www.osram-os.

com
Produktdatenblatt | Version 1.1
SFH 4350
 

SFH 4350
Radial T1
High Power Infrared Emitter (850 nm)

Applications
—Electronic Equipment —Safety and Security, CCTV
—Industrial Automation (Machine Controls, Light —Smoke/Dust/Particle Sensing
Barriers, Vision Controls)

Features:
—Package: clear epoxy
—ESD: 2 kV acc. to ANSI/ESDA/JEDEC JS-001 (HBM, Class 2)
—High Power Infrared LED
—Emission angle ± 13°
—Very high radiant intensity
—Short switching times
—UL version available (ordering code & test conditions on request)

Ordering Information 
Type 
Radiant intensity  1)2) Radiant intensity 1)
typ.
Ordering Code

IF = 100 mA; tp = 20 ms IF = 100 mA; tp = 20 ms

Ie Ie

SFH 4350 71 ... 450 mW/sr 200 mW/sr Q65110A2091

SFH 4350-AWBW 112 ... 280 mW/sr 200 mW/sr Q65111A2797


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Maximum Ratings
TA = 25 °C
Parameter Symbol Values

Operating temperature Top min. -40 °C

max. 100 °C
Storage temperature Tstg min. -40 °C
max. 100 °C
Forward current IF max. 100 mA
Forward current pulsed IF pulse max. 1A
tp ≤ 400 µs; D ≤ 0.005 
Reverse voltage 3) VR max. 5V
Power consumption Ptot max. 180 mW
ESD withstand voltage VESD max. 2 kV
acc. to ANSI/ESDA/JEDEC JS-001 (HBM, Class 2)




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Characteristics
IF = 100 mA; tp = 20 ms; TA = 25 °C
Parameter Symbol Values

Peak wavelength λpeak typ. 860 nm

Centroid wavelength λcentroid typ. 850 nm
Spectral bandwidth at 50% Irel,max (FWHM) ∆λ typ. 30 nm
Half angle φ typ. 13 °
Dimensions of active chip area LxW typ. 0.3 x 0.3
mm x mm
Rise time (10% / 90%) tr typ. 12 ns
IF = 100 mA; RL = 50 Ω
Fall time (10% / 90%) tf typ. 12 ns
IF = 100 mA; RL = 50 Ω
Forward voltage 4) VF typ. 1.5 V
max. 1.7 V
Forward voltage 4) VF typ. 2.4 V
IF = 1 A; tp = 100 µs max. 2.9 V
Reverse current 3) IR typ. 0.01 µA
VR = 5 V max. 10 µA
Radiant intensity  1) Ie typ. 1550 mW/sr
IF = 1 A; tp = 25 µs
Total radiant flux 5) Φe typ. 70 mW
Temperature coefficient of voltage TCV typ. -0.7 mV / K
Temperature coefficient of brightness TCI typ. -0.5 % / K


Temperature coefficient of wavelength
Thermal resistance junction ambient real 6)
TCλ
RthJA
typ.
max.
0.3 nm / K
450 K / W


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Brightness Groups 
TA = 25 °C

Group Radiant intensity 1)2) Radiant intensity 1)2)

IF = 100 mA; tp = 20 ms IF = 100 mA; tp = 20 ms
min. max.
Ie Ie

V 71 mW/sr 112 mW/sr

AW 112 mW/sr 180 mW/sr
BW 180 mW/sr 280 mW/sr
CW 280 mW/sr 450 mW/sr

Only one group in one packing unit (variation lower 2:1)

Relative Spectral Emission 7), 8)

Ie,rel = f (λ); IF = 100 mA; tp = 20 ms

OHF04132
100
I rel %


80

60

40

20

0
700 750 800 850 nm 950
λ


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Radiation Characteristics 7), 8)

Ie,rel = f (φ)
40˚ 30˚ 20˚ 10˚ 0˚ OHF02499

ϕ 1.0
50˚

0.8

60˚
0.6

70˚ 0.4

80˚ 0.2

0
90˚

100˚
1.0 0.8 0.6 0.4 0˚ 20˚ 40˚ 60˚ 80˚ 100˚ 120˚

Forward current 7), 8) Radiant Intensity 7), 8)

IF = f (VF); single pulse; tp = 100 µs Ie/Ie(100mA) = f (IF); single pulse; tp = 25 µs

OHL01713 OHL01715
100 101
A Ie
IF
I e (100 mA)

10-1
5
 100
5

10-2 10-1
5 5

10-3 10-2
5 5

10-4 10-3 0
0 0.5 1 1.5 2 2.5 V 3 10 5 10 1 5 10 2 mA 10 3
VF IF


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Max. Permissible Forward Current Permissible Pulse Handling Capability

IF,max = f (TA); Rthja = 450K / W IF = f (tp); duty cycle D = parameter; TA = 25°C
OHR00880 OHF05438
125 1.2
tP
A t
Ι F mA IF D = TP IF
1.0 T
100
D=
0.005
0.8 0.01
75 0.02
0.033
0.6 0.05
0.1
0.2
50 0.5
0.4 1

25
0.2

0 0 -5
0 20 40 60 80 ˚C 100 10 10-4 10-3 10-2 10-1 100 101 s 102
T tp

Permissible Pulse Handling Capability

IF = f (tp); duty cycle D = parameter; TA = 85°C
OHF05587
0.9
tP
A t
IF D = TP IF
0.8


