MATERIALS FOR POWER STORAGE SYSTEMS

ELECTRIC AND HYBRID VEHICLE SOLUTIONS

CONTENTS
Introduction...................................................................................................................................................3

Multiple Levels of Battery Solutions

Battery Cells........................................................................................................................................... 4

Battery Modules.....................................................................................................................................5

Battery Packs..........................................................................................................................................5

Materials for Lithium Ion Batteries

Bonding Materials................................................................................................................................. 9

Connecting Materials............................................................................................................................11

Protecting Materials............................................................................................................................. 15

Thermal Materials................................................................................................................................ 19

2 |Contents
INTRODUCTION
Electric and Hybrid Vehicles Charging Ahead
Henkel’s comprehensive portfolio of materials for electric and hybrid vehicles and power storage systems is
driving unprecedented levels of performance, efficiency, reliability and safety.

Our latest automotive electronic material innovations facilitate the manufacture of high-energy density,
lightweight Lithium-Ion (Li-Ion) batteries and their related sub-systems, which are key to enabling the longer
ranges and speed expectations of today’s plug-in hybrid electric and electric vehicles. Henkel’s bonding,
connecting, protecting and thermal formulations deliver advantages at the individual cell level all the way
through to the battery pack, power conversion systems and control units.

Performance Enablers
Beneath the cool, quiet exterior of modern electric vehicles are powerful Li-Ion battery packs working in
concert to facilitate the entire driving experience. Within each pack are a series of modules, which house the
individual battery cells. At every level of the battery structure – and even outside the battery in the power
inverter and engine control unit (ECU) – Henkel electronic materials are accelerating efficiency, reliability,
battery life and, ultimately, safety. Bonding materials secure housings and lead frames for rugged conditions,
while high-performance solders, adhesives and inks deliver reliable and responsive interconnects. Between
each of the battery components, award-winning BERGQUIST brand thermal management materials are
dissipating the heat generated by charging and discharging these workhorses. Safeguarding the entire
battery system from top to bottom are Henkel protection materials to defend against exposure to fluids,
harsh conditions, vibration and thermal shock.

Introduction | 3
MULTIPLE LEVELS OF BATTERY SOLUTIONS
Battery Cells
+ Cell Benefits
At the cell level, Henkel’s functional coatings pre-treat anodes and
cathodes for better conductivity, while unique PTC inks elevate cell • Pre-treatment coating
temperature in freezing conditions for optimal performance and of anodes and cathodes
longer battery life. enhances bonding for
improved conductivity.

• Extend battery life and

reduce weight with
Henkel’s novel battery
heating PTC inks.
Temperature is known to
have a significant impact
on battery performance,
safety and cycle lifetime;
Functional Coating Henkel’s positive
temperature coefficient
(PTC) self-regulating
printed inks provide
a thin, light solution
for heating in freezing
PTC Ink conditions.

Cell Level Product Portfolio

Application Technology Cell Level

Structural Adhesives
Bonding
Thread Locking Adhesives
Electrically Conductive Adhesives
Connecting Printed Inks ✓
Solder Materials
Conformal Coatings
Encapsulants
Functional Coatings ✓
Protecting
Low Pressure Molding
Sealants
Potting
Insulated Metal Substrate
Thermal
Thermal Interface Materials

4 | Battery Cells
Battery Modules
Multiple Henkel materials work in collaboration within the battery module for rugged, reliable and
responsive function.

Low Pressure
Molding

+ Module and Pack

Benefits
Insulated Metal Substrate
• Protect sensitive
components within the Electrically Conductive
battery module through a Adhesive or Solder
Conformal Coating
simple, three-step solution.
Low pressure molding can
Thermal Interface
replace metal and plastic Materials
housings, circuit board Thread Locking Adhesive

protection, sealing and

Structural Adhesive Electrically Conductive
thermal management. Adhesive

• Enable ruggedness and

durability with robust
structural adhesives and
sealants. Battery Packs
Henkel innovations seal, protect, connect and cool multiple components
• High-performance electrical
in battery packs, providing drivers with on-demand power and
function is enabled through
on-the-road reliability.
award-winning electrically
conductive adhesives and
solder materials.
Sealant

• Manage high power

densities and extreme heat
generation with BERGQUIST
Low Pressure Molding
brand thermal interface
materials in a range of
formats and conductivities. Solder Material

Insulated Metal
Substrate

Thermal Interface
Material

Electrically Conductive
Adhesive

Conformal Coating
Structural
Adhesive
Thread Locking Adhesive

Thermal Interface
Material

Battery Modules & Battery Packs | 5

Module Level Product Portfolio
Module Level
Application Technology
Battery Control Module Module Housing & Assembly
Structural Adhesives ✓
Bonding
Thread Locking Adhesives ✓
Electrically Conductive Adhesives ✓ ✓
Connecting Printed Inks ✓
Solder Materials ✓
Conformal Coatings ✓
Encapsulants ✓
Functional Coatings
Protecting
Low Pressure Molding ✓
Sealants ✓ ✓
Potting ✓
Insulated Metal Substrate ✓
Thermal
Thermal Interface Materials ✓ ✓

