CONTENT

 Acknowledgment
 Company profile
 Environment protection lab
 Telephone defence production lab
 Fabrication lab
 Injection moulding lab
 Research and development lab
 Reliability lab
 Printed circuit board lab
 Power supply lab
 CAD lab
 Metal testing lab
 Internet of things (IOT)
 Information technology (IT)
 Surface mounted technology (SMT)
 ACKNOWLEDGEMENT
Firstly I would like to thank my internship co-ordination of VIJAYA VITTALA INSTITUTE
OF TECHNOLOGY for providing me a opportunity and guiding me through the successfully
to complete my internship
I am thank full for my parents for financial supporting me and to encourage me to attend the
internship
I am very thank full for ITI ltd Bangalore allowing me to visit the manufacturing units and
labs to study and understand about the facilities available in the plant
I am very glad to be a part of the internship programmer provided by ITI ltd
I would like to thank MR. RONNY ESTIBERIO -HRED of tanning and development for
patiently guiding me through the internship program and for his valuable department
At last, I am very thank full for all the departments for sharing their knowledge and clearing
the doubts
 Company profile
Background and Inception of the company
ITI Limited formerly Indian Telephone Industry Limited is the public sector
undertaking of the country which was established in 1948. From a small beginning it has grown
into a mammoth multi unit enterprise with manufacturing units at Dooravaninagar and
electronic city in Bangalore in Karnataka. In 1964 the company started manufacturing at cross
bar automatic exchange and they started naini and Srinagar in Jammu and Kashmir in the year
1971. Water on the company started the plants in Roe Barely in V.P. Palakkad in Kerala and
Mankapur.
The company has a network of sales and service officers comprising regional officers located
at Bangalore, Mumbai, Kolkata, Delhi, Lucknow, Chennai and a number of sub-offices under
each region to represent the company in every significant town In line with the business
strategy the entire activity of the company are now re-organized as independent business group
with manufacturing facility at bangalore , Mankapur, Palakkad Transmission business group
with manufacturing facility at bangalore and naini etc. The company has a strong in house
R&D Infrastructure attached to the independent business group .
The Main R&D division is at Bangalore and Naini forward looking at technology. The R&D
is engaged in continuous development and absorption of technology.
The company lays a strong emphasis on equality, which taken as a corporate management
function under an independent execution director reporting to chairman & managing director
A large number of companies products are covered under “Self-certificate scheme”.
By the majors customer ie, department of telecommunication International quality
management system. The company has adopted ISO 9000. Taking it as a “Tool for organization
change and work redesign”.
Human Resource Development in another in a company involving professional and
organizational development activities. The company’s product range includes all that is
required ITI equip national and international telecommunication network, satellite with sample
telephone to state to the art digital switching satellite communication and optical
communication system 95% of company’s product are supplied to the department of
telecommunication now known as BSNL, the other significant customers of the company are
defence and Railways for who even special turkey projects has also been execute.
Nature of Business and carried out ;-
Manufacture of telecom equipment
Research and Development
Joint development of projects
Marketing and customer service
Value added service
Turkey project
Network management
Software applications
IT products and services
Transfer of Technologies

Vision 25
Enhance share holder value and will move up the value chain by expanding knowledge based
and service based business while simultaneously leverage over manufacturing business
Mission
To establish leadership in manufacturing in manufacturing and supply of new technology
telecom products and also retain status of top turkey solution provides
Quality policy
ITI company is committed to provide products and services of consistent quality products and
that will lead to customer delight and company will maintain the leadership in the market with
the competitive prices and professional excellence through;
* Continuous innovation
* Continuous improvement in every activity
* Implementation of sound quality management system
Product and service profile
Product Division in ITI
 Telephone Division : Main production division in ITI is telephone division .This
division manufactures around 5 lakhs telephone every year
 Transmission Division : This is another division where it undertakes the
manufacturing of microwave equipment statlite communication equipment official
fiber equipment and defense product
 Acess product Division : This division undertakes manufacturing of rural exchange
 Switching-This divided into three categories
 Large switches
 Medium switches
 Short switches
Transmission : microwave and satellites
 Defence-SCPC VSAT,millatry EPABX128port
 Access product -wireless local loop (WLL),digital loop carrier (DLC),pair given
 Terminal/subscribe and products :
Telephone,ISDN product, video conference
  Information Technology : Computer technology integration (CTI)
 Other product : Bonk mechandizing product fire alarm

