VISVESVARAYA TECHNOLOGICAL UNIVERSITY

“Jnana Sangama”, Belagavi-590018, Karnataka

An Internship Report
on
“Product and Process Quality Department”
Submitted in partial fulfillment of the requirements for the award of the degree of

Bachelor of Engineering
In
ELECTRONICS AND COMMUNICATION ENGINEERING
For the Academic Year 2021-22
Submitted By
Chandan Gowda K S: 4AD20EC011

Under the Guidance of

Mrs. Juslin F

Asst. Professor
Department of ECE

13th Kilometer, Mysore – Kanakapura – Bangalore Road,

Mysore – 570 028, Karnataka
Phone: +91-821-25 93 335
 Product and Process Quality

ATME College of Engineering, Mysuru

13th Kilometer, Mysuru – Kanakapura – Bangalore Road, Mysuru – 570 028

DEPARTMENT OF ELECTRONICS AND

COMMUNICATION ENGINEERING
CERTIFICATE
Certified that the Internship work entitled “Production and Process Quality” carried out by
C H A N D A N G O W D A K S [4AD20EC011] students of ATME College of Engineer-
ing, Mysuru in partial fulfillment for the award of Bachelor of Engineering in Electronics and
Communication Engineering, of the Visvesvaraya Technological University, Belagavi during
the year 2021-22. It is certified that all corrections/suggestions indicated for Internal Assess-
ment have been incorporated in the Report deposited in the departmental library.
The Internship report has been approved as it satisfies the academic requirements in respect
of Internship work prescribed for the said Degree.

Name & Signature Name & Signature

Guide HOD

Internship Viva-Voce

Name of the Examiners Signature with date

1.
2.

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 Product and Process Quality

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 DEPARTMENT VISION AND MISSION
· To develop highly skilled and globally competent professionals in the field of Elec-
tronics and Communication Engineering to meet industrial and social requirements
with ethical responsibility.

MISSION
· To provide State-of-art technical education in Electronics and Communication at un-
dergraduate and post-graduate levels, to meet the needs of the profession and society
and achieve excellence in teaching- learning and research.
· To develop talented and committed human resource, by providing an opportunity for
innovation, creativity and entrepreneurial leadership with high standards of profes-
sional ethics, transparency and accountability.
· To function collaboratively with technical Institutes/Universities/Industries, offer
opportunities for interaction among faculty-students and promote networking with
alumni, industries and other stake-holders.

Program Specific Outcomes (PSOs)

At the end of Graduation the student will be able,

· To have the capability to understand and adopt the technological advancements with
the usage of modern tool to analyze and design embedded system or processes for va-
riety of applications.
· To work effectively in a group as an independent visionary, team member and leader
having the ability to understand the requirement and develop feasible solutions to
emerge as potential core or electronic engineer.
 ACKNOWLEDGEMENT
We would like to express our immense gratitude to Dr. A K Murthy, Principal, AT-
MECE, Mysuru for his timely help and inspiration during the tenure of the course.

We would like to express our deep gratitude to Dr. L Basavaraj, Professor and Head,
Department of Electronics and Communication Engineering, ATMECE, Mysuru for his
timely co-operation while carrying the Internship work. His friendliness made us learn more.

We would like to express our sincere thanks to the Internship guides Mrs. Juslin F,
Assistant Professor, Department of Electronics and Communication Engineering, ATMECE,
Mysuru for their guidance, encouragement and suggestions that helped us a lot in completion
of the internship.

We also extend our sincere thanks to the Internship coordinator Mrs. Chethana K S
and Dr. Shalini Hanok, and all the faculty members, Department of Electronics and Com-
munication Engineering, ATMECE, Mysuru who have encouraged us throughout the course.