Pack Level Product Portfolio

Pack Level
Application Technology
Master Control Module Pack Housing & Assembly
Structural Adhesives ✓
Bonding
Thread Locking Adhesives ✓
Electrically Conductive Adhesives ✓ ✓
Connecting Printed Inks

Solder Materials ✓
Conformal Coatings ✓
Encapsulants ✓
Functional Coatings
Protecting
Low Pressure Molding ✓ ✓
Sealants ✓ ✓
Potting ✓
Insulated Metal Substrate ✓
Thermal
Thermal Interface Materials ✓ ✓

6 | Battery Modules & Battery Packs

Battery Packs (Continued): Electric Heating Systems

Sealant

Conformal
Coating

Electrically Thermal Interface

Conductive Adhesive Material
or Solder
Structural
Adhesive

Thermal Interface
Materials

Sealant Potting

Pack Level Product Portfolio (Continued)

Pack Level (Continued)
Application Technology
Electric Heating Systems
Structural Adhesives ✓
Bonding
Thread Locking Adhesives
Electrically Conductive Adhesives ✓
Connecting Printed Inks ✓
Solder Materials ✓
Conformal Coatings ✓
Encapsulants
Functional Coatings
Protecting
Low Pressure Molding
Sealants ✓
Potting ✓
Insulated Metal Substrate
Thermal
Thermal Interface Materials ✓

Battery Packs | 7
Battery Packs (Continued): Coolant Pumps

Sealant

Conformal Insulated Metal

Coating Substrate
Electrically Conductive
Adhesive or Solder

Thermal Interface
Material

Pack Level Product Portfolio (Continued)

Pack Level (Continued)
Application Technology
Coolant Pumps
Structural Adhesives
Bonding
Thread Locking Adhesives
Electrically Conductive Adhesives ✓
Connecting Printed Inks
Solder Materials ✓
Conformal Coatings ✓
Encapsulants ✓
Functional Coatings
Protecting
Low Pressure Molding
Sealants ✓
Potting ✓
Insulated Metal Substrate ✓
Thermal
Thermal Interface Materials ✓

8 | Battery Packs
MATERIALS FOR LITHIUM ION BATTERIES
Lasting Bonds
A strong, cohesive structure for all of the components of a battery pack is integral to long-term function
and durability. Today’s Li-Ion batteries must withstand tremendous in-use vibration and maintain structural
integrity even within these conditions. As the global leader in adhesives development, Henkel’s award-
winning LOCTITE formulations deliver uncompromising structural reliability for Li-Ion battery modules and
battery packs. Within the module, rugged cell to cell and cell to module bonding are achieved with proven
structural adhesives developed specifically for battery applications. These materials also ensure that the
battery pack housing is securely attached and sealed, keeping fluids, dust and moisture out. LOCTITE brand
adhesive strength is found in the battery’s mechanically attached components as well. While screws and
fasteners are designed to hold parts together, road vibration can loosen the threads and risk separation of
copper lead frames or housings. LOCTITE thread locking adhesives eliminate this risk, securing mechanical
parts for battery endurance.

Room Temperature LOCTITE LOCTITE

Cure H8000* H3500
Structural
Adhesives LOCTITE
BONDING UV Cure AA 3525

MATERIALS LOCTITE
4031
Thread Locking
Moisture Cure
Adhesives
LOCTITE
4601

* Product not available in Europe

Bonding Materials | 9
STRUCTURAL ADHESIVES

Operating
Viscosity
Product Name Description Key Attributes Color Cure Time Temperature Fixture time
(cP)
(°C)
Room Temperature Cure
Two component, room • Superior impact and peel strength Part A at 25°C:
Part A: Yellow
temperature curing • Little or no surface preparation 160,000 – 250,000 25 – 30 min.
LOCTITE H8000* Part B: Blue 24 hr. at 22 °C -50°C – 120°C
methacrylate adhesive • Rapid room temperature cure Part B at 25°C: at 25°C
Mix: Green
system • Excellent environmental resistance 20,000 – 50,000
• High strength, durable bonds on
Two component, room Part A: White Part A:
various metals and plastics
temperature curing Part B: Yellow 29,000 18 – 20 min.
LOCTITE H3500 • High impact strength and 24 hr. at 22 °C -50°C – 120°C
methacrylate adhesive Mix: Light Part B: at 21°C
maintains strength over a wide
system Yellow 18,000
temperature range
UV Cure
• Fast cure
• Excellent flexibility, toughness and Less than
One component, UV durability to moisture exposure Clear, colorless 9,500 to 21,000 5 sec. with
LOCTITE AA 3525 Per TDS -50°C – 120°C
curing acrylic adhesive when cured bonds at 25°C black light,
• Bonds to glass, metals and plastics 6 mW/cm2
for industiral applications
* Product not available in Europe

