www.osram-os.

com
Produktdatenblatt | Version 1.1
LY ETSF
 

LY ETSF
Power TOPLED ®
PowerTOPLED, a powerful member of the TOPLED
family. Thanks to their high luminous efficacy, the
LEDs are ideal for rear light clusters and indicators
on vehicles and for display panels for traffic control
systems.

Applications
——Cluster, Button Backlighting ——Signalling
——Interior Illumination (e.g. Ambient Map)

Features:
——Package: white PLCC-4 package, colorless clear resin
——Chip technology: Thinfilm
——Typ. Radiation: 120° (Lambertian emitter)
——Color: λdom = 590 nm (● yellow)
——Corrosion Robustness Class: 3B
——Qualifications: AEC-Q102 Qualified


——ESD: 2 kV acc. to ANSI/ESDA/JEDEC JS-001 (HBM)


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Ordering Information 
Type Luminous Intensity 1) Ordering Code
IF = 50 mA
Iv

LY ETSF-AABA-35-1 1120 ... 2240 mcd Q65110A9778

LY ETSF-ABDA-46-1 1400 ... 5600 mcd Q65112A9436




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Maximum Ratings
Parameter Symbol Values

Operating Temperature Top min. -40 °C

max. 110 °C
Storage Temperature Tstg min. -40 °C
max. 110 °C
Junction Temperature Tj max. 125 °C
Junction Temperature for short time applications* Tj max. 150 °C
Forward current IF max. 70 mA
TS = 25 °C
Surge Current IFS max. 100 mA
t ≤ 10 µs; D = 0.005 ; TS = 25 °C
Reverse voltage 2) VR max. 12 V
TS = 25 °C
ESD withstand voltage VESD 2 kV
acc. to ANSI/ESDA/JEDEC JS-001 (HBM)

* The median lifetime (L70/B50) for Tj = 150°C is 100h.




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Characteristics
IF = 50 mA; TS = 25 °C
Parameter Symbol Values

Peak Wavelength λpeak typ. 597 nm

Dominant Wavelength 3) λdom min. 583 nm
IF = 50 mA typ. 590 nm
max. 595 nm
Spectral Bandwidth at 50% Irel,max ∆λ typ. 18 nm
Viewing angle at 50% IV 2φ typ. 120 °
Forward Voltage 4) VF min. 2.05 V
IF = 50 mA typ. 2.15 V
max. 2.65 V
Reverse current 2) IR typ. 0.01 µA
VR = 12 V  max. 10 µA
Temperature Coefficient of Peak Wavelength TCλpeak typ. 0.12 nm / K
-10°C ≤ T ≤ 100°C
Real thermal resistance junction/solderpoint 5) RthJS real typ. 70 K / W
max. 95 K / W
Electrical thermal resistance junction/solderpoint 5) RthJS elec. typ. 62 K / W
with efficiency ηe = 11 % max. 85 K / W




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Brightness Groups 
Group Luminous Intensity 1) Luminous Intensity. 1) Luminous Flux 6)
IF = 50 mA IF = 50 mA IF = 50 mA
min. max. typ.
Iv Iv ΦV

AA 1120 mcd 1400 mcd 3780 mlm

AB 1400 mcd 1800 mcd 4800 mlm
BA 1800 mcd 2240 mcd 6060 mlm
BB 2240 mcd 2800 mcd 7560 mlm
CA 2800 mcd 3550 mcd 9530 mlm
CB 3550 mcd 4500 mcd 12080 mlm
DA 4500 mcd 5600 mcd 15150 mlm

Forward Voltage Groups 

Group Forward Voltage 4) Forward Voltage 4)
IF = 50 mA IF = 50 mA
min. max.
VF VF

3B 2.05 V 2.20 V
4A 2.20 V 2.35 V
4B 2.35 V 2.50 V
5A 2.50 V 2.65 V

Group
Wavelength Groups 

Dominant Wavelength 3) Dominant Wavelength 3)
IF = 50 mA IF = 50 mA
min. max.
λdom λdom

3 583 nm 586 nm
4 586 nm 589 nm
5 589 nm 592 nm
6 592 nm 595 nm


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Group Name on Label 

Example: AA-3-3B
Brightness Wavelength Forward Voltage

AA 3 3B




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Relative Spectral Emission 6)

