An Internship Report

On
“Telecommunication Technology”
Submitted in partial fulfilment for the award of degree of

BACHELOR OF ENGINEERING
In
ELECTRONICS AND COMMUNICATION ENGINEERING

Submitted by
NAGASHREE
USN: 4KV19EC015

Internship Carried Out

At
ITI Limited

Internal Guide External Guide

Mrs .Aruna P G Ronny Estiberio
B.E M.Tech, HRED
Assistant Professor, Dept. of E&C ITI Limited, Dooravaninagar
KVGCE, Sullia Bangalore

DEPARTMENT OF ELECTRONICS & COMMUNICATION ENGINEERING

K.V.G. COLLEGE OF ENGINEERING
SULLIA, D.K. – 574 327, KARNATAKA
2022-2023
 K.V.G. COLLEGE OF ENGINEERING
SULLIA, D.K. - 574327, KARNATAKA
DEPARTMENT OF ELECTRONICS & COMMUNICATION ENGINEERING

CERTIFICATE
This is to certify that NAGASHREE, USN 4KV19EC015 has satisfactorily
completed Internship Program on “TELECOMMUNICATION
TECHNOLOGY” in partial fulfilment of the requirement as prescribed by
the VTU for 8th semester, BACHELOR OF ENGINEERING in
ELECTRONICS AND COMMUNICATION ENGINEERING and submitted
this during the academic year 2022-23

INTERNAL GUIDE INTERNSHIP CO-ORDINATOR

Mrs Aruna P G Mrs. Rekha M B
B.E M.Tech, BE, M. Tech
Assistant Professor Assistant Professor
Dept. of E&C Engg Dept. of E&C Engg

Dr. Kusumadhara S Dr. SURESHA V

BE, M. Tech, Ph.D., MISTE BE, M.Tech, Ph.D., MISTE
Professor & Head Principal
KVGCE, Sullia KVGCE, Sullia

Name of the Examiners Signature with date

1. ……………………………. …………………………….

2. ……………………………. …………………………….
 K.V.G. COLLEGE OF ENGINEERING
SULLIA, D.K. - 574327, KARNATAKA
DEPARTMENT OF ELECTRONICS & COMMUNICATION ENGINEERING

DECLARATION
I hereby declare that the entire work embodied in this BE, Internship program
titled, “TELECOMMUNICATION TECHNOLOGY” has been carried out
by me at ITI Limited, Dooravaninagar, Bangalore under the guidance of
RONNY ESTIBERIO, HRED, ITI Limited, Dooravaninagar, Bangalore and
Internal guide Mrs Aruna P G, Assistant Professor, Department of
Electronics & Communication Engineering, K.V.G. College of Engineering,
Sullia, D.K. This report has not been submitted in part of the award of any
degree of this or to any other university.

Date: NAGASHREE
Place: 4KV19EC015
INTERNSHIP CERTIFICATE
 ACKNOWLEDGEMENT
It is my pleasure to be indebted to various people, who directly or indirectly
contributed in the development of this work and who influenced my thinking,
behaviour, and acts during the course of internship.

I am thankful to RONNY ESTIBERIO, HRED, ITI Limited, Dooravaninagar,

Bangalore for his guidance, support, co-operation and motivation during the internship
program.
I am also thankful to my internal guide Mrs. Aruna P G, Professor, Department of
Electronics and Communication Engineering for her inspiration and guidance.
I am thankful to Internship Co-ordinator Mrs. REKHA M B Assistant
Professor, Department of Electronics and Communication Engineering for her support
and guidance.
I record my esteemed gratitude to Dr. KUSUMADHARA S., Professor and
Head, Department of Electronics and Communication Engineering, KVGCE, Sullia for
his guidance, support, co-operation and motivation during the internship program.

I gratefully acknowledge for the help rendered by our beloved Principal

Dr. SURESHA V., for providing constant encouragement and support throughout the
course of my study.

I am extremely grateful to Dr. RENUKA PRASAD K.V., General Secretary,

Academy of Liberal Education, Sullia, for his constant support throughout the course
of my study.

I am deeply indebted to the Architect of modern Sullia, Late Dr. KURUNJI

VENKATRAMANA GOWDA, Founder President, Academy of Liberal Education,
Sullia, for having provided an environment with all facilities that helped me in
completing my studies. He is the source of inspiration for all of us.

I express my sincere thanks to all teaching and non-teaching staff members of

our college for their valuable support and co-operation. Finally, I would like to thank
my parents for their encouragement with love and affection.

NAGASHREE
4KV19EC015
 EXECUTIVE SUMMARY
Through this internship we got exposure to various product manufacturing
departments. We got to know about the working of different machines which
are used in the manufacturing process.
We have visited various labs such as injection moulding and fabrication, 3D
printing, Surface mount technology, where we observed the working
operation of different machines.
We also visited the PCB design lab where we were taught about the different
steps involved in the circuit design and observed the circuit manufacturing
process using various machines.
Since the company mainly deals with the telecommunication technology and
it manufactures a diverse range of Information and Communication
Technology (ICT) products/solutions, we gathered more knowledge about the
designing and development of different products.