THREAD LOCKING ADHESIVES

Moisture Cure
Viscosity at Operating
Fixture Time
Product Name Description Key Attributes Color 25°C Cure Time Temperature
at 25°C
(cP) (°C)
Moisture Cure
• One component
Cyanoacrylate • Low odor for applications where vapor Transparent, 5 – 180 sec.
LOCTITE 4031 thread locking control is vital colorless to 1,650 24 hr. at 22 °C -50 – 70 depending on
adhesive • Low bloom for cosmetic applications pale yellow substrate
• Suitable for metals, plastics and elastomers
• One component
• Low odor for applications where vapor
Cyanoacrylate Transparent, 5 – 180 sec.
control is vital
LOCTITE 4601 thread locking colorless to 30 – 60 24 hr. at 22 °C -50 – 70 depending on
• Low bloom for cosmetic applications
adhesive pale yellow substrate
• Suitable for metals, plastics and elastomers
• Low viscosity

10 | Bonding Materials
Strong Connections
Printed circuit boards (PCBs) within each Li-Ion battery module feed information about cell temperature,
charging/discharging speed and overall module stress and performance to the master battery pack control
module PCB, which manages battery pack operation. At the board level, Henkel’s proven interconnect
solutions deliver reliable and responsive electronic function to drive and monitor battery performance.
Advanced materials such as high-reliability solder alloys, temperature stable LOCTITE solder pastes and
electrically conductive adhesives provide superior interconnection of components to substrates. Connection
versatility is further enhanced with Henkel’s printed inks, which deliver electrical performance in space-
constrained areas and also enable battery performance through printed temperature sensors for use in
heating applications.

LOCTITE LOCTITE LOCTITE

Component Electrically
ABLESTIK 2902 ABLESTIK CE 3103WLV ABLESTIK CE 8500
Assembly Conductive Adhesives
Materials LOCTITE LOCTITE
ABLESTIK ICP 3535M1 ABLESTIK ICP 4001 LOCTITE SI 5421

LOCTITE LOCTITE LOCTITE

ECI 1010 E&C EDAG 479SS E&C EDAG 725A E&C
Electrically
Conductive Inks LOCTITE LOCTITE
Printed Inks EDAG 976SS HV E&C ECI 1011 E&C

CONNECTING PTC Inks

LOCTITE
ECI 8001 E&C
LOCTITE
ECI 8090 E&C
LOCTITE
ECI 8120 E&C

LOCTITE LOCTITE
Cored Wire C 400 C 502

LOCTITE
Solder Materials Liquid Flux MF 390HR

LOCTITE
Solder Paste HF 212

Connecting Materials | 11
COMPONENT ASSEMBLY MATERIALS
Electrically Conductive Adhesives
Coefficient of
Glass Thermal Expansion
Volume Modulus at
Transition (CTE) Recommended
Product Name Description Key Attributes Resistivity 25 °C
Temperature, Cure
(Ω∙cm) (MPa)
Tg (°C) Below Tg Above Tg

Epoxy
Epoxy
• Two component, solvent-free
LOCTITE ABLESTIK electrically 24 hr. at 25°C or
• Room temperature cure 0.0006 52 49 N/A N/A
2902 conductive 1 – 4 hr. at 65°C
• Good adhesion to variety of substrates
adhesive
Epoxy
• Pb-free alternative to solder
LOCTITE ABLESTIK electrically
• Low-temperature cure 0.0008 114 45 225 4,500 10 min. at 120°C
CE 3103WLV conductive
• Stable contact resistance
adhesive
Epoxy • One component, Pb-free alternative to
LOCTITE ABLESTIK electrically solder, Sn Compatible 1 hr. at 150°C or
0.004 102 36 141 2.6
ICP 3535M1 conductive • Low-temperature cure 10 min. at 175°C
adhesive • Stable contact resistance
Hybrid
Epoxy hybrid • One component 90 min. at 120°C
LOCTITE ABLESTIK electrically • Low stress or 40 min. at
0.0002 24 55 380 2.5
CE 8500 conductive • Flexible for bonding mismatched 150°C or
adhesive adherends 15 min. at 175°C
Silicone
• One component
• High flexibility
Silicone
• Excellent electrical conductivity
LOCTITE ABLESTIK electrically
• High temperature performance 4×10-4 -50 N/A 370 101 1 hr. at 130°C
ICP 4001 conductive
• Pb-free alternative to solder
adhesive
• Outstanding elongation performance
• Low outgassing

Electrically Conductive Adhesives

Volume Tensile Lap

Shore A Recommended
Product Name Description Key Attributes Resistivity Attenuation Shear Strength
Hardness Cure
(Ω∙cm) (N/m²)
EMI Shielding Silicone

Silicone • Room temperature cure

80dB at 10 Mhz,
electrically • Low stress
LOCTITE SI 5421 < 1 X 10-2 50 – 65 110dB at 100 MHz, 0.7 24 hr. at 25°C
conductive • High flexibility, EMI Shielding gasketing
100 dB at 10 GHz
adhesive material

