www.osram-os.

com
Produktdatenblatt | Version 1.1
LS R976
 

LS R976
Chip LED 0805

Applications
—Electronic Equipment —White Goods
—Gaming, Amusement, Gambling

Features:
—Package: SMT package 0805, colorless diffused resin
—Chip technology: InGaAlP
—Typ. Radiation: 150°
—Color: λdom = 633 nm (● super red)
—Optical efficacy: 7 lm/W
—Corrosion Robustness Class: 3B
—ESD: 2 kV acc. to ANSI/ESDA/JEDEC JS-001 (HBM)




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Ordering Information
Type Luminous Intensity 1) Ordering Code
IF = 20 mA
Iv

LS R976-NR-1 28 ... 180 mcd Q62702P5178




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Maximum Ratings
Parameter Symbol Values

Operating Temperature Top min. -30 °C

max. 85 °C
Storage Temperature Tstg min. -40 °C
max. 85 °C
Junction Temperature Tj max. 95 °C
Forward current IF max. 25 mA
TA = 25 °C
Surge Current IFS max. 100 mA
t ≤ 10 µs; D = 0.005 ; TA = 25 °C
Reverse voltage 2) VR max. 12 V
TA = 25 °C
ESD withstand voltage VESD 2 kV
acc. to ANSI/ESDA/JEDEC JS-001 (HBM)




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Characteristics
IF = 20 mA; TA = 25 °C
Parameter Symbol Values

Peak Wavelength λpeak typ. 645 nm

Dominant Wavelength 3) λdom min. 625 nm
typ. 633 nm
max. 650 nm
Spectral Bandwidth at 50% Irel,max ∆λ typ. 16 nm
Viewing angle at 50% IV 2φ typ. 160 °
Forward Voltage 4) VF typ. 2.00 V
IF = 20 mA max. 2.50 V
Reverse current 2) IR typ. 0.01 µA
VR = 12 V max. 10 µA
Temperature Coefficient of Peak Wavelength TCλpeak typ. 0.14 nm / K
Temperature Coefficient of Dominant Wavelength TCλdom typ. 0.05 nm / K
Temperature Coefficient of Forward Voltage TCVF typ. -2 mV / K
Real thermal resistance junction/ambient 5)6)
RthJA real max. 800 K / W
Real thermal resistance junction/solderpoint 5) RthJS real max. 450 K / W




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Brightness Groups
Group Luminous Intensity 1) Luminous Intensity. 1) Luminous Flux 7)
IF = 20 mA IF = 20 mA IF = 20 mA
min. max. typ.
Iv Iv ΦV

N 28 mcd 45 mcd 110 mlm

P 45 mcd 71 mcd 180 mlm
Q 71 mcd 112 mcd 290 mlm
R 112 mcd 180 mcd 460 mlm

Group Name on Label

Example: N-1
Brightness Wavelength

N 1




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Relative Spectral Emission 7)

Irel = f (λ); IF = 20 mA; TA = 25 °C

OHL00555
100

%
Ι rel orange super-red
80
Vλ yellow

60

40

20

0
400 450 500 550 600 650 nm 700
λ

Radiation Characteristics 7)

Irel = f (ϕ); TA = 25 °C
40˚ 30˚ 20˚ 10˚ 0˚ OHL00408
ϕ 1.0

50˚
 0.8

0.6
60˚

0.4
70˚

0.2
80˚

90˚ 0

100˚
1.0 0.8 0.6 0.4 0˚ 20˚ 40˚ 60˚ 80˚ 100˚ 120˚


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Forward current 7) Relative Luminous Intensity 7), 8)

IF = f(VF); TA = 25 °C Iv/Iv(20 mA) = f(IF); TA = 25 °C

OHL00232 OHL00642
10 2 10 1
mA
5 ΙV
Ι V (20 mA)
IF
10 0

10 1 5

5
10 -1
5

10 0 super-red,
orange yellow
10 -2
5
5

10 -1 10 -3
1 1.4 1.8 2.2 2.6 3 V 3.4 10 -2 10 -1 10 0 10 1 mA 10 2
VF ΙF

Relative Luminous Intensity 7)

Iv/Iv(25 °C) = f(Tj); IF = 20 mA

OHL02378
2.0
IV
I V (25 ˚C)


1.6
orange
yellow
super-red
1.2

0.8
orange
yellow
super-red
0.4

0
-20 0 20 40 60 ˚C 100
Tj


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Max. Permissible Forward Current

