www.osram-os.

com
Produktdatenblatt | Version 1.1
LR T67F
 

LR T67F
TOPLED ®
First SMT LED with integrated reflector. With our
great experience on SMT LED we are able to offer a
high quality product for all kind of applications.

Applications
——Cluster, Button Backlighting ——Traffic Lights
——Electronic Equipment ——White Goods
——Interior Illumination (e.g. Ambient Map)

Features:
——Package: white PLCC-2 package, colorless clear resin
——Chip technology: Thinfilm
——Typ. Radiation: 120° (Lambertian emitter)
——Color: λdom = 625 nm (● red)
——Corrosion Robustness Class: 3B


——Qualifications: AEC-Q102 Qualified
——ESD: 2 kV acc. to ANSI/ESDA/JEDEC JS-001 (HBM)


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Ordering Information 
Type Luminous Intensity 1) Ordering Code
IF = 20 mA
Iv

LR T67F-U1AA-1-1 450 ... 1400 mcd Q65110A9232




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Maximum Ratings
Parameter Symbol Values

Operating Temperature Top min. -40 °C

max. 100 °C
Storage Temperature Tstg min. -40 °C
max. 100 °C
Junction Temperature Tj max. 125 °C
Forward current IF max. 50 mA
TS = 25 °C
Surge Current IFS max. 100 mA
t ≤ 10 µs; D = 0.005 ; TS = 25 °C
Reverse voltage 2) VR max. 12 V
TS = 25 °C
ESD withstand voltage VESD 2 kV
acc. to ANSI/ESDA/JEDEC JS-001 (HBM)




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Characteristics
IF = 20 mA; TS = 25 °C
Parameter Symbol Values

Peak Wavelength λpeak typ. 634 nm

Dominant Wavelength 3) λdom min. 620 nm
IF = 20 mA typ. 625 nm
max. 630 nm
Spectral Bandwidth at 50% Irel,max ∆λ typ. 19 nm
Viewing angle at 50% IV 2φ typ. 120 °
Forward Voltage 4) VF min. 1.90 V
IF = 20 mA typ. 2.05 V
max. 2.50 V
Reverse current 2) IR typ. 0.2 µA
VR = 12 V  max. 10 µA
Temperature Coefficient of Peak Wavelength TCλpeak typ. 0.14 nm / K
-10°C ≤ T ≤ 100°C
Temperature Coefficient of Dominant Wavelength TCλdom typ. 0.07 nm / K
-10°C ≤ T ≤ 100°C
Temperature Coefficient of Forward Voltage TCVF typ. -2.5 mV / K
-10°C ≤ T ≤ 100°C
Real thermal resistance junction/ambient 5)6) RthJA real max. 500 K / W
Real thermal resistance junction/solderpoint 5) RthJS real max. 280 K / W




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Brightness Groups 
Group Luminous Intensity 1) Luminous Intensity. 1) Luminous Flux 7)
IF = 20 mA IF = 20 mA IF = 20 mA
min. max. typ.
Iv Iv ΦV

U1 450 mcd 560 mcd 1520 mlm

U2 560 mcd 710 mcd 1910 mlm
V1 710 mcd 900 mcd 2420 mlm
V2 900 mcd 1120 mcd 3030 mlm
AA 1120 mcd 1400 mcd 3780 mlm

Forward Voltage Groups 

Group Forward Voltage 4) Forward Voltage 4)
IF = 20 mA IF = 20 mA
min. max.
VF VF

3A 1.90 V 2.05 V
3B 2.05 V 2.20 V
4A 2.20 V 2.35 V
4B 2.35 V 2.50 V

Group Name on Label 

Example: AA-1-3A


Brightness Wavelength Forward Voltage

AA 1 3A


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Relative Spectral Emission 7)

Irel = f (λ); IF = 20 mA; TS = 25 °C

OHL02654
100

%
Ι rel
80
Vλ

60

yellow
40
orange
amber
red
super-red
20

0
400 450 500 550 600 650 nm 700
λ

Radiation Characteristics 7)