Last but not the least, we express our heartfelt gratitude to Almighty, our parents for
their love and blessings that helped us complete the Internship work successfully

TABLE OF CONTENTS
Chapter No. Title Page

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 No.
Chapter 1 INTRODUCTION
1.1 About the Company 02

1.2 About the EMS 03

1.3 Objectives of the Internship 04

Chapter 2 PRODUCTION DEPARTMENT
2.1 Pcb assembly 05

2.2 Pcb assembly process

Chapter 3 PROCESS OF PCB ASSEMBLY
3.1 Bill of Materials (BoM)

3.2 Designing

3.3 Testing

3.4 Distribution

3.5 PCB Assembly

3.6 Testing

3.7 Packing and Shipping

CONCLU-
SION
REFER-
ENCES

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Chapter 1

INTRODUCTION
In this chapter introduce about the company which has collaboration with Department of
Electronics and Communication Engineering, ATME College of Engineering, Mysuru and
provided the training.

1.1 About the Company

Marconics Technologies is is a budding EMS Company founded on December 12,

2022, with two employees.
The idea of Marconics Technologies comes from the fact that the worldwide market is a de-
termining force in digitalization through the production of electronic products and now ac-
counts for almost 30-40 percent of all assemblies; wherein the real benefits to society comes
through continuous technology development in various infrastructure and demand for newer /
smarter products and services.
Marconics Technologies was started with the aim of always staying at the cutting-edge
of automation technology and thereby providing the most appropriate technology for every
automation application. Marconics Technologies is focused on becoming a leader in the de-
velopment of test and measurement and industrial automation software and systems. We are
proud of the current products and services we offer and we look forward to contribute to fu-
ture innovations in virtual instrumentation and automation technology.

Vision of the Company

"To become the best Electronics Manufacturing Services company providing Embedded
design, automation, and PCB assembly services.”

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Product & Services
At Marconics Technologies, our resources are focused on innovation, quality, and supe-
rior value for our customers. We work closely with our customers to understand their re-
quirements, which enable us to provide innovative solutions to meet their specific needs.
Marconics Technologies significant growth is an indication of our track record of success
upon this commitment. We have separate business divisions with dedicated focus to offer the
best possible solutions.

These are:
· Embedded Systems Division.
· Automated Test Equipment (ATE) and Data Acquisition Division.
· Electronic Manufacturing services.
· Product design
· Iot sollution
Objective of Company
· One -stop shop for electronic manufacturing solutions
· Competent services at competitive prices
· Custom-made solutions and products tailor made to customer requirement
· State-of-the-art infrastructure
· Strong commitment to quality
· A dedicated R&D team to support customer
· Cost-effective global sourcing
· Short lead time and adherence to delivery datesAbout the EMS
1.2 About the EMS
Electronics manufacturing services (EMS) is a term used for companies that design, manu-
facture, test, distribute, and provide return/repair services for electronic components and as-
semblies for original equipment manufacturers (OEMs). The concept is also referred to as
electronics contract manufacturing (ECM). . Manufacturers can benefit from having their

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electronics designed and manufactured at an established, qualified facility that utilizes global
resources available from a facility in India rather than relying solely on in-house capabilities.
Electronic Manufacturing Services are useful in any situation involving the manufacture of
technology where either time, quality or both are essential. Providers of Electronic Manufac-
turing Services in India have facilities that are entirely dedicated to product development
from the ground up. However, they can also be used to supplement existing production runs
as internal manufacturing capacities are stretched.
For instance, when a product is already designed but a large order is needed, it would be
helpful to enlist Electronic Manufacturing Services from India.
A variety of industries such as aerospace, medical, automotive, instrumentation, emergency
response, commercial and consumer products can benefit from the incorporation of Elec-
tronic Manufacturing Services in India into their business plan.
Many consumer electronics are built in China, due to maintenance cost, availability of mate-
rials, quality, and speed as opposed to other countries such as the United States. Cities such
as Shenzhen have become important production centres for the Industry, attracting many
consumer and electronics companies.

