CFD - PROJECT

Name : Piyush Sharma

LTU Banner ID : 000733546

Project : Cooling of two electronic chips sitting on a pcb board

Goal : to evaluate the average temperature of each chip and the bmaximum
temperature of the pcb
board for a number of flow velocities.
Geometry : Domain Length (x-direction)=150mm
Domain Width (y-direction)=100mm
Domain Height (z-direction)=50mm
Chip Dimensions=20mmx20mmx1mm
D1=40mm D2=10mm

Boundary Conditions :
Inlet: Velocity Inlet with prescribed velocity
Outlet: Pressure Outlet 0 Gauge pressure (exhausts to the atmosphere)
PCB, chip surfaces: Walls
All other surfaces (the three surfaces that surround the tunnel) are of type
Symmetry
Materials : Chip Material: Silicon Dioxide (SiO2)
Properties Density: 2.196 g/cm3 Cp: 680 J/(kg-k)
Thermal Conductivity: 1.4 W/(m-k)
PCB Material: Copper Use standard material in Fluent
Air: Incompressible Ideal Gas
Heat Sources: Chip 1: Q=5000000 W/m3
Chip 2: Q=8000000 W/m3
Velocity U : 1,4,8,16,32 m/s

Results
Velocity

Chip 1 avg
temp

Chip 2 avg
temp

PCB boar max

temp

5.7062e+02

8.0873e+02

5.2108e+02

4.0519e+02

5.0080e+02

3.9722e+02

3.6601e+02

4.2093e+02

3.5518e+02

16

3.4092e+02

3.7288e+02

3.2849e+02

32

3.2524e+02

3.4368e+02

3.1447e+02