12 | Connecting Materials
PRINTED INKS
Coverage
Sheet Resistance Recommended
Product Name Description Key Attributes at 10 μm Processing Substrates
(Ω/sq/25 µm) Cure
(m²/kg)
PTC Carbon Inks
Positive
• Flexible • Polyester
temperature
• Printable on most common substrates • PEN**
LOCTITE ECI 8120 E&C coefficient 43 1,700 • Screenprint 10 min. at 140°C
• Self-regulating heater with PTC • Polyimide film
(PTC)
temperature of 120°C • PET*
printable ink
Positive
• Flexible • Polyester
temperature
• Printable on most common substrates • PEN** 10 min. at
LOCTITE ECI 8090 E&C coefficient 38 1,000 • Screenprint
• Self-regulating heater with PTC • Polyimide film 120°C or 140°C
(PTC)
temperature of 90°C • PET*
printable ink
Positive
• Flexible • Polyester
temperature
• Printable on most common substrates • PEN**
LOCTITE ECI 8001 E&C coefficient 48 1,700 • Screenprint 10 min. at 120°C
• Self-regulating heater with PTC • Polyimide film
(PTC)
temperature of 65°C • PET*
printable ink
Silver Inks

• Flexible
• Good adhesion
Screen • High conductivity with optimum
• Polyimide film
LOCTITE ECI 1010 E&C printable, mechanical performance 10.6 0.007 • Screenprint 15 min. at 120°C
• PET*
conductive ink • Compatible with LOCTITE EDAG 440A
E&C, LOCTITE EDAG 440B E&C and
LOCTITE EDAG PF 455B E&C

• Conductive • Membrane
Screen
• Fast drying switches
printable, very
LOCTITE EDAG 479SS E&C • Superior adhesion to polyester film 14.6 < 0.02 • Screenprint • Flexible 15 min. at 100°C
fast drying,
• Excellent fine line printing circuitry display
conductive ink
• Excellent creasability devices

• Conductive
Screen • PET*
• Process ease
printable, • Membrane
LOCTITE EDAG • Excellent adhesion
easy 11 < 0.015 • Screenprint Keyboards 15 min. at 120°C
725A E&C (6S-54) • Good printability and screen residence
processing, • Other flexible
time foils
conductive ink
• Excellent flexibility

• Phenolic paper
• Highly conductive • Epoxy paper Pre-dry 15 min.
Screen
• Resistant to wave soldering • Glass epoxy at 70°C followed
LOCTITE EDAG printable,
• Excellent adhesion 18 < 0.025 • Screenprint • Copper by cure of 30
976SS HV E&C thermoset,
• Excellent screen residence time laminated min. at 150 to
conductive ink substrates
• Solvent resistant 160°C
• plain substrates

• Highly conductive
Flexography • Polyester
• Small particle size • Screenprint
and screen • PEN** 10 min.
LOCTITE ECI 1011 E&C • Excellent adhesion 8.3 < 0.005 • Flexographic
printable • Polyimide film at 150°C
• Excellent printability with flexography • Rotogravure
conductive ink • PET*
• Flexible

* Polyethylene Terephthalate
** Polyethylene Naphthalate
*** Indium Tin Oxide

Connecting Materials | 13
SOLDER MATERIALS
Cored Wire
Approximate Flux Diameter
IPC J-STE-004B
Product Name Description Key Attributes Content Range Pb-Free Alloy SnPb Alloy
Classification
(% by Weight) (mm)
Halide-Free, No-Clean

• Clear residue • 96SC (SAC387) • Sn60

Cored solder
LOCTITE C 502 • Good wetting on difficult substrates 2.7 0.25 – 1.63 • 97SC (SAC305) • Sn62 ROM1
wire
• Medium activity flux • 99C (SnCu) • Sn63

Halogen-Free, No-Clean

• Clear residue
• Increased flux content for improved
wetting on challenging surfaces
• 90iSC
• Award-winning multiple flux core • Sn60
Cored solder • 99C
LOCTITE C 400 technology that ensures consistent 2.2 0.38 – 1.63 • Sn62 ROL0
wire • SAC305
distribution of flux throughout the • Sn63
• SAC387
solder wire
• Suitable for manual and robotic
soldering

Liquid Flux
Solid Content Acid Value IPC J-STE-004B
Product Name Description Key Attributes Application
(% by Weight) (mg KOH/g) Classification
Halogen-Free, No-Clean

• Exceptional through-hole fill

• Recommended for automotive applications
LOCTITE MF 390HR Liquid flux and general electrical soldering applications 6 20 – 25 Spray/Foam ROL0
• Compatible with Pb-free and SnPb wave
solder processes

Solder Paste
Particle Size IPC J-STE-004B Reflow
Product Name Description Key Attributes Alloy Optimal Shelf Life
Distribution Classification Atmosphere
Halogen-Free, No-Clean

• High tack
• 90iSC • Type 3
No-clean, • Low voiding
• SAC0307 • Type 4 6 months at Air and
LOCTITE HF 212 halogen free, • RoHS-compliant ROL0
• SAC305 • Type 4.5 (4A) 0 – 10°C Nitrogen
solder paste • Excellent fine pitch coalescence
• SAC387 • Type 5
• Designed for medium to large boards

14 | Connecting Materials
Amplified Protection
Once reliable assembly is achieved, multiple areas of power storage systems have to be enhanced with
protective materials to fortify the battery ecosystem against moisture, corrosion, automotive fluids, vibration
and thermal shock. Henkel conformal coatings, encapsulants and potting materials provide this defense for
the PCB, isolating and protecting solder joints and sensitive components from harmful conditions. At the
heart of the Li-Ion battery, individual battery cells are augmented with pre-treatment functional coatings of
the cathode and anode metal, allowing strengthened bonds for improved conductivity. To keep contaminants
out of the battery module and/or battery pack, Henkel TECHNOMELT low pressure molding offers a
protective and secure alternative to conventional metal or plastic housings, while Henkel sealants provide an
impenetrable barrier for pouches, battery pack housings and coolant systems.

