www.osram-os.

com
Produktdatenblatt | Version 1.1
LUW HWQP
 

LUW HWQP
OSLON ® Black Flat
OSLON Black Flat is a new small size high-flux LED
for slim designs. The black package stands for high
stability.

Applications
——Architecture ——Headlamps, LED & Laser & Night Vision
——Custom Tuning ——Stage Lighting (LED & Laser)

Features:
——Package: SMD epoxy package
——Chip technology: UX:3
——Typ. Radiation: 120° (Lambertian emitter)
——Color: Cx = 0.33, Cy = 0.34 acc. to CIE 1931 (● ultra white)
——Corrosion Robustness Class: 3B
——Qualifications: AEC-Q102 Qualified
——ESD: 8 kV acc. to ANSI/ESDA/JEDEC JS-001 (HBM, Class 3B)




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Ordering Information 
Type Luminous Flux 1) Ordering Code
IF = 1000 mA
ΦV

LUW HWQP-5N8N-ebvF46fcbB46-8E8H 280 ... 450 lm Q65112A6099




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Maximum Ratings
Parameter Symbol Values

Operating Temperature Top min. -40 °C

max. 125 °C
Storage Temperature Tstg min. -40 °C
max. 125 °C
Junction Temperature Tj max. 150 °C
Junction Temperature for short time applications* Tj max. 175 °C
Forward Current IF min. 50 mA
TS = 25 °C max. 1500 mA
Surge Current IFS max. 2500 mA
t ≤ 10 µs; D = 0.005 ; TS = 25 °C
ESD withstand voltage VESD 8 kV
acc. to ANSI/ESDA/JEDEC JS-001 (HBM, Class 3B)
Reverse current 2) IR max. 200 mA

* The median lifetime (L70/B50) for Tj = 175°C is 100h.




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Characteristics
IF = 1000 mA; TS = 25 °C
Parameter Symbol Values

Chromaticity Coordinate 3) Cx typ. 0.33

Cy typ. 0.34
Viewing angle at 50% IV 2φ typ. 120 °
Forward Voltage 4) VF min. 2.75 V
IF = 1000 mA typ. 3.05 V
max. 3.75 V
Reverse voltage (ESD device) VR ESD min. 45 V
Reverse voltage  2)
VR max. 1.2 V
IR = 20 mA
Real thermal resistance junction/solderpoint 5) RthJS real typ. 4.3 K / W
max. 5.5 K / W
Electrical thermal resistance junction/solderpoint 5) RthJS elec. typ. 3.0 K / W
with efficiency ηe = 30 % max. 3.9 K / W




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Brightness Groups 
Group Luminous Flux 1) Luminous Flux 1) Luminous Intensity 6)
IF = 1000 mA IF = 1000 mA IF = 1000 mA
min. max. typ.
ΦV ΦV Iv

5N 280 lm 315 lm 98 cd
N6 300 lm 315 lm 102 cd
6N 315 lm 355 lm 111 cd
N7 334 lm 355 lm 114 cd
7N 355 lm 400 lm 125 cd
8N 400 lm 450 lm 140 cd

Forward Voltage Groups 

Group Forward Voltage 4) Forward Voltage 4)
IF = 1000 mA IF = 1000 mA
min. max.
VF VF

8E 2.75 V 3.00 V
8F 3.00 V 3.25 V
8G 3.25 V 3.50 V
8H 3.50 V 3.75 V




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Chromaticity Coordinate Groups 3)

0.90 0.37

520
525
515 530
0.80
0.36
Cy 540 Cy
510

0.70 550

505
0.35
560
0.60 fcbB46
570
500
0.34
0.50
580
ebzB46
590
495
0.40
0.33
600
ebxD46
610
620
0.30 490 630
650
700
0.32
ebvF46
0.20 485

480 0.31
0.10
475

470
465
460
455
450
0.00 400
0.30
0.00 0.10 0.20 0.30 0.40 0.50 0.60 0.70 0.29 0.30 0.31 0.32 0.33 0.34

Cx Cx

Chromaticity Coordinate Groups  3)

Group Cx Cy Group Cx Cy

ebvF46 0.3127 0.3093 ebzB46 0.3203 0.3274

0.3212 0.3175 0.3299 0.3361
0.3199 0.3325 0.3298 0.3526
0.3104 0.3234 0.3190 0.3430
ebxD46 0.3163 0.3181 fcbB46 0.3248 0.3370
0.3253
0.3246
0.3266
0.3424  0.3350
0.3355
0.3460
0.3633
0.3145 0.3330 0.3241 0.3534


