test Qualification for Automotive Grade Discrete Semiconductors.
——ESD: 2 kV acc. to ANSI/ESDA/JEDEC JS-001 (HBM, Class 2)
——High Power Infrared LED
——Short switching times
——Half angle: ± 25°


——High forward current allowed at high temperature

Ordering Information 
Type Radiant intensity 1)2) Radiant intensity 1) Ordering Code
typ.
IF = 100 mA; tp = 20 ms IF = 100 mA; tp = 20 ms
Ie Ie

SFH 4249-TU-Z 28 ... 71 mW/sr 50 mW/sr Q65110A8168

SFH 4249-Z 28 ... 112 mW/sr 50 mW/sr Q65110A7519
SFH 4249-U 45 ... 71 mW/sr 50 mW/sr Q65111A9687
SFH 4249-UV 45 ... 112 mW/sr 50 mW/sr Q65111A5273


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Maximum Ratings
TA = 25 °C
Parameter Symbol Values

Operating temperature Top min. -40 °C

max. 100 °C
Storage temperature Tstg min. -40 °C
max. 100 °C
Forward current IF max. 100 mA
Surge current IFSM max. 1A
tp ≤ 100 µs; D = 0 
Reverse voltage 3) VR max. 5V
Power consumption Ptot max. 180 mW
ESD withstand voltage VESD max. 2 kV
acc. to ANSI/ESDA/JEDEC JS-001 (HBM, Class 2)




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Characteristics
IF = 100 mA; tp = 20 ms; TA = 25 °C
Parameter Symbol Values

Peak wavelength λpeak typ. 950 nm

Centroid wavelength λcentroid typ. 940 nm
Spectral bandwidth at 50% Irel,max (FWHM) ∆λ typ. 42 nm
Half angle φ typ. 25 °
Dimensions of active chip area LxW typ. 0.3 x 0.3
mm x mm
Rise time (10% / 90%) tr typ. 12 ns
IF = 100 mA; RL = 50 Ω
Fall time (10% / 90%) tf typ. 12 ns
IF = 100 mA; RL = 50 Ω
Forward voltage 4) VF typ. 1.5 V
max. 1.7 V
Forward voltage 4) VF typ. 2.3 V
IF = 1 A; tp = 100 µs max. 2.9 V
Reverse current 3) IR max. 10 µA
VR = 5 V
Radiant intensity 1) Ie typ. 400 mW/sr
IF = 1 A; tp = 25 µs 
Total radiant flux 5) Φe typ. 65 mW
Temperature coefficient of voltage TCV typ. -1.3 mV / K
Temperature coefficient of brightness TCI typ. -0.5 % / K


Temperature coefficient of wavelength
Thermal resistance junction solder point real 6)
TCλ
RthJS real
typ.
max.
0.3 nm / K
140 K / W
Thermal resistance junction ambient real 7) RthJA max. 300 K / W


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Brightness Groups 
TA = 25 °C

Group Radiant intensity 1)2) Radiant intensity 1)2)

IF = 100 mA; tp = 20 ms IF = 100 mA; tp = 20 ms
min. max.
Ie Ie

T 28 mW/sr 45 mW/sr
U 45 mW/sr 71 mW/sr
V 71 mW/sr 112 mW/sr

Only one group in one packing unit (variation lower 2:1).

Relative Spectral Emission 8), 9)

Ie,rel = f (λ); IF = 100 mA; tp = 20 ms

OHF04134
100
I rel %


80

60

40

20

0
800 850 900 950 nm 1025
λ


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Radiation Characteristics 8), 9)

Ie,rel = f (φ)
40˚ 30˚ 20˚ 10˚ 0˚ OHL00999

ϕ 1.0
50˚

0.8

60˚
0.6

70˚ 0.4

80˚ 0.2

0
90˚

100˚
1.0 0.8 0.6 0.4 0˚ 20˚ 40˚ 60˚ 80˚ 100˚ 120˚

Forward current 8), 9) Relative Radiant Intensity 8), 9)

IF = f (VF); single pulse; tp = 100 µs Ie/Ie(1A) = f (IF); single pulse; tp = 25 µs

OHF03822 OHF03821
100 101
A Ie
IF
I e (100 mA)

