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ADVANCES IN
LASER MATERIALS
PROCESSING
Related titles
Handbook of Laser Welding Technologies
(ISBN 978-0-85709-264-9)
Laser Spectroscopy for Sensing
(ISBN 978-0-85709-273-1)
Laser Surface Engineering
(ISBN 978-1-78242-074-3)
Laser Additive Manufacturing
(ISBN 978-0-08-100433-3)
Woodhead Publishing
Series in Welding and Other
Joining Technologies
ADVANCES IN
LASER MATERIALS
PROCESSING
Technology, Research
and Applications
Second Edition
Edited by
JONATHAN LAWRENCE
An imprint of Elsevier
Woodhead Publishing is an imprint of Elsevier
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or mechanical, including photocopying, recording, or any information storage and retrieval system,
without permission in writing from the publisher. Details on how to seek permission, further
information about the Publisher’s permissions policies and our arrangements with organizations such
as the Copyright Clearance Center and the Copyright Licensing Agency, can be found at our website:
www.elsevier.com/permissions.
This book and the individual contributions contained in it are protected under copyright by the
Publisher (other than as may be noted herein).
Notices
Knowledge and best practice in this field are constantly changing. As new research and experience
broaden our understanding, changes in research methods, professional practices, or medical treatment
may become necessary.
Practitioners and researchers must always rely on their own experience and knowledge in evaluating
and using any information, methods, compounds, or experiments described herein. In using such
information or methods they should be mindful of their own safety and the safety of others, including
parties for whom they have a professional responsibility.
To the fullest extent of the law, neither the Publisher nor the authors, contributors, or editors, assume
any liability for any injury and/or damage to persons or property as a matter of products liability,
negligence or otherwise, or from any use or operation of any methods, products, instructions, or ideas
contained in the material herein.
Contributors xv
Preface xix
2.1 Introduction 23
2.2 Laser Cutting 23
2.3 Laser Welding 29
2.4 Laser Drilling 32
2.5 Laser Surface Engineering 34
2.6 Additive Multiple Layer Manufacturing 35
2.7 Micro/Nano Fabrication 36
2.8 Fundamental Beam/Material Interactions and Process Modeling 40
2.9 Laser Systems 41
2.10 Conclusions 41
References 42
3.1 Introduction 43
3.2 Principles Involved in Fusion Laser Cutting 44
3.3 Experiences in Laser Cutting of Difficult Materials 45
3.4 Attempts to Improve Cutting Process 50
3.5 Conclusions 62
Acknowledgments 62
References 62
vii
viii Contents
4.1 Introduction 69
4.2 The Multiple Laser System 70
4.3 Numerical Simulation 71
4.4 Numerical Results and Discussions 74
4.5 Crack Propagation in Laser Cleaving 81
4.6 Conclusions 85
Acknowledgments 86
References 86
Further Reading 87
5.1 Introduction 89
5.2 Industrial Dicing Processes for Silicon and Electronic Substrates 90
5.3 Dicing of Silicon With Ultra-Fast Laser Radiation 96
5.4 Explanation of Surface Phenomena During Laser Dicing Processes 103
5.5 Factors Influencing the Aspect Ratio During Laser Dicing Processes 105
5.6 Increasing Dicing Modification Depth Using High-Repetition-Rate
Femtosecond Laser Radiation and Spatial Beam Shaping 115
References 118
Index 763
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CONTRIBUTORS
B. Acherjee
Birla Institute of Technology, Mesra, India
I.U. Ahad
Dublin City University, Dublin Ireland
E.T. Akinlabi
University of Johannesburg, Auckland Park Kingsway Campus, Johannesburg, South Africa
A. Al Hamaoy
Al-Nahrain University, Baghdad, Iraq
M. Alimardani
University of Waterloo, Waterloo, ON, Canada
K. Bagga
Dublin City University, Dublin Ireland
A. Bandyopadhyay
Washington State University, Pullman, WA, United States
S. Bluemel
Laser Zentrum Hannover e.V., Hannover, Germany
S. Bose
Washington State University, Pullman, WA, United States
M. Boutinguiza
University of Vigo,Vigo, Spain
D. Brabazon
Dublin City University, Dublin Ireland
E. Chikarakara
Dublin City University, Dublin Ireland
R. Comesaña
University of Vigo,Vigo, Spain
A. Darafsheh
Washington University School of Medicine, St. Louis, MO, United States
J.T.M. De Hosson
University of Groningen, Groningen, The Netherlands
R.T. Deam
Swinburne University of Technology, Hawthorn,VIC, Australia
H. Dittmar
Laser Zentrum Hannover e.V., Hannover, Germany
S. Dudziak
Laser Center, Hannover, Germany
xv
xvi Contributors
C. Fornaroli
Florida Institute of Technology, Melbourne, FL, United States
A. Gillner
Florida Institute of Technology, Melbourne, FL, United States
A. Issa
Al Azhar University, Gaza, Palestine
P. Jäschke
Laser Zentrum Hannover e.V., Hannover, Germany
S. Kaierle
Laser Zentrum Hannover e.V., Hannover, Germany
S. Katayama
Osaka University, Suita, Japan
A. Khajepour
University of Waterloo, Waterloo, ON, Canada
Y.L. Kuo
National Cheng Kung University, Tainan, Taiwan
S. Lauzurica
Universidad Politécnica de Madrid, Madrid, Spain
H. Lavvafi
Loyola University Medical Center, Maywood, IL, United States
J. Lawrence
University of Chester, Chester, United Kingdom
P.S. Lee
Nanyang Technological University, Singapore, Singapore
L. Li
The University of Manchester, Manchester, United Kingdom
J. Lin
National Cheng Kung University, Tainan, Taiwan
F. Lusquiños
University of Vigo,Vigo, Spain
R.M. Mahamood
University of Johannesburg, Auckland Park Kingsway Campus, Johannesburg, South Africa;
University of Ilorin, Ilorin, Nigeria
V. Marinov
North Dakota State University, Fargo, ND, United States
A. Marquez
Universidad Politécnica de Madrid, Madrid, Spain
M. Mehrpouya
Sapienza University of Rome, Rome, Italy
I. Mingareev
Florida Institute of Technology, Melbourne, FL, United States
8 Advances in Laser Materials Processing
optic feed, an energy source for many applications, is not possible in the
same way. What is possible and is already here are lasers with internal beam
sharing and switching capabilities. It is the authors' opinion that this is a
solution that will only ever be installed in a few large manufacturing en-
vironments, such as one very high-power laser supplying multiple welding
stations for automotive fabrication. Process sensitivity and miniaturization
makes it more likely that an optimized low-cost laser will be manufactured
for specific applications (There is some similarity here with the growth of
computers from mainframe to PCs).
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