www.osram-os.

com
Produktdatenblatt | Version 1.1
LA H9GP
 

LA H9GP
OSLON ® Black
OSLON Black Series combines thermal stability with
high performance and reliability in a compact black
package. It has a metal lead frame and a tried and
tested lens design. The LED can be used wherever
there are large fluctuations in temperature and a
large amount of light is needed from a small area.

Applications
——Cluster, Button Backlighting ——Interior Illumination (e.g. Ambient Map)
——Custom Tuning ——Transportation, Plane, Ship
——Head-Up Display LED & Laser

Features:
——Package: SMD epoxy package with silicone lens
——Chip technology: Thinfilm
——Typ. Radiation: 90°
——Color: λdom = 617 nm (● amber)


——Corrosion Robustness Class: 3B
——Qualifications: AEC-Q102 Qualified
——ESD: 8 kV acc. to ANSI/ESDA/JEDEC JS-001 (HBM, Class 3B)


1 Version 1.7 | 2020-01-30

 LA H9GP
 

Ordering Information 
Type Luminous Flux 1) Ordering Code
IF = 350 mA
ΦV

LA H9GP-JYKZ-24-H29C 52 ... 112 lm Q65112A3113




2 Version 1.7 | 2020-01-30

 LA H9GP
 

Maximum Ratings
Parameter Symbol Values

Operating Temperature Top min. -40 °C

max. 125 °C
Storage Temperature Tstg min. -40 °C
max. 125 °C
Junction Temperature Tj max. 150 °C
Junction Temperature for short time applications* Tj max. 175 °C
Forward current IF min. 100 mA
TS = 25 °C max. 1000 mA
Surge Current IFS max. 2500 mA
t ≤ 10 µs; D = 0.016 ; TS = 25 °C
ESD withstand voltage VESD 8 kV
acc. to ANSI/ESDA/JEDEC JS-001 (HBM, Class 3B)
Reverse current 2) IR max. 200 mA

* The median lifetime (L70/B50) for Tj = 175°C is 100h.




3 Version 1.7 | 2020-01-30

 LA H9GP
 

Characteristics
IF = 350 mA; TS = 25 °C
Parameter Symbol Values

Peak Wavelength λpeak typ. 624 nm

Dominant Wavelength 3) λdom min. 612 nm
IF = 350 mA typ. 617 nm
max. 624 nm
Spectral Bandwidth at 50% Irel,max ∆λ typ. 18 nm
Viewing angle at 50% IV 2φ typ. 90 °
Forward Voltage 4) VF min. 1.95 V
IF = 350 mA typ. 2.20 V
max. 2.65 V
Reverse voltage (ESD device) VR ESD min. 45 V
Reverse voltage 2) VR max. 1.2 V
IR = 20 mA
Real thermal resistance junction/solderpoint 5) RthJS real typ. 6.5 K / W
max. 11.0 K / W




4 Version 1.7 | 2020-01-30

 LA H9GP
 

Brightness Groups 
Group Luminous Flux 1) Luminous Flux 1) Luminous Intensity 6)
IF = 350 mA IF = 350 mA IF = 350 mA
min. max. typ.
ΦV ΦV Iv

JY 52 lm 61 lm 28 cd
JZ 61 lm 71 lm 33 cd
KX 71 lm 82 lm 38 cd
KY 82 lm 97 lm 44 cd
KZ 97 lm 112 lm 51 cd

Forward Voltage Groups 

Group Forward Voltage 4) Forward Voltage 4)
IF = 350 mA IF = 350 mA
min. max.
VF VF

H2 1.95 V 2.05 V
9B 2.05 V 2.35 V
9C 2.35 V 2.65 V

Wavelength Groups 
Group Dominant Wavelength 3) Dominant Wavelength 3)
IF = 350 mA IF = 350 mA


min. max.
λdom λdom

2 612 nm 616 nm
3 616 nm 620 nm
4 620 nm 624 nm


5 Version 1.7 | 2020-01-30

 LA H9GP
 

Group Name on Label 

Example: JY-2-9B
Brightness Wavelength Forward Voltage

JY 2 9B




6 Version 1.7 | 2020-01-30

 LA H9GP
 

Relative Spectral Emission 6)

Φrel = f (λ); IF = 350 mA; TS = 25 °C

LA H9GP
1,0
Φrel
: Vλ
: amber

0,8

0,6

0,4

0,2

0,0
350 400 450 500 550 600 650 700 750 800
λ [nm]

Radiation Characteristics 6)

Irel = f (ϕ); TS = 25 °C
LA H9GP

ϕ [°]
-10° 0° 10° 20° 30° 40° 50° 60° 70° 80° 90°
-20° 1,0
Irel


-30°

-40° 0,8

-50°
0,6
-60°

0,4
-70°

-80° 0,2

-90° 0,0

-100°


7 Version 1.7 | 2020-01-30

 LA H9GP
 

Forward current 6), 7) Relative Luminous Flux 6), 7)