10-1
5
 100
5

10-2 10-1
5 5

10-3 10-2
5 5

10-4 10-3 0
0 0.5 1 1.5 2 V 2.5 10 5 10 1 5 10 2 mA 10 3
VF IF


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Max. Permissible Forward Current Permissible Pulse Handling Capability

IF,max = f (TA); Rthja = 300K / W IF = f (tp); D = parameter; TA = 25°C
OHL01716 OHF05438
120 1.2
tP
mA A t
IF D = TP IF

I F 100 1.0 T

D=
0.005
80 0.8 0.01
0.02
0.033
60 0.6 0.05
0.1
0.2
0.5
40 0.4 1

20 0.2

0 0 -5
0 20 40 60 80 ˚C 120
10 10-4 10-3 10-2 10-1 100 101 s 102
TA tp

Permissible Pulse Handling Capability

IF = f (tp); D = parameter; TA = 85°C
OHF05708
1.1
tP
A t
IF D = TP IF


T
0.9

0.8
D=
0.7 0.005
0.01
0.6 0.02
0.05
0.5 0.1
0.2
0.4 0.5
1
0.3

0.2

0.1

0 -5
10 10-4 10-3 10-2 10-1 100 101 s 102
tp


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Dimensional Drawing 10)

3.5 (0.138) max.

3.0 (0.118) 2.1 (0.083)

2.6 (0.102) 1.7 (0.067)
2.3 (0.091) 0.9 (0.035)
2.1 (0.083) 0.7 (0.028)
3 4

4˚±1

ø2.60 (0.102)
ø2.55 (0.100)
(2.4) (0.095)
3.4 (0.134)
3.0 (0.118)

3.7 (0.146)
3.3 (0.130)
0.1 (0.004) typ

2 1 1.1 (0.043) 0.6 (0.024)

Package marking 0.5 (0.020) 0.18 (0.007)
0.4 (0.016)

0.13 (0.005)
GPLY6128

Further Information:
Approximate Weight: 37.0 mg

Package marking: Cathode

Pin Description

1 Cathode


2 Anode
3 Anode
4 Anode


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Recommended Solder Pad 10)




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Reflow Soldering Profile

Product complies to MSL Level 2 acc. to JEDEC J-STD-020E
OHA04525
300
˚C
T 250
240 ˚C Tp 245 ˚C
217 ˚C tP
200
tL

150
tS

100

50
25 ˚C
0
0 50 100 150 200 250 s 300
t

Profile Feature Symbol Pb-Free (SnAgCu) Assembly Unit

Minimum Recommendation Maximum
Ramp-up rate to preheat*) 2 3 K/s
25 °C to 150 °C
Time tS tS 60 100 120 s
TSmin to TSmax
Ramp-up rate to peak*) 2 3 K/s


TSmax to TP
Liquidus temperature TL 217 °C
Time above liquidus temperature tL 80 100 s
Peak temperature TP 245 250 °C
Time within 5 °C of the specified peak tP 10 20 30 s
temperature TP - 5 K
Ramp-down rate* 3 4 K/s
TP to 100 °C
Time 480 s
25 °C to TP

All temperatures refer to the center of the package, measured on the top of the component
* slope calculation DT/Dt: Dt max. 5 s; fulfillment for the whole T-range


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Taping 10)




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Tape and Reel 11)

Reel Dimensions
A W Nmin W1 W2 max Pieces per PU

330 mm 12 + 0.3 / - 0.1 mm 60 mm 12.4 + 2 mm 18.4 mm 2000




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Barcode-Product-Label (BPL)

Dry Packing Process and Materials 10)

Moisture-sensitive label or print

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Humidity indicator
Barcode label
Do not eat.
Avoid metal contact.
Discard if circles overrun.
bag opening.
Please check the HIC immidiately after

check dot WET

Comparator

bake units
examine units, if necessary 15%
If wet,

bake units
examine units, if necessary 10%
If wet,

change desiccant
parts still adequately dry. 5%
If wet,

MIL-I-8835
Humidity Indicator

Desiccant
AM
OSR

OHA00539
Moisture-sensitive product is packed in a dry bag containing desiccant and a humidity card according JEDEC-STD-033.


