Professional Documents
Culture Documents
NVBG070N120M3S D-3235500 2
NVBG070N120M3S D-3235500 2
www.onsemi.com
NVBG070N120M3S
Features
• Typ. RDS(on) = 65 mW @ VGS = 18 V Gate (Pin 1)
Maximum Temperature for Soldering (10 s) TL 270 °C †For information on tape and reel specifications,
including part orientation and tape sizes, please
Stresses exceeding those listed in the Maximum Ratings table may damage the refer to our Tape and Reel Packaging Specification
device. If any of these limits are exceeded, device functionality should not be Brochure, BRD8011/D.
assumed, damage may occur and reliability may be affected.
1. Surface mounted on a FR−4 board using1 in2 pad of 2 oz copper.
2. The entire application environment impacts the thermal resistance values shown,
they are not constants and are only valid for the particular conditions noted.
3. The maximum current rating is based on typical RDS(on) performance.
4. Repetitive rating, limited by max junction temperature.
5. EAS of 91 mJ is based on starting TJ = 25°C; L = 1 mH, IAS = 13.5 A,
VDD = 100 V, VGS = 18 V.
THERMAL CHARACTERISTICS
Parameter Symbol Max Unit
Junction−to−Case − Steady State (Note 2) RqJC 0.87 °C/W
Junction−to−Ambient − Steady State (Notes 1, 2) RqJA 40
Zero Gate Voltage Drain Current IDSS VGS = 0 V, VDS = 1200 V − − 100 mA
Gate−to−Source Leakage Current IGSS VGS = +22/−10 V, VDS = 0 V − − ±1 mA
ON−STATE CHARACTERISTICS
Gate Threshold Voltage VGS(TH) VGS = VDS, ID = 7 mA 2.04 2.9 4.4 V
Recommended Gate Voltage VGOP −3 − +18 V
Drain−to−Source On Resistance RDS(on) VGS = 18 V, ID = 15 A, TJ = 25°C − 65 87 mW
VGS = 18 V, ID = 15 A, TJ = 175°C − 136 −
(Note 7)
www.onsemi.com
2
NVBG070N120M3S
www.onsemi.com
3
NVBG070N120M3S
TYPICAL CHARACTERISTICS
80 2.0
VGS = 20 V to 15 V 12 V
60
1.5
12 V
40
VGS = 15 V to 20 V
1.0
20
0 0.5
0 2 4 6 8 10 0 20 40 60 80
VDS, DRAIN−TO−SOURCE VOLTAGE (V) ID, DRAIN CURRENT (A)
Figure 1. On−Region Characteristics Figure 2. Normalized On−Resistance vs. Drain
Current and Gate Voltage
2.5 500
ID = 15 A ID = 15 A
RDS(ON), NORMALIZED DRAIN−TO−
2.0 400
1.5 300
1.0 200
TJ = 150°C
0.5 100
TJ = 25°C
0 0
−75 −50 −25 0 25 50 75 100 125 150 175 200 4 8 12 16 20
TJ, JUNCTION TEMPERATURE (°C) VGS, GATE−TO−SOURCE VOLTAGE (V)
Figure 3. On−Resistance Variation with Figure 4. On−Resistance vs. Gate−to−Source
Temperature Voltage
50 160
VDS = 10 V RG = 4.7 W Etot
140 VDD = 800 V
40 VGS = 18/−3 V Eon
ID, DRAIN CURRENT (A)
120 TC = 25°C
30 100
80
20 60
TJ = 175°C TJ = 25°C
40 Eoff
10
20
TJ = −55°C
0 0
0 5 10 15 20 5 7 9 11 13 15
VGS, GATE−TO−SOURCE VOLTAGE (V) ID, COLLECTOR CURRENT (A)
Figure 5. Transfer Characteristics Figure 6. Switching Loss vs. Collector Current
www.onsemi.com
4
NVBG070N120M3S
TYPICAL CHARACTERISTICS
160 150
RG = 4.7 W Etot VDD = 800 V
140 ID = 15 A ID = 7.5 A Etot
VGS = 18/−3 V VGS = 18/−3 V
Eon
SWITCHING LOSS (mJ)
80
60
50
Eoff
40 Eoff
20
0 0
600 650 700 750 800 0 2 4 6 8 10
VDD, DRAIN−TO−SOURCE VOLTAGE (V) RG, GATE RESISTANCE (W)
Figure 7. Switching Loss vs. Drain−to−Source Figure 8. Switching Loss vs. Gate Resistance
Voltage
200 18
VGS = −3 V ID = 15 A VDD = 400 V
IS, REVERSE DRAIN CURRENT (A)
100 15
VDD = 800 V
12
9
VGS (V)
VDD = 600 V
10 TJ = 175°C 6
TJ = 25°C 3
0
TJ = −55°C
1 −3
0 2 4 6 8 10 0 10 20 30 40 50 60
VSD, BODY DIODE FORWARD VOLTAGE (V) QG, GATE CHARGE (nC)
Figure 9. Reverse Drain Current vs. Body Figure 10. Gate−to−Source Voltage vs. Total