IF = f(T)
OHL00420
30
mA

I F 25

20

15

10

0
0 10 20 30 40 50 60 70 80 °C 100
TA

Permissible Pulse Handling Capability Permissible Pulse Handling Capability

IF = f(tp); D: Duty cycle; TA = 25 °C IF = f(tp); D: Duty cycle; TA = 85 °C
OHL02140 OHL02147
0.12 0.12
tP tP
IF A t IF IF A t IF
D = TP D = TP


T T

D=
0.08 0.005 0.08
0.01 D=
0.02 0.005
0.05 0.01
0.06 0.1 0.06 0.02
0.2 0.05
0.5 0.1
0.04 1 0.04 0.2
0.5
1
0.02 0.02

0 -5 0 -5
10 10-4 10-3 10-2 10-1 100 101 s 102 10 10-4 10-3 10-2 10-1 100 101 s 102
tp tp


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Dimensional Drawing 9)

Further Information:
Approximate Weight: 3.0 mg

Corrosion test: Class: 3B

Test condition: 40°C / 90 % RH / 15 ppm H2S / 14 days (stricter than IEC
60068-2-43)




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Electrical Internal Circuit

Recommended Solder Pad 9)

1.2 (0.047)


1.2 (0.047) 0.9 (0.035) 1.2 (0.047)

OHAPY607
For superior solder joint connectivity results we recommend soldering under standard nitrogen atmosphere. Package not
suitable for ultra sonic cleaning.


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Reflow Soldering Profile

Product complies to MSL Level 2 acc. to JEDEC J-STD-020E
OHA04525
300
˚C
T 250
240 ˚C Tp 245 ˚C
217 ˚C tP
200
tL

150
tS

100

50
25 ˚C
0
0 50 100 150 200 250 s 300
t

Profile Feature Symbol Pb-Free (SnAgCu) Assembly Unit

Minimum Recommendation Maximum
Ramp-up rate to preheat*) 2 3 K/s
25 °C to 150 °C
Time tS tS 60 100 120 s
TSmin to TSmax
Ramp-up rate to peak*) 2 3 K/s


TSmax to TP
Liquidus temperature TL 217 °C
Time above liquidus temperature tL 80 100 s
Peak temperature TP 245 260 °C
Time within 5 °C of the specified peak tP 10 20 30 s
temperature TP - 5 K
Ramp-down rate* 3 6 K/s
TP to 100 °C
Time 480 s
25 °C to TP

All temperatures refer to the center of the package, measured on the top of the component
* slope calculation DT/Dt: Dt max. 5 s; fulfillment for the whole T-range


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Taping 9)




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Tape and Reel 10)

Reel Dimensions
A W Nmin W1 W2 max Pieces per PU

180 mm 8 + 0.3 / - 0.1 mm 60 mm 8.4 + 2 mm 14.4 mm 4000




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Barcode-Product-Label (BPL)

Dry Packing Process and Materials 9)

Moisture-sensitive label or print

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Humidity indicator
Barcode label
Do not eat.
Avoid metal contact.
Discard if circles overrun.
bag opening.
Please check the HIC immidiately after

check dot WET

Comparator

bake units
examine units, if necessary 15%
If wet,

bake units
examine units, if necessary 10%
If wet,

change desiccant
parts still adequately dry. 5%
If wet,

MIL-I-8835
Humidity Indicator

Desiccant
AM
OSR

OHA00539
Moisture-sensitive product is packed in a dry bag containing desiccant and a humidity card according JEDEC-STD-033.


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Schematic Transportation Box 9)

Dimensions of Transportation Box

Width Length Height

260 ± 5 mm 230 ± 5 mm 85 ± 5 mm




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Type Designation System

Wavelength Emission Color Color coordinates according

(λdom typ.) CIE 1931/Emission color:
B: 470 nm blue W: white
S: 633 nm super red
T: 528 nm true green
Y: 587 nm yellow
A: 617 nm amber
R/J: 625 nm red
H: 645 nm hyper-red
O: 606 nm orange
G: 570 nm green Package Type
Q: CHIPLED 0603 / 0402
R: CHIPLED 0805
N: CHIPLED 1206 /
L: Light CHIPLED with lens
emitting
diode

L B Q H 9 G

Lead / Package Properties

1: footprint: 0603 / height: 0.6 mm
3: footprint: 0603 / height: 0.35 mm
9: standard
H: footprint: 0402 / height: 0.35 mm

7:

Encapsulant Type / Lens Properties
1: focusing lens (=20°)
clear resin or white volume conversion
8: white volume conversion
9: clear resin

Chip Technology:
1: TSN
3: standard InGaN
4: AlGaAs
6: standard InGalP
E: ThinGaN & package with 8 kV
ESD stability
G: NOTA, Powerflip, ThinGaN


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Notes
The evaluation of eye safety occurs according to the standard IEC 62471:2006 (photo biological safety of
lamps and lamp systems). Within the risk grouping system of this IEC standard, the device specified in this
data sheet fall into the class exempt group (exposure time 10000 s). Under real circumstances (for expo-
sure time, conditions of the eye pupils, observation distance), it is assumed that no endangerment to the
eye exists from these devices. As a matter of principle, however, it should be mentioned that intense light
sources have a high secondary exposure potential due to their blinding effect. When looking at bright light
sources (e.g. headlights), temporary reduction in visual acuity and afterimages can occur, leading to irrita-
tion, annoyance, visual impairment, and even accidents, depending on the situation.
Subcomponents of this device contain, in addition to other substances, metal filled materials including silver.
Metal filled materials can be affected by environments that contain traces of aggressive substances. There-
fore, we recommend that customers minimize device exposure to aggressive substances during storage,
production, and use. Devices that showed visible discoloration when tested using the described tests above
did show no performance deviations within failure limits during the stated test duration. Respective failure
limits are described in the IEC60810.
For further application related information please visit www.osram-os.com/appnotes




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Disclaimer
Attention please!
The information describes the type of component and shall not be considered as assured characteristics.
Terms of delivery and rights to change design reserved. Due to technical requirements components may
contain dangerous substances.
For information on the types in question please contact our Sales Organization.
If printed or downloaded, please find the latest version on the OSRAM OS website.

Packing
Please use the recycling operators known to you. We can also help you – get in touch with your nearest
sales office. By agreement we will take packing material back, if it is sorted. You must bear the costs of
transport. For packing material that is returned to us unsorted or which we are not obliged to accept, we
shall have to invoice you for any costs incurred.

Product and functional safety devices/applications or medical devices/applications

OSRAM OS components are not developed, constructed or tested for the application as safety relevant
component or for the application in medical devices.
OSRAM OS products are not qualified at module and system level for such application.

In case buyer – or customer supplied by buyer – considers using OSRAM OS components in product safety
devices/applications or medical devices/applications, buyer and/or customer has to inform the local sales
partner of OSRAM OS immediately and OSRAM OS and buyer and /or customer will analyze and coordi-
nate the customer-specific request between OSRAM OS and buyer and/or customer.




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Glossary
1)
Brightness: Brightness groups are tested at a current pulse duration of 25 ms and a tolerance of
±11 %.
2)
Reverse Operation: This product is intended to be operated applying a forward current within the
specified range. Applying any continuous reverse bias or forward bias below the voltage range of light
emission shall be avoided because it may cause migration which can change the electro-optical char-
acteristics or damage the LED.
3)
Wavelength: Wavelengths are tested at a current pulse duration of 25 ms and a tolerance of ±1 nm.
4)
Forward Voltage: Forward voltages are tested at a current pulse duration of 1 ms and a tolerance of
±0.1 V.
5)
Thermal Resistance: Rth max is based on statistic values (6σ).
6)
Thermal Resistance: RthJA results from mounting on PC board FR 4 (pad size ≥ 5 mm² per pad)
7)
Typical Values: Due to the special conditions of the manufacturing processes of semiconductor devic-
es, the typical data or calculated correlations of technical parameters can only reflect statistical figures.
These do not necessarily correspond to the actual parameters of each single product, which could dif-
fer from the typical data and calculated correlations or the typical characteristic line. If requested, e.g.
because of technical improvements, these typ. data will be changed without any further notice.
8)
Characteristic curve: In the range where the line of the graph is broken, you must expect higher differ-
ences between single devices within one packing unit.
9)
Tolerance of Measure: Unless otherwise noted in drawing, tolerances are specified with ±0.1 and
dimensions are specified in mm.
10)
Tape and Reel: All dimensions and tolerances are specified acc. IEC 60286-3 and specified in mm.




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Revision History
Version Date Change

1.2 2020-04-07 Dimensional Drawing

Taping
1.3 2021-09-28 Brand




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Published by OSRAM Opto Semiconductors GmbH

Leibnizstraße 4, D-93055 Regensburg
www.osram-os.com © All Rights Reserved.


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