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Notes
The evaluation of eye safety occurs according to the standard IEC 62471:2006 (photo biological safety of
lamps and lamp systems). Within the risk grouping system of this IEC standard, the device specified in this
data sheet falls into the class exempt group (exposure time 10000 s). Under real circumstances (for expo-
sure time, conditions of the eye pupils, observation distance), it is assumed that no endangerment to the
eye exists from these devices. As a matter of principle, however, it should be mentioned that intense light
sources have a high secondary exposure potential due to their blinding effect. When looking at bright light
sources (e.g. headlights), temporary reduction in visual acuity and afterimages can occur, leading to irrita-
tion, annoyance, visual impairment, and even accidents, depending on the situation.
Subcomponents of this device contain, in addition to other substances, metal filled materials including silver.
Metal filled materials can be affected by environments that contain traces of aggressive substances. There-
fore, we recommend that customers minimize device exposure to aggressive substances during storage,
production, and use. Devices that showed visible discoloration when tested using the described tests above
did show no performance deviations within failure limits during the stated test duration. Respective failure
limits are described in the IEC60810.
For further application related information please visit www.osram-os.com/appnotes




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Disclaimer
Attention please!
The information describes the type of component and shall not be considered as assured characteristics.
Terms of delivery and rights to change design reserved. Due to technical requirements components may
contain dangerous substances.
For information on the types in question please contact our Sales Organization.
If printed or downloaded, please find the latest version on the OSRAM OS website.

Packing
Please use the recycling operators known to you. We can also help you – get in touch with your nearest
sales office. By agreement we will take packing material back, if it is sorted. You must bear the costs of
transport. For packing material that is returned to us unsorted or which we are not obliged to accept, we
shall have to invoice you for any costs incurred.

Product and functional safety devices/applications or medical devices/applications

OSRAM OS components are not developed, constructed or tested for the application as safety relevant
component or for the application in medical devices.
OSRAM OS products are not qualified at module and system level for such application.

In case buyer – or customer supplied by buyer – considers using OSRAM OS components in product safety
devices/applications or medical devices/applications, buyer and/or customer has to inform the local sales
partner of OSRAM OS immediately and OSRAM OS and buyer and /or customer will analyze and coordi-
nate the customer-specific request between OSRAM OS and buyer and/or customer.




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Glossary
1)
Radiant intensity: Measured at a solid angle of Ω = 0.01 sr
2)
Brightness: The brightness values are measured with a tolerance of ±11%.
3)
Reverse Operation: This product is intended to be operated applying a forward current within the
specified range. Applying any continuous reverse bias or forward bias below the voltage range of light
emission shall be avoided because it may cause migration which can change the electro-optical char-
acteristics or damage the LED.
4)
Forward Voltage: The forward voltages are measured with a tolerance of ±0.1 V.
5)
Total radiant flux: Measured with integrating sphere.
6)
Thermal resistance: junction - soldering point, of the device only, mounted on an ideal heatsink (e.g.
metal block)
7)
Thermal resistance: junction ‐ ambient, mounted on PC‐board (FR4), padsize 16 mm² each
8)
Typical Values: Due to the special conditions of the manufacturing processes of semiconductor devic-
es, the typical data or calculated correlations of technical parameters can only reflect statistical figures.
These do not necessarily correspond to the actual parameters of each single product, which could dif-
fer from the typical data and calculated correlations or the typical characteristic line. If requested, e.g.
because of technical improvements, these typ. data will be changed without any further notice.
9)
Testing temperature: TA = 25°C (unless otherwise specified)
10)
Tolerance of Measure: Unless otherwise noted in drawing, tolerances are specified with ±0.1 and
dimensions are specified in mm.
11)
Tape and Reel: All dimensions and tolerances are specified acc. IEC 60286-3 and specified in mm.




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Revision History
Version Date Change

1.4 2019-01-11 Tape and Reel

1.5 2020-02-05 Characteristics
1.6 2020-12-22 Reflow Soldering Profile




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Published by OSRAM Opto Semiconductors GmbH

Leibnizstraße 4, D-93055 Regensburg
www.osram-os.com © All Rights Reserved.


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