Irel = f (λ); IF = 50 mA; TS = 25 °C

LY ETSF
1,0
I
: Vλ
: yellow

0,8

0,6

0,4

0,2

0,0
350 400 450 500 550 600 650 700 750 800
λ/

Radiation Characteristics 6)

Irel = f (ϕ); TS = 25 °C
LY ETSF

ϕ/
-10° 0° 10° 20° 30° 40° 50° 60° 70° 80° 90°
-20° 1,0
I


-30°

-40° 0,8

-50°
0,6
-60°

0,4
-70°

-80° 0,2

-90° 0,0

-100°


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Forward current 6), 7) Relative Luminous Intensity 6), 7)

IF = f(VF); TS = 25 °C Iv/Iv(50 mA) = f(IF); TS = 25 °C

LY ETSF LY ETSF
IV
IF / mA
50
IV(50mA)
1
40

30
0,5
20

10

0,1
5
4
0,05
3

1
1,7 1,8 2,0 2,2 2,4
1

2
3
4
5

10

20
30
40
50
70
VF / V IF / mA




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Forward Voltage 6) Relative Luminous Intensity 6)

ΔVF = VF - VF(25 °C) = f(Tj); IF = 50 mA Iv/Iv(25 °C) = f(Tj); IF = 50 mA

LY ETSF LY ETSF
0,3 Iv 2,0
∆VF / V
Iv(25°C)

0,2

1,5

0,1

0,0 1,0

-0,1

0,5

-0,2

-0,3 0,0
-40 -20 0 20 40 60 80 100 120 -40 -20 0 20 40 60 80 100 120
Tj / °C Tj / °C

Dominant Wavelength 6)

Δλdom = λdom - λdom(25 °C) = f(Tj); IF = 50 mA
LY ETSF
λ / nm
640

620

600

580

560

540

-40 -20 0 20 40 60 80 100 120

T / °C


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Max. Permissible Forward Current

IF = f(T) 1,4

LY ETSF 1,2
80
IF / mA
1,0
70

60 0,8

50 0,6

: Ta
40 0,4
: Ts

30
0,2

20
0,0
10
0 20 40 60 80
0
0 20 40 60 80 100
T / °C

Permissible Pulse Handling Capability Permissible Pulse Handling Capability

IF = f(tp); D: Duty cycle IF = f(tp); D: Duty cycle
LY ETSF LY ETSF

TS = 0°C ... 108°C TS = 110°C

IF / mA IF / mA
120
120

 100

: D = 1.0
100 : D = 0.5
80 : D = 0.2
: D = 0.1
: D = 0.05
: D = 0.02
: D = 1.0 : D = 0.01
60 : D = 0.005
: D = 0.5
: D = 0.2
80
: D = 0.1
: D = 0.05
: D = 0.02 40
: D = 0.01
: D = 0.005

10-6 10-5 10-4 10-3 0,01 0,1 1 10 10-6 10-5 10-4 10-3 0,01 0,1 1 10
/ /


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Dimensional Drawing 8)

3.0 (0.118) 2.1 (0.083)

2.6 (0.102) 1.7 (0.067)
2.3 (0.091) 0.9 (0.035)
2.1 (0.083) 0.7 (0.028)
0.8 (0.031) 0.1 (0.004) (typ.)
0.6 (0.024) A A
A A

3.3 (0.130) 4˚±1

(2.4) (0.095)
3.4 (0.134)
3.0 (0.118)

3.7 (0.146)

A C A C
1.1 (0.043)
0.5 (0.020) 0.6 (0.024)
0.4 (0.016)
Package marking
0.18 (0.007)
0.12 (0.005) GPLY6084

Further Information:
Approximate Weight: 30.0 mg

Package marking: Cathode

Corrosion test: Class: 3B

Test condition: 40°C / 90 % RH / 15 ppm H2S / 14 days (stricter than IEC
60068-2-43)




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Recommended Solder Pad 8)

Fläche darf bei Verwendung von TOPLED®

elektrisch nicht beschaltet werden.
For TOPLED® assembly do not use
Padgeometrie für this area for electrical contact
verbesserte Wärmeableitung
3.3 (0.130) 3.3 (0.130)
Paddesign for
improved heat dissipation Anode

2.3 (0.091)
0.8 (0.031)
1.1 (0.043)

11.1 (0.437)
3.7 (0.146)

1.5 (0.059)

0.7 (0.028)
Kathode/
Cathode

Fläche darf bei Verwendung von TOPLED® Cu Fläche / <_ 16 mm 2 per pad
elektrisch nicht beschaltet werden. Cu-area
For TOPLED® assembly do not use
this area for electrical contact

Lötstoplack
Solder resist OHLPY440

For superior solder joint connectivity results we recommend soldering under standard nitrogen atmosphere. Package not
suitable for ultra sonic cleaning.