i
 CONTENTS
Chapter Title Page
No. No.
EXECUTIVE SUMMARY i
1 INTRODUCTION 1
1.1 COMPANY PROFILE 2
2 DIFFERENT DEPARTMENTS IN ITI
2.1 TELEPHONE DEFENCE
PRODUCTION 9
2.2 INJECTION MOULDING AND
FABRICATION 10
2.3 METALLURGICAL LAB AND
TESTING 14
2.4 R&D DEPARTMENT
2.4.1 PCB DEPARTMENT 16
2.4.2 POWER SUPPLY LAB 18
2.4.3 CAD LAB 20
2.4.4 RELIABILITY LAB 21
2.5 3D- PRINTING 22
2.6 SMT LAB 25
2.7 ENVIRONMENT PROTECTION
DEPARTMENT 27
2.8 INFORMATION TECHNOLOGY 29
3 CONCLUSION 31
4 REFERENCE 32
_________________________________________________________________________
 CHAPTER 1
INTRODUCTION
ITI earlier known as Indian Telephone Industries Limited is a government-owned
telecommunications equipment manufacturer in India. ITI Limited as available basic
Electronics manufacturing infrastructure which is up-gradation with the support of
Government of India. The company has manufacturing facilities in Bengaluru, Naini, Rae
Bareli, Mankapur and Palakkad. ITI has R&D, SMT setup at Bangalore unit. The focus
areas of R&D are Encryption, Wireless Products and Telephone Products. In this In-plant
Training I observed how the Electronics and Telephone products are manufactured. This
products are supplied to Indian Defense Sectors. ITI is focused on manufacturing of
diversified products in defense and Railway Sectors and the manufacturing of solar
equipment, LED Lighting Systems, Optical products, LI-ION batteries, Smart cards,
defense equipment. In this Training I have gained practical knowledge in Injection
molding and Fabrication of Telephone products, SMT(Surface Mounted Technology),
R&D(Research and Development), (TDP)Telephone Defense Production, Metal lab and
3D Printing. In R&D there are four labs which explains how the PCB(Printed Circuit
Board) are manufactured in a step by step process, CAD(Computer Aided Design) in this
CAD STAR is a window based Electronic Automation Design(EAD) software tool,
Power Supply which gives power to the PCB board by using electronics components and
Reliability lab which facilitates Environmental test. In 3D printing I learnt the
requirement of this objects in real world technology in the medical field. Using raw
materials the Telephones plastic materials are made using CNC machines in Injection
molding with the help of required shapes of modules. Then this under goes Fabrication
process where Telecom cards, Sub-racks, Electronics racks, Control panel etc. are
manufactured. SMT department deals with placing of components such as resistor, diode
etc. on the PCB board which are placed on the both the sides of the board. These
materials don’t have leads which are soldered on the surface of the PCB board.
Environment department deals with Hazardous waste produced in the industry such as
lead, acid, electronic and electrical waste etc.

1
1.2 COMPANY PROFILE

Background and Inception of Company

ITI Limited formerly Indian Telephone Industry is the public sector undertaking of the
country which was established in 1948. From a small beginning it has grown into a
Mammoth multi unit enterprise with manufacturing units at Dooravani Nagar and
Electronic City in Bangalore in Karnataka. In 1964, the companies started manufacturing
of crossbar automatic exchange and they started Naini and Srinagar in J&K in the year
1971. Later on the company started the plants in Rae Barley in UP, Palakkad in Kerala
and Mankapur.

The company has a network of sales and service officers located at Bangalore, Mumbai,
Kolkata, Delhi, Lucknow, Chennai and a number of sub officers under each region, to
represent the company in every significant town. In line with the business strategy the
entire activities of the company are now the organised as independent business group
with manufacturing facility at Bangalore, Mankapur and Palakkad, transmission business
group with manufacturing facility at Bangalore and Naini, terminal equipment business
group with manufacturing facility at Bangalore and Naini etc. Company has a house in
R&D infrastructure attached to the Independent business group. The main R&D division
is at Bangalore and Naini. Forward looking at the technology, the R&D is engaged in
continuous development and absorption of technology.

The company place a strong emphasis on quality, which taken as a corporate management
junction under and independent execution directors reporting to Chairman and managing
director. A large number of companies products are covered under the "Self Certification
Scheme" by the major customer i.e Department of Telecommunication, international
quality management system. Company has adopted ISO 9000, taking it as a " Tool for
organization change and Word Redesign".

Human resource development is another thrust in a company involving professional and

organization development activities. Company's product range involves all that is
required. ITI equip National and international telecommunication network, satellite with
simple telephone to state to the art digital switches satellite communication and optical
communication system. 95% of the company's product are supplied to department of

2
Telecommunication now known as BSNL. The Other significant customers of the
company are defence and Railways, who even special Turkey projects has also been
executed.

Nature of business carried out

 Manufacture of Telecom equipment

 Research and development
 Joint development of projects
 Marketing and customer service
 Value added service
 Turkey project
 Network management
 Software applications
 IT products and services
 Transfer of Technologies

Vision

Enhance shareholders value and will move up The value chain by expanding knowledge
based business why simultaneously leverage over manufacturing business.

Mission

To establish leadership in manufacturing and supply of new technology telecom products

and also to retain status of top ten key solution provider.

Quality policy

ITI company is committed to providing products and services of consistent quality that
will lead to customer delight and company will maintain the leadership in the market with
the competitive prices and professional excellent through:

 Continuous innovation
 Continuous improvement in every activity
 Implementation of sound quality management system

3
Products and service profile

Product division in ITI

 Telephone Division- main production division in ITI is telephone division. This

division manufactures around 5 lakhs telephone every year.
 Transmission division- another division where it under takes the manufacturing of
microwave equipment, satellite communication equipment, official fiber
equipment and defence products.
 Access product division- This division under takes manufacturing of rural
exchanges.
1. Switching- this is divided into three categories i.e
a) large switches
b) medium switches
c) short switches

2. Transmission- microwave and satellites

3. Defence- SCPC VSAT Military EPABX 128 ports

4. Access products- wireless local loop, digital loop career, pair gain.

 Terminal/ subscriber end products- telephones, ISON products, video

conferencing.
 Information technology- computer telephony integration (CTI)
 Other products- and mechanizing products, fire alarm.