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Group Name on Label 

Example: 5N-ebvF46-8E
Brightness Color Chromaticity Forward Voltage

5N ebvF46 8E




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Relative Spectral Emission 6)

Φrel = f (λ); IF = 1000 mA; TS = 25 °C

LUW HWQP
1,0
Φrel
: Vλ
: ultra white

0,8

0,6

0,4

0,2

0,0
350 400 450 500 550 600 650 700 750 800
λ [nm]
Note: Percentage of red: >5% acc. to ECE regulation
Percentage of UV: <10-5 W/lm acc. to ECE regulation

Radiation Characteristics 6)

Irel = f (ϕ); TS = 25 °C
LUW HWQP

ϕ [°]
-10° 0° 10° 20° 30° 40° 50° 60° 70° 80° 90°
-20° 1,0
Irel


-30°

-40° 0,8

-50°
0,6
-60°

0,4
-70°

-80° 0,2

-90° 0,0

-100°


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Forward current 6), 7) Relative Luminous Flux 6), 7)

IF = f(VF); TS = 25 °C Φv/Φv(1000 mA) = f(IF); TS = 25 °C

LUW HWQP
1500
LUW HWQP ΦV
IF [mA]
ΦV(1000mA) 1,4
1400

1,2
1200

1,0
1000

0,8
800

0,6
600

0,4
400

0,2

200
0,0
50

1500
0

00

00

00
50
20

40

60

80
2,6 2,8 3,0 3,2 3,3

10

12

14
VF [V] IF [mA]

Chromaticity Coordinate Shift 6)

Cx, Cy = f(IF); TS = 25 °C

LUW HWQP
0,355
Cx
Cy : Cx
: Cy


0,350

0,345

0,340

0,335

0,330

0,325
50

00

00

00
20

40

60

80

10

12

15

IF [mA]


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Forward Voltage 6) Relative Luminous Flux 6)

ΔVF = VF - VF(25 °C) = f(Tj); IF = 1000 mA Φv/Φv(25 °C) = f(Tj); IF = 1000 mA

LUW HWQP LUW HWQP
0,3 Φv 1,2
∆VF [V]
Φv(25°C)

0,2 1,0

0,1 0,8

0,0 0,6

-0,1 0,4

-0,2 0,2

-0,3 0,0
0

0
0
20

40

60

80

0
20
0

40

60

80

0
-4

-2

10

12

14

-4

-2

10

12

14
Tj [°C] Tj [°C]

Chromaticity Coordinate Shift 6)

Cx, Cy = f(Tj); IF = 1000 mA

LUW HWQP
Cx
Cy : Cx
0,335 : Cy

0,330

0,325

0,320
0

0
0
20

40

60

80

0
10

12

14
-4

-2

Tj [°C]


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Max. Permissible Forward Current

IF = f(T)
LUW HWQP.CE
1600
IF [mA]
1500
1400
1300
1200
1100
1000
900
800 : TS
700
600
500
400
300
200
100
Do not use below 50 mA
0
0 20 40 60 80 100 120 140
TS [°C]

Permissible Pulse Handling Capability Permissible Pulse Handling Capability

IF = f(tp); D: Duty cycle IF = f(tp); D: Duty cycle
TS = 0°C ... 116°C LUW HWQP.CE
TS = 125°C LUW HWQP.CE
IF [A] IF [A]
: D = 1.0 : D = 1.0
2,6
2,6 : D = 0.5 : D = 0.5


: D = 0.2 : D = 0.2
: D = 0.1 2,4 : D = 0.1
2,4 : D = 0.05 : D = 0.05
: D = 0.02 : D = 0.02
: D = 0.01 2,2 : D = 0.01
: D = 0.005 : D = 0.005
2,2
2,0

2,0 1,8

1,8 1,6

1,4
1,6

1,2

1,4
10-6 10 -5 10-4 10 -3 0,01 0,1 1 10 10-6 10 -5 10-4 10 -3 0,01 0,1 1 10
Pulse time [s] Pulse time [s]


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Dimensional Drawing 8)

Further Information:
Approximate Weight: 23.0 mg

Corrosion test: Class: 3B

Test condition: 40°C / 90 % RH / 15 ppm H2S / 14 days (stricter than IEC
60068-2-43)
ESD advice: The device is protected by ESD device which is connected in parallel to the
Chip.