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Reflow Soldering Profile

Product complies to MSL Level 2 acc. to JEDEC J-STD-020E
OHA04525
300
˚C
T 250
240 ˚C Tp 245 ˚C
217 ˚C tP
200
tL

150
tS

100

50
25 ˚C
0
0 50 100 150 200 250 s 300
t

Profile Feature Symbol Pb-Free (SnAgCu) Assembly Unit

Minimum Recommendation Maximum
Ramp-up rate to preheat*) 2 3 K/s
25 °C to 150 °C
Time tS tS 60 100 120 s
TSmin to TSmax
Ramp-up rate to peak*) 2 3 K/s


TSmax to TP
Liquidus temperature TL 217 °C
Time above liquidus temperature tL 80 100 s
Peak temperature TP 245 260 °C
Time within 5 °C of the specified peak tP 10 20 30 s
temperature TP - 5 K
Ramp-down rate* 3 6 K/s
TP to 100 °C
Time 480 s
25 °C to TP

All temperatures refer to the center of the package, measured on the top of the component
* slope calculation DT/Dt: Dt max. 5 s; fulfillment for the whole T-range


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Taping 8)

1.5 (0.059) 4 (0.157) 2 (0.079) Cathode/Collector Marking

1.75 (0.069)

8 (0.315)
3.5 (0.138)
3.6 (0.142)
2.9 (0.114)
4 (0.157) OHAY0667




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Tape and Reel 9)

Reel Dimensions
A W Nmin W1 W2 max Pieces per PU

180 mm 8 + 0.3 / - 0.1 mm 60 mm 8.4 + 2 mm 14.4 mm 2000

330 mm 8 + 0.3 / - 0.1 mm 60 mm 8.4 + 2 mm 14.4 mm 8000




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Barcode-Product-Label (BPL)

Dry Packing Process and Materials 8)

Moisture-sensitive label or print

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Barcode label
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Humidity indicator
Barcode label
Do not eat.
Avoid metal contact.
Discard if circles overrun.
bag opening.
Please check the HIC immidiately after

check dot WET

Comparator

bake units
examine units, if necessary 15%
If wet,

bake units
examine units, if necessary 10%
If wet,

change desiccant
parts still adequately dry. 5%
If wet,

MIL-I-8835
Humidity Indicator

Desiccant
AM
OSR

OHA00539
Moisture-sensitive product is packed in a dry bag containing desiccant and a humidity card according JEDEC-STD-033.


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Type Designation System

Wavelength Emission Color Color coordinates according

(λdom typ.) CIE 1931/Emission color:
A: 617 nm amber W: white
S: 633 nm super red UW: ultra white
T: 528 nm true green CW: warm white
Y: 587 nm yellow CB: color on demand blue
O: 606 nm orange CR: crystal pink
CP/P: 560 nm pure green
R: 625 nm red
B: 470 nm blue Package Type
E: PowerTOPLED

L: Light
emitting
diode

L A E 6 7 6
´
Lead / Package Properties
6: folded leads
T: folded leads, improved corrosion stability
(Au-LF), w/o TiO2 jetting

7: 
Encapsulant Type / Lens Properties
Colorless clear or white volume conversion
(resin encapsulation)
S: Silicone (with or without diffuser)
3: lens 30° … 70°
5: lens 40° .. 80°
Chip Technology:
5: HOP 2000
B: HOP 2000
C: ATON
D: Low cost ThinGaN/ Thinfilm
(e.g. 6mil)
F: Thinfilm InGaAlP
G: ThinGaN(Thinfilm InGaN)
(Subcon:Sapphire)