Irel = f (ϕ); TS = 25 °C

40˚ 30˚ 20˚ 10˚ 0˚ OHL01660

ϕ 1.0

50˚
 0.8

0.6
60˚

0.4
70˚

0.2
80˚

90˚ 0

100˚
1.0 0.8 0.6 0.4 0˚ 20˚ 40˚ 60˚ 80˚ 100˚ 120˚


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Forward current 7), 8) Relative Luminous Intensity 7), 8)

IF = f(VF); TS = 25 °C Iv/Iv(20 mA) = f(IF); TS = 25 °C

OHL03954 OHL03008
10 2 10 1
mA IV
IF
IV (20 mA)
5

red
super-red
orange 10 0
amber
yellow 5
1
10

5 10 -1

10 0 10 -2 0
1.5 1.7 1.9 2.1 2.3 V 2.5 10 5 10 1 mA 10 2
VF IF




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Forward Voltage 7) Relative Luminous Intensity 7)

ΔVF = VF - VF(25 °C) = f(Tj); IF = 20 mA Iv/Iv(25 °C) = f(Tj); IF = 20 mA

OHL02667 OHL02666
0.25 2.5
V IV
∆VF IV (25 ˚C)

0.15 2.0 yellow

0.1
1.5
0.05

0 super red
1.0 amber
red
-0.05
orange
-0.1 0.5

-0.15

-0.2 0
-60 -40 -20 0 20 40 60 ˚C 100 -60 -40 -20 0 20 40 60 ˚C 100
Tj Tj




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Max. Permissible Forward Current

IF = f(T)
OHL03044
60
mA
IF
50
TA TS
40

30

20

10
TA temp. ambient
TS temp. solder point
0
0 20 40 60 80 ˚C 100
T

Permissible Pulse Handling Capability Permissible Pulse Handling Capability

IF = f(tp); D: Duty cycle; TS = 25 °C IF = f(tp); D: Duty cycle; TS = 25 °C
OHL03045 OHL03045
0.12 0.12
A D= A D=
IF IF
0.005 0.005


0.10 0.01 0.10 0.01
0.02 0.02
0.05 0.05
0.1 0.1
0.08 0.2 0.08 0.2
0.5 0.5
1 1
0.06 0.06

0.04 0.04

0.02 tP 0.02 tP
tP IF tP IF
D= T D= T
T T
0 -5 0 -5
10 10-4 10-3 10-2 10-1 100 101 s 102 10 10-4 10-3 10-2 10-1 100 101 s 102
tp tp


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Dimensional Drawing 9)

3.0 (0.118) 2.1 (0.083)

2.6 (0.102) 1.7 (0.067)
2.3 (0.091) 0.1 (0.004) (typ.) 0.9 (0.035)
2.1 (0.083) 0.7 (0.028)

3.3 (0.130) 4˚±1

(2.4) (0.095)
3.4 (0.134)
3.0 (0.118)

3.7 (0.146)
C

1.1 (0.043)
0.5 (0.020)
Cathode marking
0.18 (0.007) 0.6 (0.024)
0.12 (0.005) 0.4 (0.016)
GPLY6724

Further Information
Approximate Weight: 34.0 mg

Package marking: Cathode

Corrosion test: Class: 3B

Test condition: 40°C / 90 % RH / 15 ppm H2S / 14 days (stricter than IEC
60068-2-43)




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Recommended Solder Pad 9)

2.6 (0.102)

4.5 (0.177)
4.5 (0.177)
1.5 (0.059)

1.5 (0.059)
2.6 (0.102)

Padgeometrie für
verbesserte Wärmeableitung
Paddesign for Lötstopplack Cu-Fläche > 16 mm 2
improved heat dissipation Solder resist Cu-area > 16 mm 2
OHLPY970

Recommended Solder Pad 9)

Fläche darf bei Verwendung von TOPLED®

elektrisch nicht beschaltet werden.
For TOPLED® assembly do not use
Padgeometrie für this area for electrical contact
verbesserte Wärmeableitung
3.3 (0.130) 3.3 (0.130)
Paddesign for
Anode


improved heat dissipation

2.3 (0.091)
0.8 (0.031)
1.1 (0.043)

11.1 (0.437)
3.7 (0.146)

1.5 (0.059)

0.7 (0.028)
Kathode/
Cathode

Fläche darf bei Verwendung von TOPLED® Cu Fläche / <_ 16 mm 2 per pad
elektrisch nicht beschaltet werden. Cu-area
For TOPLED® assembly do not use
this area for electrical contact

Lötstoplack
Solder resist OHLPY440

For superior solder joint connectivity results we recommend soldering under standard nitrogen atmosphere. Package not
suitable for ultra sonic cleaning.