Services offered in ITI :

 Turnkey projects
 Customized software development
 Development of application specific integration circuit asies
 Multiple international 1D cards ,enterprise business like data centres etc
 Pre-warranty and post warranty maintenance service for all products / projects

Areas of operation
ITI has exported products such as ADPCMC-DOT MDM / SBM switches SMPS power plant
VRLA batteries ,CDMA will equipment ,DG sets ,shelter ,tower ,MW radios rural exchange
and telephones of different types ,space cards for E-10B exchange single channel VHF radio
,multi access rural radio canalog and digital and ask’s to countries in Afghanistan ,Asia, Africa
and Europe
Besides various project in India ITI has successfully executed turkey projects overseas
Ownership pattern
ITI has a total share holding pattern of 90% (the government of INDIA KARNATAKA had
0.11%)
Competitors information
 Nokia
 Samsung
 LG
 Motorola
 Toshiba
 Ericson
 Siemens
 United Telecom
 HCL
 HRCL
 Bhorti Telecom
 Reliance
 Tata
 BHEL
Infrastructural facility
 In house research and development
 Network system unit capable of understanding turkey jobs
 Self-contained component evaluation centre
 Fully automobile component evaluating
 ICT (In Circuit Testing) ,env
  environment testing ,cord assembly
 Moulding and die casting,SMT
 Fully hedged state of the art tool rooms,fabrication of tower and shelters for GSM
 Component approval centre approved by BSNL
 Mechanical fabrication/machine shop with modern CNC machines and finishing shop
 Plastic injection technology ,through hole component assembly

Milestones
 In 1948 first public sector enterprise to be in post-independent India with assemble of
25000 telephone instruction and equal number of exchange lines in technical
collaboration with automobile telephone and electric company of England
 Components manufacture plant at stringer
 In 1950 corporate status as joined stack company
 In 1973 Telephone instrument plant in naini
 In 1994 Manufacturing setup established at Delhi for SDH transmission
 System through joint venture company PIBCON
 The name changed to ITI Ltd with new corporated identity
 Turn over crossed 1500 cr (us% 350)
 In 1996 entered into V-SAT services
 In 1997 release of 40000 lines exchange to DOT
 In 1998 ITI turns around after set back to economy VLSI one micro FAB facility in
aggerated at Bangalore plant ,ISO 9000 accreditation process completed for plants
 All time high physical production performance
 2006 winner of voice and data 1000 top telecom turnky company service company
 2010,ITI and (C-DOT) signed an agreement to evaluate discuses and negotiate of
technology for C-DOT gigabit passive optical network system
Award/achievements
 ITI has won “certificate of excellence” in the year 15 th may 2015
 ITI has won the award for “excellent effort for PSV revival” in 22 nd may 2015
 ITI has won the award for “outstanding safety performance industry safety” in the year
2015
 Three plants of ITI (Rai bareli , Palakkad and Bangalore ) have won the national safety
award for outstanding performance in industrial safety in the year 2004
 ITI has received the prestigious ISO 9001-2000 certificate for its excellence product
quality
 ITI has also won “ASCON” award which was presented by PV.Narasimha Rao
 Award won by ITI quality circle
 ITI annual circle conventional 1996, Bangalore plant won the 1 st price
 6th annual quality convention 1992, Bangalore won the 1st price
 The award constitute by the ministry of labour are given annual in recognition of good
safety performance by industrial establishment
 Environmental protection Department