LOCTITE LOCTITE STYCAST LOCTITE STYCAST

Conformal Coatings UV + Moisture Cure SI 5293 PC 40-UMF UV 7993

LOCTITE ECCOBOND LOCTITE ECCOBOND

r Heat Cure EO 1072 EN 3838T
Encapsulants
LOCTITE ECCOBOND
UV + Moisture Cure UV 9052

Protective, BONDERITE BONDERITE

Functional Coatings L-GP EB 012EU S-FN 15000
Conductive Coatings

High-Temperature TECHNOMELT TECHNOMELT

Resistant PA 673 PA 678

PROTECTING Low Pressure TECHNOMELT TECHNOMELT

Increased Hardness
MATERIALS Molding PA 641 PA 646

TECHNOMELT
Thermally Conductive TC 50

LOCTITE STYCAST LOCTITE STYCAST LOCTITE STYCAST

2651-40 W1 CAT9 2850FT CAT9 A 316-48

LOCTITE STYCAST LOCTITE STYCAST LOCTITE STYCAST

Potting Epoxy E 2534 FR CAT9 EO 1058 EO 7038

LOCTITE ECCOBOND
ES 70205

BERGQUIST
LOCTITE
Sealants Silicone SI 5970
LIQUI BOND
TLB 400 SLT

Protecting Materials | 15
CONFORMAL COATINGS
UV + Moisture Cure

Operating
Volume
Viscosity at 25°C Temperature Recommended
Product Name Description Key Attributes Color Resistivity
(cP) Range Cure
(Ω∙cm)
(°C)

• One component
• Exhibits positive fluorescence under
UV light 20 – 40 sec.
Silicone Transparent
• Repairable per side at
LOCTITE SI 5293 conformal 400 – 800 -40 – 200 amber to 1×1014
• Solvent-free 70 mW/cm² +
coating yellow
• Designed for severe temperature 72 hr. at 50% RH
environments and high-reliability
automotive applications

• One component 10 sec. at

Urethane
LOCTITE STYCAST • Solvent-free 200 W/in + Translucent
conformal 120 - 40 – 130 2.2×1016
UV 7993 • Good moisture resistance 100 hr. at yellow
coating
• Excellent chemical resistance 50% RH

Urethane
• Single component 10 sec.
LOCTITE STYCAST Acrylate
• VOC free 250 - 40 – 135 at 300 – Clear 3.5×1016
PC 40-UMF conformal
• Conforms to IPC-CC-830 requirements 600 mW/cm²
coating

ENCAPSULANTS
Glob Top – Dam and Fill
Coefficient of
Glass Thermal Expansion
Viscosity Modulus at
Transition (CTE) Recommended
Product Name Description Key Attributes at 25°C 25°C
Temperature, Cure
(cP) (MPa)
Tg (°C) Below Tg Above Tg

Heat Cure
• High Tg
• Low extractable ionics
Epoxy
LOCTITE ECCOBOND • High performance 5 min. at
encapsulant- 80,000 135 43 123 6,700
E0 1072 • Good shelf life 140 – 150°C
dam and fill
• Fast curing
• One component
• One component
• Fast cure at moderate temperatures
LOCTITE ECCOBOND Epoxy • Low Tg
6,700 2 57 217 466 8 min. at 130°C
EN 3838T encapsulant • Low modulus
• Reworkable
• Pb-free applications
UV + Moisture Cure
UV cure
• One component 0.5 – 1 J for
LOCTITE ECCOBOND Acrylate • Withstands exposure to ink 5 – 10 sec. +
6,400 2 49 248 1,987
UV 9052 adhesive • Cures in shadowed areas moisture cure
• No stringing at ambient
humidity

16 | Protecting Materials
FUNCTIONAL COATINGS
Protective Conductive Coatings
Viscosity at 25°C Recommended Sheet resistance
Product Name Description Key Attributes Color
(cP) Cure (Ohm/sq/25µm)
• Protective coating onto battery electrodes
Water based 24 hr. at room
• One component
conductive temperature or
BONDERITE L-GP EB 012EU • Water based 50 – 200 Black < 30
carbon 3 – 10 min.
• Excellent adhesion to aluminum and copper
coating at 70 – 90°C
• Good chemical resistant
• Protective coating for aluminum electrodes
Water based
• One component
conductive 1 min. at
BONDERITE S-FN 15000 • Water based 600 Black 25
carbon 110 – 130°C
• thermosetting resin system
coating
• Superior electrolyte and solvent resistance

LOW PRESSURE MOLDING

Operating Shore Softening Point

Product Name Description Key Attributes Color
Temperature (°C) Hardness (°C)
Increased Hardness