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Reflow Soldering Profile

Product complies to MSL Level 2 acc. to JEDEC J-STD-020E
OHA04525
300
˚C
T 250
240 ˚C Tp 245 ˚C
217 ˚C tP
200
tL

150
tS

100

50
25 ˚C
0
0 50 100 150 200 250 s 300
t

Profile Feature Symbol Pb-Free (SnAgCu) Assembly Unit

Minimum Recommendation Maximum
Ramp-up rate to preheat*) 2 3 K/s
25 °C to 150 °C
Time tS tS 60 100 120 s
TSmin to TSmax
Ramp-up rate to peak*) 2 3 K/s


TSmax to TP
Liquidus temperature TL 217 °C
Time above liquidus temperature tL 80 100 s
Peak temperature TP 245 260 °C
Time within 5 °C of the specified peak tP 10 20 30 s
temperature TP - 5 K
Ramp-down rate* 3 6 K/s
TP to 100 °C
Time 480 s
25 °C to TP

All temperatures refer to the center of the package, measured on the top of the component
* slope calculation DT/Dt: Dt max. 5 s; fulfillment for the whole T-range


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Taping 9)




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Tape and Reel 10)

Reel Dimensions
A W Nmin W1 W2 max Pieces per PU

180 mm 8 + 0.3 / - 0.1 mm 60 mm 8.4 + 2 mm 14.4 mm 2000

330 mm 8 + 0.3 / - 0.1 mm 60 mm 8.4 + 2 mm 14.4 mm 8000




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Barcode-Product-Label (BPL)

Dry Packing Process and Materials 9)

Moisture-sensitive label or print

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Humidity indicator
Barcode label
Do not eat.
Avoid metal contact.
Discard if circles overrun.
bag opening.
Please check the HIC immidiately after

check dot WET

Comparator

bake units
examine units, if necessary 15%
If wet,

bake units
examine units, if necessary 10%
If wet,

change desiccant
parts still adequately dry. 5%
If wet,

MIL-I-8835
Humidity Indicator

Desiccant
AM
OSR

OHA00539
Moisture-sensitive product is packed in a dry bag containing desiccant and a humidity card according JEDEC-STD-033.


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Schematic Transportation Box 9)

Barcode label Barcode label

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Packing
Sealing label OHA02044

Dimensions of Transportation Box

Width Length Height

200 ± 5 mm 195 ± 5 mm 30 ± 5 mm
352 ± 5 mm 352 ± 5 mm 33 ± 5 mm




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Type Designation System

Wavelength Emission Color Color coordinates according

(λdom typ.) CIE 1931/Emission color:
A: 617 nm amber W: white
S: 633 nm super red UW: ultra white
T: 528 nm true green CB: color on demand blue
Y: 587 nm yellow CG: color on demand green
O: 606 nm orange CL: color on demand lagune
G: 570 nm green
P: 560 nm pure green
R: 625 nm red
B: 470 nm blue Package Type
H: 645 nm hyper-red T: TOPLED
V: 505 nm verde green

L: Light
emitting
diode

L A T 6 7 6
´
Lead / Package Properties
6: folded leads
7: reverse gullwing leads
T: folded leads, improved corrosion stability
Au-LF), w/o TiO2 jetting
V: folded leads and UX:3 w/ improved
corrosion stability (Au-LF), TiO2 jetting

Encapsulant Type / Lens Properties

7: Colorless clear or white volume conversion


(resin encapsulation)
S: Silicone (with or without diffuser)

Chip Technology:
1: TSN
3: standard InGaN
4: AlGaAs
5: HOP 2000
6: Standard InGalP
9: TSN low current
B: HOP 2000
C: ATON
D: Small ThinGaN/ Thinfilm (e.g. 6mil)
F: Thinfilm InGaAlP
G: ThinGaN(Thinfilm InGaN)
K: InGaAlP low current
S: standard InGaN low current
0: TSN