Diode Forward Voltage Charge
10K 100
IAV, AVALANCHE CURRENT (A)
CISS
1K 25°C
CAPACITANCE (pF)
150°C
COSS
100 10
10 CRSS
f = 1 MHz
VGS = 0 V
1 1
0.1 1 10 100 800 0.0001 0.001 0.01 0.1 1 10
VDS, DRAIN−TO−SOURCE VOLTAGE (V) TAV, AVALANCHE TIME (ms)
Figure 11. Capacitance vs. Drain−to−Source Figure 12. Unclamped Inductive Switching
Voltage Capability
www.onsemi.com
5
NVBG070N120M3S
TYPICAL CHARACTERISTICS
40 1000
RqJC = 0.87°C/W
TJ = Max Rated
100 Single Pulse
30 VGS = 18 V
TC = 25°C
10 ms
10
20 100 ms
10 ms
1
1 ms
10 RqJC = 0.87°C/W
0.1 RDS(on) Limit
Thermal Limit 100 ms/DC
Package Limit
0 0.01
25 50 75 100 125 150 175 0.1 1 10 100 1000
TC, CASE TEMPERATURE (°C) VDS, DRAIN−TO−SOURCE VOLTAGE (V)
Figure 13. Maximum Continuous Drain Figure 14. Safe Operating Area
Current vs. Case Temperature
20K
P(PK), PEAK TRANSIENT POWER (w)
1K
100
10
0.00001 0.0001 0.001 0.01 0.1 1
t, PULSE WIDTH (sec)
Figure 15. Single Pulse Maximum Power
Dissipation
2
1
THERMAL RESISTANCE (°C/W)
ZqJC, EFFECTIVE TRANSIENT
20%
10%
0.1 5%
2%
1%
www.onsemi.com
6
NVBG070N120M3S
PACKAGE DIMENSIONS
www.onsemi.com
7
NVBG070N120M3S
onsemi, , and other names, marks, and brands are registered and/or common law trademarks of Semiconductor Components Industries, LLC dba “onsemi” or its affiliates
and/or subsidiaries in the United States and/or other countries. onsemi owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property.
A listing of onsemi’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent−Marking.pdf. onsemi reserves the right to make changes at any time to any
products or information herein, without notice. The information herein is provided “as−is” and onsemi makes no warranty, representation or guarantee regarding the accuracy of the
information, product features, availability, functionality, or suitability of its products for any particular purpose, nor does onsemi assume any liability arising out of the application or use
of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. Buyer is responsible for its products
and applications using onsemi products, including compliance with all laws, regulations and safety requirements or standards, regardless of any support or applications information
provided by onsemi. “Typical” parameters which may be provided in onsemi data sheets and/or specifications can and do vary in different applications and actual performance may
vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. onsemi does not convey any license
under any of its intellectual property rights nor the rights of others. onsemi products are not designed, intended, or authorized for use as a critical component in life support systems
or any FDA Class 3 medical devices or medical devices with a same or similar classification in a foreign jurisdiction or any devices intended for implantation in the human body. Should
Buyer purchase or use onsemi products for any such unintended or unauthorized application, Buyer shall indemnify and hold onsemi and its officers, employees, subsidiaries, affiliates,
and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death
associated with such unintended or unauthorized use, even if such claim alleges that onsemi was negligent regarding the design or manufacture of the part. onsemi is an Equal
Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.
◊ www.onsemi.com
8
Mouser Electronics
Authorized Distributor
onsemi:
NVBG070N120M3S