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Electrical Internal Circuit

Recommended Solder Pad 8)




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Recommended Solder Pad 8)

For superior solder joint connectivity results we recommend soldering under standard nitrogen atmosphere. In case the PCB
layout of the application is intended to be used with other OSLON derivates or in future developed OSLON derivates, the heat
sink must not be electrically connected to anode or cathode solder pad because of possible chip inverted polarity. Package
not suitable for ultra sonic cleaning. To ensure a high solder joint reliability and to minimize the risk of solder joint cracks, the
customer is responsible to evaluate the combination of PCB board and solder paste material for his application.




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Reflow Soldering Profile

Product complies to MSL Level 2 acc. to JEDEC J-STD-020E
OHA04525
300
˚C
T 250
240 ˚C Tp 245 ˚C
217 ˚C tP
200
tL

150
tS

100

50
25 ˚C
0
0 50 100 150 200 250 s 300
t

Profile Feature Symbol Pb-Free (SnAgCu) Assembly Unit

Minimum Recommendation Maximum
Ramp-up rate to preheat*) 2 3 K/s
25 °C to 150 °C
Time tS tS 60 100 120 s
TSmin to TSmax
Ramp-up rate to peak*) 2 3 K/s


TSmax to TP
Liquidus temperature TL 217 °C
Time above liquidus temperature tL 80 100 s
Peak temperature TP 245 260 °C
Time within 5 °C of the specified peak tP 10 20 30 s
temperature TP - 5 K
Ramp-down rate* 3 6 K/s
TP to 100 °C
Time 480 s
25 °C to TP

All temperatures refer to the center of the package, measured on the top of the component
* slope calculation DT/Dt: Dt max. 5 s; fulfillment for the whole T-range


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Taping 8)




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Tape and Reel 9)

Reel Dimensions
A W Nmin W1 W2 max Pieces per PU

180 mm 12 + 0.3 / - 0.1 mm 60 mm 12.4 + 2 mm 18.4 mm 2000




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Barcode-Product-Label (BPL)

Dry Packing Process and Materials 8)

Moisture-sensitive label or print

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Barcode label
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Ais bUagRMEICO ˚C co 72 H
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P th th va l tic F lo or
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OS

Humidity indicator
Barcode label
Do not eat.
Avoid metal contact.
Discard if circles overrun.
bag opening.
Please check the HIC immidiately after

check dot WET

Comparator

bake units
examine units, if necessary 15%
If wet,

bake units
examine units, if necessary 10%
If wet,

change desiccant
parts still adequately dry. 5%
If wet,

MIL-I-8835
Humidity Indicator

Desiccant
AM
OSR

OHA00539
Moisture-sensitive product is packed in a dry bag containing desiccant and a humidity card according JEDEC-STD-033.


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Type Designation System

Wavelength Emission ColorColor coordinates according

(λdom typ.) CIE 1931 / Emission color:
A: 617 nm amber CW: warm white
S: 633 nm super red CY: color on demand yellow
Y: 590 nm yellow UW: ultra-white
R: 625 nm red W: white
W2: white, 2 chips

Technology concept
3: Silicone encapsulation
K: Automotive (casted) platform: QFN
and Industry
Product
L: Light Package Type Product-
Emitting H: Top emitting device version
Diode Leadframe based
Black reflector package

K W H 2 L 5 3 1 . T E

Lead / Package Properties Converted Colors

Toplooker:
T: greenish cold white
2: 3731 H: 3737
C: intermediate cold white
3: 3742 I: 3746


4: 3753 J: 3757
5: 3746 K: 3768 Binning Information:
9: leadless L: 3779 E: ECE binning: IEC 62707
W: next chip development (i.e. ebxD68)
K: binning within ECE
Encapsulant Type / Lens Properties
L: no lens (Lambertian)
P: planar compression molded silicon
(120°); with volume conversion
Q: planar compression molded silicon
(120°); with layer conversion
G: outcoupling lens 90°