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Notes
The evaluation of eye safety occurs according to the standard IEC 62471:2006 (photo biological safety of
lamps and lamp systems). Within the risk grouping system of this IEC standard, the device specified in this
data sheet fall into the class exempt group (exposure time 10000 s). Under real circumstances (for expo-
sure time, conditions of the eye pupils, observation distance), it is assumed that no endangerment to the
eye exists from these devices. As a matter of principle, however, it should be mentioned that intense light
sources have a high secondary exposure potential due to their blinding effect. When looking at bright light
sources (e.g. headlights), temporary reduction in visual acuity and afterimages can occur, leading to irrita-
tion, annoyance, visual impairment, and even accidents, depending on the situation.
Subcomponents of this device contain, in addition to other substances, metal filled materials including silver.
Metal filled materials can be affected by environments that contain traces of aggressive substances. There-
fore, we recommend that customers minimize device exposure to aggressive substances during storage,
production, and use. Devices that showed visible discoloration when tested using the described tests above
did show no performance deviations within failure limits during the stated test duration. Respective failure
limits are described in the IEC60810.
For further application related information please visit www.osram-os.com/appnotes




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Disclaimer
Attention please!
The information describes the type of component and shall not be considered as assured characteristics.
Terms of delivery and rights to change design reserved. Due to technical requirements components may
contain dangerous substances.
For information on the types in question please contact our Sales Organization.
If printed or downloaded, please find the latest version on the OSRAM OS website.

Packing
Please use the recycling operators known to you. We can also help you – get in touch with your nearest
sales office. By agreement we will take packing material back, if it is sorted. You must bear the costs of
transport. For packing material that is returned to us unsorted or which we are not obliged to accept, we
shall have to invoice you for any costs incurred.

Product and functional safety devices/applications or medical devices/applications

OSRAM OS components are not developed, constructed or tested for the application as safety relevant
component or for the application in medical devices.
OSRAM OS products are not qualified at module and system level for such application.

In case buyer – or customer supplied by buyer – considers using OSRAM OS components in product safety
devices/applications or medical devices/applications, buyer and/or customer has to inform the local sales
partner of OSRAM OS immediately and OSRAM OS and buyer and /or customer will analyze and coordi-
nate the customer-specific request between OSRAM OS and buyer and/or customer.




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Glossary
1)
Brightness: Brightness values are measured during a current pulse of typically 25 ms, with an internal
reproducibility of ±8 % and an expanded uncertainty of ±11 % (acc. to GUM with a coverage factor of
k = 3).
2)
Reverse Operation: This product is intended to be operated applying a forward current within the
specified range. Applying any continuous reverse bias or forward bias below the voltage range of light
emission shall be avoided because it may cause migration which can change the electro-optical char-
acteristics or damage the LED.
3)
Wavelength: The wavelength is measured at a current pulse of typically 25 ms, with an internal repro-
ducibility of ±0.5 nm and an expanded uncertainty of ±1 nm (acc. to GUM with a coverage factor of k =
3).
4)
Forward Voltage: The forward voltage is measured during a current pulse of typically 8 ms, with an
internal reproducibility of ±0.05 V and an expanded uncertainty of ±0.1 V (acc. to GUM with a coverage
factor of k = 3).
5)
Thermal Resistance: Rth max is based on statistic values (6σ).
6)
Typical Values: Due to the special conditions of the manufacturing processes of semiconductor devic-
es, the typical data or calculated correlations of technical parameters can only reflect statistical figures.
These do not necessarily correspond to the actual parameters of each single product, which could dif-
fer from the typical data and calculated correlations or the typical characteristic line. If requested, e.g.
because of technical improvements, these typ. data will be changed without any further notice.
7)
Characteristic curve: In the range where the line of the graph is broken, you must expect higher differ-
ences between single devices within one packing unit.
8)
Tolerance of Measure: Unless otherwise noted in drawing, tolerances are specified with ±0.1 and
dimensions are specified in mm.
9)
Tape and Reel: All dimensions and tolerances are specified acc. IEC 60286-3 and specified in mm.




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Revision History
Version Date Change

1.5 2019-10-24 Ordering Information

Brightness Groups
1.6 2021-02-17 Features
Schematic Transportation Box
Dimensions of Transportation Box
Glossary




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Published by OSRAM Opto Semiconductors GmbH

Leibnizstraße 4, D-93055 Regensburg
www.osram-os.com © All Rights Reserved.


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