IF = f(VF); TS = 25 °C Φv/Φv(350 mA) = f(IF); TS = 25 °C

LA H9GP
1000
LA H9GP ΦV
IF [mA]
ΦV(350mA)
2,5

800
2,0

1,5
600

1,0
400

0,5

200

0,0
100

00
10

20

40

60

80
1,8 2,0 2,2 2,4 2,6 2,8 2,9

10
VF [V] IF [mA]




8 Version 1.7 | 2020-01-30

 LA H9GP
 

Forward Voltage 6) Relative Luminous Flux 6)

ΔVF = VF - VF(25 °C) = f(Tj); IF = 350 mA Φv/Φv(25 °C) = f(Tj); IF = 350 mA

LA H9GP LA H9GP
0,3 Φv 1,6
∆VF [V]
Φv(25°C)
1,4
0,2

1,2

0,1
1,0

0,0 0,8

0,6
-0,1

0,4

-0,2
0,2

-0,3 0,0
-40 -20 0 20 40 60 80 100 120 140 -40 -20 0 20 40 60 80 100 120 140
Tj [°C] Tj [°C]

Dominant Wavelength 6)

Δλdom = λdom - λdom(25 °C) = f(Tj); IF = 350 mA
LA H9GP
10
∆λ dom [nm]

5

0

-5

-10
-40 -20 0 20 40 60 80 100 120 140
Tj [°C]


9 Version 1.7 | 2020-01-30

 LA H9GP
 

Max. Permissible Forward Current

IF = f(T)
OHL04484
1.1
A
IF

0.9

0.8

0.7

0.6

0.5

0.4

0.3

0.2

0.1
Do not use current below 100 mA
0
0 20 40 60 80 100 ˚C 140
TS

Permissible Pulse Handling Capability Permissible Pulse Handling Capability

IF = f(tp); D: Duty cycle; TS = 25 °C IF = f(tp); D: Duty cycle; TS = 85 °C
OHL04374 OHL04374
2.6 2.6
A tP A tP
IF t IF IF t IF
2.4 D = TP 2.4 D = TP


T T
2.2 2.2

2.0 2.0
D= D=
0.005 0.005
1.8 0.01 1.8 0.01
0.02 0.02
1.6 0.05 1.6 0.05
0.1 0.1
1.4 0.2 1.4 0.2
0.5 0.5
1 1
1.2 1.2

1.0 1.0

0.8 -5 0.8 -5
10 10-4 10-3 10-2 10-1 100 101 s 102 10 10-4 10-3 10-2 10-1 100 101 s 102
tp tp


10 Version 1.7 | 2020-01-30

 LA H9GP
 

Dimensional Drawing 8)

Further Information:
Approximate Weight: 32.0 mg

Package marking: Cathode

Corrosion test: Class: 3B

Test condition: 40°C / 90 % RH / 15 ppm H2S / 14 days (stricter than IEC
60068-2-43)
ESD advice: The device is protected by ESD device which is connected in parallel to the


Chip.


11 Version 1.7 | 2020-01-30

 LA H9GP
 

Recommended Solder Pad 8)

For superior solder joint connectivity results we recommend soldering under standard nitrogen atmosphere. In case the PCB
layout of the application is intended to be used with other OSLON derivates or in future developed OSLON derivates, the heat
sink must not be electrically connected to anode or cathode solder pad because of possible chip inverted polarity. Package
not suitable for ultra sonic cleaning. To ensure a high solder joint reliability and to minimize the risk of solder joint cracks, the
customer is responsible to evaluate the combination of PCB board and solder paste material for his application.




12 Version 1.7 | 2020-01-30

 LA H9GP
 

Reflow Soldering Profile

Product complies to MSL Level 2 acc. to JEDEC J-STD-020E
OHA04525
300
˚C
T 250
240 ˚C Tp 245 ˚C
217 ˚C tP
200
tL

150
tS

100

50
25 ˚C
0
0 50 100 150 200 250 s 300
t

Profile Feature Symbol Pb-Free (SnAgCu) Assembly Unit

Minimum Recommendation Maximum
Ramp-up rate to preheat*) 2 3 K/s
25 °C to 150 °C
Time tS tS 60 100 120 s
TSmin to TSmax
Ramp-up rate to peak*) 2 3 K/s


TSmax to TP
Liquidus temperature TL 217 °C
Time above liquidus temperature tL 80 100 s
Peak temperature TP 245 260 °C
Time within 5 °C of the specified peak tP 10 20 30 s
temperature TP - 5 K
Ramp-down rate* 3 6 K/s
TP to 100 °C
Time 480 s
25 °C to TP

