www.osram-os.

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Produktdatenblatt | Version 1.1
SFH 4170S
 

SFH 4170S
OSLON ® P1616
High Power Infrared Emitter (850 nm)

Applications
——Access Control (IRIS/Vein Scan, Face Recog- ——Gesture Recognition
nition) ——Safety and Security, CCTV
——Eye Tracking

Features:
——Package: clear silicone
——ESD: 2 kV acc. to ANSI/ESDA/JEDEC JS-001 (HBM)
——IR lightsource with high efficiency
——Double stack emitter
——Centroid wavelength 850 nm

Ordering Information 


Type Total radiant flux 1) Total radiant flux 1) Ordering Code
typ.
IF = 1000 mA; tp = 10 ms IF = 1000 mA; tp = 10 ms
Φe Φe

SFH 4170S 1000 ... 1400 mW 1.15 W Q65112A9014

The brightness values are measured during a current pulse of typically 10ms, with a tolerance of +/- 12%.


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Maximum Ratings
TA = 25 °C
Parameter Symbol Values

Operating temperature Top min. -40 °C

max. 105 °C
Storage temperature Tstg min. -40 °C
max. 105 °C
Junction temperature Tj max. 145 °C
Forward current IF max. 1000 mA
Surge current IFSM max. 2A
tp ≤ 600 µs; D = 0.005 
Reverse voltage 2) VR max. 12 V
Power consumption Ptot max. 3600 mW
ESD withstand voltage VESD max. 2 kV
acc. to ANSI/ESDA/JEDEC JS-001 (HBM)

Note: For the forward current and power consumption please see “maximum permissible forward current” diagram.




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Characteristics
IF = 1000 mA; TA = 25 °C
Parameter Symbol Values

Peak wavelength λpeak typ. 860 nm

Centroid wavelength λcentroid typ. 850 nm
Spectral bandwidth at 50% Irel,max (FWHM) ∆λ typ. 30 nm
Half angle φ typ. 65 °
Dimensions of chip area LxW typ. 0.75 x 0.75
mm x mm
Rise time (10% / 90%) tr typ. 9 ns
IF = 2 A; RL = 5 Ω
Fall time (10% / 90%) tf typ. 16 ns
IF = 2 A; RL = 5 Ω
Forward voltage VF typ. 3.25 V
max. 3.6 V
Forward voltage VF typ. 3.7 V
IF = 2 A; tp = 100 µs max. 4.3 V
Reverse current 2) IR typ. 0.01 µA
VR = 5 V max. 10 µA
Radiant intensity Ie typ. 280 mW/sr
Temperature coefficient of voltage TCV typ. -2 mV / K
Temperature coefficient of brightness TCI typ. -0.3 % / K
Temperature coefficient of wavelength TCλ typ. 0.3 nm / K
Thermal resistance junction solder point electrical 3) RthJS elec. typ. 6.8 K / W
with efficiency ηe = 38 %

Thermal resistance junction solder point real 3) RthJS real
max.
typ.
8.1 K / W
11.0 K / W
max. 13.0 K / W


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Brightness Groups 
Group Total radiant flux 1) Total radiant flux 1)
IF = 1 A; tp = 10 ms IF = 1 A; tp = 10 ms
min. max.
Φe Φe

EB2 1000 mW 1120 mW

FA1 1120 mW 1250 mW
FA2 1250 mW 1400 mW

The brightness values are measured during a current pulse of typically 10ms, with a tolerance of +/- 12%.

Relative Spectral Emission 4), 5)

Ie,rel = f (λ); IF = 1000 mA
OHF04132
100
I rel %


80

60

40

20

0
700 750 800 850 nm 950
λ


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Radiation Characteristics 4), 5)

Ie,rel = f (φ)

φ[ ]
-10° 0° 10° 20° 30° 40° 50° 60° 70° 80° 90°
-20° 1.0
: 0° -30°
0.9
-40°
0.8
-50° 0.7
0.6
-60°
0.5

-70° 0.4
0.3

-80° 0.2
0.1
-90° 0.0

Forward current 4), 5) Relative Total Radiant Flux 4), 5)

IF = f (VF); single pulse; tp = 100 µs Φe/Φe(1000mA) = f (IF); single pulse; tp = 100 µs

Φ
[ ]
Φ


103

5⋅102 0.5

102 0.1

5⋅101 0.05

0.01
101
2.6 2.8 3.0 3.2 3.4 3.6 0.01 0.05 0.1 0.5 1
[ ] [ ]


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Max. Permissible Forward Current Permissible Pulse Handling Capability

IF,max = f (TA); IF = f (tp); duty cycle D = parameter; TS = 85°C

[ ] 1.0 [ ]
2.0

0.8
1.5
:D=1
: D = 0,5
0.6
: D =0,2
: D =0,1
1.0 : D =0,05
: D =0,02
0.4 : D =0,01
: D =0,005

0.5
0.2

0.0 0.0 -5
0 20 40 60 80 100 10 10-4 10-3 0.01 0.1 1 10 100
[ ] [ ]




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Dimensional Drawing 6)

Further Information
Approximate Weight: 6.2 mg

Package marking: Cathode




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Recommended Solder Pad 6)




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Reflow Soldering Profile

Product complies to MSL Level 3 acc. to JEDEC J-STD-020E
OHA04525
300
˚C
T 250
240 ˚C Tp 245 ˚C
217 ˚C tP
200
tL

150
tS

100

50
25 ˚C
0
0 50 100 150 200 250 s 300
t

Profile Feature Symbol Pb-Free (SnAgCu) Assembly Unit

Minimum Recommendation Maximum
Ramp-up rate to preheat*) 2 3 K/s
25 °C to 150 °C
Time tS tS 60 100 120 s
TSmin to TSmax
Ramp-up rate to peak*) 2 3 K/s