TECHNMELT PA 641 • Ideal for applications where strength and Amber

Moldable hardness are needed
-40°C – 125°C 92A 175 +/- 5
polyamide • Good adhesion for high-temperature
TECHNOMELT PA 646 applications Black

High-Temperature Resistant
• Good adhesion to a variety of substrates
TECHNOMELT PA 673 • Excellent moisture resistance Amber
Moldable
• Excellent environmental resistance -40 °C – 140 °C Black 187 +/- 5
polyamide
TECHNOMELT PA 678 • Good adhesion for high-temperature Black
applications
Thermally conductive
• Thermally conductive – 0.7 W/mK
Moldable • Great adhesion to a variety of substrates
TECHNOMELT TC 50 Black -40 °C – 140 °C 60D 187 +/- 5
polyamide • Ideal for application where strength and
hardness are needed

Protecting Materials | 17
POTTING
Epoxy
Glass
Viscosity at 25°C Transition Shore Recommended
Product Name Description Key Attributes Color
(cP) - Part 1/Part 2 Temperature, Hardness Cure
Tg (°C)
One Component
• Excellent chemical resistance
• High temperature stability
LOCTITE STYCAST EO 1058 Epoxy Black 50,000 140 90 2 hr. at 140°C
• Good adhesion to variety of substrate
• Low CTE

• Good chemical resistance

LOCTITE STYCAST EO 7038 Epoxy Black 40,000 140 92 2 hr. at 140°C
• Good thermal shock resistance

• Fast heat cure

• Heat resistant 30 min. at
LOCTITE STYCAST A 316-48 Epoxy Black 50,000 145 86
• Exceptional thermal stability 100°C
• Excellent chemical resistance
• Low CTE
• Good chemical resistance
LOCTITE ECCOBOND ES 70205 Epoxy Black 17000 97 90 1 hr. at 120°C
• Good thermal shock resistance
• Good adhesion ot variety of substrates
Two Component
• Low viscosity
• Ease of use
LOCTITE STYCAST 2651-40 W1 CAT9 Epoxy Black 33000 / 95 110 88 24 hr. at RT
• Good adhesion to variety of substrate
• Room Temperature (RT) or heat cure
• Thermally conductive (1W/m.K)
• Low CTE
LOCTITE STYCAST 2850FT CAT9 Epoxy Black 250000 / 95 86 96 24 hr. at RT
• Excellent chemical resistance
• Electrically insulating
• Thermally conductive
• Flame retardant (UL 94V-0 rating in 6mm
LOCTITE STYCAST E 2534 FR CAT9 Epoxy thickness) Blue 350000 / 95 76 90 24 hr. at RT
• Excellent chemical resistance
• Halogen Free

SEALANTS
Silicone
Shore A Tensile Strength Self-fixture Recommended
Product Name Description Key Attributes
Hardness (MPa) time Cure
1K, moisture cure • 1K, Ideal for use where high vibration or
silicone sealant to flexing occurs Tack-free
LOCTITE SI 5970 44 ≥ 1.5 21 days at 23°C
form a tough rubber • Can be used with plastic and painted parts after 25 min.
gasket • Excellent resistance to automotive engine oils
• 2K - 1:1 mixing ratio
• Fast and adaptable cure (RT or elevated
temperature)
High performance, • Strong and elastic bond
two-part, silicone • Thixotropic
BERGQUIST LIQUI BOND
adhesive sealant • Designed for automated dispensing as FIPG 40 2.1 12 hr. at 25°C 7 days at 25°C
TLB 400 SLT
with an adaptable (Form-In-Place Gasket)
cure profile • Full compatibility with Gap Filler
• Chemical resistance
• High adhesion and elongation
• Room temperature storage

18 | Protecting Materials
Running Cool
New Li-Ion batteries now have power and energy densities that are unprecedented, making thorough
thermal management of these high-voltage systems non-negotiable for proper operation. If any of the
parts overheat – especially those that are flammable – battery work life and, more critically, safety are at
risk. As the world’s top thermal management materials innovator, Henkel is partnering with today’s leading
automotive companies to deliver flexible and effective heat management solutions for dependable Li-Ion
battery function. Thermal management systems are required throughout the entire Li-Ion battery structure –
in between the cells, from the battery to module housing and the module to battery pack housing. Henkel’s
thermal interface materials – in liquid and pad format – permeate the Li-Ion battery system, providing
insulation for safe in-use functionality, and contributing to the reliability of road-ready electric and plug-in
hybrid electric vehicles.