All temperatures refer to the center of the package, measured on the top of the component
* slope calculation DT/Dt: Dt max. 5 s; fulfillment for the whole T-range


13 Version 1.7 | 2020-01-30

 LA H9GP
 

Taping 8)




14 Version 1.7 | 2020-01-30

 LA H9GP
 

Tape and Reel 9)

Reel Dimensions
A W Nmin W1 W2 max Pieces per PU

180 mm 12 + 0.3 / - 0.1 mm 60 mm 12.4 + 2 mm 18.4 mm 600

330 mm 12 + 0.3 / - 0.1 mm 60 mm 12.4 + 2 mm 18.4 mm 3000




15 Version 1.7 | 2020-01-30

 LA H9GP
 

Barcode-Product-Label (BPL)

Dry Packing Process and Materials 8)

Moisture-sensitive label or print

N s E RS
L
E

re
V
E

tiv
If

e
la ared ag
fr
in pa
L

hu

ck
an

m
id
k,
bl r co
ba

e
de
e be
sela

ity

30
l

˚C
).
(R

/6
R
H

0%
.
Barcode label
TIO
<
_
in IV O % k
IT T of
nta
90 to rs
S C < d ea s ). rs
N U ou
U coSEND d te (p on ,
or de H rs
iti ou
an bjec ng


ou rs
Ais bUagRMEICO ˚C co 72 H
si nd 5 H ou
˚C su es te 48
CThIS co ± e H
y da e 24 6
T E 40 be oc
or ˚C tim e
S < ill pr). ith or tim
O w nt ct 23 w tim e
M TO
at fa lo or
s at le ˚C at at e. al F lo or tim
P th th va l tic F lo or
O on s ui be if: read
ur F lo
m ce eq la lo
w ed
id
en l 4 5 F
vi g, n oc ve l
24 or de be in pr is 5a
de , e nt whe Le ve l 6
te
g: , w
r
co
se ou ke e Le ve l
da Le ve
ba ed flo
ba e m % ba al st
ur e
en re r ur e Le
ed e e tim re> 10 fo se oi st ur e
al op se fo M oi st ur
se is as or . is 33 k, M oi st
k, lo H bed
in g ph , -0 an M oi
e r- an in F R ng ar D bl M
ba
lif is po If bl ith % ki r C. S
T (if r
lf th va p. w 10 ba to et J- ea r ks
he r w, m <
_ m Y ea rs
S te ed iredicat d, EC 1 Y ee
1.
fte
A flody
nt
d
at
qu In no ire D > 1 W Hou
ou e 4 8
2. re
bo M re reity is qu/JE e
to es id 2b re C : tim e 16
a) S tim
ic is IP ed loor tim e
b) ev Humor e or
en F
D 2a king nc te F
lo or tim
a) op lo or
3. b) ba re da e F lo
If fe
al l 1 2 F
re tim ve l
4. se d l 2a
Le ve 3
ag an e Le ve l
B e ur e Le ve
at st ur e
D Le
oi st ur e
M oi st ur
M oi st
M oi
M

M
RA
OS

Humidity indicator
Barcode label
Do not eat.
Avoid metal contact.
Discard if circles overrun.
bag opening.
Please check the HIC immidiately after

check dot WET

Comparator

bake units
examine units, if necessary 15%
If wet,

bake units
examine units, if necessary 10%
If wet,

change desiccant
parts still adequately dry. 5%
If wet,

MIL-I-8835
Humidity Indicator

Desiccant
AM
OSR

OHA00539
Moisture-sensitive product is packed in a dry bag containing desiccant and a humidity card according JEDEC-STD-033.


16 Version 1.7 | 2020-01-30

 LA H9GP
 

Type Designation System

Wavelength Emission ColorColor coordinates according

(λdom typ.) CIE 1931 / Emission color:
A: 617 nm amber CW: warm white
S: 633 nm super red CY: color on demand yellow
Y: 590 nm yellow UW: ultra-white
R: 625 nm red W: white
W2: white, 2 chips

Technology concept
3: Silicone encapsulation
K: Automotive (casted) platform: QFN
and Industry
Product
L: Light Package Type Product-
Emitting H: Top emitting device version
Diode Leadframe based
Black reflector package

K W H 2 L 5 3 1 . T E

Lead / Package Properties Converted Colors

Toplooker:
T: greenish cold white
2: 3731 H: 3737
C: intermediate cold white
3: 3742 I: 3746


4: 3753 J: 3757
5: 3746 K: 3768 Binning Information:
9: leadless L: 3779 E: ECE binning: IEC 62707
W: next chip development (i.e. ebxD68)
K: binning within ECE
Encapsulant Type / Lens Properties
L: no lens (Lambertian)
P: planar compression molded silicon
(120°); with volume conversion
Q: planar compression molded silicon
(120°); with layer conversion
G: outcoupling lens 90°

