THE RISK IN SOLDERING DIFFERENT KINDS OF ELECTRONIC COMPONENTS

ON THE PRINTED CIRCUIT BOARD ASSEMBLY

A RESEARCH PAPER

PRESENTED TO

THE FACULTY OF SENIOR HIGH SCHOOL

FRANCISCO RAMOS NATIONAL HIGH SCHOOL

IN PARTIAL FULFILMENT

OF THE REQUIREMENTS IN PRACTICAL RESEARCH 2

MARVIN BANTAY

NIKKO ARTAZO

DEXIE KIM DELAGUERON

LITO GANOB

RENE GUTIERREZ

JONATHAN PATANGAN
 ALDRICH DEPIO

RONNIE EPANTO

JOHN LLOYD ASAKIL

REYMOND CADELIÑA

GRADE 12-EPAS CHARITY

SY 2023-2024

CHAPTER I

INTRODUCTION

Background of the Study

As technology advances, the demand for electronic devices increases,

making Printed Circuit Board (PCB) assembly a critical process in the electronic

industry. Soldering is one of the most crucial steps in PCB assembly, where different

electronic components are bonded to the PCB using melted metal alloys, such as

lead or lead-free solder.(Commbs,Clyde F.2007).

However, the process of soldering poses numerous risks, especially regarding

in the health and safety. These risks often arise from the characteristics of electronic
components and the soldering process itself. Components that are sensitive to heat,

such as plastic connectors, can be damaged during the soldering process, leading to

component failure. Additionally, soldering produces fumes that contain harmful

metals, such as lead, nickel, and tin, which can cause respiratory problems and

other health issues.(Rahn,Armin1993).

Numerous studies have been conducted on soldering safety and associated

risks. These studies provide guidelines and recommendations for proper safety

measures, including the use of appropriate protective gear, proper ventilation, and

regular monitoring of air quality in the soldering room. The goal of this study is to

identify and evaluate the particular risks involved in soldering electronic components

on printed circuit board assembly within the Grade 11 EPAS students in Francisco

Ramos National High School.

Statement of the Problem

The goal of this study is to determine the risk in soldering different kinds of

electronic components on printed circuit board assembly of Grade-11 EPAS students

in Francisco Ramos National High School.

Specifically it strives to answer the following questions:

1. What are the risk in soldering electronic components on printed circuit board

assembly in
2. Are there a significant difference between the risk in soldering electronic

components to Grade 11 EPAS students.

Scope and Delimitation of the Study

The main purpose of this study is to provide information to the students about

the risk in soldering different kinds of electronic components on printed circuit board

assembly. This study includes the students proper way of soldering electronic

components in printed circuit board assembly to avoid any risk.

The researcher limits the study to 10 Grade 11 EPAS students in the first

semester, school year 2023-2024 of Francisco Ramos National High School. This

study provide questionnaire to answer the following questions about the research

topic.

Concept Map

This conceptual framework shows the input, process and output approach of

the study. The input is the independent variable which includes the students profile

and soldering of electronic components on printed circuit board assembly. The

process includes the tools and analysis in gathering the data, while the output is the

outcome based on the results of the study.

 Input Process

Students Profile:
Output

 Gender Likert scale

 Age
& Enhanced
proper
Data Analysis soldering in
Soldering: printed circuit
board
Improper soldering
assembly
Lack of knowledge

Definition of Terms

This chapter presents the definitions of terms using operational definition.

Electronic Components. Parts used in devices that construct electronic

circuits

PCB. Printed circuit board

Soldering. To repaired by or as if by solder

Hypothesis

This statement below shows the null and alternative hypothesis.

Alternative Hypothesis

There is a significant risk in soldering different kinds of electronic components

on the printed circuit board assembly.

Null Hypothesis

There is no significant risk in soldering different kinds of electronic

components on the printed circuit board assembly.