Services offered in ITI

 Turkey Projects
 Customised software development
 Development of application specific integrated circuits Asics
 Multiple International ID cards, enterprise business like data centres etc.
 Pre warranty and post warranty maintenance service for all products/ projects

4
Areas of operation

ITI has exported products such as ADPCM,C-DOT MBM/SBM switches, SMPS power
plant, VRLA batteries, CDMA LULL equipments, FWT's, DG sets, shelters, towers, MW
radios, rural exchanges and telephones of different types, spare card for E-10B
exchanges. Single channels VHF radio, multi access rural radio (analog and digital and
ASIC's to countries in Afghanistan, Asia, Africa and Europe. Besides various projects in
India, ITI has successfully executed Turkey projects Overseas both)

Ownership pattern

It has a total share holding pattern of 90%(The government of India had 89.89% And
Government of Karnataka had 0.11%)

Competitor’s information

 Nokia
 Samsung
 LG
 Motorola
 Toshiba
 Ericson
 Siemens
 United Telecom
 HCL
 HFCL
 Bharati Telecom
 Reliance
 Tata
 BHEL

Infrastructural facility

 In house research and development

 Network system unit capable of understanding turn key jobs
 Self contained component evaluation centre
5
  Fully automatic component evaluating centre
 ICT (In Circuit Tester), environmental testing, card assembly
 Modern chemical, metallurgical lacs
 Moulding and diecasting, SMT
 Fully fledged state of the art tool rooms, fabrication of Towers and Shelters for
GSM
 Component approval Centre approved by BSNL
 Mechanical fabrication/ machines shop with modern CNC machines and finishing
shop
 Plastic injection Technology, through hole component assembly

Milestones

 1948 sector Enterprise to be in post independence India with assembly of 25000

telephone instruments and equal number of exchange lines in technical
collaboration with automatic telephone and electric company of England.
 1950 corporate status as joint stock company
 Components manufacture plant at Srinagar(J&K)
 1973 telephone instrument plant in Naini
 1994 manufacturing setup established at Delhi for SDH transmission
 System through joint venture company-PIBCON
 The name changed to ITI Ltd with new corporate identity
 Turnover crossed Rupees 1500 crore[US% 350]
 1996 entered into V-SAT services
 1997 release of 40000 lines exchange to DOT
 1998 ITI terms announced after set back to economy VLSI II ONE micro FAB
facility inaugurated at Bangalore plant, ISO 9000 accreditation process completed
for plants
 1999 ITI Alcatel, new technology agreement signed all time high physical
production performance
 2000 manufacturing of well equipment with collaboration of MS Lucent USA
 2001 production of latest switching exchange equipment CSN-MM version

6
  2003 the company completed BSNL, GSM, phase one order and bagged phase 2
order of 682KL value Rs. 74.5 crores joint venturing FIBCOM India Limited
achieved a sale turnover including other of Rs.42 crores and recorded a net profit
of Rs.12 crores.
 2004 of top turn services of company. ISO 9000 accreditation process completed
for all plants
 All time high physical production performance
 2006 winner of voice and data 100 top Telecom turn key service company
 2010 ITI and (C-DOT) signed and agreement to evaluate, discuss and negotiate
contractual relationship, concerning the transfer of Technology for C-DOT
gigabyte passive optical network system.

Awards/ achievements

 ITI has won " Certificates of Excellence" in the year 15 may 2015
 ITI has won the award for " Excellence effort for PSU Revival" in 22nd May 2015
 ITI has won the award for " Outstanding safety performance Industries safety" in
the year 2015
 Tree plans of ITI(Rai bareli, Palakkad and Bangalore) have won the National
safety awards for outstanding performance in industrial safety in the year 2004
 Energy conservation award ITI Mankapur plant which saved energy to tune of
Rs.384 lakh during the last 3 years has won
 ITI has received the prestigious ISO 9001-2000 certificate for its excellence
product quality
 ITI has also won 'ASCON' award which was presented by PV Narasimha Rao
 Awards won by ITI quality circle
 ITI annual circle convention 1996, Bangalore client won the first prize
 6 annual quality convention 1992, Bangalore plant on the first prize
 Confederation of India industry, then state level quality circle composite awards.
ITI won first prize in the year 1997-98

7
 The awards constituted by the Ministry of Labour and Employment, government
of India are given annually in recognition of good safety performance by
industrial establishment
 Rai bareli and Palakkad plants received the award for their achievement based on
longest accident free year and lowest average frequency rate respectively. The
runner up awards based on longest accident free year and lowest average
frequency rate awarded to Bangalore and Rai bareli respectively. Former has
posted the longest accident free period 87,36,672 man hours.

8
 CHAPTER 2

DIFFERENT DEPARTMENTS IN ITI

2.1 TELEPHONE DEFENCE PRODUCTION:

Telephone is an instrument for simultaneous transmission and reception of the human

voice. Telephone defense production is the department where manufactured electronic and
mechanical components are assembled and tested. There are 2 types of telephones generally
used.

 Executive telephone System (ETS)

 Defence telephone System (DTS)

A Business telephone system is a multiline telephone system typically used in business

environments. There are parallel connection between the telephone system.

Field telephones or the defence telephones are used for military communications. They
can draw power from their own battery or from an external power source. Military
communications needed to be secured. So inscription devices are used in the transmission
side. For long distance communication, the bandwidth require will be more.

For the original data to be transmitted, an algorithm and a key will be added, so that the
external system cannot decode the signal.