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Notes
The evaluation of eye safety occurs according to the standard IEC 62471:2006 (photo biological safety of
lamps and lamp systems). Within the risk grouping system of this IEC standard, the device specified in this
data sheet falls into the class exempt group (exposure time 10000 s). Under real circumstances (for expo-
sure time, conditions of the eye pupils, observation distance), it is assumed that no endangerment to the
eye exists from these devices. As a matter of principle, however, it should be mentioned that intense light
sources have a high secondary exposure potential due to their blinding effect. When looking at bright light
sources (e.g. headlights), temporary reduction in visual acuity and afterimages can occur, leading to irrita-
tion, annoyance, visual impairment, and even accidents, depending on the situation.
Subcomponents of this device contain, in addition to other substances, metal filled materials including silver.
Metal filled materials can be affected by environments that contain traces of aggressive substances. There-
fore, we recommend that customers minimize device exposure to aggressive substances during storage,
production, and use. Devices that showed visible discoloration when tested using the described tests above
did show no performance deviations within failure limits during the stated test duration. Respective failure
limits are described in the IEC60810.
For further application related information please visit www.osram-os.com/appnotes




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Disclaimer
Attention please!
The information describes the type of component and shall not be considered as assured characteristics.
Terms of delivery and rights to change design reserved. Due to technical requirements components may
contain dangerous substances.
For information on the types in question please contact our Sales Organization.
If printed or downloaded, please find the latest version on the OSRAM OS website.

Packing
Please use the recycling operators known to you. We can also help you – get in touch with your nearest
sales office. By agreement we will take packing material back, if it is sorted. You must bear the costs of
transport. For packing material that is returned to us unsorted or which we are not obliged to accept, we
shall have to invoice you for any costs incurred.

Product and functional safety devices/applications or medical devices/applications

OSRAM OS components are not developed, constructed or tested for the application as safety relevant
component or for the application in medical devices.
OSRAM OS products are not qualified at module and system level for such application.

In case buyer – or customer supplied by buyer – considers using OSRAM OS components in product safety
devices/applications or medical devices/applications, buyer and/or customer has to inform the local sales
partner of OSRAM OS immediately and OSRAM OS and buyer and /or customer will analyze and coordi-
nate the customer-specific request between OSRAM OS and buyer and/or customer.




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Glossary
1)
Brightness: Brightness values are measured during a current pulse of typically 25 ms, with an internal
reproducibility of ±8 % and an expanded uncertainty of ±11 % (acc. to GUM with a coverage factor of
k = 3).
2)
Reverse Operation: Reverse Operation of 10 hours is permissible in total. Continuous reverse opera-
tion is not allowed.
3)
Wavelength: The wavelength is measured at a current pulse of typically 25 ms, with an internal repro-
ducibility of ±0.5 nm and an expanded uncertainty of ±1 nm (acc. to GUM with a coverage factor of k =
3).
4)
Forward Voltage: The forward voltage is measured during a current pulse of typically 8 ms, with an
internal reproducibility of ±0.05 V and an expanded uncertainty of ±0.1 V (acc. to GUM with a coverage
factor of k = 3).
5)
Thermal Resistance: Rth max is based on statistic values (6σ).
6)
Thermal Resistance: RthJA results from mounting on PC board FR 4 (pad size 16 mm² per pad)
7)
Typical Values: Due to the special conditions of the manufacturing processes of semiconductor devic-
es, the typical data or calculated correlations of technical parameters can only reflect statistical figures.
These do not necessarily correspond to the actual parameters of each single product, which could dif-
fer from the typical data and calculated correlations or the typical characteristic line. If requested, e.g.
because of technical improvements, these typ. data will be changed without any further notice.
8)
Characteristic curve: In the range where the line of the graph is broken, you must expect higher differ-
ences between single devices within one packing unit.
9)
Tolerance of Measure: Unless otherwise noted in drawing, tolerances are specified with ±0.1 and
dimensions are specified in mm.
10)
Tape and Reel: All dimensions and tolerances are specified acc. IEC 60286-3 and specified in mm.




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Revision History
Version Date Change

1.2 2019-09-24 Features

Disclaimer




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Published by OSRAM Opto Semiconductors GmbH

Leibnizstraße 4, D-93055 Regensburg
www.osram-os.com © All Rights Reserved.


22 Version 1.2 | 2019-09-24