The natural environment or natural world encompasses all living and Non-living things
occurring naturally ,meaning in the case not artificial .The term is most aften applied to the
earth or some parts of earth
Environment encompasses the inter action of all living species ,climate weather and natural
resources that affects human survival and economic activity .The concept of natural
environment can be distinguished
 Complete ecological units that function as natural system without massive civilized
human intervention ,including all vegetation micro-organism ,soil .rocks ,atmosphere,
and natural phenomena that occur within boundaries and their nature
 Universal natural resource and physical phenomena that lack Lear-cut boundaries such
as air ,water and climate, as well as energy ,radiation ,electric charge and magnetism
,not originating from civilized human action
Environmental protection
Environmental protection is the practise of protecting the natural environment by individuals
organization and governments its objectives are to conserve natural resources and the existing
natural environment and ,where possible to repair damage and reverse trends
Due to the pressure of overconsumption population growth and technology ,the biophysical is
being degraded sometimes permanently
This has been recognized and governments have being placing restraints on
activities that cause environmental degradation have created more awareness of the multiple
environmental problems. There is the environment impact of human activity , so protection
measures are occasionally debated.
The types of pollution are :
Air Pollution (1981)
Air pollution is the contamination of air due to the presence of substances in the atmosphere
that are harmful to the health of humans and other living beings, or cause damage to the climate
or to materials. There are many different types of air pollutants , such as gases (including
ammonia, carbon monoxide, sulphur dioxide, nitrous oxides, methane, carbon dioxide and
chlorofluorocarbons).
Air pollution can causes diseases allergies, and even death to humans; it can also cause harm
to other living organisms such as animals and food crops and may damage the natural
environment.
Air pollution can be caused by both human activities and natural phenomena
The Gas are:
 Bhopal gas tragedy
 Styrene gas
Bhopal Gas Tragedy
The Bhopal disaster, also referred to as the Bhopal gas tragedy was a chemical accident on the
night of 2-3 December 1984 at the (UCIL) Union Carbide India Limited pesticide plant in
Bhopal, Madhya Pradesh, India. The industrial disaster is considered the world’s worst in
history.
Over 500,000 people were exposed to methyl isocyanate (MIC) gas. The highly toxic substance
made its way into and located near the plant estimates vary on the death toll, with the official
member of immediate deaths being 2,259, In 2008 The Government of Madhya Pradesh had
paid compensation to the family member of 3,787 victims killed in the gas release, and to
574,366 injured victims
A government affidavit in 2006 stated that the leaked caused 558,125 injuries victims including
38,478 temporary partial injuries and approximately 3,900 severely and permanently disabling
injuries others estimate that 8,000 died within two weeks, and another 8,000 or more have since
died from gas related diseases.
Date 2 December 1984 – 3 December 1984
Time (UTC +05:30)
Location Bhopal, Madhya Pradesh, India
Also known as Bhopal gas tragedy
Type Chemical accident
Cause Methyl Isocyanate leak from the E610
storage tank on the union carbide India
limited plant of which the cause is disputed
between corporate negligence or employee
sabotage
Deaths At least 3,787; over 16000 claimed
Non-fatal injuries At least 558,125
Styrene Gas leakage in Andhra Pradesh

At about 3 am - on May 7, 2020. Styrene monomer Vapour had leaked out of Storage tank on
the premises of LG Polymers unit located at Venkata Puram Village on the outskirts of the
port city.

The dangerous vapour, which spread over 3km had left 12 persons, who include two children
dead Around 600 people were hospitalised with difficult in breathing and vision complaints
As per the report submitted by the high power committee (HPC) constituted to inquire into the
incident about 1000 people had suffered different forms of illnesses that ranged from kidney
to neurological issues and from gastrointestinal problems to issues related to vision

Water Pollution (1974)

Water pollution is the contamination of water bodies usually as a result of humans activities,
so that it negatively affects its uses water bodies include lakes, rivers, oceans aquifers reservoir
and ground water, water pollution results
When contaminants are introduced into these water bodies water pollution can be attributed to
one of four sources sewage discharge industrial activities agricultural activities and urban run
off including storm water If can be grouped into surface water pollution or ground pollution.
Sources of water pollution are either point sources or non-point sources point sources have one
identifiable cause such as a storm drain a waste water treatment plant or an oil spill

Noise Pollution (2000)