Telephones can be Point to point communication and Point to multi-point

communication. Inscription devices are used in the transmission side and likewise
description devices are used in the receiver side.

In Inception device, the input data. undergoes X-OR operation with algorithm which
undergoes XOR operation with key., so that the original data is unreadable and can be
mistaken as noise and description process will take place at receiver.

The data can also be protected using Equipment distribution Switch (EQD). When EQD
is enabled the entire hardware or the components is destroyed or burnt.

9
Another way is to wise the tamper switches. When the system is ON, tamper switch will
erase the data. During the OFF condition of the system, the battery is used to hold the low
and high signals.

Fig: Defence telephone System

2.2 INJECTION MOULDING AND FABRICATION:

Plastic Injection Moulding is the process of melting plastics which are injected at pressure
in to a mould cavity, which fills and solidifies to produce the final product.

The basic principle of the Plastic Moulding Machines associated with the pre-heating of
the raw materials up to certain temperature and is converted to a plastic paste by
increasing the temperature which is then moulded to a desired shape.

Thermoplastics are the polymers that can be softened through heating before being
processed and then left to cool and harden. Thermoplastics are the raw materials used so
that the wasted plastics can be reused. Both the hard type and soft type are used for
moulding.

The basic raw materials used for moulding are,

(i)Soft materials

1. Acrylonitrile butadiene styrene (ABS)

2. Polycarbonate

10
 (ii)Hard materials

1. Nylon
2. Polystyrene
3. Polypropylene
4. High Density Polyethylene (HDPE)
5. Low Density Polyethylene (LDPE)

Vacuum section will be created by the autoloader which auto-loads the raw material to
the hopper dryer. The pre-heating of the material removes the moisture content. If not
pre-heated, the white marks or white patches will appear I the final product. The soft raw
materials will be pre-heated at the temperature of the 80 degree Celsius for 2 to 3 hours.
The hard raw material will be pre-heated at the temperature of 120 degree Celsius for 4 to
5 hours. The melting range of soft granules are around 180 to 230 degree Celsius and that
of hard granules are around 230 to 300 degree Celsius.

The pre-heated material in the heating barrel moves through the feeder zone. It contains
5 zones of heating.

1. Zone 4
2. Zone 3
3. Zone 2
4. Zone 1
5. Nozzle zone

Each zone is provided with two heating bands. No program is loaded to machine.
Program will be already stored. Only manual parameters are loaded to the machines.
Some of such parameters given manually are,

1. Shape of the cavity mould

2. Speed
3. Amount of paste
4. Size of product
5. Pressure
6. Holding Pressure
7. Cooling time

11
There are two types of moulding process.

1. Multi-cavity moulding
2. Family moulding

Multi-cavity moulding is the moulding process where many numbers of the same
products are moulded at the same time. Family moulding is the moulding process where
both the base and case of the same product is moulded together.

There will be a ejector tool to remove out the moulded product from the cavity mould.
We can also choose an auto mode, which do not require any human interference. It will
automatically pushes out the moulded product from the cavity mould.

Fig: Injection moulding

CNC Turret Punch Press:

This is widely used versatile computerized numerically controlled (CNC) punch press
for sheet metal fabrication activities in mechanical production shop. This machine is used
for making wide range of openings in the metal sheets like round holes, square holes,
rectangular holes, oblong holes, lowering, forming screed guides, dribbling etc at high
speed and accuracy for various application of sheet metal fabrication.

This CNC machine can rapidly punch openings on sheets up to 6mm thick mild steel,
braze, copper and aluminium up to 3.2mm thick stainless sheets with 44 tool stations and
auto-indexing tool stations on a single turret station. The machine provides a wide range
punching features required for fabrication of sheet-metal product like Telecom and sub-
racks, electronic racks/cabinets, control panels etc using this machine prototype product
development activities can be carried out with minimum time and tooling which in turn
reduces the time taken for the development.

12
The machine table, which has both brush and ball support, can handle, a large sheet, size
of up to 1524x2500 mm in one selfing. It can even handle extra large sheet of size
1524x4064 mm with automatic positioning. A separate work chart is provided which can
be programmed to collect punched parts out , which are required for use without allowing
it to get mixed wit scarp pieces.

The accurate movement, positioning and operation of the sheets on the table and the
tools in the turret is ensured through CNC controlled software programming. The
machine is capable of providing a punching and positioning accuracy of better than
0.7mm. The machine is capable of providing 425 hits per minute at 25mm pitch. It can
handle, sheet weighing up to 146kg and has sheet feeding speed 128mts/min on both X
and Y ratio.

The machine is required in precision mechanical sheet metal fabrication activities of on

going projects MIL pcm, E cryptons, pMox, Telephones and in prototyping of any other
mechanical items. Apart from this, the machine is required for the contract manufacturing
activity of BHE1 items, 1ERC and any other future contract manufacturing activity. Since
the machine produced is independent it can be used for any other project also.

Fig: CNC Turret Punch Press

Forming Machine:

This machine takes the metal sheets and bends it according to the requirement of the
operator. Different metal sheets used for different products needs bends at different
angles. The bends at different angles required at specific distance are the parameters
given manually as input to the machine.

13
Forming machines are also called as Bending machine or Press break machine. It can
handle sheets of length up to 2m. Overall the building required to bend the metal sheets
can be done through this forming machine.

Fig: Forming Machine

2.3 METALLURGICAL LAB AND TESTING

Metallurgy is an art and science of extracting metals from their ores and modifying the
metals for use. In the field of production, metallurgy is concerned with the production of
alloys, shaping, heat treatment and surface treatment of product.