Benefits of EMS
· Cost Efficiency
· Flexibility and Scalability
· Focus on Core Competencies
· Quality Assurance
1.3 Objectives of the Internship
· To provide experiential education to students
· To rapidly develop prototypes using Test, Measurement, and Control
· To generate internship and recruitment opportunities based on LabVIEW
· To hands-on with live Industrial problems
· To Train with Professional Educators
· To Train the students to carry out projects and carryout the real-time projects

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Chapter 2

PRODUCTION
The main objective of production management is to produce goods and services of the right
quality, right quantity, at the right time and at minimum cost. It also tries to improve the effi-
ciency.
The production department activities has been conducted under the following process,
PCBPrinted circuit board) assembly, Coil winding and Wiring harness.

2.1 PCB assembly:

Marconics is equipped with latest equipments and competent people who can make things
happen Vasantha advanced systems provides PCB Assembly to a wide range of customers
within a variety of industries, whether customer require full turn key solution from design to
despatch as a finished product or simply to supplement their manufacturing capability. The
facilities as automated assembly systems will fulfill customer requirements. They understand
the pressures and demands on companies to respond speedily to the ever changing need of
production schedules and deadlines. This is why we give you quality products through our
precision manufacturing and assembly when promised.
2.2 PCB assembly process:
The various stages in the PCB assembly process including adding solder paste to the board,
pick and place of the components, soldering, inspection and test. All these processes are re-
quired, and need to be monitored to ensure that product of the highest quality is produced.
The PCB assembly process described below assumes that surface mount components are be-
ing used as virtually all PCB assembly these days uses surface mount technology.2.1

Solder paste:
Prior to the addition of the components to a board, solder paste needs to be added to those ar -
eas of the board where solder is required. Typically these areas are the component pads. This
is achieved using a solder screen.

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The solder paste is a paste of small grains of solder mixed with flux. This can be deposited
into place in a process that is very similar to some printing processes.
Using the solder screen, placed directly onto the board and registered in the correct position,
a runner is moved across the screen squeezing a small mount of solder paste through the
holes in the screen and onto the board. As the solder screen has been generated from the
printed circuit board files, it has holes on the positions of the solder pads, and in this way sol-
der is deposited only on the solder pads.
The amount of solder that is deposited must be controlled to ensure the resulting joints have
the right amount of solder.
Pick and place:
During this part of the assembly process, the board with the added solder paste is then passed
into the pick and place process. Here a machine loaded with reels of components picks the
components from the reels or other dispensers and places them onto the correct position on
the board.
The components placed onto the board are held in place by the tension of the solder paste.
This is sufficient to keep them in place provided that the board is not jolted.
In some assembly processes, the pick and place machines add small dots of glue to secure the
components to the board. However this is normally done only if the board is to be wave sol-
dered. The disadvantage of the process is that any repair is made far more difficult by the
presence of the glue, although some glues are designed to degrade during the soldering
process.
The position and component information required to programme the pick and place machine
is derived from the printed circuit board design information. This enables the pick and place
programming to be considerably simplified.
Soldering:
Once the components have been added to the board, the next stage of the assembly, produc-
tion process is to pass it through the soldering machine.
Although some boards may be passed through a wave soldering machine, this process is not
widely used for surface mount components these days. If wave soldering is used, then solder
paste is not added to the board as the solder is provided by the wave soldering machine.
Rather than using wave soldering, reflow soldering techniques are used more widely.
Inspection:

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After the boards have been passed through the soldering process they are often inspected.
Manual inspection is not an option for surface mount boards employing a hundred or more
components. Instead automatic optical inspection is a far more viable solution. Machines are
available that are able to inspect boards and detect poor joints, misplaced components, and
under some instances the wrong component.
Test:
It is necessary to test electronic products before they leave the factory. There are several
ways in which they may be tested. Further views of test strategies and methods may be found
on the "Test and Measurement" section of this website.
Feedback:
To ensure that the manufacturing process is running satisfactorily, it is necessary to monitor
the outputs. This is achieved by investigating any failures that are detected. The ideal place is
at the optical inspection stage as this generally occurs immediately after the soldering stage.
This means that process defects can be detected quickly and rectified before too many boards
are built with the same problem
Coil Winding:
To explore the business potentials that exist for coils in the various applications like Automo-
tive, Pneumatics, Textiles, Telecommunication applications and variety of Industrials needs
Vasantha Advanced Systems has a wide focus over coil winding. They manufacture's variety
of high quality coils according to the customer needs and satisfaction. Automatic coil wind-
ing machines and latest test equipments are used for winding and testing of coils. They are
having enough experience in indigenization of coils.
· Adequate experience in indigenization of coils
· The latest testing equipments
· Capability to manufacture different types of coils like Solenoid coils,
Current transformers, Miniature coils, Ferrite transformer, Drum cores etc.

Wiring Harness:
Wiring harness has a well-established setup for manufacturing highly reliable wiring harness
based on customer requirements. Currently they manufacture wire harnesses for a variety of
industries including Automobiles, Compressors, Railways and Simulators. They are making

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different type of wiring harness / wiring kit as per the customer Requirements for Screw
Compressor, Car Driving Simulator, Gas Analyzer & Smoke Meters, Ground Power Supply
for aircraft, Fuel Dispensing and many more.
· In house capability for processing different types of wiring harness
· Supply to engineering industries with high reliability
· Designing of test jigs and fixtures to test wiring harness

Chapter 3
PROCESS OF EMS

3.1 Bill of Materials (BoM)

First, let’s understand about the bill of materials, or BOM. It is one section of the product's
technical documentation. It is a compiled information source with a list of every component
needed to create one unit of a finished product. Every manufacturing process's final result,
like the assembly of electronics, uses a certain combination of materials.

In the electronic manufacturing process — the first step includes the process of determining
an electronic bill of materials (BoM). It is settled upon long before an electronic design plan
is ever produced. During this process, manufacturers determine their overall costs and the
types of materials they need.

3.2 Designing

After the BOM is complete, the next step includes designing. Moreover, it is necessary to de -
velop a manufacturing and design blueprint. Note that it's also crucial to create multiple de -
signs in case something goes wrong.During the design phase, every part of the material the
manufacturer will employ to construct an electrical tool or device must be measured.

Product Requirements: The first step in the design phase is to determine the product re-
quirements. This includes defining the target market, the intended use of the product, and the
desired features and functions.The requirements are used to guide the design process and to
ensure that the final product meets the needs and expectations of the customer.

3.3 Testing

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A device is tested after it is produced. It helps to ensure that it performs well in a range of
circumstances before it is put into production.

Additionally, this is crucial because any design error, no matter how small, will render the
entire output useless.

Therefore, you should start by making one item, test it, and then move on to mass production.

3.4 Distribution

Once you've completed developing and testing it, then it's time to distribute it.

Moreover, before distributing your product, make a few last-minute tests to ensure that your
clients won't receive faulty things. You can be certain that your company's or product's repu-
tation won't suffer by doing this.

Repairs and returns of Printed Circuit Boards (PCBs) are also a component of the electronics
manufacturing process. It is because you have to deal with damaged electronics that you have
produced and distributed.

3.5 PCB Assembly

Assembling the Surface Mount Technology (SMT) board involves a number of different
techniques (pick and place).

Using a solder screen, the printed board is initially soldered to. The component pads often re-
ceive a coating of solder paste. The flux and small solder grains are the only ingredients in
the solder paste.

After the solder paste has been added, the board is then sent through a pick and place ma -
chine, which chooses the component from a dispenser and places it in the right place on the
board.

After that, a soldering machine is utilized to ensure that the components are attached per-
fectly. The assembled PCB, like the PCB that was made, is put through a number of tests and
inspections before being sold.

Electronic Packaging

Now, there’s the packaging for the item. The steps are straightforward:

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 • Select the material based on the environment and exposure to the elements,
• Construct the enclosure,
• Secure the PCB inside,
• Connect all cables to connectors on the enclosure's surface and seal the enclosure's in-
terior from the exterior (if necessary) with a protective film, coat, or foam.

