RPN Reduction in Slurry

Dip Process
Team:
Jesús Guillén
Enrique Aguirre
Angeles Gallardo
Ruben Santos
Aida Gonzalez
Carlos Jasso
 D M A I C
Problem Statement Measurement Basis

Identify the main failure modes in the slurry dip process and
develop actions in order to reduce ocurrence
Units: RPN

Variation of immersion level at

Defect: Slurry dip
Potential effect
High LKG, DF
& ESR Failure mode
Over/Low Potential cause
Level of
MNO2 Layer
- Micrometer Failure Opportunity: To reduce RPN score from
Project Y’s
at the
anode Business Y’s >80 to < 30, by Dec. 3,
Variation of immersion Maintain the Business with 2005
`
level at Slurry dip Costumer

Project Milestones Ranking

ID Task Name Duration Start Finish
Sep 11, '05 Sep 25, '05 Oct 9, '05 Oct 23, '05 Nov 6, '05 Nov 20, '05 Dec 4, '05
F T S W S T M F T S W S T M F T S W S
1 RPN Reduction in Slurry Dip Process 46 days Mon 10/3/05 Mon 12/5/05
Potential cause:
2 Define 4 days Mon 10/3/05 Thu 10/6/05 Micrometer Failure
3 Proyect Definition 2 days Mon 10/3/05 Tue 10/4/05
4 Gantt Chart 1 day Wed 10/5/05 Wed 10/5/05
5 QOD 206 Open 1 day Thu 10/6/05 Thu 10/6/05 Severity 7
6 Measure 9 days Fri 10/7/05 Wed 10/19/05 Moderate. Customer Compliant, Customer Audits.
7 Slurry Process Map, QFD & FMEA validation 5 days Fri 10/7/05 Thu 10/13/05
and Revision The Potential effect is High LKG, DF & ESR
8 Get Historical Data of Recurrences for Main 4 days Fri 10/14/05 Wed 10/19/05 Occurrence 2
Failure Modes
Low Probability: Control Charts were
9 Analize 10 days Thu 10/20/05 Wed 11/2/05
Implemented previously.
10 Main Failure mode MSA 10 days Thu 10/20/05 Wed 11/2/05
11 Improve 18 days Thu 11/3/05 Mon 11/28/05
12 Mistake Proofing Development/Implementation 15 days Thu 11/3/05 Wed 11/23/05 Detection 6
13 Process Map/ FMEA/QFD Revision & Update 3 days Thu 11/24/05 Mon 11/28/05
Low: Visual Detection.
14 Control 5 days Tue 11/29/05 Mon 12/5/05
15 MI's/MP's Update 3 days Tue 11/29/05 Thu 12/1/05
16 Improvements Revision Plan 1 day Fri 12/2/05 Fri 12/2/05
17 QOD Closeout 1 day Mon 12/5/05 Mon 12/5/05
 D M A I C
SIPOC Model
SUPPLIER INPUT PROCESS OUTPUT CUSTOMER

Materials Slurry Dip Anodes with

Suppliers Impregnation
MnO2 layer

Reformation Manganese Dip Station Complete Impregnation

Nitrate immersion
Impregnation Vacuum Blot
DI Water Anode size in
Sponge Blot
specs
Manganese
Slurry Mix
Dioxide
 Process Map

ASSEMBLY EPOXY MOLD

PROCESS PROCESS
CURE

Timer: 3Hrs
Temp: 165 – 175*C
 Process Map

CHECK VISUAL VISUAL Y

ASSEMBLY REGISTRED INSPECTION CURING INSPECTION
PROCESS
BATCH
BATCH OF OVEN OF
A
TEMPERATURE TIMER
CORRECT Temperature (165 – 175* C ) (SOP) CORRECT
TRANSPORTATION COMPLETE INFO BATCH INFO Time ( 180 min ) (SOP) TIME (3 HRS) (SOP)
MAGASINS OF MAGASINS & INTRO TIME N
BATCH CARRIER QTY OUT TIME
TEMPERATURE
(165 – 175 *C) (SOP)

CORRECT MORE TIME

TEMP.

MATERIAL MOLD
A OUTPUT PROCESS

CARRIER
OUTPUT