Metallurgical testing identifies the condition and makeup of materials, evaluates defects,
determines the structural features, identifying alloys, evaluates the effects of heat
treatment, and ensure materials are up to required specification and the product is fit for
the purpose.

Wave soldering is a large scale soldering process by which electronic components are
soldered to a PCB to form an electronic assembly. Due to high solder and high power
consumption of wave soldering, it is not been used nowadays.

Instead of wave soldering, surface mount soldering is used. It is the process of creating
circuits using SMT machines. Both active and passive devices can be manufactured. The
circuit components soldered using the SMT machine is called as Surface Mould Devices.

14
After the manufacturing of the circuit components, testing of the circuit components is
done o check the value of it. The components to be tested will be provided with the series
of code to check the correct range of the values of components. The data sheets

corresponding to the code will be referred and the range of the component value will be
calculated.

Precision LCR meter is a test machine which checks the components for its correctness. If
the value is within the range calculated, then the component is passed, if not the
components manufactured will be failed. Different adaptors are used for different
components. Once the adaptors are changed, the machine must be calibrated. Machine
can measure up to frequency of 2MHz.

Fig: Precision LCR Meter

Micro ohm meter is another testing machine which tests the continuity of the citcuit
components or other devices. It is also known as Digital Low Resistance Ohmmeter
(DLRO) which measures the low resistance values in micro-ohms at specified currents.

Frequency meter is a device for measuring the repetitions per unit of time. A frequency
counter is an electronic instrument, which is used for measuring frequency.

Digital variac provides a voltage adjustable source of AC.

15
2.4 RESEARCH AND DEVELOPMENT DEPARTMENT (R&D)
2.4.1 Printed circuit board (PCB) Department:

PCB is the board base for physically supporting and wiring the surface mounted and
socketed components in most electronics. They are mainly used to provide the electrical
connection and mechanical support.

Fig: PCB

Different types of PCB’s are,

1. Single layer board

2. Double layer board
3. Multi layer board

Large number of PCB’s can be fabricated at the same time, and the layout has to be done
only once.

Construction of Double side board:

1. Plated through hole: A thin layer of copper coating is added chemically into the
holes and onto the surface of the board through a process called Electroless copper
deposition.
2. Scrubbing: During the cleaning process the surface is scrubbed with pumice to
improve adhesion of the mask as well as to remove any surface contamination.
3. Lamination: Copper layer is laminated on both sides of the substrate.

16
4. Exposing: Exposing of PCB is basically an image transfer process from plotted
film on to a bare copper clad laminate. Under intense UV light, a photo resist
which is applied on a bare copper laminate exposed in areas which are to be kept
on copper laminate, thus forming lines on it.
5. Developing: The parts where the photo resist was exposed to UV light will be
washed away in about 5-10 seconds. The board should not be left in developer
solution for too long, else photo resist will be washed away. Place the PCB in cold
water immediately to stop the reaction once the board id finished
6. Copper and Tin Plating: The board will be coated with copper and tin as per the
requirement on both the sides of the board.
7. Film Stripping: The board will be stripped with a green dry film.
8. Etching: Copper is etched out from hard area since Sn prevents removal of Cu
from the soft area.
9. Tin Skipping: After etching tin is also stripped out, as result of which Cu remains
only on the soft area.
10. Solder Masking: The solder mask is placed over the copper foil on both the sides
of the board to provide protection.
11. Expose and Developing: Again the board is exposed to UV light and developed in
developing solution.
12. Solder Coating: The lead will be pre coated on the board where the components
are to be soldered.
13. Trim to final size: The board initially taken must be little greater than the required
length, since many of the above process requires holding. So it is finally trimmed
into final size.
14. Bare board Testing: The isolation and continuity of the electrical connections on a
bare circuit connection board prior to attaching components such as IC’s are
tested.
15. Legend Marking: The legend of a PCB is text printed on top of the solder mask.
Silk screen or component identification are terms used for these text layers. These
are often the manufacturers part number (MPN), a name or brand for specific
product line, company logo, serial numbers. It will help designers distinguish
between different components in similar packages.

17
In the same manner, Multi layer board is also processed.

The steps are followed as given below

1. Inner layer raw materials

2. Inner layer lamination
3. Inner layer exposing
4. Inner layer developing
5. Inner layer etching
6. Inner layer stripping
7. Guide hole drilling
8. Black oxide
9. Four layer construction layup
10. Multi layer pressing
11. CNC drilling
12. Desmear

2.4.2 Power supply Lab:

Industrial power supplies are the electrical devices used to provide power to industrial
machinery. The main purpose of the power supply is to convert electric current from a
source to the correct voltage, current, and frequency to power the load. The power supply
board is the basic essential interface for regulating and supplying power to the connected
components. Even an incredible brief loss of power can cause serious damages to
sensitive equipment’s, machinery, final products, materials and the ensuring restart can be
time consuming and expensive.

Basic and important components of a power supply unit are

1. Transformer
2. Rectifier
3. Filter
4. Voltage Regulators

18
A power supply takes the AC from the inlet, converts it to unregulated DC and reduces
the voltage using input power transformer, typically stepping it down to the voltage
required by the load, for safety reasons. The transformer also separates the output power
supply from the mains input.

Input protection is implemented in power supplies to ensure safe operations. As a result

of short circuit external to the supply or within it, over current is a major concern. It can
initiate a cascade of additional failures, and even start a fire. One of the solution is to use
a fuse. Once the fuse blows open, the current flow is completely cut off. Instead of fuse
under voltage lock out (UVLO) can also be used, that ensures that a power supply
converter doesn’t attempt to operate when its own input voltage is too low.