BERGQUIST
Coatings ISOEDGE PR4305
Thermal Clad
Insulated Metal
Substrates (IMS)
Insulated Metal IMS Circuits
BERGQUIST
BERGQUIST
TCLAD
Substrate GAP
HT DIELECTRIC
PAD EMI 1.0

BERGQUIST BERGQUIST
GAP FILLER 1000SF GAP FILLER 1500LV
Gap Filler
BERGQUIST
BERGQUIST
GAP FILLER
GAP FILLER 3500LV
TGF 1450

BERGQUIST BERGQUIST BERGQUIST

THERMAL GAP PAD HC 3.0 GAP PAD HC 5.0 GAP PAD 1000HD
GAP PAD
MATERIALS BERGQUIST BERGQUIST
GAP PAD 1450 GAP PAD 2200SF
Thermal Interface
Materials
Phase Change BERGQUIST BERGQUIST BERGQUIST
Materials HI-FLOW 300P HI-FLOW 565UT HI-FLOW 650P

BERGQUIST BERGQUIST BERGQUIST

SIL PAD SIL-PAD 900S SIL-PAD A2000 SIL-PAD K-10

BERGQUIST BERGQUIST
BOND-PLY 800 BOND-PLY LMS-HD
Thermal Adhesives
BERGQUIST BERGQUIST
LIQUI BOND LIQUI BOND
SA 1800 TLB SA2005RT

Thermal Materials | 19
THERMAL CLAD INSULATED METAL SUBSTRATES (IMS)

Thermal Dielectric
Thickness Flammability Dielectric
Product Name Description Key Attributes Conductivity Strength
(µm) Rating Constant
(W/m∙K) (VAC/mil)
Coatings

Thermally • Low thermal impedance

conductive, • Good thermal conductivity
BERGQUIST ISOEDGE PR4305 electrically • Good dielectric strength 0.6 100 – 250 650 UL 94V-0 6
isolating • UL certified
powder coat • Eliminates need for thick gap fillers

IMS Circuits

Thermally • Very low thermal impedance

conductive, • High thermal conductivity
BERGQUIST TCLAD
electrically • Great dielectric strength 2.2 76 2,000 UL 94V-0 7
HT DIELECTRIC
isolating • UL certified
dielectric • Eutectic AuSn compatible

THERMAL INTERFACE MATERIALS

Gap Filler
Thermal Viscosity Dielectric
Flammability Recommended
Product Name Description Key Attributes Conductivity at 25°C Strength
Rating Cure
(W/m∙K) (cP) (V/25 µm)
• Excellent slump resistance (stays in
Two-part,
place)
thermally
• Ultra-conforming, with excellent wet- 20 Pa-S
conductive, and
BERGQUIST GAP FILLER 1000SR out for low stress interface applications 1 (ASTM 500 UL 94V-0 20 min. at 25°C
slump resistant
• 100% Solids – no cure by-products D5099)
liquid gap filling
• Excellent low and high temperature
material
mechanical and chemical stability
• Ultra-conforming with excellent wet-
out for near zero interface stress
Part A: 30
Two-part, • No cure by-products
Pa-S (ASTM
thermally • Low density for weight sensitive
D5099)
BERGQUIST GAP FILLER 1450 conductive, application 1.5 275 UL 94V-0 5 hr. at 25°C
Part B: 200
liquid gap filling • Excellent low and high temperature
Pa-S (ASTM
material mechanical and chemical stability
D2196)
• Shear thinning viscosity for ease of
dispensing
• Low volatility for silicone sensitive
applications
Thermally • Ultra-conforming, with excellent
conductive wet-out
BERGQUIST GAP FILLER 1500 LV 1.8 20,000 400 UL 94V-0 8 hr. at 25°C
liquid gap filling • 100% solids — no cure by-products
material • Excellent low and high temperature,
chemical and mechanical stability
• Ambient or accelerated cure schedules
• Low volatility for outgassing
Thermally • sensitive applications
conductive, low • Ultra-conforming with excellent
BERGQUIST GAP FILLER 3500LV outgassing, wet-out for low stress interfaces on 3.5 45,000 275 UL 94V-0 24 hr. at 25°C
liquid gap filling applications
material • 100% solids - no cure by-products
• Ambient or accelerated cure schedules

20 | Thermal Materials
GAP PAD
Thermal Dielectric
Modulus at Thickness Flammability
Product Name Description Key Attributes Conductivity Breakdown
25°C (KPa) (mm) Rating
(W/m∙K) Voltage

High-compliance,
• High-compliance, low compression
thermally
stress 5,000 V
BERGQUIST GAP PAD HC3.0 conductive, low 3 110 • 0.508 – 3.175 UL 94V-0
• Fiberglass reinforced for shear and (at 500 µm)
modulus, gap
tear resistance
filling material

• 0.508
High-compliance, • Exceptional thermal performance
• 1.016
thermally • High-compliance, low compression
5,000 V • 1.524
BERGQUIST GAP PAD HC5.0 conductive, low stress 5 121 UL 94V-0
(at 500 µm) • 2.032
modulus, gap • Fiberglass reinforced for shear and
• 2.540
filling materiall tear resistance
• 3.175

• Permanent liner reinforcement

allows easy rework and resistance to
Highly compliant puncture and tear resistance 6,000 V
BERGQUIST GAP PAD 1450 1.3 110 • 0.508 – 3.175 UL 94V-0
gap pad material • Highly conformable/low hardness (at 500 µm)
• Designed for and low-stress
applications
• Robust Polymide carrier provides
excellent voltage breakdown,
High durability puncture and tear resistance 10,000 V
BERGQUIST GAP PAD 1000HD 1 414 • 0.508 – 3.175 UL 94V-0
gap pad • Highly conformable (at 500 µm)
• Ease of handling and rework in
applications