Noise pollution, also known as environmental noise or sound pollution is the propagation of
noise with ranging impacts on the activity of humans or animals life most of them are harmful
to a degree The source of outdoor noise worldwide is mainly caused by machines , transport
and propagation system poor urban planning may give.
The source of outdoor noise worldwide is mainly caused by machines, transport and
propagation system poor urban planning may give rise to noise disintegration or pollution side-
by-side industrial and residential buildings can result in noise pollution in the residential area
Some of the main sources of noise in residential areas include load music transportation areas
include (traffic, rail, airplanes etc) lawn care maintenance, construction electrical generators
wind turbines explosions and people
High noise level can contribute to cardiovascular effects in humans and an increased incidence
of coronary artery disease
Biomedical acts (2000)
Biomedical as defined by the UK Quality Assurance Agency for higher education benchmark
statement in 2015 includes those science disciplines whose primary focus is the biology of
human health and disease and ranges from the generic and disease and ranges from the generic
study of biomedical science and human biology to more specialised subject areas such as
pharmacology, human physiology and human nutrition. It is underpinned by relevant basic
science including anatomy and physiology, are biology. Biochemistry, microbiology, genetics
and molecular biology, immunology, mathematics and statistics and bioinformatics.
Batteries act (2001)
When a battery is supplying power, its positive terminal is the cathode and its negative terminal
is the anode. The terminal marked negative is the source of electrons that will flow through an
external electric circuit to the positive terminal. When a battery is connected to an external
electric load, a redox reaction converts high energy reactants to lower energy products and the
free energy difference is delivered to the external circuit as electrical energy historically the
term “battery” specifically referred to a device composed of multiple cells however the usage
has evolved to include devices composed of a single cell.
 Telephone Defence Production (TDP)

Telephone defence production under which comes telephone magneto

 A telephone magneto has a permanent magnet that is used for producing the alternating
current
 The rotating armature produces the current
 There are two types of telephone manufacturing
 Executive telephone system (ETS0)
 Field telephone
There are two currently manufactured telephones in ITI
1. Executive Telephone System :

This is the type of telephone system used for inter changeable communication here tow phone
are connected in the parallel
 There contains in to button which can reject the call between or when in the
conversation
 These are used to transfer information
 In this type of telephone ,conference is not possible
 The distance between the 2 international parallel phone to be within the 10 meter
 In this telephone ‘I’ button refers to inter come use to transfer the call interconnection
to the other person
 ‘F’ button refers to flash custom
 ‘R’ button refers to redial
 It is mainly used for business purpose
 It can also be used in name, office etc
2. Defence Telephone System:
 Also called as field telephone
 In this type of telephone there are three types of mode
Magneto mode
Auto mode
Line mode
3. Magneto Mode :
Can spread up to 40 km, can use 4.5v supply .It can be used as normal telephone to call and
talk , have to press while taking.
4. Auto Mode :
Switch to auto mode for the purpose of switch exchanging info has basis landline .The hand
telephone while speaking button should be pressed in hand of telephone
CB: control button
5. Visual LED Conditions :
 Line short
 Low button
 Incoming Ringing
 Outgoing Ringing
 Works up to 6km with clear speech weight up to 25 kgs
 APPLICATION:

 Army
 Navy
 Airforce
6. Line Mode:
Used the short intime and can be used to connect to other serial landline the telephone is an
one to one communication
 Magnetic mode has two keys press to call and press to talk
 It is abbreviated as PTC and PTT
7. Magneto Mode:
 It does not need exchange between one to one communication
 Distance between two telephone
PTC
PTR
CB
 Three batteries are required .It should hold 4.5 batteries
 Second one telephone is electromechanical which is used for two line communication
purpose
 This is the main concentration of this department
 The chain parameter are measured using a device called as loss pulse switch
telephone analyses
 In the telephone defence production the telephone manufacturing are tested in the
testing lab
8. PTC (press to call):
If button is used to press the call an LED light gets on the telephone so can receiver the call
9. PTR (press to receive) :
In order to talk with another end of receiving .They have to have to hold
 Fabrication Lab
Fabrication is the construction of items from different parts using at least one of a range of
processes and materials such as metal, laminates, wood and other solid surface materials
Frequently used in relation to metal fabrication, the steps involved can include stamping,
welding, cutting, bending and assembling processes.
As with other manufacturing processes, fabrication can be done manually. But the processes
are often automated these days with the use of computer aided designs (CAD) that can be
programmed into computer numerical control (CNC) technologies that can communicate
directly with machines on the shop floor, reducing lead times, costs and material usage while
improving accuracy and quality.
The fabricator’s process tends to make items from manufactured materials like steel that can
then be assembled to create larger metal structures. In addition, fabrication involves making
components for items such as engines, machines, tools, and household appliances.
Fabrication uses semi-finished or raw materials to make something from start to finish, as
opposed to simply assembling it.
This work is typically completed by a fabrication shop (or fab shop) that will bid on the
contract for the job based on engineering drawing and specifications.
Examples of fabrication processes:
As highlighted above there are a range of difference fabrication processes that can be used
according to the material being used and the desired outcome.
Burning and Cutting
Burning and cutting tools are used to cut through raw materials with the most common
method being shearing, shearing is used to trim away unwanted materials, used two blades
either side of the metal to create long straight cuts saw are also widely used for cutting,
including band saws with hardened blades and feed mechanisms to ensure even cuts and
abrasive cut off or chop saws.
Forming
This process involves using force to change a flat sheet metal into a 3D part without adding
or subtracting materials. Punches and dies can be used to control the forming as machines
control the direction and amount of force that is applied Machine controlled forming is easily
repeatable, allowing it to find use in industries including aerospace automotive, construction
and architecture. Forming can be combined with welding to produce lengths of fabricated
metal sheeting.
Machining
Another process frequently used with metal fabrication , machining involves the removal of
material from a solid block to create a desired shape. Most fabrication shapes have machining
capabilities including the use of lathes, mills drills and other machining tools. Solid items like
bolts, screw and nuts are made through machining.
Punching and Stamping
Punching involves using a press to create holes in metals. The finished product created by
punching could be an item with fastening holes punched out or the pieces of metal that are
punched out themselves known as blanks smaller fabrication shape may use hand powered or
mechanical punch presses but most large scale industrial facilities will use CNC programmed
presses that can produce complex designs at high outputs.
Welding
Being the main process used by steel fabricators, welding is part of many fabricators, welding
is part of many fabrication jobs. Whether it is joining formed and machined parts based on
engineering drawings, or a highly skilled welder using experience to fabricate a unique part,
welding will need to take account of the material and the desired finish, avoiding problems
like warping or burn through.
 Injection Moulding Lab
Injection moulding is a manufacturing process for producing parts by injecting molten
material into a mould injection moulding can be performed with a host of materials mainly
including metals, glass, elastomers, confections and most commonly thermoplastic and
thermosetting polymers.
Materials for the part is fed into a heated barrel, mixed (using a helical screw) and injected
into a mould cavity, where it cools and hardens to the configuration of the cavity. After a
product is designed usually by an industrial designer or an engineer, moulds are made by a
mould maker from metal usually either steel or aluminium and precision machined to form
the features of the desired part. Injection moulding is widely used for manufacturing a variety
of parts. From the smallest components to entire body panels of cars.
Advances in 3D printing technology. Using photopolymers that do not melt during the
injection moulding of some lower temperature thermoplastics, can be used for some simple
injection moulds.
Injection moulding uses a special purpose machine that has the three parts the injection unit
the mould and the clamp. Parts to be injection moulded must be very carefully designed to
facilitate the moulding process, the material used for the part the desired shape and features
of the part the material of the mould and the properties of the moulding machine must all be
taken into account. The versatility of injection moulding is facilitated by this breadth of
design considerations and possibilities.
Process Characteristics
Injection moulding uses a ram or screw type plunger to force molten plastic or rubber
material into a mould cavity; this solidifies into a shape that has confirmed to the counter of
the mould it is most commonly used to process both thermoplastic and thermosetting plastic
polymers, with the volume used of the former being considerably higher.
Thermoplastics are prevalent due to characteristics that make them highly suitable for
injection moulding. Such as ease of recycling, versatility for a wide variety of applications,
and ability to soften and flow on heating. Thermoplastics also have an element of safety over
thermosets if a thermosetting polymer is not ejected from the injection barrel in a timely
manner, chemical crosslinking may occur causing the screw and check values to seize and
potentially damaging the injection moulding machine.
Injection moulding consists of the high pressure injection of the raw material into a mould
which shapes the polymer into the desired form. Mould can be of a single easily or multiple
cavities. In multiple cavity moulds each cavity can be identical and form multiple different
geometries during a single cycle. Moulds can be of a single cavity or multiple cavities. In
multiple cavity moulds, each cavity can be unique and form multiple different geometries
during a single cycle. Moulds are generally made from tool steels, but stainless steels and
aluminium moulds are suitable for certain application Aluminium moulds are typically ill-
suited for high volume production or parts with narrow dimensional tolerances, as they have
inferior mechanical properties.
Applications
Injection moulding is used to create many things such as wire spools, packaging bottle caps,
automotive parts and components, toys, pocket combs, some musical instrument.
One-piece chairs and small tables, storage containers, mechanical parts and most other plastic
products available today. Injecting moulding is the most common modern method of
manufacturing plastic parts.
It is ideal for producing high volumes of the same object.
 Research &Development Lab
The research and development is classified and divide into:

 Reliability Lab
 PCB Lab
 Power supply Lab
 CAD Lab

Reliability Lab
Environment test Facility
(STD : Jss 55555,MIL STD &QM333)
 Temperature test: Low/High/Rapid cycling
 Damp heat test: cyclic/steady state
 Thermal test: cyclic/shock/profiling
 Vibration test: random/sinusoidal
 Altitude test
 ESS test (Environment stress screaming)
 Halt hass test
 Cath test (combined altitude, temperature & humidity)
 Salt spray/dust test
 Damp/drop/tople/fall test
 Temperature range from -100c to +200c
 Rate of change of temperature 15c &60c per min
 Chamber available :small
Medium
Walk-Inchamber
 Frequency range for vibration test : 5Hz to 300Hz
 Acceleration range for vibration test : upto 75g

This lab is used to development the components which sand .the certain
conditions like temperature ,humidity and vibration
The reliability lab of signify innovation labs is equipped with state of the art test
equipment and supporting tools to enable you to get fast in sign to performance of
your products over life
 Temperature Test:
 Low temperature = -100c
 High temperature =+200c
 Rapid =200c-100c(single flow)
 Damp heat test:
Temperature and humidity combined till the rapid cycling steady state
  Thermal test:
The component is placed at 100c and is been maintained by giving sudden
shock will change it to hot chamber to cool chamber which sudden changes is known
as shock test
 Vibration:
Random test = 5Hz to 2000Hz
Sinusoidal test = 5Hz to 3000Hz at 75g acceleration
 Altitude test:
This process measure the hights at what temperature and level it can be
used Mostly used in aircraft . the main purpose of altitude test is used in
aircraft purpose
 ESS test:
Environment stress screening refers to the process of exposing and newly
manufacturing or repaired production component to stress such as thermal
cycling vibration in order to force talent defects to manifest themselves by
catastrophic failure during the screening process
 Halt mass test:
High acceleration life test
High acceleration stress screening
 Catch test:
It is the combination of altitude temperature and humidity
(25 km to 30 km height)
 Salt spray /Dust test:
This test will be used in the sea and ocean regions . the salt spray test is a
standardized and popular corrosion test method used to check corrosion test
method used to check corrosion resistance of the material and surface coating ,
usually the materials to be tested are metallic and finishes with a surface coated
which is to provide degree of corrosion protection to the metal.
 Bump/Drop/Trop/Fall test:
It is done to acceleration at certain at certain height to fall have to keep the
equipment and bump at particular acceleration
 Temperature ranges from -100c to +200c
 Rate of changes of temperature 15c to 60c per min
 Chamber quality :small ,medium, walk in chamber
 Frequency range of vibration test : 5Hz to 300Hz
 CMS-centralized monitoring
Application:
All these are done for some device
The device are:

 Telephone
 Telecommunication
 Aircraft
 Drone
 Printed Circuit Board Lab (PCB)
PCB abbreviated as printed circuit extensively used in the process of fabrication of electronic
and electrical circuits
The process of manufacturing the printed circuit board is classified into three types are
1. Single side board process
2. Double side board process
3. Multi-layer side board process
 Multi-layer side board process:
A multilayer PCB is board that has than 2 layers ,unlike a double sided printed
circuit board
Flow chart of multilayer PCB:
Inner layer row material
Inner layer lamination
Inner layer exposing
Inner layer developing
Inner layer etching
Inner layer stripping
Guid hole drilling
Black oxide
4-layer construction layup
Multilayer pressing
CNC drilling
Desmear
Double sided PCB process
 Double side board process:
Plated through hole
Scrubbing
Lamination
Exposing
Development
Copper and tin plated
Film stripping
Etching
Solder masking
Expose & Developing
Bare board testing
 Legend marking
 Etching:
It is one of the prominent process in the manufacturing of PCB ,where copper
from the surface of PCB is removed in order circuit patter
 Expose and developing:
In this process UV rays are passed through the board and 10% NaO sodium
carbonate is released out .
 Solder making:
It is used for protecting against oxidation solder is a thin layer of polymer that
is placed on the circuit board
 Tin stripping:
In this process of tin stripping tin is removed using concentrated tin is removed
using concentrated nitric acid
 Film stripping:
The previous process film which was used as a protective mask is been removed
here,
Double side board process is made of substrate material which is usually
fibre glass on providing conductive a path through out the entire surface of the
board
 Scrubbing:
In this process oxidation of copper is removed undergoing scrubbing process
 Plated through hole:
In this process of plated hole electroless copper plated is used to make the inner
walls of the holes conductive to connect the printed circuit in different layer on
the pins of the integration chips.
 Lamination:
In the process image is transferred from a plotted film onto a base copper clad
laminated under intense UV rays are copper laminated is exposed which
consists of photoresist
 Developing:
The panels are placed in a tank to remove the imaginary materials. After the
resists is stripped OFF, the panels are placed in the conyorized spray which
protects copper under health.
 Bare board testing:
Board compatibility , rollability and efficiency factors are tested as final factor
and process to check it is proper or final stage where all the components are
embedded onto board.
 Power Supply Lab
In the power supply lab, the following conventions are made use

 Choppers
 Inverter
 Rectifier
 Choppers:
Chopper is a device which convert AC to DC voltage
The following on the types:
 Boost chopper
 Bvg chopper
Boost chopper:
They are used to increase the level of the machine
Bvg chopper :
Bvg chopper are defined as to decrease the level of the voltage
Cycle converters :
Cycle convertor are used to convert AC to DC voltage
Inverters :
An invertor or power inverter is a device that convert DC to AC invertor do the opposite work
function of rectifier which converts AC to DC
They are widely used in powering solutions and electrical equipment’s. In inverters voltage of
input voltage and output voltage depends on design of specific device
Rectifier :
Rectifier is used to convert the AC to DC . In a bridge rectifier where input is AC and output
is pulsating DC . D1,D2, D3,D4 are the four diodes connected in the form of bridge, because
of high level of performance this is widely used
 CAD LAB
Computer aided design (CAD) is the use of computer to aided in the creation, modifaction
analyses or optimization of a design. This software is used to increase the productivity of the
designer improve communication through documentation and to create a database for
manufacturing
Design made through CAD software are helpful in protecting production and invention when
used in patent application CAD output is often in the form of electronic files for print ,
machining or other manufacturing operations
CAD software for mechanical design uses either vector based graphics to traditional drafting
or may also produce raster graphics showing the overall of besieged objects however it involves
more than just shapes . As in the manual drafting of technical and engineering the output of
CAD must convey information such as materials, processes, dimensions and tolerance ,
according to application specific converting
CAD is an important industrial art extensively used in many application including automation
shipbuilding and aerospace industries and design , prostheses and many more .
CAD is also used to produce computer animation for special effects in movies, advertising and
technics manual , often called DCC digital content creation. 1960’s because of its economic
important , CAD has been a major driving force for research CAD has been a major driving
force for research in computational geometry
 METAL TESTING LAB
Metal testing is a process or procedure used to check composition of an known metallic
substance. There are destructive processes and non destructive processes metal testing can also
include ,determining the properties of newly forced metal alloys with many chemical property
databases readily available , identification of unmarked pure, common metal can be a quick
and easy process leaving the argininal samples in complete reusable conditions. This type of
testing is no destructive when working with alloys of metal however to determine the exact
composition could result in the original sample being separated in to its starting material then
measured and calculated after the components are known they can be looked up and matched
to known alloys
This type of testing is destruction in this type kind of testing the material undergoes mechanical
testing and is discarded there after test results are compared with specification
 Bend test
 Impact test, Charpy test and Izod test
 Hardness test
 Tensile test
 Fatigue test
 Corrosion resistance test
 Wear test
Raw and finished material undergoes testing according to codes specification such as ASME
Boiler and pressure vessel codes section V . The tested material is not damaged by the test
 Visual testing
 Dye penetrant inspection
 Magnetic particle inspection
 Radiographic testing
 Ultrasonic testing
 Leak testing
 Eddy current testing
 Remote field electromagnetic testing
 LR UT
 Internet Of Things (IOT)
The internet of things is a computing concept that describe the idea of everyday physical objects
connected to the internet and able to identify themselves to other devices. The is closely identify
with RFID as the method of communication although it also may include other sensor
technology wireless technology or QR codes. The IOT is significant object that can represent
itself digitally becomes something greater than the object by itself. IOT is the network physical
object or “THINGS” concluded with electronics, software, sensors and network which enable
these object to collect and exchange data living in the conduct of the IOT is an entity or physical
objects that has a unique identifies an system and the ability to transfer data over a network
some devices examples are used in IOT

 Heart monitoring plants.