T
0.7

0.6

0.5 D=
0.005
0.01
0.4 0.02
0.05
0.3 0.1
0.2
0.2 0.5
1
0.1

0 -5
10 10-4 10-3 10-2 10-1 100 101 s 102
tp


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Dimensional Drawing 9)

5.2 (0.205)
0.7 (0.028)
0.4 (0.016)
0.6 (0.024)
0.4 (0.016)

3.1 (0.122)
2.9 (0.114)
Surface 4.5 (0.177)
not flat 4.1 (0.161) 0.6 (0.024)
2.54 (0.100)

3.9 (0.154) 0.4 (0.016)

2
spacing

1
0.8 (0.031)
0.4 (0.016)

4.0 (0.157)
Chip position
3.3 (0.130) 3.6 (0.142)
1.8 (0.071) 6.3 (0.248)
1.2 (0.047) 5.9 (0.232) GEMY6689

Further Information:
Approximate Weight: 178.0 mg

Package marking: Anode

Pin Description

1 Anode


2 Cathode


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Recommended Solder Pad 9)

Pad 1: cathode




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TTW Soldering
IEC-61760-1 TTW
OHA04645
300
˚C 10 s max., max. contact time 5 s per wave

T 250 235 ˚C - 260 ˚C Continuous line: typical process

First wave Second wave Dotted line: process limits

200 ∆T < 150 K

Cooling
Preheating
ca. 3.5 K/s typical
150 ca. 2 K/s
130 ˚C
ca. 5 K/s
120 ˚C
Typical
100 100 ˚C

50

0
0 20 40 60 80 100 120 140 160 180 200 220 s 240
t




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Notes
The evaluation of eye safety occurs according to the standard IEC 62471:2006 (photo biological safety of
lamps and lamp systems). Within the risk grouping system of this IEC standard, the device specified in this
data sheet fall into the class exempt group (exposure time 10000 s). Under real circumstances (for expo-
sure time, conditions of the eye pupils, observation distance), it is assumed that no endangerment to the
eye exists from these devices. As a matter of principle, however, it should be mentioned that intense light
sources have a high secondary exposure potential due to their blinding effect. When looking at bright light
sources (e.g. headlights), temporary reduction in visual acuity and afterimages can occur, leading to irrita-
tion, annoyance, visual impairment, and even accidents, depending on the situation.
Subcomponents of this device contain, in addition to other substances, metal filled materials including silver.
Metal filled materials can be affected by environments that contain traces of aggressive substances. There-
fore, we recommend that customers minimize device exposure to aggressive substances during storage,
production, and use. Devices that showed visible discoloration when tested using the described tests above
did show no performance deviations within failure limits during the stated test duration. Respective failure
limits are described in the IEC60810.

Packing information is available on the internet (online product catalog).

For further application related information please visit www.osram-os.com/appnotes




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Disclaimer
Attention please!
The information describes the type of component and shall not be considered as assured characteristics.
Terms of delivery and rights to change design reserved. Due to technical requirements components may
contain dangerous substances.
For information on the types in question please contact our Sales Organization.
If printed or downloaded, please find the latest version on the OSRAM OS website.

Packing
Please use the recycling operators known to you. We can also help you – get in touch with your nearest
sales office. By agreement we will take packing material back, if it is sorted. You must bear the costs of
transport. For packing material that is returned to us unsorted or which we are not obliged to accept, we
shall have to invoice you for any costs incurred.

Product and functional safety devices/applications or medical devices/applications

OSRAM OS components are not developed, constructed or tested for the application as safety relevant
component or for the application in medical devices.
OSRAM OS products are not qualified at module and system level for such application.

In case buyer – or customer supplied by buyer – considers using OSRAM OS components in product safety
devices/applications or medical devices/applications, buyer and/or customer has to inform the local sales
partner of OSRAM OS immediately and OSRAM OS and buyer and /or customer will analyze and coordi-
nate the customer-specific request between OSRAM OS and buyer and/or customer.




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Glossary
1)
Radiant intensity: Measured at a solid angle of Ω = 0.01 sr
2)
Brightness: The brightness values are measured with a tolerance of ±11%.
3)
Reverse Operation: This product is intended to be operated applying a forward current within the
specified range. Applying any continuous reverse bias or forward bias below the voltage range of light
emission shall be avoided because it may cause migration which can change the electro-optical char-
acteristics or damage the LED.
4)
Forward Voltage: The forward voltages are measured with a tolerance of ±0.1 V.
5)
Total radiant flux: Measured with integrating sphere.
6)
Thermal resistance: junction ‐ ambient, mounted on PC‐board (FR4), padsize 16 mm² each
7)
Typical Values: Due to the special conditions of the manufacturing processes of semiconductor devic-
es, the typical data or calculated correlations of technical parameters can only reflect statistical figures.
These do not necessarily correspond to the actual parameters of each single product, which could dif-
fer from the typical data and calculated correlations or the typical characteristic line. If requested, e.g.
because of technical improvements, these typ. data will be changed without any further notice.
8)
Testing temperature: TA = 25°C (unless otherwise specified)
9)
Tolerance of Measure: Unless otherwise noted in drawing, tolerances are specified with ±0.1 and
dimensions are specified in mm.




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Revision History
Version Date Change

1.6 2021-09-21 Maximum Ratings

1.7 2021-11-18 Features
Maximum Ratings
Characteristics




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Published by OSRAM Opto Semiconductors GmbH

Leibnizstraße 4, D-93055 Regensburg
www.osram-os.com © All Rights Reserved.


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