Thermally
• Medium compliance with easy
conductive, 5,000 V
BERGQUIST GAP PAD 2200SF handling 2 228 • 0.254 – 3.175 UL 94V-0
silicone-free gap (at 250 µm)
• Electrically isolating
filling material

Thermal Materials | 21
Phase Change Materials
Thermal Phase Change Dielectric Dielectric
Flammability
Product Name Description Key Attributes Conductivity Temperature Breakdown Breakdown
Rating
(W/m∙K) (°C) Voltage Voltage
Polymide Carrier
Electrically
• Field-proven polyimide film
insulating,
• Excellent dielectric performance
thermally
BERGQUIST HI-FLOW 300P • Excellent cut-through resistance 1.6 55 5000 V 0.025 – 0.050 94V-0
conductive
• Outstanding thermal performance in
phase change
an insulated pad
material
• Thermal impedance: 0.20°C-in2/W
Electrically
(at 25 psi)
insulating,
• 150°C high temperature reliability
thermally
BERGQUIST HI-FLOW 650P • Natural tack one side for ease of 1.5 52 5000 V 0.025 – 0.050 UL 94V-0
conductive
assembly
phase change
• Exceptional thermal performance in an
material
insulated pad
No Carrier
• Very low thermal impedance
Tacky, high
• High thermal conductivity
performance,
• Natually tacky
BERGQUIST HI-FLOW 565UT un-reinforced 3 52 N/A 0.127 - 0.254 UL 94V-0
• Used for applications that do not
phase change
require electrical insulation
material
• Tabulated for ease of assembly

SIL PAD
Thermal Dielectric
Thickness Flammability
Product Name Description Key Attributes Conductivity Hardness Breakdown
(mm) Rating
(W/m∙K) Voltage
Polymide Carrier

A conformable
• Thermal impedance: 0.32°C-in2 /W
thermally
BERGQUIST SIL-PAD A2000 (at 50 psi) 3 90 (Shore A) 4000 V 0.381 to 0.508 UL 94 V-0
conductive
• Optimal heat transfer
elastomer

• Thermal impedance: 0.61°C-in2 /W

Thermally (at 50 psi)
conductive • Electrically isolating
BERGQUIST SIL-PAD 900S and electrical • Low mounting pressures 1.6 92 (Shore 00) 5500 V 0.229 UL 94 VTM-0
insulation • Smooth and highly compliant surface
material • General-purpose thermal interface
material solution
No Carrier
A high
performance
• Thermal impedance: 0.41°C-in2 /W
insulator to
(at 50 psi)
replace ceramic
• Tough dielectric barrier against cut-
BERGQUIST SIL-PAD K-10 insulators such 1.3 90 (Shore 00) 6000 V 0.152 UL 94 VTM-O
through
as Beryllium
• High performance film
Oxide, Boron
• Designed to replace ceramic insulators
Nitride, and
Alumina

22 | Thermal Materials
Thermal Adhesives
Thermal
Dielectric Flammability
Product Name Description Key Attributes Conductivity Thickness Lap Shear at RT
Strength Rating
(W/m∙K)
Tapes
• Thermal impedance: 0.60°C-in2/W
(at 50 psi)
• High bond strength to most epoxies
Thermally
and metals
conductive,
• Double-sided, pressure sensitive
electrically • 0.127mm
BERGQUIST BOND-PLY 800 adhesive tape 0.8 4000 V UL 94 V-0 150 Psi
isolation • 0.203mm
• High performance, thermally
double-sided
conductive acrylic adhesive
tape
• More cost-effective than heat-cure
adhesive, screw mounting or clip
mounting
• TO-220 Thermal performances:
Thermally 2.3°C/W, initial pressure only
conductive lamination
• 0.254mm
BERGQUIST BOND-PLY LMS-HD heat curable • Exceptional dielectric strength 1.4 4000 V UL 94 V-0 200 Psi
• 0.457mm
laminate • Very low interfacial resistance
material • Continuous use of -60 to 180°C
• Eliminates mechanical fasteners

Thermal Adhesives – Continued

Thermal
Dielectric Flammability Recommended
Product Name Description Key Attributes Conductivity Viscosity
Strength Rating Cure
(W/m∙K)
Liquids
• Eliminates need for mechanical
fasteners
High
• Low viscosity for ease of screening or 20 min. at
BERGQUIST performance,
stenciling 1.8 125,000 cps 250 V/mil UL 94 V-0 125°C or
LIQUI BOND TLB SA 1800 liquid silicone
• Maintains structural bond in severe- 10 min. at 150°C
adhesive
environment applications
• Heat cure
• Adaptive thermal cure
Two-part, high
• No cure by-products Part A:
performance
BERGQUIST • Cures and bonds at room temperature 70 Pa-S 7 days at 25°C
silicone 2 275 V/mil UL 94 V-0
LIQUI BOND TLB SA2005RT • Cure rate is greatly accelerated at Part B or 1 hr. at 85°C
thermal
elevated temperatures 70 Pa-S
adhesive
• Room temperature storage

Thermal Materials | 23
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