 Biochip transponders on forms animals.
 Automobile with built in sensor.
These devices collect data with the help of various existing technologies and then
autonomously flow the data destination other devices.
Scope of IOT
IOT can connect device in various system to the internet when the device can be represent
themselves digitally they can be controllers from anywhere the connectivity then help us
capture more data from more places, ensuring more ways of increasing efficiency It is the
technology of which is touching and transforming every spacer of one life. IOT has given a
concept of machine to machine communication comparison like MS and SAP are implemented
strategy of compatible and the IOT is proved to the emerging technological innovation. In the
current context, may scopes will be created for technology companies to release offering and
global coding system at radio frequency identifications.

Applications of IOT
 Building a home automation
 Environmental monitoring.
 Fire alarm.
 Transportation.
 Smart Education.
 Smart faxing system.
 Medical and health care system.
 Information Technology
(IT)
Information technology is the use of computer to create, process, store, retrieve and exchange
all kinds of data and information . IT is typically used within the context of business operation
as opposed to personal or entertainment technology.
IT form part of information and communication technology(ICT).An information
technology system (IT system ) is generally an information system, a communication system
or, more specially speaking , a computer system – including all hardware, software, and
peripheral equipment – operated by a limited group of IT user .
Although humans have storing retrieving, manipulating, and communication information since
the earliest writing system were developed. The term information technology in its modern
since first appeared in a 1958 article published in the Harvard Business review, author Harold
J.Leavith and Thomas L. Whisler commented that “the new technology does not yet have a
single established name. we shall call it information technology (IT).” The definition consists
of higher – order thinking through computer programming.
IP Address
An internet protocol address is a numerical label such as 192.0.2.1 that is connected to a
computer network that user the internet protocol for communication.
An IP address server two main function network interface identification and
location addressing.
There are two types of port:
 Network port
 Post port
Network port:
In computer networking, a port is a number assigned to uniquely identify a connection end
point and direct data a specific service. At the software level, within an operation system, a
port is a logical construction that identifies a specific process or a type of network service. A
port is identified for each transport protocol and address combination by 16- bits unsigned
number, known as the port number.
Post port:
In electrical circuit theory, a port is a pair of terminal connecting an electrical network or circuit
to an external circuit, as a point of entry or exit for electrical energy. A port consist of two
nodes (terminal) connected to an outside circuit which meets the port condition the current
flowing into the two nodes must be equal and opposite.
 Surface Mounted Technology
(SMT)
Surface -mount technology (SMT) is a method in which the electrical components are
mounted directly onto the surface of a printed circuit board (PCB). An electrical component
mounted in this manner is referred to as a surface-mount device (SMD).
In industry, this approach has largely replaced the through hole technology construction
method of fitting components in large part because SMT allows for increased manufacturing
automation which reduces cost and improves quality. It also allows for more components to fit
on a given area of substrate. Both technologies can be used on the same board, with the through-
hole technology often used for components not suitable for surface mounting such as large
transformers and heat-sink power semiconductors.

 Reliance.
 Tata.
 BHEL.
Infrastructural Facility
 In house research and development.
 Network system unit capable of understanding turnkey jobs.
 Self contained component evaluation centre.
 ICT(In Circuit Testing), environment testing cord assembly.
 Mould and die casting, SMT.
 Fully hedged state of the art tool rooms, fabrication of towers and shelters for GSM.
 Components approval centre approved by BSNL.
 Mechanical fabrication/ machine shop with modern CNC machines and finishing shop.
 Plastic injection technology through hole component assembly.
An SMT component is usually smaller than its through hole counterpart because it has either
smaller leads or no leads at all it may have short pins or leads of various styles, flat contact,
matrix of solder balls (BGAs) or terminations on the body of the component.