Chip Technology:
5: standard power class
P: power performance


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Notes
The evaluation of eye safety occurs according to the standard IEC 62471:2006 (photo biological safety of
lamps and lamp systems). Within the risk grouping system of this IEC standard, the device specified in this
data sheet falls into the class moderate risk (exposure time 0.25 s). Under real circumstances (for exposure
time, conditions of the eye pupils, observation distance), it is assumed that no endangerment to the eye ex-
ists from these devices. As a matter of principle, however, it should be mentioned that intense light sources
have a high secondary exposure potential due to their blinding effect. When looking at bright light sources
(e.g. headlights), temporary reduction in visual acuity and afterimages can occur, leading to irritation, annoy-
ance, visual impairment, and even accidents, depending on the situation.
Subcomponents of this device contain, in addition to other substances, metal filled materials including silver.
Metal filled materials can be affected by environments that contain traces of aggressive substances. There-
fore, we recommend that customers minimize device exposure to aggressive substances during storage,
production, and use. Devices that showed visible discoloration when tested using the described tests above
did show no performance deviations within failure limits during the stated test duration. Respective failure
limits are described in the IEC60810.
For further application related information please visit www.osram-os.com/appnotes




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Disclaimer
Attention please!
The information describes the type of component and shall not be considered as assured characteristics.
Terms of delivery and rights to change design reserved. Due to technical requirements components may
contain dangerous substances.
For information on the types in question please contact our Sales Organization.
If printed or downloaded, please find the latest version on the OSRAM OS website.

Packing
Please use the recycling operators known to you. We can also help you – get in touch with your nearest
sales office. By agreement we will take packing material back, if it is sorted. You must bear the costs of
transport. For packing material that is returned to us unsorted or which we are not obliged to accept, we
shall have to invoice you for any costs incurred.

Product and functional safety devices/applications or medical devices/applications

OSRAM OS components are not developed, constructed or tested for the application as safety relevant
component or for the application in medical devices.
OSRAM OS products are not qualified at module and system level for such application.

In case buyer – or customer supplied by buyer – considers using OSRAM OS components in product safety
devices/applications or medical devices/applications, buyer and/or customer has to inform the local sales
partner of OSRAM OS immediately and OSRAM OS and buyer and /or customer will analyze and coordi-
nate the customer-specific request between OSRAM OS and buyer and/or customer.




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Glossary
1)
Brightness: Brightness values are measured during a current pulse of typically 25 ms, with an internal
reproducibility of ±8 % and an expanded uncertainty of ±11 % (acc. to GUM with a coverage factor of
k = 3).
2)
Reverse Operation: Reverse Operation of 10 hours is permissible in total. Continuous reverse opera-
tion is not allowed.
3)
Chromaticity coordinate groups: Chromaticity coordinates are measured during a current pulse of
typically 25 ms, with an internal reproducibility of ±0.005 and an expanded uncertainty of ±0.01 (acc. to
GUM with a coverage factor of k = 3).
4)
Forward Voltage: The forward voltage is measured during a current pulse of typically 8 ms, with an
internal reproducibility of ±0.05 V and an expanded uncertainty of ±0.1 V (acc. to GUM with a coverage
factor of k = 3).
5)
Thermal Resistance: Rth max is based on statistic values (6σ).
6)
Typical Values: Due to the special conditions of the manufacturing processes of semiconductor devic-
es, the typical data or calculated correlations of technical parameters can only reflect statistical figures.
These do not necessarily correspond to the actual parameters of each single product, which could dif-
fer from the typical data and calculated correlations or the typical characteristic line. If requested, e.g.
because of technical improvements, these typ. data will be changed without any further notice.
7)
Characteristic curve: In the range where the line of the graph is broken, you must expect higher differ-
ences between single devices within one packing unit.
8)
Tolerance of Measure: Unless otherwise noted in drawing, tolerances are specified with ±0.1 and
dimensions are specified in mm.
9)
Tape and Reel: All dimensions and tolerances are specified acc. IEC 60286-3 and specified in mm.




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Revision History
Version Date Change

1.11 2020-01-30 Features

Further Information
Recommended Solder Pad
Reel Dimensions
Schematic Transportation Box
Dimensions of Transportation Box
Type Designation System
Notes
Disclaimer
Glossary




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Published by OSRAM Opto Semiconductors GmbH

Leibnizstraße 4, D-93055 Regensburg
www.osram-os.com © All Rights Reserved.


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