EMI filters are typically used together with shields and other types of protections. Almost
every electronic device contains an EMI filter. It could be separate part, an embedded part
in the circuit boards, or even a built in component inside the power supply. The main

purpose of EMI filter is to reduce high frequency electronic noise which would cause
interference with other devices.

Next, rectification process is carried out. Rectification is necessary for power supply
that converts AC mains converted to DC. Rectification, along with some degree of
filtering or smoothing of the pulsating DC output of the rectifier to a study flow of DC. In
most of the case bridge rectifiers are used.

The rectified output is again converted back to AC and given to the transformers. The
transformers don’t allow DC input flow. The power supply transformer raises or lowers
the voltage as needed. Most devices require stepped down voltage from standard AC
outlets to a much lower amount.

The diode allows the current to flow easily in one direction, but resists currents in
opposite directions. Diode protects the components which are responsive to the flow of
current through them in the wrong direction. The output of the transformer is given as a
input to the diode so as to convert from AC to DC.

A chopper is a device that converts fixed DC input to a variable DC output voltage

directly. The output of diode, is given as input to chopper to get the required output.

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2.4.3 CAD (Computer Aided Design) Lab:

A PCB designer is primarily in charge of designing and developing printed circuit boards.
They use computer software programs to create layouts and 3D models of circuit board
and also make sure the board is functional by using specialized software. Documents for
PCB assembly, schematics and fabrications using CAD software and also design layouts
to develop high speed and reliable circuits.

The boards to be designed on, are selected with required length and breadth. Different
libraries like component and path libraries are selected for the design. The schematic
diagram of the PCB is designed initially. It is a representation of elements of a system. It
shows the components that are used in the design and how are they connected together.

In the next pre layout stage, the stack up design is initiated and need to ensure that all the
materials required for design are available.

In PCB layout stag, includes setting up the design tool, board outline, import of net-list,
component placement, routing, silk screen clean up, DRC check and generation of
documents for production.

The drilling chart lists the number and the size of the holes for each drill to be used on the
board. Then different production files are generated so that to helps the manufacture the
product. Some of the files generated are

 Top-top copper layer: indicates the copper traces on the top layer of the PCB.
 SMT solder: solder mask top layer.
 SPT: solder paste top layer
 SST: silk screen top, is a layer of ink used to identify components, marks, logos
and so on.
 NC drilling files: shows the orientation of drill holes on PCB’s.
 PDF of schematic and layout.

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 Fig: PCB design using CAD software

2.4.4 Reliability Laboratory:

The Reliability Lab is equipped with the state of art test equipment and supporting tools
to enable you to get fast insight in the performance of products over life.

The product reliability testing can help to predict future behaviour during the complete
life cycle of the product, component or material under test. It is a way to verify that a
product will keep working as intended while it is subjected to a certain usage in a certain
environment, for a certain time period.

For different tests 3 standards are used.

1. JSS 55555-used for Air force and Military

2. MIL STD-used for Navy and Military
3. QM333-used in Telecommunication

Different tests are as follows,

 Temperature test- This test is conducted to test whether the circuit can with stand
the temperature whether high or low. Rapid cycling is also a test where the
temperature is first low and then increased.
 Damp heat test- This test is conducted with both the temperature and humidity.
Mostly tested with 35C with humidity 95%rh.
 Thermal test- In cycle test both the positive and negative temperatures are used
where temperature varies slowly. In shock test, the product is kept at low
temperature for certain time and then temperature is changed suddenly to a very
high value. Profiling test is another thermal test where the temperature at which
the circuit will fail will be predicted.
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  Vibration test- It is used to see that if the circuit can handle any kind of vibrations.
In a random test, test duration is for 5 to 10min. In frequency test, the frequency
of vibration is kept up to 5Hz to 200Hz. In the sinusoidal test, the frequency is
varied from 5Hz to 3000Hz and then vice versa. If the product can withstand the
test, then the implementation is done.
 Altitude test- This type of test is only used for air craft applications. It is
conducted in low pressure.
 ESS (Environmental Stress Screening) test- It is conducted automatically with
temperature 15C. If one wants to change the temperature, one can feed in the
program.
 Halt Hass test (Highly Accurate Life Test/ Highly Accelerated Stress Screening)-
In this test, temperature is varied up to 60C within a minute . Nitrogen gas is used
for the cooling purpose.
 CATH (Combined Altitude, Temperature and Humidity)Test –The product is
tested for all the 3 parameters such as altitude, temperature and humidity.
 Salt spray/Dust test- it is a environmental test in which the product will undergo
dust test and a salt is sprayed on the product. If it can withstand, implementation is
done.
 BVMP/DROP/TOPPLE/FALL test- In this test, product is made to fall from a
certain height. It is used to determine the maximum height where the product can
withstand the height or drop.

2.5 3D PRINTING LABORATORY:

3D printer is a machine allowing the creation of a object from a three dimensional digital
model. 3D printing uses computer aided design to create 3D objects through a layering
method.

3D printing involves layering materials like plastics, composites or bio materials to

create objects that range in shape, size, rigidity and color.

3D printing is the construction of a three-dimensional object from a CAD model or a

digital 3D model. It can be done in a variety of processes in which material is deposited,
joined or solidified under computer control, with material being added together, typically
layer by layer.

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 One of the advantage of 3D printing is the ability to produce very complex shape or
geometries that would be otherwise impossible to construct by hand, including hollow
parts or parts with internal structures to reduce weight. They are created with CAD which
results in fewer errors than other methods.