It is important to ensure that the device container is up to code. Though, it may seem like a
minor step, but it is essential. It is because the finished device must be able to handle specific
strains and loads.

To name a few packaging options, it includes sealed metallic, ceramic, and glass enclosures,
sheet, cast, or machined metals or alloys, molded, extruded, or injected plastic, and plastic or
resin coating.

Enclosing a device requires testing for various requirements in order to ensure dependability
and warranty. It is commonly known that the IP certification offers a certain degree of resis-
tance against the intrusion of solid and liquid particles; the first digit denotes solid particle
protection and the second, liquid particle protection.

Additionally, there are optional supplementary and additional letters with very specific use-
cases.

3.6 Testing

Each assembled PCB must undergo visual examinations. Using X-ray machines, short cir-
cuits, discontinuities, and solder flaws are routinely found. After that, the PCBs must pass
functionality testing before being made ready for use.

Once mass-market manufacture of the electronic manufacturing equipment has begun, testing
also known as quality control in manufacturing or quality assurance is required to ensure the
items' quality. Any gadget will have a sticker that lists the testing requirements it met as
proof that it did so.

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Tests are typically divided into four categories: physical, electrical, analogue, and/or digital
tests. To determine if a board can resist a given quantity of heat, it is put through physical
testing (checking if the board works as intended, logic-wise).

The equipment being tested is known as the DUT (Device Under Test), EUT (Equipment
Under Test), or UUT in the industry.

If the board was a prototype, the manufacturer can only choose to send it to large-scale fabri-
cation or to the assembly line, where it is assembled with the required cables, connectors, and
case(s) and supplied to the customer after passing all testing.

3.7 Packing and Shipping

After testing, the products are submitted for packaging and shipment to retailers. These are
finally sold to customers.

Packaging Design and Selection: The first step in the packing and shipping workflow is the
design and selection of the packaging materials. The packaging design must protect the elec-

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tronic products from physical damage, moisture, and other environmental factors during
transportation.

The materials used for packaging should also meet industry standards for strength, durability,
and recyclability.

Packaging Preparation: Once the packaging materials are selected, the next step is to pre-
pare the products for shipment. The electronic products are carefully packed, ensuring that
there is enough cushioning and protection to prevent damage during transportation.

The packaging should also be labeled and marked with the necessary information, such as the
product name, weight, and destination.

Inspection and Testing: Before shipping, the packed electronic products undergo inspection
and testing to ensure they meet the necessary quality standards.

The inspection process checks for any physical damage, defects, or other issues that may af-
fect the performance of the product. If any issues are found, they are addressed and resolved
before shipping.

Shipping and Logistics: The final stage in the packing and shipping workflow is the ship-
ment of the electronic products. The products are carefully loaded onto trucks, trains, or
ships, and transported to the destination.

The logistics of the shipment are managed by logistics specialists, who coordinate the trans-
portation, customs clearance, and delivery of the products.

Delivery and Follow-Up: Once the products arrive at their destination, they are delivered to
the customer or warehouse. The delivery process includes unloading and unpacking the prod-
ucts, and checking them for any damage or issues.

The follow-up process involves tracking the delivery, resolving any issues that may arise,
and ensuring that the customer is satisfied with the delivery.

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 CONCLUSION

Industrial training is, makes to know about the various aspects of all the departments practi-
cally and to improve knowledge by means of comparison with the
theoretical aspects study. It is opportunity to learn.
On the concluding part of my study, I had learned many ideas and Techniques in this field.
The people in this firm had helped many more in every way to complete my training. In this
firm the relationship between the Management and labor is cordial. I learned a practical
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knowledge about the functions of the various departments of electronic manufacturing ser-
vices.
The whole training period was very interesting, instructive and challenging.
Through this training I can able to gain new insights and more comprehensive understanding
about the real industry

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 REFERENCES

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