CHAPTER II

REVIEW OF RELATED LITERATURE

This part of a research paper reviews literary works and studies which have

significant bearings, on the study to provide readers an overview of its nature and

background

According to J. Smith et al. (2019) This study investigates the health risks

associated with soldering fumes emitted during PCB assembly. It discusses the
composition of these fumes, which may include hazardous substances like lead, flux

fumes, and volatile organic compounds (VOCs). The research emphasizes the

importance of proper ventilation, respiratory protective equipment, and adherence to

safety guidelines in mitigating these risks.

G. Martinez et al. (2018) a comprehensive risk assessment of soldering

processes and materials used in electronics manufacturing, focusing on PCB

assembly. It highlights various hazards, such as thermal burns, exposure to harmful

substances, and ergonomic risks. The research proposes control measures, such as

engineering controls, personal protective equipment, and administrative controls, to

mitigate these risks effectively.

A. Johnson et al. (2017)The impact of soldering on component reliability and

performance within the context of PCB assembly. It discusses the risks associated

with excessive heat exposure, including potential damage to components and the

formation of intermetallic compounds. Moreover, the study investigates the effects of

different soldering techniques and materials on long-term reliability, electrical

performance, and mechanical integrity.

H. Chen (2016) The study focuses on quality assurance in soldering processes

to ensure reliable PCB assembly. It addresses the potential risks associated with

poor soldering, such as insufficient solder joints, cold solder joints, and solder

bridging. The research provides insights into quality control methods, solder joint

inspection techniques, and process optimization to achieve reliable and defect-free

PCB assemblies.
 R. Gupta et al. (2015) This study examines the occupational hazards associated

with soldering operations in the electronics industry. It identifies potential risks, such

as thermal injuries, exposure to toxic fumes, and ergonomic issues. The research

emphasizes the importance of implementing safety protocols, including training

programs, hazard communication, and regular workplace assessments, to promote a

safe soldering environment.

S. Patel et al. (2014) The research investigates the environmental impacts of

lead-free soldering processes in PCB assembly, taking into account the shifting

industry practices in response to environmental regulations. It analyzes the potential

risks associated with lead-free solder materials, such as increased energy

consumption, greenhouse gas emissions, and the need for proper waste

management. The study suggests strategies for minimizing these environmental

impacts.

These studies collectively contribute valuable insights into the risks involved in

soldering different kinds of electronic components in PCB assembly. By addressing

these risks through appropriate control measures, safety protocols, and optimization

of soldering processes, it is possible to enhance worker safety, product quality, and

environmental sustainability in the electronic industry.

 CHAPTER III

METHODOLOGY

This chapter provides the research methodology of the study. This will describe

the subject of the study, specifically, the research locale, research design, that
includes the sample and sampling procedure, research instruments, data collection

procedure and the product descriptive of how the data will be analyzed.

Research Design

The main purpose of this research is to know the risk in soldering different kinds

of electronic components on the printed circuit board assembly in Francisco Ramos

National High School. The researcher choose descriptive research design because

to aim accurately and systematically describe a population, situation or

phenomenon. It can answer what, where, when and how questions but not why

question. Researcher choose descriptive design because it can be used a wide

variety of research methods to investigate one or more variable.

Research Sample

Simple random sampling is a type of probability Sampling in which subset a the

researcher randomly selects a subset of participants from a population and every

member of the population has an equal chances of selection. We choose this kind of

sampling because it very easy for us to select a sample that have an idea about our

research topic.

Research Instrument

The likert scale question is a psychometric scale where question based on this

scale are used in a survey. It is one of the most widely used question types in a
survey. In a likert scale survey respondents don't choose between 'yes/no; there are

specific choices based on agreeing or disagreeing on a particular survey question.

Research Locale

This study was conducted in Francisco Ramos National High School located at

Conception, Kabasalan, Zamboanga Sibugay. The study focuses on the senior high

school Grade 11 student under TVL tracks specially the EPAS students. They are

capable to answer the following questions through Likert Scale.

