SAMSON JR, C.
SILONG
BSCpE 3
MICROELECTRIC
CHAPTER 1
1. Four common types of discrete devices are:
Transistors: Act as switches and amplifiers.
Diodes: Allow current flow in one direction only.
Resistors: Resist the flow of current.
Capacitors: Store electrical energy.
2. Solid-state devices are smaller, lighter, more durable, consume
less power, generate less heat, are more reliable, and cheaper than
vacuum tubes.
3. False. ULSI circuits have more components than VLSI circuits.
4. Hybrid circuits combine different pre-made components on a
substrate, offering flexibility. Integrated circuits (ICs) have all
components fabricated on a single chip, maximizing miniaturization
and integration.
5. The stage of processing where wafers are produced is
called Wafer Fabrication or Front-End Processing.
This is the initial phase of semiconductor manufacturing, where
silicon crystals are sliced into thin wafers, which then undergo a
series of steps to create the integrated circuits (ICs) we use in our
devices.
6. The stage of processing that processes "chips" is called Back-
End Processing.
This stage takes the fabricated wafers from front-end processing
and transforms them into functional chips:
Dicing: The wafer is cut into individual chips.
Packaging: Chips are packaged into protective housings with
connections for external circuits.
Testing: Chips are tested to ensure they meet performance
specifications.
Essentially, back-end processing turns the wafer into the usable
chips we see in electronic devices.
7. An N-P junction is the interface between N-type (electron-rich)
and P-type (hole-rich) semiconductors. A depletion region forms at
the junction, affecting current flow and enabling diode and transistor
function.
8. Feature size is the minimum width of a structure on an integrated
circuit (IC). Smaller feature sizes enable more components per chip,
leading to increased performance and efficiency.
9.
1. Miniaturization (Moore's Law).
2. Expanding applications.
3. Geopolitical factors and supply chain resilience.
10. Semiconductor packages protect the chip, provide electrical
connections, manage heat dissipation, offer mechanical support,
and optimize signal routing.
