A SEMINAR ON

PRACTICAL TRAINING
TAKEN AT
INSTRUMENTATION LIMITED ,KOTA

Submitted by :
Jitendra Singh Rathore
Company profile
 Established in 1964

 Three Units
 Kota
 Palakkad(Kerala)
 Jaipur (known as REIL)

 Objective: Self Reliance in

field of Control and
Automation

 Sectors: Power, Steel, Nuclear,

Fertilizer, Chemical, Refineries,
Space, Textile etc.
Departments
 PCB FABRICATION
 UNINTERRPUTED POWER SUPPLY (UPS)
 RAILWAY SIGNALLING RELAY
 QUALITY ASSUARANCE
 DEFENCE EQUIPMENTS
 TELECOMMUNICATION

Main products of IL
 PCB Cards
 UPS
 Inverters
 Railway Signalling Relays
 SDDS (Solar Dusk Down System)
 High Performance electronic transmitters
 Liquid & Gas Analyzers
 IT Products
 Defence Equipment
PRINTED CIRCUIT BOARD
 Used for interconnection of
electronic component.
 Allows to route electric
current and signal through
copper tracks.

 Large no of component on
small area
 Suitable for mass production .
 Construction is neat and clean.
 TYPES OF PCB
 SINGLE SIDED PCB
 DOUBLE SIDED PCB
 MULTI LAYER PCB

BASE MATERIAL FOIL MATERIAL

 PAPER PHENOLIC  COPPER (GENERALLY)
 EPOXY PAPER  ALUMINIUM

 EPOXY GLASS  NICKLE

 POLYSTER  CHROME
CARD ASSEMBLY
Through Hole Technology

Components leads are

inserted from one side and
soldered at other side.
Used vastly till 1980.
Strong mechanical bond
THROUGH HOLE COMPONENTS
Limits the use of
multilayer PCBs.
Now used only for bulky
components.
Wave Soldering :-
In through hole technology, component
mounted PCB’s after inspection, are soldered
by ‘wave soldering machine.’

Wave Soldering Machine & Soldering Process

 Surface Mount Technology
 Components mounted on solder pads in SMT are
known as SMD.
 Smallest Size of SMDs order of currently 0.4 x 0.2
mm.
 Due to short leads or absence of leads inter-track
capacitance and self-inductance of SMDs reduces.
 So it can be used in High frequency applications.
 SURFACE MOUNTING DEVICES
 Plastic tapes wound on
reels.(Containing
resistors, capacitors etc.)
 Plastic tubes.
 Large Integrated Circuits
are packed in Static-trays.
Processes of SMT

 Paste or Screen Printing & Placement Of Compone

nts(Pick & Place machine)
 Reflow Soldering.
 Optical Inspection and rework.
 Manual assembling and wave soldering.
 Testing & Quality Control.
ADVANTAGES OF
SMT :- reliable assemblies
More
Increased board density
Reduced weight
Reduced volume and cost
Fewer holes need to be drilled through abrasive
board
SENSORS USED :-
Diffused sensor with background suppression :-
 These are proximity switches
 At IL, Baumer Electric’s CH-8501 sensor is used.
 It is a Photoelectric sensor used on conveyor
belt between Pick-Place machine & reflow soldering
machine.
 When there is no PCB on conveyor , it’ll stop
conveyor & Pick-Place machine , Reflow machine
partially( not shut down the system).
 Y O U
A N K
TH