Data collection procedure

The procedure in the gathering of the data pertinent to this study includes the

following:

1. Permission to conduct the study. The permission to conduct the study will be

sought form then adviser and subject teacher of the respondents. An initial

communication was sent to explain the research and aim of the study.

2. Identifying the Respondents. The respondents of the study are the selected ten

(10) Grade 11 EPAS Students who know the risk in soldering different kinds of

electronic components on the printed circuit board assembly.

3. Evaluating the Likert Scale. The answered likert scale will be checked by the

inquiry investigation and immersion and practical research II teachers.

4. Distribution of Likert Scale. Self-base assessment likert scale are given to the

selected 10 grade 11 EPAS students who know the risk in soldering different kinds of

electronic components on the printed circuit board assembly.

5. Receiving Likert Scale. The answered likert scale will be collected and checked

whether the respondents have misunderstood the questions.

6. Gathering of Data. The information will be arranged in major and minor

categories, such thoughts were labeled, identified, recognized numerically and

thematically with respect to the original respondents. This will be tailed based on the

data provided by the respondents and analyzed basis of the result of the study.

7. Interpretation of Likert Scale. With the students who are present during the

interpretation of likert scale in this manner. The respondents are informed whether

the researchers have misinterpreted the details.

Data Analysis

This data analysis would provide a comprehensive understanding of the risks

associated with soldering different electronic components in printed circuit board

assembly, enabling the development of targeted safety measures and risk mitigation

strategies.
 CHAPTER IV

PRESENTATION, ANALYSIS AND INTERPRETATION OF DATA

This chapter presents the data gathering of the study, the result of the statistical

analysis done and interpretation of findings. These are presented in tables following

the sequence of the specific research problem regarding the risk in soldering the

different kinds of electronic components on the printed circuit board assembly.

1. Demographic Profile of the Respondents

Table 1

Age and Gender of the Respondents

GENDER PERCENTAGE

Age M F M% F% Age%

16-17 3 2 30% 10% 40%

18-19 4 1 40% 10% 50%

20

ABOVE 1 10% 10%

TOTAL 8 2 80% 20% 100%

 Interpretation

The table 1 shows the age range of the respondents. Majority(50%) of the

respondents belongs to 18-19 age range. The 16-17 comes next which comprises

40% of the total respondents. The lowest percent goes to 20 years old and above

which only comprises 10% of the total sample population, out of 10 respondents

surveyed. 80% are are males while 20% are females which means majority of the

total sample population are males.

Result

Table 1

SOP 1: What are the risk in soldering electronic components on printed circuit board

assembly

Frequency of the

Respondents Percentage(%)

STATEMENT Interpretation

SA A D SD SA A D SD

1. I am aware of the

potential risk like lung

6 4 0 0 60% 40% 0 0 Strongly
cancer associated
with soldering fumes. Agree

2. I encountered any

component failures
3 7 0 0 30% 70% 0 0 Agree
due to improper

soldering technique.

Interpretation

Table 1, shows the data on the responses of samples to the (2) statements in the

questionnaire relative to the risk in soldering electronic components on printed circuit

board assembly. Based on the information above the result of the statement 1

interpreted “strongly agree” that has 60%, while the statement 2 has 70% of the

result and interpreted as “agree”.

Table 2

SOP 2:Are there a significant difference between the risk in soldering

electronic components to Grade 11 EPAS students

Frequency of the Percentage % Interpretation

respondents
Statement SA A D SD SA A D SD

1.There are safety

measures I undertake
0 7 2 1 0 70 20 10% Agree
during soldering
% %
activities.

2. I am familiar with

the handling and

4 5 1 0 40% 50 10 0 Agree
storage requirements
% %
before and during

soldering

3. I have access on

serviceable soldering

equipment and tools

4 5 1 0 40% 50 10 0 Agree
necessary for safe
% %
and effective

soldering.