TSmax to TP
Liquidus temperature TL 217 °C
Time above liquidus temperature tL 80 100 s
Peak temperature TP 245 260 °C
Time within 5 °C of the specified peak tP 10 20 30 s
temperature TP - 5 K
Ramp-down rate* 3 6 K/s
TP to 100 °C
Time 480 s
25 °C to TP

All temperatures refer to the center of the package, measured on the top of the component
* slope calculation DT/Dt: Dt max. 5 s; fulfillment for the whole T-range


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Taping 6)




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Tape and Reel 7)

W1

D0 P0
P2

13.0 ±0.25
E
F

A
W

P1 Label
Direction of unreeling Direction of unreeling
W2
Leader: min. 400 mm *
Trailer: min. 160 mm *
*) Dimensions acc. to IEC 60286-3; EIA 481-D
OHAY0324

Reel Dimensions
A W Nmin W1 W2 max Pieces per PU

180 mm 8 + 0.3 / - 0.1 mm 60 mm 8.4 + 2 mm 14.4 mm 4000




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Barcode-Product-Label (BPL)

Dry Packing Process and Materials

Moisture-sensitive label or print

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Humidity indicator
Barcode label
Do not eat.
Avoid metal contact.
Discard if circles overrun.
bag opening.
Please check the HIC immidiately after

check dot WET

Comparator

bake units
examine units, if necessary 15%
If wet,

bake units
examine units, if necessary 10%
If wet,

change desiccant
parts still adequately dry. 5%
If wet,

MIL-I-8835
Humidity Indicator

Desiccant
AM
OSR

OHA00539


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Schematic Transportation Box 6)

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Sealing label OHA02044

Dimensions of Transportation Box

Width Length Height

200 ± 5 mm 195 ± 5 mm 30 ± 5 mm




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Notes
The evaluation of eye safety occurs according to the standard IEC 62471:2006 (photo biological safety of
lamps and lamp systems). Within the risk grouping system of this IEC standard, the device specified in this
data sheet falls into the class exempt group (exposure time 10000 s). Under real circumstances (for expo-
sure time, conditions of the eye pupils, observation distance), it is assumed that no endangerment to the
eye exists from these devices. As a matter of principle, however, it should be mentioned that intense light
sources have a high secondary exposure potential due to their blinding effect. When looking at bright light
sources (e.g. headlights), temporary reduction in visual acuity and afterimages can occur, leading to irrita-
tion, annoyance, visual impairment, and even accidents, depending on the situation.
Subcomponents of this device contain, in addition to other substances, metal filled materials including silver.
Metal filled materials can be affected by environments that contain traces of aggressive substances. There-
fore, we recommend that customers minimize device exposure to aggressive substances during storage,
production, and use. Devices that showed visible discoloration when tested using the described tests above
did show no performance deviations within failure limits during the stated test duration. Respective failure
limits are described in the IEC60810.

Handling:
Solvents, water, liquids, non-conductive plastics and glues are not allowed near the device, because sol-
vents and other liquids could emerge and damage the product.
For further application related information please visit www.osram-os.com/appnotes




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Disclaimer
Attention please!
The information describes the type of component and shall not be considered as assured characteristics.
Terms of delivery and rights to change design reserved. Due to technical requirements components may
contain dangerous substances.
For information on the types in question please contact our Sales Organization.
If printed or downloaded, please find the latest version on the OSRAM OS website.

Packing
Please use the recycling operators known to you. We can also help you – get in touch with your nearest
sales office. By agreement we will take packing material back, if it is sorted. You must bear the costs of
transport. For packing material that is returned to us unsorted or which we are not obliged to accept, we
shall have to invoice you for any costs incurred.

Product and functional safety devices/applications or medical devices/applications

OSRAM OS components are not developed, constructed or tested for the application as safety relevant
component or for the application in medical devices.
OSRAM OS products are not qualified at module and system level for such application.

In case buyer – or customer supplied by buyer – considers using OSRAM OS components in product safety
devices/applications or medical devices/applications, buyer and/or customer has to inform the local sales
partner of OSRAM OS immediately and OSRAM OS and buyer and /or customer will analyze and coordi-
nate the customer-specific request between OSRAM OS and buyer and/or customer.




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Glossary
1)
Total radiant flux: Measured with integrating sphere.
2)
Reverse Operation: Reverse Operation of 10 hours is permissible in total. Continuous reverse opera-
tion is not allowed.
3)
Thermal resistance: junction - soldering point, of the device only, mounted on an ideal heatsink (e.g.
metal block)
4)
Typical Values: Due to the special conditions of the manufacturing processes of semiconductor devic-
es, the typical data or calculated correlations of technical parameters can only reflect statistical figures.
These do not necessarily correspond to the actual parameters of each single product, which could dif-
fer from the typical data and calculated correlations or the typical characteristic line. If requested, e.g.
because of technical improvements, these typ. data will be changed without any further notice.
5)
Testing temperature: TA = 25°C (unless otherwise specified)
6)
Tolerance of Measure: Unless otherwise noted in drawing, tolerances are specified with ±0.1 and
dimensions are specified in mm.
7)
Tape and Reel: All dimensions and tolerances are specified acc. IEC 60286-3 and specified in mm.




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Revision History
Version Date Change

1.0 2019-09-12 Initial Version

1.0 2019-09-17 Initial Version




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Published by OSRAM Opto Semiconductors GmbH

Leibnizstraße 4, D-93055 Regensburg
www.osram-os.com © All Rights Reserved.


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