Fused deposition Mode (FDM) is a 3D printer where materials are extended through a
nozzle and joined together to create 3D objects. It takes a polymer based filament and
forces it through heated nozzle, which melts the material and deposits it in 2D layer on
the build platform. While still warm, these layer fuse with each other to eventually create
3D part. In FDM printer, a wide variety of thermo plastic materials and exotic filaments
can be printed. Disadvantage is that only one type of material model can be printed at a
time.

Fig: 3D printing using FDM

Polyjet is another 3D printing technology that produces smooth, accurate prototypes. It

incorporates the widest variety of colors and materials in to a single model for unbeatable
efficiency. It builds the part by jetting thousands of photopolymer droplets on to a build
platform and solidifying them with a UV light. It uses the liquid photopolymers to create
the model which is similar to inkjet printer.

The disadvantage is that this machine must be kept in on condition for 24hours, since the
raw semi liquid material will solidify and block the nozzle. The models are not rigid. It
can only be used for a model purpose and cannot be used practically.

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Application:

 In food industry, a model constructed layer by layer, into 3D models is used in

order to limit food waste. Items such as chocolates and candy, and flat foods such
as crackers, pasta etc. are 3D printed.
 3D printing has also entered the world of clothing with 3D-printed shoes and
dresses.
 3D models are used mainly in the medical sectors. They are used for modeling
purposes. The body parts can also be printed, so that the surgeons and doctors can
practice on them.
 It is also wildly used in the field of civil. 3D models are used to design the
buildings and other architecture to be presented. If the model is passed, only then
the implementation will be started.
 It is mainly used in aircrafts field. Before manufacturing the aircrafts, they are
first designed and print a 3D model before the implementation.

Fig: 3D printing using Polyjet

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2.6 SURFACE MOUNT TECHNOLOGY (SMT)
SMT is a technology in which instead of putting wire leads into holes drilled in the
circuit board, components and elements are mounted directly on the surface of the
board. it is the method used for producing and SMD. In industry it has largely
replaced through whole Technology construction method of fitting components with
wire leads into holes in the circuit board. SMT include the ability to create smaller
components, I have component density and greater efficiency, since fever holes need
to be drilled in the circuit board.

The SMT loader machines are used as the Board loading device for producing
circuits boards. It can be used in the standard material box to automatically send the
circuit boards stored in the material box to the production one by one.

One of the most important parts of the surface mount assembly process is the
application of shoulder based to the printed circuit board. The aim of this process is to
accurately deposit the correct amount on to each of the pads to be soldered. This is
achieved by screen printing the solder paste through a stencil and also can be applied
by Jet printing. If this part of process is not controlled correctly, there is a chance for
the majority of assembly defects. The squeegees are the tools used to apply the
necessary force required to the solder paste across the stencil and on the PCB. The
PCB must be held flat against the stem cell during the printing process. If not, it can
lead to printing defects and smudging. PCB's have programmable positions to ensure
a consistent process. The solder paste can be leaded or unleaded.

To verify the shoulder printing process, automatic inspection can be used to

accurately check the solder paste deposits. There are two types of solder paste
inspection available which are 2D inspection which checks the area of the paste
deposit and 3D inspection which checks the volume of a paste deposit. This
inspection process can be acute by the machine called as Automatic Solder paste
Inspection system(SPI). If there are errors introduced at the stage, then there will be "
knock on" effects throughout the process.

Once the board has a paste applied, the components are placed on the top. This can be
done by hand or by a machine. This process can be done automatically using
automatic pick and place machine.

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Pick and place machine is a robotic assembly device that uses a vacuum to lift a
component off of a piece of tape, rotate it to the right orientation, then in place it on
the circuit board. It will take few hours to set up the machine to build the Assembly,
but once everything is running, it is very fast.

In a large factory, a conveyer belt often carries the board directly from an automated
paste deposition machine into Pick and place machine. Larger integrated circuits are
sometimes arranged in tray which are stacked in a compartment called as Multi-Tray
Unit(MTU).

The conveyor belt, which is present through the middle of the machine carries PCB's
and it clamps in the center of the machine. After the PCB gets clamped, the normal
pick up individual components from the feeder, and place them on appropriate pads
with high precipitation. Camera on the pick and place head photograph fiducial marks
on the PCB to measure its position on the conveyor belt accurately.

Automated optical inspection(AOI) is an automated visual inspection of PCB

manufacture where a camera scans the device under test for both missing components
and quality defects. It is one of the best inspection tool in the SMT environment. It
helps to identify the defects or issues in the early stages of the manufacturing process.

By using one or more HD cameras, this process captures images of assembled PCB
surface with the help of light source. It then compares the captured scanned images
within pre existing template images to detect both catastrophic failures and quality
defects. The following information can be expected from the inspection results.

1. Body of the machine missing

2. Body dimension
3. Polarity
4. Upside down
5. Missing lead
6. Pad offset or shift
7. Markings

A reflow oven is a machine used for reflow soldering of surface mount electronic
components to PCB's. It is a form of long tunnel containing a conveyor belt or mesh
on which PCB's travel.

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 The conveyor speed and zone temperatures are adjusted to achieve good wetting. It
contains 12 eating filament and four cooling filament.

The Automatic unloader is designed for unloading PCB's attached to the conveyor.
The X-ray inspection machine confirms the quality of PCB and also screen for
counterfeit components. X-ray inspection allows each pad to be seen clearly, as well
as the large central soldering pad. Missing solder, open and Bridge solder pads can
easily be seen, and voiding can be measured on each pad.

At last the testing of the manufactured PCB is done or processed. Flying Prob testing
is commonly used to test the analogue components, short/ open circuits. As the name
implies, uses test props that fly i.e. test probes move from test points to other test
points as per the instructions given by specific software program.