Chip Technology:
5: standard power class
P: power performance


17 Version 1.7 | 2020-01-30

 LA H9GP
 

Notes
The evaluation of eye safety occurs according to the standard IEC 62471:2006 (photo biological safety of
lamps and lamp systems). Within the risk grouping system of this IEC standard, the device specified in this
data sheet falls into the class exempt group (exposure time 10000 s). Under real circumstances (for expo-
sure time, conditions of the eye pupils, observation distance), it is assumed that no endangerment to the
eye exists from these devices. As a matter of principle, however, it should be mentioned that intense light
sources have a high secondary exposure potential due to their blinding effect. When looking at bright light
sources (e.g. headlights), temporary reduction in visual acuity and afterimages can occur, leading to irrita-
tion, annoyance, visual impairment, and even accidents, depending on the situation.
Subcomponents of this device contain, in addition to other substances, metal filled materials including silver.
Metal filled materials can be affected by environments that contain traces of aggressive substances. There-
fore, we recommend that customers minimize device exposure to aggressive substances during storage,
production, and use. Devices that showed visible discoloration when tested using the described tests above
did show no performance deviations within failure limits during the stated test duration. Respective failure
limits are described in the IEC60810.
For further application related information please visit www.osram-os.com/appnotes




18 Version 1.7 | 2020-01-30

 LA H9GP
 

Disclaimer
Attention please!
The information describes the type of component and shall not be considered as assured characteristics.
Terms of delivery and rights to change design reserved. Due to technical requirements components may
contain dangerous substances.
For information on the types in question please contact our Sales Organization.
If printed or downloaded, please find the latest version on the OSRAM OS website.

Packing
Please use the recycling operators known to you. We can also help you – get in touch with your nearest
sales office. By agreement we will take packing material back, if it is sorted. You must bear the costs of
transport. For packing material that is returned to us unsorted or which we are not obliged to accept, we
shall have to invoice you for any costs incurred.

Product and functional safety devices/applications or medical devices/applications

OSRAM OS components are not developed, constructed or tested for the application as safety relevant
component or for the application in medical devices.
OSRAM OS products are not qualified at module and system level for such application.

In case buyer – or customer supplied by buyer – considers using OSRAM OS components in product safety
devices/applications or medical devices/applications, buyer and/or customer has to inform the local sales
partner of OSRAM OS immediately and OSRAM OS and buyer and /or customer will analyze and coordi-
nate the customer-specific request between OSRAM OS and buyer and/or customer.




19 Version 1.7 | 2020-01-30

 LA H9GP
 

Glossary
1)
Brightness: Brightness values are measured during a current pulse of typically 25 ms, with an internal
reproducibility of ±8 % and an expanded uncertainty of ±11 % (acc. to GUM with a coverage factor of
k = 3).
2)
Reverse Operation: Reverse Operation of 10 hours is permissible in total. Continuous reverse opera-
tion is not allowed.
3)
Wavelength: The wavelength is measured at a current pulse of typically 25 ms, with an internal repro-
ducibility of ±0.5 nm and an expanded uncertainty of ±1 nm (acc. to GUM with a coverage factor of k =
3).
4)
Forward Voltage: The forward voltage is measured during a current pulse of typically 8 ms, with an
internal reproducibility of ±0.05 V and an expanded uncertainty of ±0.1 V (acc. to GUM with a coverage
factor of k = 3).
5)
Thermal Resistance: Rth max is based on statistic values (6σ).
6)
Typical Values: Due to the special conditions of the manufacturing processes of semiconductor devic-
es, the typical data or calculated correlations of technical parameters can only reflect statistical figures.
These do not necessarily correspond to the actual parameters of each single product, which could dif-
fer from the typical data and calculated correlations or the typical characteristic line. If requested, e.g.
because of technical improvements, these typ. data will be changed without any further notice.
7)
Characteristic curve: In the range where the line of the graph is broken, you must expect higher differ-
ences between single devices within one packing unit.
8)
Tolerance of Measure: Unless otherwise noted in drawing, tolerances are specified with ±0.1 and
dimensions are specified in mm.
9)
Tape and Reel: All dimensions and tolerances are specified acc. IEC 60286-3 and specified in mm.




20 Version 1.7 | 2020-01-30

 LA H9GP
 

Revision History
Version Date Change

1.7 2020-01-30 Features

Further Information
Reel Dimensions
Schematic Transportation Box
Dimensions of Transportation Box
Type Designation System
Notes
Disclaimer
Glossary
Recommended Solder Pad




21 Version 1.7 | 2020-01-30

 LA H9GP
 

Published by OSRAM Opto Semiconductors GmbH

Leibnizstraße 4, D-93055 Regensburg
www.osram-os.com © All Rights Reserved.


22 Version 1.7 | 2020-01-30