Fig: SMT machines

2.7 ENVIRONMENTAL PROTECTION DEPARTMENT

Environment is total of all the living and non-living elements and their effects that
influence human life. Many government acts are implemented to reduce the environment
pollution. Some of the acts are given below

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1 The water (prevention and control of pollution) act(1974)

This Act was enacted in 1974 to prevent and control the water pollution and for
maintaining or restoring of wholesomeness of water in the country.

2 Air act (1981)

It is an act passed by the Parliament of India to prevent and control the harmful effects of
air pollution in India.

3 Environment act (1986)

It was enacted in 1986 and was amended in 1991. Healthy ecosystems clean our water,
purify our air, maintain soil, regulate the climate, recycle nutrients and provide us with
food. It involves the measures taken to protect the environment.

4 Hazardous waste (1989)

Hazardous waste management rules are notified to ensure safe handling, generation,
processing, treatment, package, storage, transportation, use reprocessing, collection,
conversion, destruction and disposal of hazardous waste.

5 Biomedical Waste act (1998)

Medical ways cannot be mixed with other wastes. It will be segregated into bags or
containers at the point of generation in accordance with schedule II prior to its storage,
transportation, treatment and disposal.

6 Noise pollution act (2000)

The noise pollution effects the help such as headache, irritation, hearing loss, migraine,
nervous system breakdown, increase in blood pressure, less concentration etc. Hence the
rule states that the noise level in Industrial Area shell not exceed 75 decibel for day time

and 70 decibel at night. In commercial areas, it is 65 Decibel and 55 decibel. While in

residential areas it is 55 disable and 45 decibel during day time and night time
respectively.

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7 Batteries act (2001)

As batteries corrode, their chemical soak into soil and contaminate groundwater and
surface waste. Batteries act comes up with plan about how to handle the used batteries.

8 Solid waste act (2016)

Solid waste can be a dry waste or a wet waste. Wet waste are easily disposable. But dry
waste are not. Hence we cannot throw, burn or bury the solid waste in public places or in
drain or in water bodies.

9 Demolition and construction act (2016)

Recovery, recycling and reuse of trash produced by construction and demolition is the
foundation of this regulations.

2.8 INFORMATION TECHNOLOGY

Information technology (IT) is the study or use of system like computers and
Technology for storing, retrieving and sending information. It is basically the use of any
computer, storage, networking and other physical devices, infrastructure and process to
create, process, store, secure and exchange all forms of electronic data.

Information Technology department and ensures that the organization's system,

networks, data and applications, all are connected and functions properly. In order to
connect many devices together switches are used. Switches are key building blocks for
any network. They connect multiple devices, such as computers, wireless access points,
printers and servers, on the same network within a building or campus. A switch enables
connected devices to share information and talk to each other.

And IP address is unique address that identifies the device on the Internet or a
Local Network.

All computers on the same network share the same network ID. Firewall is a
network security system that monitors and controls incoming and outgoing network
traffic based on predetermined security rules.

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 Fire wall is essentially the barrier that sits between a private internal Network and
public internet. Basically it do not allow any unauthorized network to access the network.
If a computer needs to communicate with a host or another network, it will usually
communicate through fire wall or router.

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 CHAPTER 3
CONCLUSION
The Indian Telephone Industry (ITI) is been providing a place to acquire great learning
experience with the help of different departments like IT, IOT, SMT departments etc that
helps to develop a better understanding of the engineering principles and processes that
exist behind the defense system production in telephone and in research field. They also
have a strong household for research and development department used for Military of
Communication and they are one of the major supporting pillar of the Indian Military of
Communication with their advanced technologies in defense production field. The nature
of working of the several departments that come together to achieve the common goal of
successful production. It is a place for motivation to pursue with interest in research on
topics related to telecommunication, smart connect technology and related to defense as
recently they have been recognized by ISRO. They have departments and technologies
providing a direct correlation to the concepts learnt in academy curriculum with the
devices and the value of working in a team during the internship period as it was clear
that teamwork, communication between each departments and their coordination which is
necessary to carry out research.

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REFERENCE
1. S. C. Tang, S. Y. R. Hui and H. S. -H. Chung, "A low-profile power converter using
printed-circuit board (PCB) power transformer with ferrite polymer composite," in IEEE
Transactions on Power Electronics, vol. 16, no. 4, pp. 493- 498, July 2001.

2. F. Yuan and X. Guanying, "The Research of Hazardous Waste Management System in

Guangdong Province Based on WebGIS," 2009 International Conference on
Environmental Science and Information Application Technology, 2009.

3. V. M.Sudhakar, 2019 4th International Conference on Internet of Things: Smart

Innovation and Usages (IoT-SIU)

4. M. J. Walker, "Surface mount technology in communications products," 8th

IEEE/CHMT International Conference on Electronic Manufacturing Technology
Symposium, 1990.

5. P. M. Main, "Extension of secure audio and video data from the NTC through the
public switched telephone network," MILCOM 97 MILCOM 97 Proceedings, 1997.

6. M. Chinthavali, "3D printing technology for automotive applications," 2016

International Symposium on 3D Power Electronics Integration and Manufacturing (3D-
PEIM), 2016.

7. Sterling, Christopher H.; Military Communications: From Ancient Times to the 21st
Century (2008). Santa Barbara: ABC-CLIO. ISBN 978-1-85109-732-6 p. 444.

8. Ivanov, Alexei and Philipp S. Jowett; The Russo-Japanese War 1904-1905 (2004).
Oxford: Osprey Publishing. ISBN 1-84176-708-5

9. https://www.scribd.com/document/438917637/mouseen-iti-report-333
10. https://soch3d.com/3d-printing-service
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